JPWO2018083914A1 - Plating processing jig and plating processing apparatus - Google Patents

Plating processing jig and plating processing apparatus Download PDF

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JPWO2018083914A1
JPWO2018083914A1 JP2018548587A JP2018548587A JPWO2018083914A1 JP WO2018083914 A1 JPWO2018083914 A1 JP WO2018083914A1 JP 2018548587 A JP2018548587 A JP 2018548587A JP 2018548587 A JP2018548587 A JP 2018548587A JP WO2018083914 A1 JPWO2018083914 A1 JP WO2018083914A1
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support rod
plating
jig
carousel
substrate
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JP7034083B2 (en
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藤井 透
藤井  透
真樹 佐村
真樹 佐村
努 西崎
努 西崎
祐浩 椎木
祐浩 椎木
山本 靖雄
靖雄 山本
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Kohan Kogyo Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)

Abstract

【課題】めっき浴槽中でめっき処理用治具が回転してもノジュールの発生が抑制可能なめっき処理用治具およびめっき処理装置を提供する。【解決手段】本発明のめっき処理用治具は、めっき浴槽内のめっき液中に、中心孔を有する円盤状の基板を浸漬させるためのめっき処理用治具であって、前記基板の中心孔へ挿通される支持ロッドと、前記支持ロッドを支持するとともに、前記支持した支持ロッドが自転することを抑制する自転抑制機構を備えた拘束部材と、前記拘束部材を介して前記支持ロッドが取り付けられるカローセルと、を含むことを特徴とする。【選択図】 図1A plating processing jig and a plating processing apparatus capable of suppressing the generation of nodules even when the plating processing jig rotates in a plating bath. A plating processing jig according to the present invention is a plating processing jig for immersing a disk-shaped substrate having a center hole in a plating solution in a plating bath, the center hole of the substrate being A support rod that is inserted into the support rod, a restraint member that supports the support rod, and that includes a rotation suppression mechanism that inhibits the supported support rod from rotating, and the support rod is attached via the restraint member. A carousel. [Selection] Figure 1

Description

本発明は、めっき処理技術に関し、より詳細には中心孔を有する円盤状の基板をめっき浴槽内に浸漬してめっき被膜を基板上に形成するためのめっき処理用治具およびめっき処理装置に関する。   The present invention relates to a plating processing technique, and more particularly to a plating processing jig and a plating processing apparatus for forming a plating film on a substrate by immersing a disc-shaped substrate having a center hole in a plating bath.

PCや家電などに搭載されるHDD(ハードディスクドライブ)に用いられる磁気記録媒体は、その利便性の高さなどから需要が高く記録密度の著しい向上が図られつつある。
かような磁気記録媒体については、より高い記録密度を実現することが市場から継続して要求されており、そのため磁気記録媒体に用いられる円盤状の基板に対しても今まで以上に平滑性が高く傷の少ない高品質な基板が求められている。
Magnetic recording media used in HDDs (Hard Disk Drives) installed in PCs and home appliances are in high demand due to their high convenience and the recording density is being remarkably improved.
For such a magnetic recording medium, there is a continuing demand from the market to achieve higher recording density, and therefore even a disc-shaped substrate used for a magnetic recording medium is more smooth than ever. There is a need for a high-quality substrate with high scratches.

この円盤状の基板としては、例えばアルミニウム合金基板やガラス基板などが用いられている。このうちアルミニウム合金基板は、例えば次に示す工程などを経ることによって製造される。すなわち、先ず厚さ1〜3mm程度のアルミニウム合金板をドーナツ状に打ち抜き加工して所望の寸法の基板に加工する。次いで、打ち抜かれた基板に対して端部の面取り加工などを施した後、砥石による研削加工を行い、さらにその後に基板表面に無電解NiPめっきを施すことなどが行われている。   For example, an aluminum alloy substrate or a glass substrate is used as the disk-shaped substrate. Of these, the aluminum alloy substrate is manufactured through, for example, the following steps. That is, first, an aluminum alloy plate having a thickness of about 1 to 3 mm is punched into a donut shape to form a substrate having a desired size. Next, after chamfering the end of the punched substrate, grinding with a grindstone is performed, and thereafter, electroless NiP plating is performed on the substrate surface.

そして無電解NiPめっきにおいては、例えば特許文献1に示されるように、めっき処理用治具で複数の基板を保持し、これら基板を一括してめっき浴槽中へ浸漬させることが行われる。また、特許文献1にも開示されているとおり、基板表面にめっき被膜を効率よく成膜するため、めっき処理用治具を自転や公転をさせながら複数枚の基板に対して無電解NiPめっきを施すことも知られている。   In electroless NiP plating, for example, as shown in Patent Document 1, a plurality of substrates are held by a jig for plating treatment, and these substrates are collectively immersed in a plating bath. In addition, as disclosed in Patent Document 1, in order to efficiently form a plating film on the substrate surface, electroless NiP plating is applied to a plurality of substrates while rotating or revolving the jig for plating treatment. It is also known to apply.

一方で上記しためっき治具をめっき浴槽内で自転や公転をさせる技術では、めっき治具の摺動部分から発生する摩耗粉によって基板表面にノジュールと呼ばれる欠陥を発生させることがある。
このノジュールが発生すると基板の品質が著しく低下するため、かようなノジュールを如何に抑制するかが重要となる。この点に関して特許文献1では、基板10の外周縁部を嵌め込む溝の断面をU字状とすることで、基板の外周縁部に発生しやすいノジュールを抑制可能であることが示されている。
On the other hand, in the technique of rotating and revolving the plating jig described above in the plating bath, defects called nodules may be generated on the substrate surface due to wear powder generated from the sliding portion of the plating jig.
When this nodule is generated, the quality of the substrate is remarkably deteriorated, so it is important how to suppress such nodule. In this regard, Patent Document 1 shows that nodules that are likely to be generated at the outer peripheral edge of the substrate can be suppressed by making the cross section of the groove into which the outer peripheral edge of the substrate 10 is fitted into a U shape. .

特開2007−169757号公報JP 2007-169757 A

しかしながら、上記した従来のめっき処理用治具では以下に述べる課題があり、未だに改善すべき点があると言える。
すなわち、確かに特許文献1によれば、基板の外周縁部に起因するノジュールは抑制できる可能性はあるものの、めっき処理用治具の摺動部分から発生する摩耗粉については一切言及がない。このように特許文献1の構成では、めっき処理用治具の摺動部分から発生する摩耗粉によって別のノジュールが発生してしまうことが懸念される。
However, the above-described conventional plating jig has the following problems, and it can be said that there are still points to be improved.
That is, according to Patent Document 1, there is a possibility that nodules caused by the outer peripheral edge of the substrate can be suppressed, but there is no mention of abrasion powder generated from the sliding portion of the plating processing jig. As described above, in the configuration of Patent Document 1, there is a concern that another nodule may be generated due to the abrasion powder generated from the sliding portion of the plating processing jig.

