TWI748746B - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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TWI748746B
TWI748746B TW109139616A TW109139616A TWI748746B TW I748746 B TWI748746 B TW I748746B TW 109139616 A TW109139616 A TW 109139616A TW 109139616 A TW109139616 A TW 109139616A TW I748746 B TWI748746 B TW I748746B
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turntable
substrate
chamber
ring
chambers
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TW109139616A
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TW202125683A (en
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吳俊昊
朴永秀
柳守烈
金學杜
孫侐主
朴商弼
許成壹
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南韓商系統科技公司
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    • H—ELECTRICITY
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    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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Abstract

本發明的目的在於提供一種在多個腔室之間能夠穩定地移送基板的基板處理裝置。用於實現此的本發明的基板處理裝置，包括：多個腔室，為了處理基板而沿圓周方向以預定間隔佈置；轉盤，配備為為了在所述多個腔室之間移送所述基板而旋轉，其中，所述多個腔室中的至少一個腔室配備有安置所述基板的平台和提供用於沿上下方向升降所述平台的驅動力的平台驅動部，所述轉盤包括：轉盤主體，藉由轉盤驅動部而升降以及旋轉；環形的轉盤環，配備為在安置於所述轉盤主體的狀態下能夠從所述轉盤主體分離。The object of the present invention is to provide a substrate processing apparatus capable of stably transferring a substrate between a plurality of chambers. The substrate processing apparatus of the present invention for achieving this includes: a plurality of chambers arranged at predetermined intervals in the circumferential direction for processing substrates; and a turntable equipped to transfer the substrates between the plurality of chambers Rotating, wherein at least one of the plurality of chambers is equipped with a platform on which the substrate is placed and a platform driving part that provides a driving force for raising and lowering the platform in an up-and-down direction, and the turntable includes: a turntable main body , The turntable is lifted and rotated by the turntable driving part; the ring-shaped turntable ring is equipped to be separable from the turntable main body in a state of being placed on the turntable main body.

Description

基板處理裝置Substrate processing device

本發明涉及一種基板處理裝置，更詳細地涉及一種能夠穩定地移送基板的基板處理裝置。 The present invention relates to a substrate processing apparatus, and more specifically to a substrate processing apparatus capable of stably transferring a substrate.

通常，在半導體工序中，在與外部隔離的腔室內部在加熱或者冷卻基板等的多樣的條件下進行基板處理工序，並且正在開發用於執行所述基板處理工序的基板處理裝置。 Generally, in a semiconductor process, a substrate processing process is performed under various conditions such as heating or cooling a substrate in a chamber isolated from the outside, and a substrate processing apparatus for performing the substrate processing process is being developed.

所述基板處理裝置將多個腔室佈置為圓形，並且為了將裝載於腔室內部的基板依次移送至各個腔室而配備有在各個腔室之間移送基板的轉盤。 The substrate processing apparatus has a plurality of chambers arranged in a circular shape, and is equipped with a turntable that transfers the substrates between the chambers in order to sequentially transfer the substrates loaded in the chambers to the chambers.

如此的現有的基板處理裝置詳細地記載在韓國授權專利第10-1796647號。 Such a conventional substrate processing apparatus is described in detail in Korean Granted Patent No. 10-1796647.

所述現有技術中記載的轉盤由形成為放射狀的多個臂和在所述臂的端部底面用於支撐基板的基板支撐部構成。 The turntable described in the prior art is composed of a plurality of arms formed in a radial shape and a substrate support portion for supporting the substrate on the bottom surface of the end portion of the arm.

但是，根據這種結構的轉盤，存在在用轉盤移送基板期間變得不穩定的問題。 However, according to the turntable of this structure, there is a problem that it becomes unstable during the transfer of the substrate by the turntable.

本發明為瞭解決上述的諸多問題而提出，其目的在於提供一種在多個腔室之間能夠穩定地移送基板的基板處理裝置。 The present invention is proposed in order to solve the above-mentioned problems, and its object is to provide a substrate processing apparatus capable of stably transferring a substrate between a plurality of chambers.

用於達成上述的目的的本發明的基板處理裝置，包括：多個腔室，為了處理基板而沿圓周方向以預定間隔佈置；轉盤，配備為為了在所述多個腔室之間移送所述基板而旋轉，所述多個腔室中的至少一個腔室配備有安置所述基板的平台和提供用於沿上下方向升降所述平台的驅動力的平台驅動部，所述轉盤包括：轉盤主體，藉由轉盤驅動部而升降以及旋轉；環形的轉盤環，配備為在安置於所述轉盤主體的狀態下能夠從所述轉盤主體分離。 The substrate processing apparatus of the present invention for achieving the above-mentioned object includes: a plurality of chambers arranged at predetermined intervals in the circumferential direction for processing substrates; and a turntable provided to transfer the plurality of chambers The substrate is rotated, and at least one of the plurality of chambers is equipped with a platform on which the substrate is placed and a platform driving part that provides a driving force for raising and lowering the platform in an up-and-down direction, and the turntable includes: a turntable main body , The turntable is lifted and rotated by the turntable driving part; the ring-shaped turntable ring is equipped to be separable from the turntable main body in a state of being placed on the turntable main body.

所述多個腔室中進行所述基板的裝載及卸載的第一腔室包括進行所述基板的裝載及卸載的上部的第一空間和形成於所述第一空間下部的第二空間，在所述第一空間和第二空間彼此隔離的狀態下進行所述基板的裝載及卸載，如果所述平台和轉盤環藉由所述平台驅動部而一起向上方向移動，則所述第一空間和第二空間可以通過所述轉盤環緊貼於配備在所述第一空間和第二空間的邊界的薄片部來實現隔離。 The first chamber for loading and unloading of the substrate among the plurality of chambers includes a first space at the upper part for loading and unloading the substrate and a second space formed at the lower part of the first space. The loading and unloading of the substrate is performed in a state in which the first space and the second space are isolated from each other. If the platform and the turntable ring move upward together by the platform driving part, the first space and the The second space can be isolated by the turntable ring closely adhering to the sheet part provided on the boundary between the first space and the second space.

