TWI775214B - Substrate treating apparatus and substrate treating method - Google Patents

Abstract

An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of minimizing thermal deformation of the substrate by blocking the gap between the substrate and the heating portion inside the chamber when loading and unloading the substrate. The substrate processing apparatus of the present invention to achieve this includes: a chamber in which a heat treatment space for a substrate is arranged; a heating part provided in an upper portion of the chamber to heat the substrate; and a substrate support part provided in a portion of the chamber The substrate is placed inside; a blocking member is located between the blocking member and the substrate when the substrate is loaded into the chamber or the substrate inside the chamber is unloaded to the outside And block the heat transfer of the said heating part to the blocking position of the said board|substrate.

Description

Substrate processing apparatus and substrate processing method

The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a substrate processing apparatus and a substrate processing method capable of minimizing thermal deformation of the substrate by blocking the gap between the substrate and a heating portion inside the chamber when loading or unloading the substrate .

Generally, a reflow process, which is a subsequent process of semiconductors, is a process of supplying solder to be soldered to a semiconductor wafer or PCB, and heating the solder to electrically connect electronic parts or wirings. In order to perform the reflow process, it is necessary to perform a heat treatment of heating the solder and a heat treatment of cooling after heating, and such heat treatment apparatuses are manufactured in various structures according to manufacturers.

As a prior art related to the heat treatment apparatus as described above, there is Korean Granted Patent No. 10-1680071.

The above-mentioned Patent No. 10-1680071 discloses a heat treatment apparatus configured as follows: a heating part for heating a substrate accommodated in a chamber is provided on the upper side of the substrate support part, and a cooling part is provided on the lower side of the substrate support part A cooling part is placed on the bottom surface of the substrate of the substrate support part so that heating and cooling processes of the substrate can be performed in one chamber.

However, according to the heat treatment apparatus, during the transfer of the substrate in the process of performing the loading and unloading of the substrate, it is exposed to the heat radiated from the heating portion in a state where the cooling effect by the cooling portion is not obtained.

That is, when unloading a substrate after substrate processing, the substrate is brought out of the chamber away from the cooling unit, and when a new substrate is loaded into the chamber, the substrate is brought into the chamber and moved to a position close to the cooling unit. , the substrate may be unnecessarily heated and subject to thermal shock.

Especially recently, the use of heterojunction substrates (wafers) in semiconductor processing is increasing. When a heterogeneous crystal sheet is heated, thermal deformation such as a bending phenomenon caused by heat occurs, and there is a problem that the wafer is damaged.

The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate which can minimize thermal deformation of the substrate by blocking the gap between the substrate and a heating portion inside the chamber when loading and unloading the substrate. Approach.

In order to achieve the above object, a substrate processing apparatus of the present invention includes: a chamber in which a heat treatment space for a substrate is arranged; a heating part provided on the upper part of the chamber to heat the substrate; and a substrate support part, The substrate is installed inside the chamber, and a blocking member is positioned to block the heating portion when the substrate is loaded into the chamber or the substrate in the chamber is unloaded to the outside. The heat transfer of the heating portion is blocked from the substrate to the blocking position of the substrate.

In the case where the heat treatment of the substrate is performed, the blocking member may be located at a stand-by position away from between the heating portion and the substrate, wherein the substrate processing apparatus further includes: a blocking member driving portion in the The blocking member is moved between the blocking position and the standby position.

The substrate processing apparatus further includes a connecting member connecting between the blocking member and the blocking member driving portion, wherein the connecting member may be provided so as to penetrate the chamber, and the blocking member driving portion The connecting member is provided outside the chamber to move the connecting member so that the blocking member can move between the blocking position and the standby position.

The connecting members may be configured as a pair connected to one side and the other side of the blocking member, and the blocking member driving portions may be configured as a pair to move the pair of the connecting members.

