JP2019189886A - Tool for plating hard disk substrate - Google Patents

Abstract

To provide a tool for plating a hard disk substrate, capable of supporting a hard disk substrate in a stable posture state and preventing the flapping of the hard disk substrate from occurring when plating the hard disk substrate.SOLUTION: A tool 10 for plating a hard disk substrate P is inserted in the open hole h of the hard disk substrate P having the open hole h in the center and includes grooves 30 for supporting the tool when plating the hard disk substrate P. The groove 30 is formed in a direction orthogonal to the axial direction of the plating tool 10 with a predetermined width W2 and a predetermined depth DP2 and is formed so that a difference (a clearance C(W2-t)) between the thickness t of the hard disk substrate P and the width W2 of the groove 30 is 0.04 mm or more and 0.3 mm or less in the state that the hard disk substrate P is supported on the grooves 30 .SELECTED DRAWING: Figure 4

Description

  The present invention relates to a plating jig used for plating a hard disk substrate.

  As a plating jig for this type of hard disk substrate, a plating shaft that is inserted into a through hole at the center of the hard disk substrate and supports the hard disk substrate in a suspended state when the hard disk substrate is plated is disclosed. (See Patent Document 1 and Patent Document 2). The plating shaft is immersed in the plating solution together with the hard disk substrate, is driven to rotate in the plating solution, and is configured to follow and rotate the hard disk substrate that is supported by hanging on the plating shaft in the plating solution. Grooves are provided along the circumferential direction on the outer peripheral surface of the plating shaft to restrict the movement of the hard disk substrate suspended from the plating shaft in the axial direction.

  The groove described in Patent Document 1 has a V-shaped cross section and a depth from the outer peripheral surface of the plating shaft of 5 mm or less. A hard disk substrate having a thickness of 0.8 mm or 1.3 mm is used. The groove described in Patent Document 2 has a square cross section, a width of 0.5 mm to 1.5 mm from the outer peripheral surface of the plating shaft, and a depth of 1.5 mm to 3 mm. In particular, for a hard disk substrate having a thickness of 0.8 mm, the groove has a width of 1 mm and a depth of 2.5 mm.

JP-A-9-157857 JP-A-9-71869

  However, since the groove described in Patent Document 1 has a V-shaped cross section, the hard disk substrate supported by the plating shaft has a through hole of the hard disk substrate with respect to the inner wall surface of the groove. Only the corners of the inner wall to be formed are in point contact. Therefore, it is difficult to support the hard disk substrate in a stable posture, and the support of the hard disk substrate is insufficient. Specifically, as shown in FIG. 7, the groove having a V-shaped cross section has one inclined surface a formed on the outer peripheral surface g of the plating shaft J and the other opposing the one inclined surface a. An inclined portion K having an inclined surface b is provided. In the groove described in Patent Document 1, when the hard disk substrate is driven and rotated by the plating shaft, as shown in FIG. 8A, a large fluttering occurs in the hard disk substrate P, and the inclined surface of the inclined portion K is inclined. There is a problem of generation of so-called nodules in which a and b are scraped and mixed into the plating solution as foreign matters and adhere to the plating surface, resulting in poor plating.

  Further, as shown in FIG. 8B, when the spacer S is provided between the hard disk substrates P, the outer peripheral surface portion of the hard disk substrate P becomes the spacer S due to the flapping of the hard disk substrate P. There is a problem of generation of nodules in which the spacers S are scraped and mixed, becoming foreign matter in the plating solution and adhering to the plating surface of the hard disk substrate P, resulting in poor plating.

  Also in the groove described in Patent Document 2, as in the case of the groove described in Patent Document 1, the hard disk substrate is not sufficiently supported, and when the hard disk substrate is driven to rotate, the hard disk substrate has a large fluctuation. May occur. Therefore, the plating surface of the hard disk substrate may be scratched by collision with other components, or the plating shaft may be scraped and mixed as a foreign substance in the plating solution, resulting in poor plating due to adhesion to the plating surface. There is a problem of generation of so-called nodules. In particular, in the case of a thin hard disk substrate having a thickness of about 0.5 mm to 0.63 mm, there is a problem that the occurrence of fluttering is noticeable.

  The present invention has been made to solve such problems, and supports the hard disk substrate in a stable posture and suppresses the occurrence of flapping of the hard disk substrate when plating the hard disk substrate. An object is to provide a plating jig for a hard disk substrate that can be produced.

