JP2020178019A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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JP2020178019A
JP2020178019A JP2019078803A JP2019078803A JP2020178019A JP 2020178019 A JP2020178019 A JP 2020178019A JP 2019078803 A JP2019078803 A JP 2019078803A JP 2019078803 A JP2019078803 A JP 2019078803A JP 2020178019 A JP2020178019 A JP 2020178019A
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cassette
substrate
robot arm
chamber
carry
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JP7320369B2 (en
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謙次 江藤
Kenji Eto
謙次 江藤
智彦 岡山
Tomohiko Okayama
智彦 岡山
厚治 亀崎
Atsuji Kamezaki
厚治 亀崎
阿部　洋一
Yoichi Abe
洋一 阿部
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Ulvac Inc
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Ulvac Inc
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Priority to KR1020200043235A priority patent/KR102389972B1/en
Priority to CN202010284602.XA priority patent/CN111834252B/en
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
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Abstract

To provide a substrate processing apparatus capable of reducing an opening area of carry-in/out ports of a chamber.SOLUTION: A substrate processing apparatus includes a cassette 20 that stores a plurality of substrates in a plurality of stages, a chamber 10, an elevating mechanism that elevates the cassette 20 in the chamber 10, a transfer robot, and a control unit that controls the elevating mechanism and the transfer robot, and a side surface portion 12e of the chamber 20 is provided with carry-in/out ports 15 and 16 that are opened when the substrate is carried in and out of the cassette 20, and the transfer robot is provided with a robot arm on which the substrate is placed, and when the robot arm is moved horizontally and can be inserted into the cassette 20 from the carry-in/out ports 15 and 16 and can be raised or lowered in the cassette 20, and when the robot arm is lowered in the cassette 20, the control unit raises the cassette 20 by the elevating mechanism, and when the robot arm is raised in the cassette 20, the control unit lowers the cassette 20 by the elevating mechanism.SELECTED DRAWING: Figure 2

Description

本発明は基板処理装置に関する。 The present invention relates to a substrate processing apparatus.

加熱処理等、平板状の基板を水平位置として多段に載置し複数枚を同時に密閉チャンバ内で処理する装置が知られている（特許文献１）。 There is known an apparatus such as heat treatment in which a flat plate-shaped substrate is placed in multiple stages in a horizontal position and a plurality of sheets are simultaneously processed in a closed chamber (Patent Document 1).

このような装置において、チャンバ内に基板を搬入する場合の手順について説明する。まず、基板をロボットアームによって保持させる。基板は、ロボットアームの上に載せられ、ロボットアームは基板を下から支える。次に、ロボットアームによって、基板を、チャンバの搬出入口からチャンバ内の基板加熱ユニットに挿入させる。このときのロボットアームは水平方向に動かす。ロボットアームを挿入する際の上下方向の位置は、基板加熱ユニットの基板の設置位置よりも高い位置とする。次に、ロボットアームを下降させて、基板を基板加熱ユニットに設けられた基板支持ピンの上に載置させる。これにより、ロボットアームから基板加熱ユニットに基板を受け渡させる。更に、チャンバ内のロボットアームを下降させて、ロボットアームを基板から十分に離間させる。その後、ロボットアームをチャンバから水平に引き出す。このようにして、チャンバ内に基板を搬入する。 In such a device, a procedure for carrying the substrate into the chamber will be described. First, the substrate is held by the robot arm. The board is placed on the robot arm, and the robot arm supports the board from below. Next, the robot arm inserts the substrate into the substrate heating unit in the chamber from the loading / unloading port of the chamber. The robot arm at this time is moved in the horizontal direction. The vertical position when the robot arm is inserted shall be higher than the board installation position of the board heating unit. Next, the robot arm is lowered to place the substrate on the substrate support pins provided in the substrate heating unit. As a result, the substrate is handed over from the robot arm to the substrate heating unit. Further, the robot arm in the chamber is lowered to sufficiently separate the robot arm from the substrate. Then pull the robot arm horizontally out of the chamber. In this way, the substrate is carried into the chamber.

また、チャンバから基板を搬出する手順について説明する。まず、ロボットアームをチャンバの搬出入口から基板加熱ユニットまで挿入する。このときのロボットアームは水平方向に動かす。ロボットアームを挿入する際の上下方向の位置は、基板の設置位置よりも低い位置とする。次に、ロボットアームを上昇させて、ロボットアームを基板に接触させる。更にロボットアームを上昇させることで、基板加熱ユニットの基板支持ピンからロボットアームに基板を受け渡させる。基板が基板支持ピンから十分に離間された後、基板を保持したままロボットアームをチャンバから水平に引き出す。このようにして、チャンバから基板を搬出する。 In addition, the procedure for carrying out the substrate from the chamber will be described. First, the robot arm is inserted from the loading / unloading port of the chamber to the substrate heating unit. The robot arm at this time is moved in the horizontal direction. The vertical position when inserting the robot arm shall be lower than the installation position of the board. Next, the robot arm is raised to bring the robot arm into contact with the substrate. Further, by raising the robot arm, the substrate is handed over to the robot arm from the substrate support pin of the substrate heating unit. After the board is sufficiently separated from the board support pins, the robot arm is pulled out horizontally from the chamber while holding the board. In this way, the substrate is removed from the chamber.

上述のように、チャンバに対して基板を搬入または搬出させる際には、チャンバ内においてロボットアームを上下動させる必要がある。ロボットアームはチャンバの搬送入口に挿入された状態で上下動させるので、搬出入口の高さは、ロボットアームの可動範囲を確保できるように設計する必要がある。すなわち、搬出入口の高さは、ある程度大きくせざるを得ない。 As described above, when the substrate is carried in or out of the chamber, it is necessary to move the robot arm up and down in the chamber. Since the robot arm is moved up and down while being inserted into the transport inlet of the chamber, the height of the carry-out inlet must be designed so that the movable range of the robot arm can be secured. That is, the height of the carry-in / out port must be increased to some extent.

ところで、チャンバの搬送入口はシャッタによって開閉自在とされている。一般に、搬送入口の周囲にはＯリングが配設されている。搬送入口の閉鎖時にシャッタがＯリングに密接することで、チャンバ内の密閉性が確保されている。 By the way, the transport inlet of the chamber can be opened and closed by a shutter. Generally, an O-ring is arranged around the transport inlet. The shutter is in close contact with the O-ring when the transport inlet is closed, so that the inside of the chamber is hermetically sealed.

チャンバ内で基板が加熱されると輻射熱が発生する。この輻射熱は、シャッタ及びＯリングにも放射されるが、搬送入口の開口面積が大きくなるほど放射熱量が大きくなる。すなわち、搬送入口の開口面積が大きいと、シャッタ及びＯリングへの熱負荷が高まり、シャッタ及びＯリングの劣化が早まり、これらの交換周期が短くなる。従って、チャンバの搬出入口はできるだけ小さくすることが望まれる。 Radiant heat is generated when the substrate is heated in the chamber. This radiant heat is also radiated to the shutter and the O-ring, but the larger the opening area of the transport inlet, the larger the amount of radiant heat. That is, when the opening area of the transport inlet is large, the heat load on the shutter and the O-ring increases, the deterioration of the shutter and the O-ring is accelerated, and the replacement cycle thereof is shortened. Therefore, it is desirable to make the entrance / exit of the chamber as small as possible.