可以配備有環分離部件，當在所述轉盤環緊貼於所述薄片部的狀態下所述平台藉由所述平台驅動部而下降時，該環分離部件對所述轉盤環施加向下方向的力。 It may be equipped with a ring separating member that applies a downward direction to the turntable ring when the platform is lowered by the platform driving portion in a state where the turntable ring is in close contact with the sheet portion的力。 The force.

所述環分離部件可以是其下端部沿上下方向貫通所述薄片部，貫通的所述下端部接觸於所述轉盤環的上表面而施加所述向下方向的力。 The ring separating member may have a lower end portion penetrating the sheet portion in a vertical direction, and the penetrating lower end portion may contact the upper surface of the turntable ring to apply the downward force.

所述轉盤環的上表面與所述薄片部之間配備有用於維持氣密的第一密封部件，所述轉盤環的底面與所述平台的邊緣位置部上表面之間可以配備有用於維持氣密的第二密封部件。 A first sealing member for maintaining air tightness is provided between the upper surface of the turntable ring and the sheet portion, and a first sealing member for maintaining air tightness may be provided between the bottom surface of the turntable ring and the upper surface of the edge position of the platform. Dense second sealing part.

所述多個腔室包括：第一腔室，進行所述基板的裝載和卸載；多個熱處理腔室，用於移送裝載在所述第一腔室的基板並對裝載在所述第一腔室的基板依次進行熱處理，在所述多個熱處理腔室中經過熱處理的基板可以移送到所述第一腔室而被冷卻之後被卸載。 The plurality of chambers include: a first chamber for loading and unloading the substrate; a plurality of heat treatment chambers for transferring the substrate loaded in the first chamber and loading in the first chamber The substrates in the chambers are subjected to heat treatment in sequence, and the substrates that have undergone heat treatment in the plurality of heat treatment chambers may be transferred to the first chamber to be cooled and then unloaded.

所述多個熱處理腔室中的每一個可以分別配備有隔壁，所述隔壁在處理移送到各自的腔室內部的基板期間，為了使各個腔室內部空間與其他腔室的空間隔離或連通而移動。 Each of the plurality of heat treatment chambers may be respectively equipped with a partition wall in order to isolate or communicate the internal space of each chamber from the space of other chambers during the processing of the substrate transferred to the inside of the respective chamber. move.

所述隔壁以上下升降的方式配備，所述隔壁下降而相接到位於所述多個熱處理腔室中的每一個的所述轉盤環的上表面，所述轉盤環的底面接觸並支撐於轉盤環支撐部。 The partition wall is equipped in an up-and-down manner, the partition wall descends to be connected to the upper surface of the turntable ring located in each of the plurality of heat treatment chambers, and the bottom surface of the turntable ring contacts and supports the turntable环Support part.

根據本發明，配備有能夠從轉盤主體分離的轉盤環，通過在基板被所述轉盤環支撐的狀態下移送基板，從而能夠穩定地移送基板。 According to the present invention, a turntable ring that can be separated from the turntable main body is provided, and the substrate can be transferred stably by transferring the substrate in a state where the substrate is supported by the turntable ring.

並且，能夠防止配備於進行基板的裝載及卸載的腔室的轉盤環粘附於薄片部。 In addition, it is possible to prevent the turntable ring provided in the chamber where the substrate is loaded and unloaded from sticking to the sheet portion.

1:基板處理裝置 1: Substrate processing equipment

2:設備前端模塊 2: Equipment front-end module

2a:基板裝載部 2a: Substrate loading section

2b:基板移送部 2b: Board transfer part

20:轉盤環支撐部 20: Turntable ring support part

100:第一腔室 100: first chamber

100a:上部腔室 100a: upper chamber

100b:下部腔室 100b: Lower chamber

100c:薄片部 100c: Thin section

101:內壁 101: inner wall

110、210、310、410、510:平台 110, 210, 310, 410, 510: platform

120:環分離部件 120: Ring separation part

160:升降銷 160: lift pin

171:第一密封部件 171: The first sealing part

172:第二密封部件 172: The second sealing part

200:第二腔室 200: second chamber

271:第三密封部件 271: Third Sealing Part

300:第三腔室 300: third chamber

400:第四腔室 400: fourth chamber

500:第五腔室 500: Fifth Chamber

600:轉盤 600: turntable

610:轉盤主體 610: Turntable body

620:開口部 620: opening

630:轉盤環 630: Turntable Ring

640:基板支撐銷 640: substrate support pin

700:隔壁 700: next door

S1:第一空間 S1: the first space

S2:第二空間 S2: second space

S3:內部空間 S3: Internal space

S4:內部空間 S4: Internal space

W:基板 W: substrate

圖1是表示本發明的基板處理裝置的平面圖。 Fig. 1 is a plan view showing a substrate processing apparatus of the present invention.

圖2是表示本發明的基板處理裝置中各個腔室的內部結構的立體圖。 2 is a perspective view showing the internal structure of each chamber in the substrate processing apparatus of the present invention.

圖3的(a)和(b)是表示本發明的轉盤的立體圖。 Fig. 3 (a) and (b) are perspective views showing the turntable of the present invention.

圖4是表示本發明的基板處理裝置中在第一空間和第二空間被隔離的狀態下基板被升降銷支撐的狀態的剖面圖。 4 is a cross-sectional view showing a state in which the substrate is supported by lift pins in a state where the first space and the second space are separated in the substrate processing apparatus of the present invention.

圖5是表示在圖4的狀態下升降銷下降而基板安置於平台上表面的狀態的剖面圖。 Fig. 5 is a cross-sectional view showing a state in which the lift pins are lowered and the substrate is placed on the upper surface of the platform in the state of Fig. 4.

