TWI796470B - Plating support for substrates for hard disks - Google Patents

Abstract

The object of the present invention is to provide a plating holder for a hard disk substrate that can support the hard disk substrate in a stable posture and suppress vibration of the hard disk substrate during plating of the hard disk substrate. The electroplating bracket (10) of the hard disk substrate (P) of the present invention is provided with a through hole (h) for inserting the hard disk substrate (P) having a through hole (h) in the center, and when the hard disk substrate (P) is electroplated The supporting groove (30), the groove (30) is formed with a predetermined width (W2) and a predetermined depth (DP2) in a direction perpendicular to the axis direction of the electroplating support (10), so as to be in the groove ( 30) In the state of supporting the hard disk substrate (P), form the difference between the thickness (t) of the hard disk substrate (P) and the width (W2) of the groove (30) (clearance C (W2-t) )) is 0.04 mm or more and 0.3 mm or less.

Description

Plating support for substrates for hard disks

The invention relates to an electroplating support used in the electroplating of a substrate for a hard disk.

The electroplating support of this kind of hard disk substrate discloses that when the hard disk substrate is electroplated, it is inserted into the through hole in the center of the hard disk substrate and supports the electroplating shaft of the hard disk substrate in a suspended state (refer to Patent Document 1 and Patent Document 2). The electroplating shaft is immersed in the electroplating solution together with the hard disk substrate, and is driven to rotate in the electroplating solution, so that the hard disk substrate suspended and supported by the electroplating shaft is driven to rotate in the electroplating solution. Grooves are arranged on the peripheral surface of the electroplating shaft along the peripheral direction to restrict the axial movement of the hard disk substrate suspended from the electroplating shaft.

The groove described in Patent Document 1 is formed to have a V-shaped cross section, and the depth from the outer peripheral surface of the plating shaft is 5 mm or less. The thickness of the hard disk substrate is 0.8mm or 1.3mm. The groove described in Patent Document 2 has a square cross section, has a width of 0.5 mm to 1.5 mm from the peripheral surface of the plating shaft, and a size of 1.5 mm to 3 mm in depth. In particular, the groove has a width of 1 mm and a depth of 2.5 mm with respect to the thickness of the substrate for a hard disk of 0.8 mm. [Prior Art Literature] [Patent Document]

Patent Document 1: Japanese Patent Application Laid-Open No. 9-157857 Patent Document 2: Japanese Patent Application Laid-Open No. 9-71869

However, the groove described in Patent Document 1 is formed in a V-shaped cross section, so that the hard disk substrate suspended and supported on the plating shaft only makes point contact with the corners of the inner walls of the through-holes forming the hard disk substrate. the inner wall of the groove. Therefore, it is difficult to support the hard disk substrate in a stable posture state, and the support of the hard disk substrate becomes insufficient. Specifically, as shown in FIG. 7, the groove having a V-shaped cross section has one inclined surface a formed on the outer peripheral surface g of the plating axis J, and has the other inclined surface b opposing the one inclined surface a. Inclined part K. In the groove described in Patent Document 1, when the hard disk substrate is driven and rotated by the electric shaft, as shown in FIG. a and b become foreign matter and mix into the electroplating solution, and adhere to the electroplating surface to cause the problem of so-called small agglomeration that causes poor electroplating.

Also, as shown in FIG. 8(b), when the spacer S is provided between the substrates P for the hard disk, the outer peripheral surface of the substrate P for the hard disk and the spacer may be caused by the vibration of the substrate P for the hard disk. The pad S collides, cuts the spacer S, and becomes a problem that foreign matter is mixed into the plating solution and adheres to the plated surface of the hard disk substrate P, causing a problem of so-called small lumps that cause plating failure.

The groove described in Patent Document 2 is also the same as the groove described in Patent Document 1. The support of the hard disk substrate is insufficient, and there is a possibility that a large vibration will be generated in the corresponding disk substrate when the hard disk substrate is driven to rotate. Therefore, there is a possibility that the plated surface of the hard disk substrate may be damaged due to collision with other components, or the chipped plated axis may become foreign matter mixed into the plating solution, and adhere to the plated surface to form a problem of so-called small lumps of poor plating. . In particular, in the case of a thin hard disk substrate having a thickness of about 0.5 mm to 0.63 mm, there is a problem that vibrations are significantly generated.

The present invention was developed to solve the above problems, and provides a hard disk substrate plating that can support the hard disk substrate in a stable posture and suppress the vibration of the hard disk substrate during plating. The bracket is the subject.

