TWI796470B - Plating support for substrates for hard disks - Google Patents
Plating support for substrates for hard disks Download PDFInfo
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- TWI796470B TWI796470B TW108113140A TW108113140A TWI796470B TW I796470 B TWI796470 B TW I796470B TW 108113140 A TW108113140 A TW 108113140A TW 108113140 A TW108113140 A TW 108113140A TW I796470 B TWI796470 B TW I796470B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
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Abstract
本發明的課題為提供一種硬碟用基板的電鍍支架,可以穩定的姿勢狀態支撐硬碟用基板,在硬碟用基板電鍍時,可抑制硬碟用基板的振動產生。本發明的硬碟用基板(P)的電鍍支架(10)具備插入中心具有貫穿孔(h)的硬碟用基板(P)的貫穿孔(h),在硬碟用基板(P)電鍍時支撐的溝槽(30),溝槽(30)是在與電鍍支架(10)的軸線方向正交的方向以預定的寬度(W2)及預定的深度(DP2)所形成,以在溝槽(30)支撐硬碟用基板(P)的狀態,形成使硬碟用基板(P)的厚度(t)與上述溝槽(30)的寬度(W2)的差(餘隙C(W2-t)))成為0.04mm以上,且0.3mm以下。The object of the present invention is to provide a plating holder for a hard disk substrate that can support the hard disk substrate in a stable posture and suppress vibration of the hard disk substrate during plating of the hard disk substrate. The electroplating bracket (10) of the hard disk substrate (P) of the present invention is provided with a through hole (h) for inserting the hard disk substrate (P) having a through hole (h) in the center, and when the hard disk substrate (P) is electroplated The supporting groove (30), the groove (30) is formed with a predetermined width (W2) and a predetermined depth (DP2) in a direction perpendicular to the axis direction of the electroplating support (10), so as to be in the groove ( 30) In the state of supporting the hard disk substrate (P), form the difference between the thickness (t) of the hard disk substrate (P) and the width (W2) of the groove (30) (clearance C (W2-t) )) is 0.04 mm or more and 0.3 mm or less.
Description
本發明是關於在硬碟用基板電鍍時使用的電鍍支架。The invention relates to an electroplating support used in the electroplating of a substrate for a hard disk.
此種硬碟用基板的電鍍支架,揭示有在硬碟用基板電鍍時,插入硬碟用基板的中心的貫穿孔並以垂吊的狀態支撐硬碟用基板的電鍍軸(參閱專利文獻1及專利文獻2)。電鍍軸是與硬碟用基板一起浸漬於電鍍液,在電鍍液內旋轉驅動,構成使垂吊支撐於電鍍軸的硬碟用基板在電鍍液內從動旋轉。在電鍍軸的外圍面沿著周圍方向設有溝槽,限制垂吊於電鍍軸之硬碟用基板的軸向移動。The electroplating support of this kind of hard disk substrate discloses that when the hard disk substrate is electroplated, it is inserted into the through hole in the center of the hard disk substrate and supports the electroplating shaft of the hard disk substrate in a suspended state (refer to Patent Document 1 and Patent Document 2). The electroplating shaft is immersed in the electroplating solution together with the hard disk substrate, and is driven to rotate in the electroplating solution, so that the hard disk substrate suspended and supported by the electroplating shaft is driven to rotate in the electroplating solution. Grooves are arranged on the peripheral surface of the electroplating shaft along the peripheral direction to restrict the axial movement of the hard disk substrate suspended from the electroplating shaft.
專利文獻1記載的溝槽是形成剖面為V字形狀,從電鍍軸的外圍面的深度為5mm以下。硬碟用基板的厚度是使用0.8mm或1.3mm。專利文獻2記載的溝槽為剖面呈方形,從電鍍軸的外圍面具有寬度0.5mm~1.5mm,且深度為1.5mm~3mm的尺寸。尤其是相對於硬碟用基板的厚度0.8mm,具有溝槽的寬度1mm,深度為2.5mm的尺寸。 [先前技術文獻] [專利文獻]The groove described in Patent Document 1 is formed to have a V-shaped cross section, and the depth from the outer peripheral surface of the plating shaft is 5 mm or less. The thickness of the hard disk substrate is 0.8mm or 1.3mm. The groove described in Patent Document 2 has a square cross section, has a width of 0.5 mm to 1.5 mm from the peripheral surface of the plating shaft, and a size of 1.5 mm to 3 mm in depth. In particular, the groove has a width of 1 mm and a depth of 2.5 mm with respect to the thickness of the substrate for a hard disk of 0.8 mm. [Prior Art Literature] [Patent Document]
專利文獻1:日本特開平9-157857號公報 專利文獻2:日本特開平9-71869號公報Patent Document 1: Japanese Patent Application Laid-Open No. 9-157857 Patent Document 2: Japanese Patent Application Laid-Open No. 9-71869
但是,專利文獻1記載的溝槽為剖面是以V字形狀所形成,所以垂吊支撐於電鍍軸的硬碟用基板僅使得形成硬碟用基板之貫穿孔的內壁的角部點接觸於溝槽的內壁面。因此,以穩定的姿勢狀態支撐硬碟用基板困難,使硬碟用基板的支撐變得不足。剖面為V字形狀的溝槽具體是如第7圖表示,具備形成在電鍍軸J的外圍面g的一方的傾斜面a,及具有與一方的傾斜面a相對的另一方的傾斜面b的傾斜部K。專利文獻1記載的溝槽中,藉著電動軸從動旋轉硬碟用基板時,如第8(a)圖表示,在硬碟用基板P產生大的振動,會切削傾斜部K的傾斜面a、b成為異物而混入電鍍液,附著於電鍍表面導致電鍍不良的所謂的小結塊產生的問題。However, the groove described in Patent Document 1 is formed in a V-shaped cross section, so that the hard disk substrate suspended and supported on the plating shaft only makes point contact with the corners of the inner walls of the through-holes forming the hard disk substrate. the inner wall of the groove. Therefore, it is difficult to support the hard disk substrate in a stable posture state, and the support of the hard disk substrate becomes insufficient. Specifically, as shown in FIG. 7, the groove having a V-shaped cross section has one inclined surface a formed on the outer peripheral surface g of the plating axis J, and has the other inclined surface b opposing the one inclined surface a. Inclined part K. In the groove described in Patent Document 1, when the hard disk substrate is driven and rotated by the electric shaft, as shown in FIG. a and b become foreign matter and mix into the electroplating solution, and adhere to the electroplating surface to cause the problem of so-called small agglomeration that causes poor electroplating.