圖6是表示在圖5的狀態下平台與升降銷下降到轉盤環安置於轉盤主體的位置的狀態的剖面圖。 Fig. 6 is a cross-sectional view showing a state in which the platform and the lift pin are lowered to the position where the turntable ring is placed on the turntable main body in the state of FIG. 5.

圖7是表示在圖6的狀態下轉盤上升，從而基板從平台上表面隔開的狀態的剖面圖。 Fig. 7 is a cross-sectional view showing a state in which the turntable is raised in the state of Fig. 6 and the substrate is separated from the upper surface of the platform.

圖8是表示在圖7的狀態下轉盤旋轉，從而第一腔室的基板被移送到第二腔室的狀態的剖面圖。 Fig. 8 is a cross-sectional view showing a state in which the turntable rotates in the state of Fig. 7 and the substrate in the first chamber is transferred to the second chamber.

圖9是表示在圖8的狀態下第二腔室的基板安置於平台上表面的狀態的剖面圖。 Fig. 9 is a cross-sectional view showing a state in which the substrate of the second chamber is placed on the upper surface of the platform in the state of Fig. 8.

圖10是示出第一腔室中第一空間和第二空間隔離的狀態，且示出第二腔室中第二腔室的內部空間藉由隔壁而與其他腔室的內部空間隔離的狀態的圖。 FIG. 10 shows a state in which the first space and the second space in the first chamber are isolated, and shows a state in which the internal space of the second chamber in the second chamber is isolated from the internal spaces of other chambers by a partition wall Figure.

以下，參照附圖對本發明進行詳細說明。 Hereinafter, the present invention will be described in detail with reference to the drawings.

參照圖1至圖3，本發明的基板處理裝置1包括：多個腔室100、200、300、400、500，為了處理基板而沿圓周方向以預定間隔佈置；轉盤600，配備為為了在所述多個腔室100、200、300、400、500之間移送基板而旋轉；控制部(未示出)，用於控制包括所述轉盤600的基板處理裝置1的構成。 1 to 3, the substrate processing apparatus 1 of the present invention includes: a plurality of chambers 100, 200, 300, 400, 500, arranged at predetermined intervals in the circumferential direction in order to process substrates; The plurality of chambers 100, 200, 300, 400, 500 transfer and rotate substrates; a control unit (not shown) is used to control the structure of the substrate processing apparatus 1 including the turntable 600.

在本發明的基板處理裝置1中作為一例，可以執行回流工序。並且，本發明的基板處理裝置1中，在不是執行回流工序的情況下也可以執行使用熱的工序。 As an example, in the substrate processing apparatus 1 of the present invention, a reflow process can be performed. In addition, in the substrate processing apparatus 1 of the present invention, a process using heat may be performed without performing a reflow process.

所述多個腔室100、200、300、400、500可以包括：第一腔室100，進行所述基板的裝載和卸載；第二腔室200、第三腔室300、第四腔室400，用於對裝載在所述第一腔室100的基板加熱而進行熱處理；第五腔室500，冷卻在所述第四腔室400中經過熱處理的基板。 The plurality of chambers 100, 200, 300, 400, 500 may include: a first chamber 100 for loading and unloading the substrate; a second chamber 200, a third chamber 300, and a fourth chamber 400 , For heating the substrate loaded in the first chamber 100 for heat treatment; the fifth chamber 500, for cooling the heat-treated substrate in the fourth chamber 400.

在所述第一腔室100中進行基板的裝載及卸載，不僅如此，還可以執行依次經過所述第二腔室200、第三腔室300、第四腔室400、第五腔室500而被加熱處理的基板的冷卻。在所述第二腔室200、第三腔室300、第四腔室400、第五腔室500中可以執行伴隨基板的加熱處理的工序，從而執行作為熱處理腔室的功能。 The loading and unloading of substrates in the first chamber 100 is not only that, but it can also be executed sequentially through the second chamber 200, the third chamber 300, the fourth chamber 400, and the fifth chamber 500. Cooling of heat-treated substrates. In the second chamber 200, the third chamber 300, the fourth chamber 400, and the fifth chamber 500, a process accompanying the heating treatment of the substrate may be performed, thereby performing a function as a heat treatment chamber.

所述第五腔室500可以構成為在第一腔室100的冷卻之前執行冷卻工序。此時，所述第五腔室500也可以構成為配備加熱器以加熱基板，但是將基板的加熱溫度設定為低於在第四腔室400中加熱基板的溫度，從而實現基板的冷卻。 The fifth chamber 500 may be configured to perform a cooling process before the cooling of the first chamber 100. At this time, the fifth chamber 500 may also be configured to be equipped with a heater to heat the substrate, but the heating temperature of the substrate is set to be lower than the temperature of heating the substrate in the fourth chamber 400 to achieve cooling of the substrate.

所述第一腔室100的一側連接設置有設備前端模塊2(EFEM：Equipment Front End Module)。 An Equipment Front End Module 2 (EFEM: Equipment Front End Module) is connected to one side of the first chamber 100.

所述設備前端模塊2具有如下功能：將裝載於基板裝載部2a的未處理的基板利用配備於基板移送部2b的移送機器人(未示出)裝載到基板處理裝置1的第一腔室100，或者將基板處理裝置1中已完成處理的基板從第一腔室100卸載而裝載到基板裝載部2a。 The equipment front-end module 2 has the function of loading unprocessed substrates loaded on the substrate loading portion 2a into the first chamber 100 of the substrate processing apparatus 1 by a transfer robot (not shown) provided in the substrate transfer portion 2b, Alternatively, the processed substrate in the substrate processing apparatus 1 is unloaded from the first chamber 100 and loaded on the substrate mounting portion 2a.

