JPWO2020217951A1 - - Google Patents

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Publication number
JPWO2020217951A1
JPWO2020217951A1 JP2021515950A JP2021515950A JPWO2020217951A1 JP WO2020217951 A1 JPWO2020217951 A1 JP WO2020217951A1 JP 2021515950 A JP2021515950 A JP 2021515950A JP 2021515950 A JP2021515950 A JP 2021515950A JP WO2020217951 A1 JPWO2020217951 A1 JP WO2020217951A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021515950A
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Japanese (ja)
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JP7380681B2 (ja
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Publication of JPWO2020217951A1 publication Critical patent/JPWO2020217951A1/ja
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Publication of JP7380681B2 publication Critical patent/JP7380681B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2021515950A 2019-04-26 2020-04-06 集合基板及びその製造方法 Active JP7380681B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019086224 2019-04-26
JP2019086224 2019-04-26
PCT/JP2020/015527 WO2020217951A1 (ja) 2019-04-26 2020-04-06 集合基板及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2020217951A1 true JPWO2020217951A1 (enrdf_load_stackoverflow) 2020-10-29
JP7380681B2 JP7380681B2 (ja) 2023-11-15

Family

ID=72942256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021515950A Active JP7380681B2 (ja) 2019-04-26 2020-04-06 集合基板及びその製造方法

Country Status (3)

Country Link
JP (1) JP7380681B2 (enrdf_load_stackoverflow)
TW (1) TWI756659B (enrdf_load_stackoverflow)
WO (1) WO2020217951A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102844112B1 (ko) * 2022-08-10 2025-08-07 앱솔릭스 인코포레이티드 코어기판, 기판 및 반도체 패키징 기판의 용도

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415266U (enrdf_load_stackoverflow) * 1990-05-29 1992-02-06
JP2003347452A (ja) * 2002-05-27 2003-12-05 Tdk Corp 電子部品用構造物
JP2004063803A (ja) * 2002-07-29 2004-02-26 Ngk Spark Plug Co Ltd プリント配線基板の製造方法、プリント配線基板製造用金属板、連結プリント配線基板
JP2004146766A (ja) * 2002-08-27 2004-05-20 Kyocera Corp 多数個取り多層配線基板
JP2005159183A (ja) * 2003-11-27 2005-06-16 Kyocera Corp 電子装置の製造方法
JP2009032823A (ja) * 2007-07-25 2009-02-12 Tdk Corp 電子部品内蔵基板及びその製造方法
JP2009218240A (ja) * 2008-03-07 2009-09-24 Ngk Spark Plug Co Ltd 多数個取り基板
JP2009289848A (ja) * 2008-05-28 2009-12-10 Ngk Spark Plug Co Ltd 多層配線基板の中間製品、多層配線基板の製造方法
JP2013149874A (ja) * 2012-01-23 2013-08-01 Kyocer Slc Technologies Corp 多数個取り配線基板の組立体および多数個取り配線基板の組立方法
JP2015046450A (ja) * 2013-08-28 2015-03-12 イビデン株式会社 プリント配線板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8572839B2 (en) * 2008-11-07 2013-11-05 Ibiden Co., Ltd. Fabrication method for multi-piece board
JP6158553B2 (ja) * 2013-03-28 2017-07-05 株式会社ケーヒン 樹脂筐体
TWM503066U (zh) * 2015-03-17 2015-06-11 He Gang Tian Technology Co Ltd 基板固定之治具

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415266U (enrdf_load_stackoverflow) * 1990-05-29 1992-02-06
JP2003347452A (ja) * 2002-05-27 2003-12-05 Tdk Corp 電子部品用構造物
JP2004063803A (ja) * 2002-07-29 2004-02-26 Ngk Spark Plug Co Ltd プリント配線基板の製造方法、プリント配線基板製造用金属板、連結プリント配線基板
JP2004146766A (ja) * 2002-08-27 2004-05-20 Kyocera Corp 多数個取り多層配線基板
JP2005159183A (ja) * 2003-11-27 2005-06-16 Kyocera Corp 電子装置の製造方法
JP2009032823A (ja) * 2007-07-25 2009-02-12 Tdk Corp 電子部品内蔵基板及びその製造方法
JP2009218240A (ja) * 2008-03-07 2009-09-24 Ngk Spark Plug Co Ltd 多数個取り基板
JP2009289848A (ja) * 2008-05-28 2009-12-10 Ngk Spark Plug Co Ltd 多層配線基板の中間製品、多層配線基板の製造方法
JP2013149874A (ja) * 2012-01-23 2013-08-01 Kyocer Slc Technologies Corp 多数個取り配線基板の組立体および多数個取り配線基板の組立方法
JP2015046450A (ja) * 2013-08-28 2015-03-12 イビデン株式会社 プリント配線板

Also Published As

Publication number Publication date
TWI756659B (zh) 2022-03-01
TW202102074A (zh) 2021-01-01
JP7380681B2 (ja) 2023-11-15
WO2020217951A1 (ja) 2020-10-29

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