JP7386862B2 - Substrate holding jig and plating processing equipment for plating processing - Google Patents

Description

The present invention relates to plating technology, and more particularly, to a substrate holding jig for plating and for immersing a disk-shaped substrate having a through hole in the center in a plating bath to form a plating film on the substrate. Related to plating processing equipment.

Magnetic recording media used in PCs and the like are in high demand due to their high convenience, and in recent years, efforts have been made to significantly improve recording density.
The market continues to demand higher recording densities for such magnetic recording media, and as a result, the disk-shaped substrates used in magnetic recording media are becoming thinner and smoother than ever before. There is a demand for high-quality substrates with high durability and few scratches.

As this disc-shaped substrate, for example, an aluminum alloy substrate or a glass substrate is used. Among these, aluminum alloy substrates are manufactured, for example, through the following steps. That is, first, an aluminum alloy plate with a thickness of about 1 to 3 mm is punched into a donut shape to form a substrate of desired dimensions. Next, after chamfering the edges of the punched substrate, grinding is performed using a grindstone, and then electroless NiP plating is applied to the surface of the substrate.

In electroless NiP plating, for example, as shown in Patent Document 1, a plurality of substrates are held in a plating treatment jig, and these substrates are immersed all at once into a plating bath. In addition, as disclosed in Patent Document 1, in order to efficiently form a plating film on the surface of a substrate, electroless NiP plating is performed on multiple substrates while rotating or revolving a plating jig. It is also known to apply

On the other hand, with the above-mentioned technology in which the plating processing jig is rotated or revolved within the plating bath, convex defects called nodules are generated on the substrate surface due to abrasion powder generated from the sliding parts of the jig. There is.
When these nodules are generated, the quality of the substrate is significantly degraded, so it is important to know how to suppress such nodules.

Regarding this point, for example, Patent Document 1 shows that by making the cross section of the groove into which the outer periphery of the substrate is fitted into a U-shape, it is possible to suppress nodules that tend to occur on the outer periphery of the substrate. There is.
Further, for example, in Patent Document 2, a spindle that is provided with a ring-shaped groove on the peripheral surface and arranged horizontally and that fits into the end of the inner periphery of the substrate, and a spindle that fits into the end of the inner periphery of the substrate and A surface treatment apparatus has been proposed that includes a weight bar having ring-shaped grooves on its circumferential surface having substantially the same pitch as the ring-shaped grooves of the spindle.
Furthermore, for example, in Patent Document 3, a disk is made up of a combination of a plurality of arc-shaped segments in which the bush is divided in the circumferential direction and a drive spring that is interposed between each segment and expands/contracts the bush in the radial direction. A jig for gripping a substrate is disclosed.

Japanese Patent Application Publication No. 2007-169757 Japanese Unexamined Patent Publication No. 7-90596 Japanese Patent Application Publication No. 2001-195730

However, the conventional plating processing jig described above has the following problems, and it can be said that there are still points to be improved.
That is, for example, in Patent Document 1, since the structure is such that a holding shaft grips the substrate from the outer circumferential side, it is difficult to increase the number of substrates to be held unless the size is increased, and it is difficult to plate a large number of substrates at once. His abilities are not high.

Further, for example, in Patent Document 2, since a spindle and a weight bar can be inserted into a center hole (hereinafter also referred to as an "inner hole") of a substrate, the number of substrates that can be accommodated per volume can be relatively large. However, if the weight bar collides with the edge of the center hole, the weight bar will be scraped and the generation of wear particles will be promoted, and there is a possibility that this wear powder will be incorporated into the plating film and generate nodules. can not deny.
Furthermore, in recent years, for example, substrates for HDDs have become thinner with the advent of multilayer drives, and it is necessary to assume that substrates with reduced thickness may sway during processing. Regarding this point, for example, substrates are sometimes moved in a plating bath for the purpose of uniform plating, and it can be said that in the configuration shown in Patent Document 2, contact between the substrates may occur.

Furthermore, in Patent Document 3, it may be possible to avoid contact between the substrates by firmly gripping the center hole of the disk substrate using a plurality of springs, but the structure of the jig is complicated in the first place, leading to high costs. I'll be there. Further, with the gripping jig having the structure shown in Patent Document 3, it is difficult to grip a relatively large amount of substrates at once, and it cannot be said that the gripping jig has high plating performance.

The present invention was made in view of solving such problems as an example, and it is possible to grip a relatively large number of substrates without the substrates coming into contact with each other in a plating bath, and yet has a simpler structure. An object of the present invention is to provide a substrate holding jig for plating processing and a plating processing apparatus that can suppress nodules generated when dust from the substrate or the jig is taken into the plating film.

In order to solve the above problems, a substrate holding jig for plating processing according to an embodiment of the present invention includes (1) a main body rod portion having an external length that can be inserted into the inner hole of a disk-shaped substrate along the axial direction; a movable piece that can move toward or away from the main body rod in a transverse direction intersecting the axial direction; and a moving mechanism that moves the movable piece in the transverse direction with respect to the main body rod. The movable piece has a first position that is close to the main body rod portion and can pass through the inner hole of the disc-shaped substrate together with the main body rod portion, and a first position that is outside the first position in the cross direction. and a second position where the outer length of the plating substrate holding jig is larger than the diameter of the inner hole of the substrate.

In the plating substrate holding jig described in (1) above, (2) the moving mechanism includes a limit section that defines a movement range of the movable piece in the intersecting direction, and the limit section It is preferable that the first position and the second position are respectively defined by the following.

Furthermore, in the plating substrate holding jig described in (2) above, (3) the moving mechanism includes an elastic member disposed between the movable piece and the main body rod portion, and the limit portion is attached to a flange. It is preferable that the cap member has a base end erected on the main body rod part so that the flange part moves in the intersecting direction inside the movable piece.

Further, in the plating substrate holding jig described in (3) above, (4) at least two sets of units each including the limit portion and the elastic member are provided in the axial direction of the main body rod portion. It is preferable.

Further, in the substrate holding jig for plating processing according to any one of (1) to (4) above, (5) the main body rod portion has a holding area that holds the disk-shaped substrate at predetermined intervals. and end regions disposed at both ends of the holding region, and the cross-sectional shape of the holding region in the intersecting direction and the cross-sectional shape of the end region in the intersecting direction are preferably different from each other.

Further, in the substrate holding jig for plating processing according to any one of (1) to (5) above, (6) a different number of the movable pieces are connected to the main body rod portion via the moving mechanism. Preferably, it is provided so as to be movable in the intersecting direction.
Further, in the substrate holding jig for plating processing according to any one of (1) to (6) above, (7) the main body rod portion and the movable piece hold the disc-shaped substrate at predetermined intervals. It includes a holding area for holding, and in the holding area, it is composed of a core material extending along the axial direction, and an exterior resin material that covers the outer surface of the core material and is capable of contacting the disk-shaped substrate. It is preferable that

Further, in the substrate holding jig for plating processing according to any one of (1) to (7) above, (8) the main body rod portion has holding areas that hold the disk-shaped substrate at predetermined intervals. and end areas disposed at both ends of the holding area so as to sandwich the holding area, and the moving mechanism includes a guide hole formed in one of the movable piece and the main body rod part, and a guide hole formed in one of the movable piece and the main body rod part, and and a guide pin formed on the other side of the main body rod portion and inserted into the guide hole, and it is preferable that the movable piece and the main body rod portion each have the end region.
In addition, in order to solve the above problems, a plating processing apparatus according to an embodiment of the present invention is (9) a plating processing apparatus that immerses a disc-shaped substrate in a plating solution in a plating bath, the plating processing apparatus including: a mounting part on which a plurality of disc-shaped substrates are placed side by side; a pair of shaft holding parts each capable of holding a substrate holding jig for plating processing according to any one of (1) to (8) above; The plating substrate holding jig is inserted into the inner hole of each of the plurality of disc-shaped substrates while the movable piece is maintained at the first position by one of the shaft holding parts, and , the movable piece is attached to the carousel in the second position.
In the plating processing apparatus described in (9) above, (10) the carousel has a jig mounting bearing member on which the plating substrate holding jig is mounted, and the jig mounting bearing member The member is formed with a vertical protrusion that is inserted between the movable piece and the main body rod part when the plating substrate holding jig is attached, and the vertical protrusion is inserted between the movable piece and the main body rod part. It is preferable that the movable piece and the main body rod portion be separated from each other by being inserted between the movable piece and the main body rod portion.
Further, in order to solve the above problems, a plating processing apparatus according to an embodiment of the present invention includes (11) a mounting section on which a plurality of disc-shaped substrates to be plated are placed side by side, and (1) to a guide bar that allows the plating substrate holding jig according to any one of (8) to be inserted into and taken out from the inner hole of each of the plurality of disk-shaped substrates, the guide bar being configured to hold the plating substrate The holding jig is characterized by having a tip for maintaining the movable piece at the first position.