  (1) A plating jig for a hard disk substrate according to the present invention includes a shaft main body inserted into the through hole of the hard disk substrate having a through hole in the center, and a recess formed on the surface of the shaft main body. A hard disk substrate plating jig provided with a groove into which a part of the hard disk substrate enters while the hard disk substrate is suspended and supported on the hard disk substrate, wherein the groove is orthogonal to the axial direction of the shaft body The difference between the thickness of the hard disk substrate and the width of the groove is 0.04 mm or more in a state in which a part of the hard disk substrate enters the groove. And the width of the groove is formed to be 0.3 mm or less.

  (2) A plating jig for a hard disk substrate according to the present invention is the plating jig for a hard disk substrate according to (1), wherein the depth of the groove is 0.1 mm or more and 1.0 mm or less. It is characterized by being.

  (3) A plating jig for a hard disk substrate according to the present invention is the plating jig for a hard disk substrate according to (1) or (2), wherein the corners of the opening of the groove are rounded. It is characterized by being.

  (4) A plating jig for a hard disk substrate according to the present invention is the plating jig for a hard disk substrate according to any one of (1) to (3), wherein a bottom surface of the groove is flat, The bottom surface and the inner wall surface of the groove are orthogonal to each other.

  (5) A plating jig for a hard disk substrate according to the present invention is the plating jig for a hard disk substrate according to any one of (1) to (4), and the material of the plating jig for the hard disk substrate is , Polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polyetheretherketone (PEEK), and any mixture of polyetheretherketone (PEEK) and polytetrafluoroethylene (PTFE) It is selected from these.

  (6) A method for manufacturing a hard disk substrate according to the present invention is characterized by using the plating jig for a hard disk substrate according to any one of (1) to (5).

  The plating jig for a hard disk substrate according to the present invention described in (1) above has a width in which the clearance in the width direction between the hard disk substrate and the hard disk substrate is 0.04 mm or more and 0.3 mm or less, and the groove is Is formed. With this configuration, occurrence of flapping of the hard disk substrate due to a large gap exceeding 0.3 mm is suppressed. Furthermore, wrinkles near the inner diameter caused by flapping can be prevented. In addition, the plating thickness can be prevented from being reduced due to the small gap of less than 0.04 mm.

  In the plating jig for a hard disk substrate according to the present invention described in (2) above, a groove having a depth of 0.1 mm or more and 1.0 mm or less is formed. With this configuration, occurrence of flapping of the hard disk substrate due to the shallow groove having a depth of less than 0.1 mm is suppressed. Further, the plating thickness is prevented from being reduced due to a deep groove having a depth exceeding 1.0 mm.

  In the plating jig for a hard disk substrate according to the present invention described in (3) above, the corners of the opening of the groove are rounded. With this configuration, burrs are prevented from occurring at the corners of the opening, and wrinkles are prevented from sticking to the hard disk substrate supported by the groove.

  In the plating jig for a hard disk substrate according to the present invention described in (4) above, the bottom surface of the groove is flat, and the bottom surface and the inner wall surface of the groove are orthogonal. With this configuration, the hard disk substrate is supported in a stable posture, and the occurrence of flapping is suppressed.

  The plating jig for the hard disk substrate according to the present invention described in the above (5), the material of the plating jig for the hard disk substrate is polytetrafluoroethylene (PTFE), and polyvinylidene fluoride (PVDF), Polyetheretherketone (PEEK) or a mixture of polyetheretherketone (PEEK) and polytetrafluoroethylene (PTFE). This configuration ensures high wear resistance of the plating jig, high chemical resistance to acids and alkalis, high electrical insulation, and high mechanical strength. Further, with this configuration, generation of foreign matter from the plating jig is suppressed.

  The method for manufacturing a hard disk substrate according to the present invention described in the above (6) manufactures a hard disk substrate using the plating jig according to any one of (1) to (5). Supports in a stable posture, can suppress the occurrence of flapping of the hard disk substrate when plating the hard disk substrate, can suppress wrinkles near the inner diameter caused by the flapping, and also in a small gap The resulting plating thickness is prevented from being reduced.

  According to the present invention, there is provided a plating jig for a hard disk substrate that can support the hard disk substrate in a stable posture and can suppress the occurrence of flapping of the hard disk substrate when plating the hard disk substrate. Can be provided.

