TWI754693B - Plating treatment jig and plating treatment device - Google Patents

Abstract

The object of the present invention is to provide a jig for plating treatment and a plating treatment apparatus which can suppress the occurrence of nodules even when the jig for plating treatment is rotated in a plating bath. A jig for electroplating treatment in which a disc-shaped substrate is immersed in an electroplating solution in an electroplating bath, characterized in that it comprises: a support rod inserted into the center hole of the base plate; a restraint element, which supports the support rod and is provided with rotation suppression A mechanism is used to restrain the support rod from rotating after being supported; the turntable is installed with the support rod via the restraint element.

Description

Plating treatment jig and plating treatment device

The present invention relates to electroplating treatment technology, and more specifically, to an electroplating treatment jig and an electroplating treatment apparatus for dipping a disk-shaped substrate having a center hole in an electroplating bath to form an electroplating film on the substrate .

The magnetic recording medium used in HDDs (hard disk drives) mounted on PCs, home appliances, etc., is in high demand due to its high convenience, and the development of a significant increase in recording density is still ongoing.

With regard to such a magnetic recording medium, realization of higher recording density has continued to be demanded from the market. Therefore, the disk-shaped substrate used in the magnetic recording medium is also required to have higher smoothness and less damage than conventional high quality. substrate.

As this disk-shaped substrate, for example, an aluminum alloy substrate or a glass substrate is used. Among them, the aluminum alloy substrate is manufactured by going through, for example, the steps shown below. That is, first, an aluminum alloy plate having a thickness of about 1 to 3 mm is punched into a doughnut shape, and then processed into a substrate of a desired size. Next, the punched substrate is subjected to chamfering of the end portion and the like, followed by grinding with a grindstone, and thereafter, electroless NiP plating is performed on the surface of the substrate.

On the other hand, in electroless NiP plating, for example, as disclosed in Patent Document 1, a plurality of substrates are held by a jig for plating treatment, and these substrates are collectively immersed in a plating bath. Also, as disclosed in Patent Document 1, a plating film is efficiently formed on the surface of the substrate, and it is also known to perform electroless NiP plating on a plurality of substrates while rotating or revolving a jig for plating treatment.

On the other hand, in the above-described technique of rotating or revolving the plating jig in the plating bath, there may be cases where a defect called a nodule occurs on the surface of the substrate due to wear products generated from the sliding direction of the plating jig.

If such nodules are generated, the quality of the substrate will be significantly degraded, so how to suppress such nodules becomes important. In this regard, Patent Document 1 discloses that the grooves into which the outer peripheral edge portion of the substrate 10 is fitted have a U-shaped cross-section, thereby suppressing the occurrence of nodules that are likely to occur in the outer peripheral edge portion of the substrate.

[Prior Technology Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2007-169757

However, the above-mentioned conventional jig for electroplating treatment has the following problems, and it can be said that there is still room for improvement.

That is, according to Patent Document 1, it is possible to suppress the nodules due to the outer peripheral edge of the substrate, but there is no mention of wear products generated from the sliding parts of the jig for plating treatment. As described above, in the configuration of Patent Document 1, there is a concern that other nodules may be generated due to wear products generated by the sliding portion of the jig for plating treatment.

The present invention has been made in view of solving such a problem, and an object of the present invention is to provide a jig for plating treatment and a plating treatment apparatus which can suppress the occurrence of nodules even when the jig for plating treatment is rotated in a plating bath.

In order to solve the above problem, a jig system for electroplating treatment according to an embodiment of the present invention, (1) is used for dipping a disk-shaped substrate having a center hole into a plating solution in an electroplating bath, comprising: a support rod, Inserted into the center hole of the base plate; a restraint element supports the support rod, and is provided with a rotation restraining mechanism to restrain the support rod from rotating after being supported; a turntable is provided with the support rod through the restraint element.

Furthermore, in the above-mentioned (1) jig for electroplating treatment, preferably, (2) the rotation restraining mechanism includes a pressing element, which has: a contact element for contacting the support rod; an elastic element, The contact element is pushed against the support rod.