(1) The electroplating holder of the hard disk substrate related to the present invention has: a shaft main body inserted into the above-mentioned through hole of the hard disk substrate having a through hole in the center; A plating holder for a hard disk substrate in a groove in which a part of the above-mentioned hard disk substrate enters in a state in which the substrate is suspended from the shaft main body, wherein the plating holder is used for a hard disk having a thickness of 0.8 mm or less. In the disk substrate, the groove is in a state where a part of the hard disk substrate enters the vertical portion, and the difference between the thickness of the hard disk substrate and the width of the vertical portion is 0.04 mm or more and 0.3 mm or less. , forming the width of the above-mentioned vertical portion.

(2) The electroplating bracket of the hard disk substrate related to the present invention, In the plating holder for a hard disk substrate according to (1), the depth of the vertical portion is not less than 0.1 mm and not more than 1.0 mm.

(3) The electroplating holder of the hard disk substrate related to the present invention is in the electroplating holder of the hard disk substrate described in (1) or (2), and it is characterized in that: the angle of the opening of the above-mentioned vertical part has a round shape shape.

(4) The electroplating bracket for a hard disk substrate related to the present invention is the electroplating bracket for a hard disk substrate described in any one of (1) to (3), and it is characterized in that: the above-mentioned groove is along the above-mentioned axis The main body is provided continuously in the peripheral direction, and has a flat bottom surface and a pair of vertical portions of the inner wall surfaces perpendicular to the bottom surface.

(5) The electroplating support for the substrate for the hard disk related to the present invention belongs to the electroplating support for the substrate for the hard disk described in any one of (1) to (4), and is characterized in that: the electroplating support for the substrate for the hard disk The material is selected from polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polyetheretherketone (PEEK) and polyether ether copper (PEEK) mixed with polytetrafluoroethylene (PTFE). one.

(6) The method for manufacturing a substrate for a hard disk according to the present invention is characterized by using the plating holder for a substrate for a hard disk described in any one of (1) to (5).

In the plating holder for a hard disk substrate according to the present invention described in (1) above, grooves are formed so that the gap in the width direction between the hard disk substrate and the hard disk substrate is 0.04 mm or more and 0.3 mm or less in width. With this configuration, the generation of vibration of the hard disk substrate due to the large gap exceeding 0.3mm is suppressed. In addition, scratches in the vicinity of the inner diameter due to vibration can also be prevented. In addition, thinning of the plating thickness due to a small gap of less than 0.04 mm is prevented.

In the plating holder of the hard disk substrate of the present invention described in (2) above, grooves having a depth of not less than 0.1 mm and not more than 1.0 mm are formed. With this configuration, the generation of vibration of the hard disk substrate caused by the shallow groove with a depth of less than 0.1 mm is suppressed. In addition, it prevents thinning of the plating thickness due to deep trenches with a depth greater than 1.0 mm.

In the plating holder of the hard disk substrate according to the present invention described in (3) above, the corners of the openings of the grooves are rounded. With this structure, generation of burrs at the corners of the opening is prevented, and scratches are prevented from adhering to the hard disk substrate supported by the groove.

In the electroplating support for the hard disk substrate of the present invention described in (4) above, the bottom surface of the groove is flat so that the bottom surface is perpendicular to the inner wall surface of the groove. With this configuration, the hard disk substrate can be supported in a stable posture state, and the occurrence of vibration can be suppressed.

The electroplating support of the hard disk substrate of the present invention related to the above (5) is that the material of the electroplating support of the hard disk substrate is polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polyether ether ketone ( PEEK) or a mixture of polyether ether copper (PEEK) and polytetrafluoroethylene (PTFE). With this structure, high wear resistance of the electroplating bracket, high chemical resistance to acid and alkali, high electrical insulation and high mechanical strength are ensured. Also, with this configuration, the generation of foreign matter from the plating holder is suppressed.

The method for manufacturing a substrate for a hard disk according to the present invention described in (6) above is to use the electroplating holder described in any one of (1) to (5) to manufacture a substrate for a hard disk, so that the substrate for a hard disk can be supported in a stable posture state , It can suppress the vibration of the hard disk substrate during electroplating, and can also suppress the scratches near the inner diameter caused by the vibration, and prevent the thinning of the plating thickness caused by the small gap.

According to the present invention, there is provided a plating holder for a hard disk substrate capable of supporting the hard disk substrate in a stable posture and suppressing vibration of the hard disk substrate during electroplating of the hard disk substrate.

A plating holder 10 for a substrate for a hard disk related to an embodiment using the plating holder for a substrate for a hard disk related to the present invention will be described with reference to the drawings.