It is a figure of the board for hard disks supported by the plating jig of the board for hard disks concerning an embodiment of the present invention, Drawing 1 (a) shows a perspective view of a board for hard disks, and Drawing 1 (b) is a hard disk. FIG. The perspective view of the plating jig of the board | substrate for hard disks which concerns on embodiment of this invention. It is a figure of the plating jig of the board | substrate for hard disks which concerns on embodiment of this invention, Fig.3 (a) shows the side view of the plating jig | tool of the board | substrate for hard disks, and FIG.3 (b) is FIG. Sectional drawing cut | disconnected by AA of FIG. FIG. 4A is a side view of a plating jig for a hard disk substrate according to an embodiment of the present invention, FIG. 4A shows an inclined part and a vertical part of the groove, and FIG. 4B enlarges the vertical part of the groove. An enlarged side view is shown. FIG. 5 is a diagram of a hard disk substrate plating jig in a state in which the hard disk substrate is mounted on the hard disk substrate plating jig according to the embodiment of the present invention, and FIG. A perspective view is shown and FIG.5 (b) shows the partial cross-sectional view cut | disconnected by the part of the groove | channel of the plating jig of the board | substrate for hard disks. FIG. 6A is a table of examples and comparative examples of a plating jig for a hard disk substrate according to an embodiment of the present invention. FIG. 6A shows the thickness of the hard disk substrate and the configuration of the plating jig. ) Shows the nodule generation rate of the examples and comparative examples. The side view which expanded the groove | channel of the plating jig of the conventional hard disk board | substrate. 8A and 8B are diagrams of a conventional hard disk substrate plating jig, in which FIG. 8A shows an enlarged side view of the groove, and FIG. 8B shows a plating treatment of the hard disk substrate with the hard disk substrate mounted thereon. An enlarged side view of the tool is shown.

  A hard disk substrate plating jig 10 according to an embodiment to which the hard disk substrate plating jig according to the present invention is applied will be described with reference to the drawings.

  First, the hard disk substrate P to be mounted on the plating jig 10 for the hard disk substrate will be described. As shown in FIGS. 1A and 1B, the hard disk substrate P is formed of a disk having a thickness t, an outer diameter D, and a central through hole h having an inner diameter d. The thickness t is about 0.5 mm to 2 mm, the outer diameter D is about 30 mm to 270 mm, and the inner diameter d is about 10 mm to 70 mm.

  The hard disk substrate P is made of a plate material such as an aluminum alloy, glass, or ceramic. The hard disk substrate P has high precision smoothness and surface hardness, and also has high rigidity and impact resistance capable of suppressing the occurrence of vibration due to high-speed rotation. In order to have these characteristics, the hard disk substrate P is formed of a hard material.

  Further, the hard disk substrate P is configured such that the surface treatment of the base is performed, the plating treatment is performed after the surface treatment, and the surface is polished and mirror-finished after the plating treatment. In this embodiment, electroless nickel-phosphorus (NiP) plating is performed as the plating process.

  The plating jig 10 for the hard disk substrate P includes a plating shaft 20 that is inserted into the through hole h of the hard disk substrate P, as shown in FIGS. 2, 3 (a), and 3 (b). As shown in FIG. 3B, the plating shaft 20 includes a shaft body 21, a core material 22, and a pair of caps 23. The shaft body 21 is formed with a through hole 21a penetrating in the axial direction, and a core member 22 is inserted into the through hole 21a. The cap 23 is attached so as to close open ends on both sides of the through hole 21a after the core member 22 is inserted.

  The shaft body 21 is made of a synthetic resin material, preferably polytetrafluoroethylene (PTFE), more preferably polyvinylidene fluoride (PVDF), and most preferably polyetheretherketone (PVDF). PEEK) or a mixed material of polyetheretherketone (PEEK) and polytetrafluoroethylene (PTFE). These materials have high chemical resistance against acids and alkalis, and can be selected from a viewpoint of wear resistance, electrical insulation, mechanical strength, and the like. Further, these synthetic resin materials may be mixed materials with other components as long as they do not hinder the manufacture of the hard disk substrate.

  The shaft main body 21 has an outer peripheral surface portion 21b having a smaller diameter than the through hole h of the hard disk substrate P, and a groove 30 is provided in the outer peripheral surface portion 21b. The groove 30 has such a size that an inner peripheral end portion which is a part of the hard disk substrate P enters the shaft body 21 while the hard disk substrate P is suspended and supported on the shaft body 21. The groove 30 is formed with a predetermined width and a predetermined depth in a direction orthogonal to the axial direction of the shaft main body 21, and the hard disk substrate with the inner peripheral edge of the hard disk substrate P entering the groove 30. The width of the groove 30 is formed so that the clearance C in the width direction with respect to P is 0.04 mm or more and 0.3 mm or less.