A plurality of the blocking members are provided in a flat plate shape, and the plurality of blocking members are folded into a plurality of layers by connecting one end and the other end of the adjacent blocking members. Structural connection, wherein a plurality of the blocking members may be configured to be unfolded in the blocking position to be in a flat plate shape, and to be in the state of being folded into multiple layers in a standby position separated from between the heating unit and the substrate.

The blocking member may be in a state of being curled on a roller at a stand-by position away from the space between the heating portion and the substrate, and the blocking member may be curled on the roller when one side end of the blocking member is pulled. The component is deployed from the roller in the blocking position.

When loading the substrate, the blocking member may be in the blocking position before the substrate is brought into the interior of the chamber, and when unloading the substrate, the substrate is brought out of the chamber After that, the blocking member is located at a stand-by position separated from between the substrate and the heating unit.

A cooling part for cooling the substrate is provided inside the chamber, wherein, when the substrate is loaded, if the substrate reaches a cooling position adjacent to the cooling part, the blocking member may in the standby position, and when the substrate is unloaded, the blocking member may be in the blocking position before the substrate is separated from the cooling position.

The heating unit is an upper heater provided on an upper portion of the chamber, and the blocking member may be located at the blocking position in a state where at least a part of the substrate is located inside the chamber.

The blocking member may be configured to have a size larger than or equal to the size of the substrate when the blocking member is located at the blocking position.

The substrate processing method of the present invention includes the following steps: a) the blocking member stands by at a standby position separated from the heating portion for heating the substrate and the substrate support portion for placing the substrate; b) the blocking member is located in the blocking portion A blocking position between the heating portion and the substrate support portion; c) loading the substrate into the chamber or unloading the substrate inside the chamber to the outside.

According to the present invention, by providing the blocking member that blocks heat transfer between the heating portion and the substrate, the space between the substrate and the heating portion can be blocked by the blocking member when loading and unloading the substrate, so that it is possible to Thermal deformation of the substrate is minimized and damage to the substrate is prevented.

10: Robotic Arm

100: Substrate processing device

110-1, 110-2: Blocking parts

111-1, 111-2: connecting parts

112-1, 112-2: Blocking member drive part

120: Heating Department

130: shower head

140: Gas Supply Department

150: Substrate support part

160: Cooling Department

170: Lifting drive part

171: Lifting pin

172: Lifting support part

180: Door

190: Chamber

W: substrate

S: heat treatment space

FIG. 1 is a diagram showing a state in which a blocking member is located at a standby position in the substrate processing apparatus according to the first embodiment of the present invention.

FIG. 2 is a diagram showing a state in which the blocking member is moved to the blocking position in the state of FIG. 1 .

3 is a plan view showing a state in which a blocking member is located at a standby position in the substrate processing apparatus according to the first embodiment of the present invention.

FIG. 4 is a plan view showing a state in which the blocking member is moved to the blocking position in the state of FIG. 3 .

5 is an operation state diagram showing a state in which a substrate is loaded into the substrate processing apparatus according to the first embodiment of the present invention.

6 is an operational state diagram showing a state in which a substrate is set on a substrate support portion in the substrate processing apparatus according to the first embodiment of the present invention.

7 is an operation state diagram showing a state in which the substrate is moved to the cooling position and the blocking member is moved to the standby position in the substrate processing apparatus according to the first embodiment of the present invention.

8 is an operation state diagram showing a state in which the substrate is moved to the heating position and the heating process of the substrate is performed in the substrate processing apparatus according to the first embodiment of the present invention.

9 is a diagram showing a state in which the blocking member is located at the standby position in the substrate processing apparatus according to the second embodiment of the present invention.

10 is a diagram showing a state in which the blocking member is located at the blocking position in the substrate processing apparatus according to the second embodiment of the present invention.

The present invention will be described in detail below with reference to the accompanying drawings.

A first embodiment of the substrate processing apparatus according to the present invention will be described with reference to FIGS. 1 to 4 .

