TWI761335B - 支撐片及保護膜形成用複合片 - Google Patents
支撐片及保護膜形成用複合片 Download PDFInfo
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- TWI761335B TWI761335B TW106108951A TW106108951A TWI761335B TW I761335 B TWI761335 B TW I761335B TW 106108951 A TW106108951 A TW 106108951A TW 106108951 A TW106108951 A TW 106108951A TW I761335 B TWI761335 B TW I761335B
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- Prior art keywords
- protective film
- adhesive layer
- forming
- film
- meth
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- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
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- Organic Chemistry (AREA)
- Dicing (AREA)
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- Laminated Bodies (AREA)
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| JP7059553B2 (ja) * | 2017-10-04 | 2022-04-26 | 昭和電工マテリアルズ株式会社 | ステルスダイシング用粘着テープ及びダイシングダイボンディング一体型テープ、並びに半導体装置の製造方法 |
| KR102448152B1 (ko) * | 2017-10-27 | 2022-09-27 | 린텍 가부시키가이샤 | 보호막 형성용 필름, 보호막 형성용 복합 시트 및 반도체 칩의 제조 방법 |
| WO2019087992A1 (ja) * | 2017-10-31 | 2019-05-09 | 東レフィルム加工株式会社 | 積層フィルム |
| JP7138448B2 (ja) * | 2018-02-22 | 2022-09-16 | リンテック株式会社 | 粘着シート巻回体 |
| WO2019172438A1 (ja) * | 2018-03-09 | 2019-09-12 | リンテック株式会社 | 保護膜形成用複合シート及び保護膜付き半導体チップの製造方法 |
| CN111630631B (zh) * | 2018-03-30 | 2023-07-14 | 琳得科株式会社 | 支撑片及保护膜形成用复合片 |
| WO2019186990A1 (ja) * | 2018-03-30 | 2019-10-03 | リンテック株式会社 | 支持シート及び保護膜形成用複合シート |
| WO2019186994A1 (ja) * | 2018-03-30 | 2019-10-03 | リンテック株式会社 | 保護膜形成用複合シート及びその製造方法 |
| KR102467148B1 (ko) * | 2018-03-30 | 2022-11-14 | 린텍 가부시키가이샤 | 지지 시트 및 보호막 형성용 복합 시트 |
| KR102524205B1 (ko) * | 2018-03-30 | 2023-04-20 | 린텍 가부시키가이샤 | 보호막 형성용 복합 시트 및 그 제조 방법 |
| JP7119070B2 (ja) * | 2018-03-30 | 2022-08-16 | リンテック株式会社 | 保護膜形成用複合シートの製造方法、保護膜付き半導体チップの製造方法、及び、半導体装置の製造方法 |
| JP6854983B1 (ja) * | 2019-04-26 | 2021-04-07 | リンテック株式会社 | 第三積層体の製造方法、第四積層体の製造方法及び裏面保護膜付き半導体装置の製造方法、並びに、第三積層体 |
| JP7478524B2 (ja) * | 2019-09-05 | 2024-05-07 | リンテック株式会社 | 保護膜形成用フィルム、保護膜形成用複合シート、及び保護膜付きワーク加工物の製造方法 |
| JP7387510B2 (ja) * | 2020-03-26 | 2023-11-28 | リンテック株式会社 | 保護膜形成フィルム、保護膜形成用複合シート、及び保護膜形成フィルム付きワークの搬送方法 |
| TWI811636B (zh) * | 2020-03-31 | 2023-08-11 | 日商東洋紡股份有限公司 | 附有保護膜之無機基板/工程塑膠薄膜積層體、積層體之堆疊、積層體的保管方法、及積層體的運輸方法 |
| CN111777961B (zh) * | 2020-07-15 | 2022-05-17 | 宁波东旭成新材料科技有限公司 | 一种uv减粘保护膜的制备方法 |
| JP2022143454A (ja) | 2021-03-17 | 2022-10-03 | リンテック株式会社 | 支持シート、保護膜形成用複合シートおよび装置の製造方法 |
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| JP2011243613A (ja) * | 2010-05-14 | 2011-12-01 | Mitsui Chemicals Inc | 半導体ウェハ保護用粘着フィルム及び半導体ウェハ保護用粘着フィルムロール |
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| TW201602303A (zh) * | 2014-05-23 | 2016-01-16 | 琳得科股份有限公司 | 保護膜形成用複合片 |
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| JP5124778B2 (ja) * | 2008-09-18 | 2013-01-23 | リンテック株式会社 | レーザーダイシングシートおよび半導体チップの製造方法 |
| JP5432853B2 (ja) | 2010-07-30 | 2014-03-05 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法 |
| JP6010945B2 (ja) * | 2012-03-16 | 2016-10-19 | 住友ベークライト株式会社 | ダイシングフィルム |
| JP5607847B1 (ja) * | 2013-11-29 | 2014-10-15 | 古河電気工業株式会社 | 半導体加工用粘着テープ |
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| JP2010042665A (ja) * | 2008-07-15 | 2010-02-25 | San Totsukusu Kk | 基材フィルム |
| TW201008771A (en) * | 2008-07-15 | 2010-03-01 | Sun Tox Co Ltd | Base film |
| JP2011243613A (ja) * | 2010-05-14 | 2011-12-01 | Mitsui Chemicals Inc | 半導体ウェハ保護用粘着フィルム及び半導体ウェハ保護用粘着フィルムロール |
| JP2012015236A (ja) * | 2010-06-30 | 2012-01-19 | Furukawa Electric Co Ltd:The | ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 |
| TW201602303A (zh) * | 2014-05-23 | 2016-01-16 | 琳得科股份有限公司 | 保護膜形成用複合片 |
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| WO2017163971A1 (ja) | 2017-09-28 |
| TW201739078A (zh) | 2017-11-01 |
| KR20180124868A (ko) | 2018-11-21 |
| CN108966671A (zh) | 2018-12-07 |
| JP6893500B2 (ja) | 2021-06-23 |
| SG11201807645SA (en) | 2018-10-30 |
| JPWO2017163971A1 (ja) | 2019-01-31 |
| KR102313074B1 (ko) | 2021-10-14 |
| CN108966671B (zh) | 2023-09-26 |
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