TWI849143B - Substrate holding jig for plating treatment and plating treatment device - Google Patents

Abstract

The present invention provides a substrate holding fixture for plating processing and a plating processing device, which can hold a relatively large number of substrates without the substrates touching each other in the plating bath, but can still suppress the generation of tumors from the substrates or the fixture with a simpler structure. The substrate holding fixture for plating treatment of the present invention comprises: a main body rod, which has an outer shape length that can be inserted into the inner hole of the disc-shaped substrate along the axial direction; a movable piece, which can approach or move away from the main body rod in a cross direction that intersects the above-mentioned axial direction; and a moving mechanism, which enables the above-mentioned movable piece to move relative to the above-mentioned main body rod along the above-mentioned cross direction; and the above-mentioned movable piece is positioned at the following positions: a first position, which is close to the above-mentioned main body rod and passes through the inner hole of the disc-shaped substrate together with the main body rod; and a second position, which is on the outside of the above-mentioned first position in the cross direction, and the above-mentioned outer shape length in the above-mentioned substrate holding fixture for plating treatment becomes larger than the inner hole diameter of the above-mentioned substrate.

Description

Substrate holding jig for plating treatment and plating treatment device

The present invention relates to a plating treatment technology, and more specifically, to a substrate holding jig for plating treatment and a plating treatment device for immersing a disc-shaped substrate having a through hole at the center into a plating bath to form a plating film on the substrate.

Magnetic recording media used in PCs and other devices are in high demand due to their high convenience, and have been achieving significant increases in recording density in recent years. The market continues to demand higher recording densities for such magnetic recording media, so the disc-shaped substrates used in magnetic recording media are also seeking to be thinner, smoother, and less prone to damage than before.

As the disc-shaped substrate, for example, an aluminum alloy substrate or a glass substrate is used. The aluminum alloy substrate is manufactured, for example, by the following steps. That is, first, an aluminum alloy plate with a thickness of about 1 to 3 mm is punched into a ring shape to form a substrate of a desired size. Then, the punched substrate is subjected to chamfering of the end, grinding with a grindstone, and then electroless NiP plating is performed on the surface of the substrate.

In the electroless NiP plating, for example, as shown in Patent Document 1, a plurality of substrates are held by a plating processing jig and the substrates are immersed in a plating bath at one time. Also, as disclosed in Patent Document 1, it is also known that in order to efficiently form a plating film on the surface of the substrate, the plating processing jig is rotated or revolved to simultaneously perform electroless NiP plating on a plurality of substrates.

On the other hand, in the technology of rotating or revolving the above-mentioned jig for plating treatment in the plating bath, there is a situation in which a convex defect called a nodule is generated on the surface of the substrate due to the wear powder generated by the sliding part of the jig. If the nodule is generated, the quality of the substrate is significantly reduced, so it is important to suppress such a nodule.

In this regard, for example, Patent Document 1 shows that by setting the cross-section of the groove embedded in the outer peripheral portion of the substrate to be U-shaped, it is possible to suppress the tumor that is easily generated in the outer peripheral portion of the substrate. In addition, for example, Patent Document 2 proposes a surface treatment device, which includes: a spindle, which has an annular groove embedded in the end of the inner peripheral portion of the substrate and is arranged horizontally on the circumferential surface; and a weighting rod, which has an annular groove embedded in the end of the inner peripheral portion of the substrate and has substantially the same spacing as the annular groove of the spindle. Furthermore, for example, Patent Document 3 discloses a jig for holding a disc substrate, which is composed of a plurality of arc-shaped segments divided along the circumferential direction of a sleeve and a driving spring installed between the segments to expand/contract the sleeve in the radial direction. [Prior Technical Document] [Patent Document]

[Patent Document 1] Japanese Patent Publication No. 2007-169757 [Patent Document 2] Japanese Patent Publication No. 7-90596 [Patent Document 3] Japanese Patent Publication No. 2001-195730

[The problem that the invention wants to solve]

However, the above-mentioned known jig for plating treatment has the following problems, which can be said to still have points to be improved. That is, for example, in Patent Document 1, since the substrate is held by a holding shaft from the outer peripheral side, it is difficult to increase the number of substrates held unless it is enlarged, and the ability to perform plating treatment on a large number of substrates at the same time is not high.

In addition, for example, in Patent Document 2, since the spindle and the weighting rod can be inserted into the center hole of the substrate (hereinafter also referred to as the "inner hole"), the number of substrates that can be accommodated per unit volume can be relatively increased. However, it cannot be denied that when the weighting rod collides with the edge of the center hole, the weighting rod is ground and promotes the generation of abrasive powder, and the abrasive powder is mixed into the coating film to cause a tumor. Furthermore, in recent years, for example, with the development of multi-layer drives, the substrates for HDD use have developed towards thinning, and it is also necessary to assume the shaking of the substrate during the processing of the thinned substrate. In this regard, for example, in order to achieve uniform coating, the substrate is sometimes moved in the plating bath, and in the structure shown in Patent Document 2, it can be said that the substrates may come into contact with each other.

Furthermore, in Patent Document 3, multiple springs are used to firmly hold the center hole of the disc substrate, which may prevent the substrates from contacting each other, but the structure of the fixture is complicated and leads to high costs. In addition, in the holding fixture of the structure shown in Patent Document 3, it is difficult to hold a relatively large number of substrates at the same time, and it cannot be said that the coating processing capability is also high.

The present invention is made in view of solving such a problem as an example, and its purpose is to provide a substrate holding fixture for plating processing and a plating processing device, which can hold a relatively large number of substrates in the plating bath without the substrates touching each other, but can still suppress the formation of nodules caused by dust from the substrate or fixture mixing into the plating film with a simpler structure. [Technical means for solving the problem]

In order to solve the above-mentioned problems, a substrate holding fixture for plating treatment in one embodiment of the present invention is characterized in that: (1) it has: a main body rod having an outer length that can be inserted into the inner hole of a disc-shaped substrate along the axial direction; a movable piece that can approach or move away from the main body rod in a cross direction that intersects the above-mentioned axial direction; and a moving mechanism that enables the above-mentioned movable piece to move relative to the above-mentioned main body rod along the above-mentioned cross direction; and the above-mentioned movable piece is positioned in the following positions: a first position, which is a position that can approach the above-mentioned main body rod and pass through the inner hole of the disc-shaped substrate together with the main body rod; and a second position, which is on the outer side of the above-mentioned first position in the cross direction, and the above-mentioned outer length in the above-mentioned substrate holding fixture for plating treatment becomes larger than the inner hole diameter of the above-mentioned substrate.

Furthermore, in the substrate holding jig for plating processing described in (1) above, it is preferred that: (2) the above-mentioned moving mechanism includes a limiting portion that defines the moving range of the above-mentioned movable piece toward the above-mentioned intersecting direction, and the above-mentioned first position and the above-mentioned second position are respectively defined by the above-mentioned limiting portion.

Furthermore, in the substrate holding jig for coating processing described in (1) or (2) above, it is preferred that: (3) the above-mentioned moving mechanism includes an elastic member arranged between the above-mentioned movable piece and the above-mentioned main body rod, the above-mentioned limiting portion includes an umbrella-shaped member having a flange portion, and the above-mentioned umbrella-shaped member is formed in such a way that the above-mentioned flange portion moves inside the above-mentioned movable piece along the above-mentioned cross direction, and its base end is erected on the above-mentioned main body rod portion.

Furthermore, in the substrate holding jig for plating processing described in (3) above, it is preferred that: (4) at least two sets of the assembly consisting of the above-mentioned limiting portion and the above-mentioned elastic member are provided in the axial direction of the above-mentioned main body rod portion.

Furthermore, in the substrate holding fixture for coating processing described in any one of the above (1) to (4), it is preferred that: (5) the above-mentioned main rod portion includes: a holding area for holding the above-mentioned disc-shaped substrate at each specific gap, and an end area arranged at both ends of the above-mentioned holding area, and the cross-sectional shape of the above-mentioned holding area in the above-mentioned cross-direction is different from the cross-sectional shape of the above-mentioned end area in the above-mentioned cross-direction.

Furthermore, in the substrate holding fixture for coating processing described in any one of the above (1) to (5), it is preferred that: (6) the movable pieces having a different number relative to the main body rod are movably arranged in the above cross direction via the above moving mechanism. Furthermore, in the substrate holding fixture for coating processing described in any one of the above (1) to (6), it is preferred that: (7) the main body rod and the movable piece include a holding area for holding the disk-shaped substrate at specific intervals, and in the holding area, the core material extending along the above axial direction and the outer coating resin material covering the outer surface of the core material and capable of contacting the disk-shaped substrate are formed.