又,如第8(b)圖表示,在硬碟用基板P彼此之間,設有襯墊S的場合,會有因硬碟用基板P的振動使硬碟用基板P的外圍面部與襯墊S衝突,切削襯墊S,而成為異物混入電鍍液,附著於硬碟用基板P的電鍍面導致電鍍不良的所謂的小結塊產生的問題。Also, as shown in FIG. 8(b), when the spacer S is provided between the substrates P for the hard disk, the outer peripheral surface of the substrate P for the hard disk and the spacer may be caused by the vibration of the substrate P for the hard disk. The pad S collides, cuts the spacer S, and becomes a problem that foreign matter is mixed into the plating solution and adheres to the plated surface of the hard disk substrate P, causing a problem of so-called small lumps that cause plating failure.
專利文獻2記載的溝槽也是與專利文獻1記載的溝槽的場合相同,硬碟用基板的支撐不足,在從動旋轉硬碟用基板時會有對應碟用基板產生大的振動之虞。因此,會有因與其他的零組件衝突而傷及硬碟用基板的電鍍表面之虞,或切削電鍍軸成為異物混入電鍍液內,附著於電鍍表面成為電鍍不良的所謂的小結塊產生的問題。尤其是厚度為0.5mm~0.63mm左右的薄的硬碟用基板的場合,會有振動的產生顯著形成的問題。 The groove described in Patent Document 2 is also the same as the groove described in Patent Document 1. The support of the hard disk substrate is insufficient, and there is a possibility that a large vibration will be generated in the corresponding disk substrate when the hard disk substrate is driven to rotate. Therefore, there is a possibility that the plated surface of the hard disk substrate may be damaged due to collision with other components, or the chipped plated axis may become foreign matter mixed into the plating solution, and adhere to the plated surface to form a problem of so-called small lumps of poor plating. . In particular, in the case of a thin hard disk substrate having a thickness of about 0.5 mm to 0.63 mm, there is a problem that vibrations are significantly generated.
本發明是為解決如以上的問題所研創而成,提供一種可以穩定的姿勢狀態支撐硬碟用基板,在硬碟用基板電鍍時可抑制硬碟用基板的振動產生的硬碟用基板的電鍍支架為課題。 The present invention was developed to solve the above problems, and provides a hard disk substrate plating that can support the hard disk substrate in a stable posture and suppress the vibration of the hard disk substrate during plating. The bracket is the subject.
(1)本發明相關的硬碟用基板的電鍍支架,具備:插入中心具有貫穿孔的硬碟用基板之上述貫穿孔的軸主體,及凹設於該軸主體的表面並將上述硬碟用基板以垂吊支撐於上述軸主體的狀態使上述硬碟用基板的一部分進入的溝槽之硬碟用基板的電鍍支架,其特徵為:該電鍍支架,使用於具有0.8mm以下的厚度的硬碟用基板,上述溝槽是以在上述硬碟用基板的一部分進入垂直部的狀態,使上述硬碟用基板的厚度與上述垂直部的寬度的差成為0.04mm以上,且0.3mm以下的方式,形成上述垂直部的寬度。 (1) The electroplating holder of the hard disk substrate related to the present invention has: a shaft main body inserted into the above-mentioned through hole of the hard disk substrate having a through hole in the center; A plating holder for a hard disk substrate in a groove in which a part of the above-mentioned hard disk substrate enters in a state in which the substrate is suspended from the shaft main body, wherein the plating holder is used for a hard disk having a thickness of 0.8 mm or less. In the disk substrate, the groove is in a state where a part of the hard disk substrate enters the vertical portion, and the difference between the thickness of the hard disk substrate and the width of the vertical portion is 0.04 mm or more and 0.3 mm or less. , forming the width of the above-mentioned vertical portion.
(2)本發明相關的硬碟用基板的電鍍支架, 係於(1)記載的硬碟用基板的電鍍支架中,其特徵為:上述垂直部的深度為0.1mm以上,且為1.0mm以下。 (2) The electroplating bracket of the hard disk substrate related to the present invention, In the plating holder for a hard disk substrate according to (1), the depth of the vertical portion is not less than 0.1 mm and not more than 1.0 mm.
(3)本發明相關的硬碟用基板的電鍍支架,係於(1)或(2)記載的硬碟用基板的電鍍支架中,其特徵為:上述垂直部的開口部的角具有圓形的形狀。 (3) The electroplating holder of the hard disk substrate related to the present invention is in the electroplating holder of the hard disk substrate described in (1) or (2), and it is characterized in that: the angle of the opening of the above-mentioned vertical part has a round shape shape.
(4)本發明相關的硬碟用基板的電鍍支架,係於(1)~(3)的其中任一記載的硬碟用基板的電鍍支架中,其特徵為:上述溝槽沿著上述軸主體的周圍方向連續地設置,具有平坦的底面及與該底面正交的一對內壁面的垂直部。 (4) The electroplating bracket for a hard disk substrate related to the present invention is the electroplating bracket for a hard disk substrate described in any one of (1) to (3), and it is characterized in that: the above-mentioned groove is along the above-mentioned axis The main body is provided continuously in the peripheral direction, and has a flat bottom surface and a pair of vertical portions of the inner wall surfaces perpendicular to the bottom surface.
(5)本發明相關的硬碟用基板的電鍍支架,係於(1)~(4)的其中任一記載的硬碟用基板的電鍍支架中,其特徵為:硬碟用基板的電鍍支架的材質是選擇聚四氟乙烯(PTFE)、聚偏二氟乙烯(PVDF)、聚醚醚酮(PEEK)及聚醚醚銅(PEEK)與聚四氟乙烯(PTFE)的混合材料的其中之一。 (5) The electroplating support for the substrate for the hard disk related to the present invention belongs to the electroplating support for the substrate for the hard disk described in any one of (1) to (4), and is characterized in that: the electroplating support for the substrate for the hard disk The material is selected from polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polyetheretherketone (PEEK) and polyether ether copper (PEEK) mixed with polytetrafluoroethylene (PTFE). one.
(6)本發明相關的硬碟用基板的製造方法,其特徵為:使用(1)~(5)的其中任一記載的硬碟用基板的電鍍支架。 (6) The method for manufacturing a substrate for a hard disk according to the present invention is characterized by using the plating holder for a substrate for a hard disk described in any one of (1) to (5).
上述(1)記載之本發明相關的硬碟用基板的電鍍支架是與硬碟用基板之間的寬方向的餘隙以成為0.04mm以上,且0.3mm以下的寬度形成溝槽。藉此構成,抑制起因於超過0.3mm的大間隙之硬碟用基板的振動產生。並且,也可防止起因於振動之內徑附近的刮痕。並且,防止起因於成為小於0.04mm的小間隙之電鍍厚度的薄膜化。In the plating holder for a hard disk substrate according to the present invention described in (1) above, grooves are formed so that the gap in the width direction between the hard disk substrate and the hard disk substrate is 0.04 mm or more and 0.3 mm or less in width. With this configuration, the generation of vibration of the hard disk substrate due to the large gap exceeding 0.3mm is suppressed. In addition, scratches in the vicinity of the inner diameter due to vibration can also be prevented. In addition, thinning of the plating thickness due to a small gap of less than 0.04 mm is prevented.