First, the hard disk substrate P of the plating holder 10 mounted on the hard disk substrate will be described. The substrate P for a hard disk is, as shown in FIG. 1(a) and FIG. 1(b), constituted by a disc having a thickness t, an outer diameter D, and an inner diameter d of a central through hole h. It has a thickness t of about 0.5 mm to 2 mm, an outer diameter D of about 30 mm to 270 mm, and an inner diameter d of about 10 mm to 70 mm.

The material of the hard disk substrate P is made of plate materials such as aluminum alloy, glass, and ceramics. The hard disk substrate P has high-precision smoothness and surface hardness, and also has high rigidity and impact resistance that can suppress vibration caused by high-speed rotation. In order to have these characteristics, the substrate P for a hard disk is formed of a hard raw material.

In addition, the substrate P for a hard disk is subjected to surface treatment of the base, electroplating treatment is performed after the surface treatment, and the surface is polished and mirror-finished after the electroplating treatment. As the plating treatment, in this embodiment, electroless nickel-phosphorus (NiP) plating is performed.

The plating holder 10 of the hard disk substrate P is provided with a plating shaft 20 inserted into the through hole h of the hard disk substrate P as shown in FIGS. The plating shaft 20 is shown in FIG. 3( b ), and has a shaft main body 21 , a core material 22 and a pair of covers 23 . A through hole 21 a penetrating in the axial direction is formed in the shaft main body 21 , and the core material 22 is inserted into the through hole 21 a. The caps 23 are attached after the core material 22 is inserted to close the open ends on both sides of the through-hole 21a.

The shaft body 21 is made of a synthetic resin material, preferably polytetrafluoroethylene (PTFE), more preferably polyvinylidene fluoride (PVDF), most preferably polyether ether ketone (PEEK) or poly Composed of a mixture of ether ether copper (PEEK) and polytetrafluoroethylene (PTFE). These materials have high chemical resistance to acids and alkalis, and one of them can be selected from the viewpoints of wear resistance, electrical insulation, and mechanical strength in terms of balance. Moreover, these synthetic resin materials may be mixed materials of other components within the range which does not interfere with the manufacture of the hard disk board|substrate.

The shaft body 21 has an outer peripheral surface 21b having a diameter smaller than the through-hole h of the hard disk substrate P, and a groove 30 is recessed in the peripheral surface 21b. The groove 30 has such a size that a part of the hard disk substrate P enters into the inner peripheral end in a state where the hard disk substrate P is suspended and supported by the shaft main body 21 . The groove 30 is formed with a predetermined width and a predetermined depth in a direction perpendicular to the axial direction of the shaft main body 21, and enters the groove 30 at the inner peripheral end of the hard disk substrate P so as to be compatible with the hard disk. The width of the groove 30 is formed so that the clearance C in the width direction between the substrates P is 0.04 mm or more and 0.3 mm or less.

The plurality of grooves 30 are shown in Fig. 3(a) and Fig. 3(b), and are respectively arranged continuously in a circumferential shape along the peripheral direction of the shaft main body 21, with predetermined intervals in the axial direction of the shaft main body 21, such as Set around 60. The groove 30 is shown in Fig. 4(a) and Fig. 4(b), and has: an inclined portion 31 inclined from the peripheral surface 21b toward the axis of the shaft main body 21; The vertical portion 32 is formed vertically toward the axis; and the corner portion 33 where the inclined portion 31 intersects with the vertical portion 32 is formed.

The inclined portion 31 has: one inclined surface 31a, and the other inclined surface 31b opposite to one inclined surface 31a, the angle formed by the inclined surface 31a and the inclined surface 31b is formed by θ (degrees), and the inclined portion 31 The opening is formed with a width W1 (mm). The formed angle θ and width W1 can be appropriately selected according to various setting conditions such as the structure, size, and shape of the plating shaft 10 or data such as experimental values.

When the shaft main body 21 is inserted through the through hole h of the hard disk substrate P to be suspended and supported on the hard disk substrate P, the inner peripheral end of the hard disk substrate P can easily enter the vertical portion 32 of the groove 30 In such a manner, the formed angle θ is, for example, about 100 degrees, the width W1 is about 6 mm, and the depth DP1 from the peripheral surface 21b to the corner 33 where the inclined portion 31 intersects the vertical portion 32 is about 2.2 mm. In addition, instead of forming the inclined portion 31 , the vertical portion 32 may be formed directly from the outer peripheral surface portion 21 b of the shaft main body 21 .