In addition, in the jig for electroplating according to (2) above, it is preferable that (3) the restraining element is provided with a U-shaped accommodating recess for accommodating at least a part of the peripheral surface of the support rod , the contact element is in the state of receiving the support rod in the receiving recess, and contacts and pushes the support rod through the elastic element.

Furthermore, in the jig for electroplating treatment according to (2) or (3) above, it is preferable that (4) at least two of the pressing elements are provided, and the contact elements are related to the direction of entering and exiting. And relative configuration.

Furthermore, in the jig for electroplating treatment according to any one of the above (1) to (4), preferably, (5) a guide surface is formed on the top of the contact element to facilitate the support rod loading and unloading.

Furthermore, in the jig for electroplating treatment according to any one of (1) to (5) above, it is preferable that (6) at least a part of the top portion of the contact element is subjected to a low friction treatment .

Furthermore, in order to solve the above-mentioned problems, a plating treatment apparatus according to an embodiment of the present invention includes the plating treatment jig described in any one of the above (1) to (6) and a rotating mechanism for rotating the turntable.

According to the present invention, since the rotation of the support rod attached to the turntable is suppressed by the rotation suppression mechanism, it is possible to suppress the occurrence of nodules due to wear products generated at the connection portion between the support rod and the turntable.

L‧‧‧electroplating solution

1‧‧‧Substrate

10‧‧‧Electroplating fixtures

11‧‧‧Support rod

12‧‧‧Restriction element

12a‧‧‧Bearing

12b‧‧‧Push element

13‧‧‧Turntable

13a‧‧‧First turntable

13b‧‧‧Second Turntable

14‧‧‧Suspension

15‧‧‧Rotating mechanism

15a‧‧‧motor

15b‧‧‧Transmission gear

16‧‧‧Rotary axis

20‧‧‧Plating baths

100‧‧‧Plating treatment equipment

FIG. 1 is a schematic diagram of a jig 10 for electroplating treatment and an electroplating treatment apparatus 100 of the present invention.

FIG. 2 is a schematic diagram of the restraining element 12 in the jig 10 for electroplating according to the present invention.

FIG. 3 is a development view of each side of the jig 10 for electroplating according to the present invention after development.

FIG. 4 is a schematic view illustrating the pressing element 12b in the rotation suppressing mechanism of the jig 10 for plating treatment of the present invention.

5 is a schematic view illustrating the bearing member 12a in the rotation suppressing mechanism of the jig 10 for plating treatment of the present invention.

6 is a state transition diagram of the jig 10 for electroplating according to the present invention, when the restraint element 12 is attached and detached.

Hereinafter, embodiments for implementing the present invention will be described. In the drawings used in the following description, for convenience, the direction in which the support rod 11 extends when attached to the jig 10 for plating treatment is denoted as the X direction, and the X direction is used as a reference, and the directions suitable for the description in each drawing are used. The Y direction and the Z direction are appropriately set. However, these directions are ultimately set for the purpose of clarifying the description, and are not intended to unduly limit the interpretation of the present invention.

FIG. 1 is a schematic diagram of a jig 10 for electroplating treatment and an electroplating treatment apparatus 100 of the present invention. 1(a) is a schematic view of a plating treatment apparatus 100 including a plating treatment jig 10, (b) is a plan view of the plating treatment jig 10 viewed from the axial direction, and (c) is in FIG. 1(a) Part of the enlarged view of the region P, (d) is the AA cross-sectional view of Figure 1 (c) (cut in the direction of the YZ plane). As shown in these figures, the electroplating treatment apparatus 100 in this embodiment mainly includes a jig 10 for electroplating treatment and a rotating mechanism 15 .

The jig 10 for electroplating treatment is used to immerse the disk-shaped substrate 1 having a center hole in the electroplating liquid L in the electroplating bath 20 . And the jig 10 for electroplating processing of this embodiment is comprised at least including a support rod, a restraint element, and a turntable.