上述(2)記載之本發明相關的硬碟用基板的電鍍支架,形成深度0.1mm以上,且1.0mm以下的溝槽。藉此構成,抑制起因於深度小於0.1mm的淺溝槽之硬碟用基板的振動產生。並且,防止起因於深度大於1.0mm的深溝槽之電鍍厚度的薄膜化。In the plating holder of the hard disk substrate of the present invention described in (2) above, grooves having a depth of not less than 0.1 mm and not more than 1.0 mm are formed. With this configuration, the generation of vibration of the hard disk substrate caused by the shallow groove with a depth of less than 0.1 mm is suppressed. In addition, it prevents thinning of the plating thickness due to deep trenches with a depth greater than 1.0 mm.
上述(3)記載之本發明相關的硬碟用基板的電鍍支架為溝槽的開口部的角具有圓形。藉此構成,防止在開口部的角有毛刺的產生,防止刮痕附著在支撐於溝槽的硬碟用基板。In the plating holder of the hard disk substrate according to the present invention described in (3) above, the corners of the openings of the grooves are rounded. With this structure, generation of burrs at the corners of the opening is prevented, and scratches are prevented from adhering to the hard disk substrate supported by the groove.
上述(4)記載之本發明相關的硬碟用基板的電鍍支架是溝槽的底面為平坦,使得底面與溝槽的內壁面正交。藉此構成,可以穩定的姿勢狀態支撐硬碟用基板,抑制振動的產生。In the electroplating support for the hard disk substrate of the present invention described in (4) above, the bottom surface of the groove is flat so that the bottom surface is perpendicular to the inner wall surface of the groove. With this configuration, the hard disk substrate can be supported in a stable posture state, and the occurrence of vibration can be suppressed.
上述(5)記載之本發明相關的硬碟用基板的電鍍支架是硬碟用基板的電鍍支架的材質為聚四氟乙烯(PTFE)、聚偏二氟乙烯(PVDF)、聚醚醚酮(PEEK)或聚醚醚銅(PEEK)及聚四氟乙烯(PTFE)的混合材料。藉此構成,確保電鍍支架的高耐磨損性、對於酸及鹼的高抗藥性、高電絕緣性及高機械強度。又,藉此構成,抑制異物從電鍍支架的產生。The electroplating support of the hard disk substrate of the present invention related to the above (5) is that the material of the electroplating support of the hard disk substrate is polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polyether ether ketone ( PEEK) or a mixture of polyether ether copper (PEEK) and polytetrafluoroethylene (PTFE). With this structure, high wear resistance of the electroplating bracket, high chemical resistance to acid and alkali, high electrical insulation and high mechanical strength are ensured. Also, with this configuration, the generation of foreign matter from the plating holder is suppressed.
上述(6)記載之本發明相關的硬碟用基板的製造方法是使用(1)~(5)其中任一記載的電鍍支架製造硬碟用基板,因此可以穩定的姿勢狀態支撐硬碟用基板,在硬碟用基板電鍍時可抑制硬碟用基板的振動產生,也可抑制起因於振動之內徑附近的刮痕,並且,防止起因於小間隙之電鍍厚度的薄膜化。The method for manufacturing a substrate for a hard disk according to the present invention described in (6) above is to use the electroplating holder described in any one of (1) to (5) to manufacture a substrate for a hard disk, so that the substrate for a hard disk can be supported in a stable posture state , It can suppress the vibration of the hard disk substrate during electroplating, and can also suppress the scratches near the inner diameter caused by the vibration, and prevent the thinning of the plating thickness caused by the small gap.
根據本發明,提供一種硬碟用基板的電鍍支架,可以穩定的姿勢狀態支撐硬碟用基板,在硬碟用基板電鍍時可抑制硬碟用基板的振動產生。According to the present invention, there is provided a plating holder for a hard disk substrate capable of supporting the hard disk substrate in a stable posture and suppressing vibration of the hard disk substrate during electroplating of the hard disk substrate.
針對運用本發明相關的硬碟用基板的電鍍支架之實施形態相關的硬碟用基板的電鍍支架10參閱圖示進行說明。A
首先,裝設在硬碟用基板的電鍍支架10的硬碟用基板P說明。硬碟用基板P是如第1(a)圖、第1(b)圖表示,以厚度為t、外徑為D、中心的貫穿孔h的內徑為d的圓盤所構成。具有厚度t為0.5mm~2mm左右、外徑D為30mm~ 270mm左右、內徑d為10mm~70mm左右的尺寸。First, the hard disk substrate P of the
硬碟用基板P的材料是由鋁合金、玻璃、陶磁等的板材所構成。硬碟用基板P具有高精度的平滑性與表面硬度,也具有可抑制因高速旋轉導致振動產生的高剛性及耐衝擊性。為具備該等的特性硬碟用基板P是以硬的原材形成。The material of the hard disk substrate P is made of plate materials such as aluminum alloy, glass, and ceramics. The hard disk substrate P has high-precision smoothness and surface hardness, and also has high rigidity and impact resistance that can suppress vibration caused by high-speed rotation. In order to have these characteristics, the substrate P for a hard disk is formed of a hard raw material.
又,硬碟用基板P是進行基底的表面處理,在表面處理之後進行電鍍處理,在電鍍處理後,研磨表面與以鏡面化所構成。作為電鍍處理,本實施形態進行無電解鎳-磷(NiP)電鍍。In addition, the substrate P for a hard disk is subjected to surface treatment of the base, electroplating treatment is performed after the surface treatment, and the surface is polished and mirror-finished after the electroplating treatment. As the plating treatment, in this embodiment, electroless nickel-phosphorus (NiP) plating is performed.