According to the present invention, it is possible to hold a relatively large number of disk-shaped substrates and immerse them in a plating bath while suppressing nodule generation by reducing dust generation from substrates and jigs with a simpler structure. It is possible.

FIG. 1 is an external perspective view of a substrate holding jig for plating processing according to a first embodiment, and a view taken from a specific direction. FIG. 3 is a side view of the plating substrate holding jig when the movable piece is in the second position. FIG. 3 is a side view of the plating substrate holding jig when the movable piece is in the first position. It is a schematic diagram explaining the state transition of the movable piece in 1st Embodiment. It is a schematic diagram which shows the state transition of a movable piece seen from the edge part side. FIG. 2 is a schematic diagram of a substrate holding jig for plating processing in a state in which a disk-shaped substrate is held. FIG. 1 is an external perspective view schematically showing a plating processing apparatus in a first embodiment. 3 is a flowchart showing a method for holding a substrate holding jig for plating processing in the first embodiment. FIG. 7 is an external view schematically showing a substrate holding jig for plating processing in a second embodiment. FIG. 7 is an external view schematically showing a substrate holding jig for plating processing in a third embodiment. FIG. 7 is an external view schematically showing a substrate holding jig for plating processing in a fourth embodiment. It is an external view schematically showing a substrate holding jig for plating processing in a fifth embodiment. FIG. 7 is an external view schematically showing a substrate holding jig for plating processing in a sixth embodiment. FIG. 7 is a schematic diagram showing a state transition when a plating substrate holding jig according to a sixth embodiment is attached to a carousel. 7 is an external view schematically showing a substrate holding jig for plating processing in Modification 1. FIG. 7 is a schematic diagram showing a substrate holding jig for plating processing in Modification 2. FIG. 7 is a schematic diagram showing a substrate holding jig for plating processing in Modification 3. FIG. It is a schematic diagram which showed the other example of a structure in cam mechanism Cm. FIG. 7 is an external view schematically showing a plating substrate holding jig in Modification 4. FIG.

Embodiments for implementing the present invention will be described below. In the drawings used in the following explanation, for convenience, the axial direction in which the plating substrate holding jig extends is referred to as AD, and the direction intersecting this axial direction AD (radial direction in this embodiment) is referred to as RD. It is set. However, these directions are set solely for the purpose of clarifying the explanation, and should not be interpreted as unduly limiting the present invention.

≪First embodiment≫
<Substrate holding jig for plating process 100A>
First, the configuration of the plating substrate holding jig 100A in the first embodiment will be described with reference to FIGS. 1 to 6 as appropriate.
As shown in FIG. 1 and the like, the plating processing substrate holding jig 100 in this embodiment is inserted into the inner hole 1a of the disc-shaped substrate 1, and holds the plurality of disc-shaped substrates 1 in the plating solution in the plating bath. It has a immersion function. There are no particular limitations on the material of such a substrate holding jig 100 for plating processing, and for example, known metal materials, ceramics, synthetic resin materials, etc. can be used as the main material. It is preferable to use a material that has high chemical resistance against acids and alkalis, and the material should be selected with a balance in view of wear resistance, electrical insulation, mechanical strength, workability, etc. can do. In addition, from the viewpoint of workability, it is preferable to select the synthetic resin material or metal material as the main material among the above-mentioned materials. More specifically, as the above-mentioned synthetic resin, for example, any one of polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), and/or a mixed material thereof can be used. Moreover, as the above-mentioned metal material, stainless steel (SUS) and titanium (Ti) can be used, for example. In addition, the plating substrate holding jig 100 of this embodiment does not necessarily need to be made of a single material; for example, the core material is a metal material (SUS, etc.) and the disc-shaped substrate 100 is not necessarily made of a single material. The contact portion may be made of a composite material such as the above-mentioned synthetic resin material.

The disc-shaped substrate 1 suitable for this embodiment is a disc-shaped member made of a metal material such as glass or aluminum and having a circular through hole (inner hole) at the center. Such a disk-shaped substrate 1 has a thickness of, for example, about 0.3 mm to 2.0 mm, and generally has a diameter of about 2.0 mm. For substrates larger than 5 inches, aluminum substrates are mainly used, and for substrates smaller than 2.5 inches, glass substrates are mainly used.

Among these, for the aluminum disk-shaped substrate 1, for example, a substrate punched from an aluminum material is subjected to the necessary pretreatment, and then subjected to electroless plating treatment using a Ni-P plating solution, which will be described later, to coat the surface with Ni-P. A magnetic recording disk substrate is formed by forming an alloy film and further laminating a ferromagnetic metal thin film thereon.

As shown in FIGS. 1 to 4, the plating substrate holding jig 100A includes at least a main body rod portion 10A, a movable piece 20A, and a moving mechanism 30.
The main body rod portion 10A is a rod-shaped member that is provided with a recessed area in which a movable piece 20A (described later) is arranged, and has an external length that can be inserted into the inner hole 1a of the disc-shaped substrate 1 along the axial direction. be. The main body rod portion 10A has end regions ER provided at both ends thereof, and a holding region SR arranged between the end regions ER. In other words, the main body rod portion 10A of this embodiment includes a holding region SR that holds the disc-shaped substrate 1 at predetermined intervals, and end regions ER arranged at both ends of the holding region SR. has been done.

The end region ER is a region that comes into contact with a jig mounting bearing member (not shown) when being mounted on the carousel C shown in FIG. 7, for example, and is also a region that is placed on a support stand (not shown) or the like This is the area that comes into contact with the support stand when the disc-shaped substrate 1 is being held, so that it is possible to support the disc-shaped substrate 1 so that it does not come into contact with the ground. Further, as will be described later, the end region ER may also be a part that comes into contact with the robot hand of the plating processing apparatus when the hand grips the plating substrate holding jig.
As described later, in each embodiment of the present invention, the main body rod portion 10 and the movable piece 20 may each have the above-described end region ER.
In this embodiment, the end region ER has the same external length as the holding region SR, which will be described later, and has a cylindrical shape with a circular cross section and a hollow interior, as described later. There is. Note that the outer lengths of the end region ER and the holding region SR may be the same as in this embodiment, but they may also be different, and the outer length of the end region ER may be determined for positioning when the carousel is mounted. It is preferable to be different from the viewpoint of ease of use.

Here, the "outer length" in this embodiment refers to the longest part of the radial length of the outermost circumference of the plating substrate holding jig. Furthermore, the cross-sectional shape of the plating substrate holding jig in the disk mounting direction may be a perfect circle, square, ellipse, or asymmetrical shape, and this cross-sectional shape is not particularly limited. Therefore, if the cross-sectional shape of the plating substrate holding jig is circular, the length in the radial direction is almost uniform, so in this case, the above-mentioned "outer length" means its outer diameter. I will do it. In the following description, the case where the cross-sectional shape of the plating substrate holding jig is circular will be described, so unless otherwise specified, "outer length" will be referred to as "outer diameter."

The holding region SR is set to be, for example, twice or more larger than the end region ER in the axial direction AD. In this holding region SR, a moving mechanism 30, which will be described later, is installed, and a first accommodation groove G1 and a second accommodation groove G2 are also formed.
Regarding the arrangement relationship between the moving mechanism 30, the first accommodation groove G1, and the second accommodation groove G2, as is clear from FIG. The first accommodation groove G1 is arranged inside the housing, and the second accommodation groove G2 is arranged on the innermost side.

