JPH11256347A - Rack device for plating disk to be plated and racking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the rubbing flaw on an unfinished substrate developed in conveying or plating treatment and to perform uniform plating treatment. SOLUTION: In a rack device, plural swing-preventing grooves arranged corresponding to plural restraining grooves in a shaft 3 with grooves having the restraining groove s for restraining the unfinished substrate 40 and auxiliary shafts with grooves 7, 8 for preventing the swing by allowing this swing- preventing groove to contact with the outside ridge 44 of the unfinished substrate, are provided. The swing-preventing positions 46 on the outside ridge 44 of the unfinished substrate with these auxiliary shafts 7, 8 with grooves are set at the center angle θ1 in the range from 90 deg. to 180 deg. and swing preventing positions 46 of the adjacent shafts are set at the center angle θ2 of <=90 deg..

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circular plate to be plated, for example, an electroless Ni-base for an Al substrate for a magnetic disk.
In-process substrate to be P-plated (hereinafter, the disk to be processed between the punched circular plate punched out in an annular shape and the Al substrate for magnetic disk will be collectively referred to as the "in-process substrate")
And a rack method for plating.

[0002]

2. Description of the Related Art Conventionally, a plating process for a disk to be plated, for example, a base electroless Ni-P plating process for an in-process substrate to be processed and processed into an Al substrate for a magnetic disk, is performed by, for example, forming a plurality of annularly arranged annular plates. A plating process is performed by locking each substrate in the groove through a grooved shaft in an inner hole of the substrate and dipping the substrate in a plating tank (Japanese Patent Application Laid-Open No. 9-157857).

Further, there is disclosed a plating jig in which a grooved shaft has a U-shaped groove (Japanese Utility Model Laid-Open No. 6-645).
No. 4).

FIG. 10 shows an example of a rack device for plating a work-in-progress disk according to the prior art. A surface treatment in which an auxiliary support shaft 50 having an interval holding groove is arranged on an outer edge 44 of the work-in-progress disk 40 is shown. An apparatus has been disclosed (JP-A-8-41649).

[0005]

Heretofore, in order to lock a work-in-progress board in a groove, it has generally been advantageous to reduce the width of the groove in order to reduce the play of the work-in-progress board. However, when the groove width is narrowed, as pointed out in Japanese Utility Model Application Laid-Open No. 6-6454, the in-process substrate comes into contact with the groove during transportation of the plating rack apparatus or during immersion of the plating rack apparatus in the plating solution. Then, the surface is rubbed and scratched. For this reason, Japanese Utility Model Laid-Open No. 6-6454
In the publication, a U-shaped groove is disclosed to prevent scratches caused by rubbing with the groove.

However, in the U-shaped groove, a portion where the clearance between the groove side wall and the in-process substrate is narrowed is formed, and circulation of the plating solution in the groove is obstructed, so that the play of the groove cannot be reduced. There is a problem that the outside of the in-process substrate comes into contact with the outside of the adjacent in-process substrate to cause rubbing and flaws.

SUMMARY OF THE INVENTION An object of the present invention is to provide a plating apparatus for a disk to be plated and a method for racking a disk to be plated which can eliminate abrasion and flaws of the disk to be plated generated in the plating process and enable uniform plating. To provide.

[0008]

In order to achieve the above object, the present invention provides a plurality of locking grooves for locking the disk to be plated through the inside of a hole at the center of the annular disk to be plated. In a rack device for plating a disk to be plated, which locks and plate the disk to be plated on a grooved shaft having a plurality of locking grooves provided in correspondence with the plurality of locking grooves of the grooved shaft. A shaft having an auxiliary groove, which contacts an outer edge of the disk to be plated locked by the locking groove by the vibration preventing groove and stops the vibration, and the auxiliary grooved shaft is parallel to the grooved shaft. And to contact the outer edges of the disk to be plated at at least three points to prevent the disk to be plated from swaying.

An auxiliary grooved shaft having a detent groove is provided in parallel with the grooved shaft, and the outer edge of the disk to be plated contacts the detent groove of the auxiliary grooved shaft at at least three points. When the disk to be plated is locked in the locking groove of the grooved shaft, even if there is a slight run-out, the outer edge is pressed by the vibration-preventing grooves of the plurality of auxiliary grooved shafts, and the vibration is stopped, Surface scratches due to contact between the disks to be plated are prevented. Then, during the plating process, the surface of the disk to be plated is plated uniformly.

Further, in the rack apparatus for plating a disk to be plated, the outer edge of each disk to be plated contacts the detent groove of the shaft with the auxiliary groove at three points, and the outer edge of the disk to be plated is provided. The farthest rest position on the top is 90 degrees to 18
That is, they are arranged at a central angle in a range of 0 degrees, and the steady rest positions of adjacent ones are arranged at a central angle of 90 degrees or less.