硬碟用基板P的電鍍支架10是如第2圖、第3(a)圖、第3(b)圖表示,具備插入硬碟用基板P的貫穿孔h的電鍍軸20。電鍍軸20是如第3(b)圖表示,具有軸主體21、芯材22及一對的蓋子23。在軸主體21形成有貫穿軸線方向的貫穿孔21a,貫穿孔21a插入有芯材22。在將芯材22插入之後安裝蓋子23以封閉貫穿孔21a兩側的開口端。The
軸主體21是以合成樹脂製材料所構成,較佳是以聚四氟乙烯(PTFE),更佳是以聚偏二氟乙烯(PVDF),最好是以聚醚醚酮(PEEK)或聚醚醚銅(PEEK)及聚四氟乙烯(PTFE)的混合材料所構成。該等的材料具有對於酸及鹼的高抗藥性,從耐磨損性、電絕緣性及機械強度等觀點由其平衡可選擇其中之一。又,該等的合成樹脂製材料在不妨礙硬碟用基板的製造的範圍也可以是其他成分的混合材料。The
軸主體21具有比硬碟用基板P的貫穿孔h小徑的外圍面部21b,在其外圍面部21b凹設有溝槽30。溝槽30具有以將硬碟用基板P垂吊支撐於軸主體21的狀態使硬碟用基板P的一部分進入至內周圍端部的大小。溝槽30是在與軸主體21的軸線方向正交的方向以預定的寬度及預定的深度所形成,在硬碟用基板P的內周圍端部進入溝槽30的狀態,以與硬碟用基板P之間的寬方向的餘隙C成為0.04mm以上,且0.3mm以下的方式,形成溝槽30的寬度。The
複數的溝槽30是如第3(a)圖、第3(b)圖表示,分別沿著軸主體21的周圍方向呈周圍狀連續地設置,在軸主體21的軸向隔著預定間隔例如設置60個左右。溝槽30是如第4(a)圖、第4(b)圖表示,具有:從外圍面部21b朝著軸主體21的軸心傾斜的傾斜部31;從傾斜部31的軸心側的端部朝軸心形成垂直的垂直部32;及傾斜部31與垂直部32交叉的角部33。The plurality of
傾斜部31具有:一方的傾斜面31a,及與一方的傾斜面31a相對的另一方的傾斜面31b,傾斜面31a與傾斜面31b所成的角是以θ(度)所形成,傾斜部31的開口是以寬度W1(mm)所形成。所成的角θ及寬度W1是可根據電鍍軸10的構造、大小、形狀等的設定諸條件或實驗值等的數據適當選擇。The inclined portion 31 has: one
在將軸主體21插穿於硬碟用基板P的貫穿孔h垂吊支撐於硬碟用基板P的場合,以使得硬碟用基板P的內周圍端部容易進入溝槽30之垂直部32的方式,以所成角θ是例如100度左右、寬度W1為6mm左右、從外圍面部21b到傾斜部31與垂直部32交叉的角部33為止的深度DP1為2.2mm左右所形成。並且,也可以不形成此傾斜部31,而是從軸主體21的外圍面部21b直接形成垂直部32。When the shaft
垂直部32是如第4(b)圖表示,具有:一方的內壁面32a;與一方的內壁面32a相對的另一方的內壁面32b;及底面32c。一方的內壁面32a與另一方的內壁面32b之間是以寬度W2(mm)(參閱第4(a)圖)所形成,垂直部32是以深度DP2(mm)所形成。此寬度W2是形成使硬碟用基板P的厚度t與寬度W2的差(W2-t),即與硬碟用基板P之間的寬方向的餘隙C成為0.04mm以上,且0.3mm以下。並且,當餘隙C在硬碟用基板P位於寬度W2的中心部的場合,成為間隙C1與間隙C2的合計。As shown in FIG. 4(b), the
因此,包括硬碟用基板P的厚度t,寬度W2是形成為t+C。並且,硬碟用基板P的厚度t為0.63mm的場合,寬度W2是以0.67mm~0.75mm為佳。並且,藉此垂直部32,如第5(b)圖表示,支撐硬碟用基板P的貫穿孔h的內周圍端部。Therefore, including the thickness t of the hard disk substrate P, the width W2 is formed to be t+C. In addition, when the thickness t of the hard disk substrate P is 0.63 mm, the width W2 is preferably 0.67 mm to 0.75 mm. In addition, the
並且,餘隙C小於0.04mm時,朝間隙之電鍍液的侵入不足而會使電鍍厚度變薄,硬碟用基板P的貫穿孔h的角部,即ID槽附近會有刮痕產生。餘隙C超過0.3mm時,會因溝槽30對硬碟用基板P的支撐變得不足,在以電鍍軸20從動旋轉硬碟用基板P時會有在硬碟用基板P產生大的振動。Furthermore, when the clearance C is less than 0.04mm, the penetration of the plating solution into the gap is insufficient and the plating thickness becomes thinner, and scratches occur at the corners of the through-hole h of the hard disk substrate P, that is, near the ID groove. When the clearance C exceeds 0.3mm, the support of the substrate P for the hard disk due to the
垂直部32的深度DP2是以從垂直部32與傾斜部31的交叉角部33到底面32c為止的距離(mm)表示。具體而言,在角部33形成有後述的倒角R,深度DP2是以從角部33的倒角R的中心到底面32c為止的距離表示。The depth DP2 of the
並且,深度DP2是以0.1mm以上,且1.0mm以下為佳,以0.3mm以下更佳。深度DP2小於0.1mm時,藉溝槽30對硬碟用基板P的支撐變得不足,會有大的振動產生。深度DP2超過1.0mm時,朝間隙之電鍍液的侵入不足而會使電鍍厚度變薄,在ID槽附近會有刮痕產生。In addition, the depth DP2 is preferably not less than 0.1 mm and not more than 1.0 mm, more preferably not more than 0.3 mm. When the depth DP2 is less than 0.1 mm, the support of the hard disk substrate P by the
底面32c是沿著軸主體21的軸心形成為平坦,使底面32c與垂直部32的一方的內壁面32a正交,並使得底面32c與垂直部32的另一方的內壁面32b正交。並且,底面32c與一方的內壁面32a及另一方的內壁面32b正交的角部,也可以是硬碟用基板P的貫穿孔h的角部不干涉範圍的小的圓形或小的傾斜。The
角部33的倒角R只要是帶圓形的即可,在角部33形成圓形,藉此除去角部產生的毛刺,防止硬碟用基板P的刮痕產生。The chamfer R of the
芯材22是由纖維強化樹膠或金屬等具有高剛性的材料所構成,插入軸主體21,可提升電鍍軸20的機械強度。一對蓋子23是以和軸主體21相同的材料所構成,單方的蓋子23是如第2圖表示,插入設置於電鍍設備的齒輪,藉此齒輪構成使電鍍軸20旋轉。The
朝電鍍軸20,如第5(a)圖表示,對應複數個,例如形成於軸主體21的溝槽30,插入60個左右的硬碟用基板P。此外,電鍍軸20是將設置於電鍍設備的襯墊S設定在各硬碟用基板P之間所構成。Towards the plating
電鍍軸20是以設定著硬碟用基板P與襯墊S的狀態,裝設於電鍍設備,以浸漬在浴液內的狀態旋轉驅動。垂吊支撐於電鍍軸20的硬碟用基板P是藉電鍍軸20在浴內從動旋轉施以表面處理,在表面處理的結束後與電鍍軸20一起從浴內提起。The plating
硬碟用基板P是藉著在(1)脫脂、(2)酸蝕刻、(3)脫垢、(4)1st鋅酸鹽、(5)脫鋅酸鹽、(6)2nd鋅酸鹽、(7)無電解NiP電鍍及各步驟間的水洗之浸漬於各步驟的浴液對硬碟用基板P的表面施以表面處理。電鍍軸20不限於上述(1)~(7),可將硬碟用基板P浸漬於浴液,在浴內使用於從動旋轉的步驟,例如也可使用於上述(1)~(7)的一部分的步驟,但是以使用所有的步驟為佳。Substrate P for hard disk is obtained by (1) degreasing, (2) acid etching, (3) descaling, (4) 1st zincate, (5) dezincate, (6) 2nd zincate, (7) Electroless NiP Plating and Water Washing Between Each Step Immersion in the bath liquid of each step Surface treatment is given to the surface of the substrate P for a hard disk. The
接著,針對本實施形態相關之硬碟用基板P的電鍍支架10的實施例及比較例說明。製作本實施形態相關之硬碟用基板P的電鍍支架10的實施例相關的電鍍支架及比較例的相關電鍍支架,將硬碟用基板P安裝於電鍍支架,針對第6(a)圖的表的各項目進行評估。針對實施例1~15與比較例1~3分別評估。以下,針對各實施例及各比較例說明。Next, examples and comparative examples of the
(實施例1)