As shown in FIG. 4(b), the vertical portion 32 has: one inner wall surface 32a; the other inner wall surface 32b opposing the one inner wall surface 32a; and a bottom surface 32c. The space between one inner wall surface 32a and the other inner wall surface 32b is formed with a width W2 (mm) (see FIG. 4(a)), and the vertical portion 32 is formed with a depth DP2 (mm). This width W2 is formed so that the difference (W2-t) between the thickness t of the hard disk substrate P and the width W2, that is, the clearance C in the width direction between the hard disk substrate P becomes 0.04 mm or more and 0.3 mm or less. . Furthermore, when the clearance C is located at the center of the width W2 on the hard disk substrate P, it becomes the sum of the clearance C1 and the clearance C2.

Therefore, including the thickness t of the hard disk substrate P, the width W2 is formed to be t+C. In addition, when the thickness t of the hard disk substrate P is 0.63 mm, the width W2 is preferably 0.67 mm to 0.75 mm. In addition, the vertical portion 32 supports the inner peripheral end portion of the through-hole h of the hard disk substrate P as shown in FIG. 5( b ).

Furthermore, when the clearance C is less than 0.04mm, the penetration of the plating solution into the gap is insufficient and the plating thickness becomes thinner, and scratches occur at the corners of the through-hole h of the hard disk substrate P, that is, near the ID groove. When the clearance C exceeds 0.3mm, the support of the substrate P for the hard disk due to the groove 30 becomes insufficient, and when the substrate P for the hard disk is driven by the electroplating shaft 20, a large gap will be generated on the substrate P for the hard disk. vibration.

The depth DP2 of the vertical part 32 is represented by the distance (mm) from the intersection corner part 33 of the vertical part 32 and the inclined part 31 to the bottom surface 32c. Specifically, a chamfer R described later is formed in the corner portion 33 , and the depth DP2 is represented by the distance from the center of the chamfer R of the corner portion 33 to the bottom surface 32 c.

In addition, the depth DP2 is preferably not less than 0.1 mm and not more than 1.0 mm, more preferably not more than 0.3 mm. When the depth DP2 is less than 0.1 mm, the support of the hard disk substrate P by the groove 30 becomes insufficient, and large vibration occurs. When the depth DP2 exceeds 1.0 mm, the penetration of the electroplating solution toward the gap is insufficient, so that the thickness of the electroplating becomes thinner, and scratches are generated near the ID groove.

The bottom surface 32c is formed flat along the axis of the shaft main body 21, and the bottom surface 32c is perpendicular to one inner wall surface 32a of the vertical portion 32, and the other inner wall surface 32b of the vertical portion 32 is perpendicular to the bottom surface 32c. In addition, the corners of the bottom surface 32c perpendicular to the one inner wall surface 32a and the other inner wall surface 32b may be small circles or small inclinations where the corners of the through-hole h of the hard disk substrate P do not interfere. .

The chamfer R of the corner portion 33 may be rounded as long as the corner portion 33 is rounded to remove burrs generated at the corner portion and prevent scratches on the hard disk substrate P.

The core material 22 is made of high-rigidity materials such as fiber-reinforced resin or metal, and is inserted into the shaft main body 21 to improve the mechanical strength of the electroplated shaft 20 . A pair of covers 23 are made of the same material as the shaft main body 21, and one cover 23 is inserted into a gear provided in the electroplating equipment as shown in FIG.

Towards the plating shaft 20, as shown in FIG. 5(a), about 60 hard disk substrates P are inserted corresponding to a plurality of, for example, grooves 30 formed in the shaft main body 21. Moreover, the plating shaft 20 is comprised by setting the spacer S provided in the plating facility between each hard disk board|substrates P. As shown in FIG.

The plating shaft 20 is installed in the plating equipment in a state where the hard disk substrate P and the spacer S are set, and is driven to rotate while being immersed in a bath. The hard disk substrate P suspended and supported by the plating shaft 20 is subjected to surface treatment by the driven rotation of the plating shaft 20 in the bath, and is lifted out of the bath together with the plating shaft 20 after the surface treatment is completed.

Substrate P for hard disk is obtained by (1) degreasing, (2) acid etching, (3) descaling, (4) 1st zincate, (5) dezincate, (6) 2nd zincate, (7) Electroless NiP Plating and Water Washing Between Each Step Immersion in the bath liquid of each step Surface treatment is given to the surface of the substrate P for a hard disk. The electroplating shaft 20 is not limited to the above-mentioned (1)-(7), and the substrate P for the hard disk can be immersed in the bath, and used in the step of driven rotation in the bath, for example, it can also be used in the above-mentioned (1)-(7) Some of the steps, but it is better to use all the steps.