The steady rest position is located at a central angle in a range of 90 degrees to 180 degrees, and the steady rest positions of adjacent ones are 9
By being disposed at a central angle of 0 ° or less, contact between the discs to be plated is more reliably prevented at the minimum number of holding points, and generation of scratches on the surface is reliably prevented. Also, the surface of the disk to be plated is uniformly plated.

In the racking method for a disk to be plated, a plurality of annular disks to be plated are locked and attached to a grooved shaft at an interval from each other, the outer edge of each of the disks to be plated is set to three. It is to hold down more than a part and stop it.

The outer edges of the disc to be plated are pressed and held at three or more places, thereby preventing the discs to be plated from contacting each other at the minimum number of holding places, preventing the occurrence of rubbing scratches, and Even during the treatment, the surface of the disk to be plated is plated uniformly.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a rack apparatus and a rack method for plating a disk to be plated according to the present invention will be described below in detail with reference to the drawings. 1 to 10, the same or equivalent parts are denoted by the same reference numerals.

In the rack apparatus for plating a disk to be plated according to the present embodiment, a workpiece substrate 40 is mounted for plating a workpiece substrate which is a disk to be plated. The in-process punched substrate is chamfered, the surface is ground and then washed, and the surface is subjected to base Ni-P electroless plating. The plated in-process board is
The surface is mirror-finished by polishing, and finally polishing powder,
Cleaning for removing foreign matter and the like is performed. The aluminum substrate for a magnetic disk (aluminum substrate) formed through these processes is thereafter provided with a magnetic layer serving as an information medium, and becomes a magnetic disk.

FIG. 4 is an overall front view showing a rack apparatus for plating a disk to be plated using an auxiliary grooved shaft of the present invention, FIG. 5 shows a side view of FIG. 4, (A) is a left side view,
6B is a right side view, and FIG. 6 is a plan view of FIG.

In FIG. 4, a rack apparatus 1 for plating a disk to be plated has, for example, ten grooved shafts 3 parallel to each other and both ends of the grooved shafts 3 rotating on the same circle of disks 29a and 29b. It is arranged radially on the circumference 15 and the grooved shaft 3 can be attached and detached at prescribed positions 16 (FIG. 5) of the disks 29a, 29b. One plating rack apparatus 1 can set 500 in-process substrates 40 depending on the size of the apparatus, and the in-process substrates 40 are locked by the grooved shaft 3 and described later. The outer edges of the shafts 7 and 8 are held down by the auxiliary grooved shafts 7 and 8 to prevent the outer edges thereof from being steady.

Further, the rack apparatus 1 for plating a disk to be plated has an upper frame 17 and a lower frame 18, and an arm 20 is fixed to the lower frame 18.
Is transported and moved by the arm 20. A motor reducer 22 is fixed to the upper frame 17, and a middle gear 25 that is supported by a motor gear 23 on an upper central shaft 31.
A large gear 26 pivotally supported by the lower central shaft 32 on the middle gear 25.
Are engaged. Disks 29 a and 29 b are fixed to the large gear 26 via a lower central shaft 32. Disk 29
guides 28a, 29b in the outer circumferential direction of
28b is provided to hold the grooved shaft 3 when it is transferred to the rack device 1.

A multi-connector 36 is provided to supply power to the motor reducer 22 mounted on the plating rack apparatus 1 itself, and has an automatic detaching mechanism for supplying power to the motor reducer 22. Each time the plating rack device 1 is replaced, it is automatically detached. Motor reducer 2
In the rotation drive (inverter) control of No. 2, an inverter controlled power is supplied from the multi-connector 36 which is automatically attached and detached. The number of rotations can be automatically switched between high speed, medium speed, and low speed, and each rotation speed can be adjusted from outside.

The plating rack apparatus 1 according to the present embodiment
Is provided with an origin return operation mechanism capable of automatically performing origin return in all mechanisms. The origin return is manually operated to some extent, and automatic origin return is performed when conditions are met.

FIG. 1 shows the rack apparatus 1 for plating.
(A) is a side view of a main part, (B) is an enlarged view of a main part of (A), FIG. 2 shows the grooved shaft 3 shown in FIG. 1, (A) is an overall front view, and (B) is an engagement. FIG. 3 shows the shafts 7 and 8 with auxiliary grooves shown in FIG. 1, wherein FIG. 3 (A) is an overall front view of the shaft 7 with inner auxiliary grooves, and FIG. 3 (B) is the shaft 8 with outer auxiliary grooves. , Respectively, are shown.

As shown in FIG. 1, a plating rack apparatus 1
The grooved shaft 3 is attached, and the grooved shaft 3
Are a plurality of locking grooves 4 for locking the in-process substrate 40 through the inside of the hole 41 in the center of the annular in-process substrate 40 (FIG. 2).
Having. The plating process is performed while the in-process substrate 40 is locked on the grooved shaft 3.