The substrate processing apparatus 100 according to the present invention includes: a chamber 190 in which a heat treatment space S for a substrate W is arranged; a heating section 120 provided at an upper portion of the chamber 190 to heat the substrate W; and a substrate support section 150 provided in The substrate W is placed inside the chamber 190; the blocking member 110-1 is in the case of loading the substrate W into the chamber 190 or unloading the substrate W inside the chamber 190 to the outside The lower part is located at a blocking position that blocks the heating part 120 and the substrate W to block the heat transfer of the heating part 120 to the substrate W.

A control unit for controlling each configuration of the substrate processing apparatus 100 is provided.

The substrate W may be a silicon wafer corresponding to a semiconductor substrate. However, the present invention is not limited thereto, and the substrate W may be a transparent substrate used as a flat panel display device. The size of the shape of the substrate W is not limited to the drawings, and may have various shapes and sizes such as circular and quadrangular plates.

A heat treatment space S for heat treatment of the substrate W is formed inside the chamber 190 .

The substrate processing apparatus may further include: a door 180 for opening and closing so that the robot arm 10 of the transfer robot can enter and exit the chamber 190 when loading or unloading the substrate W; a cooling unit 160 for cooling the substrate W; and a lift drive part 170 , lifts the substrate support part 150 .

The heating unit 120 may be an upper heater provided in an upper portion of the chamber 190 , and may be configured to supply heat to the upper surface of the substrate W through the heat treatment space S. The heating unit 120 may be configured in a lamp form that emits heating light, a plate form that incorporates a heater and radiates heat, or the like.

The cooling unit 160 is configured to cool the substrate W heated by the heating unit 120 to a temperature at which it can be unloaded. The substrate W supported by the substrate supporting portion 150 is provided. The cooling unit 160 may be configured to include a heat removal unit such as a cooling water path (not shown) through which cooling water flows, or the like.

The substrate support portion 150 may be configured in such a manner that the substrate W is placed on the upper surface thereof, and the substrate W may be adsorbed to the substrate support portion 150 by a vacuum applied to the upper surface, thereby maintaining the substrate support portion 150. The placement state of the substrate W and the fixed position. In addition to the aforementioned vacuum suction method, the position fixation of the substrate W may also be modified and implemented by an electrostatic suction method such as an electrostatic chuck or the like.

The elevating drive unit 170 may be configured to include an elevating pin 171 and an elevating support unit 172 that are independently elevated and driven by driving of a motor, an air cylinder, or the like.

The lift pins 171 may be configured to support the substrate W from the lower side, and be driven up and down to receive the substrate W from the robot arm 10 of the transfer robot and set it on the substrate support portion 150 or from the substrate support portion. 150 separates the substrate W and transfers it to the robot arm 10 of the transfer robot.

The lift support portion 172 may be configured to support the substrate support portion 150 from below, and to be driven up and down so that the substrate support portion 150 in a state where the substrate W is placed is brought close to the heating portion 120 or brought closer to the heating portion 120 . Or contact the cooling part 160 .

The position of the substrate support portion 150 in the state where the substrate W is placed near the heating portion 120 is referred to as the heating position where the substrate W is heated, and the position close to or in contact with the cooling portion 160 is referred to as the position where the substrate W is heated. The cooling position where the substrate W is cooled.

The lift pins 171 may be provided to vertically penetrate the substrate support portion 150 and the cooling portion 160 , and the lift support portion 172 may be provided to vertically penetrate the cooling portion 160 .

The substrates processed in the substrate processing apparatus are unloaded from the chamber 190 , and the preprocessed substrates to be processed in the chamber 190 are loaded into the chamber 190 .

The blocking member 110 - 1 is located at the blocking position when loading or unloading the substrates W, and is located at the standby position away from the blocking position when the substrates W are processed.

A blocking member driving portion 112-1 that moves the blocking member 110-1 between the blocking position and the standby position and a blocking member driving portion 112 that connects the blocking member 110-1 and the blocking member driving portion 112 may also be provided. -1 between the connecting parts 111-1.