本発明は、かような課題を解決することを鑑みてなされたものであり、めっき浴槽中でめっき処理用治具が回転してもノジュールの発生が抑制可能なめっき処理用治具およびめっき処理装置を提供することを目的とする。   The present invention has been made in view of solving such problems, and a plating treatment jig and a plating treatment capable of suppressing the generation of nodules even when the plating treatment jig rotates in the plating bath. An object is to provide an apparatus.

上記課題を解決するため、本発明の一実施形態にかかるめっき処理用治具は、(1)めっき浴槽内のめっき液中に、中心孔を有する円盤状の基板を浸漬させるためのめっき処理用治具であって、前記基板の中心孔へ挿通される支持ロッドと、前記支持ロッドを支持するとともに、前記支持した支持ロッドが自転することを抑制する自転抑制機構を備えた拘束部材と、前記拘束部材を介して前記支持ロッドが取り付けられるカローセルと、を含むことを特徴とする。 In order to solve the above problems, a plating processing jig according to an embodiment of the present invention is (1) for plating processing for immersing a disk-shaped substrate having a center hole in a plating solution in a plating bath. A support rod that is inserted into a center hole of the substrate; a restraint member that supports the support rod and includes a rotation suppression mechanism that suppresses rotation of the supported support rod; and And a carousel to which the support rod is attached via a restraining member.

なお、上記した(1)に記載のめっき処理用治具においては、(2)前記自転抑制機構は、前記支持ロッドに接触する接触部材と、前記接触部材を前記支持ロッドに対して押し付ける弾性部材を有する押し付け部材を含むことが好ましい。   In the plating jig described in (1) above, (2) the rotation suppression mechanism includes a contact member that contacts the support rod, and an elastic member that presses the contact member against the support rod. It is preferable to include a pressing member having

さらに上記した(2)に記載のめっき処理用治具においては、(3)前記拘束部材には、前記支持ロッドの周面の少なくとも一部が収容されるU字状の収容凹部が設けられ、前記接触部材は、前記収容凹部に前記支持ロッドが収容された状態で前記弾性部材を介して当該支持ロッドに接触して押し付けられることが好ましい。   Furthermore, in the plating processing jig according to (2) described above, (3) the restraining member is provided with a U-shaped accommodation recess that accommodates at least a part of the peripheral surface of the support rod, It is preferable that the contact member is pressed in contact with the support rod via the elastic member in a state where the support rod is accommodated in the accommodation recess.

また、上記した(2)又は(3)に記載のめっき処理用治具においては、(4)前記押し付け部材を少なくともそれぞれ2つ具備し、互いの前記接触部材が進退方向に関して対向するように配置されていることが好ましい。   In the plating processing jig described in (2) or (3) above, (4) at least two of the pressing members are provided so that the contact members are opposed to each other in the advancing / retreating direction. It is preferable that

また、上記した(1)〜(4)のいずれかに記載のめっき処理用治具においては、(5)前記接触部材の頂部には、前記支持ロッドの脱着を促すガイド面が形成されてなることが好ましい。   In the plating jig according to any one of the above (1) to (4), (5) a guide surface for urging and removing the support rod is formed on the top of the contact member. It is preferable.

また、上記した(1)〜(5)のいずれかに記載のめっき処理用治具においては、(6)前記接触部材の頂部の少なくとも一部には低摩擦処理が施されてなることが好ましい。   In the plating jig according to any one of the above (1) to (5), (6) it is preferable that at least a part of the top of the contact member is subjected to a low friction treatment. .

また、上記課題を解決するため、本発明の一実施形態にかかるめっき処理装置は、上記した(1)〜(6)のいずれかに記載のめっき処理用治具と、前記カローセルを回転させる回転機構と、を含むことを特徴とする。   Moreover, in order to solve the said subject, the plating processing apparatus concerning one Embodiment of this invention is the rotation which rotates the jig for plating processing in any one of above-described (1)-(6), and the said carousel. And a mechanism.

本発明によれば、カローセルに取り付けられる支持ロッドが自転抑制機構によって自転してしまうことが抑制されるため、支持ロッドとカローセルとの接続部位で生じ得る摩耗粉に起因して発生するノジュールを抑制することが可能となる。   According to the present invention, since the support rod attached to the carousel is prevented from rotating by the rotation suppressing mechanism, the nodule generated due to wear powder that may occur at the connection portion between the support rod and the carousel is suppressed. It becomes possible to do.

めっき処理用治具10とめっき処理装置100を示した図である。1 is a view showing a plating processing jig 10 and a plating processing apparatus 100. FIG. めっき処理用治具10のうち拘束部材12を示した図である。It is the figure which showed the restraint member 12 among the jigs 10 for a plating process. めっき処理用治具10の各側面を展開した展開図である。FIG. 3 is a development view in which each side surface of the plating processing jig 10 is developed. めっき処理用治具10における自転抑制機構のうち接触部材12bを説明するための模式図である。It is a schematic diagram for demonstrating the contact member 12b among the rotation suppression mechanisms in the jig | tool 10 for a plating process. めっき処理用治具10における自転抑制機構のうち軸受部材12aを説明するための模式図である。It is a schematic diagram for demonstrating the bearing member 12a among the rotation suppression mechanisms in the jig | tool 10 for a plating process. めっき処理用治具10における拘束部材12に支持ロッド11が着脱される際の状態遷移の図である。It is a figure of a state transition at the time of the support rod 11 being attached or detached with the restraint member 12 in the jig | tool 10 for a plating process.

以下、本発明を実施するための実施形態について説明する。なお、以下の説明に用いる図面においては、便宜的にめっき処理用治具10に取り付けられたときの支持ロッド11が延びる方向をX方向とし、このX方向を基準として各図において説明に適した方向を適宜Y方向とZ方向に設定している。ただしこれらの方向はあくまでも説明の明瞭化という目的で設定されるものであり、本発明を不当に限定解釈するようなものではない。   Hereinafter, an embodiment for carrying out the present invention will be described. In the drawings used for the following description, for convenience, the direction in which the support rod 11 extends when attached to the plating processing jig 10 is defined as the X direction, and this drawing is suitable for the description with reference to the X direction. The directions are set appropriately in the Y direction and the Z direction. However, these directions are set only for the purpose of clarifying the explanation, and do not unduly limit and interpret the present invention.