Here, the board|substrate 1 is a disk-shaped element which consists of a metal material, such as glass or aluminum, which has a circular through-hole (center hole) in the center. Such a substrate 1 has a thickness of about 0.3 mm to 2.0 mm. Generally, aluminum substrates are mainly used for substrates with a diameter larger than 2.5 inches, and glass substrates are mainly used for sizes below 2.5 inches.

Among them, on the aluminum substrate 1, after performing necessary pretreatment on, for example, a pretreated workpiece punched from an aluminum material, an electroless plating treatment according to a Ni-P plating bath described later is performed to form a Ni-P alloy coating on the surface, In addition, a ferromagnetic metal thin film or the like is laminated thereon to form a magnetic recording disk substrate.

The electroplating bath 20 is a metal or resin tank having a size of about one or a plurality of electroplating jigs. Furthermore, as the plating bath 20, for example, the bath disclosed in the patent document or other known electroless plating baths can be used. Furthermore, in the present embodiment, the electroplating solution L stored in the electroplating bath 20 can be a known Ni-P electroplating solution. As an example, nickel sulfate: 20 g/dm ³ , hypophosphorous acid can be used for example. Sodium: 20 g/dm ³ , sodium acetate: 100 g/dm ³ , sodium citrate: 10 g/dm ³ aqueous solution, etc.

The support rod 11 is a rod-shaped member inserted into the center hole of the base plate. As shown in FIG. 1, one or a plurality of support rods 11 are arranged between a pair of turntables 13a and 13b. The material of the support rod 11 is not particularly limited, for example, resin etc. are mentioned.

Furthermore, the support rod 11 supports the substrate 1 through the above-mentioned center hole, but in addition to the periphery of the support rod 11 , outer peripheral holding shafts arranged at predetermined intervals on the circumferential line in the vicinity of the outer peripheral edge of the substrate 1 may be arranged. (See Japanese Patent Laid-Open No. 2007-169757, etc.).

The restraining element 12 has the function of supporting the support rod 11 . An example of the restraint element 12 in this embodiment is a U-shaped element in cross-section in the form of holding the support rod 11 . On the other hand, the restraint element 12 of the present embodiment includes a rotation restraining mechanism (described later), which restrains the support rod 11 from being supported from rotating. The material of the restraining element 12 is not particularly limited, for example, resin and the like can be used. On the other hand, as shown in FIG. 1 , the restraint member 12 is in the form of facing the outer circumferential direction of the U-shaped opening side (the space where the support rod 11 is inserted) through the positioning protrusion 12a ₃ to be described later, corresponding to the support rod. One or more counts of 11 are set on the turntable 13 .

The turntable 13 is an element to which the support rod 11 is mounted via the restraining element 12 . The turntable 13 of the present embodiment is a large-sized disk having teeth formed on the outer periphery, and can be arranged in a pair so as to horizontally support the support rods 11 . More specifically, as shown in FIG. 1 , the first turntable 13a and the second turntable 13b are arranged to face each other at a predetermined interval, and one or a plurality of support rods 11 are horizontally arranged in the inside. The material of the turntable 13 is not particularly limited, for example, resin or the like can be mentioned.

In addition, the electroplating treatment apparatus 100 of the present embodiment may include the suspension device 14 that is supported in a state where the jig for electroplating treatment is immersed in the electroplating bath 20 .

As shown in FIG. 1 , the suspension device 14 has a function of suspending and supporting both ends of the turntable 13 . At this time, it is preferable that the suspension devices 14 are not fixed to both ends of the turntable 13 so as not to hinder the rotation of the turntable 13 by the rotation mechanism 15 described later, and support the turntable 13 in this state.

Therefore, as shown in FIG. 1 , the plurality of substrates 1 accommodated in the jig 10 for electroplating treatment suspended by the suspension device 14 are immersed in the electroplating bath 20 in a state in which the support rods 11 are inserted into the center holes, respectively. in liquid L.

After the plurality of substrates 1 are immersed in the plating solution L, the turntable 13 can rotate around the rotating shaft 16 via the rotating mechanism 15 of the plating treatment apparatus 100 , and the support rod 11 can revolve in the plating solution L through this.