Furthermore, in the substrate holding fixture for plating processing described in any one of (1), (5) and (6), it is preferred that: (8) it includes an end region arranged in a manner to clamp the holding region, and the moving mechanism has a guide hole formed in one of the movable piece and the main body rod, and a guide pin formed in the other of the movable piece and the main body rod and inserted into the guide hole, and the movable piece and the main body rod each have the end region. Furthermore, in order to solve the above-mentioned problem, the coating treatment device of one embodiment of the present invention is characterized in that: (9) it immerses the disc-shaped substrate in the coating liquid in the coating bath, and comprises: a loading portion, which loads a plurality of disc-shaped substrates before the coating treatment in parallel; and a pair of shaft pressing portions, which can respectively hold the substrate holding fixture for coating treatment described in any one of the above (1) to (8); and the above-mentioned movable piece is maintained in the state of the above-mentioned first position by using one of the above-mentioned shaft pressing portions, and the above-mentioned substrate holding fixture for coating treatment is inserted into the inner hole of each of the plurality of the above-mentioned disc-shaped substrates, and the above-mentioned movable piece is mounted on the rotary material rack in the state of the above-mentioned second position. Furthermore, in the coating processing device described in (9), it is preferred that: (10) the rotating material rack has a jig mounting bearing component for mounting the substrate holding jig for coating processing described in any one of (1) to (8), and a vertical protrusion is formed on the jig mounting bearing component, and the vertical protrusion is inserted between the movable piece and the main body rod when the substrate holding jig for coating processing is installed. The movable piece and the main body rod are separated from each other by the vertical protrusion being inserted between the movable piece and the main body rod. Furthermore, in order to solve the above-mentioned problem, the coating processing device of one embodiment of the present invention is characterized in that: (11) it has: a loading portion that loads a plurality of disc-shaped substrates before coating processing in parallel; and a guide rod that enables the substrate holding fixture for coating processing described in any one of the above (1) to (8) to enter and exit the inner hole of each of the plurality of disc-shaped substrates; and the guide rod has a front end that is used to maintain the movable piece of the substrate holding fixture for coating processing at the above-mentioned first position. [Effect of the invention]

According to the present invention, the generation of nodules can be suppressed by reducing dust from a substrate or a jig with a simpler structure, and a relatively large number of disc-shaped substrates can be kept immersed in a plating bath.

The following is an explanation of the embodiments for implementing the present invention. In addition, in the drawings used in the following explanation, for the sake of convenience, the axial direction in which the substrate holding jig for plating processing extends is set as AD, and the direction intersecting the axial direction AD (in this embodiment, the radial direction) is set as RD. However, these directions are only set for the purpose of making the explanation clear, and are not intended to inappropriately limit the interpretation of the present invention.

《First Implementation》 <Substrate holding fixture 100A for plating treatment> First, with appropriate reference to FIGS. 1 to 6, the structure of the substrate holding fixture 100A for plating treatment in the first implementation is described. As shown in FIG. 1, etc., the substrate holding fixture 100 for plating treatment in this implementation has the function of inserting the inner hole 1a of the disc-shaped substrate 1 and immersing a plurality of disc-shaped substrates 1 in the plating liquid in the plating bath. There is no particular restriction on the material of the substrate holding fixture 100 for plating treatment. For example, known metal materials, ceramics, or synthetic resin materials can be used as the main materials. The main material is preferably one with high chemical resistance to acid and alkali, and can be selected based on the balance from the perspectives of wear resistance, electrical insulation, mechanical strength, and processability. Furthermore, from the perspective of processability, it is preferred to select the synthetic resin material or metal material mentioned above as the main material. More specifically, as the synthetic resin, for example, any one of polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polyetheretherketone (PEEK) and/or a mixed material thereof can be used. Moreover, as the metal material, for example, stainless steel (SUS) and titanium (Ti) can be used. Furthermore, the plating processing substrate holding jig 100 of this embodiment does not necessarily need to be entirely made of a single material, and may be constructed as described below, for example, by making the core material a metal material (SUS, etc.) and making the portion in contact with the disc-shaped substrate 1 a composite material such as the above-mentioned synthetic resin material.

The preferred disc-shaped substrate 1 in this embodiment is a disc-shaped member made of glass or metal such as aluminum with a circular through hole (inner hole) in the center. The thickness of such disc-shaped substrate 1 is, for example, about 0.3 mm to 2.0 mm. Generally speaking, aluminum substrates are mainly used for substrates with a diameter exceeding 2.5 inches, and glass substrates are mainly used for substrates with a size below 2.5 inches.

Among them, in the aluminum disc-shaped substrate 1, for example, after the required pre-treatment is performed on the substrate punched from the aluminum raw material, an electroless plating treatment using the following Ni-P plating solution is performed to form a Ni-P alloy film on the surface, and then a ferromagnetic metal film is layered thereon to form a magnetic recording disk substrate.

As shown in FIGS. 1 to 4, etc., the substrate holding fixture 100A for plating processing is composed of at least a main rod 10A, a movable piece 20A and a moving mechanism 30. The main rod 10A is a rod-shaped component having a recessed area in which the movable piece 20A described below is arranged, and having an outer length that can be inserted into the inner hole 1a of the disc-shaped substrate 1 along the axial direction. This main rod 10A is in the following form: end areas ER are provided at both ends thereof, and holding areas SR are arranged in a manner that is clamped by the end areas ER. In other words, the main rod 10A of this embodiment is composed of a holding area SR that holds the disc-shaped substrate 1 at a specific gap, and end areas ER arranged at both ends of the holding area SR.

The end region ER is, for example, a region that contacts a jig mounting bearing member (not shown) when mounted on the rotating material rack C shown in FIG. 7, and further, a region that contacts the support platform when placed on other unshown support platforms, thereby supporting the disc-shaped substrate 1 in a non-grounded manner while holding the disc-shaped substrate 1. In addition, as described below, the end region ER can also be a portion that contacts the hand of a robot of a coating processing device when holding a substrate holding jig for coating processing. As described below, in each embodiment of the present invention, the main body rod 10 and the movable piece 20 can be configured to have the above-mentioned end region ER, respectively. Furthermore, in the present embodiment, the end region ER is formed to have the same outer length as the holding region SR described below, and as described below, is formed to have a cylindrical shape with a circular cross section and a part of the interior being hollow. Furthermore, the outer lengths of the end region ER and the holding region SR may be the same as those in the present embodiment or may be different. From the perspective of facilitating positioning when the rotary rack is mounted, it is preferred that the outer lengths of the end region ER are different.

Here, the "external length" in this embodiment refers to the longest part of the radial length of the outermost circumference of the substrate holding jig for plating processing. Furthermore, the cross-sectional shape of the disc mounting direction of the substrate holding jig for plating processing can be a perfect circle, a square, an ellipse or an asymmetric shape, etc., and the cross-sectional shape is not particularly limited. Therefore, when the cross-sectional shape of the substrate holding jig for plating processing is a circle, the length in the radial direction is roughly the same, so in this case, the above-mentioned "external length" means its outer diameter. Furthermore, below, in order to explain the case where the cross-sectional shape of the substrate holding jig for plating processing is a circle, unless otherwise specified, the "external length" will be explained as the "outer diameter".

The holding area SR is set to be, for example, twice or more the size of the end area ER in the axial direction AD. In the holding area SR, in addition to the following moving mechanism 30, a first receiving groove G1 and a second receiving groove G2 are formed. In addition, regarding the arrangement relationship between the moving mechanism 30 and the first receiving groove G1 and the second receiving groove G2, it can be seen from FIG. 1 that in this embodiment, in the holding area SR, the moving mechanism 30 is located at both ends, the first receiving groove G1 is arranged inside the moving mechanism 30, and the second receiving groove G2 is arranged at the innermost side.

As described above, the first receiving groove G1 is arranged on the outer side (end side) of the second receiving groove G2. The first receiving groove G1 is configured to have the function of accommodating a dummy substrate not shown. In other words, the substrate holding fixture 100A for plating processing of this embodiment has the function of holding dummy substrates on both sides of a plurality of disc-shaped substrates 1.

Here, the dummy substrate refers to a substrate that has a shape similar to that of the disk-shaped substrate 1 but has not yet been manufactured. The outermost substrate among the substrates held in the substrate holding jig 100A for plating treatment is exposed to the strongest liquid flow in the plating bath, so the plating film formed on the substrate is not easy to become uniform. For this reason, in this embodiment, it is preferred to carry a dummy substrate, but it is not necessarily necessary and there may be no dummy substrate.