図1は、めっき処理用治具10とめっき処理装置100を示した図である。このうち図1(a)はめっき処理用治具10を含むめっき処理装置100の模式図であり、(b)はめっき処理用治具10を軸線方向から見た平面図であり、(c)は図1(a)における領域Pの部分拡大図であり、(d)は図1(c)のA−A断面図(YZ平面方向でスライス)である。これらの図に示すように、本実施形態におけるめっき処理装置100は、主として、めっき処理用治具10と、回転機構15、を含んで構成されている。   FIG. 1 is a view showing a plating processing jig 10 and a plating processing apparatus 100. Among these, FIG. 1A is a schematic view of a plating apparatus 100 including a plating jig 10, and FIG. 1B is a plan view of the plating jig 10 viewed from the axial direction. FIG. 2A is a partially enlarged view of a region P in FIG. 1A, and FIG. 1D is a cross-sectional view taken along the line AA in FIG. As shown in these drawings, the plating apparatus 100 according to the present embodiment mainly includes a plating processing jig 10 and a rotation mechanism 15.

めっき処理用治具10は、めっき浴槽20内のめっき液L中に、中心孔を有する円盤状の基板1を浸漬させるために用いられる。そして本実施形態のめっき処理用治具10は、支持ロッド11、拘束部材12、及びカローセル13を少なくとも含んで構成されている。   The plating processing jig 10 is used for immersing the disc-shaped substrate 1 having a center hole in the plating solution L in the plating bath 20. The plating processing jig 10 of this embodiment includes at least a support rod 11, a restraining member 12, and a carousel 13.

ここで、基板1は、中心に円形の貫通孔(中心孔)を有するガラス製またはアルミニウムなどの金属製の材料で構成された円盤状の部材である。かような基板1は、厚みが0.3mm〜2.0mm程度であり、一般的には直径が2 . 5 インチを超える基板にあっては主にアルミニウム製の基板が用いられ、2.5インチ以下のサイズでは主としてガラス製基板が用いられている。   Here, the board | substrate 1 is a disk-shaped member comprised with metal materials, such as glass or aluminum which have a circular through-hole (center hole) in the center. Such a substrate 1 has a thickness of about 0.3 mm to 2.0 mm, and generally has a diameter of 2. For a substrate exceeding 5 inches, an aluminum substrate is mainly used, and for a size of 2.5 inches or less, a glass substrate is mainly used.

このうちアルミニウム製の基板1では、例えばアルミニウム素材から打抜いたサブストレートに所要の前処理を施した後、後述するNi−Pめっき液浴による無電解めっき処理を施して表面にNi−P合金被膜を形成し、さらにその上に強磁性の金属薄膜を積層することなどを経て磁気記録ディスク基板へと形成される。   Of these, for the aluminum substrate 1, for example, a substrate punched out of an aluminum material is subjected to a necessary pretreatment, and then subjected to an electroless plating treatment using a Ni-P plating solution bath, which will be described later. A film is formed, and a ferromagnetic metal thin film is further laminated thereon, and the magnetic recording disk substrate is formed.

めっき浴槽20は、1又は複数のめっき処理用治具10を内包できる程度の大きさの金属製又は樹脂製の槽である。なお、めっき浴槽20としては、例えば上記した特許文献に開示された浴槽や他の公知の無電解めっき浴槽を適用することができる。なお、本実施形態でめっき浴槽20内に貯留されるめっき液Lは、公知のNi−Pめっき液が適用可能であり、一例として例えば硫酸ニッケル:20g/dm、次亜りん酸ソーダ:20g/dm、酢酸ソーダ:10g/dm、クエン酸ソーダ:10g/dmを含む水溶液などが例示できる。The plating bath 20 is a metal or resin tank having a size enough to enclose one or a plurality of plating treatment jigs 10. In addition, as the plating bathtub 20, the bathtub disclosed by the above-mentioned patent document and other well-known electroless plating bathtubs can be applied, for example. In addition, the well-known Ni-P plating solution is applicable to the plating solution L stored in the plating bath 20 in this embodiment, for example, nickel sulfate: 20 g / dm 3 , sodium hypophosphite: 20 g. An aqueous solution containing / dm 3 , sodium acetate: 10 g / dm 3 , sodium citrate: 10 g / dm 3 and the like can be exemplified.

支持ロッド11は、基板1の中心孔へ挿通される棒状の部材である。この支持ロッド11は、図1に示すとおり、一対のカローセル13a、13bの間で1又は複数配置される。支持ロッド11の材質に特に制限はないが、例えば樹脂などが例示される。
なお、支持ロッド11は、上記した中心孔を介して基板1を支持するものであるが、さらに基板1の外周縁部近くの円周線上に所定間隔おきに配置される外周保持シャフト(特開2007−169757号公報などを参照)が支持ロッド11の周囲に配置されていてもよい。
The support rod 11 is a rod-shaped member that is inserted into the center hole of the substrate 1. As shown in FIG. 1, one or more support rods 11 are arranged between a pair of carousels 13a and 13b. Although there is no restriction | limiting in particular in the material of the support rod 11, For example, resin etc. are illustrated.
The support rod 11 supports the substrate 1 through the above-described center hole, and is further provided with an outer peripheral holding shaft arranged at predetermined intervals on a circumferential line near the outer peripheral edge of the substrate 1 (Japanese Patent Application Laid-Open No. 2005-260707). 2007-169757 or the like) may be disposed around the support rod 11.

拘束部材12は、支持ロッド11を支持する機能を有する。本実施形態における拘束部材12は、一例として、支持ロッド11を把持するように断面がU字状の部材となっている。そして本実施形態の拘束部材12は、支持した支持ロッド11が自転することを抑制する自転抑制機構(後述)を備えている。この拘束部材12の材質に特に制限はないが、例えば樹脂などが例示される。そして図1に示すとおり、拘束部材12は、後述する位置決め突部12aを介して、U字状の開口部側(支持ロッド11が挿入される側の空間)が外周方向を向くように、支持ロッド11の本数に応じてカローセル13に1又は複数設置される。The restraining member 12 has a function of supporting the support rod 11. As an example, the restraint member 12 in the present embodiment is a member having a U-shaped cross section so as to grip the support rod 11. And the restraint member 12 of this embodiment is provided with the rotation suppression mechanism (after-mentioned) which suppresses the supported support rod 11 rotating. Although there is no restriction | limiting in particular in the material of this restraining member 12, For example, resin etc. are illustrated. As shown in FIG. 1, the restraining member 12 is arranged such that the U-shaped opening side (the space on the side where the support rod 11 is inserted) faces the outer peripheral direction via a positioning protrusion 12a 3 described later. One or a plurality of support rods 11 are installed in the carousel 13 according to the number of support rods 11.