As described above, the first housing groove G1 is arranged outside (on the end side) of the second housing groove G2. This first accommodation groove G1 is configured to have a function of accommodating a dummy substrate (not shown). In other words, the plating substrate holding jig 100A of this embodiment has a function of holding dummy substrates on both sides of the plurality of disk-shaped substrates 1.

Here, the dummy substrate refers to a substrate that has almost the same external shape as the disk-shaped substrate 1 but is not used as a product. Since the outermost substrate held by the plating substrate holding jig 100A is exposed to the strongest liquid flow in the plating bath, the plating film formed on the substrate is also difficult to be uniform. For these reasons, it is preferable to mount a dummy board in this embodiment, but it is not always essential and the dummy board may not be provided.

Therefore, in this embodiment, by allocating a dummy substrate to the above-mentioned outermost substrate, it is possible to improve the quality of the plating film formed on the disc-shaped substrate 1 that becomes the product. In this embodiment, a total of two first accommodation grooves G1 are arranged on both sides of the second accommodation groove G2, but the present invention is not limited to this, and two or more first accommodation grooves G1 may be arranged on both sides. .

The second accommodation groove G2 is a groove for accommodating the disk-shaped substrate 1, and a plurality of second accommodation grooves G2 are provided at predetermined intervals in the axial direction AD within the holding region SR. Note that the second accommodation groove G2 may have a shape different from the first accommodation groove G1 in, for example, the depth of the groove and the angle of the slope connected to the bottom, or may have the same shape.

The movable piece 20A is configured to be able to approach or move away from the above-described main body rod portion 10A in an intersecting direction (radial direction RD in this embodiment) intersecting the axial direction.
More specifically, the movable piece 20A in this embodiment is located at a first position P1 (FIGS. 3 and 4 ), and a second position P2 (see Fig. 2 and FIG. 4).

In this embodiment, it is preferable that a tapered portion 20t is formed at at least one end of the movable piece 20A. This tapered portion 20t has a function of guiding the cylindrical body 150c, which will be described later, when it is inserted, so that the movable piece 20A can be moved by the cylindrical body 150c to the first position without being hit by the cylindrical body 150c. moved to position. Further, there is no particular restriction on the form of the tapered portion 20t, and various shapes as shown in the drawings are exemplified as long as the above function can be achieved.

The moving mechanism 30 is configured to have a function of moving the movable piece 20A described above relative to the main body rod portion 10A in the above-described intersecting direction (radial direction RD in this embodiment).
As is clear from FIGS. 1(b), 2, and 4, the moving mechanism 30 in this embodiment includes a limit portion 31 and an elastic member 32. As shown in the figure, in this embodiment, two units each including a limit portion 31 and an elastic member 32 are provided in the axial direction AD of the main body rod portion 10A. It is preferable that one set of the unit consisting of the limit portion 31 and the elastic member 32 is provided, but an arbitrary number of three or more sets may be provided. Further, the limit portion 31 and/or the elastic member 32 may be provided not only as a unit but also in an arbitrary number.

The limit portion 31 has a function of defining a movement range of the movable piece 20A in the radial direction RD. This limit portion 31 defines the second position P2 of the movable piece 20A.
More specifically, as shown in FIGS. 1(b) and 4, a specific example of the limit portion 31 of this embodiment is a shade member having a flange portion F. As such a cap member, for example, screws, rivets, etc. are preferable.

As shown in FIG. 4, the cap member serving as the limit part 31 of this embodiment has its base end fixed to the main body rod part 10A, and its upper part including the flange part F accommodated in the recess 21 formed in the movable piece 20. ing. In this embodiment, the cap member serving as the limit part 31 has its base end standing up against the main body rod part 10A so that the flange part F moves in the radial direction RD inside the movable piece 20A (inside the recess 21). It is set up.
Note that, as shown in FIG. 4, a reference hole sh is provided in the main body rod portion 10A so as to correspond to the recessed portion 21. This facilitates positioning of the recess 21 and the limit portion 31 when assembling the main body rod portion 10A and the movable piece 20A.

When the movable piece 20A is in the first position P1, the flange part F moves relatively upward within the recess 21 of the movable piece 20A, and when the movable piece 20A is in the second position P2, the flange part F contacts the bottom of the recess 21 and becomes caught. Considering the functional aspect of the second position P2, the "second position P2" in this embodiment is located outside the first position P1 in the radial direction and is movable with the main body rod portion 10A. In other words, the position is such that at least one of the pieces 20A is in contact with the inner hole 1a of the disc-shaped substrate 1 and can hold the disc-shaped substrate 1. Furthermore, in other words, considering the state at the second position, the "second position P2" in this embodiment is located outside the first position P1 in the radial direction, and is located at the plating substrate holding jig 100. It can also be said that the position is such that the circumscribed circle of the outer diameter is larger than the diameter of the inner hole 1a of the disc-shaped substrate 1.

For example, as shown in FIG. 4, the elastic member 32 is arranged between the movable piece 20A and the main body rod portion 10A. More specifically, recesses 22 are formed in opposing surfaces of the main body rod portion 10A and the movable piece 20A, and a space for accommodating the elastic member 32 is formed by the pair of recesses 22 facing each other.

The elastic member 32 acts to separate the movable piece 20A from the main body rod portion 10A. As described above, in this embodiment, the limit portion 31 defines the separation limit of the movable piece 20A, so the reference state is such that the movable piece 20A is set to the second position P2 by the action of the elastic member 32. ing.

In this embodiment, a coil spring is used as the elastic member 32, but there is no particular restriction as long as it can exhibit the above-mentioned effect, and other known elastic materials such as rubber may also be used as the elastic member 32. good.
Further, in the moving mechanism 30 of the present embodiment, the limit portion 31 is disposed on the outside in the axial direction AD compared to the elastic member 32, but the present invention is not limited to this aspect. may be disposed on the outside in the axial direction AD.

<State transition of movable piece 20A>
Next, a mode in which the plating substrate holding jig 100A of this embodiment is inserted into the disk-shaped substrate 1 and holds the substrate will be described using FIGS. 5 and 6.
That is, first, as shown in FIG. 5(a), when the movable piece 20A is at the first position P1, the outer diameter (outer length) of the plating substrate holding jig 100A is D3 (see FIG. 3). It has become.

The size of this outer diameter D3 (outer length) is smaller than the diameter of the inner hole 1a of the disc-shaped substrate 1.
Therefore, for example, if this state is maintained by a mechanism such as a robot hand as described later, the plating substrate holding jig 100A can smoothly pass through the inner holes 1a of the plurality of disc-shaped substrates 1.

Next, the plating substrate holding jig 100A is inserted into the inner holes of a predetermined number of disc-shaped substrates 1 and the dummy substrate, and then gripped by a known gripping mechanism such as a robot hand, the guide bar is separated, and the carousel is assembled. Install it on C. Then, as shown in FIG. 5(b), the movable piece 20A moves to take the second position P2 with respect to the main body rod part 10A due to the action of the limit part 31 and the elastic member 32, and the above-mentioned dummy board and The disk-shaped substrate 1 is held and accommodated in the first accommodation groove G1 and the second accommodation groove G2 in the holding area SR, respectively (see FIG. 6).

At this time, as shown in the figure, when the movable piece 20A is at the second position P2, the outer diameter (outer length) of the plating substrate holding jig 100A is D2 (see FIG. 2). The size of this outer diameter (outer length) D2 is set to be larger than the diameter of the inner hole 1a of the disc-shaped substrate 1. Further, the outer diameter (outer length) D2 is configured to be larger than the outer diameter of the end region ER of the main body rod portion 10A.

At this time, as shown in FIG. 5(b), the inner hole 1a of the disc-shaped substrate 1 is in contact with the second accommodation groove G2 on the movable piece 20A side. In other words, in this embodiment, when the disc-shaped substrate 1 is accommodated and held in the plating substrate holding jig 100A (at the time of housing and holding the substrate), at least the movable piece 20A is inserted into the inner hole 1a of the disc-shaped substrate 1. It is sufficient that one of the main body rod portions 10A is in contact with the other (this aspect is referred to as one-point contact or upper contact).