實施例1是如第6(a)圖表示,作為硬碟用基板P,使用厚度t為0.63mm、外徑D為95mm、內徑d為25mm的鋁合金製的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.70mm。因此,溝槽30與硬碟用基板P之間的寬方向的餘隙C是成為W2-t,即0.70mm-0.63mm= 0.07mm。溝槽30的角部33的倒角R為0.2mm。設溝槽30之垂直部32的深度DP2為0.8mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 1)
In Example 1, as shown in FIG. 6( a ), as the hard disk substrate P, an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm was used. The width W2 of the
在實施例1中,將電鍍軸20形成長度比構成實際之電鍍設備的電鍍軸20短,可支撐10個左右的硬碟用基板P。電鍍軸20以外的其他構成是藉著與構成實際之電鍍設備的構成元件同樣所構成的實驗機進行評估。硬碟用基板P進行基底的表面處理,在表面處理之後進行與實際的電鍍設備之電鍍處理相同的無電解鎳-磷(NiP)電鍍的電鍍處理。In Embodiment 1, the plating
相對於如以上構成之實施例1相關的硬碟用基板P,針對基板的振動、內徑附近(內周圍端部)的刮痕、內徑附近(內周圍端部)的電鍍厚度的3項目進行評估。基板的振動是以目視觀察藉實驗機施以電鍍處理的硬碟用基板P。以◎表示幾乎不存在有硬碟用基板P的搖動。在與裝設於第7圖表示習知的電鍍軸J的實施例1相同之硬碟用基板P產生的振動比較,硬碟用基板P的振動有相當改善的是以○表示。With respect to the hard disk substrate P related to Example 1 constituted as above, three items of vibration of the substrate, scratches near the inner diameter (inner peripheral end), and plating thickness near the inner diameter (inner peripheral end) to evaluate. The vibration of the substrate was visually observed on the substrate P for a hard disk that was plated with a testing machine. ⊚ indicates that there is almost no shaking of the substrate P for a hard disk. Compared with the vibration generated by the same hard disk substrate P as that of Example 1 in which the conventional plating shaft J is shown in FIG. 7, the vibration of the hard disk substrate P is considerably improved.
並且,習知的電鍍軸J是構成與實施形態相關的電鍍軸20相同,僅形成在電鍍軸的溝槽不同。具體而言,習知的電鍍軸J的溝槽是如第7圖表示,具備傾斜部K。傾斜部K具有:一方的傾斜面a,及與一方的傾斜面a相對的另一方的傾斜面b,傾斜面a與傾斜面b所成的角度是以100度形成,傾斜部K的開口是以寬度6.6mm形成。又,從傾斜部K的外圍面部g的深度是以2.2mm形成,在傾斜部的底部以0.2mm形成倒角R。In addition, the conventional plating shaft J has the same configuration as the plating
又,與裝設於習知之電鍍軸J的硬碟用基板P產生的振動比較,硬碟用基板P的振動稍有改善的是以△表示。並且,與裝設在習知的電鍍軸J之硬碟用基板P產生的振動相同振動的是以×表示。In addition, the vibration of the hard disk substrate P is slightly improved compared with the vibration generated by the hard disk substrate P mounted on the conventional plating shaft J, which is indicated by △. In addition, the same vibration as the vibration generated in the hard disk substrate P mounted on the known plating shaft J is indicated by x.
內徑附近(內周圍端部)的刮痕是以光顯微鏡觀察硬碟用基板P的貫穿孔h的角部附近,即ID槽附近,使用習知的電鍍軸J與硬碟用基板P之ID槽附近的刮痕比較來判定刮痕的程度。以○表示與習知同等的刮痕,與習知比較刮痕稍微多的是以△表示,與習知比較有多數存在刮痕的是以×表示。Scratches near the inner diameter (inner peripheral end) are observed with a light microscope near the corner of the through-hole h of the hard disk substrate P, that is, near the ID groove, using a known electroplating axis J and the hard disk substrate P. The scratches near the ID groove are compared to determine the degree of scratches. Scratches equivalent to conventional ones are indicated by ○, those with slightly more scratches than conventional ones are indicated by △, and those with more scratches than conventional ones are indicated by ×.
內徑附近(內周圍端部)的電鍍厚度是以雷射顯微鏡測量從硬碟用基板P的外圍附近朝貫穿孔h的平面部到ID槽附近為止的高度,即厚度。針對ID槽附近的厚度變薄的觀察剖面,與平面部比較驗證電鍍厚度是否變薄。與使用習知的電鍍軸J電鍍的硬碟用基板P之ID槽附近的電鍍厚度比較進行評估。The plating thickness in the vicinity of the inner diameter (inner peripheral end) is the height measured with a laser microscope from the vicinity of the periphery of the hard disk substrate P toward the flat portion of the through hole h to the vicinity of the ID groove, that is, the thickness. Regarding the observed section where the thickness becomes thinner near the ID groove, compare it with the flat part to verify whether the plating thickness is thinner. Compared with the plating thickness near the ID groove of the hard disk substrate P plated using the conventional plating axis J, the evaluation was carried out.
以○表示與習知同等的厚度,與習知比較雖顯示變薄,但是剖面觀察的結果電鍍厚度與平面部比較以△表示確保有80%的厚度,剖面觀察的結果電鍍厚度與平面部比較不能確保有80%厚度的則以×表示。○ indicates the same thickness as the conventional one. Compared with the conventional one, it is thinner, but the plating thickness is compared with the flat part as a result of cross-sectional observation. △ indicates that 80% of the thickness is ensured. The plating thickness is compared with the flat part as a result of cross-sectional observation. If 80% of the thickness cannot be ensured, it is indicated by ×.