  As shown in FIG. 3A and FIG. 3B, the plurality of grooves 30 are continuously provided in a circumferential shape along the circumferential direction of the shaft main body 21, respectively. For example, about 60 pieces are provided at predetermined intervals. As shown in FIGS. 4A and 4B, the groove 30 includes an inclined portion 31 that is inclined from the outer peripheral surface portion 21 b toward the axial center of the shaft main body 21, and an end on the axial center side of the inclined portion 31. A vertical portion 32 formed vertically from the portion toward the axial center, and a corner portion 33 where the inclined portion 31 and the vertical portion 32 intersect.

  The inclined portion 31 has one inclined surface 31a and the other inclined surface 31b opposite to the one inclined surface 31a, and the angle formed by the inclined surface 31a and the inclined surface 31b is formed by θ (degrees). The opening of the inclined portion 31 is formed with a width W1 (mm). The formed angle θ and the width W1 are appropriately selected based on setting specifications such as the structure, size, and shape of the plating shaft 10 and data such as experimental values.

  When the shaft main body 21 is inserted into the through hole h of the hard disk substrate P and the hard disk substrate P is supported by hanging, the inner peripheral end of the hard disk substrate P is easily inserted into the vertical portion 32 of the groove 30. For example, the angle θ is about 100 degrees, the width W1 is about 6 mm, and the depth DP1 from the outer peripheral surface portion 21b to the corner portion 33 where the inclined portion 31 and the vertical portion 32 intersect is about 2.2 mm. Note that the vertical portion 32 may be formed directly from the outer peripheral surface portion 21 b of the shaft body 21 without forming the inclined portion 31.

  As shown in FIG. 4B, the vertical portion 32 has one inner wall surface 32a, the other inner wall surface 32b facing the one inner wall surface 32a, and a bottom surface 32c. A space W2 (mm) (see FIG. 4A) is formed between one inner wall surface 32a and the other inner wall surface 32b, and the vertical portion 32 is formed with a depth DP2 (mm). The width W2 is such that the difference (W2−t) between the thickness t and the width W2 of the hard disk substrate P, that is, the clearance C in the width direction between the hard disk substrate P and 0.04 mm or more and 0.3 mm or less. It is formed to become. The clearance C is the sum of the gap C1 and the gap C2 when the hard disk substrate P is located at the center of the width W2.

  Therefore, the width W2 including the thickness t of the hard disk substrate P is formed to be t + C. When the thickness t of the hard disk substrate P is 0.63 mm, the width W2 is preferably 0.67 mm to 0.75 mm. The vertical portion 32 supports the inner peripheral end portion of the through hole h of the hard disk substrate P as shown in FIG.

  If the clearance C is less than 0.04 mm, the plating solution may not sufficiently penetrate into the gap and the plating thickness may be reduced. The corner of the through hole h of the hard disk substrate P, that is, near the ID chamfer May cause wrinkles. When the clearance C exceeds 0.3 mm, the hard disk substrate P is not sufficiently supported by the grooves 30, and when the hard disk substrate P is driven to rotate by the plating shaft 20, a large flapping occurs on the hard disk substrate P. There is.

  The depth DP2 of the vertical portion 32 is represented by the distance (mm) from the corner portion 33 where the vertical portion 32 and the inclined portion 31 intersect to the bottom surface 32c. Specifically, a chamfer R, which will be described later, is formed in the corner portion 33, and the depth DP2 is represented by a distance from the center of the chamfer R of the corner portion 33 to the bottom surface 32c.

  The depth DP2 is preferably 0.1 mm or more and 1.0 mm or less, and more preferably 0.3 mm or less. When the depth DP2 is less than 0.1 mm, the support of the hard disk substrate P by the grooves 30 becomes insufficient, and a large flapping may occur. If the depth DP2 exceeds 1.0 mm, the plating solution may not sufficiently penetrate into the gap and the plating thickness may be reduced, and wrinkles may occur near the ID chamfer.

  The bottom surface 32 c is formed flat along the axis of the shaft body 21, and the bottom surface 32 c and one inner wall surface 32 a of the vertical portion 32 are orthogonal to each other, and the bottom surface 32 c and the other inner wall surface 32 b of the vertical portion 32 are orthogonal to each other. is doing. Even if the corners where the bottom surface 32c intersects one inner wall surface 32a and the other inner wall surface 32b are not rounded and do not interfere with each other, the corners of the through holes h of the hard disk substrate P may have small roundness or small inclination. Good.

  The chamfer R of the corner 33 only needs to be rounded. By forming the corner 33 to be rounded, burrs generated at the corner are removed, and wrinkles of the hard disk substrate P are prevented.