In addition, by adjusting the movement range (width D1 of the clearance) of the movable piece 20A in the radial direction RD by the limit part 31, the second accommodation groove G2 of both the movable piece 20A and the main body rod part 10A can be adjusted when the substrate is housed and held. may be in a mode (also referred to as two-point contact or upper and lower contact) in which the inner hole 1a of the disc-shaped substrate 1 comes into contact with the inner hole 1a. As a result, the wobbling of the disc-shaped substrates 1 is more suppressed than in the case of one-point contact or top contact, so it is better possible to prevent the disc-shaped substrates 1 from coming into contact with each other even in the plating bath. Ru. In addition, it is preferable that the size of the circumscribed circle at the deepest part (bottom) of the accommodation groove at the second position P2 is smaller than the inner hole 1a of the disc-shaped substrate 1. In addition, when the accommodation groove contacts the inner hole 1a of the disc-shaped substrate 1 at two or more points such as two-point contact (or upper and lower contact), the clearance is such that the disc-shaped substrate 1 can rotate in the plating solution. It is preferable to have between the substrate and the groove. That is, the disc-shaped substrate 1 in the plating solution may have a structure in which the number of contact points changes during rotation.

<Plating processing apparatus 200>
Next, the plating processing apparatus 200 of this embodiment, a substrate holding method using this apparatus, and a plating processing method will be described in detail with reference to FIGS. 7(a) and 8.
First, as shown in FIG. 7A, the plating processing apparatus 200 is a plating processing apparatus that immerses a disc-shaped substrate in a plating solution in a plating bath, and includes at least a mounting section 110 and a shaft holding section 120. , further includes a grip part 130 and a lifter part 140.

The mounting section 110 is a member on which a plurality of disk-shaped substrates 1 before plating are placed side by side.
As is clear from the figure, the mounting section 110 is capable of mounting the disc-shaped substrate 1 and/or the dummy substrate in an upright state (inner hole facing sideways) with a predetermined gap therebetween. A housing groove portion is formed as shown in FIG. Note that the predetermined gap between the disk-shaped substrates 1 described above is set to a size corresponding to the first accommodation groove G1 and the second accommodation groove G2.

As shown in FIG. 7(a), a total of two shaft holding parts 120 are arranged at both ends of the plating substrate holding jig 100A. These pair of shaft holding parts 120 have the function of gripping the end side of the plating substrate holding jig 100A under the control of a control device (not shown), and the function of holding the gripped plating substrate holding jig 100A in a carousel. It has the function of being attached to C.
As a specific example of such a shaft holding part 120, a known gripping mechanism such as a robot hand may be applied.

The gripping section 130 is configured to have a function of gripping the outer peripheral surface of the disk-shaped substrate 1 and/or the dummy substrate from both sides. This makes it possible to collectively grip a plurality of disk-shaped substrates 1 and/or dummy substrates placed on the placing section 110.

The lifter part 140 has both a vertical movement function of moving the grip part 130 along the vertical direction and a horizontal movement function of moving the grip part 130 along the horizontal direction, using a known power source such as an electric motor. Note that the vertical movement function and the horizontal movement function may be separated. This makes it possible to move a plurality of disc-shaped substrates 1 and/or dummy substrates to an arbitrary location, such as between a pair of shaft holding parts 120, while holding a plurality of disk-shaped substrates 1 and/or dummy substrates at once with the gripping part 130. ing.

The guide bar 150a is a member for inserting the plating substrate holding jig 100A into the inner hole of the plurality of upright disc-shaped substrates 1 and/or dummy substrates. The guide bar 150a is configured to be movable forward and backward with respect to the inner holes of the plurality of disc-shaped substrates 1 and/or dummy substrates set upright by a known drive mechanism.

As will be described later, the guide bar 150a performs an operation in which it is first inserted into the inner hole and then pulled out from the inner hole. When the guide bar 150a leaves the inner hole, it is accompanied by the plating substrate holding jig 100A, so that the plating substrate holding jig 100A is inserted into the inner hole in a seamless manner.
At this time, the guide bar 150a may have a function of maintaining the outer diameter of the plating substrate holding jig 100A such that it passes through the inner hole of the disc-shaped substrate 1. For example, the tip of the guide bar 150b shown in FIG. 7(b) is made into a cylindrical body 150c with an open end, and one end (the side that contacts the guide bar) of the plating substrate holding jig 100A is placed in the first position P1. It may also be inserted into the cylindrical body 150c. With this configuration, the movable piece 20A of the plating substrate holding jig 100A can be maintained at the first position P1.
Although not shown in the present embodiment, the carousel C may have a known shape in which, for example, a C-shaped bearing member (not shown) for mounting a jig is provided.

Next, a method for holding a substrate in the plating substrate holding jig of this embodiment will be described with reference to FIG. 8 as well.
First, in step 1, a plurality of disk-shaped substrates 1 before plating are placed side by side on the placing section 110 by a supply mechanism (not shown). At this time, as is clear from FIG. 7, the plurality of disc-shaped substrates 1 and/or dummy substrates are arranged side by side in an upright state.

Next, in step 2, the outer periphery of the disk-shaped substrate 1 and/or the dummy substrate is gripped. More specifically, the outer peripheries of the disk-shaped substrates 1 and/or dummy substrates juxtaposed on the mounting section 110 are gripped by the gripping section 130 . Further, in this step, the lifter section 140 lifts up the disk-shaped substrate 1 and/or the dummy substrate while the grip section 130 grasps the outer periphery of the substrate.
Thereby, the inner holes of the plurality of disc-shaped substrates 1 and/or dummy substrates are lined up linearly so that the guide bar 150 can be inserted.
Note that in the state of step 2, the disc-shaped substrate 1 and/or the dummy substrate held by the gripping part 130 are positioned in front of the carousel C, and the plating substrate holding jig 100A has not yet been inserted into the inner hole. It is now waiting on the side.

In step 3, the grip region GR (see FIG. 1) on the non-insertion side of the movable piece 20A is gripped. More specifically, of the pair of shaft retainers 120 shown in FIG. 7, the shaft retainer 120 on the right side in the paper (the right side is the non-insertion side because the guide bar 150 is disposed on the left side) allows the grip region GR to be be gripped. As a result, the movable piece 20A is drawn toward the main body rod portion 10A, and the movable piece 20A is positioned at the first position P1.

In addition, in step 4, the outer side of the non-inserted side of the board group (see FIG. 7 In this case, the plating substrate holding jig 100A is placed on standby (to the right of the right shaft holding part 120). At this time, the end hole 10h (see FIG. 1) of the plating substrate holding jig 100A is positioned to face the inner hole of the substrate group.

Therefore, after reaching step 4, while the gripping portion 130 grips the outer periphery of each substrate group, when the guide bar 150 is inserted from the insertion side, the end hole of the plating substrate holding jig 100A is inserted. It is possible to insert up to 10 hours.
Note that at least a portion of steps 2 to 4 described above may be executed in parallel, or steps 2 and 3 may be executed in the reverse order. Furthermore, if the plating substrate holding jig 100A is placed at a location that matches the direction of movement of the guide bar 150, step 4 may be omitted.

Next, in step 5, while inserting the guide bar 150 into the inner hole of the substrate group from the insertion side (the side where the plating substrate holding jig 100A is not arranged, in the case of FIG. 7, the left side of the paper), The tip of the guide bar 150 is inserted into a part (end hole 10h) of the plating substrate holding jig 100A.

In the subsequent step 6, the plating substrate holding jig 100A is inserted into the inner hole of the substrate group in conjunction with the guide bar 150 while pulling out the guide bar 150. As described above, after step 5, the tip of the guide bar 150 and the end hole 10h of the plating substrate holding jig 100A are integrated. Therefore, when the guide bar 150 is pulled out from the inner hole of the substrate group, the plating substrate holding jig 100A that interlocks with the guide bar 150 can also be seamlessly inserted into the inner hole of the substrate group. There is. At this time, the movable piece 20A is maintained at the first position P1 by the shaft holding part 120, or the first position P1 is maintained by the guide bar 150.
In this embodiment, the movable piece 20A maintains the first position P1 by one of the shaft holding parts 120, and moves into a plurality of disk shapes in conjunction with the pulling operation of the guide bar 150 from the inner hole described above. A plating substrate holding jig 100A is inserted into each inner hole of the substrate.

