JP2007169757A - Tool for plating treatment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tool for plating treatment capable of performing the uniform electroless Ni-P plating treatment by consistently holding a large number of aluminum-made substrates for magnetic disks having the small outside diameter of ≤ 65 mm as objects for treatment. <P>SOLUTION: Four outer circumference holding shafts 3 are mounted between a pair of right and left flanges 2, 2 at an equal interval on the same circumference in a horizontally stretching manner. A holding groove 6 in which an outer circumferential edge of a substrate 10 to be treated is fitted is formed on each shaft 3. Further, one outer circumference holding shaft 3A is movably displaceable to expand a space from the adjacent shaft 3 by the movement, and to form an access port of the substrate 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a plating processing jig, and more particularly to a plating processing jig used for performing an electroless Ni-P plating process on an aluminum substrate for a magnetic disk as an information recording medium.

  In the present invention, the term “aluminum” is used in a sense including the alloy.

  As magnetic disk substrates, there are conventional glass substrates and aluminum substrates. Generally, substrates having a diameter of more than 2.5 inches mainly use aluminum substrates, and have a smaller diameter than that. As the substrate, a glass substrate is mainly used.

  The substrate made of aluminum is subjected to the necessary pretreatment on the substrate punched from the material, and then subjected to electroless plating treatment with a Ni-P plating solution bath to form a Ni-P alloy coating on the surface. As a magnetic substrate, a ferromagnetic metal thin film as a magnetic layer (recording layer) is laminated on the substrate.

Conventionally, the above-described plating treatment of an aluminum substrate is performed by the following method using a plating treatment jig as shown in Patent Documents 1 to 4 below.
JP-A-7-90596 Japanese Patent Laid-Open No. 7-243050 JP-A-11-209877 JP 11-335857 A

  That is, since the aluminum substrate has a donut shape having a circular through-hole at the center, as shown in FIG. 9, a large number of annular grooves for holding the substrate ( A suspension shaft (30) having a not-shown shape is used, and this is passed through the through hole to hold a large number of substrates (10) in parallel. Then, the shaft (30) holding the substrate (10) is mounted horizontally between the peripheral portions of a pair of left and right rotating disks (31a) (31a) of a rotating drum (31) called a carousel, and plated. The said rotating disk (31) is slowly rotated via a gear drive mechanism (33) in the state immersed in the processing tank (32), and Ni-P plating solution is poured while giving rotation to the substrate (30). It is supposed to be contacted without any problems. In FIG. 9, (34) shows a rotation driving motor, and (35) shows a hanger device for the rotating drum (31).

  Plating processing using the above-described plating processing jig (30) is preferably performed when the aluminum substrate (10) to be processed is a relatively large substrate having a diameter of 65 mm or more. Can be adopted.

  However, recently, even for extremely small-diameter magnetic disk substrates such as 1-inch disks and 0.85-inch disks whose outer diameter is less than 65 mm, aluminum is used instead of conventional glass substrates because of cost reduction demands. In the case of such a small-diameter substrate, this is used in the plating jig (30) for the inner suspension method as described above. It was actually difficult to perform the plating process. One reason is that the substrate itself has a small diameter, so the center through-hole is small, and a thin suspension shaft that can be inserted through it can withstand the load of multiple substrates. Therefore, the substrate cannot be stably held due to bending, and because the substrate is lightweight, the substrate floats due to the plating solution flow caused by the rotation of the carousel, and the holding groove of the suspension shaft This is due to a phenomenon that is likely to cause a groove jump.

  In the present invention, in the background of the prior art as described above, a small or ultra-small aluminum substrate having a diameter of less than 65 mm is used as an object to be processed, and this is stably and efficiently plated. An object of the present invention is to provide a jig for plating treatment that makes it possible. It is another object of the present invention to provide a suitable plating processing apparatus and processing method using such a plating processing jig.

  The present invention provides a plating processing jig in which a substrate to be processed is gripped from the outer peripheral side by a plurality of holding shafts, specifically, the following problems. The solution is presented.

