JP5672224B2 - Grooved roller and wire saw using the same - Google Patents

Description

  The present invention relates to a grooved roller and a wire saw using the roller, and more particularly to a grooved roller in which a plurality of wire tension grooves are formed on the outer peripheral surface at a predetermined pitch, and a wire saw using the roller.

  A semiconductor wafer used as a material for manufacturing a semiconductor device or a light emitting diode is manufactured by slicing a semiconductor single crystal into a wafer.

  Conventionally, a cutting method using a multi-wire saw has been known and widely used as a method for slicing a semiconductor single crystal into a wafer (for example, see Patent Document 1).

  A multi-wire saw is a method of slicing a material to be cut such as a semiconductor single crystal by reciprocating a large number of tensioned wires, and grooves for fixing the wire position are engraved at fixed intervals arranged in parallel. In addition, a number of looped wires are stretched between two driving rollers (grooved rollers), and by rotating the rollers, the wire is reciprocated while pressing the material to be cut. The material to be cut is processed by friction of the material to be cut.

  In the past, there were many free abrasive grain processing methods in which a liquid in which abrasive grains were suspended between a wire and a material to be cut was continuously supplied. However, in recent years, sapphire and In order to process a high-hardness material such as SiC, there is an increasing number of fixed abrasive methods that use a wire in which diamond abrasive grains are fixed to the wire.

  As a grooved roller, a grooved roller is known in which a U-shaped groove is formed on the surface of a cylindrical grooved roller with a wire that is 20% thicker than the diameter of the wire used for wafer processing ( For example, see Patent Document 2).

  In the grooved roller described in Patent Document 2, by using a U-shaped groove shape, the groove interval in the axial direction of the grooved roller is narrow, the wire is difficult to come off from the groove during wafer processing, and a thin wire is used. It has the effect of being able to do.

JP 2003-320521 A JP 2008-126341 A

  However, even when the grooved roller described in Patent Document 2 is used, if a hard material such as sapphire or SiC is cut by a fixed abrasive method, the adhesion between the wire and the diamond fixed to the wire However, there is a problem in that the frictional force with the high-hardness material is increased, the wire blurring is large, and a rough surface shape by cutting, called a saw mark, remains on the cut wafer.

  Accordingly, the present invention provides a grooved roller capable of reducing the generation of saw marks and preventing the wire from coming out of the groove while cutting a high-hardness material using a fixed abrasive wire saw. And it aims at providing the wire saw using this.

In order to achieve the above object, one aspect of the grooved roller according to the present invention is:
A grooved roller for a fixed abrasive type wire saw in which a plurality of fixed abrasive type wire extending grooves are formed at a predetermined pitch on an outer peripheral surface,
The cross-sectional shape of the groove is a V-shaped bottom portion, an equal width portion formed from the upper end of the bottom portion toward the outer peripheral surface, the equal width portion not reaching the outer peripheral surface, and the outer peripheral surface from the upper end of the equal width portion. shape der having a inlet section to reach the outer peripheral surface with a groove width increases towards is,
The groove width of said equal width portion is characterized 1.1-1.5 Baidea Rukoto wire diameter.

  Moreover, it is preferable that the groove angle of the said introduction part is 60-90 degrees.

  The groove angle at the bottom is preferably 45 to 90 °.

  Moreover, it is preferable that the depth to the upper end of the said bottom part of the said groove | channel is 3 to 5 times the wire diameter.

  Moreover, it is preferable that the part in which the said groove | channel was formed consists of urethane resins.

Further, wire saw according to another aspect of the invention, said grooved rollers,
A fixed abrasive type wire provided with fixed abrasive grains fixed to the surface;
A wire moving mechanism for moving the fixed abrasive grain type wire by winding the fixed abrasive grain type wire grooved rollers,
And a holding mechanism for fixing and holding the workpiece.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that the blur of the wire at the time of a cutting | disconnection and a wire remove | deviate from a groove | channel, and can ensure the pitch accuracy of a wire.

It is a figure which shows schematic structure of the multi-wire saw which concerns on Example 1 of this invention. 3 is an enlarged view of a grooved roller portion of the multi-wire saw according to Embodiment 1. FIG. FIG. 3 is a diagram illustrating an example of a grooved roller according to the first embodiment. It is a B section cross-sectional enlarged view of the grooved roller 10 shown in FIG. It is the figure which showed an example of the dimension ratio of the groove | channel of the roller with a groove | channel which concerns on Example 1. FIG. It is the figure which showed the cross-sectional structure of an example of the grooved roller which concerns on Example 2 of this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram illustrating a schematic configuration of a multi-wire saw according to Embodiment 1 of the present invention. In FIG. 1, the multi-wire saw 100 according to the first embodiment includes a grooved roller 10, a wire 40, a reel 50, a guide roller 60, a cutting block 70, a dummy material 80, and a supply nozzle 90. Have. Moreover, in FIG. 1, the to-be-processed object 110 is shown as a related component.