所述第二腔室200、第三腔室300、第四腔室400、第五腔室500中加熱基板的溫度可以設定為100℃至450℃。並且，所述第二腔室200、第三腔室300、第四腔室400、第五腔室500分別可以配備有為了加熱基板而產生熱的加熱 器。所述加熱器的形狀和大小可以變更為多種多樣，所述加熱器可以分別配備於基板的上部和下部。 The temperature of the substrate to be heated in the second chamber 200, the third chamber 300, the fourth chamber 400, and the fifth chamber 500 may be set at 100°C to 450°C. In addition, the second chamber 200, the third chamber 300, the fourth chamber 400, and the fifth chamber 500 may be equipped with heating devices that generate heat in order to heat the substrate. Device. The shape and size of the heater can be varied, and the heater can be provided on the upper and lower parts of the substrate, respectively.

所述第一腔室100、第二腔室200、第三腔室300、第四腔室400、第五腔室500可以各自配備有平台110、210、310、410、510。所述第一腔室100的平台110的上表面安置基板，可以通過冷卻單元而對基板進行冷卻。除了所述第一腔室100的平台110以外的其餘腔室200、300、400、500的平台210、310、410、510配備有加熱器，從而可以實現對基板施加熱的處理。 The first chamber 100, the second chamber 200, the third chamber 300, the fourth chamber 400, and the fifth chamber 500 may be equipped with platforms 110, 210, 310, 410, 510, respectively. A substrate is placed on the upper surface of the platform 110 of the first chamber 100, and the substrate can be cooled by a cooling unit. The platforms 210, 310, 410, and 510 of the remaining chambers 200, 300, 400, 500 except for the platform 110 of the first chamber 100 are equipped with heaters, so that the process of applying heat to the substrate can be realized.

配備有主體外殼10，該主體外殼10圍繞所述第一腔室100、第二腔室200、第三腔室300、第四腔室400、第五腔室500及轉盤600的整個外側，並具有能夠設置所述各個部件的支撐架的功能。 Equipped with a main body housing 10 that surrounds the entire outside of the first chamber 100, the second chamber 200, the third chamber 300, the fourth chamber 400, the fifth chamber 500 and the turntable 600, and It has the function of being able to set the support frame of the various components.

所述轉盤600包括：轉盤主體610，藉由轉盤驅動部(未示出)而旋轉；多個開口部620，貫通所述轉盤主體610並以對應於所述多個腔室100、200、300、400、500的數量沿圓周外圍而形成；環形的轉盤環630，配備為支撐並安置在各個所述開口部620的邊緣位置的狀態下能夠從所述轉盤主體610分離。 The turntable 600 includes: a turntable main body 610, which is rotated by a turntable driving part (not shown); a plurality of openings 620, penetrates the turntable main body 610 and corresponds to the plurality of chambers 100, 200, 300 The numbers of 400, 500 are formed along the periphery of the circumference; the ring-shaped turntable ring 630 is equipped to be supported and can be separated from the turntable main body 610 in a state where it is arranged at the edge position of each of the openings 620.

所述轉盤驅動部可以配備為能夠使轉盤600旋轉，並且能夠使轉盤600沿上下方向升降。藉由這樣的構成，可以執行將基板從一個腔室移送到相鄰的腔室的功能。 The turntable driving part may be equipped to be capable of rotating the turntable 600 and capable of raising and lowering the turntable 600 in an up-and-down direction. With this configuration, it is possible to perform the function of transferring the substrate from one chamber to the adjacent chamber.

所述轉盤環630結合有用於支撐基板的底面的基板支撐銷640。所述基板支撐銷640沿所述轉盤環630的圓周外圍而配備為多個，所述基板支撐銷640的一側端部用緊固部件(未示出)結合於所述轉盤環630，另一側端部配備為朝向所述轉盤環630的中心。 The turntable ring 630 is combined with a substrate support pin 640 for supporting the bottom surface of the substrate. The substrate support pin 640 is provided in multiple along the circumference of the turntable ring 630, and one end of the substrate support pin 640 is coupled to the turntable ring 630 by a fastening member (not shown). One side end is equipped to face the center of the turntable ring 630.

所述第一腔室100、第二腔室200、第三腔室300、第四腔室400、第五腔室500各自配備有多個所述基板支撐銷640。配備於各個所述腔室的所述多個基板支撐銷6400配備為沿中央的平台110、210、310、410、510的外圍而以預定間隔隔開佈置。配備於所述第一腔室100的平台110的上表面形成有凹陷的形狀的向上方向開放的基板支撐銷插入槽110a，在所述基板支撐銷插入槽110a插入有基板支撐銷640。 The first chamber 100, the second chamber 200, the third chamber 300, the fourth chamber 400, and the fifth chamber 500 are each equipped with a plurality of the substrate support pins 640. The plurality of substrate support pins 6400 provided in each of the chambers are provided to be arranged at predetermined intervals along the periphery of the central platform 110, 210, 310, 410, 510. The upper surface of the platform 110 provided in the first chamber 100 is formed with a recessed shape and upwardly opened substrate support pin insertion groove 110 a, and the substrate support pin 640 is inserted into the substrate support pin insertion groove 110 a.

圖3的(a)表示轉盤環630安置於轉盤主體610的狀態，圖3的(b)表示轉盤環630從轉盤主體610分離的狀態。 3(a) shows a state where the turntable ring 630 is placed on the turntable main body 610, and FIG. 3(b) shows a state where the turntable ring 630 is separated from the turntable main body 610.

如果驅動所述轉盤驅動部，則轉盤600在上下高度固定的狀態下進行旋轉。所述轉盤環630隨著後述的平台110升降而一同升降，所述轉盤環630以從所述轉盤主體610分離的狀態升降。 When the turntable driving section is driven, the turntable 600 rotates in a state where the vertical height is fixed. The turntable ring 630 moves up and down along with the platform 110 described later, and the turntable ring 630 moves up and down in a state of being separated from the turntable main body 610.

參照圖4針對作為所述多個腔室100、200、300、400、500中的一個的第一腔室100的結構及內部構成進行說明。 The structure and internal structure of the first chamber 100 as one of the plurality of chambers 100, 200, 300, 400, and 500 will be described with reference to FIG. 4.

