TW201943889A - Plating jig for hard disk substrate - Google Patents

Abstract

The present invention addresses the problem of providing a plating jig for a hard disk substrate, capable of supporting the hard disk substrate in a stable orientation and suppressing flapping of the hard disk substrate during plating of the hard disk substrate. This plating jig 10 for the hard disk substrate P is to be inserted into a through-hole h of the hard disk substrate P having the through-hole h at the center thereof and is provided with a groove 30 for supporting the hard disk substrate P during plating. The groove 30 is formed in a predetermined width W2 in an orthogonal direction to the axial direction of the plating jig 10 and to a predetermined depth DP2 and is formed in such a manner that the difference (clearance C (W2 - t)) between the thickness t of the hard disk substrate P and the width W2 of the groove 30 is 0.04 mm to 0.3 mm in a state in which the hard disk substrate P is supported by the groove 30.

Description

Plating bracket for hard disk substrate

The present invention relates to a plating stand used when plating a substrate for a hard disk.

Such a plating stand for a hard disk substrate is disclosed in a plating shaft inserted into a through hole in the center of the hard disk substrate and supporting the hard disk substrate in a suspended state during plating of the hard disk substrate (see Patent Document 1 and Patent Document 2). The plating shaft is immersed in the plating solution together with the substrate for the hard disk, and is driven and rotated in the plating solution, so that the hard disk substrate suspended and supported by the plating shaft is driven to rotate in the plating solution. Grooves are provided on the peripheral surface of the plating shaft along the peripheral direction to restrict the axial movement of the hard disk substrate suspended from the plating shaft.

The groove described in Patent Document 1 is formed in a V-shaped cross section, and the depth from the outer peripheral surface of the plating shaft is 5 mm or less. The thickness of the hard disk substrate is 0.8 mm or 1.3 mm. The groove described in Patent Document 2 has a square cross section, and has a width of 0.5 mm to 1.5 mm and a depth of 1.5 mm to 3 mm from the outer peripheral surface of the plating shaft. In particular, it has a size of 0.8 mm with respect to the thickness of the substrate for a hard disk, a width of a groove of 1 mm, and a depth of 2.5 mm.
[Prior technical literature]
[Patent Literature]

Patent Document 1: Japanese Patent Application Laid-Open No. 9-157857 Patent Document 2: Japanese Patent Application Laid-Open No. 9-71869

[Problems to be Solved by the Invention]

However, the groove described in Patent Document 1 is formed in a V-shape in cross section. Therefore, the hard disk substrate suspended and supported on the plating shaft is only brought into point contact with the corners of the inner wall forming the through hole of the hard disk substrate. The inner wall surface of the groove. Therefore, it is difficult to support the hard disk substrate in a stable posture state, and the support of the hard disk substrate becomes insufficient. Specifically, as shown in FIG. 7, the groove having a V-shaped cross section is provided with one inclined surface a formed on the peripheral surface g of the plating axis J, and the other having an inclined surface b facing the other inclined surface a. Inclined part K. In the groove described in Patent Document 1, when the hard disk substrate is driven to rotate by the electric shaft, as shown in FIG. 8 (a), a large vibration is generated in the hard disk substrate P, and the inclined surface of the inclined portion K is cut. a and b become foreign matter and are mixed into the plating solution and adhere to the plating surface, causing problems such as so-called small clumps caused by poor plating.

As shown in FIG. 8 (b), when the pads S are provided between the hard disk substrates P, the peripheral surface of the hard disk substrate P and the backing may be caused by the vibration of the hard disk substrate P. The pads S collide and the pads S are cut, and foreign matter is mixed into the plating solution and adheres to the plating surface of the hard disk substrate P, causing a problem of so-called small clumps due to poor plating.

The groove described in Patent Document 2 is also the same as the case described in Patent Document 1. The support for the hard disk substrate is insufficient, and when the hard disk substrate is driven to rotate, a large vibration may be generated in response to the disk substrate. Therefore, there is a problem that the plated surface of the hard disk substrate may be damaged due to conflict with other components, or the so-called small clumps caused by cutting the plated shaft and foreign matter mixed in the plating solution and adhering to the plated surface may cause poor plating. . In particular, in the case of a thin hard disk substrate having a thickness of about 0.5 mm to 0.63 mm, there is a problem that significant generation of vibration occurs.

The present invention has been developed to solve the problems described above, and provides a hard disk substrate plating that can support a hard disk substrate in a stable posture, and can suppress the vibration of the hard disk substrate when the hard disk substrate is electroplated. The bracket is the subject.

[Means for solving problems]

(1) A plating stand for a hard disk substrate according to the present invention includes a shaft body inserted into the through hole of the hard disk substrate having a through hole in the center, and a shaft body recessed on the surface of the shaft body and used for the hard disk. A plated bracket for a hard disk substrate in which a substrate is suspended and supported by the shaft body, and a part of the hard disk substrate enters, wherein the groove is orthogonal to an axial direction of the shaft body. The direction is formed with a predetermined width and a predetermined depth, in a state where a part of the hard disk substrate enters the groove, so that the difference between the thickness of the hard disk substrate and the width of the groove becomes 0.04 mm or more. In addition, the width of the groove is formed in a manner of 0.3 mm or less.