Such a rotating mechanism 15 includes, for example, a motor 15a and a transmission gear 15b. Among them, various known electronic motors can also be used for the motor 15a. In addition, the transmission gear 15b transmits the power from the motor 15a to the turntable 13, whereby the turntable 13 can rotate around the rotation shaft 16.

Furthermore, as described above, when the turntable 13 rotates around the rotation shaft 16 , the support rod 11 supporting the turntable 13 revolves around the rotation shaft 16 .

Next, the rotation suppressing mechanism of the restraint element 12 in the present embodiment will be described in detail with reference to FIGS. 1 to 5 . Furthermore, FIG. 2( a ) is an external perspective view of the restraining element 12 , and FIG. 2( b ) is a side view and a top view. 3 is an external view of the restraint member 12 viewed from the front, side, and top. 4 is a schematic diagram of the structure of the pressing element 12b in the rotation restraining mechanism of the restraining element 12. As shown in FIG. 5 is a schematic view of the bearing 12a in the rotation suppressing mechanism of the restraining member 12. As shown in FIG.

As described above, the restraint element 12 provided on the turntable 13 includes a rotation restraining mechanism, which can restrain the support rod 11 from rotating within the restraint element 12 when the support rod 11 revolves around the rotating shaft 16 with the rotation of the turntable 13 ( rotation).

As shown in FIG. 2 , the rotation restraining mechanism of the restraining element 12 in this embodiment includes a bearing 12a and a pressing element 12b.

Among them, the bearing 12a is, as also shown in FIGS. 3 and 5 , and includes a housing recess 12a ₁ , a pressing element housing 12a ₂ , a positioning protrusion 12a ₃ , and the like. The material of the bearing 12a is not particularly limited, and may be formed of, for example, resin or the like.

The accommodating recess 12a ₁ is a recess that can accommodate at least a part of the peripheral surface of the support rod 11 , and the bottom surface that the support rod 11 contacts forms a U-shaped curved surface according to the outer peripheral surface of the support rod 11 . Furthermore, as shown in FIG. 3 , the length L inserted by the support rod 11 is as far as possible so that the support rod 11 can be supported by the restraining element 12 and is not particularly limited. set up.

The pressing element accommodating part 12a- ₂ is a site|part which accommodates the pressing element 12b mentioned later. In the present embodiment, the pressing element accommodating portion 12a ₂ is arranged so as to sandwich the accommodating recessed portion 12a ₁ so as to face each other at two places. Moreover, as shown in FIG. 5, guide grooves 12a- ₄ are formed in the pressing element accommodating part 12a- ₂ , and guide the movement of the pressing element 12b so that the pressing element 12b does not fall off.

Moreover, the insertion hole 12a ₅ into which the attachment element 12b ₃ mentioned later is inserted is formed in the push element accommodating part 12a ₂ . In this way, in the present embodiment, the mounting element 12b ₃ is arranged in the pressing element accommodating portion 12a ₂ through the insertion hole 12a ₅ , so that the pressing element 12b can be stabilized and positioned in the pressing element accommodating portion 12a ₂ .

The positioning protrusions 12a to ₃ are used to set guides for the restraining elements 12 at predetermined positions of the above-mentioned turntable 13 . That is, the turntable 13 is also formed with a positioning recess (not shown) corresponding to the positioning protrusion 12a ₃ . By inserting the positioning recess into the positioning protrusion 12a ₃ , the position of the restraining element 12 on the turntable 13 can be determined. .

Furthermore, the positioning protrusions 12a ₃ of the present embodiment are cylindrical, but not limited to this, and may also be rectangular, such as a triangular column, a quadrangular column, or a pentagonal column. The positioning protrusions 12a ₃ are rectangular, and the corresponding positioning recesses are also rectangular, so that the opening of the U-shaped side faces the outer periphery, etc., the orientation of the restraining element 12 can also be automatically determined.

Next, the detailed configuration of the pressing element 12b in the above-described rotation suppression mechanism will be described with reference to FIGS. 2 to 4 .

First, as shown in FIG. 4 , the pressing element 12b includes a contact element 12b ₁ , an elastic element 12b ₂ , and a mounting element 12b ₃ .