カローセル13は、拘束部材12を介して支持ロッド11が取り付けられる部材である。本実施形態のカローセル13は、外周に歯が形成された大型の円盤であり、支持ロッド11を横架状に支持可能なように対となって配置される。より具体的には図1に示すとおり、第1カローセル13aと第2カローセル13bが所定の間隔で対向配置され、この内部に1又は複数の支持ロッド11が横架状に配置される。このカローセル13の材質に特に制限はないが、例えば樹脂などが例示される。   The carousel 13 is a member to which the support rod 11 is attached via the restraining member 12. The carousel 13 of this embodiment is a large disk having teeth formed on the outer periphery, and is arranged in pairs so that the support rod 11 can be supported horizontally. More specifically, as shown in FIG. 1, the first carousel 13a and the second carousel 13b are arranged to face each other at a predetermined interval, and one or a plurality of support rods 11 are arranged horizontally in the inside. Although there is no restriction | limiting in particular in the material of this carousel 13, For example, resin etc. are illustrated.

また、本実施形態のめっき処理装置100は、めっき処理用治具10をめっき浴槽20内に浸漬した状態で支持する吊り下げ装置14を含んでいてもよい。
図1に示すとおり、吊り下げ装置14は、カローセル13の両端を吊り下げ支持する機能を備えている。このとき、吊り下げ装置14は、カローセル13の両端に固定されず、後述する回転機構15によってカローセル13が回転することを阻害しない態様でカローセル13を支持することが好ましい。
In addition, the plating apparatus 100 of the present embodiment may include a suspension apparatus 14 that supports the plating processing jig 10 while being immersed in the plating bath 20.
As shown in FIG. 1, the hanging device 14 has a function of hanging and supporting both ends of the carousel 13. At this time, it is preferable that the suspension device 14 is not fixed to both ends of the carousel 13 and supports the carousel 13 in a manner that does not hinder the rotation of the carousel 13 by the rotation mechanism 15 described later.

したがって図1に示すように、吊り下げ装置14で吊り下げられためっき処理用治具10に収容された複数の基板1は、それぞれ中心孔に支持ロッド11が挿通した状態でめっき浴槽20内のめっき液L中へ浸漬される。
そして複数の基板1がめっき液L中へ浸漬した後、めっき処理装置100の回転機構15を介してカローセル13が回転軸16を中心に回転することで、めっき液L内で支持ロッド11が公転することが可能となっている。
Therefore, as shown in FIG. 1, the plurality of substrates 1 accommodated in the plating processing jig 10 suspended by the suspension device 14 are in the plating bath 20 with the support rods 11 inserted through the center holes. It is immersed in the plating solution L.
Then, after the plurality of substrates 1 are immersed in the plating solution L, the carousel 13 rotates around the rotation shaft 16 via the rotation mechanism 15 of the plating apparatus 100, so that the support rod 11 revolves in the plating solution L. It is possible to do.

かような回転機構15は、例えばモータ15aと伝達ギア15bとを含んで構成されている。このうちモータ15aは、公知の種々の電気モータを適用してもよい。また、伝達ギア15bはモータ15aからの動力をカローセル13に伝達し、これによりカローセル13が回転軸16を中心に回転することが可能となっている。
なお上述したとおり、カローセル13が回転軸16を中心に回転するときには、カローセル13に支持された支持ロッド11は回転軸16周りに公転することになる。
Such a rotating mechanism 15 includes, for example, a motor 15a and a transmission gear 15b. Of these, various known electric motors may be applied to the motor 15a. Further, the transmission gear 15 b transmits the power from the motor 15 a to the carousel 13, whereby the carousel 13 can rotate around the rotation shaft 16.
As described above, when the carousel 13 rotates around the rotation shaft 16, the support rod 11 supported by the carousel 13 revolves around the rotation shaft 16.

次に、図2〜図5を用いて本実施形態における拘束部材12の自転抑制機構について詳述する。なお、図2(a)は拘束部材12の外観斜視図であり、(b)は側面図及び上面図である。また、図3は、拘束部材12を正面、側面、背面および上面から見た外観図である。また、図4は、拘束部材12の自転抑制機構のうち押し付け部材12bの構成を示す図である。また、図5は、拘束部材12の自転抑制機構のうち軸受12aを示す図である。
上述したとおり、カローセル13に設置される拘束部材12は、カローセル13の回転に伴って支持ロッド11が回転軸16周りに公転したときに、支持ロッド11自身が拘束部材12内で回転(自転)してしまうことを抑制可能な自転抑制機構を含んでいる。
Next, the rotation suppression mechanism of the restraining member 12 in the present embodiment will be described in detail with reference to FIGS. 2A is an external perspective view of the restraining member 12, and FIG. 2B is a side view and a top view. FIG. 3 is an external view of the restraining member 12 as seen from the front, side, back and top. FIG. 4 is a diagram illustrating the configuration of the pressing member 12b in the rotation suppressing mechanism of the restraining member 12. FIG. 5 is a view showing the bearing 12 a in the rotation suppressing mechanism of the restraining member 12.
As described above, the restraining member 12 installed in the carousel 13 rotates (rotates) in the restraining member 12 when the support rod 11 revolves around the rotation axis 16 as the carousel 13 rotates. This includes a rotation suppression mechanism capable of suppressing the rotation.

図2に示すとおり、本実施形態における拘束部材12の自転抑制機構は、軸受12aと押し付け部材12bを含んでいる。
このうち、軸受12aは、図3及び5などにも示されるとおり、収容凹部12a、押し付け部材格納部12a、及び位置決め突部12aなどを含んで構成されている。この軸受12aの材質に特に制限はないが、例えば樹脂などで形成してもよい。
As shown in FIG. 2, the rotation suppression mechanism of the restraining member 12 in the present embodiment includes a bearing 12a and a pressing member 12b.
Of these, the bearing 12a is configured to include an accommodation recess 12a 1 , a pressing member storage 12a 2 , a positioning protrusion 12a 3 and the like, as shown in FIGS. Although there is no restriction | limiting in particular in the material of this bearing 12a, For example, you may form with resin.

収容凹部12aは、支持ロッド11の周面の少なくとも一部が収容可能な凹部であり、支持ロッド11が接触する底面は当該支持ロッド11の外周面に倣うようにU字状の曲面となっている。なお図3に示されるとおり、支持ロッド11が挿入される長さLは、支持ロッド11が拘束部材12で支持可能な限り特に制限はなく、カローセル13からの拘束部材12の高さを考慮して適宜設定してもよい。The housing recess 12 a 1 is a recess capable of housing at least a part of the peripheral surface of the support rod 11, and the bottom surface with which the support rod 11 comes into contact is a U-shaped curved surface so as to follow the outer peripheral surface of the support rod 11. ing. As shown in FIG. 3, the length L into which the support rod 11 is inserted is not particularly limited as long as the support rod 11 can be supported by the restraining member 12, and the height of the restraining member 12 from the carousel 13 is taken into consideration. May be set as appropriate.