  The core material 22 is made of a material having high rigidity such as fiber reinforced plastic or metal, and is inserted into the shaft main body 21 to increase the mechanical strength of the plating shaft 20. The pair of caps 23 are formed of the same material as the shaft main body 21. As shown in FIG. 2, one cap 23 is inserted into a gear provided in the plating facility, and the plating shaft 20 is configured to rotate by this gear.

  As shown in FIG. 5A, a plurality of hard disk substrates P, for example, corresponding to the grooves 30 formed in the shaft main body 21 are inserted into the plating shaft 20. Furthermore, the plating shaft 20 is configured such that a spacer S provided in the plating facility is set between the hard disk substrates P.

  The plating shaft 20 is mounted on the plating facility with the hard disk substrate P and the spacer S set, and is driven to rotate while being immersed in the bath liquid. The hard disk substrate P that is supported by hanging on the plating shaft 20 is driven to rotate in the bath by the plating shaft 20 to be surface-treated, and is lifted from the bath together with the plating shaft 20 after the surface treatment is finished.

  Hard disk substrate P includes (1) degreasing, (2) acid etching, (3) desmutting, (4) 1st zincate, (5) dezincating, (6) 2nd zincate, (7) electroless NiP plating, and Surface treatment is performed on the surface of the substrate P for the hard disk by being immersed in the bath solution of each step of washing with water between the steps. The plating shaft 20 is not limited to the above (1) to (7), and can be used for the step of immersing the hard disk substrate P in a bath solution and driven to rotate in the bath, for example, the above (1) to (7). Although it may be used in some of the steps, it is preferably used in all the steps.

  Next, examples and comparative examples of the plating jig 10 for the hard disk substrate P according to the present embodiment will be described. The plating jig according to the example of the plating jig 10 of the hard disk substrate P according to the present embodiment and the plating jig according to the comparative example are manufactured, and the hard disk substrate P is mounted on the plating jig, and FIG. Each item shown in the table of a) was evaluated. Examples 1 to 15 and Comparative Examples 1 to 3 were evaluated. Hereinafter, each example and each comparative example will be described.

(Example 1)
In Example 1, as shown in FIG. 6A, an aluminum alloy aluminum substrate having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm was used as the hard disk substrate P. The width W2 at the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was set to 0.70 mm. Therefore, the clearance C in the width direction between the groove 30 and the hard disk substrate P is W2-t, that is, 0.70 mm−0.63 mm = 0.07 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.8 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In Example 1, the plating shaft 20 was formed shorter than the plating shaft 20 constituting the actual plating equipment, and about 10 hard disk substrates P could be supported. The configuration other than the plating shaft 20 was evaluated by an experimental machine configured in the same manner as the components constituting the actual plating equipment. The substrate P for the hard disk was subjected to the surface treatment of the base, and after the surface treatment, the plating treatment by electroless nickel-phosphorus (NiP) plating was performed in the same manner as the plating treatment in the actual plating equipment.

  For the hard disk substrate P according to the first embodiment configured as described above, evaluation was made on three items: substrate flutter, wrinkles near the inner diameter (inner peripheral end), and plating thickness near the inner diameter (inner peripheral end). Went. For flapping of the substrate, the hard disk substrate P that was plated by an experimental machine was visually observed. A hard disk substrate P with almost no shaking is indicated by ◎. Compared with the fluttering generated on the hard disk substrate P similar to that of Example 1 mounted on the conventional plating shaft J shown in FIG.

  In addition, the conventional plating axis | shaft J is comprised similarly to the plating axis | shaft 20 which concerns on embodiment, and only the groove | channels formed in the plating axis | shaft differ. Specifically, the groove of the conventional plating shaft J includes an inclined portion K as shown in FIG. The inclined portion K has one inclined surface a and the other inclined surface b facing the one inclined surface a, and the angle formed by the inclined surface a and the inclined surface b is 100 degrees. The opening of the inclined portion K is formed with a width of 6.6 mm. Moreover, the depth from the outer peripheral surface part g of the inclined part K is formed by 2.2 mm, and chamfering R is formed by 0.2 mm at the bottom part of the inclined part.

  Compared with the fluttering generated on the hard disk substrate P mounted on the conventional plating shaft J, the flickering of the hard disk substrate P slightly improved is indicated by Δ. Further, the flicker equivalent to the flutter generated on the hard disk substrate P mounted on the conventional plating shaft J is indicated by x.