4, (a) shows the contact element 12b ₁ , (b) shows the elastic element 12b ₂ , (c) shows the mounting element 12b ₃ , (d) shows the contact element viewed from the Y direction side 12b ₁ , (e) is a view of the mounting member 12b ₃ viewed from the Y direction side.

The contact element 12b ₁ is an element that can contact the support rod 11 received in the receiving recess 12a ₁ . The material of the contact element 12b ₁ is not particularly limited, and may be formed of, for example, resin.

As shown in the same figure, a bolt hole M is formed in the contact element 12b ₁ , and a bolt portion N of the attachment element 12b ₃ to be described later is screwed. Therefore, the contact element 12b ₁ is in a state where the support rod 11 is accommodated in the accommodation recess 12a ₁ , and the support rod 11 can be contacted and pressed via the elastic element 12b ₂ described later.

In addition, as also shown in FIG. 2 and FIG. 3 , the restraining element 12 of this embodiment can also be provided with at least two pressing elements 12b, and the mutual contact elements 12b ₁ are related to the entering and exiting directions (in FIG. 2 ). The Y direction) and the relative configuration.

Also, as shown in FIG. 4 , a guide surface t1 and a guide surface t2 are formed on the top t of the contact element 12b1 _of the present embodiment to facilitate the attachment and detachment of the support rod 11 .

Among them, the guide surface t1 is the surface contacted by the support rod 11 after the receiving recess 12a ₁ is received. As is also apparent from FIG. 3 , the top t is formed in a shape such as a triangular roof or an arrow shape, and the guide surface t1 is formed along the peripheral surface of the support rod 11 from the front end of the top t to make the front end relative to the Y direction. Tapered form and sloping face.

On the other hand, the guide surface t2 is a surface with which the support rod 11 contacts when the support rod 11 is accommodated in the accommodating recess 12a ₁ . As is also apparent from FIG. 3 , this guide surface t2 is also a surface that is inclined from the front end of the top t in such a manner that the front end is tapered with respect to the Y direction. 4, in this embodiment, the angle α1 formed by the guide surface _t1 and the Y axis and the angle α2 formed by the guide surface _t2 and the Y axis are equal to each other. However, it is not limited to this state. When α ₁ ≠α ₂ , it can also be α ₁ >α ₂ , or α ₁ <α ₂ .

In addition, at least a part of the top _t of the contact element 12b1 may be subjected to low-friction treatment. In other words, at least one of the guide surface t1 and the guide surface t2 may be subjected to low-friction treatment to facilitate the attachment and detachment of the support rod 11 . As a specific example of this low-friction treatment, various known treatment methods can be used, for example, a fluorine coating film can also be individually applied, and a diamond-like carbon (DLC; diamond-like carbon) coating film can also be individually applied.

Further, as shown in FIG. 4 , the contact element 12b ₁ is formed with a guide protrusion 12b ₄ corresponding to the guide groove 12a ₄ of the above-described push element accommodating portion 12a ₂ . In this embodiment, corresponding to the guide grooves 12a ₄ , guide protrusions 12b ₄ are respectively formed on two adjacent side surfaces of the contact element 12b ₁ .

The elastic element 12b ₂ has a function of pressing the above-mentioned contact element 12b ₁ to the support rod 11 . As a specific example of the elastic element 12b ₂ in this embodiment, there is no particular limitation if the contact element 12b ₁ can be pressed against the support rod 11 , such as a spring or a gum. The elastic element 12b ₂ preferably has a load factor that allows the contact element 12b ₁ to continuously push the support rod 11 when the support rod 11 is accommodated in the accommodating recess 12a ₁ .

In the elastic element 12b ₂ of the present embodiment, one end portion of the elastic element 12b 2 is in contact with the contact element 12b ₁ , while the other end portion is in contact with the pressing element receiving portion 12a ₂ . Thereby, when the support rod 11 is attached and detached, the elastic element 12b ₂ can achieve the effect of pushing out the contact element 12b ₁ with the pressing element receiving portion 12a ₂ as the base end.

