TW202126162A - Substrate treating apparatus and substrate treating method - Google Patents

Abstract

A purpose of the invention is to provide a substrate treating apparatus and a substrate treating method that can block the substrate from the heating portion inside the chamber during loading and unloading the substrate in order to minimize degree of thermal deformation. In order to implement the substrate treating apparatus, the invention comprises: a chamber having a heat treatment space inside for substrates; a heating portion arranged on the upper part of the chamber for heating substrates; a substrate supporting portion arranged in the chamber for placing substrates; and a blocking member located on a blocking position where it can separate the heating portion from the substrate for blocking the heat of the heating portion transfer to substrates during loading the substrate into the interior of the chamber or unloading substrates inside the chamber to the outside.

Description

Substrate processing device and substrate processing method

The present invention relates to a substrate processing apparatus and a substrate processing method. In more detail, it relates to a substrate processing apparatus and a substrate processing method that can block a substrate and a heating section inside a chamber when loading or unloading a substrate, thereby minimizing thermal deformation of the substrate .

Generally, a reflow process, which is a subsequent process of semiconductors, is a process of supplying solder to be soldered to a semiconductor chip or PCB and heating the solder to electrically connect electronic components or wiring. In order to perform the reflow process, it is necessary to perform heat treatment of heating solder and heat treatment of cooling after heating, and such heat treatment apparatuses are manufactured in various structures according to manufacturers.

As a prior art related to the heat treatment apparatus as described above, there is Korean Granted Patent No. 10-1680071.

The said granted patent No. 10-1680071 discloses a heat treatment device configured as follows: a heating part for heating the substrate contained in the chamber is provided on the upper side of the substrate support part, and a cooling device is provided on the lower side of the substrate support part The cooling part is arranged on the bottom surface of the substrate of the substrate supporting part, so that the heating and cooling processing of the substrate can be performed in one chamber.

However, according to the heat treatment apparatus, during the transfer of the substrate during the loading and unloading of the substrate, the cooling effect by the cooling part is exposed to the heat radiated from the heating part in a state where the cooling effect is not obtained.

That is, when the substrate after substrate processing is unloaded, the substrate is moved away from the cooling part and taken out of the chamber, and when a new substrate is loaded into the chamber, the substrate is taken into the chamber and moved to a position close to the cooling part. , The substrate may be unnecessarily heated and suffer thermal shock.

Especially recently, the use of heterojunction substrates (wafers) in semiconductor processes is increasing. When a heterogeneous crystal sheet is heated, thermal deformation such as a bending phenomenon caused by heat occurs, and there is a problem of damage to the wafer.

The present invention is proposed to solve the above-mentioned problems, and its object is to provide a substrate processing apparatus and a substrate that can block the substrate and the heating part inside the chamber during loading and unloading of the substrate, thereby minimizing the thermal deformation of the substrate. Approach.

In order to achieve the above-mentioned object, a substrate processing apparatus of the present invention includes: a chamber in which a heat treatment space for a substrate is arranged; a heating part arranged on the upper part of the chamber to heat the substrate; and a substrate supporting part, The substrate is arranged inside the chamber; a blocking member is located to block the heating part when the substrate is loaded into the chamber or the substrate in the chamber is unloaded to the outside Between the substrate and the substrate to block the heat transfer of the heating part to the blocking position of the substrate.

In the case of performing the heat treatment of the substrate, the blocking member may be located at a standby position away from the heating section and the substrate, wherein the substrate processing apparatus further includes: a blocking member driving section, The blocking member is moved between the blocking position and the standby position.

The substrate processing apparatus further includes: a connecting member that connects the blocking member and the blocking member driving portion, wherein the connecting member may be provided to penetrate the chamber, and the blocking member driving portion The connecting member is provided outside the chamber to move the connecting member in such a way that the blocking member can move between the blocking position and the standby position.

The connecting member may be configured as a pair connected to one side and the other side of the blocking member, and the blocking member driving section may be configured as a pair to move the pair of connecting members.

The blocking member is configured in the shape of a flat plate and is provided with a plurality of blocking members, wherein the plurality of blocking members are connected by connecting one end portion and the other side end portion of the adjacent blocking member to be folded into a plurality of layers. The structure is connected, wherein the plurality of blocking members may be configured to be expanded at the blocking position to be in the shape of a flat plate, and to be in the state of being folded into multiple layers at a standby position away from the heating part and the substrate.