[1] A pair of left and right flanges arranged opposite to each other at a distance from each other, and three or more outer peripheral holding shafts arranged horizontally at predetermined intervals on the same circumferential line between these flanges, A support rod projecting outward from at least one of the flanges,
A plurality of holding grooves into which outer peripheral edge portions of the substrate to be processed are fitted are formed in at least a plurality of the outer peripheral holding shafts at predetermined intervals in the axial direction, and the substrate to be processed is divided into three or more of the outer periphery. In the space surrounded by the holding shaft, the outer peripheral edge portion can be held in parallel in the aspect of fitting the holding groove,
At least one outer peripheral holding shaft is configured to be detachable with respect to the both flanges, or to be movable and displaceable in a direction in which the interval between the adjacent outer peripheral holding shafts can be enlarged, and by removing or moving the shaft A plating jig characterized in that a substrate can be attached and detached by forming a loading / unloading port.

  [2] The plating jig according to [1], wherein the number of outer peripheral holding shafts is four.

  [3] One movable outer displacement holding shaft that is slidable in a direction perpendicular to the circumferential direction or the radial direction along arc-shaped or linear elongated holes provided in the left and right flanges The jig for plating treatment as set forth in [1] or [2].

  [4] A single sliding movement mechanism of the outer peripheral holding shaft, which is movable and displaceable, extends both ends of the mounting shaft of the outer peripheral holding shaft to the outside through the long hole of the flange. A fastening sleeve biased in the direction is slidably mounted, and a locking recess having a large diameter is formed at both ends of the long hole on the outer surface side of the flange, and the fastening sleeve is formed in the recess. The plating processing jig according to [3], wherein the shaft can be positioned and fixed to the flange by fitting and locking the ends of the plating.

  [5] Any one of the above [1] to [4], wherein a shaft spacing restricting plate having an engaging portion that engages with each shaft is disposed at an intermediate portion in the length direction of the outer peripheral holding shaft. The jig for plating treatment according to Item 1.

  [6] The claims [1] to [5], wherein the substrate to be processed is held in a state surrounded by a plurality of outer peripheral holding shafts so as to have play in both the radial direction and the axial direction. ] The jig for a plating process of any one of these.

  [7] The plating processing jig according to any one of [1] to [6], wherein the holding groove is provided only in a part of the outer peripheral surface of the outer peripheral holding shaft facing the substrate. .

  [8] The plating jig according to any one of [1] to [7], wherein the holding groove is a groove having a U-shaped cross section.

  [9] The [1] to [1], wherein a notch plane portion is formed on the outer peripheral surface of the left and right flanges at a position opposite to the loading / unloading port, and the flange can be stably placed on the work table surface. 8] The plating jig according to any one of [8].

  [10] The plating jig according to any one of the above [1] to [9] is horizontally mounted between a pair of left and right turntables of a carousel provided in a plating tank and is attached and detached. Plating equipment that can be installed freely.

  [11] A plating method performed using the plating apparatus according to [10].

  [12] The plating method according to [11], wherein the substrate to be processed is an aluminum substrate for a magnetic disk, and the plating process is an electroless plating process using a Ni-P plating solution bath.

  [13] A method for manufacturing an aluminum substrate for a magnetic disk, comprising the plating method according to claim [12] in a manufacturing process.

  [14] An aluminum substrate for a magnetic disk plated by the plating method according to [12].

  [15] The aluminum substrate for a magnetic disk according to claim 14, wherein the outer diameter is 65 mm or less.

  According to the jig for plating treatment described in the invention [1], it can be efficiently and stably plated even on a small-diameter aluminum substrate which could not be processed by a conventional plating jig. It becomes possible to process. Further, the conventional processing apparatus is modified by making the support rod protruding from at least one of the left and right flanges compatible with the carousel of the plating processing apparatus using the conventional plating processing jig. It can be used as it is without being subjected to the required electroless Ni—P plating treatment, and can enjoy the economic advantage of the facility.

  In addition, according to the jig for plating processing according to the invention of [2], since the outer periphery of the small-diameter substrate to be processed is held by the four outer peripheral holding shafts, the substrate to be processed can be stably held. The spacing between the adjacent outer peripheral holding shafts can be sufficiently widened, and as a result, the flow of the plating solution into the arrangement space region of the substrate to be processed can be prevented from being obstructed by the shaft. A good plating process can be performed on the substrate to be processed.

  In addition, according to the plating processing jig according to the invention [3], the substrate to be processed can be taken in and out of the jig with good workability.

  Moreover, according to the jig for a plating process which concerns on the invention of said [4], said attachment / detachment workability | operativity can be improved further.

  Also, according to the plating processing jig according to the invention of [5], the outer periphery holding shaft is set to have a long length so that a large number of substrates to be processed can be set and held at a time. Even in this case, it is possible to prevent the interval between the outer peripheral holding shafts from becoming uneven, and as a result, all of the substrates to be processed can be stably held.