In this embodiment, the guide bar 150 is used as an auxiliary when inserting the plating substrate holding jig 100A into the inner hole of the substrate group, but the guide bar 150 is not necessarily essential and may be omitted as appropriate. You can.
Continuing in step 7, the pair of shaft pressers 120 is driven to mount the plating substrate holding jig 100A on the carousel C while gripping the grip region GR of the movable piece 20A in step 3. At this time, for example, the pair of shaft holding parts 120 may grip the end region ER of the plating substrate holding jig 100A. Further, in step 7, the lifter section 140 may be retracted as appropriate. After the plating substrate holding jig 100A is attached to the carousel C, the holding by the shaft holding part 120 is released, and the movable piece 20A can be placed in the second position P2.

Therefore, in step 7, with the movable piece 20A at the first position P1, the plating substrate holding jig 100A holding the plurality of disc-shaped substrates 1 is attached to the carousel C by the pair of shaft holding parts 120. The specified action is executed.
Note that in this embodiment, the movable piece 20A is attached to the carousel C in a state where it is in the first position P1, but the position of the movable piece 20 may be changed from the first position P1 to the second position P2. It may also be configured to be attached to the carousel C after it is brought into a state where it is.

Then, in step 8, it is determined whether the planned number of sheets has been installed in the carousel C. If the planned number of sheets is not yet, the process from step 1 is executed again, and if the planned number has been reached, the installation process is completed. Carousel C is moved into the plating pretreatment tank, plating bath, and washing/drying tank.
The plating bath suitable for this embodiment is a metal or resin bath having a size that can accommodate one or more carousels C. The plating pretreatment tank can be used for degreasing, acid etching, desmutting, 1st zincate, dezincate, and 2nd zincate. As the plating bath, for example, the bathtub disclosed in the above-mentioned patent documents and other known electroless plating bathtubs can be used. The plating solution stored in the plating bath in this embodiment can be a known Ni-P plating solution, such as nickel sulfate: 20 g/dm ³ , sodium hypophosphite: 20 g/dm ³ , Examples include an aqueous solution containing 10 g/dm ³ of sodium acetate and 10 g/dm ³ of sodium citrate. In addition, it can be used for washing with water and drying between each step, and from the viewpoint of improving productivity, it is preferable to use the present invention in all steps, but it may be used only in some steps.

According to the plating substrate holding jig 100A and the plating processing apparatus 200 in this embodiment described above, when the movable piece 20A is in the first position P1, the inner holes 1a of the plurality of disc-shaped substrates 1 are plated. When the processing substrate holding jig 100A can be inserted and the movable piece 20A is at the second position P2 via the moving mechanism 30, the substrates can be held at as few contact points as possible while suppressing contact between the substrates. Can hold the substrate.
As a result, even if substrates become thinner and become extremely thin (for example, 0.635 mm, 0.6 mm, 0.5 mm, or 0.38 mm thick), shaking of the substrate can be suppressed. This makes it possible to immerse a relatively large number of substrates in the plating bath while suppressing the generation of nodules from the substrates and jigs.

≪Second embodiment≫
<Substrate holding jig 100B for plating process>
Hereinafter, a substrate holding jig 100B for plating processing according to the second embodiment will be explained using FIG. In the following description, components having functions and effects common to those of the first embodiment will be given the same reference numerals, and the description thereof will be omitted as appropriate. (The same applies to)

In the first embodiment described above, the moving mechanism 30 includes the limit section 31 and the elastic member 32. On the other hand, in this embodiment, as shown in FIG. 9, the main body rod part 10B and the movable piece 20B have a pair of inclined surfaces 13a and 23a that slide while being in relative contact with each other. The feature is that the movable pieces 20B approach or separate from each other.

That is, as shown in FIG. 9A, when the movable piece 20B is positioned at the first position P1, the outer diameter of the plating substrate holding jig 100B becomes D3 (outer length). In this state, similarly to the first embodiment, the plating substrate holding jig 100B can be inserted into the inner hole of the substrate group.
Further, a reference end 13b is formed at the end of the inclined surface 13a of the main body rod portion 10B, and a reference end 23b is formed at the end of the inclined surface 23a of the movable piece 20B. The size of the above-mentioned outer diameter D3 (outer length) is specified.

On the other hand, as shown in FIG. 9(b), when the outer diameter (outer length) of the plating substrate holding jig 100B is D2, in other words, when the movable piece 20B is positioned at the second position P2, A locking hook 31b (one form of the limit section 31) provided upright on the inclined surface 13a at the end (both ends in this example) of the main body rod section 10B is inserted into the insertion groove 31z of the movable piece 20B. Thereby, even when the movable piece 20B is at the second position P2, the movable piece 20B is prevented from being largely separated from the main body rod portion 10B in the radial direction RD.

Note that when attaching the movable piece 20B to the main body rod portion 10B, a cutout 23d is provided in a part of the inclined surface 23a of the movable piece 20B so as to ensure the state shown in FIG. 9(a).
Further, the main body rod portion 10B and the movable piece 20B that constitute the plating substrate holding jig 100B can be formed by, for example, cutting or a known method capable of three-dimensional modeling such as a 3D printer.

According to the plating substrate holding jig 100B of the second embodiment described above, the movable piece 20B can be moved relative to the main body rod portion 10B without using the elastic member 32. Thereby, the same effects as in the first embodiment can be achieved, and furthermore, according to the present embodiment, it is possible to omit operations such as replacement of the elastic member due to deterioration over time.

<Plating processing apparatus 200>
Next, the plating processing apparatus 200, a substrate holding method using this apparatus, and a plating processing method in this embodiment will be described in detail. Note that descriptions of points that overlap with the first embodiment will be omitted, and only portions that are different from the first embodiment will be described.

In this embodiment, the guide bar 150a is similar to the first embodiment in that it is first inserted into the inner hole 1a of the disc-shaped substrate 1 and then pulled out from the inner hole 1a, but the movable piece 20 The mode of transition from the first position P1 to the second position P2 is different.
That is, in the plating processing apparatus 200 according to the present embodiment, as a function of maintaining the external length of the plating processing substrate holding jig to the extent that it passes through the inner hole 1a of the disc-shaped substrate 1, for example, the plating processing substrate holding jig 100B is used. After the movable piece 20B is inserted into the inner hole 1a, the movable piece 20B is pushed in the direction of movement, thereby transitioning the movable piece 20B to the second position P2 (see also FIG. 9, and the same applies to FIG. 10). can do.

Alternatively, in the form of the movable piece 20D shown in FIG. The transition can be made using a robot hand or the like so that the transition occurs.
In this embodiment, the plating substrate holding jig 100 can be attached to the plating apparatus 200 by moving the movable piece 20 to the second position P2 and then placing it on the carousel C. becomes.

≪Third embodiment≫
<Substrate holding jig for plating process 100C>
Hereinafter, a plating processing substrate holding jig 100C according to the third embodiment will be described using FIG. 10. In the second embodiment described above, the locking hook 31b is integrally formed with the main body rod portion 10B. In contrast, the present embodiment is characterized in that a pair of detachable locking hooks 31c (one form of the limit section 31) are provided on the inclined surface 13a of the main body rod section 10C.

The locking hook provided on the inclined surface of the main body rod portion in this way is not limited to the form in which it is formed integrally with the main body rod portion, but the main body rod portion and the locking hook may be formed as separate bodies as in this embodiment. may be configured. Further, in this embodiment, the locking hooks may be configured in a pair (two), or may be configured in any number of three or more, or a single locking hook (in the second embodiment (same as well).

≪Fourth embodiment≫
<Substrate holding jig 100D for plating process>
Hereinafter, a substrate holding jig 100D for plating processing according to a fourth embodiment will be described using FIG. 11. In the second and third embodiments described above, the main body rod portion and the movable piece constituted one end and the other end of the plating substrate holding jig, respectively.