評估實施例1相關之硬碟用基板P的結果,基板的振動為◎,內徑附近的刮痕為△,內徑附近的電鍍厚度為△。因此,可確認實施例1相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 1, the vibration of the substrate was ◎, the scratch near the inner diameter was Δ, and the plating thickness near the inner diameter was Δ. Therefore, it was confirmed that the plating
(實施例2)
實施例2是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.70mm,餘隙C為0.07mm。溝槽30的角部33的倒角部R為1.0mm。設溝槽30的垂直部32的深度DP2為0.1mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 2)
Example 2 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例2相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。As in Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 2, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were the same as those in Example 1. Evaluate similarly.
評估實施例2相關之硬碟用基板P的結果,基板的振動為○,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例2相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 2, the vibration of the substrate was ○, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例3)
實施例3是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.70mm,餘隙C為0.07mm。溝槽30的角部33的倒角部R為0.4mm。設溝槽30的垂直部32的深度DP2為0.15mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 3)
Example 3 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例3相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 3, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.
評估實施例3相關之硬碟用基板P的結果,基板的振動為○,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例3相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 3, the vibration of the substrate was ○, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例4)
實施例4是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.70mm,餘隙C為0.07mm。溝槽30的角部33的倒角部R為0.4mm。設溝槽30的垂直部32的深度DP2為0.25mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 4)
Example 4 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例4相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 4, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.
評估實施例4相關之硬碟用基板P的結果,基板的振動為○,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例4相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 4, the vibration of the substrate was ○, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例5)
實施例5是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.70mm,餘隙C為0.07mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為0.3mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 5)
Example 5 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例5相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 5, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.
評估實施例5相關之硬碟用基板P的結果,基板的振動為◎,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例5相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 5, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例6)
實施例6是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.70mm,餘隙C為0.07mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為0.3mm。以聚四氟乙烯(PTFE)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 6)
Example 6 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例6相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 6, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.
評估實施例6相關之硬碟用基板P的結果,基板的振動為◎,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例6相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 6, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例7)
實施例7是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.70mm,餘隙C為0.07mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為0.3mm。以聚醚醚酮(PEEK)及聚四氟乙烯(PTFE)的混合材料形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 7)
Example 7 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例7相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 7, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.
評估實施例7相關之硬碟用基板P的結果,基板的振動為◎,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例7相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 7, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例8)
實施例8是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.70mm,餘隙C為0.07mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為0.3mm。以聚偏二氟乙烯(PVDF)形成構成電鍍軸20的軸主體21及一對蓋子23。(Embodiment 8)
Example 8 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例8相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 8, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.
評估實施例8相關之硬碟用基板P的結果,基板的振動為◎,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例8相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 8, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例9)
實施例9是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.67mm,餘隙C為0.04mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為0.3mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 9)
Example 9 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例9相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 9, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.
評估實施例9相關之硬碟用基板P的結果,基板的振動為◎,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例9相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 9, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例10)
實施例10是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.80mm,餘隙C為0.17mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為0.2mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 10)
Example 10 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例10相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 10, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.
評估實施例10相關之硬碟用基板P的結果,基板的振動為○,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例10相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 10, the vibration of the substrate was ○, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例11)
實施例11是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.90mm,餘隙C為0.27mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為0.2mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 11)
Example 11 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例11相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 11, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.
評估實施例11相關之硬碟用基板P的結果,基板的振動為△,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例11相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 11, the vibration of the substrate was Δ, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例12)
實施例12是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.90mm,餘隙C為0.27mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為0.8mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 12)
Example 12 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例12相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 12, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were the same as those in Example 1. Evaluate similarly.
評估實施例12相關之硬碟用基板P的結果,基板的振動為◎,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例12相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 12, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例13)
實施例13是與實施例1同樣,硬碟用基板P是厚度t為0.50mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.55mm,餘隙C為0.05mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為0.3mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 13)
Example 13 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.50 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例13相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 13, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.
評估實施例13相關之硬碟用基板P的結果,基板的振動為◎,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例13相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 13, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例14)
實施例14是與實施例1同樣,硬碟用基板P是厚度t為0.50mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.57mm,餘隙C為0.07mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為0.3mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 14)
Example 14 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.50 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例14相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 14, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate similarly.
評估實施例14相關之硬碟用基板P的結果,基板的振動為◎,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例14相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 14, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(實施例15)
實施例15是與實施例1同樣,硬碟用基板P是厚度t為0.80mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.87mm,餘隙C為0.07mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為0.3mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(Example 15)
Example 15 is the same as Example 1, and the hard disk substrate P is an aluminum substrate made of aluminum alloy with a thickness t of 0.80 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於實施例15相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。Similar to Example 1, the electroplating process was carried out by the experimental machine. For the hard disk substrate P related to Example 15, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were the same as those in Example 1. Evaluate similarly.
評估實施例15相關之硬碟用基板P的結果,基板的振動為◎,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認實施例15相關的電鍍軸20為良好。As a result of evaluating the hard disk substrate P related to Example 15, the vibration of the substrate was ◎, the scratch near the inner diameter was ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plating
(比較例1)
比較例1是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。電鍍軸是使用第7圖的習知的電鍍軸J。因此,如第6(a)圖表示,未形成與實施例1相同的溝槽30的垂直部32,顯示不具有溝槽。以聚醚醚酮(PEEK)形成構成電鍍軸J的軸主體及一對蓋子。(comparative example 1)
In Comparative Example 1, the same as in Example 1, the hard disk substrate P has a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm, and is made of an aluminum alloy. The plating axis is the conventional plating axis J of FIG. 7 . Therefore, as shown in FIG. 6( a ), the
與實施例1同樣,藉實驗機進行電鍍處理,對於比較例1相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。As in Example 1, electroplating was performed on a test machine. For the hard disk substrate P related to Comparative Example 1, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with those in Example 1. Evaluate similarly.
評估比較例1相關之硬碟用基板P的結果,基板的振動為×,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認比較例1相關的電鍍軸J之基板的振動大,不適合於電鍍軸。As a result of evaluating the hard disk substrate P related to Comparative Example 1, the vibration of the substrate was rated as x, the scratches near the inner diameter were rated as ○, and the plating thickness near the inner diameter was rated as ○. Therefore, it was confirmed that the plating shaft J related to Comparative Example 1 had a large vibration of the substrate and was not suitable for the plating shaft.
(比較例2)
比較例2是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為1.00mm,餘隙C為0.37mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為0.2mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(comparative example 2)
In Comparative Example 2, the same as in Example 1, the hard disk substrate P has a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm, and is made of an aluminum alloy. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於比較例2相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。As in Example 1, the electroplating process was performed on a test machine. For the hard disk substrate P related to Comparative Example 2, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with those in Example 1. Evaluate similarly.
評估比較例2相關之硬碟用基板P的結果,基板的振動為×,內徑附近的刮痕為○,內徑附近的電鍍厚度為○。因此,可確認比較例2相關的電鍍軸J之基板的振動大,不適合於電鍍軸。As a result of evaluating the hard disk substrate P related to Comparative Example 2, the vibration of the substrate was rated as x, the scratches near the inner diameter were rated as ○, and the plating thickness near the inner diameter was rated as ○. Therefore, it was confirmed that the plating shaft J related to Comparative Example 2 had a large vibration of the substrate and was not suitable for the plating shaft.