  In FIG. 1, a workpiece 110 is attached to a cutting block 70 for fixing the workpiece 110 to the main body of the multi-wire saw 100 via a dummy material 80. A supply nozzle 90 for supplying a cutting liquid to the wire 40 when the workpiece 110 is cut is provided obliquely below the workpiece 110. Below the supply nozzle 90, two grooved rollers 10 for mounting the processing wire 40 are provided in parallel, and the wire 40 is unwound from the reel 50 on one side when the workpiece 110 is cut. As a result, a new wire 40 is supplied. The wire 40 that has finished processing the workpiece 110 is wound around the reel 50 on the opposite side.

  The grooved roller 10 accommodates a processing wire 40 in a wire-stretching groove formed on the outer peripheral surface, arranges the wires 40 at a predetermined pitch, and moves the wire 40 in that state, thereby processing the workpiece. A cylindrical member for cutting 110. Although not shown in FIG. 1, a groove is formed on a cylindrical curved surface (circumferential surface), and the wire 40 can be accommodated in the groove. Then, in a state where the wire 40 is pressed against the workpiece 110, the grooved roller 10 is sequentially rotated clockwise and counterclockwise, so that the wire 40 is alternately moved left and right, and is reciprocated similarly to a saw. The workpiece 110 is cut by movement. The configuration of the groove will be described later.

  The wire 40 is a processing means for cutting the workpiece 110. As described above, the wire 40 is mounted and positioned on the grooved roller 10 and is pressed against the workpiece 110 in the lateral direction ( The workpiece 110 is cut by changing the direction in the horizontal direction and moving alternately.

  The reel 50 is a member for collecting the wire 40 by winding the wire 40 from one reel 50 and feeding the wire 40 with the other reel 50.

  The guide roller 60 is a member for guiding the direction of the wire 40 supplied from the reel 50 on the wire supply side and the direction of the wire 40 wound and collected on the reel 50 on the wire recovery side. That is, the supply-side wire 40 is guided to the grooved roller 10, and the wire 40 sent from the grooved roller 10 is guided to the collection-side reel 50.

  In addition, the grooved roller 10 and the reel 50 may include a rotation drive mechanism such as a motor, and may constitute a wire moving mechanism as a whole.

  The cutting block 70 is a fixed support member for fixing and supporting the workpiece 110 in order to cut the workpiece 110.

  The dummy material 80 is a member that is provided between the cutting block 70 and the workpiece 110 and is cut together with the workpiece 110 when the workpiece 110 is cut.

  The supply nozzle 90 is a means for supplying a cutting liquid to the wire 40 when the workpiece 110 is cut, and a coolant for cooling the wire 40 is supplied in the case of cutting with a fixed abrasive method. Is done. On the other hand, in the case of the free abrasive grain method, a slurry containing abrasive grains is supplied.

  The workpiece 110 may be a high-hardness material such as sapphire or SiC in addition to a semiconductor single crystal. Since the wire saw according to the first embodiment can sufficiently cope with the fixed abrasive method used for processing a high-hardness material, the high-hardness material that is difficult to cut can be used as the workpiece 110.

  FIG. 2 is an enlarged view of the grooved roller 10 portion of the multi-wire saw 100 according to the first embodiment. The grooved roller 10 has a cylindrical shape, the center portion is made of a cored bar made of stainless steel such as SUS304, and the outer periphery of the cored bar is made of various steel materials (SUS304, 316), ceramic material, urethane resin, and the like. A roller base is fitted, and a plurality of grooves 20 for mounting the wire 40 is provided on the surface of the roller base.

  When the groove 20 formed on the surface of the roller base is worn or damaged with the core metal and the roller base as separate parts, the running cost of the grooved roller 10 can be reduced by replacing only the roller base. become.

  The material of the roller base is not particularly limited as long as it is the above material, but when using the fixed abrasive method, a roller base made of urethane resin is suitable for preventing the wire to which the diamond is fixed from being worn out. ing. Therefore, in the case of the fixed abrasive method, a roller base made of urethane resin may be used and the groove 20 may be formed on the surface thereof.