Next, examples and comparative examples of the plating holder 10 of the hard disk substrate P related to the present embodiment will be described. Make the electroplating rack 10 of the hard disk substrate P related to the embodiment and the electroplating rack related to the comparative example, and install the hard disk substrate P on the electroplating rack. Each project is evaluated. Evaluate respectively for Examples 1-15 and Comparative Examples 1-3. Hereinafter, each Example and each comparative example are demonstrated.

(Example 1) In Example 1, as shown in FIG. 6( a ), as the hard disk substrate P, an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm was used. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is set to 0.70 mm. Therefore, the gap C in the width direction between the groove 30 and the hard disk substrate P is W2-t, that is, 0.70mm-0.63mm=0.07mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to be 0.8 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

In Embodiment 1, the plating shaft 20 is formed to be shorter than the plating shaft 20 constituting the actual plating equipment, and about 10 hard disk substrates P can be supported. The configurations other than the plating shaft 20 were evaluated with a test machine having the same configuration as the components constituting the actual plating equipment. The substrate P for a hard disk is subjected to surface treatment of the base, and after the surface treatment, electroless nickel-phosphorus (NiP) plating is performed, which is the same as the plating treatment of an actual plating equipment.

With respect to the hard disk substrate P related to Example 1 constituted as above, three items of vibration of the substrate, scratches near the inner diameter (inner peripheral end), and plating thickness near the inner diameter (inner peripheral end) to evaluate. The vibration of the substrate was visually observed on the substrate P for a hard disk that was plated with a testing machine. ⊚ indicates that there is almost no shaking of the substrate P for a hard disk. Compared with the vibration generated by the same hard disk substrate P as that of Example 1 in which the conventional plating shaft J is shown in FIG. 7, the vibration of the hard disk substrate P is considerably improved.

In addition, the conventional plating shaft J has the same configuration as the plating shaft 20 in the embodiment, and only the grooves formed on the plating shaft are different. Specifically, the groove of the conventional plating axis J is shown in FIG. 7 and has an inclined portion K. The inclined portion K has: one inclined surface a, and the other inclined surface b opposite to one inclined surface a, the angle formed by the inclined surface a and the inclined surface b is formed at 100 degrees, and the opening of the inclined portion K is Formed with a width of 6.6mm. In addition, the depth of the outer peripheral surface g from the inclined portion K is formed at 2.2 mm, and a chamfer R is formed at the bottom of the inclined portion at 0.2 mm.

In addition, the vibration of the hard disk substrate P is slightly improved compared with the vibration generated by the hard disk substrate P mounted on the conventional plating shaft J, which is indicated by △. In addition, the same vibration as the vibration generated in the hard disk substrate P mounted on the known plating shaft J is indicated by x.

Scratches near the inner diameter (inner peripheral end) are observed with a light microscope near the corner of the through-hole h of the hard disk substrate P, that is, near the ID groove, using a known electroplating axis J and the hard disk substrate P. The scratches near the ID groove are compared to determine the degree of scratches. Scratches equivalent to conventional ones are indicated by ○, those with slightly more scratches than conventional ones are indicated by △, and those with more scratches than conventional ones are indicated by ×.

The plating thickness in the vicinity of the inner diameter (inner peripheral end) is the height measured with a laser microscope from the vicinity of the periphery of the hard disk substrate P toward the flat portion of the through hole h to the vicinity of the ID groove, that is, the thickness. Regarding the observed section where the thickness becomes thinner near the ID groove, compare it with the flat part to verify whether the plating thickness is thinner. Compared with the plating thickness near the ID groove of the hard disk substrate P plated using the conventional plating axis J, the evaluation was carried out.

○ indicates the same thickness as the conventional one. Compared with the conventional one, it is thinner, but the plating thickness is compared with the flat part as a result of cross-sectional observation. △ indicates that 80% of the thickness is ensured. The plating thickness is compared with the flat part as a result of cross-sectional observation. If 80% of the thickness cannot be ensured, it is indicated by ×.

As a result of evaluating the hard disk substrate P related to Example 1, the vibration of the substrate was ◎, the scratch near the inner diameter was Δ, and the plating thickness near the inner diameter was Δ. Therefore, it was confirmed that the plating shaft 20 related to Example 1 was good.