所述第一腔室100由上部腔室100a和配備於所述上部腔室100a的下側的下部腔室100b組成。 The first chamber 100 is composed of an upper chamber 100a and a lower chamber 100b provided on the lower side of the upper chamber 100a.

所述上部腔室100a的內部形成有第一空間S1，所述下部腔室100b的內部形成有第二空間S2。 A first space S1 is formed in the upper chamber 100a, and a second space S2 is formed in the lower chamber 100b.

所述第一腔室100中基板W的裝載及卸載是在所述第一空間S1與第二空間S2在空間上隔離而互不連通的狀態下執行。 The loading and unloading of the substrate W in the first chamber 100 is performed in a state where the first space S1 and the second space S2 are spaced apart and not connected to each other.

所述第一空間S1具有藉由移送機器人而裝載基板裝載部2a的基板W或藉由移送機器人將已完成基板處理的基板W卸載到基板裝載部2a的作為裝載鎖定部的功能。 The first space S1 has a function as a load lock portion for loading the substrate W of the substrate mounting portion 2a by the transfer robot or unloading the substrate W that has been processed to the substrate loading portion 2a by the transfer robot.

所述第二空間S2佈置有轉盤600，並且與相鄰的另外腔室200、300、400、500連通而提供各個腔室100、200、300、400、500之間移送基板W的通路。即，所述第二空間S2具有將裝載的基板從第一腔室100移送到第二腔室200的通路的功能、將所述第五腔室500中已完成處理的基板移送到裝載鎖定部的通路的功能以及卸載之前執行基板的冷卻的作為工序腔室的功能。 The second space S2 is provided with a turntable 600 and communicates with other adjacent chambers 200, 300, 400, and 500 to provide a passage for transferring substrates W between the respective chambers 100, 200, 300, 400, and 500. That is, the second space S2 has the function of a passage for transferring the loaded substrates from the first chamber 100 to the second chamber 200, and transfers the processed substrates in the fifth chamber 500 to the load lock section. The function of the passage and the function of the process chamber that performs the cooling of the substrate before unloading.

所述上部腔室100a的一側面形成有用於使裝載及卸載的基板出入的開口部(未示出)，所述開口部通過閘閥(未示出)進行開閉。 An opening (not shown) for loading and unloading substrates is formed on one side surface of the upper chamber 100a, and the opening is opened and closed by a gate valve (not shown).

所述第一腔室100配備有：平台110，安置基板W；升降銷160，支撐所述基板W的底面而升降基板；冷卻單元(未示出)，用於冷卻裝載在所述平台110的上部的基板。並且，可以配備有提供驅動力以使所述平台110能夠沿上下方向進行升降的平台驅動部(未示出)。 The first chamber 100 is equipped with: a platform 110 for placing a substrate W; a lifting pin 160 for supporting the bottom surface of the substrate W to lift the substrate; a cooling unit (not shown) for cooling the platform 110 The upper substrate. Also, a platform driving part (not shown) that provides a driving force to enable the platform 110 to be raised and lowered in the up and down direction may be equipped.

所述上部腔室100a與下部腔室100b的邊界部分形成有向內側突出的薄片部100c。所述平台110與轉盤環630上升，從而所述轉盤環630的上表面緊貼於所述薄片部100c。所述轉盤環630的上表面與所述薄片部100c之間夾設有第一密封部件171，從而保持氣密。並且，所述轉盤環630的底面與平台110的上表面之間夾設有第二密封部件172，從而保持氣密。 The boundary portion between the upper chamber 100a and the lower chamber 100b is formed with a sheet portion 100c protruding inward. The platform 110 and the turntable ring 630 rise, so that the upper surface of the turntable ring 630 is in close contact with the sheet portion 100c. A first sealing member 171 is sandwiched between the upper surface of the turntable ring 630 and the sheet portion 100c, so as to maintain airtightness. In addition, a second sealing member 172 is interposed between the bottom surface of the turntable ring 630 and the upper surface of the platform 110 to maintain airtightness.

在這種狀態下，第一腔室100的內部空間以平台110為基準其上側的第一空間S1與下側的第二空間S2相互隔離。 In this state, the internal space of the first chamber 100 is isolated from each other with the first space S1 on the upper side and the second space S2 on the lower side with the platform 110 as a reference.

所述升降銷160配備為沿上下方向貫通所述平台110。配備有用於使所述升降銷160沿上下方向升降的升降銷驅動部(未示出)。如果驅動所述升降銷驅動部而使所述升降銷160上升或下降，則在升降銷160的上端支撐基板W的底面的狀態下實現基板W的升降。 The lifting pin 160 is equipped to penetrate the platform 110 in the up and down direction. Equipped with a lift pin driving part (not shown) for lifting the lift pin 160 in the up-and-down direction. If the lift pin drive unit is driven to raise or lower the lift pin 160, the substrate W is lifted and lowered in a state where the upper end of the lift pin 160 supports the bottom surface of the substrate W.

平台110和升降銷160藉由所述平台驅動部和升降銷驅動部的驅動而上升，所述轉盤環630處於從轉盤主體610分離而與平台110一起向上移動的狀態。 The platform 110 and the lifting pin 160 are driven by the platform driving part and the lifting pin driving part to rise, and the turntable ring 630 is in a state of being separated from the turntable main body 610 and moving upward together with the platform 110.

在此狀態下將會藉由移送機器人將基板W從基板裝載部2a裝載到上部腔室100a的內部或者將上部腔室100a內部的基板W卸載到基板裝載部2a。 In this state, the transfer robot will load the substrate W from the substrate loading portion 2a into the upper chamber 100a or unload the substrate W in the upper chamber 100a to the substrate loading portion 2a.