As shown in FIG. 2, the grooved shaft 3 has a plurality of 52 locking grooves 4 formed at equal intervals in this case, and the shape of the locking grooves 4 is V-shaped. The V-shape of the locking groove 4 preferably has an obtuse angle from the viewpoint of uniformity of the plating film. At both ends of the grooved shaft 3, supported portions 6a and 6b supported by disks 29a and 29b (FIG. 4) are provided, and a gear 5 for rotating the grooved shaft 3 is provided to the left of the grooved shaft 3. Is formed. The locking groove 4 comes into contact with the inner side 42 of at least one side of the in-process substrate 40.

Further, as shown in FIG. 1, the plating rack apparatus 1 includes an inner auxiliary grooved shaft 7 and an outer auxiliary grooved shaft 8. Accordingly, the in-process substrate 40 is located at one position (the anti-sway position 46) on the inner auxiliary grooved shaft 7.
a), the outer auxiliary grooved shaft 8 is used to prevent steadying at three points at two locations (sway resting positions 46b and 46c). Then, these three auxiliary grooved shafts 7 and 8 are located at the farthest rest positions 46b on the outer edge 44 of the in-process substrate.
Is located at a central angle θ ₁ in the range of 90 degrees to 180 degrees, and the adjacent steady rest position 46 a and the steady rest position 46 b or the steady rest position 4.
6a and the steady rest position 46c are arranged at a central angle θ ₂ of 90 degrees or less. Here, the center of the center angle θ ₁ or the center angle θ _{2 is} the center of the in-process substrate 40.

As shown in FIG. 3, the auxiliary grooved shaft 7,
Numeral 8 denotes 52 stabilizing grooves 1 corresponding to the 52 locking grooves 4 of the grooved shaft 3 for preventing the work-in-progress board 40 from oscillating.
0, 11 and two detent grooves 10a, 10b at both ends.
And 11a and 11b are grooves for locking the dummy disk. The anti-vibration grooves 10 and 11 come into contact with the outer edge 44 of the work-in-progress board 40 locked in the locking groove 4 to stop the vibration. A disk 2 is provided at both ends of the shafts 7 and 8 with auxiliary grooves.
Supported parts 12a, 12b, 1 supported by 9a, 29b
3a and 13b are formed. A plurality of these auxiliary grooved shafts 7 and 8 are provided in parallel with the grooved shaft 3. Incidentally, the grooved shaft 3, the inner auxiliary grooved shaft 7, and the outer auxiliary grooved shaft 8 are also provided by ten each.

The plating rack apparatus 1 for plating a disk to be plated having the above structure according to the present embodiment operates as follows. In other words, the locking groove 4 of the grooved shaft 3 has a large play, so that when the in-process substrate 40 is assembled, the in-process substrate 40 easily oscillates in the locking groove 4. In the inside of the auxiliary grooved shaft 8 having the groove 11,
Since the auxiliary grooved shaft 7 having a zero is provided in parallel with the grooved shaft 3 so that the detent grooves of the auxiliary grooved shaft come into contact with each of the in-process substrates 40 at three points, the in-process substrate 4
In the case of No. 0, the outer edge 44 is pressed to prevent the run-out, and the surface scratches due to the contact between the in-process substrates 40 are prevented. Then, during the plating process, the surface of the in-process substrate 40 is uniformly plated.

Furthermore, the run-out of the in-process substrate 40 increases as the distance from the auxiliary grooved shafts 7 and 8 increases, and becomes maximum in the 90-degree direction. Therefore, the auxiliary grooved shaft extends over 90 degrees at intervals of 90 degrees or less. By arranging 7 and 8, it is possible to prevent scratches on the outer peripheral portion of the in-process substrate 40. That is, the three steady rest positions 46a to 46c are shifted from 90 degrees to 180 degrees.
The central substrate is disposed at the central angle θ ₁ in the range of degrees, and the steady rest positions 46a and 46b or 46a and 46c between adjacent ones are disposed at the central angle θ ₂ of 90 degrees or less.
The outer edge 44 is pressed at the minimum number of three places and is prevented from oscillating, and the contact between the in-process substrates 40 is more reliably prevented,
Scratches and scratches are reliably prevented, and the surface of the in-process substrate 40 is evenly plated during plating.

Next, a method of racking a disk to be plated according to the present embodiment will be described. The racking method of a work-in-progress substrate, which is a disk to be plated, is a method in which a plurality of, for example, 50 ring-like work-in-progress substrates are locked and attached to a grooved shaft at intervals from each other, racked, and plated. And said 5
The zero in-process substrate is held down at three or more outer edges thereof by being pressed. As a result, contact between the in-process substrates at the minimum number of holding points is prevented, no rubbing occurs, and even during plating, the surface of the in-process substrate is plated uniformly.