(2) The plated bracket for a hard disk substrate according to the present invention is a plated bracket for a hard disk substrate according to (1), wherein the depth of the groove is 0.1 mm or more and 1.0 mm or less .

(3) The plated bracket for a hard disk substrate according to the present invention is a plated bracket for a hard disk substrate according to (1) or (2), wherein the corner of the opening of the groove has a circular shape shape.

(4) The plated bracket for a hard disk substrate according to the present invention is a plated bracket for a hard disk substrate according to any one of (1) to (3), wherein the bottom surface of the groove is flat The bottom surface is orthogonal to the inner wall surface of the groove.

(5) The plated bracket for a hard disk substrate according to the present invention is a plated bracket for a hard disk substrate according to any one of (1) to (4), and is characterized in that it is a plated bracket for a hard disk substrate. The material is selected from among polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), and a mixture of polyether ether copper (PEEK) and polytetrafluoroethylene (PTFE). One.

(6) The method for manufacturing a hard disk substrate according to the present invention is characterized by using the plated holder of the hard disk substrate according to any one of (1) to (5).

The plated holder for a hard disk substrate according to the present invention described in the above (1) is formed with a gap in a width direction from the hard disk substrate to be 0.04 mm or more and 0.3 mm or less in width. With this configuration, occurrence of vibration of the hard disk substrate caused by a large gap exceeding 0.3 mm is suppressed. Furthermore, it is also possible to prevent scratches caused near the inner diameter of the vibration. Furthermore, it is possible to prevent thinning of the plating thickness due to a small gap of less than 0.04 mm.

The electroplated holder for a hard disk substrate according to the present invention described in (2) above, has grooves having a depth of 0.1 mm or more and 1.0 mm or less. With this configuration, occurrence of vibration of the hard disk substrate due to shallow grooves having a depth of less than 0.1 mm is suppressed. In addition, a reduction in the thickness of the plating due to a deep trench having a depth of more than 1.0 mm is prevented.

The plated holder of the hard disk substrate according to the present invention described in (3) above has a rounded corner at the opening of the groove. With this configuration, burrs are prevented from being generated at the corners of the openings, and scratches are prevented from being attached to the hard disk substrate supported by the grooves.

In the plating bracket for the hard disk substrate according to the present invention described in the above (4), the bottom surface of the groove is flat so that the bottom surface is orthogonal to the inner wall surface of the groove. With this configuration, the substrate for a hard disk can be supported in a stable posture, and generation of vibration can be suppressed.

The plated bracket for a hard disk substrate according to the present invention described in the above (5) is a plated bracket for a hard disk substrate. The material of the plated bracket is polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), and polyetheretherketone ( PEEK) or a mixture of polyetherethercopper (PEEK) and polytetrafluoroethylene (PTFE). With this structure, high abrasion resistance, high resistance to acids and alkalis, high electrical insulation, and high mechanical strength are ensured. With this configuration, generation of foreign matter from the plated stent is suppressed.

The method for manufacturing a hard disk substrate according to the present invention described in (6) above is to manufacture the hard disk substrate using the electroplated bracket described in any one of (1) to (5), so that the hard disk substrate can be supported in a stable posture. When the substrate for a hard disk is plated, vibration of the substrate for the hard disk can be suppressed, and scratches caused near the inner diameter of the vibration can be suppressed, and the thickness of the plated film due to a small gap can be prevented.

[Inventive effect]

According to the present invention, there is provided a plating stand for a hard disk substrate, which can support the hard disk substrate in a stable posture state, and can suppress the generation of vibration of the hard disk substrate when the hard disk substrate is plated.

The plated holder 10 of the hard disk substrate according to the embodiment using the plated holder of the hard disk substrate according to the present invention will be described with reference to the drawings.

First, the hard disk substrate P mounted on the plating stand 10 mounted on the hard disk substrate will be described. The hard disk substrate P is constituted by a disk having a thickness t, an outer diameter D, and an inner diameter d of the through-hole h at the center as shown in Figs. 1 (a) and 1 (b). The thickness t has a size of about 0.5 mm to 2 mm, an outer diameter D of about 30 mm to 270 mm, and an inner diameter d of about 10 mm to 70 mm.

The material of the hard disk substrate P is made of a plate material such as aluminum alloy, glass, or ceramic. The hard disk substrate P has high-precision smoothness and surface hardness, and also has high rigidity and impact resistance that can suppress vibration caused by high-speed rotation. In order to have such characteristics, the hard disk substrate P is formed of a hard raw material.

In addition, the hard disk substrate P is formed by subjecting the surface of the substrate to surface treatment, and then performing plating treatment after the surface treatment. After the plating treatment, the surface is polished and mirror-finished. As the plating treatment, the present embodiment performs electroless nickel-phosphorus (NiP) plating.

The plated holder 10 of the hard disk substrate P is a plated shaft 20 having a through-hole h inserted into the hard disk substrate P as shown in FIGS. 2, 3 (a), and 3 (b). As shown in FIG. 3 (b), the plated shaft 20 includes a shaft body 21, a core material 22, and a pair of covers 23. The shaft body 21 is formed with a through hole 21 a penetrating in the axial direction, and a core material 22 is inserted into the through hole 21 a. After inserting the core material 22, a cover 23 is attached to close the open ends on both sides of the through hole 21a.