所述第一腔室100可以配備有環分離部件120，當在所述轉盤環630緊貼於所述薄片部100c的狀態下所述平台110藉由所述平台驅動部而下降時，為了防止所述轉盤環630粘附於薄片部100c的底面，該環分離部件120對所述轉盤環630施加向下方向的力。 The first chamber 100 may be equipped with a ring separating member 120, when the platform 110 is lowered by the platform driving portion when the turntable ring 630 is in close contact with the sheet portion 100c, in order to prevent The turntable ring 630 is adhered to the bottom surface of the sheet portion 100c, and the ring separating member 120 exerts a downward force on the turntable ring 630.

所述環分離部件120可以配備為下端部貫通所述薄片部100c，並且會藉由提供升降所述環分離部件120的力的分離部件驅動部(未示出)的驅動而進行升降。 The ring separation member 120 may be equipped with a lower end portion penetrating through the sheet portion 100c, and can be lifted and lowered by a separation member driving portion (not shown) that provides a force for raising and lowering the ring separation member 120.

所述第二腔室200的上面配備有用於安置基板W而進行基板處理的平台210，並且配備有用於圍繞所述平台210的上部空間的內壁101和從所述內壁101的外側面沿上下方向移動的隔壁700。 The upper surface of the second chamber 200 is equipped with a platform 210 for arranging substrates W for substrate processing, and is equipped with an inner wall 101 for surrounding the upper space of the platform 210 and a peripheral edge from the outer side of the inner wall 101. The partition 700 moves up and down.

所述內壁101可以一體地形成於圍繞第二腔室200的外殼。所述隔壁700配備為在緊貼於所述內壁101的外側面的狀態下能夠進行上下移動。可以配備有用於使所述隔壁700上下移動的隔壁驅動部(未示出)。 The inner wall 101 may be integrally formed on the outer shell surrounding the second chamber 200. The partition wall 700 is provided so as to be able to move up and down while in close contact with the outer surface of the inner wall 101. It may be equipped with a partition wall driving part (not shown) for moving the partition wall 700 up and down.

所述隔壁700配備為在第二腔室200進行基板處理期間使平台210的上部空間與其他腔室隔離，或者完成基板處理後，為了與其他腔室連通而進行上下升降。所述隔壁700也可以分別配備於第三腔室至第五腔室300、400、500。 The partition wall 700 is configured to isolate the upper space of the platform 210 from other chambers during substrate processing in the second chamber 200, or to move up and down to communicate with other chambers after the substrate processing is completed. The partition wall 700 may also be provided in the third chamber to the fifth chamber 300, 400, 500, respectively.

如圖4所示，在所述隔壁700向上移動的情形下，第二腔室200的內部空間成為與其他腔室連通的狀態，如果所述隔壁700向下移動而下端部接觸於轉盤環630，則第二腔室200的內部空間成為不與其他腔室連通的隔離狀態。所述轉盤環630的上表面630配備有第三密封部件271，所述隔壁700的下端部和所述轉盤環630的上表面之間夾設有所述第三密封部件271，從而可以維持氣密。 As shown in FIG. 4, when the partition wall 700 moves upward, the internal space of the second chamber 200 becomes in communication with other chambers. If the partition wall 700 moves downward and the lower end contacts the turntable ring 630 , The internal space of the second chamber 200 becomes an isolated state that does not communicate with other chambers. The upper surface 630 of the turntable ring 630 is equipped with a third sealing member 271, and the third sealing member 271 is sandwiched between the lower end of the partition wall 700 and the upper surface of the turntable ring 630, so that the air can be maintained. dense.

所述第二腔室200配備有轉盤環支撐部20，所述轉盤環630的底面接觸並支撐於所述轉盤環支撐部20的上表面並被支撐。 The second chamber 200 is equipped with a turntable ring support portion 20, and the bottom surface of the turntable ring 630 is in contact with and supported on the upper surface of the turntable ring support portion 20 and is supported.

在所述實施例中，構成為所述隔壁700的下端部接觸於轉盤環630，轉盤環630的底面接觸於轉盤環支撐部20，但是也可以構成為在轉盤主體610的上表面和底面分別接觸隔壁700的下端部和轉盤環支撐部20的上表面。 In the above embodiment, the lower end of the partition wall 700 is in contact with the turntable ring 630, and the bottom surface of the turntable ring 630 is in contact with the turntable ring support portion 20. However, it can also be constructed so that the upper surface and the bottom surface of the turntable main body 610 are in contact with each other. The lower end portion of the partition wall 700 and the upper surface of the turntable ring support portion 20 are contacted.

圖5表示在圖4的狀態下驅動升降銷驅動部而使升降銷160下降的狀態。若所述升降銷160下降，則基板W將安置於平台110上。 FIG. 5 shows a state in which the lift pin drive unit is driven to lower the lift pin 160 in the state of FIG. 4. If the lifting pin 160 descends, the substrate W will be placed on the platform 110.

圖6表示在圖5的狀態下驅動平台驅動部而使平台110下降的狀態。此時，升降銷160藉由升降銷驅動部的驅動而向下移動。所述轉盤環630和基板支撐銷640與平台110一起下降，此時將下降到所述轉盤環630安置於轉盤主體610為止。 FIG. 6 shows a state where the platform driving section is driven to lower the platform 110 in the state of FIG. 5. At this time, the lift pin 160 moves downward by the driving of the lift pin driving part. The turntable ring 630 and the substrate support pin 640 are lowered together with the platform 110, and at this time, the turntable ring 630 will be lowered until the turntable ring 630 is placed on the turntable main body 610.

圖5的狀態是轉盤環630的上表面緊貼於薄片部100c的狀態，第一空間S1和第二空間S2被隔離。在這種狀態下，若使平台110下降，則可能發生轉盤環630粘附於薄片部100c的底面的情況。當所述第一空間S1作為裝載鎖定部而發揮功能時，第一空間S1可以形成為真空，此時可能會頻繁發生所述轉盤環630粘附於薄片部100c的底面的現象。 The state of FIG. 5 is a state where the upper surface of the turntable ring 630 is in close contact with the sheet portion 100c, and the first space S1 and the second space S2 are isolated. In this state, if the platform 110 is lowered, the turntable ring 630 may adhere to the bottom surface of the sheet portion 100c. When the first space S1 functions as a load lock portion, the first space S1 may be formed as a vacuum. At this time, the turntable ring 630 may frequently adhere to the bottom surface of the sheet portion 100c.