The blocking member may be curled on the roller at the standby position between the heating part and the substrate, and the blocking member may be curled on the side end of the blocking member of the roller when pulled. The component is unfolded from the roller and located at the blocking position.

When the substrate is loaded, the blocking member may be located at the blocking position before the substrate is brought into the interior of the chamber, and when the substrate is unloaded, the substrate may be taken out of the chamber. After that, the blocking member is located at a standby position away from the substrate and the heating part.

A cooling part for cooling the substrate is provided inside the chamber, wherein, when the substrate is loaded, if the substrate reaches a cooling position adjacent to the cooling part, the blocking member may be located in the In the standby position, when the substrate is unloaded, the blocking member may be located at the blocking position before the substrate is separated from the cooling position.

The heating part is an upper heater provided in the upper part of the chamber, and the blocking member may be located at the blocking position in a state where at least a part of the substrate is located inside the chamber.

The blocking member may be configured to have a size greater than or equal to the substrate when the blocking member is located at the blocking position.

The substrate processing method of the present invention includes the following steps: a) the blocking member stands by at a stand-by position between the heating part for heating the substrate and the substrate placement part where the substrate is placed; b) the blocking member is positioned to block the The blocking position between the heating part and the substrate placement part; c) loading the substrate inside the chamber or unloading the substrate inside the chamber to the outside.

According to the present invention, by providing a blocking member that blocks the heat transfer between the heating part and the substrate, the blocking member can block the substrate and the heating part when the substrate is loaded and unloaded. Minimize the thermal deformation of the substrate and prevent damage to the substrate.

Hereinafter, the present invention will be described in detail with reference to the drawings.

The first embodiment of the substrate processing apparatus according to the present invention will be described with reference to FIGS. 1 to 4.

The substrate processing apparatus 100 according to the present invention includes: a chamber 190, a heat treatment space S in which a substrate W is arranged; a heating part 120, which is provided in the upper part of the chamber 190 to heat the substrate W; a substrate support part 150, which is provided in The substrate W is placed inside the chamber 190; the blocking member 110-1 is used when loading the substrate W inside the chamber 190 or unloading the substrate W inside the chamber 190 to the outside Below, it is located at a blocking position that blocks the heating portion 120 and the substrate W and blocks the heat transfer of the heating portion 120 to the substrate W.

A control unit for controlling each configuration of the substrate processing apparatus 100 is provided.

The substrate W may be a silicon wafer corresponding to a semiconductor substrate. However, the present invention is not limited to this, and the substrate W may be a transparent substrate used as a flat panel display device. The size of the shape of the substrate W is not limited to the drawings, and may have various shapes and sizes such as circular and quadrangular plates.

A heat treatment space S for heat treatment of the substrate W is formed in the chamber 190.

The substrate processing apparatus may further include: a door 180 that opens and closes in such a manner that the robot arm 10 of the transfer robot can enter and exit the chamber 190 when loading or unloading the substrate W; a cooling part 160 to cool the substrate W; and a lifting drive The portion 170 lifts and lowers the substrate support portion 150.

The heating part 120 may be an upper heater provided in the upper part of the inside of the chamber 190, and may be configured to supply heat to the upper surface of the substrate W through the heat treatment space S. The heating unit 120 may be configured in a lamp shape that irradiates heating light, a plate shape that has a built-in heater and radiates heat, or the like.

The cooling unit 160 is configured to cool the substrate W heated by the heating unit 120 to a temperature at which it can be unloaded. The substrate W supported by the substrate supporting portion 150. The cooling part 160 may be configured in a form in which a heat removal unit such as a cooling water path (not shown) through which cooling water flows, etc. is provided.

The substrate support portion 150 may be configured in a form in which the substrate W is placed on its upper surface, and the substrate W may be adsorbed to the substrate support portion 150 by vacuum applied to the upper surface, thereby maintaining the The placement state of the substrate W and the fixed position. In addition to the aforementioned vacuum suction method, the position fixation of the substrate W can also be deformed and implemented by an electrostatic suction method such as an electrostatic chuck.

The lifting driving part 170 may be configured to include a lifting pin 171 and a lifting support part 172 that are independently driven up and down by driving of a motor, an air cylinder, or the like.

The lifting pin 171 may be configured to support the substrate W from the lower side, and drive to receive the substrate W from the robot arm 10 of the transfer robot and place it on the substrate support portion 150 or from the substrate support portion. 150 separates the substrate W and transfers it to the robot arm 10 of the transfer robot.