In contrast, in this embodiment, the main body rod portion 10D constitutes both one end and the other end of the substrate holding jig for plating processing, and the movable piece 20D is buried in the recess 13e of the main body rod portion 10D. It is characterized by the fact that it is
According to this aspect, compared to the plating substrate holding jigs 100A to 100C of each of the embodiments described above, the plating substrate holding jig 100 can be stably supported without changing its overall length in the axial direction AD. etc. are now possible.
Further, in order to maintain the state shown in FIG. 11(b), that is, the second position P2, a spacer (not shown) or the like may be inserted into the space of the recess 13e.

≪Fifth embodiment≫
<Substrate holding jig 100E for plating process>
Hereinafter, a plating processing substrate holding jig 100E according to a fifth embodiment will be described using FIG. 12. In each of the embodiments described above, the members in the holding region SR were made of resin (for example, PEEK resin). On the other hand, the main feature of this embodiment is that the holding region SR in at least one of the main body rod portion 10 and the movable piece 20 is made of a plurality of different materials. Furthermore, this embodiment is also characterized in that, instead of or in addition to the configuration of the holding region SR, the configuration arrangement in the pair of end regions ER (both ends) is configured to be different from each other.

That is, as understood from FIG. 12, the plating substrate holding jig 100E includes a main body rod portion 10E and a movable piece 20E. The plating substrate holding jig 100E also includes a holding area SR for holding the disc-shaped substrate 1 at predetermined intervals, and a first end area ER1 and a second end area ER2 sandwiching this holding area SR. It is composed of:

Regarding this holding region SR, each of the main body rod portion 10E and the movable piece 20E has a core material IM extending along the axial direction AD, and can contact the disk-shaped substrate 1 by covering the outer surface of the core material IM. It is composed of an exterior resin material OR. In this embodiment, the main body rod portion 10E and the movable piece 20E are each made of a composite material (the above-mentioned core material IM and exterior resin material OR), but if the strength of the core material IM is adjusted, the main body can be formed as described above. At least one of the rod portion 10 and the movable piece 20 may be made of a composite material.

The core material IM is made of a known metal material or ceramic, such as SUS (stainless steel material) or surface-treated aluminum material. The core material IM of this embodiment has higher strength than the exterior resin material OR. Moreover, the core material IM is arranged inside the respective exterior resin materials OR so that the core material IM of the main body rod portion 10E and the core material IM of the movable piece 20E face each other. Although the length of the core material IM in the axial direction AD is set to be approximately the same as that of the exterior resin material OR, the length of the core material IM in the axial direction AD is not limited to this, for example, the length of the core material IM in the axial direction AD is set to be shorter than that of the exterior resin material OR. They may have different lengths.

Moreover, the core material IM of this embodiment extends along the axial direction AD so that its width (length in the radial direction perpendicular to the axial direction) is uniform. However, the core material IM of the present embodiment is not limited to the above example, and extends so that the width changes along the axial direction AD, for example, the above-mentioned width increases toward the center of the holding region SR. Good too.

The exterior resin material OR is configured to cover the outer surface of the above-mentioned core material IM so as to be able to come into contact with the disc-shaped substrate 1. As the material of such an exterior resin material OR, a known resin material such as PEEK can be used, for example. Moreover, as shown in FIG. 12, the exterior resin material OR and the core material IM can be separated into respective sets.

More specifically, in one set of the exterior resin material OR and the core material IM, a connection hole 33a is formed between the exterior resin material OR and the core material IM, and a known connection such as a screw is formed inside this connection hole 33a. A member 33c is provided. Furthermore, in the other pair of exterior resin material OR and core material IM, the pair of exterior resin material OR and core material IM are connected via the connecting hole 33b and the connecting member 33d in the same manner as described above.
As a result, in the holding region SR, the above-mentioned pair of exterior resin material OR and core material IM are connected to each other, and one pair of exterior resin material OR and core material IM is connected to the other exterior resin material OR. The set of core material IM can be separated.

As shown in FIG. 12, the plating substrate holding jig 100E of this embodiment includes a pair of end regions (a first end region ER1, a second end region ER2) sandwiching the holding region SR. It consists of Moreover, as shown in each of the embodiments described above, in this embodiment as well, the moving mechanism 30 includes an elastic member 32 disposed between the movable piece 20E and the main body rod portion 10E, and a direction in which the movable piece 20E crosses and a limit section 31 that defines a movement range.

Furthermore, in the plating substrate holding jig 100E of this embodiment, an end hole 10h into which the guide bar 150a can be inserted is formed on the end surface of the first end region ER1. Furthermore, an accommodation hole 24 is formed in the movable piece 20E so as to be continuous with the end hole 10h and accommodate the tip of the guide bar 150a.

As shown in FIG. 12, for example, when the guide bar 150a is inserted into the end hole 10h and the accommodation hole 24, the tapered end portion of the guide bar 150a pushes up the accommodation hole 24 in the radial direction RD, so that the above-mentioned pair The main body rod portion 10E and the movable piece 20E move toward each other. On the other hand, for example, when the guide bar 150a is pulled out from the end hole 10h and the accommodation hole 24, the above-mentioned pair of main body rod portions 10E and movable piece 20E are separated from each other with a predetermined clearance due to the action of the elastic member 32. Become.
In order to facilitate understanding of the present embodiment, for convenience of explanation, the lower side of FIG. 33c and 33d are not shown.

At this time, in this embodiment, the arrangement of the elastic member 32 and the limit part 31 in one end region (first end region ER1) is different from that of the elastic member 32 in the other end region (second end region ER2). The arrangement is different from that of the limit section 31.
More specifically, in the present embodiment, in the first end region ER1, the limit portion 31 is disposed farther from the holding region SR than the elastic member 32, while in the second end region ER2, the limit portion 31 is disposed farther from the holding region SR. The elastic member 32 is located further away from the holding region SR than the elastic member 31 is.

By configuring the arrangement of the limit part 31 and the elastic member 32 to be different from each other in one end region and the other end region, the above-mentioned clearance in the holding region SR can be maintained at a substantially constant width along the axial direction AD. It is now possible to do so.
Note that in this embodiment, the limit portion 31 is disposed outside the elastic member 32 at the end on the side where the accommodation hole 24 is formed, but the present invention is not limited to this configuration. The elastic member 32 may be disposed outside the limit portion 31 at the end portion of the elastic member 32 .

As mentioned above, as long as the above-described clearance is stable (for example, not extremely narrow) along the axial direction AD, the above-described first end region ER1 and second end region ER2 will have the same arrangement. Alternatively, a limit portion 31 and an elastic member 32 may be provided.
According to the present embodiment described above, similarly to each of the above-described embodiments, a relatively large number of disc-shaped It becomes possible to hold the substrate and immerse it in the plating bath. Furthermore, in this embodiment, when a different material is used in the holding region SR, its strength can be increased, and the above-described clearance can be stabilized along the axial direction AD.

≪Sixth embodiment≫
<Substrate holding jig 100F for plating process>
Hereinafter, a substrate holding jig 100F for plating processing according to a sixth embodiment will be described using FIGS. 13 and 14. In each of the embodiments described above, the limit portion 31 and the elastic member 32 control the proximity/separation state of the movable piece 20 with respect to the main body rod portion 10. On the other hand, the plating substrate holding jig 100F of this embodiment is not equipped with the limit portion 31 and the elastic member 32, and the plating substrate holding jig 100F is attached to a member (for example, carousel C). The main feature is that the movable piece 20 cooperates with the main body rod portion 10 to control the approach/separation state in the radial direction RD.

That is, as understood from FIG. 13, the plating substrate holding jig 100F has a guide hole GH formed in one of the movable piece 20F and the main body rod part 10F, and a guide hole GH formed in the other side of the movable piece 20F and the main body rod part 10F. The moving mechanism 30 includes a guide pin GP formed in the guide hole GH and inserted into the guide hole GH. In this way, the moving mechanism 30 in this embodiment does not include the limit portion 31 and the elastic member 32 described above, and has a simple configuration with a small number of parts.
On the other hand, as is clear from the figure, in the plating substrate holding jig 100F of this embodiment, an end region ER is provided in each of the main body rod portion 10F and the movable piece 20F. In other words, because the main body rod part 10F and the movable piece 20F cannot open and close (separate from each other) by themselves due to their structure, the end regions ER are arranged on the main body rod part 10F side and the movable piece 20F side, respectively. Must be provided.