このように、シャッタ及びＯリングの劣化を抑制するためにはチャンバの搬出入口の開口面積を縮小したい。しかし、ロボットアームの可動範囲を確保する必要性から、搬出入口の開口面積の縮小化には限界があった。 In this way, in order to suppress the deterioration of the shutter and the O-ring, it is desired to reduce the opening area of the inlet / outlet of the chamber. However, due to the need to secure the movable range of the robot arm, there is a limit to reducing the opening area of the carry-in / out port.

特開２００８−２６３０６３号公報Japanese Unexamined Patent Publication No. 2008-263063

本発明は上記事情に鑑みてなされたものであり、ロボットアームによって基板の搬出入を行う場合であっても、チャンバの搬出入口の開口面積を小さくすることが可能な基板処理装置を提供することを課題とする。 The present invention has been made in view of the above circumstances, and provides a substrate processing apparatus capable of reducing the opening area of the loading / unloading port of a chamber even when the substrate is loaded / unloaded by a robot arm. Is the subject.

上記課題を解決するため、本発明は以下の構成を採用する。
［１］ 複数枚の基板を多段に収納するカセットと、
前記カセットを密閉可能に収納するチャンバと、
前記カセットを前記チャンバ内で昇降させる昇降機構と、
前記基板を前記カセットに対して搬出入する搬送ロボットと、
前記昇降機構及び前記搬送ロボットの動作を制御する制御部と、を備え、
前記チャンバの側面部には、前記基板を前記カセットに搬出入する際に開口する搬出入口が設けられ、
前記搬送ロボットには、前記基板が載置されるロボットアームが備えられ、
前記ロボットアームは、水平方向に移動して前記搬出入口から前記カセット内に挿入可能とされ、かつ、前記カセット内において上昇または下降が可能とされ、
前記制御部は、前記カセット内において前記ロボットアームを下降させる場合は前記昇降機構によって前記カセットを上昇させ、前記カセット内において前記ロボットアームを上昇させる場合は前記昇降機構によって前記カセットを下降させることを特徴とする基板処理装置。
［２］ 前記カセットから前記基板を搬出する動作として、前記制御部は、前記チャンバの前記搬出入口から前記ロボットアームを前記カセット内に挿入させ、次いで、前記ロボットアームを上昇させて前記基板を下から持ち上げるとともに、前記昇降機構によって前記カセットを下降させ、次いで、前記ロボットアームを前記カセットから引き抜かせることを特徴とする［１］に記載の基板処理装置。
［３］ 前記カセットに前記基板を搬入する動作として、前記制御部は、前記チャンバの前記搬出入口から、前記基板を保持した前記ロボットアームを前記カセット内に挿入させ、次いで、前記ロボットアームを下降させて前記基板を前記カセット内に載置するとともに、前記昇降機構によって前記カセットを上昇させ、次いで、前記ロボットアームを前記カセットから引き抜かせることを特徴とする［１］に記載の基板処理装置。 In order to solve the above problems, the present invention adopts the following configuration.
[1] A cassette that stores multiple boards in multiple stages,
A chamber that houses the cassette so that it can be sealed,
An elevating mechanism that elevates and elevates the cassette in the chamber,
A transfer robot that carries in and out the substrate to and from the cassette,
The elevating mechanism and the control unit for controlling the operation of the transfer robot are provided.
The side surface of the chamber is provided with a carry-in / out port that opens when the substrate is carried in / out of the cassette.
The transfer robot is provided with a robot arm on which the substrate is placed.
The robot arm can move in the horizontal direction and can be inserted into the cassette from the carry-in / out port, and can be raised or lowered in the cassette.
When the robot arm is lowered in the cassette, the control unit raises the cassette by the elevating mechanism, and when raising the robot arm in the cassette, the control unit lowers the cassette by the elevating mechanism. A featured substrate processing device.
[2] As an operation of carrying out the substrate from the cassette, the control unit inserts the robot arm into the cassette from the carry-out inlet of the chamber, and then raises the robot arm to lower the substrate. The substrate processing apparatus according to [1], wherein the cassette is lowered by the elevating mechanism, and then the robot arm is pulled out from the cassette.
[3] As an operation of loading the substrate into the cassette, the control unit inserts the robot arm holding the substrate into the cassette from the loading / unloading port of the chamber, and then lowers the robot arm. The substrate processing apparatus according to [1], wherein the substrate is placed in the cassette, the cassette is raised by the elevating mechanism, and then the robot arm is pulled out from the cassette.

本発明の基板処理装置によれば、制御部が、カセット内においてロボットアームを下降させる場合はカセットを上昇させ、カセット内においてロボットアームを上昇させる場合はカセットを下降させるので、従来の基板搬送装置に比べて、基板をチャンバに搬出入する際のロボットアームの上昇時の変位量及び下降時の変位量を小さくすることができ、これにより、搬出入口の開口面積を小さくすることができる。これにより、チャンバの搬出入口の開閉機構に対する熱負荷を軽減することができ、チャンバのメンテナンス頻度を少なくして、基板処理の生産性を向上させることができる。 According to the substrate processing apparatus of the present invention, when the control unit lowers the robot arm in the cassette, the cassette is raised, and when the robot arm is raised in the cassette, the cassette is lowered. Compared with the above, the amount of displacement of the robot arm when the robot arm is carried in and out of the chamber and the amount of displacement when the robot arm is lowered can be reduced, whereby the opening area of the loading / unloading port can be reduced. As a result, the heat load on the opening / closing mechanism of the inlet / outlet of the chamber can be reduced, the maintenance frequency of the chamber can be reduced, and the productivity of substrate processing can be improved.

また、本実施形態の基板処理装置によれば、カセットから基板Ｋを搬出する動作として、制御部が、ロボットアームをカセット内に挿入させた後に、ロボットアームを上昇させて基板の下から持ち上げるとともに、昇降機構によってカセットを下降させるので、従来の基板搬送装置に比べてロボットアームの上昇時の変位量を小さくすることができる。これにより、搬出入口の開口面積を小さくすることでき、また、基板Ｋの搬出時間を短縮することもできる。 Further, according to the substrate processing apparatus of the present embodiment, as an operation of carrying out the substrate K from the cassette, the control unit inserts the robot arm into the cassette, then raises the robot arm and lifts it from under the substrate. Since the cassette is lowered by the elevating mechanism, the amount of displacement of the robot arm when ascending can be reduced as compared with the conventional substrate transfer device. As a result, the opening area of the carry-in / out port can be reduced, and the carry-out time of the substrate K can be shortened.

また、本実施形態の基板処理装置によれば、カセットに基板を搬入する動作として、制御部が、基板を保持したロボットアームをカセット内に挿入させた後に、ロボットアームを下降させて基板をカセット内に載置するとともに、昇降機構によってカセットを上昇させるので、従来の基板搬送装置に比べてロボットアームの下降時の変位量を小さくすることができる。これにより、搬出入口の開口面積を小さくすることでき、また、基板の搬入時間を短縮することもできる。 Further, according to the substrate processing apparatus of the present embodiment, as an operation of carrying the substrate into the cassette, the control unit inserts the robot arm holding the substrate into the cassette, and then lowers the robot arm to cassette the substrate. Since the cassette is raised by the elevating mechanism while being placed inside, the amount of displacement of the robot arm when it is lowered can be reduced as compared with the conventional substrate transfer device. As a result, the opening area of the carry-in / out port can be reduced, and the carry-in time of the substrate can be shortened.