  Further, according to the jig for plating processing according to the invention of [6], the substrate to be processed is held in a state having play in the space surrounded by the outer periphery holding shaft, so that the outer peripheral edge of the substrate is Occurrence of plating unevenness due to the fixed position always contacting the shaft is avoided, and a uniform plating film can be generated over the entire periphery.

  Further, according to the plating processing jig of the above [7], the volume of the groove occupying the whole can be greatly reduced as compared with the case where the annular holding groove is formed on the entire circumference of the outer peripheral holding shaft. . As a result, the water retention (liquid) amount of the processing liquid collected in the groove can be reduced, and the amount of the processing liquid brought into the plating tank and the amount of the plating liquid brought into the processing tank in the subsequent process can be reduced. , Makes it easy to manage the concentration of the treatment liquid.

  In addition, according to the plating processing jig according to the invention of [8], nodules that are likely to occur at the outer peripheral edge portion of the substrate to be processed are compared to those in which the holding groove is formed in a V-shaped or U-shaped cross section. It is possible to effectively suppress the occurrence of plating defects due to small protrusions of the Ni—P alloy.

  In addition, according to the invention [9], the plating processing jig can be stably placed on the work surface with the loading / unloading port of the processing substrate facing upward, so that the processing substrate can be placed on the jig. It is easy to carry out and take out work, and the workability can be improved.

  Moreover, according to the plating apparatus which concerns on the said [10] invention, the effect equivalent to the invention of said [1]-[9] item can be enjoyed.

  Similarly, the plating treatment method according to the invention [11] can also achieve the same effects as those of the inventions [1] to [9].

  Further, according to the plating method of the invention of [12], an aluminum substrate for a magnetic disk in which a uniform electroless Ni-P layer is formed on the entire surface of a small-diameter aluminum substrate can be efficiently obtained. Obtainable.

  In addition, according to the invention [13], it is possible to manufacture a magnetic disk aluminum substrate having excellent quality.

  Furthermore, the aluminum substrate for magnetic disks according to [14] can be a high-quality one having a uniform Ni-P plating film.

  According to the invention [15], a small-diameter aluminum substrate having a diameter of 65 mm or less can be made high-quality.

  Next, preferred embodiments of the present invention will be described with reference to the illustrated examples.

  FIG. 1 shows an entire plating processing jig (1) according to the present invention.

  This jig (1) has a pair of disc-shaped flanges (2) and (2) on the left and right sides that are arranged to be opposed to each other and between the flanges (2) and (2). Coaxially outward from the centers of the four outer periphery holding shafts (3) and the two flanges (2) and (2), which are horizontally connected at predetermined intervals on the same circumferential line near the portion. And a pair of left and right support rods (4) and (4).

  The left and right flanges (2) and (2) are made of hard synthetic resin, and a plurality of connecting shafts (5) and (5) whose outer peripheral edge is made of a non-rusting metal such as stainless steel. They are integrally connected to each other.

  The outer periphery holding shaft (3) is also made of a hard synthetic resin, and is made of, for example, a round bar having a diameter of 12 mm. A number of annular holding grooves (6) are formed on the outer peripheral surface at predetermined intervals in the axial direction.

  The holding groove (6) is for fitting the outer peripheral edge of the substrate (10) to be processed, and is provided in alignment at the same position in each outer peripheral holding shaft (3) as shown in FIG. Yes. The groove shape is U-shaped in cross section and has a sufficiently wide groove width exceeding three times the thickness of the substrate to be processed (10).

  Therefore, the small-diameter aluminum magnetic disk substrate (10), which is the object to be processed, has the outer peripheral edge portion in the inner space (7) surrounded by the four outer peripheral holding shafts (3). In the state of being fitted in the holding groove (6), a large number are held in parallel as shown by the region in FIG. A magnetic disk substrate made of aluminum having a diameter of 65 mm or less is suitable for use with the jig.

  In this holding state, the substrate to be processed (10) is not held in a fixed restrained state by the outer peripheral holding shaft (3), but is held in a loose state having some play in the axial direction and the radial direction. It is supposed to be done. That is, the diameter of the circle connecting the contact points of the holding grooves (6) of the four outer peripheral holding shafts (3) with the substrate on the groove bottom surface is set slightly larger than the diameter of the substrate (10). (10) is held in a state having some play in the radial direction. The diameter difference is set to about 1 mm to 2 mm, for example. Further, the substrate (10) is slightly loose in the axial direction of the shaft within the holding groove (6) because the groove width of the holding groove (6) is relatively sufficiently large as described above. It is supposed to be held in a possible state.