Therefore, in this embodiment, by allocating a dummy substrate to the outermost substrate, the quality of the coating film formed on the disk-shaped substrate 1 of the finished product is improved. Furthermore, in this embodiment, a total of two first receiving grooves G1 are arranged on both sides of the second receiving groove G2, but it is not limited to this, and more than two first receiving grooves G1 can also be arranged on the above-mentioned two sides.

The second receiving groove G2 is a groove for receiving the disc-shaped substrate 1, and a plurality of the second receiving grooves G2 are provided in the holding region SR at specific intervals along the axial direction AD. Furthermore, the second receiving groove G2 may be different from the first receiving groove G1 in shape, such as the groove depth or the angle of the slope related to the bottom, or may be the same shape.

The movable piece 20A is configured as follows: it can approach or move away from the main body rod 10A in the intersecting direction (the radial direction RD in the present embodiment) intersecting the axial direction. More specifically, the movable piece 20A in the present embodiment has the function of being positioned at the following positions: the first position P1 (refer to FIG. 3 and FIG. 4 ), which is close to the main body rod 10A and passes through the inner hole 1a of the disc-shaped substrate 1 together with the main body rod 10A; and the second position P2 (refer to FIG. 2 and FIG. 4 ), which is outside the first position P1 in the intersecting direction and the outer length of the substrate holding fixture 100A for plating processing becomes larger than the inner hole diameter of the substrate.

Furthermore, in this embodiment, it is preferred that a tapered portion 20t is formed at least at one end of the movable piece 20A. The tapered portion 20t has the function of guiding the cylindrical body 150c when the cylindrical body 150c described below is inserted, thereby allowing the movable piece 20A to move to the first position through the cylindrical body 150c without collision. In addition, there is no particular limitation on the formation of the tapered portion 20t, as long as the above-mentioned function can be exerted, and various shapes such as shown in the figure are exemplified.

The moving mechanism 30 is configured to have the function of making the movable piece 20A relatively move along the above-mentioned intersection direction (radial direction RD in this embodiment) relative to the main body rod 10A. As shown in Figures 1 (b), 2 and 4, the moving mechanism 30 in this embodiment includes a limiting portion 31 and an elastic member 32. As shown in the figure, in this embodiment, the assembly consisting of the limiting portion 31 and the elastic member 32 is provided in two groups in the axial direction AD of the main body rod 10A. Furthermore, the assembly consisting of the limiting portion 31 and the elastic member 32 is preferably provided in one group, but it can also be provided in any number of groups of more than three groups. In addition, the limiting portion 31 and/or the elastic member 32 can not only be provided as an assembly, but can also be provided in any number.

The limiting portion 31 has the function of defining the range of movement of the movable piece 20A in the radial direction RD. The limiting portion 31 is used to define the second position P2 in the movable piece 20A. More specifically, as shown in FIG. 1 (b) and FIG. 4 , as a specific example of the limiting portion 31 of the present embodiment, an umbrella-shaped member having a flange portion F can be exemplified. As such an umbrella-shaped member, for example, a screw, a rivet, etc. are preferred.

As shown in FIG. 4 , the base end side of the umbrella-shaped member as the limiting portion 31 of this embodiment is fixed to the main body rod 10A, and the upper part including the flange F is accommodated in the recess 21 formed in the movable piece 20. Thus, in this embodiment, the umbrella-shaped member as the limiting portion 31 is erected on the main body rod 10A in such a manner that the flange F moves along the radial direction RD inside the movable piece 20A (in the recess 21). Furthermore, as shown in FIG. 4 , a reference hole sh is provided in the main body rod 10A in a manner corresponding to the recess 21. Thereby, when assembling the main body rod 10A and the movable piece 20A, it is easy to align the recess 21 and the limiting portion 31.

Furthermore, the following state is achieved: when the movable piece 20A is at the first position P1, the flange F moves upward relatively in the recess 21 of the movable piece 20A, and when the movable piece 20A is at the second position P2, the flange F contacts and hangs on the bottom of the recess 21. According to the functional surface of the second position P2, the "second position P2" in this embodiment can also be said to be the following position: the position is radially outward from the first position P1, and at least one of the main rod 10A and the movable piece 20A contacts the inner hole 1a of the disc-shaped substrate 1 to hold the disc-shaped substrate 1. Furthermore, in view of the state of the second position, in other words, the "second position P2" in this embodiment can also be referred to as the following position: it is radially outward compared to the first position P1, and the circumscribed circle of the outer diameter in the coating processing substrate holding fixture 100 becomes larger than the diameter of the inner hole 1a of the disk-shaped substrate 1.

For example, as shown in Fig. 4, the elastic member 32 is disposed between the movable piece 20A and the main body rod 10A. More specifically, the main body rod 10A and the movable piece 20A have concave portions 22 formed on the opposing surfaces thereof, and the pair of concave portions 22 are opposed to form a space for accommodating the elastic member 32.

Such elastic member 32 functions to separate movable piece 20A from main rod 10A. In addition, as described above, in this embodiment, since the spacing limit of movable piece 20A is defined by limiting portion 31, movable piece 20A is set to be at second position P2 by elastic member 32 as a reference state.

Furthermore, in this embodiment, a coil spring is used as the elastic member 32, but there is no particular limitation as long as it can play the above-mentioned role. For example, other well-known elastic materials such as rubber can also be used as the elastic member 32. In addition, in the moving mechanism 30 in this embodiment, the limiting portion 31 is arranged on the outside in the axial direction AD compared to the elastic member 32, but it is not limited to this state. The elastic member 32 can also be arranged on the outside in the axial direction AD compared to the limiting portion 31.

<State transition of movable piece 20A> Next, using FIG. 5 and FIG. 6, the state in which the substrate holding jig 100A for plating processing of this embodiment is inserted into the disc-shaped substrate 1 to hold the substrate is described. That is, first, as shown in FIG. 5 (a), when the movable piece 20A is at the first position P1, the outer diameter (external length) of the substrate holding jig 100A for plating processing becomes D3 (refer to FIG. 3).

The size of the outer diameter D3 (outer length) becomes smaller than the diameter of the inner hole 1a of the disk-shaped substrate 1. Therefore, if this state is maintained by a mechanism such as a robot as described below, the substrate holding jig 100A for plating processing can smoothly pass through the inner holes 1a of a plurality of disk-shaped substrates 1.

Next, the substrate holding jig 100A for plating treatment is inserted into the inner hole of the predetermined number of disc-shaped substrates 1 and the dummy substrate, and then held by a known holding mechanism such as a robot, the guide rod is divided, and set on the rotary material rack C. In this way, as shown in FIG5 (b), due to the action of the limiting portion 31 and the elastic member 32, the movable piece 20A moves in a manner of taking the second position P2 relative to the main rod portion 10A, and the dummy substrate and the disc-shaped substrate 1 are respectively held in the first receiving groove G1 and the second receiving groove G2 (see FIG6) contained in the holding area SR.

At this time, as shown in the figure, when the movable piece 20A is at the second position P2, the outer diameter (outer length) of the substrate holding jig 100A for plating processing becomes D2 (refer to Figure 2). The size of the outer diameter (outer length) D2 is set so as to become larger than the diameter of the inner hole 1a of the disc-shaped substrate 1. In addition, the size of the outer diameter (outer length) D2 is configured so as to become larger than the outer diameter of the end region ER of the main body rod 10A.

At this time, as shown in FIG. 5( b ), the inner hole 1a of the disk-shaped substrate 1 is in contact with the second receiving groove G2 on the side of the movable piece 20A. In other words, in this embodiment, when the disk-shaped substrate 1 is received and held in the substrate holding jig 100A for plating processing (when receiving and holding the substrate), at least one of the movable piece 20A and the main body rod 10A may be in contact with the inner hole 1a of the disk-shaped substrate 1 (this state is referred to as single-point contact or upper contact).

Furthermore, the following embodiment may be adopted: by adjusting the moving range (gap width D1) of the movable piece 20A in the radial direction RD by using the limiting portion 31, when accommodating and holding the substrate, the second receiving groove G2 of both the movable piece 20A and the main rod portion 10A contacts the inner hole 1a of the disc-shaped substrate 1 (also referred to as two-point contact or upper and lower contact). In this way, compared with the case of one-point contact or upper contact, since the swing of the disc-shaped substrate 1 is further suppressed, the disc-shaped substrates 1 are further prevented from contacting each other in the plating bath. Furthermore, the receiving groove at the second position P2 is preferably such that the size of the circumscribed circle of the deepest part (bottom) does not reach the inner hole 1a of the disc-shaped substrate 1. Furthermore, when the receiving groove contacts the inner hole 1a of the disc-shaped substrate 1 at two or more points in a two-point contact manner (or upper and lower contact), it is preferred that there is a gap between the substrate and the groove to the extent that the disc-shaped substrate 1 can rotate in the coating liquid. That is, the disc-shaped substrate 1 in the coating liquid can be configured to have a structure in which the number of contact points changes during rotation.