本発明の実施形態である基板処理装置を示す平面模式図。The plan view which shows the substrate processing apparatus which is an embodiment of this invention. 本発明の実施形態である基板処理装置の要部を示す側面断面図。The side sectional view which shows the main part of the substrate processing apparatus which is an embodiment of this invention. 本発明の実施形態である基板処理装置の動作を説明する側面断面図。FIG. 5 is a side sectional view illustrating the operation of the substrate processing apparatus according to the embodiment of the present invention. 本発明の実施形態である基板処理装置の動作を説明する側面断面図。The side sectional view explaining the operation of the substrate processing apparatus which is an embodiment of this invention. 従来の基板処理装置の動作を説明する側面断面図。The side sectional view explaining the operation of the conventional substrate processing apparatus.

以下、本発明の実施形態について図面を参照して説明する。
図１は、本実施形態における基板処理装置を示す模式平面図であり、図において、符号１は基板処理装置である。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic plan view showing a substrate processing apparatus according to the present embodiment, in which reference numeral 1 is a substrate processing apparatus.

本実施形態に係る基板処理装置１は、図１に示すように、平面視して多角形状のトランスファチャンバ２と、トランスファチャンバ２の各辺に接続された処理室となるチャンバ１０〜１０Ｅと、を有する。 As shown in FIG. 1, the substrate processing apparatus 1 according to the present embodiment includes a transfer chamber 2 having a polygonal shape in a plan view, chambers 10 to 10E serving as processing chambers connected to each side of the transfer chamber 2. Has.

本実施形態に係る基板処理装置１は、複数枚の基板を真空雰囲気等の密閉状態として処理するものとされ、その処理は特に限定されない。チャンバ１０〜１０Ｅは、それぞれ、異なる処理を基板に施す処理室とされることができる。
例えば、チャンバ１０〜１０Ｅのうち1箇所は、基板を出し入れするロード／アンロード室とすることができる。 The substrate processing apparatus 1 according to the present embodiment processes a plurality of substrates in a sealed state such as a vacuum atmosphere, and the processing is not particularly limited. The chambers 10 to 10E can be treated chambers for performing different treatments on the substrate.
For example, one of the chambers 10 to 10E can be a load / unload chamber for loading and unloading the substrate.

トランスファチャンバ２は、図１に示すように、その内部に、搬送ロボット２ａを有し、トランスファチャンバ２と各チャンバ１０〜１０Ｅとの間で、基板を搬送可能とされている。
なお、トランスファチャンバ２には、搬送ロボット２ａを複数設置することもできる。
さらに、トランスファチャンバ２は、多角形であればよく、三角形から八角形程度まで、任意の平面形状とすることができる。 As shown in FIG. 1, the transfer chamber 2 has a transfer robot 2a inside, and can transfer a substrate between the transfer chamber 2 and each of the chambers 10 to 10E.
A plurality of transfer robots 2a can be installed in the transfer chamber 2.
Further, the transfer chamber 2 may be polygonal, and may have an arbitrary planar shape from a triangle to an octagon.

また、基板処理装置１には、トランスファチャンバ２と、チャンバ１０〜１０Ｅと、搬送ロボット２ａとを制御する制御部１００が備えられている。 Further, the substrate processing apparatus 1 is provided with a control unit 100 that controls the transfer chamber 2, the chambers 10 to 10E, and the transfer robot 2a.

搬送ロボット２ａには、水平方向、垂直方向に移動可能に構成されたロボットアーム２ｂが備えられている。搬送ロボット２ａは、回転軸と、この回転軸に取り付けられたロボットアーム２ｂと、上下動装置とを有している。ロボットアーム２ｂの先端には、ロボットハンド２ｃが取り付けられている。 The transfer robot 2a is provided with a robot arm 2b configured to be movable in the horizontal direction and the vertical direction. The transfer robot 2a has a rotation shaft, a robot arm 2b attached to the rotation shaft, and a vertical movement device. A robot hand 2c is attached to the tip of the robot arm 2b.

ロボットアーム２ｂは、互いに屈曲可能な第一、第二の能動アームと、第一、第二の従動アームとから構成されている。搬送ロボット２ａは、被搬送物である基板を、チャンバ１０〜１０Ｅ間で移動させることができる。 The robot arm 2b is composed of a first and second active arm that can bend each other and a first and second driven arm. The transfer robot 2a can move the substrate to be transported between the chambers 10 to 10E.

ロボットアーム２ｂは、基板を載置できるように形成されており、複数本、例えば、平面視して２本、あるいは、４本形成されることができる。また、ロボットアーム２ｂにおける、基板の搬出入方向に沿う方向の長さは、基板をロボットアーム２ｂ上に確実に載置して搬送することができるように基板より長く形成される。 The robot arms 2b are formed so that a substrate can be placed on them, and a plurality of robot arms 2b, for example, two or four robot arms 2b in a plan view can be formed. Further, the length of the robot arm 2b in the direction along the loading / unloading direction of the substrate is formed to be longer than that of the substrate so that the substrate can be reliably placed and conveyed on the robot arm 2b.

ロボットアーム２ｂの垂直方向における厚みは、後述するチャンバ１０のカセット２０に設けられた基板支持ピンの高さよりも薄く形成されている。このようにすることで、基板をロボットアーム２ｂ上に載置して、チャンバ１０へと搬送し、基板をチャンバ１０内のカセット２０における基板支持ピン上に移設する際に、基板を落下させることなくスムーズにロボットアーム２ｂ上から基板支持ピン上に移設することができる。 The thickness of the robot arm 2b in the vertical direction is formed to be thinner than the height of the substrate support pin provided in the cassette 20 of the chamber 10, which will be described later. By doing so, the substrate is placed on the robot arm 2b, conveyed to the chamber 10, and dropped when the substrate is transferred onto the substrate support pin in the cassette 20 in the chamber 10. It can be smoothly transferred from the robot arm 2b onto the board support pin.

つまり、基板に集中荷重などがかかることなく確実に移設することができる。また、基板の処理が完了した後、チャンバ１０から搬出する際に基板支持ピンにより形成される基板と後述する支持部２１との間の隙間にロボットアーム２ｂを挿通することができるため、基板をロボットアーム２ｂ上に確実に移設することができる。 That is, the substrate can be reliably relocated without applying a concentrated load or the like. Further, after the processing of the substrate is completed, the robot arm 2b can be inserted into the gap between the substrate formed by the substrate support pins and the support portion 21 described later when the substrate is carried out from the chamber 10, so that the substrate can be inserted. It can be reliably relocated onto the robot arm 2b.

トランスファチャンバ２および各チャンバ１０〜１０Ｅには、真空状態に保持できるように、図示しない真空ポンプが接続されている。また、トランスファチャンバ２および各チャンバ１０〜１０Ｅには、所定の雰囲気ガスを供給するガス供給部を接続することができる。 A vacuum pump (not shown) is connected to the transfer chamber 2 and each of the chambers 10 to 10E so as to be able to maintain the vacuum state. Further, a gas supply unit for supplying a predetermined atmospheric gas can be connected to the transfer chamber 2 and each chamber 10 to 10E.