The shaft body 21 is made of a synthetic resin material, preferably polytetrafluoroethylene (PTFE), more preferably polyvinylidene fluoride (PVDF), and most preferably polyetheretherketone (PEEK) or poly It is composed of a mixed material of ether ether copper (PEEK) and polytetrafluoroethylene (PTFE). These materials have high resistance to acids and alkalis, and one of them can be selected from the balance of wear resistance, electrical insulation, and mechanical strength. In addition, such a synthetic resin material may be a mixed material of other components so long as it does not interfere with the production of the hard disk substrate.

The shaft body 21 has a peripheral surface portion 21b having a smaller diameter than the through-hole h of the hard disk substrate P, and a groove 30 is recessed in the peripheral surface portion 21b. The groove 30 has a size such that a part of the hard disk substrate P enters the inner peripheral end portion in a state where the hard disk substrate P is suspended and supported on the shaft body 21. The groove 30 is formed in a direction orthogonal to the axial direction of the shaft body 21 with a predetermined width and a predetermined depth. The groove 30 enters the groove 30 at the inner peripheral end portion of the hard disk substrate P, and is formed in a manner similar to the hard disk. The width C between the substrates P in the width direction is 0.04 mm or more and 0.3 mm or less, so that the width of the trench 30 is formed.

As shown in FIGS. 3 (a) and 3 (b), the plurality of grooves 30 are continuously provided in a peripheral shape along the peripheral direction of the shaft main body 21, and a predetermined interval is arranged in the axial direction of the shaft main body 21, for example. Set about 60. The groove 30 has, as shown in FIGS. 4 (a) and 4 (b), an inclined portion 31 inclined from the peripheral surface portion 21 b toward the axial center of the shaft main body 21, and an end from the axial center side of the inclined portion 31. The portion forms a vertical portion 32 perpendicular to the axis; and a corner portion 33 where the inclined portion 31 intersects the vertical portion 32.

The inclined portion 31 includes one inclined surface 31a and the other inclined surface 31b opposite to the one inclined surface 31a. The angle formed by the inclined surface 31a and the inclined surface 31b is formed by θ (degrees). The inclined portion 31 The opening is formed by a width W1 (mm). The formed angle θ and width W1 can be appropriately selected based on data such as conditions, experimental values, and the like of the structure, size, and shape of the plating shaft 10.

When the shaft body 21 is inserted through the through-hole h of the hard disk substrate P, and is suspended and supported on the hard disk substrate P, so that the inner peripheral end portion of the hard disk substrate P can easily enter the vertical portion 32 of the groove 30. The angle θ is, for example, about 100 degrees, the width W1 is about 6 mm, and the depth DP1 from the peripheral surface portion 21b to the corner portion 33 where the inclined portion 31 intersects the vertical portion 32 is about 2.2 mm. In addition, instead of forming the inclined portion 31, the vertical portion 32 may be directly formed from the peripheral surface portion 21 b of the shaft body 21.

As shown in FIG. 4 (b), the vertical portion 32 includes: one inner wall surface 32a; the other inner wall surface 32b opposite the one inner wall surface 32a; and a bottom surface 32c. One inner wall surface 32a and the other inner wall surface 32b are formed with a width W2 (mm) (see FIG. 4 (a)), and the vertical portion 32 is formed with a depth DP2 (mm). This width W2 is formed so that the difference (W2-t) between the thickness t of the hard disk substrate P and the width W2, that is, the clearance C in the wide direction from the hard disk substrate P is 0.04 mm or more and 0.3 mm or less. . When the clearance C is at the center of the width W2 of the hard disk substrate P, the clearance C becomes the total of the clearance C1 and the clearance C2.

Therefore, the width W2 including the thickness t of the hard disk substrate P is formed as t + C. When the thickness t of the hard disk substrate P is 0.63 mm, the width W2 is preferably 0.67 mm to 0.75 mm. Then, as shown in FIG. 5 (b), the vertical portion 32 supports the inner peripheral end portion of the through hole h of the hard disk substrate P.

In addition, when the clearance C is less than 0.04 mm, the penetration of the plating solution into the clearance is insufficient to reduce the thickness of the plating, and scratches may occur at the corners of the through holes h of the hard disk substrate P, that is, near the ID grooves. When the clearance C exceeds 0.3 mm, the support 30 for the hard disk substrate P becomes insufficient due to the groove 30. When the hard disk substrate P is driven by the electroplating shaft 20, a large amount of the hard disk substrate P is generated. vibration.

The depth DP2 of the vertical portion 32 is represented by the distance (mm) from the bottom surface 32c of the intersection angle portion 33 between the vertical portion 32 and the inclined portion 31. Specifically, a chamfer R to be described later is formed in the corner portion 33, and the depth DP2 is a distance from the center of the chamfer R of the corner portion 33 to the bottom surface 32c.

The depth DP2 is preferably 0.1 mm or more and 1.0 mm or less, and more preferably 0.3 mm or less. When the depth DP2 is less than 0.1 mm, the support of the hard disk substrate P by the groove 30 becomes insufficient, and large vibrations may occur. When the depth DP2 exceeds 1.0 mm, the penetration of the plating solution into the gap is insufficient to make the plating thickness thin, and scratches may occur near the ID groove.