(比較例3)
比較例3是與實施例1同樣,硬碟用基板P是厚度t為0.63mm、外徑D為95mm、內徑d為25mm,使用鋁合金構成的鋁基板。設構成電鍍軸20的軸主體21之溝槽30的垂直部32的寬度W2為0.70mm,餘隙C為0.07mm。溝槽30的角部33的倒角部R為0.2mm。設溝槽30的垂直部32的深度DP2為1.1mm。以聚醚醚酮(PEEK)形成構成電鍍軸20的軸主體21及一對蓋子23。(comparative example 3)
In Comparative Example 3, the same as in Example 1, the hard disk substrate P has a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm, and is made of an aluminum alloy. The width W2 of the
與實施例1同樣,藉實驗機進行電鍍處理,對於比較例3相關的硬碟用基板P,針對基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目與實施例1同樣地進行評估。As in Example 1, electroplating was performed on a test machine. For the hard disk substrate P related to Comparative Example 3, the three items of vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with those in Example 1. Evaluate similarly.
評估比較例3相關之硬碟用基板P的結果,基板的振動為◎,內徑附近的刮痕為×,內徑附近的電鍍厚度為×。因此,可確認比較例3相關的電鍍軸J之基板的振動雖然良好,但由於內徑附近的刮痕為×,內徑附近的電鍍厚度為×,可確認不適合於電鍍軸。As a result of evaluating the hard disk substrate P related to Comparative Example 3, the vibration of the substrate was ◎, the scratch near the inner diameter was ×, and the plating thickness near the inner diameter was ×. Therefore, it was confirmed that the vibration of the substrate of the plated shaft J related to Comparative Example 3 was good, but it was confirmed that it was not suitable for the plated shaft because the scratches near the inner diameter were x and the plating thickness near the inner diameter was x.
並且,如第6(b)圖表示,相對於實施例5、實施例7、實施例9、實施例15及比較例1,以實際的電鍍設備進行電鍍,針對小節塊產生率(個/面)進行驗證。小結塊產生率是藉光學式表面檢查裝置,檢查硬碟用基板P的表面,以掃描電子顯微鏡(SEM)或原子間力顯微鏡(AFM)算出成為缺點的突起的個數。判定基準為0.003個/面。並且,光學式表面檢查裝置是使用日立先端科技精密系統(Hitachi High-Tech Fine Systems)公司製的型式RS1390。And, as the 6th (b) figure shows, with respect to embodiment 5, embodiment 7, embodiment 9, embodiment 15 and comparative example 1, carry out electroplating with actual electroplating equipment, for small nodule generation rate (one/face )authenticating. The occurrence rate of small lumps is to inspect the surface of the hard disk substrate P with an optical surface inspection device, and calculate the number of protrusions that become defects with a scanning electron microscope (SEM) or an atomic force microscope (AFM). The criterion for judging is 0.003 pieces/face. In addition, as an optical surface inspection device, model RS1390 manufactured by Hitachi High-Tech Fine Systems was used.
小結塊產生率在實施例5為0.002,實施例7、實施例9及實施例15為0.001,符合判定基準,確認可適合於電鍍軸。相對於此,比較例1的小結塊產生率為0.010,不符合判定基準,可確認不適合於電鍍軸。並且,第6(b)表示的「-」是表示未實施驗證,但針對其他未實施的各實施例,針對硬碟用基板P的基板的振動、內徑附近的刮痕、內徑附近的電鍍厚度的3項目獲得良好的評估結果,因此可推定小結塊產生率也符合判定基準。The rate of occurrence of small lumps was 0.002 in Example 5, and 0.001 in Example 7, Example 9, and Example 15, which met the judgment criteria and were confirmed to be suitable for electroplating shafts. On the other hand, in Comparative Example 1, the occurrence rate of small lumps was 0.010, which did not meet the judgment criteria, and it was confirmed that it was not suitable for the plating axis. In addition, "-" shown in the 6th (b) means that the verification has not been implemented, but for other examples that have not been implemented, the vibration of the substrate P of the hard disk substrate P, the scratches near the inner diameter, and the vibration near the inner diameter Since good evaluation results were obtained for the three items of plating thickness, it can be presumed that the rate of occurrence of small lumps also meets the judgment criteria.
以下,針對本實施形態相關硬碟用基板P之電鍍支架10的效果說明。Hereinafter, the effects of the
本實施形態相關之硬碟用基板P的電鍍支架10是以硬碟用基板P的厚度t與溝槽30的寬度W2的餘隙C為0.04mm以上,且0.3mm以下的寬度W2形成溝槽30。藉此構成,抑制起因於超過0.3mm的餘隙C之硬碟用基板的振動產生,獲得起因於成為小於0.04mm的餘隙C之電鍍厚度的薄膜化的效果。並且,也可獲得起因於振動的內徑附近之刮痕的防止效果。The
又,本實施形態相關之硬碟用基板P的電鍍支架10是以深度為0.1mm以上,且1.0mm以下形成溝槽30。藉此溝槽,可獲得抑制起因於深度形成小於0.1mm的溝槽30之硬碟用基板P的振動產生的效果。並且,可獲得起因於深度超過1.0mm之溝槽30的電鍍厚度薄膜化的效果。In addition, in the
又,本實施形態相關之硬碟用基板P的電鍍支架10為溝槽30的開口部的角具有圓形。藉此構成,防止在開口部的角有毛刺產生,可防止在支撐於溝槽30的硬碟用基板P有刮痕附著的效果。In addition, in the
又,本實施形態相關之硬碟用基板P的電鍍支架10是溝槽30的底面32c為平坦,底面32c與溝槽30的一方的傾斜面31a及另一方的傾斜面31b為正交。藉此構成,在溝槽30的底面32c以穩定的姿勢狀態支撐硬碟用基板P,可獲得抑制振動產生的效果。Also, in the
又,本實施形態相關之硬碟用基板P的電鍍支架10為硬碟用基板P的電鍍支架10的材質是以聚四氟乙烯(PTFE)為佳,更佳為聚偏二氟乙烯(PVDF),最佳為聚醚醚酮(PEEK),或聚醚醚銅(PEEK)及聚四氟乙烯(PTFE)的混合材料所構成。藉此構成,獲得確保電鍍支架10的高耐磨損性、對於酸及鹼的高抗藥性、高電絕緣性及高機械強度的效果。又,本實施形態相關之硬碟用基板P的電鍍支架10,由於具有高耐磨損性、抗藥性,可獲得抑制異物從電鍍支架10產生的效果。Also, the
以上,雖已詳述本發明的實施形態,但本發明不限於上述的實施形態,在不脫離申請專利範圍記載的本發明之精神的範圍內,可進行種種的設計變更。Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-mentioned embodiments, and various design changes can be made without departing from the spirit of the present invention described in the claims.
