TWI758276B - 保護膜形成用片、保護膜形成用片的製造方法及半導體裝置的製造方法 - Google Patents

保護膜形成用片、保護膜形成用片的製造方法及半導體裝置的製造方法 Download PDF

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Publication number
TWI758276B
TWI758276B TW106105584A TW106105584A TWI758276B TW I758276 B TWI758276 B TW I758276B TW 106105584 A TW106105584 A TW 106105584A TW 106105584 A TW106105584 A TW 106105584A TW I758276 B TWI758276 B TW I758276B
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TW
Taiwan
Prior art keywords
protective film
sheet
forming
meth
layer
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TW106105584A
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English (en)
Chinese (zh)
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TW201801160A (zh
Inventor
山本大輔
米山裕之
小橋力也
Original Assignee
日商琳得科股份有限公司
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Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201801160A publication Critical patent/TW201801160A/zh
Application granted granted Critical
Publication of TWI758276B publication Critical patent/TWI758276B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW106105584A 2016-02-22 2017-02-20 保護膜形成用片、保護膜形成用片的製造方法及半導體裝置的製造方法 TWI758276B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-031343 2016-02-22
JP2016031343 2016-02-22

Publications (2)

Publication Number Publication Date
TW201801160A TW201801160A (zh) 2018-01-01
TWI758276B true TWI758276B (zh) 2022-03-21

Family

ID=59686239

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106105584A TWI758276B (zh) 2016-02-22 2017-02-20 保護膜形成用片、保護膜形成用片的製造方法及半導體裝置的製造方法

Country Status (6)

Country Link
JP (1) JP6893498B2 (ja)
KR (1) KR102637275B1 (ja)
CN (1) CN108701641B (ja)
SG (1) SG11201806881WA (ja)
TW (1) TWI758276B (ja)
WO (1) WO2017145938A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210098994A (ko) * 2018-12-05 2021-08-11 린텍 가부시키가이샤 보호막 형성용 복합 시트, 및 반도체 칩의 제조 방법
WO2020189873A1 (ko) * 2019-03-18 2020-09-24 주식회사 모두테크 반도체 패키지 제조공정을 위한 접착 테이프 및 그 제조방법
JP7478524B2 (ja) * 2019-09-05 2024-05-07 リンテック株式会社 保護膜形成用フィルム、保護膜形成用複合シート、及び保護膜付きワーク加工物の製造方法
KR102677755B1 (ko) * 2021-08-12 2024-06-24 (주)이녹스첨단소재 웨이퍼 이면 연삭용 점착 필름

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011110878A (ja) * 2009-11-30 2011-06-09 Lintec Corp 剥離シート、ラベル用粘着シートおよびラベル用粘着シート積層体の製造方法
WO2015178346A1 (ja) * 2014-05-23 2015-11-26 リンテック株式会社 保護膜形成用複合シート

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432853Y2 (ja) 1974-12-12 1979-10-11
JPH0620601Y2 (ja) * 1986-06-13 1994-06-01 株式会社きもと 転写可能な保護膜形成用多層シ−ト
JP3668439B2 (ja) * 2001-06-14 2005-07-06 ソニーケミカル株式会社 接着フィルム
JP2003336217A (ja) * 2002-05-21 2003-11-28 Sanvic Inc ポリエチレンと１−ヘキセンとの共重合体シートを二枚重ねて形成した接触面で摩擦力を低減する工法
JP2007031470A (ja) * 2005-07-22 2007-02-08 Toppan Printing Co Ltd 積層光学部材用粘着シート
JP5565230B2 (ja) * 2010-09-16 2014-08-06 日本ゼオン株式会社 光学フィルムロール及び光学フィルムロールの製造方法
JP5865045B2 (ja) * 2011-12-07 2016-02-17 リンテック株式会社 保護膜形成層付ダイシングシートおよびチップの製造方法
MY169040A (en) * 2012-11-05 2019-02-07 Lintec Corp Adhesive sheet
JP6325307B2 (ja) * 2014-03-28 2018-05-16 積水化成品工業株式会社 深絞り成形用の樹脂製発泡シート、容器及びこれらの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011110878A (ja) * 2009-11-30 2011-06-09 Lintec Corp 剥離シート、ラベル用粘着シートおよびラベル用粘着シート積層体の製造方法
WO2015178346A1 (ja) * 2014-05-23 2015-11-26 リンテック株式会社 保護膜形成用複合シート

Also Published As

Publication number Publication date
CN108701641B (zh) 2023-03-28
TW201801160A (zh) 2018-01-01
KR102637275B1 (ko) 2024-02-15
JP6893498B2 (ja) 2021-06-23
JPWO2017145938A1 (ja) 2018-12-13
KR20180118628A (ko) 2018-10-31
WO2017145938A1 (ja) 2017-08-31
CN108701641A (zh) 2018-10-23
SG11201806881WA (en) 2018-09-27

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