The bottom surface 32c is formed flat along the axis of the shaft body 21, the bottom surface 32c is orthogonal to one inner wall surface 32a of the vertical portion 32, and the bottom surface 32c is orthogonal to the other inner wall surface 32b of the vertical portion 32. In addition, a corner portion of the bottom surface 32c orthogonal to one of the inner wall surfaces 32a and the other inner wall surface 32b may be a small circle or a small inclination of a non-interference range of a corner portion of the through hole h of the hard disk substrate P. .

The chamfer R of the corner portion 33 only needs to be rounded, and a round shape is formed in the corner portion 33, thereby removing burrs generated at the corner portion and preventing scratches of the hard disk substrate P from being generated.

The core material 22 is made of a material having high rigidity such as fiber-reinforced gum or metal, and is inserted into the shaft body 21 to improve the mechanical strength of the plated shaft 20. The pair of covers 23 are made of the same material as the shaft body 21, and the unilateral cover 23 is inserted into a gear provided in the plating equipment as shown in FIG. 2, whereby the gear structure rotates the plating shaft 20.

As shown in FIG. 5 (a), the plating shaft 20 corresponds to a plurality of grooves 30 formed in the shaft body 21, for example, and about 60 hard disk substrates P are inserted. In addition, the plating shaft 20 is configured by setting a spacer S provided in a plating apparatus between each hard disk substrate P.

The plating shaft 20 is mounted on the plating equipment in a state where the hard disk substrate P and the spacer S are set, and is rotationally driven while being immersed in the bath. The hard disk substrate P suspended from the plating shaft 20 is surface-treated by the plating shaft 20 following rotation in the bath, and is lifted from the bath together with the plating shaft 20 after the surface treatment is completed.

The hard disk substrate P is obtained by (1) degreasing, (2) acid etching, (3) descaling, (4) 1st zincate, (5) dezincate, (6) 2nd zincate, (7) The surface of the surface of the hard disk substrate P is subjected to surface treatment with the bath solution immersed in each step by electroless NiP plating and water washing between the steps. The plating shaft 20 is not limited to the above (1) to (7), and the substrate P for a hard disk can be immersed in a bath liquid and used in the step of driven rotation in the bath. For example, it can also be used in the above (1) to (7) Part of the steps, but it is better to use all the steps.

Next, examples and comparative examples of the plated holder 10 of the hard disk substrate P according to this embodiment will be described. The plated bracket 10 for the hard disk substrate P according to this embodiment is prepared. The plated bracket for the example and the related plated bracket for the comparative example are prepared. The hard disk substrate P is mounted on the plated bracket. The table in FIG. 6 (a) is shown. Evaluation of each project. Evaluation was performed for Examples 1 to 15 and Comparative Examples 1 to 3, respectively. Hereinafter, each Example and each comparative example are demonstrated.

(Example 1)
In Example 1, as shown in FIG. 6 (a), as the hard disk substrate P, an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm was used. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.70 mm. Therefore, the clearance C in the wide direction between the groove 30 and the hard disk substrate P becomes W2-t, that is, 0.70 mm to 0.63 mm = 0.07 mm. The chamfer R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the trench 30 is set to 0.8 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

In Example 1, the plating shaft 20 is formed to have a length shorter than that of the plating shaft 20 constituting the actual plating equipment, and can support about 10 hard disk substrates P. The components other than the plating shaft 20 were evaluated by an experimental machine configured in the same manner as the components constituting the actual plating equipment. The hard disk substrate P is subjected to a surface treatment of the base, and after the surface treatment, the same electroless nickel-phosphorus (NiP) plating as the plating treatment of the actual plating equipment is performed.

With respect to the hard disk substrate P according to the above-mentioned structure of Example 1, three items regarding the vibration of the substrate, scratches near the inner diameter (inner peripheral end), and plating thickness near the inner diameter (inner peripheral end) are provided. to evaluate. The substrate vibration was visually observed on the hard disk substrate P subjected to the plating treatment by an experimental machine. ◎ indicates that there is almost no shaking of the hard disk substrate P. In comparison with the vibration generated in the hard disk substrate P, which is the same as that in Example 1 in which the conventional plated shaft J is installed in FIG. 7, the vibration of the hard disk substrate P is markedly improved by ○.

The conventional plating shaft J has the same configuration as the plating shaft 20 according to the embodiment, and only the grooves formed in the plating shaft are different. Specifically, as shown in FIG. 7, the groove of the conventional plated shaft J is provided with an inclined portion K. The inclined portion K has one inclined surface a and the other inclined surface b opposite to the one inclined surface a. The angle formed by the inclined surface a and the inclined surface b is 100 degrees. The opening of the inclined portion K is It is formed with a width of 6.6mm. The depth from the peripheral surface g of the inclined portion K is 2.2 mm, and the chamfer R is formed at the bottom of the inclined portion 0.2 mm.

The vibration of the hard disk substrate P slightly improved compared to the vibration generated by the hard disk substrate P mounted on the conventional plating axis J is represented by Δ. In addition, the same vibration as that generated on the hard disk substrate P mounted on the conventional plated shaft J is indicated by ×.