The blocking member 110-1 may be configured in a flat plate shape and provided in plural. The plurality of blocking members 110-1 may be configured such that one end (upper end in the figure) and the other end (lower in the figure) of the adjacent blocking members 110-1 end) connection and folded into a multi-layer structural connection.

FIG. 1 shows a state in which the blocking member 110-1 is located at a standby position. In this case, the blocking member 110 - 1 is separated from between the heating part 120 and the substrate supporting part 150 .

FIG. 2 shows a state in which the blocking member 110-1 is located at the blocking position. When the blocking member driving part 112-1 is driven to pull the connecting member 111-1 in the state shown in FIG. 1, the plurality of blocking members 110-1 are unfolded, and the blocking member 110-1 blocks heating between the heating part 120 and the substrate supporting part 150, so that the heat generated from the heating part 120 is blocked from being transferred to the substrate W placed on the substrate supporting part 150 by the blocking member 110-1.

In the state of FIG. 2, if the blocking member driving portion 112-1 is driven to push the connecting member 111-1 in the direction in which the blocking members 110-1 are arranged, the plurality of blocking members 110-1 will be folded It is located at the standby position by being separated from between the heating part 120 and the substrate W placed on the substrate support part 150 for the multi-layer.

The connecting part 111 - 1 may be provided to penetrate the chamber 190 , and the blocking part driving part 112 - 1 may be provided outside the chamber 190 . If the blocking member driving part 112 - 1 is provided outside the chamber 190 , the generation of particles inside the chamber 190 can be minimized. The connecting member 111 - 1 can move so as to be located inside the chamber 190 or at least partially located outside the chamber 190 by being driven by the blocking member driving part 112 - 1 .

The blocking member 110 - 1 may be constructed of a material with high heat resistance, chemical resistance and corrosion resistance to withstand the high temperature environment inside the chamber 190 and not be related to the process fluid supplied to the chamber 190 As a result of the reaction, deterioration or corrosion occurs, which affects the substrate processing process. As an example, silicon or stainless steel (SUS) can be used.

Also, the blocking member 110-1 may be equipped to have a horizontal area not smaller than or the same as the substrate W to more effectively block the heat between the heating portion 120 and the substrate The transfer, preferably, can be equipped with a larger horizontal area than the substrate W.

3 and 4 , when viewed in plan view, the connecting member 111-1 may be composed of a pair connected to one side and the other side of the blocking member 110-1, the blocking member driving portion 112-1 may be configured as a pair so that a pair of the connecting members 111-1 can be moved.

The substrate processing method according to the present invention will be described with reference to FIGS. 5 to 8 .

As shown in FIG. 1 , before the substrate W is brought into the chamber 190 , the blocking member 110 - 1 waits at the standby position.

Thereafter, as shown in FIG. 2 , a step of positioning the blocking member 110 - 1 at a blocking position blocking the heating portion 120 and the substrate supporting portion 150 is performed.

For the blocking member 110-1, as the connecting member 111-1 is driven by the blocking member driving part 112-1, the folded blocking members 110-1 are moved by the blocking member 110-1. Expanded into blocking position.

The blocking member 110 - 1 is located at the blocking position by preceding the substrate W, and thus can effectively block the heat transfer between the substrate W and the heating portion 120 during the execution of the substrate processing described later. .

Thereafter, as shown in FIG. 5 , a step of loading the substrate W into the inside of the chamber 190 is performed. The door 180 is opened, and the substrate W is brought into the chamber 190 by the robot arm 10 of the transfer robot. At this time, the lift pins 171 are driven upward in a state of protruding from the upper surface of the substrate support portion 150 to support the lower end of the substrate W supported by the robot arm 10 of the transfer robot, so that the substrate W is The substrate is received by the upper end of the lift pin 171, and at this time, the substrate supporting part 150 may be in a position to pass the A state in which the lift support portion 172 is moved upward by a predetermined distance from the cooling portion 160 upward. After receiving the substrate W, the robotic arm 10 of the transfer robot may be pulled out of the chamber 190, and the door 180 is closed.