  The holding of the substrate to be processed (10) in a state having such play is that the contact position of the outer peripheral edge of the substrate (10) that contacts the shaft (3) during the plating process is always constant. This is to avoid the occurrence of a situation in which contact with the plating solution is inhibited in the portion and uniform plating is not performed on the entire surface.

  When all of the four outer peripheral holding shafts (3) are fixed to the flanges (2) and (2) in a stationary state, the space (7) is treated. The substrate (10) cannot be taken in and out, that is, cannot be attached or detached. For this reason, one (3A) of the four shafts (3) can be moved and displaced in a direction in which the interval between the other adjacent shafts can be enlarged. Has been made. This single shaft (3A) that can be moved and displaced has a straight elongated hole (8) in which the mounting shafts at both ends are formed in the left and right flanges (2) and (2) in a direction perpendicular to the radial direction. And is slidable within the length range of the long hole (8). The mounting shaft can be fixed with a fixing screw (9) from the outer surface side of the flange (2) at the substrate holding position on one end side of the long hole (8).

  Therefore, when the substrate (10) is put in and out of the jig (1), the fixing screw (9) is loosened from the steady substrate holding position shown in FIG. In addition, the shaft (3A) is moved to the retracted position on the other end side of the long hole (8), thereby forming a large opening / closing port (11) with the other adjacent shaft (3). The substrate (10) can be taken in and out of the space (7).

  The four outer peripheral holding shafts (3) can accommodate and hold a large number of substrates to be processed (10) of about 50 to 80 in the space portion (7), and therefore have a length exceeding 300 mm in total length. It is supposed to have On the other hand, the outer peripheral holding shaft (3) is constituted by a relatively thin one having a diameter of about 12 mm as described above. For this reason, in the state which accommodated and hold | maintained many board | substrates (10), there exists a possibility that the said outer periphery holding shaft (3) may bend by the weight. If this occurs, the holding force of the substrate (10) becomes partially unstable, and a part of the substrate (10) may come off the shaft (3) and fall off.

  In order to cope with such a problem, in the plating jig (1) according to the present invention, one or a plurality of shaft spacing regulating members are provided in the middle portion in the length direction of the outer peripheral holding shaft (3). The restraint plate (12) is arranged.

  The constraining plate (12) in the illustrated embodiment is a hard synthetic resin disc-like member, and only one is attached to the central portion in the length direction of the outer peripheral holding shaft (3). As shown in FIG. 4, the constraining plate (12) has four notch circles at equal intervals in the circumferential direction corresponding to the arrangement of the outer peripheral holding shaft (3) on the outer peripheral edge, that is, the inlet side is narrow and the inner part is narrow. It has a wide notch engaging portion (13) of Ω, and the center portion of the shaft (3) is tightly fitted to each of them, and the mutual position of each shaft (3) is constrained so that the mutual distance is reduced. It can be kept constant. However, the notch engaging portion (13) corresponding to one movable outer peripheral holding shaft (3A) has a horizontal notch as shown in FIG. 4 so as not to hinder the lateral movement of the shaft (3A). (13a).

  Further, the pair of left and right flanges (2) and (2) are formed with a linear notch plane part (14) as shown in FIG. 1 and FIG. . The notched flat portion (14) is provided at a position opposite to the loading / unloading port (11) formed by moving the movable single outer peripheral holding shaft (3A). Therefore, when the jig (1) is placed on the work table surface (T) with the notch plane portion (14) facing downward as shown in FIG. It prevents movement and always holds the loading / unloading port (11) stably in an upward state so that the substrate (10) to be processed can be easily assembled and removed.

  Furthermore, as shown in FIG. 1, the support rods (4) and (4) projecting from the left and right flanges (2) and (2) have attachment portions (16) at their respective ends as shown in FIG. The plating processing jig (1) is mounted on the rotary disk by holding the carousel (31) and the C-shaped bearing member (31b) for mounting the jig on the rotating disk (31a) (31a) in a fitted state. (31a) It can be detachably mounted horizontally between (31a).