(Example 2) Example 2 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.70 mm, and the clearance C is 0.07 mm. The chamfer R of the corner portion 33 of the groove 30 was 1.0 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.1 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

As in Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 2, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were the same as those in Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 2, the vibration of the substrate was ○, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 2 was good.

(Example 3) Example 3 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.70 mm, and the clearance C is 0.07 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.4 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.15 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 3, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 3, the vibration of the substrate was ○, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 3 was good.

(Example 4) Example 4 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.70 mm, and the clearance C is 0.07 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.4 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.25 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 4, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 4, the vibration of the substrate was ○, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 4 was good.

(Example 5) Example 5 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.70 mm, and the clearance C is 0.07 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 5, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 5, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 5 was good.

(Example 6) Example 6 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.70 mm, and the clearance C is 0.07 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polytetrafluoroethylene (PTFE).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 6, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 6, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 6 was good.

(Example 7) Example 7 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.70 mm, and the clearance C is 0.07 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of a mixed material of polyetheretherketone (PEEK) and polytetrafluoroethylene (PTFE).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 7, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 7, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 7 was good.

(Embodiment 8) Example 8 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.70 mm, and the clearance C is 0.07 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyvinylidene fluoride (PVDF).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 8, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 8, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 8 was good.

(Example 9) Example 9 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.67 mm, and the clearance C is 0.04 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 9, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 9, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 9 was good.

(Example 10) Example 10 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.80 mm, and the clearance C is 0.17 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.2 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 10, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 10, the vibration of the substrate was ○, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 10 was good.

(Example 11) Example 11 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.90 mm, and the clearance C is 0.27 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.2 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 11, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 11, the vibration of the substrate was Δ, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 11 was good.

(Example 12) Example 12 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.90 mm, and the clearance C is 0.27 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.8 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 12, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were the same as those in Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 12, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 12 was good.

(Example 13) Example 13 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.50 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.55 mm, and the clearance C is 0.05 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 13, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 13, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 13 was good.

(Example 14) Example 14 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.50 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plating shaft 20 is 0.57 mm, and the clearance C is 0.07 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 14, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 14, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 14 was good.

(Example 15) Example 15 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.80 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.87 mm, and the clearance C is 0.07 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 15, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were the same as those in Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Example 15, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating shaft 20 related to Example 15 was good.

(comparative example 1) In Comparative Example 1, the same as in Example 1, the hard disk substrate P has a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm, and is made of an aluminum alloy. The plating axis is the conventional plating axis J of FIG. 7 . Therefore, as shown in FIG. 6( a ), the vertical portion 32 of the trench 30 similar to that of Example 1 is not formed, indicating that there is no trench. The shaft main body and a pair of covers constituting the plating shaft J are made of polyetheretherketone (PEEK).

As in Example 1, electroplating was performed on a test machine. For the hard disk substrate P related to Comparative Example 1, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with those in Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Comparative Example 1, the vibration of the substrate was rated as x, the scratches near the inner diameter were rated as ○, and the plating thickness near the inner diameter was rated as ○. Therefore, it was confirmed that the plating shaft J related to Comparative Example 1 had a large vibration of the substrate and was not suitable for the plating shaft.

(comparative example 2) In Comparative Example 2, the same as in Example 1, the hard disk substrate P has a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm, and is made of an aluminum alloy. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 1.00 mm, and the clearance C is 0.37 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is set to 0.2 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

As in Example 1, the electroplating process was performed on a test machine. For the hard disk substrate P related to Comparative Example 2, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with those in Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Comparative Example 2, the vibration of the substrate was rated as x, the scratches near the inner diameter were rated as ○, and the plating thickness near the inner diameter was rated as ○. Therefore, it was confirmed that the plating shaft J related to Comparative Example 2 had a large vibration of the substrate and was not suitable for the plating shaft.

(comparative example 3) In Comparative Example 3, the same as in Example 1, the hard disk substrate P has a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm, and is made of an aluminum alloy. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft main body 21 of the plating shaft 20 is 0.70 mm, and the clearance C is 0.07 mm. The chamfer R of the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 was set to 1.1 mm. The shaft main body 21 and the pair of covers 23 constituting the plating shaft 20 are formed of polyetheretherketone (PEEK).

As in Example 1, electroplating was performed on a test machine. For the hard disk substrate P related to Comparative Example 3, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with those in Example 1. Evaluate similarly.

As a result of evaluating the hard disk substrate P related to Comparative Example 3, the vibration of the substrate was ◎, the scratch near the inner diameter was ×, and the plating thickness near the inner diameter was ×. Therefore, it was confirmed that the vibration of the substrate of the plated shaft J related to Comparative Example 3 was good, but it was confirmed that it was not suitable for the plated shaft because the scratches near the inner diameter were x and the plating thickness near the inner diameter was x.