The lifting support portion 172 may be configured to support the substrate support portion 150 from the lower side, and be driven up and down to bring the substrate support portion 150 in the state where the substrate W is placed close to or close to the heating portion 120 Or contact the cooling part 160.

The position of the substrate support part 150 in the state where the substrate W is placed close to the heating part 120 is referred to as the heating position where the substrate W is heated, and the position close to or in contact with the cooling part 160 is referred to as the heating position where the substrate W is heated. The cooling position where the substrate W is cooled.

The lifting pin 171 may be configured to penetrate the substrate support portion 150 and the cooling portion 160 up and down, and the lifting support portion 172 may be configured to penetrate the cooling portion 160 up and down.

The substrate processed in the substrate processing apparatus is unloaded from the chamber 190, and the preprocessed substrate to be processed in the chamber 190 is loaded into the chamber 190.

The blocking member 110-1 is located at the blocking position when the substrate W is loaded or unloaded, and is located at the standby position away from the blocking position when the substrate W is processed.

It may also be equipped with a blocking member driving part 112-1 that moves the blocking member 110-1 between the blocking position and the standby position, and a blocking member driving part 112 that connects the blocking member 110-1 and the blocking member 110-1. -1 between the connecting part 111-1.

The blocking member 110-1 may be configured in a flat plate shape and provided with a plurality of pieces. The plurality of blocking members 110-1 may be configured such that one end portion (upper end in the figure) and the other end portion (lower side in the figure) of the adjacent blocking member 110-1 are pressed. The end) is connected and folded into a multi-layer structure connection.

Fig. 1 shows a state where the blocking member 110-1 is in a standby position. In this case, the blocking member 110-1 is separated from between the heating part 120 and the substrate supporting part 150.

FIG. 2 shows a state where the blocking member 110-1 is located at the blocking position. If the blocking member driving portion 112-1 is driven to pull the connecting member 111-1 in the state of FIG. 1, the plurality of blocking members 110-1 are unfolded, and the blocking member 110-1 blocks heating Between the portion 120 and the substrate support portion 150, the heat generated from the heating portion 120 is blocked from being transferred to the substrate W placed on the substrate support portion 150 by the blocking member 110-1.

In the state of FIG. 2, if the blocking member driving portion 112-1 is driven to push the connecting member 111-1 in the direction in which the blocking member 110-1 is arranged, the plurality of blocking members 110-1 will be folded For multiple layers, it is separated from the heating part 120 and the substrate W placed on the substrate supporting part 150 so as to be located at the standby position.

The connecting member 111-1 may be provided to penetrate the cavity 190, and the blocking member driving portion 112-1 may be provided outside the cavity 190. If the blocking member driving part 112-1 is provided outside the chamber 190, the generation of particles inside the chamber 190 may be minimized. The connecting member 111-1 is driven by the blocking member driving portion 112-1 to move in a manner of being located inside the chamber 190 or at least a part of being located outside the chamber 190.

The blocking member 110-1 may be made of a material with high heat resistance, chemical resistance, and corrosion resistance, so as to withstand the high temperature environment inside the chamber 190 and the process fluid that is not supplied to the chamber 190. It may deteriorate or corrode due to the reaction, thereby affecting the substrate processing process. As an example, silicon or stainless steel (SUS) can be used.

In addition, the blocking member 110-1 may be equipped to have a horizontal area that is not smaller than or the same as the substrate W to more effectively block the heat between the heating part 120 and the substrate. The transfer, preferably, can be equipped to have a larger horizontal area than the substrate W.

3 and 4, when viewed in a plan view, the connecting member 111-1 may be composed of a pair connected to one side and the other side of the blocking member 110-1, and the blocking member driving portion 112-1 may be configured as a pair such that a pair of the connecting members 111-1 can be moved.

The substrate processing method according to the present invention will be described with reference to FIGS. 5 to 8.

As shown in FIG. 1, before the substrate W is brought into the chamber 190, the blocking member 110-1 stands by at the standby position.

Thereafter, as shown in FIG. 2, a step of positioning the blocking member 110-1 at a blocking position blocking the heating portion 120 and the substrate supporting portion 150 is performed.

For the blocking member 110-1, as the connecting member 111-1 is driven by the blocking member driving portion 112-1 to move, the plurality of folded blocking members 110-1 will be Expanded and located in the blocking position.

The blocking member 110-1 is positioned at the blocking position before the substrate W, and therefore can effectively block the heat transfer between the substrate W and the heating part 120 during the execution of the substrate processing described later. .