  When the electroless Ni-P plating process is applied to the small-diameter magnetic disk substrate (10) using the plating jig (1) having the above-described configuration, a large number of approximately 50 to 75 sheets is generally used. After the substrate (10) to be processed is accommodated and arranged in parallel with the jig (1) as described above, the plating processing jig (1) is used as a pair of large-size plating processing apparatuses as shown in FIG. A large number of horizontal plates are mounted between the rotating disks (31a) and (31a).

  And as shown in FIG. 9, it rotates slowly by the rotational drive mechanism (33) in the state which immersed the whole carousel (31) in the plating solution in a plating processing tank (32). As a result, the substrate to be treated (10) repetitively moves slightly between the four outer peripheral holding shafts (3) while revolving around the rotation center of the turntable (31a) in the plating solution bath, and the entire surface of both surfaces The plating solution is uniformly contacted with the desired Ni-P plating film.

  As mentioned above, although one preferred embodiment of this invention was described, this invention is not limited to this, A various change is accept | permitted in the range which does not deviate from the summary of invention.

  First, regarding the number of outer peripheral holding shafts (3), this is not limited to four. In short, it is sufficient that the substrate (10) is gripped from the outer peripheral side and can be held. Installation is also possible. However, in order to stably hold the substrate (10), four installations are necessary and sufficient, and are most preferable. This is because if it is set to 5 or more, in addition to the disadvantage caused by the increase in the manufacturing cost of the jig, there is a possibility that the smooth inflow of the plating solution into the substrate holding space portion may be hindered.

  Further, the holding groove (6) formed in the outer peripheral holding shaft (3) does not necessarily need to be provided in all holding shafts. However, in order to stably hold the substrate (10), at least the plurality of outer peripheral holding shafts (3) should have holding grooves (6).

  Further, the holding groove (6) does not necessarily need to have an annular shape over the entire circumference of the shaft (3). Since the outer peripheral holding shaft (3) holds the substrate (10) with a part of the inner peripheral surface facing the holding space (7), as shown in FIG. The holding groove (6a) may be formed only in this part, that is, only in a part of the outer peripheral surface facing the substrate direction. In this case, the amount of water retained (liquid) by the holding groove (6a) can be reduced by the amount by which the total volume of the holding groove (6a) is reduced, and the amount of processing liquid taken out and brought from the processing tank can be reduced. Benefits can be expected.

  Depending on the type of existing plating apparatus, there is only one carousel (31) rotating plate (31a), and the plating jig (1) cantilevered in a cantilever manner. is there. In the case of a plating processing jig applied to such a plating processing apparatus, the support rod (4) may be provided only on one flange (2) side.

  Furthermore, the movable outer peripheral holding shaft (3A) for forming the inlet / outlet (11) for the substrate (10) is temporarily removable from the flange (2), and is removed. It is good also as what can open the said entrance / exit (11) by this.

  The long hole (8) for sliding the movable outer peripheral holding shaft may be formed in an arc shape that is long in the circumferential direction of the flange (2).

  Furthermore, a slide moving mechanism (18) as shown in FIGS. 7 and 8 may be adopted so that the slide moving operation can be performed more easily. In this mechanism (18), both ends of the mounting shaft of the outer peripheral holding shaft (3) are extended outwardly through the long hole (8) of the flange (2), and a spring (19) is attached to the extended shaft portion (3a). The fastening sleeve (20) constantly urged in the direction of the flange (2) is slidably mounted on the both ends of the long hole (8), and the outer diameter side of the flange (2) is engaged with the large diameter. The shaft (3) is positioned and fixed to the flange (2) by forming a concave portion (8a) for use and fitting and locking the end of the fastening collar member (20) to the concave portion (8a). It was made to be able to. In the case of this slide movement mechanism (18), when the substrate (10) is attached / detached, the fastening sleeve (20) is slid outwardly against the spring (19), so that the locking recess (8a) By releasing the engagement, the outer peripheral holding shaft (3) can be moved along the long hole (8). Therefore, the operation of moving between the substrate holding position of the shaft (3) and the retracted position for creating the loading / unloading port (11) can be performed more easily, and the workability is good.