And, as the 6th (b) figure shows, with respect to embodiment 5, embodiment 7, embodiment 9, embodiment 15 and comparative example 1, carry out electroplating with actual electroplating equipment, for small nodule generation rate (one/face )authenticating. The occurrence rate of small lumps is to inspect the surface of the hard disk substrate P with an optical surface inspection device, and calculate the number of protrusions that become defects with a scanning electron microscope (SEM) or an atomic force microscope (AFM). The criterion for judging is 0.003 pieces/face. In addition, as an optical surface inspection device, model RS1390 manufactured by Hitachi High-Tech Fine Systems was used.

The rate of occurrence of small lumps was 0.002 in Example 5, and 0.001 in Example 7, Example 9, and Example 15, which met the judgment criteria and were confirmed to be suitable for electroplating shafts. On the other hand, in Comparative Example 1, the occurrence rate of small lumps was 0.010, which did not meet the judgment criteria, and it was confirmed that it was not suitable for the plating axis. In addition, "-" shown in the 6th (b) means that the verification has not been implemented, but for other examples that have not been implemented, the vibration of the substrate P of the hard disk substrate P, the scratches near the inner diameter, and the vibration near the inner diameter Since good evaluation results were obtained for the three items of plating thickness, it can be presumed that the rate of occurrence of small lumps also meets the judgment criteria.

Hereinafter, the effects of the plating holder 10 on the hard disk substrate P according to the present embodiment will be described.

The electroplating holder 10 of the hard disk substrate P related to the present embodiment forms grooves with a clearance C between the thickness t of the hard disk substrate P and the width W2 of the groove 30 of not less than 0.04 mm and a width W2 of not more than 0.3 mm. 30. With this configuration, the occurrence of vibration of the hard disk substrate due to the clearance C exceeding 0.3 mm is suppressed, and the effect of thinning the plating thickness due to the clearance C of less than 0.04 mm is obtained. In addition, the effect of preventing scratches in the vicinity of the inner diameter caused by vibration can also be obtained.

In addition, in the plating holder 10 of the hard disk substrate P related to this embodiment, the groove 30 is formed with a depth of not less than 0.1 mm and not more than 1.0 mm. With this groove, it is possible to obtain an effect of suppressing the vibration of the substrate P for a hard disk in which the groove 30 having a depth of less than 0.1 mm is formed. In addition, an effect of thinning the plating thickness due to the trench 30 having a depth of more than 1.0 mm can be obtained.

In addition, in the plating holder 10 of the hard disk substrate P according to this embodiment, the corners of the openings of the grooves 30 are rounded. This structure prevents burrs from being generated at the corners of the opening, and prevents scratches from adhering to the hard disk substrate P supported by the groove 30 .

Also, in the plating holder 10 of the hard disk substrate P according to this embodiment, the bottom surface 32c of the groove 30 is flat, and the bottom surface 32c is perpendicular to one inclined surface 31a and the other inclined surface 31b of the groove 30 . With this structure, the hard disk substrate P is supported in a stable posture on the bottom surface 32c of the groove 30, and the effect of suppressing the occurrence of vibration can be obtained.

Also, the electroplating support 10 of the hard disk substrate P related to the present embodiment is preferably made of polytetrafluoroethylene (PTFE), more preferably polyvinylidene fluoride (PVDF). ), preferably polyether ether ketone (PEEK), or a mixed material of polyetherether copper (PEEK) and polytetrafluoroethylene (PTFE). With this configuration, the effects of ensuring high wear resistance, high chemical resistance to acids and alkalis, high electrical insulation and high mechanical strength of the electroplating bracket 10 are obtained. In addition, since the plating holder 10 of the hard disk substrate P according to the present embodiment has high abrasion resistance and chemical resistance, the effect of suppressing generation of foreign matter from the plating holder 10 can be obtained.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-mentioned embodiments, and various design changes can be made without departing from the spirit of the present invention described in the claims.