The scratches near the inner diameter (inner peripheral end) are observed with a light microscope near the corners of the through holes h of the hard disk substrate P, that is, near the ID grooves, using a conventional plating axis J and the hard disk substrate P. Compare the scratches near the ID grooves to determine the degree of scratches. ○ indicates scratches equivalent to the conventional ones, and slightly more scratches than the conventional ones are indicated by △, and those that have a lot of scratches compared to the conventional ones are indicated by ×.

The plating thickness near the inner diameter (the inner peripheral end portion) is measured by a laser microscope from the vicinity of the periphery of the hard disk substrate P toward the flat portion of the through-hole h to the vicinity of the ID groove, that is, the thickness. The observation section in which the thickness near the ID groove becomes thinner is compared with the flat portion to verify whether the plating thickness has become thinner. The evaluation was performed by comparison with the plating thickness near the ID groove of the hard disk substrate P plated with the conventional plating axis J.

○ indicates the same thickness as the conventional one. Although it shows thinner compared with the conventional one, the results of the cross-section observation show that the plating thickness is compared with the flat part. The △ indicates that 80% of the thickness is ensured. If the thickness cannot be guaranteed to be 80%, it is indicated by ×.

As a result of evaluating the substrate P for a hard disk related to Example 1, the vibration of the substrate was ◎, the scratches near the inner diameter were Δ, and the plating thickness near the inner diameter was Δ. Therefore, it can be confirmed that the plated shaft 20 according to Example 1 is good.

(Example 2)
Example 2 is an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.70 mm, and the clearance C is set to 0.07 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 1.0 mm. The depth DP2 of the vertical portion 32 of the trench 30 is set to 0.1 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

In the same manner as in Example 1, the plating process was performed by an experimental machine. For the substrate P for a hard disk related to Example 2, three items of the plate thickness for the vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate the same.

As a result of evaluating the hard disk substrate P according to Example 2, the vibration of the substrate was ○, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it can be confirmed that the plated shaft 20 according to Example 2 is good.

(Example 3)
Example 3 is an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.70 mm, and the clearance C is set to 0.07 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.4 mm. The depth DP2 of the vertical portion 32 of the groove 30 is 0.15 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

As in Example 1, the plating process was performed by an experimental machine. For the substrate P for a hard disk related to Example 3, three items of the substrate vibration, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate the same.

As a result of evaluating the substrate P for a hard disk related to Example 3, the vibration of the substrate was ○, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it can be confirmed that the plated shaft 20 according to Example 3 is good.

(Example 4)
Example 4 is the same as Example 1. The hard disk substrate P is an aluminum substrate made of an aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.70 mm, and the clearance C is set to 0.07 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.4 mm. The depth DP2 of the vertical portion 32 of the trench 30 is set to 0.25 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

In the same manner as in Example 1, an electroplating process was performed by an experimental machine. For the substrate P for a hard disk related to Example 4, the three items of the substrate vibration for the substrate, the scratches near the inner diameter, and the plating thickness near the inner diameter were the same as in Example 1. Evaluate the same.

As a result of evaluating the hard disk substrate P according to Example 4, the vibration of the substrate was ○, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it can be confirmed that the plated shaft 20 according to Example 4 is good.

(Example 5)
Example 5 is an aluminum substrate made of an aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.70 mm, and the clearance C is set to 0.07 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

In the same manner as in Example 1, an electroplating process was performed by an experimental machine. For the substrate P for a hard disk related to Example 5, the three items of the substrate vibration for the substrate, the scratches near the inner diameter, and the plating thickness near the inner diameter were the same as in Example 1. Evaluate the same.

As a result of evaluating the hard disk substrate P according to Example 5, the vibration of the substrate was 基板, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it can be confirmed that the plated shaft 20 according to Example 5 is good.

(Example 6)
Example 6 is an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.70 mm, and the clearance C is set to 0.07 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is 0.3 mm. The shaft body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polytetrafluoroethylene (PTFE).

In the same manner as in Example 1, the plating process was performed by an experimental machine. For the substrate P for a hard disk related to Example 6, the three items of the substrate vibration, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate the same.

As a result of evaluating the substrate P for a hard disk related to Example 6, the vibration of the substrate was ◎, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plated shaft 20 according to Example 6 is good.

(Example 7)
Example 7 is the same as Example 1. The hard disk substrate P is an aluminum substrate made of an aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.70 mm, and the clearance C is set to 0.07 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is 0.3 mm. A shaft body 21 and a pair of covers 23 constituting the plated shaft 20 are formed of a mixed material of polyetheretherketone (PEEK) and polytetrafluoroethylene (PTFE).

As in Example 1, the plating process was performed by an experimental machine. For the hard disk substrate P according to Example 7, three items of the plate thickness and the thickness of the plating near the inner diameter with respect to the vibration of the substrate, scratches near the inner diameter, and the first embodiment Evaluate the same.

As a result of evaluating the substrate P for a hard disk related to Example 7, the vibration of the substrate was ◎, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plated shaft 20 according to Example 7 is good.