押し付け部材格納部12aは、後述する押し付け部材12bが収容される部位である。押し付け部材格納部12aは、本実施形態では収容凹部12aを挟むよう2ヶ所で互いに対向するように配置されている。また、図5に示すとおり、押し付け部材格納部12aには、押し付け部材12bが脱落しないように当該押し付け部材12bの移動をガイドするガイド溝12aが形成されている。The pressing member storage portion 12a 2 is a portion in which a pressing member 12b described later is accommodated. In this embodiment, the pressing member storage portion 12a 2 is disposed so as to face each other at two positions so as to sandwich the housing recess 12a 1 . Further, as shown in FIG. 5, the pressing member storage portion 12a 2 is formed with a guide groove 12a 4 that guides the movement of the pressing member 12b so that the pressing member 12b does not fall off.

さらに、押し付け部材格納部12aには、後述する取り付け部材12bが挿入される挿入孔12aが形成されている。このように本実施形態では挿入孔12aを介して取り付け部材12bが押し付け部材格納部12a内に配置されるため、押し付け部材12bを安定して押し付け部材格納部12a内に位置付けることが可能となっている。Further, the pressing member storage portion 12a 2 is formed with an insertion hole 12a 5 into which a mounting member 12b 3 described later is inserted. Thus for the present embodiment the mounting member 12b 3 are disposed in the pressing member storing portion 12a in the 2 through the insertion hole 12a 5, be located pressed stably against member storing portion 12a in the 2 members 12b It is possible.

位置決め突部12aは、上記したカローセル13の予め規定された位置に拘束部材12を設置するためのガイドである。すなわち、カローセル13にも位置決め突部12aと対応する位置決め凹部(不図示)が形成されており、この位置決め凹部に位置決め突部12aを挿入することでカローセル13上における拘束部材12の位置が確定される。The positioning protrusion 12a 3 is a guide for installing the restraining member 12 at a predetermined position of the carousel 13 described above. That is, a positioning recess (not shown) corresponding to the positioning protrusion 12a 3 is also formed in the carousel 13, and the position of the restraining member 12 on the carousel 13 is determined by inserting the positioning protrusion 12a 3 into the positioning recess. Confirmed.

なお、本実施形態の位置決め突部12aは円柱状であるが、この態様に限られず例えば三角柱や四角柱、あるいは五角柱などの矩形状であってもよい。位置決め突部12aを矩形状とし、対応する位置決め凹部も矩形状とすることで、例えばU字状の開口部側が外周を向くなど拘束部材12の向きも自動的に確定することが可能となる。The positioning protrusion 12a 3 in the present embodiment is cylindrical, for example a triangular prism or a quadrangular prism is not limited to this embodiment, or may be rectangular, such as pentagonal prism. By making the positioning protrusion 12a 3 rectangular and the corresponding positioning recess also rectangular, the direction of the restraining member 12 can be automatically determined, for example, the U-shaped opening side faces the outer periphery. .

次に図2〜図4を用いて、上記した自転抑制機構のうち押し付け部材12bの詳細な構成について説明する。
まず図4に示すとおり、押し付け部材12bは、接触部材12b、弾性部材12b及び取り付け部材12bを含んで構成されている。
なお図4において、(a)は接触部材12bを示し、(b)は弾性部材12bを示し、(c)は取り付け部材12bを示し、(d)は接触部材12bをY方向側から見た図であり、(e)は取り付け部材12bをY方向側から見た図である。
接触部材12bは、収容凹部12aに収容された支持ロッド11に接触可能な部材である。この接触部材12bの材質に特に制限はないが、例えば樹脂などで形成してもよい。
Next, a detailed configuration of the pressing member 12b in the above-described rotation suppression mechanism will be described with reference to FIGS.
First, as shown in FIG. 4, the pressing member 12 b includes a contact member 12 b 1 , an elastic member 12 b 2, and a mounting member 12 b 3 .
4, (a) shows the contact member 12b 1 , (b) shows the elastic member 12b 2 , (c) shows the attachment member 12b 3 , and (d) shows the contact member 12b 1 on the Y direction side. is a view from a view of the (e) the mounting member 12b 3 from the Y direction.
The contact member 12b 1 is a member that can contact the support rod 11 housed in the housing recess 12a 1 . There is no particular limitation on the material of the contact member 12b 1, may be formed, for example, a resin such as.

同図に示すとおり、接触部材12bにはネジ孔Mが形成されており、後述する取り付け部材12bのネジ部Nと螺合される。したがって、接触部材12bは、収容凹部12aに支持ロッド11が収容された状態で後述する弾性部材12bを介して当該支持ロッド11に接触して押し付けられることが可能となっている。As shown in the drawing, a screw hole M is formed in the contact member 12b 1 and is screwed with a screw portion N of the mounting member 12b 3 described later. Therefore, the contact member 12b 1 can be pressed against the support rod 11 via the elastic member 12b 2 described later in a state where the support rod 11 is housed in the housing recess 12a 1 .

さらに図2や図3にも示されるとおり、本実施形態の拘束部材12は、押し付け部材12bを少なくとも2つ具備し、互いの接触部材12bが進退方向(図2におけるY方向)に関して対向するように配置されていてもよい。
また、図4に示されるとおり、本実施形態の接触部材12bの頂部tには、支持ロッド11の脱着を促すガイド面t1及びガイド面t2が形成されてなる。
As further shown also in FIGS. 2 and 3, the restraining member 12 of this embodiment, at least two comprises a member 12b pressing the contact member 12b 1 of each other are opposed with respect to (Y direction in FIG. 2) moving direction It may be arranged as follows.
Further, as shown in FIG. 4, the top t of the contact members 12b 1 of the present embodiment, the guide surface t1 and the guide surface t2 encourage desorption of the support rod 11 is formed.

このうちガイド面t1は、収容凹部12aに収容された支持ロッド11が接触する面である。図3からも明らかなとおり、頂部tは三角屋根状又は矢印状のごとき形状となっており、このガイド面t1は、頂部tの先端から支持ロッド11の周面に沿って、Y方向に関して先端が先細りとなるような傾斜した面となっている。Among guide surfaces t1, the support rod 11 which is accommodated in the accommodating recess 12a 1 is a surface which contacts. As apparent from FIG. 3, the top portion t has a triangular roof shape or an arrow-like shape, and the guide surface t <b> 1 extends along the circumferential surface of the support rod 11 from the distal end of the top portion t with respect to the Y direction. It has an inclined surface that tapers.