特に、チャンバ１０には、図示しない窒素ガス供給部が設けられてもよい。窒素ガス供給部より窒素ガスをチャンバ１０内に供給すると、例えば、加熱処理をする際に、基板の昇温速度を速めることができる。また、このときチャンバ１０内の圧力は１００Ｐａ程度に保持できるように構成されることができる。 In particular, the chamber 10 may be provided with a nitrogen gas supply unit (not shown). When nitrogen gas is supplied into the chamber 10 from the nitrogen gas supply unit, the heating rate of the substrate can be increased, for example, when heat treatment is performed. At this time, the pressure in the chamber 10 can be maintained at about 100 Pa.

また、トランスファチャンバ２には、排気口が形成されてもよい。排気口は、トランスファチャンバ２におけるチャンバ１０との境界部近傍に形成さる。排気口により、トランスファチャンバ２内の排気をすることができるとともに、後述するシャッタ１５ａ，１６ａが開状態に保持されているときには、チャンバ１０内の排気をすることが可能となる。
この場合、チャンバ１０に排気手段を設ける必要がなくなりコスト低減できる。また、チャンバ１０からトランスファチャンバ２に流出した高温の窒素ガスは、搬送ロボット２ａに到達する前に排気口から排出されるので、高温の窒素ガスによる搬送ロボットへの悪影響を防止することができる。 Further, an exhaust port may be formed in the transfer chamber 2. The exhaust port is formed in the vicinity of the boundary portion of the transfer chamber 2 with the chamber 10. The exhaust port allows the transfer chamber 2 to be exhausted, and the chamber 10 can be exhausted when the shutters 15a and 16a, which will be described later, are held in the open state.
In this case, it is not necessary to provide the exhaust means in the chamber 10, and the cost can be reduced. Further, since the high-temperature nitrogen gas flowing out from the chamber 10 to the transfer chamber 2 is discharged from the exhaust port before reaching the transfer robot 2a, it is possible to prevent the transfer robot from being adversely affected by the high-temperature nitrogen gas.

本実施形態に係る基板処理装置１としては、チャンバ１０が複数枚の基板に対して同時に加熱処理を施すものとして説明する。
チャンバ１０における処理は熱処理に限定されない。また、チャンバ１０Ａ〜１０Ｅは、チャンバ１０と同じ処理を施す同じ構成としてもよいし、異なる処理を施す処理室として異なる構成とすることもできる。チャンバ１０と異なる処理としては、成膜、エッチング、洗浄等を挙げることができる。 The substrate processing apparatus 1 according to the present embodiment will be described assuming that the chamber 10 simultaneously heat-treats a plurality of substrates.
The treatment in the chamber 10 is not limited to heat treatment. Further, the chambers 10A to 10E may have the same configuration in which the same treatment as the chamber 10 is performed, or may have different configurations as processing chambers in which different treatments are performed. Examples of the treatment different from the chamber 10 include film formation, etching, and cleaning.

図２は、本実施形態の基板処理装置におけるチャンバを示す側断面図である。
チャンバ１０は、図１及び図２に示すように、平面視して略矩形断面を有するとともに、鉛直方向の断面形状が略矩形とされている。チャンバ１０は、密閉可能とされている。 FIG. 2 is a side sectional view showing a chamber in the substrate processing apparatus of this embodiment.
As shown in FIGS. 1 and 2, the chamber 10 has a substantially rectangular cross section in a plan view, and the cross-sectional shape in the vertical direction is substantially rectangular. The chamber 10 is hermetically sealed.

チャンバ１０は、図２に示すように、天井部１１ａと、天井部１１ａと平行な底部１２ａと、平面視して天井部１１ａと底部１２ａとの輪郭に沿って立設された側部１１ｂ、１２ｅとを有する。また、図２には示されないが、平面視して天井部１１ａと底部１２ａとの輪郭に沿って立設された別の側部がある。 As shown in FIG. 2, the chamber 10 includes a ceiling portion 11a, a bottom portion 12a parallel to the ceiling portion 11a, and side portions 11b erected along the contours of the ceiling portion 11a and the bottom portion 12a in a plan view. It has 12e and. Further, although not shown in FIG. 2, there is another side portion erected along the contour of the ceiling portion 11a and the bottom portion 12a in a plan view.

チャンバ１０の側部１２ｅには、図２に示すように、後述するように基板を出し入れする搬出入口１５，１６が設けられる。搬出入口１５，１６は、上下方向に離間して、例えば２箇所設けられる。なお、搬出入口１５，１６の設置数はこれに限定されるものではなく、１箇所でもよく、３箇所以上でもよい。 As shown in FIG. 2, the side portions 12e of the chamber 10 are provided with carry-in / out ports 15 and 16 for taking in / out the substrate, as will be described later. The carry-out ports 15 and 16 are provided at two locations, for example, separated in the vertical direction. The number of carry-in / out ports 15 and 16 is not limited to this, and may be one or three or more.

搬出入口１５，１６には、それぞれ開閉可能なシャッタ１５ａ，１６ａが設けられる。
シャッタ１５ａ，１６ａは、いずれもシャッタ駆動部１５ｂ，１６ｂによって開閉可能とされている。 Shutters 15a and 16a that can be opened and closed are provided at the carry-out ports 15 and 16, respectively.
The shutters 15a and 16a are both openable and closable by the shutter drive units 15b and 16b.

シャッタ駆動部１５ｂが、シャッタ１５ａを開放した際には、搬送ロボット２ａが、上下動装置によってロボットアーム２ｂを搬出入口１５に対応する高さ位置まで移動して、ロボットアーム２ｂに支持された基板を搬出入口１５からチャンバ１０内に搬出入可能とされる。 When the shutter drive unit 15b opens the shutter 15a, the transfer robot 2a moves the robot arm 2b to a height position corresponding to the carry-in / out port 15 by the vertical movement device, and the substrate supported by the robot arm 2b. Can be carried in and out of the chamber 10 from the carry-in / out port 15.

シャッタ駆動部１６ｂが、シャッタ１６ａを開放した際には、搬送ロボット２ａが、上下動装置によってロボットアーム２ｂを搬出入口１６に対応する高さ位置まで移動して、ロボットアーム２ｂに支持された基板を搬出入口１６からチャンバ１０内に搬出入可能とされる。 When the shutter drive unit 16b opens the shutter 16a, the transfer robot 2a moves the robot arm 2b to a height position corresponding to the carry-in / out port 16 by the vertical movement device, and the substrate supported by the robot arm 2b. Can be carried in and out of the chamber 10 from the carry-in / out port 16.

チャンバ１０の内部には、図２に示すように、処理する基板を複数支持するカセット２０が設けられる。
カセット２０は、図２に示すように、略矩形の支持部２１が上下方向に複数設けられる。複数の支持部２１は、ほぼ等しい輪郭形状を有する。複数の支持部２１は、互いに上下方向に離間して配置される。 As shown in FIG. 2, a cassette 20 for supporting a plurality of substrates to be processed is provided inside the chamber 10.
As shown in FIG. 2, the cassette 20 is provided with a plurality of substantially rectangular support portions 21 in the vertical direction. The plurality of support portions 21 have substantially the same contour shape. The plurality of support portions 21 are arranged apart from each other in the vertical direction.