因此，在圖5的狀態下，若平台110下降的同時驅動分離部件驅動部而使其驅動為使環分離部件120下降，則所述環分離部件120的下端部對所述轉盤環630的上表面加壓，從而防止轉盤環630的上表面粘附於薄片部100c的底面，所述轉盤環630將與平台110一起下降。 Therefore, in the state of FIG. 5, if the platform 110 is lowered while driving the separating member drive unit to drive it to lower the ring separating member 120, the lower end of the ring separating member 120 will face the upper end of the turntable ring 630. The surface is pressurized to prevent the upper surface of the turntable ring 630 from adhering to the bottom surface of the sheet portion 100c, and the turntable ring 630 will descend together with the platform 110.

圖7表示在圖6的狀態下驅動轉盤驅動部而使轉盤600上升的狀態。若所述轉盤600上升，則基板W在其底面被基板支撐銷640支撐的狀態下與轉盤600一起上升。 FIG. 7 shows a state where the turntable drive section is driven to raise the turntable 600 in the state of FIG. 6. When the turntable 600 rises, the substrate W will rise together with the turntable 600 in a state where the bottom surface of the substrate W is supported by the substrate support pins 640.

圖8表示在圖7的狀態下驅動轉盤驅動部而使轉盤600旋轉的狀態。若所述轉盤600旋轉，則基板W將從第一腔室100移送到相鄰的第二腔室200。如果第五腔室500中具有已進行基板處理的基板，則曾位於第五腔室500的基板可以藉由轉盤600的旋轉而移動到第一腔室100。 FIG. 8 shows a state in which the turntable driving section is driven to rotate the turntable 600 in the state of FIG. 7. When the turntable 600 rotates, the substrate W will be transferred from the first chamber 100 to the adjacent second chamber 200. If the fifth chamber 500 has a substrate that has undergone substrate processing, the substrate once located in the fifth chamber 500 can be moved to the first chamber 100 by the rotation of the turntable 600.

圖9表示在圖8的狀態下轉盤600藉由轉盤驅動部的驅動而下降，從而基板W安置於平台210的上表面的狀態。 FIG. 9 shows a state in which the turntable 600 is lowered by the driving of the turntable driving part in the state of FIG. 8, and the substrate W is placed on the upper surface of the platform 210.

圖10表示在圖9的狀態下隔壁700藉由隔壁驅動部的驅動而下降，從而隔壁700的下端部接觸於轉盤環630的上表面的狀態。所述隔壁700的下端部隔著第三密封部件271而接觸於轉盤環630的上表面，所述轉盤環630的底面藉由轉盤環支撐部20而被支撐。因此，第二腔室200的上部的內部空間S3和下部的內部空間S4以不與其他腔室100、300、400、500的內部空間連通的方式而被隔離。 FIG. 10 shows a state where the partition wall 700 is lowered by the driving of the partition wall driving unit in the state of FIG. 9, and the lower end of the partition wall 700 is in contact with the upper surface of the turntable ring 630. The lower end of the partition wall 700 contacts the upper surface of the turntable ring 630 with the third sealing member 271 interposed therebetween, and the bottom surface of the turntable ring 630 is supported by the turntable ring support portion 20. Therefore, the upper internal space S3 and the lower internal space S4 of the second chamber 200 are isolated so as not to communicate with the internal spaces of the other chambers 100, 300, 400, and 500.

此時，當從第五腔室500移送的基板W位於第一腔室100時，在所述第一腔室100進行基板W的冷卻的同時，為了冷卻後卸載基板W，可以構成為平台110上升而使轉盤環630的上表面緊貼於薄片部100c。此後，若升降銷160上升而基板W的底面從平台110的上表面隔開，則將實現基板W的卸載。 At this time, when the substrate W transferred from the fifth chamber 500 is located in the first chamber 100, while cooling the substrate W in the first chamber 100, in order to unload the substrate W after cooling, it may be configured as a platform 110 The upper surface of the turntable ring 630 is in close contact with the sheet portion 100c by ascending. After that, if the lift pin 160 rises and the bottom surface of the substrate W is separated from the upper surface of the platform 110, the substrate W will be unloaded.

根據如上所述的構成，由於在基板被配備於轉盤600的轉盤環630支撐的狀態下進行旋轉而實現基板的移送，因此能夠穩定地移送基板。並且，可以防止平台110下降時轉盤環630粘附於薄片部100c的現象。 According to the above-mentioned configuration, since the substrate is rotated while being supported by the turntable ring 630 provided on the turntable 600 to realize the transfer of the substrate, the substrate can be transferred stably. In addition, it is possible to prevent the turntable ring 630 from adhering to the sheet portion 100c when the platform 110 is lowered.

如上所述，舉出優選的實施例對本發明進行了詳細的說明，但是本發明並不局限於前述的實施例，在權利要求書和發明的詳細的說明以及附圖的範圍內能夠以多種方式變形實施，這也屬於本發明。 As described above, the present invention has been described in detail with preferred embodiments, but the present invention is not limited to the foregoing embodiments, and can be done in various ways within the scope of the claims, the detailed description of the invention, and the drawings. Modified implementation also belongs to the present invention.