  For the wrinkles near the inner diameter (inner peripheral end), the corners of the through holes h of the hard disk substrate P, that is, the vicinity of the ID chamfer, are observed with an optical microscope, and the degree of wrinkles is determined using a conventional plating axis J. Judgment was made in comparison with the wrinkles in the vicinity of the ID chamfer of the hard disk substrate P plated. The same type of wrinkles as in the conventional case is indicated by ○, those having slightly more wrinkles than the conventional case are indicated by Δ, and those having a larger number of wrinkles than the conventional case are indicated by ×.

  The plating thickness in the vicinity of the inner diameter (inner peripheral end) was measured with a laser microscope from the vicinity of the outer periphery of the hard disk substrate P to the through hole h to the vicinity of the ID chamfer, that is, the thickness. For the thin part near the ID chamfer, the cross section was observed to verify whether the plating thickness was thinner than the flat part. Evaluation was made in comparison with the plating thickness in the vicinity of the ID chamfer of the hard disk substrate P plated using the conventional plating axis J.

  The plating thickness equivalent to the conventional one is displayed as ◯, which looks thinner than the conventional one, but the cross-sectional observation shows that the plating thickness is 80% of the thickness compared to the flat part, and the cross-sectional observation Results The case where the plating thickness could not be secured 80% compared with the flat part was indicated by x.

  As a result of evaluating the hard disk substrate P according to Example 1, the fluttering of the substrate was ◎, the wrinkles near the inner diameter were Δ, and the plating thickness near the inner diameter was Δ. Therefore, it was confirmed that the plating shaft 20 according to Example 1 is good.

(Example 2)
In Example 2, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.70 mm, and the clearance C was 0.07 mm. The chamfer R at the corner 33 of the groove 30 was 1.0 mm. The depth DP2 in the vertical portion 32 of the groove 30 was set to 0.1 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Example 2 was compared with Example 1 for three items of substrate flapping, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 2, the flapping of the substrate was ◯, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 2 is good.

(Example 3)
In Example 3, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.70 mm, and the clearance C was 0.07 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.4 mm. The depth DP2 in the vertical portion 32 of the groove 30 was set to 0.15 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Example 3 was compared with Example 1 for three items of substrate flutter, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 3, the fluttering of the substrate was ◯, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 3 is good.

Example 4
In Example 4, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.70 mm, and the clearance C was 0.07 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.4 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.25 m. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Example 4 was compared with Example 1 for three items of substrate flapping, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 4, the fluttering of the substrate was ◯, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 4 is good.

(Example 5)
In Example 5, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.70 mm, and the clearance C was 0.07 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.3 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Example 5 was compared with Example 1 for three items of substrate flutter, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 5, the substrate fluttering was ◎, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 5 is good.

(Example 6)
In Example 6, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.70 mm, and the clearance C was 0.07 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.3 mm. A shaft main body 21 and a pair of caps 23 constituting the plating shaft 20 were formed of polytetrafluoroethylene (PTFE).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Example 6 was compared with Example 1 for three items of substrate flapping, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 6, the fluttering of the substrate was ◎, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 6 is good.

(Example 7)
In Example 7, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.70 mm, and the clearance C was 0.07 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.3 mm. The shaft body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of a mixed material of polyetheretherketone (PEEK) and polytetrafluoroethylene (PTFE).

  In the same manner as in Example 1, plating was performed using an experimental machine, and the hard disk substrate P according to Example 7 was compared with Example 1 for three items of substrate flapping, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 7, the fluttering of the substrate was ◎, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 7 is good.

(Example 8)
In Example 8, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.70 mm, and the clearance C was 0.07 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.3 mm. A shaft main body 21 and a pair of caps 23 constituting the plating shaft 20 were formed of polyvinylidene fluoride (PVDF).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Example 8 was compared with Example 1 for three items of substrate flapping, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 8, the fluttering of the substrate was ◎, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 8 is good.

Example 9
In Example 9, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.67 mm, and the clearance C was 0.04 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.3 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Example 9 was compared with Example 1 for three items of substrate flutter, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 9, the fluttering of the substrate was ◎, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 9 is good.

(Example 10)
In Example 10, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.80 mm, and the clearance C was 0.17 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.2 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, the plating process was performed by an experimental machine, and the hard disk substrate P according to Example 10 was compared with Example 1 for three items of substrate flapping, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 10, the fluttering of the substrate was ◯, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 10 is good.

(Example 11)
In Example 11, as in Example 1, the hard disk substrate P used was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.90 mm, and the clearance C was 0.27 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.2 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Example 11 was compared with Example 1 for three items of substrate flapping, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 11, the fluttering of the substrate was Δ, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 11 is good.

(Example 12)
In Example 12, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.90 mm, and the clearance C was 0.27 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.8 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Example 12 was compared with Example 1 for three items of substrate flapping, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 12, the substrate fluttering was ◎, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 12 is good.