It is a perspective view showing the whole shape of the jig for plating processing concerning the present invention. It is a partially broken front view which shows the board | substrate holding | maintenance space part enclosed by an outer periphery holding shaft. FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 1, where FIG. (A) shows a state where a movable outer periphery holding shaft is installed at a substrate holding position, and FIG. The state when moving to is shown respectively. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 1. It is a perspective view which shows the state which mounted | wore the carousel with the jig for plating processing which concerns on this invention. It is sectional drawing of the part corresponding to FIG. 3 which shows the modification of the holding groove of an outer periphery holding shaft. It is a principal part perspective view which shows the modification of the slide movement mechanism of a movable outer periphery holding shaft. It is sectional drawing of the VIII-VIII line of FIG. It is explanatory drawing of the metal-plating processing apparatus equipped with the conventional jig for metal-plating processing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 .... Jig for plating processing 2 .... Flange 3 .... Peripheral holding shaft 3A ... Movable outer peripheral holding shaft 4 .... Support rod 6 .... Holding groove 7. ··· Space for holding substrate 8 ··· Long hole 10 ··· Substrate to be processed 11 ··· In / out port 12 · · · Restricting plate 13 · · · Engaging portion 14 · · · Flat surface 16 ... Mounting part 18 at the tip 18 ... Slide movement mechanism 19 ... Spring 20 ... Fitting sleeve 30 ... Conventional plating jig 31 ... Carousel (rotary drum)
31a ... rotating plate 32 ... plating tank 33 ... rotation drive mechanism

Claims (15)

A pair of left and right flanges that are spaced apart from each other, three or more outer peripheral holding shafts that are horizontally disposed at predetermined intervals on the same circumferential line, and at least one of the flanges. A support rod projecting outward from the flange,
A plurality of holding grooves into which outer peripheral edge portions of the substrate to be processed are fitted are formed in at least a plurality of the outer peripheral holding shafts at predetermined intervals in the axial direction, and the substrate to be processed is divided into three or more of the outer periphery. In the space surrounded by the holding shaft, the outer peripheral edge portion can be held in parallel in the aspect of fitting the holding groove,
At least one outer peripheral holding shaft is configured to be detachable with respect to the both flanges, or to be movable and displaceable in a direction in which the interval between the adjacent outer peripheral holding shafts can be enlarged, and by removing or moving the shaft A plating jig characterized in that a substrate can be attached and detached by forming a loading / unloading port.   The jig for plating treatment according to claim 1, wherein the number of outer peripheral holding shafts is four.   The one outer periphery holding shaft that is movable and displaceable is slidable in a direction perpendicular to the circumferential direction or the radial direction along arcuate or straight elongated holes provided in the left and right flanges. The jig for plating treatment according to claim 1 or 2.   One sliding movement mechanism of the outer peripheral holding shaft that can be moved and displaced extends both ends of the mounting shaft of the outer peripheral holding shaft outwardly through the long hole of the flange, and this extended shaft portion is always attached in the flange direction. While the slidable mounting sleeve is slidably mounted, a locking recess having a large diameter is formed at both ends of the long hole on the outer surface side of the flange, and the end of the locking sleeve is formed in the recess. The jig for plating processing according to claim 3, wherein the shaft can be positioned and fixed to the flange by fitting and locking.   The plating according to any one of claims 1 to 4, wherein a constraining plate for regulating a shaft interval having an engaging portion that engages with each shaft is disposed at an intermediate portion in the length direction of the outer peripheral holding shaft. Processing jig.   In any one of Claims 1-5 by which the to-be-processed board | substrate is hold | maintained in the state which has a play in a radial direction and an axial direction in the space part enclosed by several outer periphery holding shafts. The jig for plating treatment as described.   The plating processing jig according to any one of claims 1 to 6, wherein the holding groove is provided only on a part of the outer peripheral surface of the outer peripheral holding shaft facing the substrate.   The jig for plating processing according to any one of claims 1 to 7, wherein the holding groove is a groove having a U-shaped cross section.   The cutout plane part is formed in the outer peripheral surface of the said right-and-left flange on the opposite side to the said entrance / exit, and this flange can be stably mounted on a work-table surface. The plating treatment jig according to Item.   The plating jig according to any one of claims 1 to 9 is mounted horizontally and detachably between a pair of left and right turntables of a carousel provided in a plating tank. Plating equipment.   The plating processing method performed using the plating processing apparatus of Claim 10.   The plating method according to claim 11, wherein the substrate to be processed is an aluminum substrate for a magnetic disk, and the plating process is an electroless plating process using a Ni—P plating solution bath.   The manufacturing method of the aluminum substrate for magnetic discs which contains the plating processing method of Claim 12 in a manufacturing process.   An aluminum substrate for a magnetic disk plated by the plating method according to claim 12.   The aluminum substrate for magnetic disks according to claim 14, wherein the outer diameter is 65 mm or less.

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