(Example 8)
Example 8 is the same as Example 1. The hard disk substrate P is an aluminum substrate made of an aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.70 mm, and the clearance C is set to 0.07 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyvinylidene fluoride (PVDF).

As in Example 1, the plating process was performed by an experimental machine. For the substrate P for a hard disk related to Example 8, the three items of the substrate vibration for the substrate, the scratches near the inner diameter, and the plating thickness near the inner diameter were the same as in Example 1. Evaluate the same.

As a result of evaluating the hard disk substrate P according to Example 8, the vibration of the substrate was 基板, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it can be confirmed that the plated shaft 20 according to Example 8 is good.

(Example 9)
Example 9 is the same as Example 1. The hard disk substrate P is an aluminum substrate made of an aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.67 mm, and the clearance C is set to 0.04 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

As in Example 1, the plating process was performed by an experimental machine. For the hard disk substrate P according to Example 9, three items of the plate thickness for vibrating the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate the same.

As a result of evaluating the substrate P for a hard disk related to Example 9, the vibration of the substrate was ◎, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it can be confirmed that the plated shaft 20 according to Example 9 is good.

(Example 10)
Example 10 is an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.80 mm, and the clearance C is set to 0.17 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the trench 30 is set to 0.2 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

In the same manner as in Example 1, the plating process was performed by an experimental machine. For the substrate P for a hard disk related to Example 10, the three items of the substrate vibration for the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were the same as in Example 1. Evaluate the same.

As a result of evaluating the hard disk substrate P according to Example 10, the vibration of the substrate was ○, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it can be confirmed that the plated shaft 20 according to Example 10 is good.

(Example 11)
Example 11 is an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.90 mm, and the clearance C is set to 0.27 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the trench 30 is set to 0.2 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

As in Example 1, the plating process was performed by an experimental machine. For the hard disk substrate P according to Example 11, three items of the plate thickness for vibrating the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate the same.

As a result of evaluating the substrate P for a hard disk related to Example 11, the vibration of the substrate was Δ, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it can be confirmed that the plated shaft 20 according to Example 11 is good.

(Example 12)
Example 12 is an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.90 mm, and the clearance C is set to 0.27 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the trench 30 is set to 0.8 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

In the same manner as in Example 1, an electroplating process was performed by an experimental machine. For the substrate P for a hard disk related to Example 12, the three items of the substrate vibration for the substrate, the scratches near the inner diameter, and the plating thickness near the inner diameter were the same as in Example 1. Evaluate the same.

As a result of evaluating the substrate P for a hard disk related to Example 12, the vibration of the substrate was ◎, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the plated shaft 20 according to Example 12 is good.

(Example 13)
Example 13 is an aluminum substrate made of an aluminum alloy having a thickness t of 0.50 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.55 mm, and the clearance C is set to 0.05 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

In the same manner as in Example 1, an electroplating process was performed by using an experimental machine. For the substrate P for a hard disk related to Example 13, three items of the vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate the same.

As a result of evaluating the hard disk substrate P according to Example 13, the vibration of the substrate was 基板, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it can be confirmed that the plated shaft 20 according to Example 13 is good.

(Example 14)
Example 14 is the same as Example 1. The hard disk substrate P is an aluminum substrate made of an aluminum alloy with a thickness t of 0.50 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. It is assumed that the width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is 0.57 mm, and the clearance C is 0.07 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

In the same manner as in Example 1, the plating process was performed by an experimental machine. For the substrate P for a hard disk related to Example 14, three items of the substrate vibration, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate the same.

As a result of evaluating the hard disk substrate P according to Example 14, the vibration of the substrate was 基板, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it can be confirmed that the plated shaft 20 according to Example 14 is good.

(Example 15)
Example 15 is an aluminum substrate made of an aluminum alloy having a thickness t of 0.80 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.87 mm, and the clearance C is set to 0.07 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the groove 30 is 0.3 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

In the same manner as in Example 1, the plating process was performed by an experimental machine. For the hard disk substrate P according to Example 15, three items of the substrate vibration for the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate the same.

As a result of evaluating the hard disk substrate P according to Example 15, the vibration of the substrate was 基板, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it can be confirmed that the plated shaft 20 according to Example 15 is good.

(Comparative example 1)
Comparative Example 1 is an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The plating shaft is a conventional plating shaft J shown in FIG. 7. Therefore, as shown in FIG. 6 (a), the vertical portion 32 having no groove 30 similar to that of the first embodiment is formed, and it is shown that there is no groove. A shaft body and a pair of covers constituting the plated shaft J are formed of polyetheretherketone (PEEK).

In the same manner as in Example 1, the plating process was performed by an experimental machine. For the substrate P for a hard disk related to Comparative Example 1, three items of the plate thickness, the scratches near the inner diameter, and the plating thickness near the inner diameter were compared with Example 1. Evaluate the same.

As a result of evaluating the substrate P for a hard disk related to Comparative Example 1, the vibration of the substrate was ×, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the vibration of the substrate of the plated shaft J according to Comparative Example 1 was large, and it was not suitable for the plated shaft.