(Example 13)
In Example 13, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.50 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.55 mm, and the clearance C was 0.05 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.3 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed using an experimental machine, and the hard disk substrate P according to Example 13 was compared with Example 1 for three items of substrate flutter, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 13, the fluttering of the substrate was ◎, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 13 was good.

(Example 14)
In Example 14, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.50 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.57 mm, and the clearance C was 0.07 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.3 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Example 14 was compared with Example 1 for three items of substrate flapping, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 14, the fluttering of the substrate was ◎, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 14 is good.

(Example 15)
In Example 15, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.80 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.87 mm, and the clearance C was 0.07 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.3 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Example 15 was compared with Example 1 for three items of substrate flutter, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Example 15, the fluttering of the substrate was ◎, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating shaft 20 according to Example 15 is good.

(Comparative Example 1)
In Comparative Example 1, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. As a plating shaft, a conventional plating shaft J shown in FIG. 7 was used. Therefore, as shown in FIG. 6A, the vertical portion 32 of the groove 30 similar to that of the first embodiment is not formed, and it is indicated that there is no groove. The shaft main body and the pair of caps constituting the plating shaft J were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Comparative Example 1 was compared with Example 1 for three items of substrate flapping, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Comparative Example 1, the fluttering of the substrate was x, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating axis J according to Comparative Example 1 has a large substrate flutter and is not suitable for the plating axis.

(Comparative Example 2)
In Comparative Example 2, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 1.00 mm, and the clearance C was 0.37 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 0.2 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Comparative Example 2 was compared with Example 1 for three items of substrate flapping, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Comparative Example 2, the flutter of the substrate was x, the wrinkles near the inner diameter were ◯, and the plating thickness near the inner diameter was ◯. Therefore, it was confirmed that the plating axis J according to Comparative Example 2 has a large substrate flutter and is not suitable for the plating axis.

(Comparative Example 3)
In Comparative Example 3, as in Example 1, the hard disk substrate P was an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 in the vertical portion 32 of the groove 30 of the shaft body 21 constituting the plating shaft 20 was 0.70 mm, and the clearance C was 0.07 mm. The chamfer R at the corner portion 33 of the groove 30 was 0.2 mm. The depth DP2 in the vertical portion 32 of the groove 30 was 1.1 mm. The shaft main body 21 and the pair of caps 23 constituting the plating shaft 20 were formed of polyetheretherketone (PEEK).

  In the same manner as in Example 1, plating was performed by an experimental machine, and the hard disk substrate P according to Comparative Example 3 was compared with Example 1 for three items of substrate flapping, wrinkles near the inner diameter, and plating thickness near the inner diameter. Evaluation was performed in the same manner.

  As a result of evaluating the hard disk substrate P according to Comparative Example 3, the fluttering of the substrate was ◎, the wrinkles near the inner diameter were x, and the plating thickness near the inner diameter was x. Therefore, although the plating axis J according to Comparative Example 3 had good substrate fluttering, it was confirmed that the wrinkles near the inner diameter were x and the plating thickness near the inner diameter was x, which was not suitable for the plating axis.

  In addition, as shown in FIG.6 (b), with respect to Example 5, Example 7, Example 9, Example 15, and the comparative example 1, it plated with an actual plating equipment, and a nodule generation rate (piece / Surface). As for the nodule generation rate, the surface of the hard disk substrate P was inspected with an optical surface inspection device, and the number of projections that became defects was counted with a scanning electron microscope (SEM) or an atomic force microscope (AFM). The criterion was 0.003 / surface. The optical surface inspection apparatus used was model RS1390 manufactured by Hitachi High-Tech Fine Systems.

  The nodule generation rate was 0.002 in Example 5, 0.001 in Example 7, Example 9 and Example 15, which met the criteria and was confirmed to be suitable for the plating axis. On the other hand, the nodule generation rate of Comparative Example 1 was 0.010, which did not satisfy the criterion, and was confirmed not to be suitable for the plating shaft. Note that “−” shown in FIG. 6B indicates that the verification has not been performed. However, in each of the other unexecuted examples, the flapping of the substrate with respect to the hard disk substrate P and the flaw near the inner diameter are also observed. Since good evaluation results have been obtained for the three items of the plating thickness near the inner diameter, it is estimated that the nodule generation rate also satisfies the criterion.

  Hereinafter, the effect of the plating jig 10 of the hard disk substrate P according to the present embodiment will be described.