  FIG. 3 is a diagram illustrating an example of the grooved roller 10 according to the first embodiment. As shown in FIG. 3, the grooved roller 10 according to the first embodiment has a configuration in which the groove 20 is formed on the outer peripheral surface having a cylindrical curved surface. A plurality of grooves 20 are formed along the outer peripheral surface with a predetermined pitch and perpendicular to the cylindrical axis.

  4 is an enlarged cross-sectional view of a portion B of the grooved roller 10 shown in FIG. The cross section shows a cross section cut in the radial direction parallel to the axis of the grooved roller 10. In FIG. 4, the cross-sectional structure of the outer peripheral surface of the grooved roller 10 is shown, and the detailed cross-sectional structure of the groove | channel 20 which guides the wire 40 is represented.

  The cross-sectional shape of the groove 20 is a shape having a bottom portion 21, a uniform width portion 22, and an introduction portion 23. The bottom portion 21 forms the bottom surface of the groove 20 and has a V-shaped cross-sectional shape. That is, the deeper the groove 20 is, the narrower the groove width is, and it is formed in a V-shape with a sharp point. The inclined surface of the bottom 21 is not a curved cross section but a straight cross section. That is, it has a V-shape instead of a U-shape. By having such a V-shaped slope, when a pulling force is applied to the wire 40, the wire 40 moves toward the deepest part of the bottom along the inclined surface, so that the wire 40 is positioned with high accuracy. be able to.

  The equal-width portion 22 has a cross-sectional shape that extends continuously toward the outer peripheral surface side, has an equal-width groove width continuously from the upper end of the V-shaped bottom portion 21. The equal width portion 22 extends toward the outer peripheral surface of the grooved roller 10, but does not reach the outer peripheral surface and is provided as an intermediate portion of the groove 20. The equal width portion 22 functions like a wall for the wire 40 and functions to prevent the wire 40 from protruding from the groove 20. Moreover, it prevents that the wire 40 moves to a horizontal direction (groove width direction), and suppresses the blurring at the time of the cutting | disconnection of the wire 40. FIG. The movement of the wire 40 in the vertical direction (depth direction) and the horizontal direction (width direction) is restricted by the equal width portion 22, and the wire 40 protrudes from the inside of the groove 20 or shakes or vibrates in the horizontal direction inside the groove 20. Cannot be moved. Thereby, the positioning of the wire 40 is performed with high accuracy.

  The introduction portion 23 is a groove portion that connects the upper end of the equal width portion 22 and the outer peripheral surface of the grooved roller 10, and the groove width increases linearly from the upper end of the equal width portion 22 toward the outer peripheral surface. It has a trumpet shape and a tulip shape. The introduction part 23 is provided so that the wire 40 can easily enter the groove 20. That is, if the equal width portion 22 has a groove shape that reaches the outer peripheral surface of the grooved roller 10 with the same width as it is, it may be difficult to put the wire 40 into the groove 20. In order to facilitate the housing, the groove has a cross-sectional shape in which the groove width increases toward the outside where the opening area of the outer peripheral surface is increased.

  Thus, in the grooved roller 10 according to the first embodiment, by forming the groove 20 having three portions having different groove widths on the outer peripheral surface, the positioning of the wire 40 is accurately performed, and the wire 40 is It has the structure which can suppress that it remove | deviates from the groove | channel 20 or shakes in the groove | channel 20, and can mount | wear the groove | channel 20 with the wire 40 easily.

  In addition, when the cross-sectional shape of the groove 20 is expressed from the outer peripheral surface side, the groove 20 has a cross-sectional shape that is continuous from the outer peripheral surface of the grooved roller 10 toward the center portion, and is continuous with the introducing portion. And a bottom portion that is continuous with the equal width portion and narrows toward the center portion.

  The groove angle θ1 of the introducing portion 23 is desirably 60 degrees to 90 degrees. When the groove angle of the introduction portion 23 is 60 degrees or less, the opening width of the grooved roller surface becomes narrow, and when the wire 40 is wound around the grooved roller 10, May not fit. On the other hand, when the groove angle θ1 of the introduction portion 23 is 90 degrees or more, the wire 40 that has entered the introduction portion 23 of the groove 20 is poorly slipped, the wire 40 stops at the introduction portion 23, and the wire 40 is inserted into the groove 20. May be difficult to fit.