<Coating treatment device 200> Next, referring to FIG. 7 (a) and FIG. 8, the coating treatment device 200 in this embodiment and the substrate holding method and coating treatment method using the device are described in detail. First, as shown in FIG. 7 (a), the coating treatment device 200 is a coating treatment device for immersing a disc-shaped substrate in a coating liquid in a coating bath, and includes at least a mounting portion 110 and a shaft pressing portion 120, and further has a holding portion 130 and a lifting portion 140.

The mounting part 110 is a component for mounting a plurality of disk-shaped substrates 1 before plating in parallel. As can be seen from the figure, the mounting part 110 is formed with receiving grooves in a manner that allows the disk-shaped substrates 1 and/or dummy substrates to be mounted with a specific gap in a state where the disk-shaped substrates 1 and/or dummy substrates are erected (in a state where the inner hole is horizontal). Furthermore, the specific gaps between the above-mentioned disk-shaped substrates 1 are set to a size corresponding to the first receiving groove G1 or the second receiving groove G2.

As shown in FIG. 7 (a), a total of two shaft pressing parts 120 are arranged on both ends of the substrate holding fixture 100A for plating processing. The pair of shaft pressing parts 120 are controlled by a control device not shown in the figure, and have the function of holding the end side of the substrate holding fixture 100A for plating processing and installing the held substrate holding fixture 100A for plating processing on the rotating material rack C. As a specific example of such a shaft pressing part 120, a known holding mechanism such as a robot can be applied.

The holding portion 130 is configured to hold the outer peripheral surface of the disk-shaped substrate 1 and/or the dummy substrate by clamping it from both sides. Thus, a plurality of disk-shaped substrates 1 and/or dummy substrates placed on the placing portion 110 can be held at one time.

The lifting part 140 has both the up-and-down movement function of the holding part 130 in the vertical direction and the horizontal movement function of the holding part 130 in the horizontal direction through a known power source such as an electric motor. Furthermore, the up-and-down movement function and the horizontal movement function can be separated. In this way, when the holding part 130 holds a plurality of disk-shaped substrates 1 and/or dummy substrates at one time, the substrates can be moved to any position such as between a pair of shaft pressing parts 120.

The guide rod 150a is a member for inserting the substrate holding jig 100A for plating processing into the inner holes of the plurality of upright disc-shaped substrates 1 and/or dummy substrates. The guide rod 150a is constructed in a manner that it can advance and retreat relative to the inner holes of the plurality of upright disc-shaped substrates 1 and/or dummy substrates using a known driving mechanism.

As described below, first, the guide rod 150a itself is inserted into the inner hole and then pulled out from the inner hole. And when the guide rod 150a is detached from the inner hole, the substrate holding jig 100A for coating processing is inserted into the inner hole in a seamless replacement manner. At this time, the guide rod 150a can have the function of maintaining the substrate holding jig 100A for coating processing to the outer diameter passing through the inner hole of the disc-shaped substrate 1. For example, the front end of the guide rod 150b shown in Figure 7 (b) is set as an open cylindrical body 150c, and one end (the side in contact with the guide rod) of the substrate holding jig 100A for coating processing can be inserted into the cylindrical body 150c in the state of the first position P1. By configuring in this way, the movable piece 20A of the substrate holding jig 100A for plating processing can be maintained at the first position P1. Furthermore, although the rotary rack C is not shown in the present embodiment, a known shape such as a C-shaped bearing member (not shown) for jig mounting can be applied.

Next, the substrate holding method in the substrate holding fixture for plating treatment of this embodiment is described with reference to FIG8. First, in step 1, a plurality of disc-shaped substrates 1 before plating treatment are placed side by side on the placement portion 110 using a supply mechanism not shown. At this time, it can also be seen from FIG7 that a plurality of disc-shaped substrates 1 and/or dummy substrates are arranged side by side in an upright state.

Then, in step 2, the outer periphery of the disk-shaped substrate 1 and/or the dummy substrate is held. More specifically, the outer periphery of the disk-shaped substrate 1 and/or the dummy substrate arranged in parallel on the mounting portion 110 is held by the holding portion 130. Furthermore, in this step, the lifting portion 140 lifts the disk-shaped substrate 1 and/or the dummy substrate while the holding portion 130 holds the outer periphery of the substrate. Thereby, the inner holes of the plurality of disk-shaped substrates 1 and/or the dummy substrates are arranged in a straight line in a manner that allows the guide rod 150 to be inserted. Furthermore, in the state of step 2, the disc-shaped substrate 1 and/or the dummy substrate held by the holding portion 130 is positioned on the front of the rotating material rack C, and the substrate holding fixture 100A for plating processing is not yet inserted into the inner hole and is in a standby state at the side.

Furthermore, in step 3, the gripping region GR of the non-insertion side of the movable piece 20A is gripped (refer to FIG. 1 ). More specifically, the gripping region GR is gripped by the shaft pressing portion 120 on the right side of the paper (since the guide rod 150 is arranged on the left side, the right side is the non-insertion side) of the pair of shaft pressing portions 120 shown in FIG. 7 . As a result, the movable piece 20A is pulled to the main rod portion 10A side, and the movable piece 20A is positioned at the first position P1.

Furthermore, in step 4, the substrate holding jig 100A for plating processing is placed on standby outside the non-insertion side of the substrate group (to the right of the shaft pressing portion 120 on the right side in FIG. 7 ) in a manner that the substrates are opposed to the inner holes of the plurality of disk-shaped substrates 1 and/or dummy substrates (these substrates are also referred to as "substrate group" at this time). At this time, the end hole 10h (refer to FIG. 1 ) of the substrate holding jig 100A for plating processing is positioned to be opposed to the inner hole of the substrate group.

Therefore, after reaching step 4, when the outer periphery of each substrate group is held by the holding portion 130 and the guide rod 150 is inserted from the insertion side, it is still in a state where it can be inserted into the end hole 10h of the substrate holding fixture 100A for plating processing. Furthermore, the above steps 2 to 4 can be performed at least partially in parallel, and step 2 and step 3 can be performed in the opposite order. In addition, when the substrate holding fixture 100A for plating processing is arranged at a position consistent with the travel direction of the guide rod 150, the above step 4 can be omitted.

Next, in step 5, the guide rod 150 is inserted into the inner hole of the substrate group from the insertion side (the side where the substrate holding jig 100A for coating processing is not configured, which is the left side of the paper in the case of Figure 7), and then the front end of the guide rod 150 is inserted into a part of the substrate holding jig 100A for coating processing (the end hole 10h).

Furthermore, in the next step 6, the guide rod 150 is pulled out, and the substrate holding fixture 100A for coating processing is linked with the guide rod 150 and inserted into the inner hole of the substrate group. As described above, after the time point of step 5, the front end of the guide rod 150 is integrated with the end hole 10h of the substrate holding fixture 100A for coating processing. Therefore, when the guide rod 150 is pulled out from the inner hole of the substrate group, the substrate holding fixture 100A for coating processing linked with the guide rod 150 can also be seamlessly inserted into the inner hole of the above-mentioned substrate group. Furthermore, at this time, the movable piece 20A is in a state of maintaining the first position P1 by using the shaft pressing part 120, or in a state of maintaining the first position P1 by using the guide rod 150. Thus, in this embodiment, the movable piece 20A is maintained at the first position P1 by the axial pressing portion 120, and the substrate holding jig 100A for coating processing is inserted into the inner holes of each of the plurality of disc-shaped substrates in conjunction with the above-mentioned withdrawal of the guide rod 150 from the inner hole.

Furthermore, in this embodiment, the guide rod 150 is used as an auxiliary when inserting the substrate holding fixture 100A for coating processing into the inner hole of the substrate group, but the guide rod 150 is not necessarily required and can be appropriately omitted. Then, in step 7, in the state of holding the gripping area GR of the movable piece 20A in step 3, the pair of shaft pressing parts 120 are driven to install the substrate holding fixture 100A for coating processing on the rotating material rack C. At this time, for example, the pair of shaft pressing parts 120 can hold the end area ER of the substrate holding fixture 100A for coating processing. In addition, in step 7, the action of appropriately avoiding the lifting part 140 can also be performed. After the substrate holding jig 100A for plating processing is mounted on the rotary rack C, the holding of the shaft pressing portion 120 is released, and the movable piece 20A can be set to the second position P2.