一方でガイド面t2は、収容凹部12aに支持ロッド11が収容されるときに当該支持ロッド11が接触する面である。図3からも明らかなとおり、このガイド面t2も、頂部tの先端からY方向に関して先端が先細りとなるような傾斜した面となっている。なお、図4のとおり、本実施形態では、ガイド面t1とY軸とのなる角度αと、ガイド面t2とY軸とのなる角度αは、互いに等しい角度となっている。しかしながらこの形態に限られず、α≠αとなってα>αであってもよいし、α<αであってもよい。On the other hand the guide surface t2, the said support rod 11 is a surface which contacts when the support rod 11 in the accommodation recess 12a 1 is accommodated. As is apparent from FIG. 3, the guide surface t2 is also an inclined surface with the tip tapered from the tip of the top t in the Y direction. Incidentally, as shown in Figure 4, in this embodiment, become angle alpha 1 between the guide surface t1 and the Y-axis becomes an angle alpha 2 between the guide surface t2 and Y-axis is made equal angles to each other. However, the present invention is not limited to this, and α 1 ≠ α 2 and α 1 > α 2 may be satisfied, or α 12 may be satisfied.

また、接触部材12bの頂部tの少なくとも一部には、低摩擦処理が施されていてもよい。換言すれば、ガイド面t1およびガイド面t2の少なくとも一方には、支持ロッド11の着脱を促進するように低摩擦処理が施されていてもよい。この低摩擦処理の具体例としては、種々の公知の処理が適用でき、例えばフッ素コーティング膜を別途施してもよいし、DLC(ダイヤモンドライクカーボン)コーティング膜を別途施してもよい。Further, at least a part of the top part t of the contact member 12b 1 may be subjected to a low friction process. In other words, at least one of the guide surface t1 and the guide surface t2 may be subjected to a low friction process so as to promote attachment / detachment of the support rod 11. As specific examples of this low friction treatment, various known treatments can be applied. For example, a fluorine coating film may be separately applied, or a DLC (diamond-like carbon) coating film may be separately applied.

また、図4に示すとおり、接触部材12bには、上述した押し付け部材格納部12a2のガイド溝12aに対応するガイド突起12bが形成されている。本実施形態では、ガイド溝12aに対応して、接触部材12bの隣り合う2つの側面にそれぞれガイド突起12bが形成されている。Further, as shown in FIG. 4, the contact member 12b 1 is formed with a guide projection 12b 4 corresponding to the guide groove 12a 4 of the pressing member storage portion 12a 2 described above. In the present embodiment, the guide protrusions 12b 4 are respectively formed on the two adjacent side surfaces of the contact member 12b 1 corresponding to the guide grooves 12a 4 .

弾性部材12bは、上記した接触部材12bを支持ロッド11に対して押し付ける機能を有する。本実施形態における弾性部材12bの具体例としては、接触部材12bを支持ロッド11に対して押し付けることが可能であれば特に制限はないが、例えばバネやゴムなどが例示できる。そして弾性部材12bは、支持ロッド11が収容凹部12a内に収容された状態において、当該支持ロッド11を接触部材12bが押し付け続けられる程度のバネ定数を有していることが好ましい。The elastic member 12 b 2 has a function of pressing the contact member 12 b 1 against the support rod 11. A specific example of the elastic member 12b 2 in the present embodiment is not particularly limited as long as the contact member 12b 1 can be pressed against the support rod 11, but examples thereof include a spring and rubber. The elastic member 12b 2, in a state where the support rod 11 is accommodated in the accommodating recess 12a 1, preferably has a spring constant of the degree to which the support rod 11 is contacted member 12b 1 can continue pressing.

そして本実施形態の弾性部材12bは、一方の端部が接触部材12bと接触するとともに、他方の端部が押し付け部材格納部12aに接触している。これにより、支持ロッド11が脱着される際に、弾性部材12bは、押し付け部材格納部12aを基端にして接触部材12bを押し出す作用を奏することができる。The elastic member 12b 2 of the present embodiment has one end portion in contact with the contact member 12b 1 and the other end portion in contact with the pressing member storage portion 12a 2 . Thereby, when the support rod 11 is detached, the elastic member 12b 2 can exert an action of pushing out the contact member 12b 1 with the pressing member storage portion 12a 2 as a base end.

取り付け部材12bは、図3などに示されるとおり、押し付け部材格納部12aに格納される部位である。この取り付け部材12bの材質に特に制限はないが、例えば樹脂などで形成してもよい。上述のとおり本実施形態では、押し付け部材格納部12aに挿入孔12aが形成されるとともに、この挿入孔12aに取り付け部材12bが挿入される。また、取り付け部材12bの先端部はネジ部Nとなっており、接触部材12bの上記したネジ孔Mと螺合されることで一体化される。これにより、押し付け部材格納部12aに押し付け部材12bが格納され、さらにガイド溝12aとガイド突起12bとで押し付け部材12bが脱落することが防止されている。The attachment member 12b 3 is a part stored in the pressing member storage portion 12a 2 as shown in FIG. There is no particular limitation on the material of the mounting member 12b 3, may be formed, for example, a resin such as. As described above, in the present embodiment, the insertion hole 12a 5 is formed in the pressing member storage portion 12a 2 , and the attachment member 12b 3 is inserted into the insertion hole 12a 5 . The tip portion of the mounting member 12b 3 is a threaded portion N, are integrated by being screwed with the screw hole M as described above of the contact member 12b 1. This will member 12b pressing the pressing member storage section 12a 2 is stored, it is prevented from further guide groove 12a 4 and the guide projections 12b 4 and in the pressing member 12b comes off.

次に図6を用いて、支持ロッド11が拘束部材12の収容凹部12aに対して挿脱される際の状態遷移について説明する。なお図6(a)は支持ロッド11が収容凹部12aの外部にあるときを示し、(b)は支持ロッド11が収容凹部12aに挿入中のときを示し、(c)は支持ロッド11の収容凹部12aへの収容が完了したときを示す。
そして図6(b)に示されるとおり、支持ロッド11が拘束部材12の収容凹部12aに収容されるときは、支持ロッド11の挿入に伴って押し付け部材12の接触部材12bが外側に(一対の接触部材12bが互いに離間する方向に)スライド移動する。
Next, with reference to FIG. 6, the supporting rod 11 will be described the state transition when being inserted and removed with respect to the housing recess 12a 1 of the restraint member 12. FIG. 6A shows the case where the support rod 11 is outside the housing recess 12a 1 , FIG. 6B shows the time when the support rod 11 is being inserted into the housing recess 12a 1, and FIG. 6C shows the support rod 11. The time when the accommodation into the accommodation recess 12a 1 is completed is shown.
As shown in FIG. 6B, when the support rod 11 is accommodated in the accommodating recess 12a 1 of the restraining member 12, the contact member 12b 1 of the pressing member 12 is moved outward as the support rod 11 is inserted ( The pair of contact members 12b 1 slides in a direction away from each other.