複数の支持部２１は、ほぼ等しい上下方向の離間距離を有する。複数の支持部２１は、例えばその四隅に立設された支持柱２２によって、互いの上下間隔を維持される。
支持柱２２は、上下方向における複数の支持部２１間の離間を維持可能であれば、この構成に限るものではない。 The plurality of support portions 21 have substantially the same vertical separation distance. The plurality of support portions 21 are maintained at a vertical distance from each other by, for example, support columns 22 erected at the four corners thereof.
The support pillar 22 is not limited to this configuration as long as the distance between the plurality of support portions 21 in the vertical direction can be maintained.

本実施形態のカセット２０においては、支持部２１が６段配置される。したがって、本実施形態のカセット２０においては、６枚の基板を支持して同時に処理することが可能とされる。なお、支持部２１の段数はこれに限定されるものではない。 In the cassette 20 of the present embodiment, the support portions 21 are arranged in six stages. Therefore, in the cassette 20 of the present embodiment, it is possible to support six substrates and process them at the same time. The number of stages of the support portion 21 is not limited to this.

複数の支持部２１は、それぞれの上に基板を載置可能とされている。複数の支持部２１は、いずれも、載置する基板よりもやや大きい輪郭形状とされる。 A substrate can be placed on each of the plurality of support portions 21. Each of the plurality of support portions 21 has a contour shape slightly larger than that of the substrate on which the support portion 21 is placed.

また、複数の支持部２１は、それぞれの上に載置された基板を加熱する図示略のヒータを備えている。支持部２１に備えられたヒータは、いずれも、基板の全面で等しい加熱状態となるように配置される。具体的には、支持部に備えられたヒータは、支持部の全面に対応した配置とされることができる。 Further, the plurality of support portions 21 are provided with heaters (not shown) for heating the substrate placed on each of the support portions 21. All the heaters provided on the support portion 21 are arranged so that the entire surface of the substrate is in the same heating state. Specifically, the heater provided in the support portion can be arranged so as to correspond to the entire surface of the support portion.

ヒータは、例えば、カーボンからなる板状部材を２枚重ね合わせ、その板状部材どうしの間にシースヒータが挟持された構成としたものを用いることができる。ヒータは、チャンバ１０の外部に設けられた図示しないヒータ電源よりシースヒータに電圧を印加することで、加熱されるように構成されている。加熱されたヒータからの輻射熱により基板を加熱できるように構成されている。 As the heater, for example, a heater in which two plate-shaped members made of carbon are laminated and a sheath heater is sandwiched between the plate-shaped members can be used. The heater is configured to be heated by applying a voltage to the sheath heater from a heater power supply (not shown) provided outside the chamber 10. It is configured so that the substrate can be heated by the radiant heat from the heated heater.

なお、カセット２０は、最上部の支持部２１の上側に、支持部２１とほぼ同じ輪郭形状のヒータ２１ａを有する。ヒータ２１ａは、支持柱２２によって最上部の支持部２１との上下間隔を維持される。ヒータ２１ａと最上部の支持部２１との上下間隔は、上下方向に隣り合う支持部２１と支持部２１との上下間隔と等しく設定される。ヒータ２１ａは、ヒータと略同等の構成を有する。 The cassette 20 has a heater 21a having a contour shape substantially the same as that of the support portion 21 on the upper side of the uppermost support portion 21. The heater 21a is maintained at a vertical distance from the uppermost support portion 21 by the support pillar 22. The vertical distance between the heater 21a and the uppermost support portion 21 is set to be equal to the vertical distance between the support portions 21 adjacent to each other in the vertical direction and the support portion 21. The heater 21a has substantially the same configuration as the heater.

カセット２０の最上部のヒータ２１ａ、および、各段の支持部２１に備えられたヒータは、図示しないヒータ線を介して、チャンバ１０の外部に設けられたヒータ電源から加熱電力を供給される。 The heater 21a at the top of the cassette 20 and the heater provided in the support portion 21 of each stage are supplied with heating power from a heater power source provided outside the chamber 10 via a heater wire (not shown).

支持部２１の上面位置には、載置された基板を支持する基板支持ピンを有していてもよい。基板支持ピンは、ヒータの上面に複数取り付けられており、基板を載置したときに、基板の自重による撓みを最小限に抑制すべく適正な位置に取り付けられている。また、基板支持ピンは、平面視して搬送ロボット２ａのロボットアーム２ｂと干渉しない位置に設けられている。 A substrate support pin that supports the mounted substrate may be provided at the upper surface position of the support portion 21. A plurality of board support pins are attached to the upper surface of the heater, and are attached at appropriate positions so as to minimize bending due to the weight of the substrate when the substrate is placed. Further, the substrate support pin is provided at a position where it does not interfere with the robot arm 2b of the transfer robot 2a in a plan view.

基板支持ピンは、支持部２１上に取り付けられた支柱と、支柱の上部に設けられたローラとを備えている。ローラは、その中心軸を中心に回転可能に構成されている。ローラの中心軸は水平方向に延在する。このローラに基板が載置されることにより、基板が加熱により熱伸びする際に、基板に傷が発生することを防止することができる。 The board support pin includes a support column mounted on the support portion 21 and a roller provided on the upper portion of the support column. The roller is configured to be rotatable around its central axis. The central axis of the roller extends horizontally. By placing the substrate on the roller, it is possible to prevent the substrate from being scratched when the substrate is thermally expanded by heating.

それぞれの基板支持ピンは、ローラの回転方向が基板の中心からそれぞれの基板支持ピンへ指向する方向に沿うように配置されている。つまり、基板が加熱されたときに、基板の熱伸び方向に対応するように基板支持ピンを配置する。なお、基板の中心に対応する位置の基板支持ピンはローラを設けず、固定されたピンとしてもよい。このように構成することで、基板を加熱しても基板の中心位置がずれなくなり、加熱が完了した基板を搬出入する際に、位置合わせをすることなく、確実に基板を搬出することができる。 Each substrate support pin is arranged so that the rotation direction of the roller is directed from the center of the substrate to each substrate support pin. That is, when the substrate is heated, the substrate support pins are arranged so as to correspond to the thermal expansion direction of the substrate. The substrate support pin at a position corresponding to the center of the substrate may be a fixed pin without providing a roller. With this configuration, the center position of the substrate does not shift even when the substrate is heated, and when the heated substrate is carried in and out, the substrate can be reliably carried out without alignment. ..

カセット２０の最下層（底部）となる支持部２１の下側位置には、図２に示すように、昇降軸２３が下向きに延在するように接続される。昇降軸２３は、平面視した支持部２１の中央位置に接続される。 As shown in FIG. 2, the elevating shaft 23 is connected to the lower position of the support portion 21 which is the lowermost layer (bottom portion) of the cassette 20 so as to extend downward. The elevating shaft 23 is connected to the central position of the support portion 21 in a plan view.