  The plating jig 10 for the hard disk substrate P according to this embodiment has a width W2 in which the clearance C between the thickness t of the hard disk substrate P and the width W2 of the groove 30 is 0.04 mm or more and 0.3 mm or less. A groove 30 is formed. With this configuration, it is possible to suppress the occurrence of flapping of the hard disk substrate due to the clearance C exceeding 0.3 mm and to prevent the plating thickness from being reduced due to the clearance C being less than 0.04 mm. . Furthermore, the effect that wrinkles near the inner diameter caused by flapping can be prevented is obtained.

  Further, the plating jig 10 of the hard disk substrate P according to the present embodiment has a depth of 0.1 mm or more and 1.0 mm or less and a groove 30 is formed. With this configuration, the effect of suppressing the occurrence of flapping of the hard disk substrate P due to the groove 30 having a depth of less than 0.1 mm can be obtained. Moreover, the effect that the thinning of the plating thickness resulting from the groove | channel 30 whose depth exceeds 1.0 mm is prevented is acquired.

  Further, in the plating jig 10 for the hard disk substrate P according to the present embodiment, the corners of the openings of the grooves 30 are rounded. With this configuration, it is possible to prevent the occurrence of burrs at the corners of the opening and to prevent the hard disk substrate P supported by the grooves 30 from being wrinkled.

  Further, in the plating jig 10 for the hard disk substrate P according to the present embodiment, the bottom surface 32c of the groove 30 is flat, and the bottom surface 32c and the one inclined surface 31a and the other inclined surface 31b of the groove 30 are orthogonal to each other. ing. With this configuration, the hard disk substrate P is supported in a stable posture by the bottom surface 32c of the groove 30, and the effect of suppressing the occurrence of flapping is obtained.

  In the plating jig 10 for the hard disk substrate P according to the present embodiment, the material of the plating jig 10 for the hard disk substrate P is preferably polytetrafluoroethylene (PTFE), more preferably polyfluorinated. Vinylidene (PVDF), most preferably composed of polyetheretherketone (PEEK) or a mixture of polyetheretherketone (PEEK) and polytetrafluoroethylene (PTFE). With this configuration, it is possible to obtain the effects of ensuring high wear resistance of the plating jig 10, high chemical resistance to acid and alkali, high electrical insulation, and high mechanical strength. In addition, since the plating jig 10 of the hard disk substrate P according to the present embodiment has high wear resistance and chemical resistance, an effect that generation of foreign matters from the plating jig 10 is suppressed can be obtained.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various designs can be made without departing from the spirit of the present invention described in the claims. It can be changed.

10 ... Plating jig 20 ... Plating shaft (Plating jig)
21 ... Shaft body 21a, h ... Through hole 21b ... Outer peripheral surface part 22 ... Core material 23 ... Cap 30 ... Groove 31 ... Inclined part 31a ... One inclined surface 31b ... the other inclined surface 32 ... vertical portion 32a ... one inner wall surface 32b ... the other inner wall surface 32c ... bottom surface 33 ... corner C, C1, C2 ... clearance D: outer diameter d: inner diameter DP1, DP2: depth P: hard disk substrate t: thickness R: chamfering W1, W2: width

Claims (6)

A shaft main body inserted into the through hole of the hard disk substrate having a through hole in the center, and the hard disk substrate in a state of being recessedly supported on the surface of the shaft main body and hanging the hard disk substrate on the shaft main body A hard disk substrate plating jig having a groove into which a part of
The groove is formed with a predetermined width and a predetermined depth in a direction orthogonal to the axial direction of the shaft main body, and with the thickness of the hard disk substrate in a state where a part of the hard disk substrate enters the groove. A plating jig for a substrate for a hard disk, wherein the groove width is formed such that a difference from the groove width is 0.04 mm or more and 0.3 mm or less.   The depth of the said groove | channel is 0.1 mm or more and 1.0 mm or less, The plating jig of the board | substrate for hard disks of Claim 1 characterized by the above-mentioned.   3. The plating jig for a hard disk substrate according to claim 1, wherein the corner of the opening of the groove has a rounded shape.   4. The plating treatment of a hard disk substrate according to claim 1, wherein the bottom surface of the groove is flat, and the bottom surface and the inner wall surface of the groove are orthogonal to each other. Ingredients.   The material of the plating jig for the hard disk substrate is polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), polyether ether ketone (PEEK) and polytetrafluoroethylene (PTFE). 5. The plating jig for a hard disk substrate according to claim 1, wherein the jig is selected from any one of the above mixed materials.   A method for manufacturing a hard disk substrate, comprising using the hard disk substrate plating jig according to claim 1.

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