TWI761533B - 導電性組成物及使用該組成物之導電體與積層構造體 - Google Patents

導電性組成物及使用該組成物之導電體與積層構造體 Download PDF

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Publication number
TWI761533B
TWI761533B TW107120896A TW107120896A TWI761533B TW I761533 B TWI761533 B TW I761533B TW 107120896 A TW107120896 A TW 107120896A TW 107120896 A TW107120896 A TW 107120896A TW I761533 B TWI761533 B TW I761533B
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TW
Taiwan
Prior art keywords
silver powder
conductive composition
conductor
particle size
elastomer
Prior art date
Application number
TW107120896A
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English (en)
Chinese (zh)
Other versions
TW201907764A (zh
Inventor
塩澤直行
落合真二
山藤征矢
Original Assignee
日商太陽油墨製造股份有限公司
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Publication of TW201907764A publication Critical patent/TW201907764A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Insulated Conductors (AREA)
TW107120896A 2017-06-19 2018-06-19 導電性組成物及使用該組成物之導電體與積層構造體 TWI761533B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017119896 2017-06-19
JP2017-119896 2017-06-19

Publications (2)

Publication Number Publication Date
TW201907764A TW201907764A (zh) 2019-02-16
TWI761533B true TWI761533B (zh) 2022-04-21

Family

ID=64737195

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107120896A TWI761533B (zh) 2017-06-19 2018-06-19 導電性組成物及使用該組成物之導電體與積層構造體

Country Status (5)

Country Link
JP (1) JP7077316B2 (ja)
KR (2) KR20230141912A (ja)
CN (1) CN110799583B (ja)
TW (1) TWI761533B (ja)
WO (1) WO2018235734A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7305102B2 (ja) * 2019-02-19 2023-07-10 太陽ホールディングス株式会社 導電性組成物およびそれを用いた導電体並びに積層構造体
JP7205896B2 (ja) * 2019-05-22 2023-01-17 株式会社 ベアック 貼り付け装置および貼り付け方法
JP2021095440A (ja) * 2019-12-13 2021-06-24 東洋インキＳｃホールディングス株式会社 樹脂組成物、伸縮性導体、電子デバイスおよび粘着フィルム
JP2021109901A (ja) * 2020-01-08 2021-08-02 太陽インキ製造株式会社 導電性組成物およびその固形物、並びにトランスデューサ
JP7511448B2 (ja) 2020-11-13 2024-07-05 信越化学工業株式会社 ポリウレタン、ポリウレタンの製造方法、導電性ペースト組成物、導電配線および導電配線の製造方法
JP7150962B1 (ja) 2021-10-15 2022-10-11 信越化学工業株式会社 ポリウレタン、ポリウレタンの製造方法、導電性ペースト組成物、導電配線および導電配線の製造方法
JPWO2023120484A1 (ja) * 2021-12-20 2023-06-29

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105378854A (zh) * 2013-07-08 2016-03-02 东洋纺株式会社 导电浆料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916633B2 (ja) * 1977-02-28 1984-04-17 松下電工株式会社 戻り防止装置付折り畳み扉
JPS56149006A (en) * 1980-04-21 1981-11-18 Nippon Telegr & Teleph Corp <Ntt> Production of single polarization mode optical fiber
KR102007046B1 (ko) * 2011-01-26 2019-08-02 나믹스 가부시끼가이샤 도전성 페이스트 및 그 제조 방법
WO2017026130A1 (ja) * 2015-08-07 2017-02-16 太陽インキ製造株式会社 導電性組成物、導電体および基材
KR102572783B1 (ko) * 2015-08-07 2023-08-31 다이요 홀딩스 가부시키가이샤 도전성 조성물, 도전체 및 플렉시블 프린트 배선판
JP6103404B1 (ja) * 2016-03-11 2017-03-29 福田金属箔粉工業株式会社 導電性ペースト

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105378854A (zh) * 2013-07-08 2016-03-02 东洋纺株式会社 导电浆料

Also Published As

Publication number Publication date
KR20230141912A (ko) 2023-10-10
TW201907764A (zh) 2019-02-16
KR20200020719A (ko) 2020-02-26
CN110799583B (zh) 2022-12-13
CN110799583A (zh) 2020-02-14
KR102616622B1 (ko) 2023-12-26
WO2018235734A1 (ja) 2018-12-27
JPWO2018235734A1 (ja) 2020-04-23
JP7077316B2 (ja) 2022-05-30

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