TWI762584B - 鉍系玻璃粉末、密封材料以及氣密封裝體 - Google Patents

鉍系玻璃粉末、密封材料以及氣密封裝體 Download PDF

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Publication number
TWI762584B
TWI762584B TW107105743A TW107105743A TWI762584B TW I762584 B TWI762584 B TW I762584B TW 107105743 A TW107105743 A TW 107105743A TW 107105743 A TW107105743 A TW 107105743A TW I762584 B TWI762584 B TW I762584B
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TW
Taiwan
Prior art keywords
sealing material
glass
material layer
package
bismuth
Prior art date
Application number
TW107105743A
Other languages
English (en)
Chinese (zh)
Other versions
TW201840499A (zh
Inventor
廣瀬将行
Original Assignee
日商日本電氣硝子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本電氣硝子股份有限公司 filed Critical 日商日本電氣硝子股份有限公司
Publication of TW201840499A publication Critical patent/TW201840499A/zh
Application granted granted Critical
Publication of TWI762584B publication Critical patent/TWI762584B/zh

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Glass Compositions (AREA)
TW107105743A 2017-02-23 2018-02-21 鉍系玻璃粉末、密封材料以及氣密封裝體 TWI762584B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017031656A JP7169739B2 (ja) 2017-02-23 2017-02-23 ビスマス系ガラス粉末、封着材料及び気密パッケージ
JP2017-031656 2017-02-23

Publications (2)

Publication Number Publication Date
TW201840499A TW201840499A (zh) 2018-11-16
TWI762584B true TWI762584B (zh) 2022-05-01

Family

ID=63253192

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107105743A TWI762584B (zh) 2017-02-23 2018-02-21 鉍系玻璃粉末、密封材料以及氣密封裝體

Country Status (5)

Country Link
JP (1) JP7169739B2 (ko)
KR (1) KR20190116247A (ko)
CN (1) CN110248904A (ko)
TW (1) TWI762584B (ko)
WO (1) WO2018155144A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7168903B2 (ja) * 2018-09-06 2022-11-10 日本電気硝子株式会社 気密パッケージ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013185214A (ja) * 2012-03-08 2013-09-19 Jx Nippon Mining & Metals Corp α線量が少ないビスマス又はビスマス合金及びその製造方法
JP2013239609A (ja) * 2012-05-16 2013-11-28 Asahi Glass Co Ltd 気密部材とその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3381332B2 (ja) * 1993-08-24 2003-02-24 日本電気硝子株式会社 高誘電率ガラスセラミック
JPH10251042A (ja) * 1997-03-10 1998-09-22 Nippon Electric Glass Co Ltd シリカフィラー粉末及びガラス−セラミック組成物
TW200739253A (en) * 2006-01-12 2007-10-16 Toray Industries Photosensitive composition, display member and process for manufacturing the same
CN103011284B (zh) * 2012-12-27 2014-07-16 湖南金旺铋业股份有限公司 一种粗氧化铋除杂方法
JP2014236202A (ja) 2013-06-05 2014-12-15 旭硝子株式会社 発光装置
TWI686968B (zh) * 2015-02-26 2020-03-01 日商日本電氣硝子股份有限公司 氣密封裝及其製造方法
EP3318180A1 (en) 2016-11-02 2018-05-09 Koninklijke Philips N.V. Device, system and method for co2 monitoring

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013185214A (ja) * 2012-03-08 2013-09-19 Jx Nippon Mining & Metals Corp α線量が少ないビスマス又はビスマス合金及びその製造方法
JP2013239609A (ja) * 2012-05-16 2013-11-28 Asahi Glass Co Ltd 気密部材とその製造方法

Also Published As

Publication number Publication date
WO2018155144A1 (ja) 2018-08-30
JP2018135246A (ja) 2018-08-30
JP7169739B2 (ja) 2022-11-11
CN110248904A (zh) 2019-09-17
TW201840499A (zh) 2018-11-16
KR20190116247A (ko) 2019-10-14

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