As shown in FIG. 3 etc., the mounting element 12b ₃ is accommodated in the part of the pressing element accommodating part 12a ₂ . The material of this mounting member _12b3 is not particularly limited, and may be formed of, for example, resin or the like. As described above, in the present embodiment, the insertion hole 12a ₅ is formed in the pressing element accommodating portion 12a ₂ , and the mounting element 12b ₃ is inserted into the insertion hole 12a ₅ . Moreover, the front-end|tip part of the attachment element _12b3 forms the bolt part N, and is integrated by screwing with the said bolt hole M of the contact element _12b1 . Thereby, the pressing element 12b is accommodated in the pressing element accommodating portion 12a ₂ , and the guide groove 12a ₄ and the guide protrusion 12b ₄ can prevent the pressing element 12b from falling off.

Next, the state transition when the support rod 11 is inserted into and removed from the accommodation recess 12a ₁ of the restraint element 12 will be described with reference to FIG. 6 . 6(a) shows when the support rod 11 is outside the housing recess 12a ₁ , (b) shows when the support rod 11 is being inserted into the housing recess 12a ₁ , and (c) shows the support rod 11 moving toward the housing recess 12a. ₁ when the collection is completed.

As shown in FIG. 6( b ), when the support rod 11 is accommodated in the receiving recess 12a ₁ of the restraining member 12, along with the insertion of the support rod 11, the contact member 12b ₁ of the pressing member 12 is tied to the outside (for a pair of The direction in which the contact elements 12b ₁ are separated from each other) slides.

As shown in FIG. 6( c ), if the support rod 11 moves further into the receiving recess 12a ₁ , the contact element 12b ₁ pushes the outer peripheral surface of the support rod 11 by the action of the elastic element 12b ₂ . Thereby, the support rod 11 is fixed in the accommodation recess 12a ₁ , and even if the support rod 11 revolves due to the rotation of the turntable 13 as described above, the rotation of the support rod 11 can be suppressed in the accommodation recess 12a ₁ .

On the other hand, for example, when the substrate 1 is removed from the support rod 11 after the Ni-P plating process is completed, it is necessary to release the restraint by the restraint element 12 and remove the support rod 11 from the turntable 13 . In this case, as shown in FIG. 6( b ), the contact element 12b ₁ of the pressing element 12 slides outside along with the disengagement of the support rod 11 from the receiving recess 12a ₁ . Next, as shown in FIG. 6( a ), after the support rod 11 is completely detached from the receiving recess 12a ₁ , the contact element 12b ₁ is restored to its original position by the action of the elastic element 12b ₂ .

In this way, in the present embodiment, the restraining element 12 provided on the turntable 13 supports the support rod 11 in a detachable manner, and can restrain the support rod 11 from rotating in the accommodation recess 12a ₁ by the function of the rotation restraining mechanism.

Thereby, it is possible to suppress the occurrence of nodules due to wear products generated at the connection portion between the support rod and the turntable.

Furthermore, various modifications can be made to the embodiments described above without departing from the spirit and scope of the present invention. Hereinafter, a variation example applicable to the present invention will be described.

In the above-mentioned embodiment, a guide surface is formed on the top t of the contact element 12b ₁ and is shaped like a triangular roof or an arrow, but the guide surface t2 can also be the same curved surface as the peripheral surface of the support rod 11 . Alternatively, the top t of the contact element 12b ₁ does not necessarily have a guide surface, and it can be appropriately omitted.

Moreover, in the above-described embodiment, the top t has a shape such as a triangular roof shape or an arrow shape whose tip is tapered. Here, the front end of the top part t may be made sharp, and more preferably, the front end may be formed into a rounded shape having an R part (rounded part). .

That is, by setting the front end to have a rounded part shape, the installation of the support rod 11 can be performed more smoothly. As a result, when the support rod 11 on which the disk-shaped substrate is installed is installed on the jig for electroplating treatment of the present invention, the collision between the disk-shaped substrates or between the disk-shaped substrate and the jig for electroplating treatment can be suppressed. Generated shallow pits (small depressions).