20:轉盤環支撐部20: Turntable ring support part

100:第一腔室100: first chamber

100a:上部腔室100a: upper chamber

100b:下部腔室100b: Lower chamber

100c:薄片部100c: Thin section

101:內壁101: inner wall

110:平台110: platform

120:環分離部件120: Ring separation part

160:升降銷160: lift pin

171:第一密封部件171: The first sealing part

172:第二密封部件172: The second sealing part

200:第二腔室200: second chamber

210:平台210: platform

271:第三密封部件271: Third Sealing Part

610:轉盤主體610: Turntable body

630:轉盤環630: Turntable Ring

640:基板支撐銷640: substrate support pin

700:隔壁700: next door

S1:第一空間S1: the first space

S2:第二空間S2: second space

W:基板W: substrate

Claims (7)

一種基板處理裝置，包括：多個腔室，為了處理基板而沿圓周方向以預定間隔佈置；轉盤，配備為為了在該等腔室之間移送該基板而旋轉，其中該等腔室中的至少一個腔室配備有安置該基板的平台和提供用於沿上下方向升降該平台的驅動力的平台驅動部，該轉盤包括：轉盤主體，藉由轉盤驅動部而升降以及旋轉；環形的轉盤環，配備為在安置於該轉盤主體的狀態下能夠從該轉盤主體分離；其中該等腔室中進行該基板的裝載及卸載的第一腔室包括進行該基板的裝載及卸載的上部的第一空間和形成於該第一空間下部的第二空間，在該第一空間和該第二空間彼此隔離的狀態下進行該基板的裝載及卸載，如果該平台和該轉盤環藉由該平台驅動部而一起向上方向移動，則該轉盤環緊貼於配備在該第一空間和該第二空間的邊界的薄片部，從而該第一空間和該第二空間被隔離。 A substrate processing apparatus includes: a plurality of chambers arranged at predetermined intervals in a circumferential direction for processing substrates; a turntable is equipped to rotate in order to transfer the substrate between the chambers, wherein at least one of the chambers A chamber is equipped with a platform on which the substrate is placed and a platform driving part that provides driving force for raising and lowering the platform in the up and down direction. The turntable includes: a turntable body, which is lifted and rotated by the turntable driving part; an annular turntable ring, Equipped to be detachable from the turntable main body in a state of being placed on the turntable main body; wherein the first chamber in the chambers for loading and unloading the substrate includes a first space on the upper part for loading and unloading the substrate And the second space formed in the lower part of the first space, the loading and unloading of the substrate are performed in a state where the first space and the second space are isolated from each other, if the platform and the turntable ring are driven by the platform driving part Moving in the upward direction together, the turntable ring closely adheres to the sheet portion provided at the boundary between the first space and the second space, so that the first space and the second space are isolated. 根據請求項1所述的基板處理裝置，其中配備有環分離部件，當在該轉盤環緊貼於該薄片部的狀態下該平台藉由該平台驅動部而下降時，該環分離部件對該轉盤環施加向下方向的力。 The substrate processing apparatus according to claim 1, wherein a ring separating member is provided, and when the platform is lowered by the platform driving portion in a state in which the turntable ring is in close contact with the sheet portion, the ring separating member responds to The turntable ring exerts a downward force. 根據請求項2所述的基板處理裝置，其中該環分離部件的下端部沿上下方向貫通該薄片部，貫通的該下端部接觸於該轉盤環的上表面而施加該向下方向的力。 The substrate processing apparatus according to claim 2, wherein the lower end portion of the ring separating member penetrates the sheet portion in the vertical direction, and the penetrating lower end portion contacts the upper surface of the turntable ring to apply the downward force. 根據請求項1所述的基板處理裝置，其中該轉盤環的上表面與該薄片部之間配備有用於維持氣密的第一密封部件，該轉盤環的底面與該平台的邊緣位置部上表面之間配備有用於維持氣密的第二密封部件。 The substrate processing apparatus according to claim 1, wherein a first sealing member for maintaining air tightness is provided between the upper surface of the turntable ring and the sheet portion, and the bottom surface of the turntable ring and the upper surface of the edge position portion of the platform Between is equipped with a second sealing component for maintaining airtightness. 根據請求項1所述的基板處理裝置，其中該等腔室包括：第一腔室，進行該基板的裝載和卸載；多個熱處理腔室，用於移送裝載在該第一腔室的該基板並對裝載在該第一腔室的基板依次進行熱處理，在該等熱處理腔室中經過熱處理的該基板在移送到該第一腔室而被冷卻之後被卸載。 The substrate processing apparatus according to claim 1, wherein the chambers include: a first chamber for loading and unloading the substrate; and a plurality of heat treatment chambers for transferring the substrate loaded in the first chamber The substrates loaded in the first chamber are sequentially heat-treated, and the substrates that have been heat-treated in the heat-treatment chambers are transferred to the first chamber to be cooled and then unloaded. 根據請求項1所述的基板處理裝置，其中該等腔室包括：第一腔室，進行該基板的裝載和卸載；多個熱處理腔室，用於移送裝載在該第一腔室的該基板並對裝載在該第一腔室的基板依次進行熱處理，該等熱處理腔室中的每一個分別配備有隔壁，該隔壁在處理移送到各自的腔室內部的該基板期間，為了使各個腔室內部空間與其他腔室的空間隔離或連通而移動。 The substrate processing apparatus according to claim 1, wherein the chambers include: a first chamber for loading and unloading the substrate; and a plurality of heat treatment chambers for transferring the substrate loaded in the first chamber The substrates loaded in the first chamber are sequentially heat-treated. Each of the heat-treatment chambers is equipped with a partition wall. During the processing of the substrate transferred to the inside of the respective chamber, the partition wall The part space is separated from or communicated with the space of other chambers to move. 根據請求項6所述的基板處理裝置，其中該隔壁以上下升降的方式配備，該隔壁下降而接觸到位於該等熱處理腔室中的每一個的該轉盤環的上表面，該轉盤環的底面接觸並支撐於轉盤環支撐部。 The substrate processing apparatus according to claim 6, wherein the partition wall is equipped in an up-and-down manner, the partition wall descends to contact the upper surface of the turntable ring located in each of the heat treatment chambers, and the bottom surface of the turntable ring Contact and support the turntable ring support part.
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