TWI756659B - 集合基板及其製造方法 - Google Patents

集合基板及其製造方法 Download PDF

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Publication number
TWI756659B
TWI756659B TW109111685A TW109111685A TWI756659B TW I756659 B TWI756659 B TW I756659B TW 109111685 A TW109111685 A TW 109111685A TW 109111685 A TW109111685 A TW 109111685A TW I756659 B TWI756659 B TW I756659B
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TW
Taiwan
Prior art keywords
substrate
aggregate
frame body
frame
assembly
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Application number
TW109111685A
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English (en)
Chinese (zh)
Other versions
TW202102074A (zh
Inventor
鈴木義弘
望月強
大川博茂
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日商Ｔｄｋ股份有限公司
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Publication of TW202102074A publication Critical patent/TW202102074A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW109111685A 2019-04-26 2020-04-08 集合基板及其製造方法 TWI756659B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019086224 2019-04-26
JP2019-086224 2019-04-26

Publications (2)

Publication Number Publication Date
TW202102074A TW202102074A (zh) 2021-01-01
TWI756659B true TWI756659B (zh) 2022-03-01

Family

ID=72942256

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109111685A TWI756659B (zh) 2019-04-26 2020-04-08 集合基板及其製造方法

Country Status (3)

Country Link
JP (1) JP7380681B2 (enrdf_load_stackoverflow)
TW (1) TWI756659B (enrdf_load_stackoverflow)
WO (1) WO2020217951A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102844112B1 (ko) * 2022-08-10 2025-08-07 앱솔릭스 인코포레이티드 코어기판, 기판 및 반도체 패키징 기판의 용도

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102210198A (zh) * 2008-11-07 2011-10-05 揖斐电株式会社 多片式基板的制造方法
JP2013149874A (ja) * 2012-01-23 2013-08-01 Kyocer Slc Technologies Corp 多数個取り配線基板の組立体および多数個取り配線基板の組立方法
CN104080283A (zh) * 2013-03-28 2014-10-01 株式会社京滨 树脂框体
JP2015046450A (ja) * 2013-08-28 2015-03-12 イビデン株式会社 プリント配線板
TWM503066U (zh) * 2015-03-17 2015-06-11 He Gang Tian Technology Co Ltd 基板固定之治具

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0747904Y2 (ja) * 1990-05-29 1995-11-01 シャープ株式会社 複合多層プリント配線基板
JP4026705B2 (ja) 2002-05-27 2007-12-26 Ｔｄｋ株式会社 積層型電子部品を構成する層及び積層型電子部品の製造方法
JP2004063803A (ja) * 2002-07-29 2004-02-26 Ngk Spark Plug Co Ltd プリント配線基板の製造方法、プリント配線基板製造用金属板、連結プリント配線基板
JP2004146766A (ja) 2002-08-27 2004-05-20 Kyocera Corp 多数個取り多層配線基板
JP2005159183A (ja) 2003-11-27 2005-06-16 Kyocera Corp 電子装置の製造方法
JP4518113B2 (ja) * 2007-07-25 2010-08-04 Ｔｄｋ株式会社 電子部品内蔵基板及びその製造方法
JP4560099B2 (ja) 2008-03-07 2010-10-13 日本特殊陶業株式会社 多数個取り基板
JP5203045B2 (ja) * 2008-05-28 2013-06-05 日本特殊陶業株式会社 多層配線基板の中間製品、多層配線基板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102210198A (zh) * 2008-11-07 2011-10-05 揖斐电株式会社 多片式基板的制造方法
JP2013149874A (ja) * 2012-01-23 2013-08-01 Kyocer Slc Technologies Corp 多数個取り配線基板の組立体および多数個取り配線基板の組立方法
CN104080283A (zh) * 2013-03-28 2014-10-01 株式会社京滨 树脂框体
JP2015046450A (ja) * 2013-08-28 2015-03-12 イビデン株式会社 プリント配線板
TWM503066U (zh) * 2015-03-17 2015-06-11 He Gang Tian Technology Co Ltd 基板固定之治具

Also Published As

Publication number Publication date
TW202102074A (zh) 2021-01-01
JPWO2020217951A1 (enrdf_load_stackoverflow) 2020-10-29
JP7380681B2 (ja) 2023-11-15
WO2020217951A1 (ja) 2020-10-29

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