(Comparative example 2)
Comparative Example 2 is the same as in Example 1. The hard disk substrate P is an aluminum substrate made of an aluminum alloy with a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 1.00 mm, and the clearance C is set to 0.37 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the trench 30 is set to 0.2 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

In the same manner as in Example 1, the plating process was performed by an experimental machine. For the hard disk substrate P according to Comparative Example 2, three items of the vibration of the substrate, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate the same.

As a result of evaluating the substrate P for a hard disk related to Comparative Example 2, the vibration of the substrate was ×, the scratches near the inner diameter were ○, and the plating thickness near the inner diameter was ○. Therefore, it was confirmed that the vibration of the substrate of the plated shaft J according to Comparative Example 2 was large, and it was not suitable for the plated shaft.

(Comparative example 3)
In Comparative Example 3, as in Example 1, the hard disk substrate P is an aluminum substrate made of an aluminum alloy having a thickness t of 0.63 mm, an outer diameter D of 95 mm, and an inner diameter d of 25 mm. The width W2 of the vertical portion 32 of the groove 30 constituting the shaft body 21 of the plated shaft 20 is set to 0.70 mm, and the clearance C is set to 0.07 mm. The chamfered portion R of the corner portion 33 of the groove 30 is 0.2 mm. The depth DP2 of the vertical portion 32 of the trench 30 is set to 1.1 mm. The shaft main body 21 and the pair of covers 23 constituting the plated shaft 20 are formed of polyetheretherketone (PEEK).

In the same manner as in Example 1, the plating process was performed by an experimental machine. For the hard disk substrate P according to Comparative Example 3, three items of the substrate vibration, scratches near the inner diameter, and plating thickness near the inner diameter were compared with Example 1. Evaluate the same.

As a result of evaluating the substrate P for a hard disk related to Comparative Example 3, the vibration of the substrate was ◎, the scratches near the inner diameter were ×, and the plating thickness near the inner diameter was ×. Therefore, it can be confirmed that although the vibration of the substrate of the plated shaft J according to Comparative Example 3 is good, the scratches near the inner diameter are ×, and the plating thickness near the inner diameter is ×, which confirms that it is not suitable for the plated shaft.

In addition, as shown in FIG. 6 (b), relative to Example 5, Example 7, Example 9, Example 15 and Comparative Example 1, electroplating was performed using an actual electroplating equipment, and the generation rate (number / surface) of the nodule was measured. )authenticating. The small clump generation rate is determined by inspecting the surface of the hard disk substrate P with an optical surface inspection device, and calculating the number of protrusions that are defective with a scanning electron microscope (SEM) or an atomic force microscope (AFM). The determination criterion was 0.003 pieces / surface. The optical surface inspection apparatus uses a model RS1390 manufactured by Hitachi High-Tech Fine Systems.

The small clump generation rate was 0.002 in Example 5, and was 0.001 in Example 7, Example 9, and Example 15, which met the judgment criteria and was confirmed to be suitable for plating shafts. On the other hand, the small clump generation rate of Comparative Example 1 was 0.010, which did not meet the determination criteria, and it was confirmed that it was not suitable for the plating shaft. In addition, the "-" shown in 6 (b) indicates that verification has not been performed, but for other examples not implemented, the vibration of the substrate of the hard disk substrate P, scratches near the inner diameter, and The 3 items of plating thickness obtained good evaluation results, so it can be estimated that the occurrence rate of small clumps is also in line with the judgment criteria.

The effect of the plated holder 10 of the hard disk substrate P according to this embodiment will be described below.

The plated support 10 of the hard disk substrate P according to this embodiment is such that the clearance C between the thickness t of the hard disk substrate P and the width W2 of the groove 30 is 0.04 mm or more, and the width W2 of 0.3 mm or less forms a groove. 30. With this configuration, the occurrence of vibration of the hard disk substrate caused by the clearance C exceeding 0.3 mm is suppressed, and the effect of reducing the thickness of the plating due to the thickness C of the clearance C smaller than 0.04 mm is obtained. In addition, the effect of preventing scratches near the inner diameter due to vibration can also be obtained.

In addition, the plating bracket 10 of the hard disk substrate P according to this embodiment is formed with a groove 30 having a depth of 0.1 mm or more and 1.0 mm or less. With this groove, it is possible to obtain the effect of suppressing the vibration of the hard disk substrate P caused by the groove 30 having a depth of less than 0.1 mm. In addition, it is possible to obtain the effect of reducing the thickness of the plating thickness of the trench 30 having a depth exceeding 1.0 mm.

In the plated holder 10 of the hard disk substrate P according to the present embodiment, the corners of the openings of the grooves 30 have circular shapes. With this configuration, the occurrence of burrs at the corners of the openings can be prevented, and the effect of scratches on the hard disk substrate P supported by the grooves 30 can be prevented.

In the plated holder 10 of the hard disk substrate P according to this embodiment, the bottom surface 32c of the groove 30 is flat, and the bottom surface 32c is orthogonal to one of the inclined surfaces 31a and the other inclined surface 31b of the groove 30. With this configuration, the hard disk substrate P is supported on the bottom surface 32c of the groove 30 in a stable posture state, and the effect of suppressing the occurrence of vibration can be obtained.