そして図6(c)に示されるとおり、支持ロッド11がさらに移動して収容凹部12a内に進入すると、弾性部材12bの作用で接触部材12bが支持ロッド11の外周面を押し付ける。これにより、収容凹部12a内で支持ロッド11は固定されることとなり、上述のとおりカローセル13が回転することで支持ロッド11が公転したとしても、収容凹部12a内で支持ロッド11が自転してしまうことが抑制される。Then, as shown in FIG. 6C, when the support rod 11 further moves and enters the housing recess 12 a 1 , the contact member 12 b 1 presses the outer peripheral surface of the support rod 11 by the action of the elastic member 12 b 2 . Thereby, the accommodation recess 12a 1 inside the support rod 11 becomes to be fixed, as carousel 13 as described above has support rods 11 revolve by rotating the supporting rod 11 is rotating in the housing recess 12a within 1 Is suppressed.

一方で、例えばNi−Pめっき処理が完了して支持ロッド11から基板1を取り外す際などは、拘束部材12による拘束を解放して支持ロッド11をカローセル13から外す必要がある。このような場合には、図6(b)のとおり支持ロッド11が収容凹部12a内から離脱するに伴って押し付け部材12の接触部材12bが外側にスライド移動する。次いで図6(a)のとおり、支持ロッド11が収容凹部12a内から完全に離脱した後は、弾性部材12bの作用で接触部材12bが元の位置へ戻ることとなる。On the other hand, for example, when the Ni-P plating process is completed and the substrate 1 is removed from the support rod 11, it is necessary to release the support rod 11 from the carousel 13 by releasing the restraint by the restraint member 12. In such a case, the contact member 12b 1 of the member 12 pressed with as support rods 11 shown in FIG. 6 (b) is removed from the housing recess 12a within 1 is slid to the outside. Then as FIG. 6 (a), the after supporting rod 11 is completely disengaged from the housing recess 12a within 1, the contact member 12b 1 by the action of the elastic member 12b 2 so that the return to the original position.

このように本実施形態では、カローセル13に設置された拘束部材12は、支持ロッド11を着脱自在に支持しつつ、自転抑制機構の作用によって支持ロッド11が収容凹部12a内で自転してしまうことを抑制している。
これにより、支持ロッドとカローセルとの接続部位で生じ得る摩耗粉に起因して発生するノジュールを抑制することが可能となる。
As described above, in this embodiment, the restraining member 12 installed in the carousel 13 supports the support rod 11 in a detachable manner, and the support rod 11 rotates within the accommodation recess 12a 1 by the action of the rotation suppression mechanism. That is restrained.
Thereby, it becomes possible to suppress nodules generated due to wear powder that may be generated at the connection portion between the support rod and the carousel.

なお上記で説明した実施形態は、本発明の趣旨を逸脱しない範囲で種々の変形が可能である。以下、本発明に適用が可能な変形例について説明する。
上記した実施形態では、接触部材12bの頂部tにはガイド面が形成されて三角屋根状又は矢印状のごとき形状となっていたが、ガイド面t2は支持ロッド11の周面と同様の曲面となっていてもよい。あるいは、接触部材12bの頂部tにガイド面は必須ではなく、適宜これを省略してもよい。
The embodiment described above can be variously modified without departing from the spirit of the present invention. Hereinafter, modifications that can be applied to the present invention will be described.
In the above-described embodiment, a guide surface is formed on the top t of the contact member 12b 1 to have a shape like a triangular roof shape or an arrow shape, but the guide surface t2 is a curved surface similar to the peripheral surface of the support rod 11. It may be. Alternatively, the guide surface is not essential at the top t of the contact member 12b 1 and may be omitted as appropriate.

また、上記で説明した実施形態は、頂部tは先端が先細りとなった三角屋根状又は矢印状のごとき形状となっている。ここで頂部tの先端は尖っていても良いが、先端にR部(アール部)を有する先丸形状となっていることがさらに好ましい。
すなわち、先端にR部(アール部)を有する形状とすることにより、支持ロッド11の装着がよりスムーズに行えるようになる。その結果、ディスク基板を装着した支持ロッド11を本願発明のめっき処理用治具10に装着する際に、ディスク基板同士やディスク基板とめっき処理用治具10が衝突して生ずるシャローピット(小さい凹み欠陥)の発生を抑制することが可能となる。
そのため、頂部tは先端にR部(アール部)を有する形状とすることがより好ましいものである。
なお上記R部(アール部)の大きさとしては特に制限されるものではないが、例えばR0.5〜R5.0程度の大きさであれば好ましい。
In the embodiment described above, the apex t has a shape like a triangular roof or an arrow with a tapered tip. Here, the tip of the top part t may be sharp, but it is more preferable that the tip part has a rounded shape having an R part (Ru part) at the tip.
That is, the support rod 11 can be mounted more smoothly by adopting a shape having an R portion (R portion) at the tip. As a result, when the support rod 11 with the disk substrate mounted thereon is mounted on the plating processing jig 10 of the present invention, the shallow pits (small dents) generated by the collision between the disk substrates and the disk substrate and the plating processing jig 10. It is possible to suppress the occurrence of defects.
Therefore, it is more preferable that the top part t has a shape having an R part (Ru part) at the tip.
In addition, although it does not restrict | limit especially as a magnitude | size of said R part (Ru part), For example, if it is a magnitude | size about R0.5-R5.0, it is preferable.

また、拘束部材12の自転抑制機構として、軸受12aと押し付け部材12bの例を説明したが、支持ロッド11の自転を抑制できれば他の構造を採用してもよい。例えば、軸受12aの収容凹部12a内に、支持ロッド11が圧入可能なように凹状のスポンジやゴムなどの個体弾性部材を配置し、この個体弾性部材内に支持ロッド11を圧入して自転を抑制する態様であってもよい。また、上記実施形態では、押しつけ部材12bを対向するように形成したが、自転を抑制できれば押しつけ部材12bは片側に1つだけ設ける構造を用いてもよい。
さらに、上記した実施形態では、拘束部材12は支持ロッド11を把持可能な断面がU字状の部材であったが、同様の作用効果が得られれば他の構造を用いてもよい。
Moreover, although the example of the bearing 12a and the pressing member 12b was demonstrated as a rotation suppression mechanism of the restraint member 12, as long as the rotation of the support rod 11 can be suppressed, another structure may be employ | adopted. For example, a solid elastic member such as a concave sponge or rubber is arranged in the housing recess 12a 1 of the bearing 12a so that the support rod 11 can be press-fitted, and the support rod 11 is press-fitted into the solid elastic member to rotate. It may be a mode of suppression. Moreover, in the said embodiment, although it formed so that the pressing member 12b might be opposed, the structure which provides only one pressing member 12b on one side may be used if rotation can be suppressed.
Furthermore, in the above-described embodiment, the constraining member 12 is a member having a U-shaped cross section capable of gripping the support rod 11. However, other structures may be used as long as the same function and effect can be obtained.