[0029]

EXAMPLE Next, an example of the present invention was experimented under the following conditions, and will be described with reference to FIGS.

(1) Apparatus (or method) for preventing the work-in-progress board from being carried out Embodiment 1: The outside edges of the work-in-progress board 40 are provided at three positions at approximately 90 degrees by auxiliary grooved shafts 7 and 8 at the steady-state positions 46a and 46b. (FIG. 7) Comparative Example 1: Two steady rest positions 4 on the outer edge of the work-in-process substrate 40 with the auxiliary grooved shaft 8 at substantially 180-degree intervals.
6b, 46c (FIG. 8) Comparative Example 2: Case in which the outer edge of the in-process substrate 40 is not pressed (FIG. 9) (2) Evaluation method and result The presence or absence of scratches on the surface of the in-process substrate 40 was examined. . Table 1 shows the results.

[0031]

[Table 1]

According to Table 1, although no scratch was found in Example 1, slight scratch was found in Comparative Example 1, and severe scratch was found in Comparative Example 2. As described above, by using the present invention, it is possible to eliminate surface scratches caused by transport for plating and plating, and to perform uniform plating, thereby improving the reliability of the magnetic disk. .

[0033]

According to the rack apparatus for plating a disk to be plated according to the present invention, scratches on the disk to be plated which occur during transport and plating can be eliminated, and uniform plating can be performed.

Further, according to the method of racking a disk to be plated of the present invention, as in the rack apparatus for plating a disk to be plated, scratches on the disk to be plated are eliminated and uniform plating can be performed. become.

[Brief description of the drawings]

1A and 1B show an embodiment of a rack apparatus for plating a disk to be plated according to the present invention, wherein FIG. 1A is a side view of a main part, and FIG. 1B is an enlarged view of a main part of FIG.

FIGS. 2A and 2B show the grooved shaft shown in FIG. 1, wherein FIG. 2A is an overall front view, and FIG.

3A and 3B show the auxiliary grooved shaft shown in FIG. 1, wherein FIG. 3A is an overall front view of an inner auxiliary grooved shaft, and FIG. 3B is an overall front view of an outer auxiliary grooved shaft.

FIG. 4 is an overall front view showing the rack apparatus for plating a disk to be plated shown in FIG. 1;

5 shows a side view of FIG. 4, (A) is a left side view, (B)
Is a right side view.

FIG. 6 is a plan view of FIG. 4;

FIGS. 7A and 7B show the steady rest position of the in-process substrate according to the first embodiment of the present invention, wherein FIG. 7A is a side view and FIG.

8A and 8B show a steady rest position of Comparative Example 1 compared with the present invention, wherein FIG. 8A is a side view and FIG. 8B is a front view.

9A and 9B show Comparative Example 2 in comparison with the present invention, wherein FIG. 9A is a side view and FIG. 9B is a front view.

FIG. 10 is a side view of an essential part showing an example of a rack apparatus for plating a disk to be plated according to a conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Plating rack apparatus for disk to be plated 3 Shaft with groove 4 Locking groove 7, 8 Shaft with auxiliary groove 10, 11 Detent groove 40 Work in progress board (plate to be plated) 41 Hole 42 Inside 44 Outside edge 46a, 46b , 46c Steady-stop position θ ₁ Central angle in the range of 90 degrees to 180 degrees θ ₂ Central angle of 90 degrees or less

Claims (3)

[Claims] 1. A plate-shaped disk having a plurality of locking grooves for locking the disk to be plated through the inside of a hole formed in the center of an annular disk to be plated. In a rack device for plating a disk to be plated,
The grooved shaft has a plurality of detent grooves provided in correspondence with the plurality of detent grooves, and is in contact with an outer edge of the disk to be plated locked by the detent grooves by the detent grooves. An auxiliary grooved shaft for preventing steadying, the auxiliary grooved shaft is provided in parallel with the grooved shaft, and contacts the outer edge of the disk to be plated at at least three points to prevent the disk from being plated. A rack apparatus for plating a disk to be plated. 2. An outer edge of each disk to be plated is in contact with a vibration-preventing groove of an auxiliary grooved shaft at three points according to claim 1,
The farthest rest position on the outer edge of the disc to be plated is arranged at a central angle in the range of 90 degrees to 180 degrees, and the steady rest positions between adjacent ones are arranged at a central angle of 90 degrees or less. A rack apparatus for plating a disk to be plated. 3. A method of racking a plurality of annular plates to be locked and attached to a grooved shaft at an interval from each other, wherein the outer edge of each of the plurality of circular plates is set to three. A racking method for a disk to be plated, characterized in that the plate is held down at least at a certain position to stop the steadying.