Therefore, in step 7, the substrate holding jig 100A for plating processing that holds a plurality of disc-shaped substrates 1 is mounted on the rotary material rack C by a pair of shaft pressing parts 120 when the movable piece 20A is in the first position P1. In this embodiment, the movable piece 20A is mounted on the rotary material rack C when it is in the first position P1, but it may be mounted on the rotary material rack C after the position of the movable piece 20 is changed from the first position P1 to the second position P2.

In step 8, it is determined whether the predetermined number of sheets is set on the rotary rack C. If the predetermined number of sheets is not set, the process from step 1 is performed again. If the predetermined number of sheets is reached, the setting process is terminated and the rotary rack C is moved to the coating pretreatment tank, the coating bath tank, and the water washing and drying tank. In addition, the preferred coating bath tank in this embodiment is a metal or resin tank of a size that can contain one or more rotary racks C. As a coating pretreatment tank, it can be used for degreasing, acid etching, descaling, 1st zincate, dezincification, and 2nd zincate. As a plating bath, for example, the bath disclosed in the above patent document or other known electroless plating baths can be used. In this embodiment, the plating solution stored in the plating bath can be a known Ni-P plating solution as an example, for example, an aqueous solution containing nickel sulfate: 20 g/dm ³ , sodium hypophosphite: 20 g/dm ³ , sodium acetate: 10 g/dm ³ , sodium citrate: 10 g/dm ³ , etc. In addition, it can also be used in water washing or drying between each process. From the perspective of improving productivity, it is preferred to use the present invention in all processes, but it can also be used in only a part of the process.

According to the above-described substrate holding fixture 100A for plating processing and the plating processing device 200 in this embodiment, when the movable piece 20A is at the first position P1, the substrate holding fixture 100A for plating processing can be inserted into the inner holes 1a of the plurality of disc-shaped substrates 1. On the other hand, when the movable piece 20A is at the second position P2 via the moving mechanism 30, the contact between the substrates can be suppressed and the substrates can be held at the least possible contact positions. Thereby, even when the substrate wall thickness continues to be reduced to an extremely thin substrate (for example, a thickness of 0.635 mm, 0.6 mm, 0.5 mm, or 0.38 mm, etc.), shaking of the substrate and generation of tumors from the substrate or the jig can be suppressed, and a relatively large number of substrates can be immersed in the plating bath.

《Second Implementation》 <Substrate holding jig 100B for plating treatment> The following describes the substrate holding jig 100B for plating treatment of the second implementation using FIG. 9. In the following description, the same reference numbers are used to indicate the same components as those of the first implementation and their descriptions are omitted as appropriate (the same applies to the third to sixth implementations and variations described below).

In the first embodiment, the limiting portion 31 and the elastic member 32 are included to form the moving mechanism 30. In contrast, in the present embodiment, as shown in FIG. 9 , the movable piece 20B is characterized in that the movable piece 20B moves closer to or farther from the main body rod 10B by a pair of inclined surfaces 13a and 23a that are in contact with each other and slide at the same time.

That is, as shown in FIG. 9 (a), when the movable piece 20B is positioned at the first position P1, the outer diameter of the substrate holding fixture 100B for plating processing becomes D3 (external length). In this state, the inner hole of the substrate group is made available for the substrate holding fixture 100B for plating processing to be inserted, as in the first embodiment. In addition, the size of the outer diameter D3 (external length) is determined by forming a reference end 13b at the end of the inclined surface 13a of the main rod 10B, and forming a reference end 23b at the end of the inclined surface 23a of the movable piece 20B, and the reference ends are in contact with each other.

On the other hand, as shown in FIG. 9( b ), when the outer diameter (outer length) of the substrate holding jig 100B for plating processing becomes D2, in other words, when the movable piece 20B is positioned at the second position P2, the locking hook 31b (a form of the limiting portion 31) of the inclined surface 13a erected at the end (in this example, both ends) of the main body rod 10B is inserted into the insertion groove 31z of the movable piece 20B. Thus, even when the movable piece 20B becomes the second position P2, the movable piece 20B is prevented from being largely disengaged in the radial direction RD relative to the main body rod 10B.

Furthermore, when the movable piece 20B is mounted relative to the main rod 10B, in order to ensure the state of FIG. 9 (a), a cutout 23d is provided on a portion of the inclined surface 23a of the movable piece 20B. In addition, the main rod 10B or the movable piece 20B constituting the substrate holding fixture 100B for coating processing can be formed by a known method that can perform three-dimensional shaping, such as cutting processing or a 3D printer.

According to the substrate holding jig 100B for plating processing of the second embodiment described above, the movable piece 20B can be moved relative to the main rod 10B without the elastic member 32. Thereby, the same effect as the first embodiment can be exerted, and further, according to this embodiment, the replacement of the elastic member due to the deterioration over time can be omitted.

<Coating treatment apparatus 200> Next, the coating treatment apparatus 200 in this embodiment and the substrate holding method and coating treatment method using the apparatus are described in detail. In addition, the description of the aspects overlapped with the first embodiment is omitted, and only the parts different from the first embodiment are described.

In this embodiment, first, the guide rod 150a itself is inserted into the inner hole 1a of the disk-shaped substrate 1 and then pulled out from the inner hole 1a, which is the same as the embodiment 1, but the manner in which the movable piece 20 is transferred from the first position P1 to the second position P2 is different. That is, in the plating processing device 200 in this embodiment, as a function of maintaining the outer length of the substrate holding fixture for plating processing to the extent of passing through the inner hole 1a of the disk-shaped substrate 1, for example, the following structure can be set: after the substrate holding fixture 100B for plating processing is inserted into the inner hole 1a, the movable piece 20B is pressed into the travel direction, and the movable piece 20B is transferred to the state of the second position P2 (also refer to Figure 9, Figure 10 is the same).

Alternatively, in the form of the movable piece 20D shown in FIG. 11 , after the substrate holding jig 100D for plating processing is inserted into the inner hole 1a of the disc-shaped substrate 1, the movable piece 20D can be transferred to the second position P2 using a robot or the like instead of this. Thus, in this embodiment, by transferring the movable piece 20 to the second position P2 and placing it on the rotary rack C, the substrate holding jig 100 for plating processing can be installed in the plating processing device 200.

《Third embodiment》 <Substrate holding jig 100C for plating treatment> The third embodiment of the substrate holding jig 100C for plating treatment is described below using FIG. 10. In the second embodiment described above, the locking hook 31b is formed integrally with the main body rod 10B. In contrast, in this embodiment, the following features are provided: a pair of removable locking hooks 31c (a form of the limiting portion 31) are provided on the inclined surface 13a in the main body rod 10C.

Thus, the locking hook provided on the inclined surface of the main body rod is not limited to the form of being integrally formed on the main body rod, and the main body rod and the locking hook may be separately formed as in this form. In addition, in this embodiment, the locking hook may be composed of a pair (2), or may be composed of any number of more than 3 or a single locking hook (the same applies to the second embodiment).

《Fourth Implementation》 <Substrate holding jig 100D for plating processing> The following describes the substrate holding jig 100D for plating processing of the fourth implementation using FIG. 11. In the above-mentioned second and third implementations, the main body rod and the movable piece constitute the end of one and the end of the other substrate holding jig for plating processing, respectively.

In contrast, in this embodiment, the following features are present: the main body rod 10D constitutes both the end of one and the end of the other substrate holding fixture for plating processing, and the movable piece 20D is buried in the recess 13e of the main body rod 10D. According to this aspect, compared with the substrate holding fixture for plating processing 100A to C of the above-mentioned embodiments, the substrate holding fixture for plating processing 100 can be stably supported while the entire length in the axial direction AD of the substrate holding fixture for plating processing remains unchanged. In addition, in order to maintain the state of FIG. 11 (b), that is, the second position P2, a spacer not shown is installed in the space of the recess 13e.

《Fifth Implementation》 <Substrate holding fixture 100E for plating treatment> Below, FIG. 12 is used to explain the substrate holding fixture 100E for plating treatment of the fifth implementation. In each of the above-mentioned implementations, the components in the holding area SR are composed of resin (for example, PEEK resin). In contrast, in this implementation, its main feature is that the holding area SR in at least one of the main body rod 10 and the movable piece 20 is composed of a plurality of different materials. Furthermore, in this implementation, its feature is also that the configuration of the holding area SR is replaced by or in addition to the configuration of the holding area SR, and the configuration arrangement in a pair of end areas ER (two ends) is different from each other.

That is, as can be understood from Fig. 12, the substrate holding jig 100E for plating processing includes a main rod 10E and a movable piece 20E. The substrate holding jig 100E for plating processing includes: a holding region SR for holding the disc-shaped substrate 1 at a specific gap, a first end region ER1 for clamping the holding region SR, and a second end region ER2.