In addition, the plated bracket 10 of the hard disk substrate P according to this embodiment is a plated bracket 10 of the hard disk substrate P. The material is preferably polytetrafluoroethylene (PTFE), and more preferably polyvinylidene fluoride (PVDF). ), Preferably composed of polyetheretherketone (PEEK), or a mixed material of polyetherethercopper (PEEK) and polytetrafluoroethylene (PTFE). With this configuration, the effects of securing high abrasion resistance, high chemical resistance to acids and alkalis, high electrical insulation, and high mechanical strength are obtained. In addition, the plated holder 10 of the hard disk substrate P according to this embodiment has high abrasion resistance and chemical resistance, so that the effect of suppressing the generation of foreign matter from the plated holder 10 can be obtained.

Although the embodiments of the present invention have been described in detail, the present invention is not limited to the above-mentioned embodiments, and various design changes can be made without departing from the spirit of the present invention described in the scope of the patent application.

10‧‧‧Plating bracket

20‧‧‧Plating shaft (plating bracket)

21‧‧‧axis body

21a, h‧‧‧through hole

21b‧‧‧ Peripheral face

22‧‧‧Core material

23‧‧‧ Cover

30‧‧‧ Trench

31‧‧‧inclined

31a‧‧‧one inclined surface

31b‧‧‧ the other side of the inclined surface

32‧‧‧ vertical section

32a‧‧‧one inner wall surface

32b‧‧‧ the other side's inner wall surface

32c‧‧‧ Underside

33‧‧‧ Corner

C, C1, C2 ‧‧‧ clearance

D‧‧‧ outer diameter

d‧‧‧inner diameter

DP1, DP2‧‧‧depth

P‧‧‧ Hard disk substrate

t‧‧‧thickness

R‧‧‧ Chamfer

W1, W2‧‧‧Width

FIG. 1 is a view of a hard disk substrate supported by a plating support of a hard disk substrate according to an embodiment of the present invention. FIG. 1 (a) shows a perspective view of the hard disk substrate, and FIG. 1 (b) shows A cross-sectional view of a hard disk substrate.

Fig. 2 is a perspective view of a plated holder of a hard disk substrate according to an embodiment of the present invention.

Fig. 3 is a view of a plated support for a hard disk substrate according to an embodiment of the present invention. Fig. 3 (a) is a side view of the plated support for a hard disk substrate. Fig. 3 (b) is shown in Fig. 3 (a). ) AA cut section.

Fig. 4 is a side view of a plated support for a hard disk substrate according to an embodiment of the present invention. Fig. 4 (a) shows the inclined portion and vertical portion of the groove, and Fig. 4 (b) shows the vertical portion of the groove. Zoomed in side view.

FIG. 5 is a view of a hard disk substrate plating stand in a state where the hard disk substrate is mounted on a plating stand of a hard disk substrate according to an embodiment of the present invention, and FIG. 5 (a) shows a hard disk substrate. FIG. 5 (b) is a perspective view of the plated bracket, and a partial cross-sectional view of the plated bracket of the hard disk substrate after the groove portion is cut.

FIG. 6 is a table of an example and a comparative example of a plated holder for a hard disk substrate according to an embodiment of the present invention. FIG. 6 (a) shows the thickness of the hard disk substrate and the configuration of the plated holder. FIG. 6 (b) The figure shows the small clumping rate of the examples and comparative examples.

FIG. 7 is an enlarged side view of a groove of a plating stand of a conventional hard disk substrate.

Fig. 8 is a view of a conventional plated support for a hard disk substrate. Fig. 8 (a) shows an enlarged side view of the groove, and Fig. 8 (b) shows the hard disk substrate after the hard disk substrate is installed. An enlarged side view of a plated bracket of a substrate.

Claims (6)

A plating support for a hard disk substrate includes a shaft body inserted into the through hole of the hard disk substrate having a through hole in the center, and a shaft body recessed on the surface of the shaft body and supporting the hard disk substrate in a suspended manner. The groove in which the state of the shaft body allows a part of the hard disk substrate to enter is characterized in that: The groove is formed with a predetermined width and a predetermined depth in a direction orthogonal to the axial direction of the shaft body, and a part of the hard disk substrate enters the groove, so that the hard disk substrate The difference between the thickness and the width of the groove is 0.04 mm or more and 0.3 mm or less so that the width of the groove is formed. The plated bracket for a hard disk substrate according to item 1 of the patent application scope, wherein the depth of the groove is 0.1 mm or more and 1.0 mm or less. The plated holder for a hard disk substrate according to item 1 or 2 of the scope of patent application, wherein the corner of the opening of the groove has a circular shape. According to the electroplated bracket for a hard disk substrate according to any one of the claims 1 to 3, the bottom surface of the groove is flat, and the bottom surface is orthogonal to the inner wall surface of the groove. The plated bracket for a hard disk substrate according to any one of claims 1 to 4, wherein the material of the plated bracket for a hard disk substrate is selected from the group consisting of polytetrafluoroethylene (PTFE) and polyvinylidene fluoride. One of polyvinyl fluoride (PVDF), polyetheretherketone (PEEK), and a mixture of polyetherethercopper (PEEK) and polytetrafluoroethylene (PTFE). A method for manufacturing a substrate for a hard disk, characterized in that it uses a plated holder of the substrate for a hard disk as described in any one of claims 1 to 5 of the scope of patent application.