また、上記実施形態では、めっき処理用治具10の主とした材質を樹脂で形成したが、これに限られず、めっき処理した金属など他の材料を用いてもよい。
また、上記実施形態では、基板1の用途としてHDD向けの磁気ディスク(磁気記録媒体)を例にして説明したが、磁気ディスク以外の他の用途に適用してもよい。この場合、その用途に即してめっき浴槽内のめっき液が変更されることは言うまでもない。
Moreover, in the said embodiment, although the main material of the jig | tool 10 for a plating process was formed with resin, it is not restricted to this, You may use other materials, such as the metal which carried out the plating process.
In the above-described embodiment, the magnetic disk (magnetic recording medium) for the HDD is described as an example of the use of the substrate 1, but it may be applied to other uses other than the magnetic disk. In this case, it goes without saying that the plating solution in the plating bath is changed according to the application.

以上説明したように、本発明のめっき処理用治具およびめっき処理装置は、各種めっき処理される基板の製造に適しており、幅広い分野の産業への適用が可能である。   As described above, the plating jig and the plating apparatus of the present invention are suitable for manufacturing various types of substrates to be plated and can be applied to a wide range of industries.

L めっき液
1 基板
10 めっき処理用治具
11 支持ロッド
12 拘束部材
12a 軸受
12b 押し付け部材
13 カローセル
13a 第1カローセル
13b 第2カローセル
14 吊り下げ装置
15 回転機構
15a モータ
15b 伝達ギア
16 回転軸
20 めっき浴槽
100 めっき処理装置
L Plating solution 1 Substrate 10 Plating treatment jig 11 Support rod 12 Restraint member 12a Bearing 12b Pressing member 13 Carousel 13a First carousel 13b Second carousel 14 Suspension device 15 Rotating mechanism 15a Motor 15b Transmission gear 16 Rotating shaft 20 Plating bath 100 Plating equipment

Claims (7)

めっき浴槽内のめっき液中に、中心孔を有する円盤状の基板を浸漬させるためのめっき処理用治具であって、
前記基板の中心孔へ挿通される支持ロッドと、
前記支持ロッドを支持するとともに、前記支持した支持ロッドが自転することを抑制する自転抑制機構を備えた拘束部材と、
前記拘束部材を介して前記支持ロッドが取り付けられるカローセルと、
を含むことを特徴とするめっき処理用治具。
A plating treatment jig for immersing a disc-shaped substrate having a center hole in a plating solution in a plating bath,
A support rod inserted through the central hole of the substrate;
A restraint member provided with a rotation suppression mechanism that supports the support rod and suppresses rotation of the supported support rod;
A carousel to which the support rod is attached via the restraining member;
A plating jig characterized by comprising:
前記自転抑制機構は、
前記支持ロッドに接触する接触部材と、前記接触部材を前記支持ロッドに対して押し付ける弾性部材を有する押し付け部材を含む請求項1に記載のめっき処理用治具。
The rotation suppression mechanism is
The plating processing jig according to claim 1, comprising a pressing member having a contact member that contacts the support rod and an elastic member that presses the contact member against the support rod.
前記拘束部材には、前記支持ロッドの周面の少なくとも一部が収容されるU字状の収容凹部が設けられ、
前記接触部材は、前記収容凹部に前記支持ロッドが収容された状態で前記弾性部材を介して当該支持ロッドに接触して押し付けられる請求項2に記載のめっき処理用治具。
The constraining member is provided with a U-shaped accommodation recess that accommodates at least a part of the peripheral surface of the support rod,
3. The plating jig according to claim 2, wherein the contact member is pressed in contact with the support rod via the elastic member in a state where the support rod is accommodated in the accommodation recess.
前記押し付け部材を少なくともそれぞれ2つ具備し、
互いの前記接触部材が進退方向に関して対向するように配置されている請求項2又は3に記載のめっき処理用治具。
Each including at least two pressing members;
The plating jig according to claim 2 or 3, wherein the contact members are arranged so as to oppose each other in the advancing / retreating direction.
前記接触部材の頂部には、前記支持ロッドの脱着を促すガイド面が形成されてなる請求項1〜4のいずれか一項に記載のめっき処理用治具。   The jig for a plating process according to any one of claims 1 to 4, wherein a guide surface that promotes detachment of the support rod is formed on a top portion of the contact member. 前記接触部材の頂部の少なくとも一部には低摩擦処理が施されてなる請求項1〜5のいずれか一項に記載のめっき処理用治具。   The jig for plating treatment according to any one of claims 1 to 5, wherein at least a part of the top portion of the contact member is subjected to a low friction treatment. 請求項1〜6のいずれか一項に記載のめっき処理用治具と、
前記カローセルを回転させる回転機構と、
を含むことを特徴とするめっき処理装置。
The jig for plating treatment according to any one of claims 1 to 6,
A rotation mechanism for rotating the carousel;
The plating apparatus characterized by including.
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Citations (7)

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JPH0841649A (en) * 1993-03-29 1996-02-13 Nippon Light Metal Co Ltd Surface treating device
JPH11209877A (en) * 1998-01-27 1999-08-03 Nippon Light Metal Co Ltd Plating device
JPH11256347A (en) * 1998-03-13 1999-09-21 Nippon Light Metal Co Ltd Rack device for plating disk to be plated and racking method
JP2001003177A (en) * 1999-06-18 2001-01-09 Mitsubishi Materials Corp Disk substrate plating device
JP2007169757A (en) * 2005-12-26 2007-07-05 Showa Denko Kk Tool for plating treatment
JP2011231347A (en) * 2010-04-23 2011-11-17 Showa Denko Kk Electroless plating device and magnetic rotation transmission mechanism

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6233776A (en) * 1985-08-06 1987-02-13 Nec Corp Work mounting device for surface treatment device
JPH0841649A (en) * 1993-03-29 1996-02-13 Nippon Light Metal Co Ltd Surface treating device
JPH11209877A (en) * 1998-01-27 1999-08-03 Nippon Light Metal Co Ltd Plating device
JPH11256347A (en) * 1998-03-13 1999-09-21 Nippon Light Metal Co Ltd Rack device for plating disk to be plated and racking method
JP2001003177A (en) * 1999-06-18 2001-01-09 Mitsubishi Materials Corp Disk substrate plating device
JP2007169757A (en) * 2005-12-26 2007-07-05 Showa Denko Kk Tool for plating treatment
JP2011231347A (en) * 2010-04-23 2011-11-17 Showa Denko Kk Electroless plating device and magnetic rotation transmission mechanism

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