Furthermore, regarding the holding region SR, each of the main body rod 10E and the movable piece 20E is composed of a core material IM extending along the axial direction AD and a coating resin material OR covering the outer surface of the core material IM and being in contact with the disc-shaped substrate 1. Furthermore, in the present embodiment, each of the main body rod 10E and the movable piece 20E is composed of a composite material (the core material IM and the coating resin material OR), but if the strength of the core material IM is adjusted, at least one of the main body rod 10 and the movable piece 20 may be composed of a composite material as described above.

The core material IM is formed of, for example, a known metal material such as SUS (stainless steel) or a surface-treated aluminum material or ceramic. The core material IM of this embodiment has a higher strength than the above-mentioned exterior resin material OR. In addition, the core material IM is arranged on the inner side relative to the exterior resin material OR of each in such a manner that the core material IM of the main rod 10E and the core material IM of the movable piece 20E face each other. Furthermore, the core material IM is set to have a length in the axial direction AD that is approximately equal to the exterior resin material OR, but is not limited to this. For example, the length in the axial direction AD can be shorter than the exterior resin material OR, etc., and can be different from each other.

Furthermore, the core material IM of the present embodiment extends along the axial direction AD in a manner that its width (length in the radial direction orthogonal to the axial direction) is the same. However, the core material IM of the present embodiment is not limited to the above example, and for example, the core material IM can also extend in a manner that the width changes along the axial direction AD such that the width increases toward the center of the holding region SR.

The outer resin material OR is formed so as to cover the outer surface of the core material IM and contact the disc-shaped substrate 1. The material of the outer resin material OR can be, for example, a known resin material such as PEEK. In addition, as shown in FIG. 12 , the outer resin material OR and the core material IM can be separated in their respective groups.

More specifically, in a set of an exterior resin material OR and a core material IM, a connecting hole 33a is formed in the exterior resin material OR and the core material IM, and a known connecting member 33c such as a screw is provided inside the connecting hole 33a. In addition, in another set of an exterior resin material OR and a core material IM, the set of the exterior resin material OR and the core material IM is connected via a connecting hole 33b and a connecting member 33d as described above. Thereby, in the holding area SR, the above pair of sets of the exterior resin material OR and the core material IM are connected at each other, and the set of the exterior resin material OR and the core material IM can be separated from the set of the other exterior resin material OR and the core material IM.

As shown in Fig. 12, the substrate holding jig 100E for plating processing of this embodiment is composed of a pair of end regions (first end region ER1 and second end region ER2) in a manner of clamping the above-mentioned holding region SR. In addition, as shown in the above-mentioned embodiments, in this embodiment, the moving mechanism 30 also has an elastic member 32 disposed between the movable piece 20E and the main rod 10E, and a limiting portion 31 that defines the moving range of the movable piece 20E in the intersecting direction.

In the substrate holding jig 100E for plating processing of this embodiment, an end hole 10h for inserting the guide rod 150a is formed on the end surface of the first end region ER1. In addition, a receiving hole 24 for receiving the front end of the guide rod 150a is formed in the movable piece 20E in succession to the end hole 10h.

As shown in FIG. 12 , for example, when the guide rod 150a is inserted into the end hole 10h and the receiving hole 24, the front end conical portion of the guide rod 150a pushes the receiving hole 24 toward the radial direction RD, and the pair of main body rods 10E and the movable piece 20E move toward each other and approach each other. On the other hand, for example, if the guide rod 150a is pulled out of the end hole 10h and the receiving hole 24, the pair of main body rods 10E and the movable piece 20E have a specific gap due to the action of the elastic member 32 and are separated from each other. Furthermore, in order to further promote the understanding of this embodiment and for the convenience of explanation, the exterior resin material OR and the connecting members 33c and 33d are not shown in the lower side of FIG. 12 (the state where the movable piece 20E is away from the main rod 10E).

At this time, in this embodiment, the arrangement of the elastic member 32 and the limiting portion 31 in one end region (first end region ER1) is different from the arrangement of the elastic member 32 and the limiting portion 31 in the other end region (second end region ER2). More specifically, in this embodiment, in the first end region ER1, the limiting portion 31 is arranged farther from the holding region SR than the elastic member 32, and in the second end region ER2, the elastic member 32 is arranged farther from the holding region SR than the limiting portion 31.

In this way, by configuring the arrangement of the limiting portion 31 and the elastic member 32 in one end region and the other end region in different ways, the above-mentioned gap in the holding region SR can be set to a substantially constant width along the axial direction AD. Furthermore, in the present embodiment, the limiting portion 31 is arranged on the outer side of the elastic member 32 at the end portion on the side where the receiving hole 24 is formed, but it is not limited to this form. At the end portion on the side where the receiving hole 24 is formed, the elastic member 32 can also be arranged on the outer side of the limiting portion 31.

Furthermore, as described above, as long as the gap is stable along the axial direction AD (for example, it is not extremely narrowed, etc.), the limiting portion 31 and the elastic member 32 can be arranged in the first end region ER1 and the second end region ER2 in the same manner. According to the above-described embodiment, as in the above-mentioned embodiments, the generation of tumors can be suppressed by reducing dust from the substrate or the jig with a simpler structure, and a relatively large number of disc-shaped substrates can be kept immersed in the plating bath. Furthermore, in the present embodiment, when different materials are used in the holding region SR, its strength can be increased, and the gap can be stabilized along the axial direction AD.

《Sixth Implementation》 <Substrate holding fixture 100F for plating processing> The following uses Figures 13 and 14 to explain the sixth implementation of the substrate holding fixture 100F for plating processing. In each of the above-mentioned implementations, the limiting portion 31 and the elastic member 32 are used to control the approach/distancing state of the movable piece 20 relative to the main rod 10. In contrast, in the substrate holding fixture 100F for plating processing of this implementation, its characteristics are mainly the following aspects: the limiting portion 31 and the elastic member 32 are not equipped, and the movable piece 20 is controlled to approach/distancing state relative to the main rod 10 toward the radial direction RD in cooperation with the member (such as the rotating material rack C) installed on the substrate holding fixture 100F for plating processing.

That is, as can be understood from FIG. 13 , the substrate holding jig 100F for plating processing includes a moving mechanism 30 having a guide hole GH formed in one of the movable piece 20F and the main body rod 10F, and a guide pin GP formed in the other of the movable piece 20F and the main body rod 10F and inserted into the guide hole GH. Thus, the moving mechanism 30 in this embodiment does not have the above-mentioned limiting portion 31 and the elastic member 32, and has a simple structure with a small number of parts. On the other hand, it can also be seen from the figure that in the substrate holding jig 100F for plating processing of this embodiment, an end region ER is provided in each of the main body rod 10F and the movable piece 20F. In other words, since the main rod 10F and the movable piece 20F cannot be opened and closed by themselves (separated from each other) in their structure, it is necessary to set the end area ER on the side of the main rod 10F and the side of the movable piece 20F respectively as a substitute.

Furthermore, as can be seen from the figure, the movable piece 20F and the main body rod 10F in this embodiment are symmetrical structures except for the guide hole GH and the guide pin GP. Therefore, in this embodiment, the side with the guide pin GP is defined as the main body rod 10F, and the side with the guide hole GH is set as the movable piece 20F, but it is not limited to this definition, and the side with the guide pin GP may also be set as the movable piece 20F.

Thus, in the substrate holding jig 100F for plating treatment, since the limiting portion 31 and the elastic member 32 are not provided, the state of the above-mentioned gap cannot be controlled by its own action. Therefore, in this embodiment, the following configuration is adopted: by forming an end hole 10i at the end surface of the second end region ER2 and inserting the guide rod 150b into the end hole 10i, the state in which the main body rod 10F and the movable piece 20F are close to each other is maintained. That is, in this embodiment, the front end of the guide rod 150b is formed into a shape that can maintain the close state (first position) of the main body rod 10F and the movable piece 20F, and has a concave shape that uniformly constrains the protrusions formed at the ends of the main body rod 10F and the movable piece 20F, respectively. The front end of the guide rod 150b may be in any shape as long as it can constrain the ends of the main rod 10F and the movable piece 20F to maintain a close state, and may be in a cylindrical shape as shown in FIG7(b), a concave shape as shown in FIG13, or a shape of a sharp-tipped cylindrical shape with a concave socket, etc. Furthermore, as long as the shape can maintain the close state of the main rod and the movable piece, it may be in various shapes, and may be in a fork shape instead of the above shapes.

On the other hand, for example, when the movable piece 20F is moved away from the main rod 10F, it cooperates with other components. As such other components, the rotating rack C in the above-mentioned coating processing device can be exemplified. That is, as shown in FIG. 14, the rotating rack C in this embodiment has a jig mounting bearing component 12 that constrains the end area ER of the substrate holding jig 100F for coating processing of this embodiment.