昇降軸２３は、チャンバ１０の底部１２ａに設けられた貫通部１２ｇを貫通する。昇降軸２３は、貫通部１２ｇを上下方向に摺動可能とされる。貫通部１２ｇは、昇降軸２３の外周面との間で摺動可能にシールされている。
昇降軸２３は中空状とされる。昇降軸２３の内部には、支持部２１に備えられたヒータと、チャンバ１０外部に設けられたヒータ電源とを接続する複数本のヒータ線が全て通される。 The elevating shaft 23 penetrates the penetrating portion 12g provided at the bottom portion 12a of the chamber 10. The elevating shaft 23 is capable of sliding the penetrating portion 12g in the vertical direction. The penetrating portion 12g is slidably sealed with the outer peripheral surface of the elevating shaft 23.
The elevating shaft 23 is hollow. Inside the elevating shaft 23, a plurality of heater wires for connecting the heater provided in the support portion 21 and the heater power supply provided outside the chamber 10 are all passed through.

昇降軸２３の内部は、チャンバ１０内部と連通している。昇降軸２３の内部における下端部には図示略のシールフランジが設けられる。シールフランジは、昇降軸２３における下端部で、昇降軸２３の内部を密閉可能にシールしている。 The inside of the elevating shaft 23 communicates with the inside of the chamber 10. A seal flange (not shown) is provided at the lower end of the elevating shaft 23. The seal flange is the lower end portion of the elevating shaft 23 and seals the inside of the elevating shaft 23 so as to be hermetically sealed.

昇降軸２３は、図２に示すように、昇降駆動部３０に接続されている。
昇降駆動部３０は、カセット２０をチャンバ１０内で昇降させる。昇降駆動部３０は、昇降軸２３の下端を支持する昇降支持部３１と、昇降支持部３１を上下方向に位置規制して昇降するボールネジ３２，３２と、ボールネジ３２を回転駆動する昇降回転部３３と、を有する。 As shown in FIG. 2, the elevating shaft 23 is connected to the elevating drive unit 30.
The elevating drive unit 30 elevates and elevates the cassette 20 in the chamber 10. The elevating drive unit 30 includes an elevating support portion 31 that supports the lower end of the elevating shaft 23, ball screws 32 and 32 that restrict the position of the elevating support portion 31 in the vertical direction to move up and down, and an elevating and rotating unit 33 that rotationally drives the ball screw 32. And have.

ボールネジ３２は、鉛直方向に立設される。ボールネジ３２は、昇降支持部３１を上下方向に貫通する貫通孔３１ａに螺合されている。
昇降回転部３３によってボールネジ３２を回転することで、昇降支持部３１が上下方向に位置規制した状態で昇降する。これにより、昇降駆動部３０が昇降軸２３を昇降する。
昇降駆動部３０と昇降軸２３とは、昇降機構を構成している。 The ball screw 32 is erected in the vertical direction. The ball screw 32 is screwed into a through hole 31a that penetrates the elevating support portion 31 in the vertical direction.
By rotating the ball screw 32 by the elevating and rotating portion 33, the elevating and lowering support portion 31 moves up and down in a state where the position is restricted in the vertical direction. As a result, the elevating drive unit 30 moves up and down the elevating shaft 23.
The elevating drive unit 30 and the elevating shaft 23 form an elevating mechanism.

昇降駆動部３０によって昇降軸２３を昇降することで、チャンバ１０内でカセット２０が上下方向に移動される。昇降機構の動作は、制御部１００によって制御される。 The cassette 20 is moved in the vertical direction in the chamber 10 by moving the lifting shaft 23 up and down by the lifting drive unit 30. The operation of the elevating mechanism is controlled by the control unit 100.

カセット２０が、チャンバ１０内で最も上側位置に移動された場合を考える。
この場合、図２に示すように、最下段となる支持部２１は、搬出入口１６に対応する高さ位置となる。同時に、下から４段目、上から３段目となる支持部２１は、搬出入口１５に対応する高さ位置となる。 Consider the case where the cassette 20 is moved to the uppermost position in the chamber 10.
In this case, as shown in FIG. 2, the lowermost support portion 21 is at a height position corresponding to the carry-in / out port 16. At the same time, the support portion 21 which is the fourth step from the bottom and the third step from the top is at a height position corresponding to the carry-in / out port 15.

この状態で、シャッタ駆動部１５ｂが、シャッタ１５ａを開放した際には、搬送ロボット２ａが、上下動装置によってロボットアーム２ｂを搬出入口１５に対応する高さ位置まで移動する。そして、ロボットアーム２ｂに支持された基板を搬出入口１５から上から３段目となる支持部２１に搬出入可能である。 In this state, when the shutter drive unit 15b opens the shutter 15a, the transfer robot 2a moves the robot arm 2b to a height position corresponding to the carry-in / out port 15 by the vertical movement device. Then, the substrate supported by the robot arm 2b can be carried in and out from the carry-in / out port 15 to the support portion 21 which is the third stage from the top.

同様に、シャッタ駆動部１６ｂが、シャッタ１６ａを開放した際には、搬送ロボット２ａが、上下動装置によってロボットアーム２ｂを搬出入口１６に対応する高さ位置まで移動する。そして、ロボットアーム２ｂに支持された基板を搬出入口１６から最下段となる支持部２１に搬出入可能である。 Similarly, when the shutter drive unit 16b opens the shutter 16a, the transfer robot 2a moves the robot arm 2b to a height position corresponding to the carry-in / out port 16 by the vertical movement device. Then, the substrate supported by the robot arm 2b can be carried in and out from the carry-in / out port 16 to the lowermost support portion 21.

さらに、多段とされた支持部２１における一段分だけ、カセット２０がチャンバ１０内で下側に移動された場合を考える。
この場合、上から５段目、下から２段目となる支持部２１は、搬出入口１６に対応する高さ位置となる。同時に、下から５段目、上から２段目となる支持部２１は、搬出入口１５に対応する高さ位置となる。 Further, consider a case where the cassette 20 is moved downward in the chamber 10 by one stage in the support portion 21 having multiple stages.
In this case, the support portion 21, which is the fifth step from the top and the second step from the bottom, is at a height position corresponding to the carry-in / out port 16. At the same time, the support portion 21, which is the fifth step from the bottom and the second step from the top, is at a height position corresponding to the carry-in / out port 15.

この状態で、シャッタ駆動部１５ｂが、シャッタ１５ａを開放した際には、搬送ロボット２ａが、上下動装置によってロボットアーム２ｂを搬出入口１５に対応する高さ位置まで移動する。そして、ロボットアーム２ｂに支持された基板を搬出入口１５から上から２段目となる支持部２１に搬出入可能である。 In this state, when the shutter drive unit 15b opens the shutter 15a, the transfer robot 2a moves the robot arm 2b to a height position corresponding to the carry-in / out port 15 by the vertical movement device. Then, the substrate supported by the robot arm 2b can be carried in and out from the carry-in / out port 15 to the support portion 21 which is the second stage from the top.

同様に、シャッタ駆動部１６ｂが、シャッタ１６ａを開放した際には、搬送ロボット２ａが、上下動装置によってロボットアーム２ｂを搬出入口１６に対応する高さ位置まで移動する。そして、ロボットアーム２ｂに支持された基板を搬出入口１６から下から２段目となる支持部２１に搬出入可能である。 Similarly, when the shutter drive unit 16b opens the shutter 16a, the transfer robot 2a moves the robot arm 2b to a height position corresponding to the carry-in / out port 16 by the vertical movement device. Then, the substrate supported by the robot arm 2b can be carried in and out from the carry-in / out port 16 to the support portion 21 which is the second stage from the bottom.