After that, as shown in FIG. 6 , a step of setting the substrate W to the substrate support portion 150 is performed. The lift pins 171 are driven downward to place the substrate W on the upper surface of the substrate support portion 150 , and a vacuum is applied to the upper surface of the substrate support portion 150 to attract the substrate W.

Thereafter, as shown in FIG. 7 , the lift pins 171 may further descend after the substrate W is placed on the substrate support portion 150 so that the upper ends thereof are located inside the cooling portion 160 . The elevating support portion 172 is driven downward to lower the substrate support portion 150 to be positioned at the cooling position, so that the cooling effect of the cooling portion 160 is applied to the substrate W. As shown in FIG.

When the substrate W and the substrate support portion 150 are located at the cooling position, the blocking member driving portion 112-1 is driven to move the blocking member 110-1 to the standby position.

In this way, the blocking member 110 - 1 is configured to block the upper side in the vertical direction of the substrate W while the substrate W is brought into the chamber 190 and reaches the cooling position, so that the substrate W can be blocked in the vertical direction. W is blocked from being heated by the heating unit 120 in a state where the cooling effect by the cooling unit 160 is not applied, and the substrate W can be prevented from being damaged such as thermal deformation.

Thereafter, as shown in FIG. 8 , a step of heat-treating the substrate W is performed.

The elevating support portion 172 is driven to raise the substrate support portion 150 to be positioned at the heating position, thereby applying the heating effect of the heating portion 120 to the substrate W. As shown in FIG.

At this time, the process gas flows in through the gas supply part 140 at the upper end of the chamber 190 to be heated by the heating part 120 , and is sprayed into the heat treatment space S through the shower head 130 , so that the heating of the substrate W is performed. Processing process, for example, reflow process.

The step of cooling the processed substrate W may then be performed. In order to cool the substrate W, the elevating support portion 172 is driven downward to move the substrate support portion 150 down to the cooling position, so that the cooling effect of the cooling portion 160 is applied to the substrate W, The substrate W heated by the heat treatment process is cooled accordingly.

After that, the step of moving the blocking member 110-1 to the blocking position is performed.

If the blocking member driving part 112 - 1 is driven, the blocking member 110 - 1 will move to the blocking position to block the space between the substrate W and the heating part 120 .

When the substrate W is located at the cooling position, the blocking member 110 - 1 is located at the blocking position. Therefore, until the substrate W is unloaded, it is possible to more effectively block the connection between the substrate W and the heating unit 120 . heat transfer.

Then, a step of separating the substrate support 150 from the cooling position is performed. The elevating support portion 172 is driven upward to lift the substrate support portion 150 to separate it from the cooling position. Accordingly, after this step, the cooling effect by the cooling portion 160 will not be applied to the substrate W.

Then, the step of unloading the substrate W is performed. The robot arm 10 of the transfer robot is brought into the chamber 190 to receive and support the substrate W from the lift pins 171 . At this time, the vacuum applied to the upper surface of the substrate support portion 150 is released, and the lift pins 171 are driven upward so as to protrude from the upper surface of the substrate support portion 150 to move the substrate support portion 150 and the substrate support portion 150 upward. The substrate W is spaced up and down, and the robot arm 10 of the transfer robot moves between the substrate W and the substrate support portion 150 to support the lower end of the substrate W, thereby receiving the substrate W.

After the robot arm 10 of the transfer robot receives the substrate W, the substrate W is transferred to be taken out of the chamber 190 .

In this way, the blocking member 110 - 1 is configured to block the vertical upper side of the substrate W while the substrate W is separated from the cooling position and completely taken out of the chamber 190 , thereby blocking the passage of the substrate W through the heating portion 120 . When heated, the substrate W can be prevented from being damaged by thermal deformation or the like.