As shown in the figure, the jig mounting bearing member 12 is composed of a bearing 12a and a pressing member 12b. Furthermore, the structure of the jig mounting bearing member 12 is the same as the jig mounting bearing member 12 provided on the rotating material rack 13 disclosed in the international publication No. WO2018/083914. Therefore, the manner in which the jig mounting bearing member 12 is installed on the rotating material rack C or the detailed structure of the jig mounting bearing member 12 can refer to the content of the above-mentioned WO2018/083914.

Furthermore, as shown in FIG. 14 , when the substrate holding jig 100F for plating treatment is mounted on a plating treatment device (rotating rack C) for immersing a disc-shaped substrate 1 in a plating bath, the movable piece 20F and the main body rod 10F are separated from each other by inserting a vertical protrusion VP formed on the jig mounting bearing member 12 of the plating treatment device between the movable piece 20F and the main body rod 10F. Furthermore, it is preferred that at least one of the main rod 10F and the movable piece 20F of the substrate holding jig 100F for coating processing has a guiding inclined surface for guiding the front end of the vertical protrusion VP of the jig mounting bearing component 12 to be inserted between the main rod 10F and the movable piece 20F, and it is more preferred that the above-mentioned guiding inclined surface is formed on both the main rod 10F and the movable piece 20F.

At this time, as can be understood from FIG. 14 (c), the width D1 of the gap between the main body rod 10F and the movable piece 20F is determined by the width of the vertical protrusion VP. Moreover, as the vertical protrusion VP is inserted between the main body rod 10F and the movable piece 20F, the main body rod 10F and the movable piece 20F are separated from each other, thereby being able to hold the disc-shaped substrate 1 in the first receiving groove G1 of the substrate holding jig 100F for plating processing. Moreover, the substrate holding jig 100F for plating processing mounted on the jig mounting bearing member 12 maintains the width D1 of the above-mentioned gap by pressing against the side of the vertical protrusion VP with the pressing member 12b connected to each of the main body rod 10F and the movable piece 20F.

Here, regarding the loading and unloading operation of the coating processing device in this embodiment, only the differences from the embodiment 1 are described using FIG. 8. In step 6, when the guide rod is removed from the end of the substrate holding jig 100F for coating processing, the handle area GR is gripped in a manner that the shaft pressing portion 120 can be maintained at the first position P1 (the main rod portion 10F and the movable piece 20F are close), and then the guide rod is moved away from the end of the substrate holding jig 100F for coating processing.

Furthermore, in step 7, when the substrate holding jig 100F for coating processing is installed on the rotating material rack C, it is necessary to hold it to a degree that allows the main rod 10F and the movable piece 20F to be slowly separated. On the other hand, after the substrate holding jig 100F for coating processing is separated from the rotating material rack C, the shaft pressing part is used to maintain the state of the first position P1, waiting for the installation of the guide rod. The shaft pressing part 120 is preferably capable of appropriately controlling the force of holding the substrate holding jig 100F for coating processing, and can perform an auxiliary action for maintaining the substrate holding jig 100F for coating processing in the state of the first position P1.

Furthermore, the above-described embodiments can be variously modified within the scope of the present invention. The following describes the modified examples applicable to the present invention. <Modification 1> Figure 15 shows a substrate holding fixture for plating processing that can be applied to the above-described embodiments of Modification 1. In the above-described embodiments, the cross-section of the end region ER is the same circular shape as the holding region SR, but it is not limited to this shape, and the cross-section of the end region ER can be a polygon. Furthermore, in this Modification 1, the cross-section of the end region ER of the substrate holding fixture for plating processing is hexagonal, but the above cross-section can also be a quadrilateral or a triangle. In this way, the substrate holding jig for plating processing can be configured so that the cross-sectional shape of the holding region SR in the radial direction RD and the cross-sectional shape of the end region ER in the radial direction RD are different from each other.

<Variant 2> Figure 16 shows a substrate holding fixture for plating treatment that can be applied to each of the above-mentioned embodiments or variant 2 of variant 1. That is, the main body rod and the movable piece do not necessarily need to be in a one-to-one relationship, as shown in this example, they can have a one-to-many or many-to-many relationship. More specifically, as shown in Figure 16 (a), the movable pieces 20 that are different in number from the main body rods 10 can be movably arranged in the radial direction RD via the moving mechanism 30. Furthermore, in this figure, the number of movable pieces 20 is greater than the number of main body rods 10, but it can also be the opposite configuration.

Furthermore, as shown in FIG. 16 (b), a moving mechanism 30 (elastic expansion piece 31x composed of rubber with a flange or the like) in which the functions of the limiting portion 31 and the elastic member 32 are integrated can be used. Furthermore, as shown in FIG. 16 (c), the movable piece 20 can be connected via another form of moving mechanism 30 (ring-shaped rubber 31y) in which the functions of the limiting portion 31 and the elastic member 32 are integrated. Furthermore, in this form, the following structure can also be formed: the main body rod 10 not shown is connected to the movable piece 20, and only a plurality of movable pieces 20 are connected via the moving mechanism 30 (ring-shaped rubber 31y).

<Variant 3> Figure 17 shows a substrate holding jig for plating processing of variant 3. In each of the above-mentioned embodiments or variants, the movable piece 20 is exemplified as being in a state of parallel movement, but as shown in this variant, the movable piece 20 may also be in a state of movement other than parallel movement. That is, as shown in Figure 17 (a), the movable piece 20 in this variant 3 is positioned at the above-mentioned first position P1, and its base end is axially supported in a rotatable manner with the axial support portion 20p as the base point. At this time, the base end of the movable piece 20 is pressed in a manner that the elastic member 32 (a spring in this example) is used to maintain the state of the first position P1.

Furthermore, the front end portion of the movable piece 20 in this modification 3 is configured in a manner that the size in the radial direction is gradually enlarged. Thus, as shown in FIG. 17 (b), if the cam mechanism Cm (moving mechanism 30) rotates in the circumferential direction (around the axis), the front end portion can be moved in the above-mentioned cross direction and positioned at the second position P2 by using the cam mechanism Cm. Thus, in this modification, the front end portion of the movable piece 20 can be rotated by using the cam mechanism Cm as an example of the moving mechanism 30 to achieve the above-mentioned second position P2 and maintain the disc-shaped substrate 1. Furthermore, if the cam mechanism Cm becomes the state of FIG. 17 (a), the movable piece 20 returns to the first position P1 by using the above-mentioned elastic member 32.

Furthermore, only one cam mechanism Cm as the moving mechanism 30 in the modification example 3 is shown in the figure, but the present invention is not limited to this form. That is, as shown in FIG. 18 (a), a plurality of cam mechanisms Cm may be provided around the axis (circumferential direction) of the substrate holding fixture for plating processing. In the form shown in the figure, a total of two cam mechanisms Cm are arranged around the axis, and corresponding to the cam mechanisms Cm, two movable pieces 20 respectively support the base end portion in a manner that the front end portion thereof can be rotated.

Furthermore, the cam mechanism Cm as the above-mentioned moving mechanism 30 is configured to rotate with the central axis of the substrate holding fixture for plating processing as a reference, but the present invention is not limited to this form. That is, as shown in FIG. 18 (b), the cam mechanism Cm may be linearly moved toward the radial direction of the substrate holding fixture for plating processing. In this case, in the example shown in the figure, a plurality of movable pieces 20 are provided, but it may also be a form in which only any one is provided. Furthermore, as shown in FIG. 18 (b), in order to move the movable piece 20 to the second position P2, the guide rod 150 may be used to rotate the cam mechanism Cm. For example, a plus-shaped groove is formed on the insertion side surface of the cam mechanism Cm, and the cam mechanism Cm can be rotated by setting the front end of the guide rod 150 to be a plus-shaped convex shape in a manner that matches the groove.

<Variant 4> Figure 19 shows a substrate holding jig for plating processing of variant 4. In the substrate holding jig for plating processing in the second to fourth embodiments, since the movable piece 20 also has a moving component along the axial direction, it becomes a structure for switching the position of the receiving groove between the first position P1 and the second position P2.

In contrast, the movable piece 20 in the present modification 4 does not include a movement component that moves only in the radial direction RD and along the axial direction in the movement path between the first position P1 and the second position P2. Furthermore, the cam mechanism Cm as the moving mechanism 30 in the present modification includes a cam body cb, a cam groove cg formed in the cam body cb and serving as the above-mentioned limiting portion 31, a cam pin cp movable in the cam groove cg, and a cam shaft cs connected to the cam pin cp. Furthermore, the cam body cb is limited in its movement in the radial direction by a limiting groove (not shown) in the body rod 10 in a manner that allows it to move linearly along the axial direction.