Thereafter, as shown in FIG. 5, a step of loading the substrate W into the inside of the chamber 190 is performed. The door 180 is opened, and the substrate W is brought into the chamber 190 by the robot arm 10 of the transfer robot. At this time, the lifting pin 171 is driven upwardly in a state protruding from the upper surface of the substrate supporting portion 150 to support the lower end of the substrate W supported by the robot arm 10 of the transfer robot, so that the substrate W The substrate is received at the upper end of the lifting pin 171. At this time, the substrate supporting portion 150 may be in a state of being spaced upward by a predetermined distance from the cooling portion 160 by the lifting drive of the lifting supporting portion 172 . After receiving the substrate W, the robot arm 10 of the transfer robot may be pulled out of the chamber 190, and the door 180 is closed.

After that, as shown in FIG. 6, a step of setting the substrate W to the substrate supporting portion 150 is performed. The lifting pins 171 are driven to descend to place the substrate W on the upper surface of the substrate supporting portion 150, and the upper surface of the substrate supporting portion 150 is vacuum applied to adsorb the substrate W.

Thereafter, as shown in FIG. 7, the lifting pin 171 may be further lowered after the substrate W is placed on the substrate supporting portion 150 so that its upper end is located inside the cooling portion 160. The lifting support portion 172 is driven to lower the substrate support portion 150 to be located at the cooling position, so that the cooling effect of the cooling portion 160 is applied to the substrate W.

If the substrate W and the substrate supporting portion 150 are located at the cooling position, the blocking member driving portion 112-1 drives to move the blocking member 110-1 to the standby position.

In this way, the blocking member 110-1 is configured to block the upper side of the substrate W in the vertical direction while the substrate W is brought into the chamber 190 and reaches the cooling position, so that the substrate In a state where the cooling effect of the cooling unit 160 is not applied, the W is blocked from being heated by the heating unit 120, and the substrate W can be prevented from being damaged by thermal deformation or the like.

Thereafter, as shown in FIG. 8, a step of heat-treating the substrate W is performed.

The lifting support portion 172 raises the substrate support portion 150 by a lifting drive to be located at the heating position, so that the heating effect of the heating portion 120 is applied to the substrate W.

At this time, the process gas flows in through the gas supply part 140 at the upper end of the chamber 190 and is heated by the heating part 120, and is sprayed into the heat treatment space S through the shower head 130, thereby performing heating of the substrate W Treatment process, for example, reflow process.

Then, a step of cooling the processed substrate W may be performed. In order to cool and process the substrate W, the lifting support portion 172 is driven down to lower the substrate support portion 150 to be located at the cooling position, thereby applying the cooling effect of the cooling portion 160 to the substrate W, Accordingly, the substrate W heated by the heat treatment process is cooled.

After that, the step of moving the blocking member 110-1 to the blocking position is performed.

If the blocking member driving unit 112-1 is driven, the blocking member 110-1 will move to the blocking position to block the substrate W and the heating unit 120.

In the state where the substrate W is at the cooling position, the blocking member 110-1 is at the blocking position. Therefore, until the substrate W is unloaded, it is possible to more effectively block the gap between the substrate W and the heating part 120. heat transfer.

Then, a step of separating the substrate support 150 from the cooling position is performed. The lifting support portion 172 is driven up to raise the substrate support portion 150 to separate it from the cooling position. Accordingly, after this step, the cooling effect through the cooling portion 160 will not be applied to The substrate W.

Then, the step of unloading the substrate W is performed. The robot arm 10 of the transfer robot is brought into the chamber 190, and receives and supports the substrate W from the lifting pin 171. At this time, the vacuum applied to the upper surface of the substrate support portion 150 is released, and the lift pins 171 are lifted and driven to protrude from the upper surface of the substrate support portion 150 to drive the substrate support portion 150 and The substrate W is spaced up and down, and the robot arm 10 of the transfer robot moves between the substrate W and the substrate supporting portion 150 to support the lower end of the substrate W, thereby receiving the substrate W.

After the robot arm 10 of the transfer robot receives the substrate W, the substrate W is transferred and taken out of the chamber 190.

In this way, the blocking member 110-1 is configured to block the upper side of the substrate W in the vertical direction while the substrate W is separated from the cooling position and completely taken out of the cavity 190, so that the passage of the heating portion 120 can be blocked. In the case of being heated, it is possible to prevent damages such as thermal deformation of the substrate W from occurring.

Then, the blocking member driving unit 112-1 drives to move the blocking member 110-1 to the standby position.

The blocking member according to the second embodiment of the present invention will be described with reference to FIGS. 9 and 10.