  The equal width portion 22 is equal in width until the cross-sectional shape is connected from the introduction portion 23 to the bottom portion 21, the groove width is 1.1 to 1.5 times the wire diameter, and the groove depth t is the wire diameter. It is preferably 3 to 5 times. Here, the groove depth t indicates the depth of the lower end of the equal width portion 22, in other words, the depth of the upper end of the bottom portion 21. That is, the distance from the lower end portion of the equal width portion 22 or the upper end portion of the bottom portion 21 to the outer peripheral surface of the roller 10 is the groove depth t. Further, the groove width of the equal width portion 22 is preferably 1.1 to 1.5 times the wire diameter. When the groove width of the equal width portion 22 is smaller than 1.1 times the wire diameter, the wire There is a possibility that the wire 40 is caught in the equal width portion 22 and hardly fits in the bottom portion 23. If the wire width is larger than 1.5 times, the wire 40 swings within the groove width when the workpiece 110 is cut, and the wire 40 This is because the flat state may be adversely affected. In addition, when the groove depth t is smaller than 3 times the wire diameter, the wire 40 is easily detached from the groove 20, and even if the groove depth t is larger than 5 times, the effect that the wire 40 is not easily detached does not change and the groove processing becomes difficult. There is no merit. Therefore, the groove depth t is preferably 3 to 5 times the wire diameter.

  The groove angle θ2 at the bottom is preferably 45 ° to 90 °. If the groove angle θ2 is out of the range of 45 ° to 90 °, the wire 40 may not be properly accommodated, and the wire 40 may be greatly shaken when the workpiece 110 is cut, so that the processing accuracy of the workpiece 110 is increased. This is because it may adversely affect

  In the multi-wire saw 100 according to the first embodiment, the grooved roller 10 according to the first embodiment is used to wind the fixed abrasive wire 40 around the guide groove 20 and move in one direction or reciprocate. The cutting fluid is discharged from a supply hole provided in the supply nozzle 40. The workpiece 110 mounted on the fine adjustment table is pressed against the group of wires 40 consisting of several hundreds wound around the grooved roller 10, whereby the workpiece 110 can be cut.

  FIG. 5 is a diagram illustrating an example of a dimensional ratio of the groove 20 of the grooved roller 10 according to the first embodiment. A fixed abrasive flow 41 typically made of diamond or the like is fixedly provided on the surface of the wire 40. As shown in FIG. 5, for example, when the pitch width P is 0.95, the groove width is 0.30, the depth of the deepest portion of the groove 20 is 0.50, and the depth of only the equal width portion 22 ( The length in the depth direction) may be 0.30, the groove angle of the bottom 21 may be 90 °, the groove angle of the introduction portion may be 60 °, and the opening width of the introduction portion 21 may be 0.54. In FIG. 5, although the depth of the lower end of the equal width part 22 of the groove | channel 20 is not specifically shown, the above-mentioned relationship may be satisfy | filled with a relationship with a wire diameter. Moreover, even if it does not satisfy | fill the above-mentioned relationship, it becomes the cross-sectional shape which has the bottom part 21, the equal width part 22, and the introducing | transducing part 23, and has become the structure which can prevent the blurring and detachment | leave of the wire 40. FIG. In addition, FIG. 5 is a figure which showed only an example of the size ratio of each part of the groove | channel 20, and a groove | channel angle, and it cannot be overemphasized that these values may be set variously according to a use.

  FIG. 6 is a diagram illustrating a cross-sectional configuration of an example of the grooved roller 11 according to the second embodiment of the present invention. In addition, the cross section has shown the cross section cut | disconnected in the radial direction parallel to the axis | shaft of the roller 11 with a groove | channel similarly to Example 1. FIG. Although the grooved roller 11 according to the second embodiment includes the groove 30 on the outer peripheral surface, the cross-sectional shape of the groove 30 is only the bottom portion 31 and the equal width portion 32 and the introduction portion is not included. 1 is different from the grooved roller 10 according to FIG. A wire 40 is installed inside the groove 30, and a fixed abrasive flow 41 made of diamond or the like is schematically shown on the surface of the wire 40.

  As shown in FIG. 6, a bottom 31 having a V shape without providing an introduction portion, and a constant width portion 32 extending from the upper end of the bottom 31 toward the outer peripheral surface of the grooved roller 11 and reaching the outer peripheral surface as it is. A groove 30 having a cross-sectional shape having the shape may be formed on the outer peripheral surface of the grooved roller 11.

  In FIG. 6, the size ratio and groove angle of each part of the exemplary groove 30 are shown, but for example, a configuration with a dimensional ratio as shown in FIG. 6 may be used. That is, the pitch P between the deepest portions of the bottom portions 31 of the grooves 30 is 0.95 mm, the depth of the deepest portion of the grooves 30 is 1.0 mm, and the interval between the openings of the grooves 30 is 0.26 mm. Moreover, the groove depth t to the lower end of the equal width part 32 or the upper end of the bottom part 31 shall be 0.68 mm, and the groove angle of the bottom part 31 shall be 90 degrees.