さらに、多段とされた支持部２１における一段分だけ、カセット２０がチャンバ１０内で下側に移動された場合を考える。
この場合、上から４段目、下から３段目となる支持部２１は、搬出入口１６に対応する高さ位置となる。同時に、最上段となる支持部２１は、搬出入口１５に対応する高さ位置となる。 Further, consider a case where the cassette 20 is moved downward in the chamber 10 by one stage in the support portion 21 having multiple stages.
In this case, the support portion 21, which is the fourth step from the top and the third step from the bottom, is at a height position corresponding to the carry-in / out port 16. At the same time, the support portion 21 at the uppermost stage is at a height position corresponding to the carry-in / out port 15.

この状態で、シャッタ駆動部１５ｂが、シャッタ１５ａを開放した際には、搬送ロボット２ａが、上下動装置によってロボットアーム２ｂ及びロボットハンド２ｃを搬出入口１５に対応する高さ位置まで移動する。そして、ロボットハンド２ｃに支持された基板を搬出入口１５から最上段となる支持部２１に搬出入可能である。 In this state, when the shutter drive unit 15b opens the shutter 15a, the transfer robot 2a moves the robot arm 2b and the robot hand 2c to a height position corresponding to the carry-in / out port 15 by the vertical movement device. Then, the substrate supported by the robot hand 2c can be carried in and out from the carry-in / out port 15 to the support portion 21 which is the uppermost stage.

同様に、シャッタ駆動部１６ｂが、シャッタ１６ａを開放した際には、搬送ロボット２ａが、上下動装置によってロボットアーム２ｂを搬出入口１６に対応する高さ位置まで移動する。そして、ロボットアーム２ｂに支持された基板を搬出入口１６から下から３段目となる支持部２１に搬出入可能である。 Similarly, when the shutter drive unit 16b opens the shutter 16a, the transfer robot 2a moves the robot arm 2b to a height position corresponding to the carry-in / out port 16 by the vertical movement device. Then, the substrate supported by the robot arm 2b can be carried in and out from the carry-in / out port 16 to the support portion 21 which is the third stage from the bottom.

昇降駆動部３０によって昇降軸２３を昇降する際には、チャンバ１０内でカセット２０が上下方向に移動可能な空間が形成されていることが必要である。
したがって、チャンバ１０の高さ寸法は、チャンバ１０内でカセット２０を上下方向に移動可能とする空間高さに規定される。
本実施形態では、複数の搬出入口１５，１６において、その高さ位置を上述するように設定したことで、チャンバ１０の高さ寸法を小さくできる。 When the elevating shaft 23 is moved up and down by the elevating drive unit 30, it is necessary that a space in which the cassette 20 can move in the vertical direction is formed in the chamber 10.
Therefore, the height dimension of the chamber 10 is defined as the space height that allows the cassette 20 to move in the vertical direction in the chamber 10.
In the present embodiment, the height dimension of the chamber 10 can be reduced by setting the height positions of the plurality of carry-in / out ports 15 and 16 as described above.

次に、基板をチャンバ１０に対して搬出入する動作について詳細に説明する。
本実施形態の基板処理装置１では、上述のように、ロボットアーム２ｂが、水平方向に移動して搬出入口１５、１６からチャンバ１０内に挿入可能とされ、かつ、カセット２０内において上昇または下降が可能とされている。また、制御部１００は、搬送ロボット２ａ及び昇降駆動部３０の動作を制御することができるようになっている。具体的には、制御部１００は、カセット２０内においてロボットアーム２ｂを下降させる場合は昇降機構によってカセット２０を上昇させ、カセット２０内においてロボットアーム２ｂを上昇させる場合は昇降機構によってカセット２０を下降させる。 Next, the operation of loading and unloading the substrate to and from the chamber 10 will be described in detail.
In the substrate processing device 1 of the present embodiment, as described above, the robot arm 2b moves horizontally so that it can be inserted into the chamber 10 from the carry-in / out ports 15 and 16, and rises or falls in the cassette 20. Is possible. Further, the control unit 100 can control the operations of the transfer robot 2a and the elevating drive unit 30. Specifically, the control unit 100 raises the cassette 20 by the elevating mechanism when lowering the robot arm 2b in the cassette 20, and lowers the cassette 20 by the elevating mechanism when raising the robot arm 2b in the cassette 20. Let me.

カセット２０内においてロボットアーム２ｂを下降させる場合とは、基板をカセット２０内に設置する場合である。この場合は、昇降機構によってカセット２０を上昇させることで、ロボットアーム２ｂに保持された基板と、カセット２０内に設置された支持部２１とを相互に接近させる。これにより、ロボットアーム２ｂの下降時の変位量を少なくする。 The case where the robot arm 2b is lowered in the cassette 20 is a case where the substrate is installed in the cassette 20. In this case, the cassette 20 is raised by the elevating mechanism so that the substrate held by the robot arm 2b and the support portion 21 installed in the cassette 20 are brought close to each other. As a result, the amount of displacement of the robot arm 2b when descending is reduced.

また、カセット２０内においてロボットアーム２ｂを上昇させる場合とは、基板をカセット２０から取り出す場合である。この場合は、昇降機構によってカセット２０を下降させることで、ロボットアーム２ｂに保持された基板と、カセット２０内に設置された支持部２１とを相互に離間させる接近させる。これにより、ロボットアーム２ｂの上昇時の変位量を少なくする。 The case where the robot arm 2b is raised in the cassette 20 is a case where the substrate is taken out from the cassette 20. In this case, the cassette 20 is lowered by the elevating mechanism so that the substrate held by the robot arm 2b and the support portion 21 installed in the cassette 20 are brought close to each other so as to be separated from each other. As a result, the amount of displacement of the robot arm 2b when ascending is reduced.

以下、図３及び図４を参照して、基板処理装置１の動作をより詳細に説明する。図３及び図４では、搬出入口１５に対する搬出入動作を説明するが、搬出入口１６に対する搬出入動作も同様である。 Hereinafter, the operation of the substrate processing apparatus 1 will be described in more detail with reference to FIGS. 3 and 4. Although the loading / unloading operation with respect to the loading / unloading port 15 will be described with reference to FIGS. 3 and 4, the same applies to the loading / unloading operation with respect to the loading / unloading port 16.

まず、図３に基づき、カセット２０から基板を搬出する動作を説明する。図３（ａ）は、チャンバ１０内のカセット２０の支持部２１に基板Ｋが載置されている状態を示す。基板Ｋは、チャンバ１０内において各種の処理が施された状態にある。支持部２１の上面には複数の基板支持ピン２１ｂが備えられており、基板支持ピン２１ｂの上に基板Ｋが載せられている。基板Ｋと支持部２１とは基板支持ピン２１ｂによって離間されており、基板Ｋと支持部２１との間にロボットアーム２ｂが挿入可能な空間が設けられている。なお、図３（ａ）には、上段側の支持部２１も図示している。チャンバ１０の側部１２ｅに設けられた搬出入口１５は開口されている。 First, the operation of carrying out the substrate from the cassette 20 will be described with reference to FIG. FIG. 3A shows a state in which the substrate K is placed on the support portion 21 of the cassette 20 in the chamber 10. The substrate K is in a state of being subjected to various treatments in the chamber 10. A plurality of substrate support pins 21b are provided on the upper surface of the support portion 21, and the substrate K is placed on the substrate support pins 21b. The substrate K and the support portion 21 are separated by a substrate support pin 21b, and a space into which the robot arm 2b can be inserted is provided between the substrate K and the support portion 21. Note that FIG. 3A also shows the support portion 21 on the upper stage side. The carry-in / out port 15 provided on the side portion 12e of the chamber 10 is open.