10‧‧‧Electroplating bracket 20‧‧‧Electroplating shaft (electroplating bracket) 21‧‧‧Shaft body 21a, h‧‧‧through hole 21b‧‧‧Peripheral face 22‧‧‧core material 23‧‧‧Cover 30‧‧‧groove 31‧‧‧Inclined part 31a‧‧‧inclined surface on one side 31b‧‧‧The inclined surface of the other side 32‧‧‧vertical part 32a‧‧‧Inner wall surface of one side 32b‧‧‧The inner wall of the other side 32c‧‧‧Bottom 33‧‧‧corner C, C1, C2‧‧‧clearance D‧‧‧outer diameter d‧‧‧inner diameter DP1, DP2‧‧‧depth P‧‧‧substrate for hard disk t‧‧‧thickness R‧‧‧Chamfering W1, W2‧‧‧width

Fig. 1 is a diagram of a substrate for a hard disk supported by an electroplating support for a substrate for a hard disk according to an embodiment of the present invention. Fig. 1 (a) shows a perspective view of a substrate for a hard disk, and Fig. 1 (b) shows A cross-sectional view of a hard disk substrate. Fig. 2 is a perspective view of a plating holder for a substrate for a hard disk according to an embodiment of the present invention. Fig. 3 is a diagram of an electroplating support for a substrate for a hard disk according to an embodiment of the present invention. Fig. 3 (a) shows a side view of the electroplating support for a substrate for a hard disk. ) A cut-off cross-sectional view of A-A of the figure. Fig. 4 is a side view of an electroplating bracket for a substrate for a hard disk according to an embodiment of the present invention, Fig. 4(a) shows the inclined portion and vertical portion of the groove, and Fig. 4(b) shows the vertical portion of the groove Enlarged side view after zooming in. Fig. 5 is a view of a hard disk substrate plating holder in a state where a hard disk substrate is mounted on a hard disk substrate plating holder according to an embodiment of the present invention, and Fig. 5 (a) shows a hard disk substrate. The perspective view of the electroplating bracket, Figure 5(b) shows a partial cross-sectional view after cutting the groove part of the electroplating bracket of the hard disk substrate. Fig. 6 is a table of examples and comparative examples of electroplating holders for hard disk substrates related to the embodiment of the present invention. Fig. 6 (a) shows the thickness of substrates for hard disks and the structure of electroplating holders. Fig. 6 (b) The figure shows the generation rate of small lumps in Examples and Comparative Examples. Fig. 7 is an enlarged side view of the groove of the electroplating bracket of the conventional hard disk substrate. Fig. 8 is a diagram of a known electroplating support for a substrate for a hard disk, Fig. 8(a) shows an enlarged side view of the groove, and Fig. 8(b) shows the state of the hard disk after the substrate for a hard disk is installed Enlarged side view of the plated holder for the substrate.

20‧‧‧Electroplating shaft (electroplating bracket)

21‧‧‧Shaft body

21b‧‧‧Peripheral face

30‧‧‧groove

31‧‧‧Inclined part

31a‧‧‧inclined surface on one side

31b‧‧‧The inclined surface of the other side

32‧‧‧vertical part

32a‧‧‧Inner wall surface of one side

32b‧‧‧The inner wall of the other side

32c‧‧‧Bottom

33‧‧‧corner

C‧‧‧clearance

C1‧‧‧clearance

C2‧‧‧clearance

DP1‧‧‧depth

DP2‧‧‧depth

P‧‧‧substrate for hard disk

R‧‧‧Chamfering

W1‧‧‧width

W2‧‧‧width

Claims (4)

An electroplating bracket for a substrate for a hard disk, comprising: a shaft main body inserted into the above-mentioned through hole of a substrate for a hard disk with a through hole in the center; The state of the shaft main body allows a part of the hard disk substrate to enter the groove, wherein the electroplating bracket is used for a hard disk substrate having a thickness of 0.8 mm or less, and the groove is along the periphery of the shaft main body. The direction is continuously arranged, and there is a vertical portion with a flat bottom surface and a pair of inner wall surfaces perpendicular to the bottom surface. In a state where a part of the above-mentioned hard disk substrate enters the above-mentioned vertical portion, the thickness of the above-mentioned hard disk substrate is equal to the above-mentioned The width of the vertical portion is formed such that the difference in width of the vertical portion is 0.04 mm to 0.3 mm, and the depth of the vertical portion is 0.1 mm to 1.0 mm. The plating holder for a substrate for a hard disk according to Claim 1, wherein the corners of the openings of the vertical portions have a rounded shape. As the electroplating bracket of the hard disk substrate described in claim 1 or claim 2, wherein, the material of the electroplating bracket of the hard disk substrate is selected from polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), poly One of the mixed materials of ether ether ketone (PEEK) and polyetherether copper (PEEK) and polytetrafluoroethylene (PTFE). A method for manufacturing a substrate for a hard disk, characterized by using the electroplating support for a substrate for a hard disk described in any one of claim 1 to claim 3.

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