As is clear from the figure, the movable piece 20F and the main body rod portion 10F in this embodiment have a symmetrical structure except for the guide hole GH and guide pin GP. Therefore, in the present embodiment, the side having the guide pin GP is defined as the main body rod part 10F, and the side having the guide hole GH is defined as the movable piece 20F, but the specification is not limited to this, and the side having the guide pin GP is the movable piece 20F. You can also use it as

As described above, since the plating substrate holding jig 100F is not equipped with the limit portion 31 and the elastic member 32, it cannot control the above-described clearance state by its own action. Therefore, in this embodiment, the end hole 10i is formed in the end surface of the second end region ER2, and the guide bar 150b is inserted into the end hole 10i, so that the main rod portion 10F and the movable piece 20F are brought close to each other. The configuration is such that this state is maintained. That is, in this embodiment, the tip of the guide bar 150b has a shape that allows the main body rod part 10F and the movable piece 20F to maintain a close state (first position), and the end of the main body rod part 10F and the movable piece 20F It has a concavity that collectively restrains the convexities formed on each side. The tip shape of the guide bar 150b may be any shape that can be restrained to the extent that the main body rod portion 10F and the end of the movable piece 20F can be maintained in a close state, and may be a cylindrical shape as shown in FIG. 7(b) or a shape as shown in FIG. It may be a concave shape such as , or a socket-like shape having a sharp cylindrical concave shape. Furthermore, various shapes may be used as long as the main body rod portion and the movable piece can be maintained in a close state, and a bifurcated shape may be used instead of the above.

On the other hand, when moving the movable piece 20F away from the main body rod portion 10F, for example, it is supposed to cooperate with other members. An example of such another member is the carousel C of the above-mentioned plating processing apparatus.
That is, as shown in FIG. 14, the carousel C in this embodiment includes a jig attachment bearing member 12 that restrains the end region ER of the plating substrate holding jig 100F of this embodiment.

As shown in the figure, such a jig mounting bearing member 12 includes a bearing 12a and a pressing member 12b. The structure of this jig attachment bearing member 12 is similar to the jig attachment bearing member 12 provided in the carousel 13 disclosed in International Publication WO 2018/083914. Therefore, regarding the attachment manner of the jig attachment bearing member 12 to the carousel C and the detailed structure of the jig attachment bearing member 12, reference can be made to the contents of WO2018/083914 mentioned above.

As shown in FIG. 14, when the plating substrate holding jig 100F is attached to the plating processing apparatus (carousel C) for immersing the disc-shaped substrate 1 in the plating bath, the movable piece 20F and the main body rod part 10F, the vertical protrusion VP formed on the jig attachment bearing member 12 of the plating processing apparatus is inserted, so that the movable piece 20F and the main body rod portion 10F are separated from each other.
Note that at least one of the main body rod portion 10F and the movable piece 20F of the plating substrate holding jig 100F has a tip of the vertical projection VP of the jig mounting bearing member 12 between the main body rod portion 10F and the movable piece 20F. It is preferable that the main body rod portion 10F and the movable piece 20F have the above-mentioned guide inclined surfaces formed on both the main body rod portion 10F and the movable piece 20F.

At this time, as understood from FIG. 14(c), the width D1 of the clearance between the main body rod portion 10F and the movable piece 20F is defined by the width of the vertical projection VP. Further, as the vertical protrusion VP is inserted between the main body rod part 10F and the movable piece 20F, the main body rod part 10F and the movable piece 20F are separated from each other, and this causes the plating substrate holding jig 100F to move away from the main body rod part 10F and the movable piece 20F. It is possible to hold the disc-shaped substrate 1 within the first accommodation groove G1.
Further, the plating substrate holding jig 100F attached to the jig mounting bearing member 12 is pressed against the vertical projection VP side by the pressing member 12b in contact with the main body rod portion 10F and the movable piece 20F, respectively. The clearance width D1 is maintained.

Here, regarding the attachment/detachment operation to the plating processing apparatus in this embodiment, only the differences from Embodiment 1 will be explained using FIG.
In step 6, when removing the guide bar from the end of the plating substrate holding jig 100F, the grip region GR is moved to the first position P1 (the main body rod part 10F and the movable piece 20F are close to each other) by the shaft holding part 120. After gripping the plating substrate holding jig 100F, the guide bar is moved away from the end of the plating substrate holding jig 100F.

Furthermore, when mounting the plating substrate holding jig 100F on the carousel C in step 7, it is necessary to grip it to the extent that the main body rod portion 10F and the movable piece 20F are allowed to gradually separate. On the other hand, after the plating substrate holding jig 100F is removed from the carousel C, it is maintained at the first position P1 by holding the shaft and waits for the guide bar to be attached.
It is preferable that the shaft holding part 120 can appropriately control the force with which it grips the substrate holding jig 100F for plating processing, and performs an auxiliary operation to maintain the substrate holding jig 100F for plating processing in the state of the first position P1. You may do so.

Note that the embodiment described above can be modified in various ways without departing from the spirit of the present invention. Modifications applicable to the present invention will be described below.
<Modification 1>
FIG. 15 shows a substrate holding jig for plating processing according to Modification 1 that can be applied to each of the above embodiments. In each of the embodiments described above, the cross section of the end region ER is circular like the holding region SR, but the cross section of the end region ER is not limited to this shape, and the cross section of the end region ER may be polygonal. Note that in Modification 1, the end region ER of the plating substrate holding jig has a hexagonal cross section, but the cross section may also be square or triangular.
In this way, in the substrate holding jig for plating processing, the cross-sectional shape of the holding region SR in the radial direction RD and the cross-sectional shape of the end region ER in the radial direction RD may be configured to be different from each other.

<Modification 2>
FIG. 16 shows a plating substrate holding jig according to a second modification that can be applied to each of the above embodiments and the first modification. That is, the main body rod portion and the movable piece do not necessarily have to have a one-to-one relationship, but may have a one-to-many relationship or a plurality-to-many relationship as shown in this example.
More specifically, as shown in FIG. 16(a), different numbers of movable pieces 20 may be provided to the main body rod portion 10 so as to be movable in the radial direction RD via the movement mechanism 30. In the figure, the number of movable pieces 20 is greater than the number of main body rod portions 10, but the configuration may be reversed.

Further, as shown in FIG. 16(b), even if a moving mechanism 30 (elastic stretchable piece 31x made of rubber or the like having a flange) in which the functions of the limit part 31 and the elastic member 32 are integrated is used. good.
Further, as shown in FIG. 16(c), the movable piece 20 is linked via another type of moving mechanism 30 (ring-shaped rubber 31y) in which the functions of the limit part 31 and the elastic member 32 are integrated. It may be configured as follows. In this embodiment, the main body rod portion 10 (not shown) is connected to the movable pieces 20, and only the plurality of movable pieces 20 are linked via the moving mechanism 30 (ring-shaped rubber 31y). You can.

<Modification 3>
FIG. 17 shows a substrate holding jig for plating processing according to Modification 3.
In each of the embodiments and modifications described above, the movable piece 20 moves in parallel, but as in this modification, the movable piece 20 may move in a form other than parallel movement.
That is, as shown in FIG. 17(a), the movable piece 20 in the present modification 3 is positioned at the above-described first position P1, and its base end can pivot around the shaft support 20p. It is axially supported. At this time, the base end portion of the movable piece 20 is urged by an elastic member 32 (a spring in this example) so as to maintain the state at the first position P1.

The distal end portion of the movable piece 20 in Modification 3 is configured such that the size in the radial direction gradually increases. As a result, as shown in FIG. 17(b), when the cam mechanism Cm (moving mechanism 30) rotates in the circumferential direction (around the axis), the cam mechanism Cm moves the tip in the above-mentioned cross direction. 2 position P2.
In this modification, the distal end of the movable piece 20 is rotated by the cam mechanism Cm, which is an example of the moving mechanism 30, so that the disk-shaped substrate 1 can be held at the second position P2 described above. becomes. Note that when the cam mechanism Cm is in the state shown in FIG. 17(a), the movable piece 20 is returned to the first position P1 by the elastic member 32 described above.