Therefore, it is more preferable that the top t has a rounded part at the front end.

In addition, the size of the above-mentioned R part (rounded part) is not particularly limited, for example, a size of about R0.5 to R5.0 is preferable.

In addition, the bearing 12a and the pressing element 12b are described as examples of the rotation restraining mechanism of the restraining element 12, but other structures may be adopted as long as the rotation of the support rod 11 can be restrained. For example, an individual elastic element such as sponge or gum is arranged in the receiving recess 12a ₁ of the bearing 12a, so that the support rod 11 can be pressed in. If the support rod 11 is pressed into the individual elastic element, the state of self-rotation is also suppressed. Can. Furthermore, in the above-mentioned embodiment, the pressing elements 12b are formed to face each other, and if the rotation can be suppressed, a structure in which only one pressing element 12b is provided on one side can be used.

In addition, in the above-mentioned embodiment, the restraining element 12 is a U-shaped element that can hold the cross-section of the support rod 11 . If the same effect can be obtained, other structures can also be used.

Moreover, in the above-mentioned embodiment, the main material of the jig 10 for electroplating treatment is formed of resin, but it is not limited to this, and other materials such as metal after electroplating treatment may also be used.

In addition, in the above-mentioned embodiment, the application of the substrate 1 is described by taking a magnetic disk (magnetic recording medium) for hard disks as an example, but it can also be applied to applications other than magnetic disks. In this case, it goes without saying that the plating solution in the plating bath can be changed according to the application.

As described above, the jig for electroplating treatment and the electroplating treatment apparatus of the present invention can be applied to the manufacture of various electroplated substrates, and can be applied to industries in a wide range of fields.

L‧‧‧electroplating solution

1‧‧‧Substrate

10‧‧‧Electroplating fixtures

11‧‧‧Support rod

12‧‧‧Restriction element

12a‧‧‧Bearing

12b‧‧‧Push element

13a‧‧‧First turntable

13b‧‧‧Second Turntable

14‧‧‧Suspension

15‧‧‧Rotating mechanism

15a‧‧‧motor

15b‧‧‧Transmission gear

16‧‧‧Rotary axis

20‧‧‧Plating baths

100‧‧‧Plating treatment equipment

Claims (9)

A jig for electroplating treatment, which is used for immersing a disc-shaped substrate with a center hole in an electroplating solution in an electroplating bath, characterized in that it comprises: a support rod inserted into the center hole of the substrate; a restraint element to The support rod is supported in a detachable manner, and a rotation restraining mechanism is provided to restrain the rotation of the support rod after being supported; the turntable is detachably mounted with the support rod through the restraint element. The jig for electroplating treatment according to claim 1, wherein the rotation restraining mechanism includes a pushing element, which has: a contact element for contacting the support rod; and an elastic element for pushing the contact element against the support rod pressure. According to the jig for electroplating treatment according to claim 2, the restraining element is provided with a U-shaped accommodating recess for accommodating at least a part of the peripheral surface of the support rod, and the contact element is attached to the In the state in which the support rod is accommodated by the accommodating recess, the support rod is contacted and pushed through the elastic element. The jig for electroplating according to claim 2, wherein at least two of the pressing elements are respectively provided, and the mutual contact elements are arranged opposite to each other with respect to the entering and exiting directions. The jig for electroplating according to claim 3, wherein at least two of the pressing elements are respectively provided, and the mutual contact elements are arranged opposite to each other with respect to the entering and exiting directions. The jig for electroplating treatment according to any one of claims 2 to 5, wherein a guide surface is formed on the top of the contact element to facilitate the mounting and dismounting of the support rod. The jig for electroplating treatment according to any one of claims 2 to 5, wherein at least a part of the top of the contact element is subjected to low-friction treatment. The jig for electroplating according to claim 6, wherein at least a part of the top of the contact element is subjected to low friction treatment. An electroplating treatment device, characterized in that it includes any one of items 1 to 8 in the scope of application Said jig for electroplating and a rotating mechanism for rotating the turntable.

Images