10‧‧‧電鍍支架
20‧‧‧電鍍軸(電鍍支架)
21‧‧‧軸主體
21a、h‧‧‧貫穿孔
21b‧‧‧外圍面部
22‧‧‧芯材
23‧‧‧蓋子
30‧‧‧溝槽
31‧‧‧傾斜部
31a‧‧‧一方的傾斜面
31b‧‧‧另一方的傾斜面
32‧‧‧垂直部
32a‧‧‧一方的內壁面
32b‧‧‧另一方的內壁面
32c‧‧‧底面
33‧‧‧角部
C、C1、C2‧‧‧餘隙
D‧‧‧外徑
d‧‧‧內徑
DP1、DP2‧‧‧深度
P‧‧‧硬碟用基板
t‧‧‧厚度
R‧‧‧倒角
W1、W2‧‧‧寬度10‧‧‧
第1圖是藉本發明實施形態相關之硬碟用基板的電鍍支架所支撐的硬碟用基板的圖,第1(a)圖表示硬碟用基板的透視圖,第1(b)圖表示硬碟用基板的剖面圖。 第2圖為本發明實施形態相關之硬碟用基板的電鍍支架的透視圖。 第3圖為本發明實施形態相關之硬碟用基板的電鍍支架的圖,第3(a)圖表示硬碟用基板之電鍍支架的側面圖,第3(b)圖表示在第3(a)圖的A-A切斷的剖面圖。 第4圖為本發明實施形態相關之硬碟用基板的電鍍支架的側面圖,第4(a)圖表示溝槽的傾斜部及垂直部,第4(b)圖表示將溝槽的垂直部放大後的放大側面圖。 第5圖是在本發明實施形態相關之硬碟用基板的電鍍支架裝設有硬碟用基板的狀態之硬碟用基板的電鍍支架的圖,第5(a)圖表示硬碟用基板的電鍍支架的透視圖,第5(b)圖表示在硬碟用基板的電鍍支架之溝槽部分切斷後的部分橫剖面圖。 第6圖為本發明實施形態相關之硬碟用基板的電鍍支架的實施例及比較例的表,第6(a)圖表示硬碟用基板的厚度與電鍍支架的構成,第6(b)圖表示實施例及比較例的小結塊產生率。 第7圖是將習知之硬碟用基板的電鍍支架的溝槽放大後的側面圖。 第8圖為習知之硬碟用基板的電鍍支架的圖,第8(a)圖表示溝槽的放大側面圖,第8(b)圖表示硬碟用基板裝設後的狀態之硬碟用基板的電鍍支架的放大側面圖。Fig. 1 is a diagram of a substrate for a hard disk supported by an electroplating support for a substrate for a hard disk according to an embodiment of the present invention. Fig. 1 (a) shows a perspective view of a substrate for a hard disk, and Fig. 1 (b) shows A cross-sectional view of a hard disk substrate. Fig. 2 is a perspective view of a plating holder for a substrate for a hard disk according to an embodiment of the present invention. Fig. 3 is a diagram of an electroplating support for a substrate for a hard disk according to an embodiment of the present invention. Fig. 3 (a) shows a side view of the electroplating support for a substrate for a hard disk. ) A cut-off cross-sectional view of A-A of the figure. Fig. 4 is a side view of an electroplating bracket for a substrate for a hard disk according to an embodiment of the present invention, Fig. 4(a) shows the inclined portion and vertical portion of the groove, and Fig. 4(b) shows the vertical portion of the groove Enlarged side view after zooming in. Fig. 5 is a view of a hard disk substrate plating holder in a state where a hard disk substrate is mounted on a hard disk substrate plating holder according to an embodiment of the present invention, and Fig. 5 (a) shows a hard disk substrate. The perspective view of the electroplating bracket, Figure 5(b) shows a partial cross-sectional view after cutting the groove part of the electroplating bracket of the hard disk substrate. Fig. 6 is a table of examples and comparative examples of electroplating holders for hard disk substrates related to the embodiment of the present invention. Fig. 6 (a) shows the thickness of substrates for hard disks and the structure of electroplating holders. Fig. 6 (b) The figure shows the generation rate of small lumps in Examples and Comparative Examples. Fig. 7 is an enlarged side view of the groove of the electroplating bracket of the conventional hard disk substrate. Fig. 8 is a diagram of a known electroplating support for a substrate for a hard disk, Fig. 8(a) shows an enlarged side view of the groove, and Fig. 8(b) shows the state of the hard disk after the substrate for a hard disk is installed Enlarged side view of the plated holder for the substrate.
20‧‧‧電鍍軸(電鍍支架) 20‧‧‧Electroplating shaft (electroplating bracket)
21‧‧‧軸主體 21‧‧‧Shaft body
21b‧‧‧外圍面部 21b‧‧‧Peripheral face
30‧‧‧溝槽 30‧‧‧groove
31‧‧‧傾斜部 31‧‧‧Inclined part
31a‧‧‧一方的傾斜面 31a‧‧‧inclined surface on one side
31b‧‧‧另一方的傾斜面 31b‧‧‧The inclined surface of the other side
32‧‧‧垂直部 32‧‧‧vertical part
32a‧‧‧一方的內壁面 32a‧‧‧Inner wall surface of one side
32b‧‧‧另一方的內壁面 32b‧‧‧The inner wall of the other side
32c‧‧‧底面 32c‧‧‧Bottom
33‧‧‧角部 33‧‧‧corner
C‧‧‧餘隙 C‧‧‧clearance
C1‧‧‧餘隙 C1‧‧‧clearance
C2‧‧‧餘隙 C2‧‧‧clearance
DP1‧‧‧深度 DP1‧‧‧depth
DP2‧‧‧深度 DP2‧‧‧depth
P‧‧‧硬碟用基板 P‧‧‧substrate for hard disk
R‧‧‧倒角 R‧‧‧Chamfering
W1‧‧‧寬度 W1‧‧‧width
W2‧‧‧寬度 W2‧‧‧width
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JPS62291725A (en) * | 1986-06-10 | 1987-12-18 | Seiko Epson Corp | Manufacture of hard disk |
JPH06306621A (en) * | 1993-04-28 | 1994-11-01 | Fuji Electric Co Ltd | Discoid substrate support |
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JP2011231347A (en) * | 2010-04-23 | 2011-11-17 | Showa Denko Kk | Electroless plating device and magnetic rotation transmission mechanism |
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JPS62291725A (en) * | 1986-06-10 | 1987-12-18 | Seiko Epson Corp | Manufacture of hard disk |
JPH06306621A (en) * | 1993-04-28 | 1994-11-01 | Fuji Electric Co Ltd | Discoid substrate support |
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