Note that although only one cam mechanism Cm as the moving mechanism 30 in Modification 3 is illustrated, the present invention is not limited to this form.
That is, as shown in FIG. 18(a), a plurality of cam mechanisms Cm may be provided around the axis (circumferential direction) of the plating substrate holding jig. In the form shown in the figure, a total of two cam mechanisms Cm are arranged around the shaft, and corresponding to the cam mechanisms Cm, two movable pieces 20 each have their proximal ends so that their distal ends can pivot. Axially supported.

Furthermore, although the cam mechanism Cm as the above-mentioned moving mechanism 30 was configured to rotate with respect to the central axis of the plating substrate holding jig, the present invention is not limited to this form.
That is, as shown in FIG. 18(b), the cam mechanism Cm may move linearly in the radial direction of the plating substrate holding jig. In this case, in the example shown in the figure, a plurality of movable pieces 20 are installed, but only one of them may be installed.
Further, as shown in FIG. 18(b), in order to move the movable piece 20 to the second position P2, the cam mechanism Cm may be rotated by the guide bar 150. For example, the cam mechanism Cm can be rotated by forming a plus-shaped groove on the insertion side surface of the cam mechanism Cm and making the tip of the guide bar 150 have a plus-shaped convex shape to match the groove.

<Modification 4>
FIG. 19 shows a substrate holding jig for plating processing according to modification 4.
In the substrate holding jig for plating processing in the second to fourth embodiments described above, since the movable piece 20 also has a movement component along the axial direction, it is accommodated at the first position P1 and the second position P2. The structure was such that the position of the groove shifted.

In contrast, the movable piece 20 in Modification 4 moves only in the radial direction RD in the movement path between the first position P1 and the second position P2, and does not include a movement component along the axial direction. The cam mechanism Cm as the moving mechanism 30 in this modification includes a cam body cb, a cam groove cg formed in the cam body cb and also serving as the above-mentioned limit part 31, and a cam mechanism Cm that is movable within the cam groove cg. It is configured to include a cam pin CP and a camshaft CS connected to the cam pin CP.
The movement of the cam body cb in the radial direction is restricted by a restriction groove (not shown) in the main body rod portion 10 so that the cam body cb can move linearly along the axial direction.

As shown in FIG. 19(a), when positioning the movable piece 20 at the first position P1, the movable piece 20 is inserted by inserting the convex tip 150e of the guide bar 150d from the end of the main body rod part 10. 20 is housed within the main body rod portion 10.
On the other hand, as shown in FIG. 19(b), when the movable piece 20 is positioned at the second position P2, the convex tip 150e of the guide bar 150d is separated from the end of the main body rod portion 10.
As a result, the cam pin cp moves in the cam groove cg following the movement of the cam body cb biased by the elastic member 32, and the movable piece 20 becomes detached from the main body rod portion 10 in the radial direction RD. .
Modifications 1 to 4 described above can also achieve the same effects as the embodiment described above.

In the embodiment described above, the cross-sectional shape of the movable piece 20 is configured to be an arc obtained by cutting out (dividing) a part of a perfect circle, but the cross-sectional shape of the main body rod portion 10 and the movable piece 20 is not necessarily the same. It does not have to be an arc cut out of a perfect circle. That is, the cross-sectional shape of the main body rod portion and movable piece of the present invention may be a curved shape that includes a straight line in at least a portion of the outer periphery or groove bottom, such as an arc shape that is not a perfect circle, such as an ellipse, a semicircle shape, or a boat bottom shape. good.
Thereby, for example, when the cross-sectional shape of the movable piece 20A is a semi-cylindrical piece, it is possible to hold the disc-shaped substrate 1 at a total of two locations (two directions) by moving in one direction.

Further, in the above embodiment, the use of the disk-shaped substrate 1 has been explained using a magnetic disk (magnetic recording medium) for HDD as an example, but it may be applied to other uses other than magnetic disks. In this case, it goes without saying that the plating solution in the plating bath is changed depending on the application.
Further, in the first embodiment, it is preferable that the tapered portion 20t is formed at at least one end of the movable piece 20A, but the same applies to the second and subsequent embodiments.

As described above, the plating substrate holding jig and plating apparatus of the present invention are suitable for manufacturing substrates to be plated in various ways, and can be applied to a wide range of industries.

1 Substrate 10 Main body rod part 20 Movable piece 30 Moving mechanism 100 Plating processing substrate holding jig 110 Placing part 120 Shaft holding part 130 Gripping part 140 Lifter part 150 Guide bar 200 Plating processing apparatus

Claims (11)

a main body rod portion having an external length that can be inserted into the inner hole of the disc-shaped substrate along the axial direction;
a movable piece that can approach or move away from the main body rod portion in a cross direction that intersects the axial direction;
a moving mechanism that moves the movable piece in the cross direction with respect to the main body rod portion,
The movable piece is
a first position that is close to the main body rod portion and can pass through the inner hole of the disc-shaped substrate together with the main body rod portion;
a second position which is outside the first position in the cross direction and where the external length of the plating substrate holding jig is larger than the diameter of the inner hole of the substrate;
A substrate holding jig for plating processing, characterized in that it is positioned as The moving mechanism includes a limit portion that defines a movement range of the movable piece in the intersecting direction,
The substrate holding jig for plating processing according to claim 1, wherein the first position and the second position are each defined by the limit portion. The moving mechanism includes an elastic member disposed between the movable piece and the main body rod portion,
The limit part includes a cap member having a flange part,
3. The plating substrate holding jig according to claim 2 , wherein the cap member has a base end erected on the main body rod portion so that the flange portion moves in the cross direction inside the movable piece. Ingredients. 4. The substrate holding jig for plating processing according to claim 3, wherein at least two units including the limit portion and the elastic member are provided in the axial direction of the main body rod portion. The main body rod portion includes a holding area that holds the disc-shaped substrate at predetermined intervals, and end areas disposed at both ends of the holding area,
5. The substrate holding jig for plating processing according to claim 1, wherein a cross-sectional shape of the holding region in the cross direction and a cross-sectional shape of the end region in the cross direction are different from each other. The substrate holding jig for plating processing according to any one of claims 1 to 5, wherein a different number of the movable pieces are provided to be movable in the intersecting direction via the moving mechanism with respect to the main body rod part. Ingredients. The main body rod portion and the movable piece are
including a holding area that holds the disc-shaped substrate at predetermined intervals;
In the holding area, the holding area includes a core material extending along the axial direction, and an exterior resin material that covers the outer surface of the core material and is capable of contacting the disk-shaped substrate.
The substrate holding jig for plating processing according to any one of claims 1 to 6. The main body rod portion includes a holding area that holds the disk-shaped substrate at predetermined intervals , and end areas arranged at both ends of the holding area so as to sandwich the holding area,
The moving mechanism includes a guide hole formed in one of the movable piece and the main body rod portion, and a guide pin formed in the other of the movable piece and the main body rod portion and inserted into the guide hole,
the movable piece and the main body rod each have the end region;
A substrate holding jig for plating processing according to any one of claims 1 to 7 . A plating processing apparatus that immerses a disc-shaped substrate in a plating solution in a plating bath,
a mounting section on which a plurality of disk-shaped substrates before plating are placed side by side;
A pair of shaft holding parts each capable of holding a substrate holding jig for plating processing according to any one of claims 1 to 8,
The plating substrate holding jig is inserted into each inner hole of the plurality of disk-shaped substrates while the movable piece maintains the first position, and
A plating processing apparatus, wherein the movable piece is attached to the carousel in the second position. The carousel has a jig mounting bearing member on which the plating substrate holding jig is mounted,
The jig mounting bearing member is formed with a vertical protrusion that is inserted between the movable piece and the main body rod portion when the plating substrate holding jig is mounted,
The vertical protrusion is inserted between the movable piece and the main body rod, so that the movable piece and the main body rod are separated from each other.
The plating processing apparatus according to claim 9. a mounting section on which a plurality of disk-shaped substrates before plating are placed side by side;
A guide bar that allows the plating substrate holding jig according to any one of claims 1 to 8 to be inserted into and taken out from the inner hole of each of the plurality of disc-shaped substrates,
A plating processing apparatus, wherein the guide bar has a tip for maintaining the movable piece of the plating substrate holding jig at the first position.