Then, the blocking member driving unit 112-1 drives and moves the blocking member 110-1 to the standby position.

A blocking member according to a second embodiment of the present invention will be described with reference to FIGS. 9 and 10 .

The blocking member 110 - 2 according to the second embodiment is configured to be in a state of being curled on the roller at the standby position, and if one side end of the blocking member 110 - 2 curled on the roller is pulled, it will be removed from the roller. The shaft is unfolded into the blocking position.

A connecting member 111-2 is connected to one end of the blocking member 110-2, and a blocking member driving portion 112-2 is provided on the other side of the connecting member 111-2.

When the blocking member driving part 112-2 is driven, the connecting member 111-2 moves to the blocking member driving part 112-2 side or to the roller side where the blocking member 110-2 is curled.

Referring to Fig. 9 , the blocking member 110-2 is in a state of being curled on the outer peripheral surface of the roller at the standby position. In this state, the blocking member 110 - 2 does not block the space between the heating portion 120 and the substrate W or the substrate supporting portion 150 .

Referring to FIG. 10 , in the state of FIG. 9 , the blocking member driving unit 112 - 2 is driven so that the blocking member 110 - 2 is located at the blocking position. When the blocking member driving part 112-2 is driven, the connecting member 111-2 is pulled, and the blocking member 110-2 connected to the connecting member 111-2 is unfolded from the roller and moved to the blocking position. in this state Next, the blocking member 110 - 2 blocks the space between the heating portion 120 and the substrate W or the substrate supporting portion 150 , thereby performing blocking such that the heat of the heating portion 120 cannot be transferred to the substrate W.

In the case of the second embodiment, as shown in FIGS. 3 and 4 , the connecting members 111-1 may be provided as a pair, and the blocking member driving portions 112-2 may be provided as a pair.

In addition, the connecting member 111-2 may be provided to penetrate through the chamber 190, and the blocking member 110-2 may have a flat plate shape when it reaches the blocking position.

In addition, when the blocking member 110-2 is located at the blocking position, the blocking member 110-2 may be configured to be larger than or equal to the size of the substrate.

Also, when the substrate W is loaded, the blocking member 110 - 2 may be located at the blocking position before the substrate W is brought into the chamber 190 , and when the substrate W is unloaded, The blocking member 110 - 2 may be located at a standby position between the substrate W and the heating part 120 after the substrate W is taken out of the chamber 190 .

In addition, the blocking member 110-2 may be configured to be located at the standby position when the substrate W reaches a cooling position adjacent to the cooling unit 160 when the substrate W is loaded When the W is unloaded, the blocking position is located before the substrate W is separated from the cooling position.

According to the above-described configuration, by providing the blocking members 110-1 and 110-2 for blocking the heat transfer between the heating portion 120 and the substrate W, the blocking members can pass when the substrate W is loaded or unloaded. 110-1 and 110-2 block the space between the substrate W and the heating part 120, thereby minimizing thermal deformation of the substrate W and preventing damage to the substrate.

Although the present invention has been described in detail by taking the preferred embodiment as an example as shown above, the present invention is not limited to the foregoing embodiment, and various modifications are possible within the scope of the claims and the scope of the detailed description of the invention and the accompanying drawings. Modifications are implemented, and these modifications also belong to the present invention.

10: Robotic Arm

100: Substrate processing device

110-1: Blocking parts

111-1: Connecting parts

112-1: Blocking part drive

120: Heating Department

130: shower head

140: Gas Supply Department

150: Substrate support part

160: Cooling Department

170: Lifting drive part

171: Lifting pin

172: Lifting support part

180: Door

190: Chamber

S: heat treatment space

Claims (11)