Furthermore, as shown in FIG. 19 (a), when the movable piece 20 is positioned at the first position P1, the convex front end portion 150e of the guide rod 150d is inserted from the end of the main body rod 10, so that the movable piece 20 is accommodated in the main body rod 10. On the other hand, as shown in FIG. 19 (b), when the movable piece 20 is positioned at the second position P2, the convex front end portion 150e of the guide rod 150d is separated from the end of the main body rod 10. Thus, the following state is achieved: the cam pin cp moves in the cam groove cg following the movement of the cam body cb pressing the elastic member 32, and the movable piece 20 is separated from the main body rod 10 toward the radial direction RD. In the above-described variations 1 to 4, the same effects as those of the above-described embodiment can also be achieved.

Furthermore, in the above-mentioned embodiment, the cross-sectional shape of the movable piece 20 is formed in a manner of an arc obtained by cutting (dividing) a part of a true circle, but the cross-sectional shape of the main body rod 10 or the movable piece 20 may not necessarily be an arc obtained by cutting a true circle. That is, the cross-sectional shape of the main body rod or movable piece of the present invention may be an elliptical or kamaboko-shaped or boat-bottom-shaped arc-shaped non-true circle, such as an outer circumference or a groove bottom, and at least a part of the curved shape includes a straight line. Thus, for example, when the cross-sectional shape of the movable piece 20A is a kamaboko-shaped, a total of 2 parts (2 directions) of the disc-shaped substrate 1 can be maintained in 1 direction of movement.

Furthermore, in the above-mentioned embodiment, the disk (magnetic recording medium) used for HDD is described as an example of the use of the disk-shaped substrate 1, but it can also be applied to other uses besides the disk. In this case, the plating liquid in the plating bath can be changed according to its use. In addition, in the first embodiment, it is preferred that a tapered portion 20t is formed at least at one end of the movable piece 20A, and the same is true for the second embodiment and thereafter. [Industrial Applicability]

As described above, the substrate holding jig for plating treatment and the plating treatment apparatus of the present invention are suitable for the manufacture of various substrates to be plated, and can be applied to industries in a wide range of fields.

1: Substrate 10: Main body rod 20: Movable piece 30: Moving mechanism 100: Substrate holding fixture for plating treatment 110: Loading part 120: Shaft pressing part 130: Holding part 140: Lifting part 150: Guide rod 200: Plating treatment device

[FIG. 1] is an oblique external view of the substrate holding jig for plating processing in the first embodiment, and an arrow view observed from a specific direction. [FIG. 2] is a side view of the substrate holding jig for plating processing when the movable piece is in the second position. [FIG. 3] is a side view of the substrate holding jig for plating processing when the movable piece is in the first position. [FIG. 4] is a schematic diagram illustrating the state transition of the movable piece in the first embodiment. [FIG. 5] is a schematic diagram showing the state transition of the movable piece observed from the end side. [FIG. 6] is a schematic diagram of the substrate holding jig for plating processing in the state of holding a disc-shaped substrate. [FIG. 7] is a schematic oblique external view of the plating processing device in the first embodiment. [Figure 8] is a flow chart showing a holding method of a substrate holding jig for plating processing in the first embodiment. [Figure 9] is a schematic diagram showing the external appearance of a substrate holding jig for plating processing in the second embodiment. [Figure 10] is a schematic diagram showing the external appearance of a substrate holding jig for plating processing in the third embodiment. [Figure 11] is a schematic diagram showing the external appearance of a substrate holding jig for plating processing in the fourth embodiment. [Figure 12] is a schematic diagram showing the external appearance of a substrate holding jig for plating processing in the fifth embodiment. [Figure 13] is a schematic diagram showing the external appearance of a substrate holding jig for plating processing in the sixth embodiment. [Figure 14] is a schematic diagram showing the state transition when the substrate holding jig for plating processing in the sixth embodiment is mounted on a rotary rack. [FIG. 15] is a schematic diagram showing the external appearance of the substrate holding jig for plating processing in Modification 1. [FIG. 16] is a schematic diagram showing the substrate holding jig for plating processing in Modification 2. [FIG. 17] is a schematic diagram showing the substrate holding jig for plating processing in Modification 3. [FIG. 18] is a schematic diagram showing another configuration example of the cam mechanism Cm. [FIG. 19] is a schematic diagram showing the external appearance of the substrate holding jig for plating processing in Modification 4.

10h: End hole

10A: Main rod

20A: Movable piece

21: Concave part

100A: Substrate holding fixture for plating process

G1: Storage slot 1

G2: Storage tank No. 2

ER: terminal region

GR: Grip area

SR:Retention Zone

AD: Axial direction

Claims (11)

A substrate holding fixture for plating treatment comprises: a main body rod having an outer shape length that can be inserted into the inner hole of a disc-shaped substrate along the axial direction; a movable piece that can approach or move away from the main body rod in a cross direction that intersects the axial direction; and a moving mechanism that moves the movable piece relative to the main body rod along the cross direction; and the movable piece is positioned at the following positions: a first position that can approach the main body rod and pass through the inner hole of the disc-shaped substrate together with the main body rod; and a second position that is outside the cross direction relative to the first position, and the outer shape length in the substrate holding fixture for plating treatment becomes larger than the inner hole diameter of the substrate. As in claim 1, the substrate holding fixture for coating processing, wherein the moving mechanism includes a limiting portion that defines the moving range of the movable piece toward the cross direction, and the first position and the second position are defined by the limiting portion, respectively. As in claim 2, the substrate holding fixture for plating treatment, wherein the moving mechanism includes an elastic member disposed between the movable piece and the main body rod, the limiting portion includes an umbrella-shaped member having a flange, and the umbrella-shaped member is formed by the flange moving inside the movable piece along the cross direction, with its base end erected on the main body rod. As in claim 3, the substrate holding fixture for plating treatment, wherein at least two sets of components consisting of the above-mentioned limiting portion and the above-mentioned elastic member are arranged in the axial direction of the above-mentioned main body rod. A substrate holding fixture for plating processing as claimed in any one of claims 1 to 4, wherein the main body rod comprises: a holding area for holding the disc-shaped substrate at specific intervals, and end areas arranged at both ends of the holding area, and the cross-sectional shape of the holding area in the cross-sectional direction is different from the cross-sectional shape of the end areas in the cross-sectional direction. A substrate holding fixture for plating processing as claimed in any one of claims 1 to 4, wherein the movable pieces having a different number relative to the main body rods are movably arranged in the above-mentioned cross direction via the above-mentioned moving mechanism. A substrate holding fixture for plating processing as claimed in any one of claims 1 to 4, wherein the main body rod and the movable piece include a holding area for holding the disc-shaped substrate at specific intervals, and the holding area is composed of a core material extending along the axial direction and an outer coating resin material covering the outer surface of the core material and capable of contacting the disc-shaped substrate. A substrate holding fixture for plating processing as claimed in any one of claims 1 to 4, wherein the main body rod comprises: a holding area for holding the disc-shaped substrate at specific intervals, and end areas arranged at both ends of the holding area in a manner of clamping the holding area, and the moving mechanism comprises: a guide hole formed in one of the movable piece and the main body rod, and a guide pin formed in the other of the movable piece and the main body rod and inserted into the guide hole, and the movable piece and the main body rod each have the end area. A plating treatment device, which immerses a disc-shaped substrate in a plating liquid in a plating bath, and is characterized by comprising: a loading portion, which loads a plurality of disc-shaped substrates in parallel before plating treatment; and a pair of shaft pressing portions, which can respectively hold a substrate holding fixture for plating treatment of any one of claim items 1 to 8; and the movable piece maintains the state of the first position, and the substrate holding fixture for plating treatment is inserted into the inner hole of each of the plurality of disc-shaped substrates, and the movable piece is mounted on the rotating material rack in the state of the second position. The coating processing device of claim 9, wherein the rotating rack has a jig mounting bearing component for mounting a substrate holding jig for coating processing of any one of claims 1 to 8, and a vertical protrusion is formed on the jig mounting bearing component, and the vertical protrusion is inserted between the movable piece and the main body rod when the substrate holding jig for coating processing is installed, and the movable piece and the main body rod are separated from each other by the vertical protrusion inserted between the movable piece and the main body rod. A coating processing device, comprising: a loading portion for loading a plurality of disc-shaped substrates before coating processing in parallel; and a guide rod for enabling a substrate holding fixture for coating processing of any one of claims 1 to 8 to enter and exit the inner holes of each of the plurality of disc-shaped substrates; the guide rod has a front end for maintaining the movable piece of the substrate holding fixture for coating processing at the first position.