The blocking member 110-2 according to the second embodiment is configured to be curled on the roller in the standby position, and if one end of the blocking member 110-2 curled on the roller is pulled, it will roll off. The shaft is unfolded and located at the blocking position.

A connecting member 111-2 is connected to one end of the blocking member 110-2, and a blocking member driving portion 112-2 is provided on the other side of the connecting member 111-2.

If the blocking member driving portion 112-2 is driven, the connecting member 111-2 moves to the blocking member driving portion 112-2 side or to the roller side on which the blocking member 110-2 is curled.

9, the blocking member 110-2 is in a state of being curled on the outer peripheral surface of the roller in the standby position. In this state, the blocking member 110-2 does not block the space between the heating part 120 and the substrate W or the substrate supporting part 150.

10, in the state of FIG. 9, the blocking member driving section 112-2 is driven to position the blocking member 110-2 at the blocking position. Driving the blocking member driving portion 112-2 pulls the connecting member 111-2, and the blocking member 110-2 connected to the connecting member 111-2 unfolds from the roller and moves to the blocking position. In this state, the blocking member 110-2 blocks the heating portion 120 and the substrate W or the substrate supporting portion 150, thereby performing blocking in such a manner that the heat of the heating portion 120 cannot be transferred to the substrate W.

In the case of the second embodiment, as shown in FIGS. 3 and 4, the connecting member 111-1 may be equipped as a pair, and the blocking member driving portion 112-2 may be equipped as a pair.

In addition, the connecting member 111-2 may be equipped to penetrate the cavity 190, and the blocking member 110-2 may become a flat plate shape when it reaches the blocking position.

In addition, when the blocking member 110-2 is located at the blocking position, the blocking member 110-2 may be configured to be larger than or equal to the size of the substrate.

Moreover, when the substrate W is loaded, the blocking member 110-2 may be located at the blocking position before the substrate W is brought into the chamber 190, and when the substrate W is unloaded, After the substrate W is taken out of the chamber 190, the blocking member 110-2 may be located at a standby position away from the substrate W and the heating part 120.

In addition, the blocking member 110-2 may be configured such that if the substrate W reaches a cooling position adjacent to the cooling unit 160 when the substrate W is loaded, it is located at the standby position, and the substrate W When the W is unloaded, the substrate W is located at the blocking position before the substrate W is separated from the cooling position.

According to the above-mentioned configuration, by providing blocking members 110-1, 110-2 that block the heat transfer between the heating portion 120 and the substrate W, the blocking members 110-1 and 110-2 can be passed through when the substrate W is loaded or unloaded. 110-1 and 110-2 block the substrate W from the heating part 120, thereby minimizing thermal deformation of the substrate W and preventing damage to the substrate.

Although the present invention has been described in detail by taking the preferred embodiment as an example as shown above, the present invention is not limited to the foregoing embodiment, and can be variously described within the scope of the claims, the detailed description of the invention, and the scope of the drawings. Modifications are implemented, and these modifications also belong to the present invention.

10: Robotic arm 100: Substrate processing device 110-1, 110-2: blocking parts 111-1, 111-2: connecting parts 112-1, 112-2: Blocking component drive part 120: heating section 130: shower nozzle 140: Gas Supply Department 150: substrate support 160: Cooling part 170: Lifting drive 171: Lift pin 172: Lifting support part 180: door 190: Chamber W: substrate S: Heat treatment space

Fig. 1 is a diagram showing a state in which a blocking member is located at a standby position in a substrate processing apparatus according to a first embodiment of the present invention. Fig. 2 is a diagram showing a state where the blocking member is moved to a blocking position in the state of Fig. 1. 3 is a plan view showing a state in which the blocking member is located at a standby position in the substrate processing apparatus according to the first embodiment of the present invention. Fig. 4 is a plan view showing a state where the blocking member is moved to the blocking position in the state of Fig. 3. FIG. 5 is an operation state diagram showing a state in which a substrate is loaded to the substrate processing apparatus according to the first embodiment of the present invention. 6 is an operation state diagram showing a state in which a substrate is placed on a substrate supporting part in the substrate processing apparatus according to the first embodiment of the present invention. 7 is an operation state diagram showing a state in which the substrate is moved to the cooling position and the blocking member is moved to the standby position in the substrate processing apparatus according to the first embodiment of the present invention. FIG. 8 is an operation state diagram showing a state in which the substrate is moved to a heating position and the heating process of the substrate is performed in the substrate processing apparatus according to the first embodiment of the present invention. FIG. 9 is a diagram showing a state in which the blocking member is located at a standby position in the substrate processing apparatus according to the second embodiment of the present invention. FIG. 10 is a diagram showing a state in which the blocking member is located at the blocking position in the substrate processing apparatus according to the second embodiment of the present invention.