A substrate processing apparatus comprising: a chamber in which a heat treatment space for a substrate is arranged; a heating portion provided in an upper portion of the chamber to heat a substrate; a substrate support portion provided in the interior of the chamber to accommodate the substrate; and A plurality of blocking members are located between the heating portion and the substrate to block heat of the heating portion when the substrate is loaded into the chamber or the substrate inside the chamber is unloaded to the outside The blocking position transmitted to the substrate is located at a standby position separated from between the heating unit and the substrate when heat treatment of the substrate is performed; the blocking member driving unit is moved between the blocking position and the standby position the blocking member; a connecting member that connects between the blocking member and the blocking member driving portion on the same horizontal plane as the vertical upper end portion of the blocking member; the plurality of blocking members are connected to each other and are horizontal It can be folded into a plurality of layers in the direction, and when it is folded into a plurality of layers, the connection parts between the adjacent blocking members are repeatedly located at the upper end portion and the lower side end portion in the vertical direction of the blocking member ; The blocking member is configured to be unfolded on the same horizontal plane as the upper end portion to be in a flat plate shape, and to be in a state of being folded into multiple layers at the standby position away from the heating portion and the substrate. The substrate processing apparatus of claim 1, wherein the connecting member is provided to penetrate the chamber, and the blocking member driving portion is provided outside the chamber so that the blocking member can communicate with the blocking member at the blocking position. Move the connecting member in a manner that moves between standby positions. The substrate processing apparatus according to claim 2, wherein the connecting member is configured as a pair connected to one side and the other side of the blocking member, and the blocking member driving portion is configured as a pair to move a pair of the connections part. The substrate processing apparatus of claim 1, wherein when the substrate is loaded, the blocking member is located at the blocking position before the substrate is brought into the chamber, and when the substrate is unloaded, the substrate is brought After exiting the chamber, the blocking member is located at the standby position between the substrate and the heating portion. The substrate processing apparatus according to claim 1, wherein a cooling portion for cooling the substrate is provided inside the chamber, and when the substrate is loaded, if the substrate reaches a cooling position adjacent to the cooling portion, the blocking member is in the standby position, and when the substrate is unloaded, the blocking member is in the blocking position before the substrate is separated from the cooling position. The substrate processing apparatus according to claim 1, wherein the heating unit is an upper heater provided on an upper portion of the chamber, and the blocking member is located in the blocking member in a state where at least a part of the substrate is located inside the chamber. break position. The substrate processing apparatus according to claim 1, wherein the blocking member is configured to have a size greater than or equal to the substrate when the blocking member is located at the blocking position. A substrate processing method, comprising the steps of: A) a plurality of blocking members stand by from a stand-by position between a heating portion for heating a substrate and a substrate support portion on which the substrate is placed; B) the blocking members are positioned to block the heating and C) loading the substrate inside the chamber or unloading the substrate inside the chamber to the outside; In the step A), the plurality of blocking members are connected to each other and can be folded into a plurality of layers in the horizontal direction, and in the case of folding into a plurality of layers, the connecting portions between the adjacent blocking members are repeatedly The upper end portion and the lower end portion in the vertical direction of the blocking member; in the B) step, the blocking member is configured to be deployed on the same horizontal plane as the upper end portion in the blocking position A flat plate shape; a blocking member driving portion that moves the blocking member between the blocking position and the standby position is connected to the blocking member through a connecting member on the same horizontal plane as the upper end portion. The substrate processing method according to claim 8, wherein the standby position where the blocking member stands by is inside the chamber. The substrate processing method of claim 8, wherein when the substrate is loaded, the blocking member is located at the blocking position before the substrate is brought into the chamber, and when the substrate is unloaded, the substrate is removed from the chamber. The blocking member is in the standby position after being brought out of the chamber. The substrate processing method according to claim 10, wherein a cooling portion for cooling the substrate is provided inside the chamber, and when the substrate is loaded, if the substrate reaches a cooling position adjacent to the cooling portion for cooling the substrate, Then the blocking member is located in the standby position, and when the substrate is unloaded, the blocking member is located in the blocking position before the substrate is separated from the cooling position.

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