  Even in such a configuration, since the cross-sectional shape of the bottom portion 31 is configured in a V shape, when a force is applied to the wire 40, the wire 40 is positioned toward the deepest portion of the bottom portion 31 to perform accurate positioning. be able to. Further, if the groove depth t to the upper end of the bottom portion 31 is 3 to 5 times the wire diameter and the groove width of the equal width portion 32 is 1.1 to 1.5 times the wire diameter, the equal width portion 32 is obtained. Functions as a wall, and in the same manner as in Example 1, it is possible to prevent the wire from coming off and to suppress wire blurring.

  Note that the grooved roller 11 according to the second embodiment is predicted to be more difficult to mount the wire 40 than the grooved roller 10 according to the first embodiment because the groove 30 does not have an introduction portion. By setting the groove width of the equal width portion 32 to about 1.5 times the upper limit wire diameter, the wire 40 can be easily mounted.

  Thus, even in the grooved roller 11 having the groove 30 constituted only by the V-shaped cross-sectional bottom 31 and the equal-width cross-sectional equal width part 32, the size and shape of each part of the groove 30 are appropriately set. With this configuration, it is possible to suppress the disconnection of the wire, perform positioning with high accuracy, and to attach the wire 40 to the groove 30 without difficulty.

  Moreover, the roller 11 with a groove | channel which concerns on Example 2 is applicable as it is to the multi-wire saw 100 shown in FIG.

  As described above, according to the grooved roller 11 according to the second embodiment and the wire saw using the grooved roller 11, the configuration of the simple groove 30 is adopted, the wire detachment is reduced, and the positioning of the wire 40 is performed with high accuracy. be able to. In addition, by appropriately setting the groove width, the wire 40 can be easily wound around the groove 30 as in the first embodiment.

  Thus, according to the wire with a groove | channel which concerns on Example 1 and Example 2, and a wire saw using the same, while wire blurring is suppressed and the pitch accuracy of a wire is ensured, it is that a wire remove | deviates from a groove | channel. Can be prevented. Moreover, since it is easy to insert the wire into the guide groove, it is easy to attach the wire to the groove. Furthermore, since it is excellent in processing accuracy such as variation in wafer thickness obtained after cutting and parallelism within the wafer surface, it is possible to reduce the number of man-hours required for workers, wafer processing accuracy defects and wafer manufacturing costs. .

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the present invention. Can be added.

  The present invention can be used for a wire saw for cutting an ingot such as a semiconductor crystal or a sapphire crystal.

DESCRIPTION OF SYMBOLS 10 Grooved roller 20, 30 Groove 21, 31 Bottom part 22, 32 Equal width part 23 Introduction part 40 Wire 41 Fixed abrasive flow 50 Reel 60 Guide roller 70 Block for cutting 80 Dummy material 90 Supply nozzle 100 Multi-wire saw 110 Workpiece

Claims (6)

A grooved roller for a fixed abrasive type wire saw in which a plurality of fixed abrasive type wire extending grooves are formed at a predetermined pitch on an outer peripheral surface,
The cross-sectional shape of the groove is a V-shaped bottom portion, an equal width portion formed from the upper end of the bottom portion toward the outer peripheral surface, the equal width portion not reaching the outer peripheral surface, and the outer peripheral surface from the upper end of the equal width portion. shape der having a inlet section to reach the outer peripheral surface with a groove width increases towards is,
The groove width of said equal width portion is grooved rollers, characterized in 1.1-1.5 Baidea Rukoto wire diameter. The grooved roller according to claim 1 , wherein a groove angle of the introduction portion is 60 to 90 °. The grooved roller according to claim 1 or 2, wherein the groove angle of the bottom is 45 to 90 °. It said bottom upper end to a depth of said groove is grooved roller according to any one of claims 1 to 3, characterized in that 3 to 5 times the wire diameter. The grooved roller according to any one of claims 1 to 4 , wherein the portion where the groove is formed is made of urethane resin. A grooved roller according to any one of claims 1 to 5,
A fixed abrasive type wire provided with fixed abrasive grains fixed to the surface;
A wire moving mechanism for moving the fixed abrasive grain type wire by winding the fixed abrasive grain type wire to said grooved rollers,
A wire saw comprising: a fixed support member that fixedly supports a workpiece.

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