10: Robotic arm

100: Substrate processing device

110-1: Blocking parts

111-1: Connecting parts

112-1: Blocking component drive unit

120: heating section

130: shower nozzle

140: Gas Supply Department

150: substrate support

160: Cooling part

170: Lifting drive

171: Lift pin

172: Lifting support part

180: door

190: Chamber

S: Heat treatment space

Claims (14)

A substrate processing device includes: The chamber, in which the heat treatment space of the substrate is arranged; The heating part is arranged in the upper part of the chamber to heat the substrate; The substrate supporting part is provided in the chamber to place the substrate; and The blocking member is located between the heating part and the substrate to block the heat transfer of the heating part when the substrate is loaded into the chamber or the substrate inside the chamber is unloaded to the outside. The blocking position of the substrate. The substrate processing apparatus according to claim 1, wherein when the heat treatment of the substrate is performed, the blocking member is located at a standby position away from the heating portion and the substrate, and the substrate processing apparatus further includes: blocking member driving Part to move the blocking member between the blocking position and the standby position. The substrate processing apparatus according to claim 2, which further includes: A connecting member is connected between the blocking member and the blocking member driving portion, wherein the connecting member is equipped to penetrate the cavity, and the blocking member driving portion is equipped outside the cavity so that the blocking member can The connecting member is moved in a manner of moving between the blocking position and the standby position. The substrate processing apparatus according to claim 3, wherein the connecting member is configured as a pair connected to one side and the other side of the blocking member, and the blocking member driving section is configured as a pair to move the connection part. The substrate processing apparatus according to claim 1, wherein the blocking member is formed in a flat plate shape and provided with a plurality of blocking members, and the blocking members are arranged according to one end portion and the other side end portion of the blocking member adjacent to each other. Connected and folded into a structure of multiple layers, the blocking members are configured to be expanded at the blocking position to be in the shape of a flat plate, and in the state of being folded into multiple layers at the standby position away from the heating part and the substrate . The substrate processing apparatus according to claim 1, wherein the blocking member is in a state of being curled on a roller when it leaves the standby position between the heating part and the substrate, and if the blocking member curled on the roller is pulled The blocking component is deployed from the roller to be located at the blocking position. The substrate processing apparatus according to claim 1, wherein when the substrate is loaded, the blocking member is located at the blocking position before the substrate is brought into the interior of the chamber, and when the substrate is unloaded, the substrate is After exiting the chamber, the blocking member is located at the standby position between the substrate and the heating part. The substrate processing apparatus according to claim 2, wherein a cooling part for cooling the substrate is provided inside the chamber, and when the substrate is loaded, if the substrate reaches a cooling position adjacent to the cooling part, the blocking member It is located at the standby position, and when the substrate is unloaded, the blocking member is located at the blocking position before the substrate is separated from the cooling position. The substrate processing apparatus according to claim 1, wherein the heating part is an upper heater provided in the upper part of the chamber, and in a state where at least a part of the substrate is located inside the chamber, the blocking member is located in the resistance Off position. The substrate processing apparatus according to claim 1, wherein the blocking member is configured to have a size greater than or equal to the substrate when the blocking member is located at the blocking position. A substrate processing method, including the steps: A) The blocking member stands by while leaving the standby position between the heating part for heating the substrate and the substrate placement part where the substrate is placed; B) The blocking component is located at a blocking position blocking the heating part and the substrate placement part; and C) Load the substrate inside the chamber or unload the substrate inside the chamber to the outside. The substrate processing method according to claim 11, wherein the standby position where the blocking member waits is inside the chamber. The substrate processing method according to claim 11, wherein when the substrate is loaded, the blocking member is located at the blocking position before the substrate is brought into the interior of the chamber, and when the substrate is unloaded, the substrate is removed from After being taken out of the cavity, the blocking component is located at the standby position. The substrate processing method according to claim 13, wherein a cooling part for cooling the substrate is provided inside the chamber, and when the substrate is loaded, if the substrate reaches a cooling position adjacent to the cooling part for cooling the substrate, The blocking member is located at the standby position, and when the substrate is unloaded, the blocking member is located at the blocking position before the substrate is separated from the cooling position.

Images