次に、図３（ｂ）に示すように、制御部１００の指令に基づき、搬出入口１５からロボットアーム２ｂをチャンバ１０内のカセット２０に挿入させる。ロボットアーム２ｂは、カセット２０内の支持部２１と基板Ｋとの間の空間、すなわち基板Ｋよりも低い位置に向けて水平方向から挿入させる。 Next, as shown in FIG. 3B, the robot arm 2b is inserted into the cassette 20 in the chamber 10 from the carry-in / out port 15 based on the command of the control unit 100. The robot arm 2b is inserted from the horizontal direction toward the space between the support portion 21 in the cassette 20 and the substrate K, that is, a position lower than the substrate K.

次に、図３（ｃ）に示すように、制御部１００の指令に基づき、ロボットアーム２ｂをカセット２０内で上昇させる。また、制御部１００の指令に基づき、昇降機構によりカセット２０を下降させる。ロボットアーム２ｂが上昇し、また、カセット２０が下降する間に、ロボットアーム２ｂと基板Ｋとが相互に接近して接触し、基板支持ピン２１ｂからロボットアーム２ｂに基板Ｋが受け渡される。そして、ロボットアーム２ｂに保持された基板Ｋは、基板保持ピン２１ａから離間される。 Next, as shown in FIG. 3C, the robot arm 2b is raised in the cassette 20 based on the command of the control unit 100. Further, the cassette 20 is lowered by the elevating mechanism based on the command of the control unit 100. While the robot arm 2b is raised and the cassette 20 is lowered, the robot arm 2b and the substrate K are in close contact with each other, and the substrate K is delivered from the substrate support pin 21b to the robot arm 2b. Then, the substrate K held by the robot arm 2b is separated from the substrate holding pin 21a.

次に、図３（ｄ）に示すように、制御部１００の指令に基づき、ロボットアーム２ｂを基板Ｋとともにチャンバ１０及びカセット２０から引き出す。ロボットアーム２ｂは、水平方向に引き出される。 Next, as shown in FIG. 3D, the robot arm 2b is pulled out from the chamber 10 and the cassette 20 together with the substrate K based on the command of the control unit 100. The robot arm 2b is pulled out in the horizontal direction.

次に、図４に基づき、カセット２１に基板を搬入する動作を説明する。
まず、図４（ａ）に示すように、制御部１００の指令に基づき、搬出入口１５からロボットアーム２ｂを基板Ｋとともにチャンバ１０のカセット２０内に挿入させる。ロボットアーム２ｂは、カセット２０内の支持部２１の上方の空間であって、基板Ｋの設置予定位置よりも上側の位置に向けて水平方向から挿入させる。 Next, the operation of carrying the substrate into the cassette 21 will be described with reference to FIG.
First, as shown in FIG. 4A, the robot arm 2b is inserted into the cassette 20 of the chamber 10 together with the substrate K from the carry-in / out port 15 based on the command of the control unit 100. The robot arm 2b is inserted in the space above the support portion 21 in the cassette 20 from the horizontal direction toward a position above the planned installation position of the substrate K.

次に、図４（ｂ）に示すように、制御部１００の指令に基づき、ロボットアーム２ｂを基板Ｋとともにカセット２０内で下降させる。また、制御部１００の指令に基づき、昇降機構によりカセット２０を上昇させる。ロボットアーム２ｂとともに基板Ｋが下降し、また、カセット２０が上昇する間に、基板Ｋと支持部２１が相互に接近して基板Ｋと基板保持ピン２１ａとが接触し、ロボットアーム２ｂから基板支持ピン２１ｂに基板Ｋが受け渡される。そして、ロボットアーム２ｂは基板Ｋから離間される。 Next, as shown in FIG. 4B, the robot arm 2b is lowered together with the substrate K in the cassette 20 based on the command of the control unit 100. Further, based on the command of the control unit 100, the cassette 20 is raised by the elevating mechanism. While the substrate K descends together with the robot arm 2b and the cassette 20 rises, the substrate K and the support portion 21 approach each other and the substrate K and the substrate holding pin 21a come into contact with each other to support the substrate from the robot arm 2b. The substrate K is delivered to the pin 21b. Then, the robot arm 2b is separated from the substrate K.

次に、図４（ｃ）に示すように、制御部１００の指令に基づき、チャンバ１０の搬出入口１５からロボットアーム２ｂを引き出す。ロボットアーム２ｂは、水平方向に引き出される。そして、図４（ｄ）に示すように、支持部２１の基板支持ピン２１ｂに載せられた基板Ｋに対して、各種の処理が開始される。 Next, as shown in FIG. 4C, the robot arm 2b is pulled out from the carry-in / out port 15 of the chamber 10 based on the command of the control unit 100. The robot arm 2b is pulled out in the horizontal direction. Then, as shown in FIG. 4D, various processes are started on the substrate K mounted on the substrate support pin 21b of the support portion 21.

次に、比較のため、従来の基板処理装置における動作について図５を参照して説明する。従来の基板処理装置では、ロボットアームのみがカセット内において上下動し、カセット自体は上下動しない構成とされている。従来の基板処理装置の動作は、基板をチャンバから取り出す動作のみについて説明する。 Next, for comparison, the operation in the conventional substrate processing apparatus will be described with reference to FIG. In the conventional substrate processing apparatus, only the robot arm moves up and down in the cassette, and the cassette itself does not move up and down. The operation of the conventional substrate processing apparatus describes only the operation of removing the substrate from the chamber.

図５（ａ）は、チャンバ内のカセット２２０の支持部２２１に基板Ｋが載置されている状態を示す。従来の基板処理装置では、図５（ｂ）に示すように、搬出入口２１５からロボットアーム２０２ｂをカセット内に挿入させる。ロボットアーム２０２ｂは、カセット２２０内の支持部２２１と基板Ｋとの間の空間、すなわち基板Ｋよりも低い位置に向けて水平方向から挿入させる。 FIG. 5A shows a state in which the substrate K is placed on the support portion 221 of the cassette 220 in the chamber. In the conventional substrate processing apparatus, as shown in FIG. 5B, the robot arm 202b is inserted into the cassette from the carry-in / out port 215. The robot arm 202b is inserted from the horizontal direction toward the space between the support portion 221 in the cassette 220 and the substrate K, that is, a position lower than the substrate K.

次に、図５（ｃ）に示すように、ロボットアーム２０２ｂを上昇させて、ロボットアーム２０２ｂを基板Ｋに接触させる。更にロボットアーム２０２ｂを上昇させることで、支持部２２１の基板支持ピン２２１ｂからロボットアーム２０２ｂに基板を受け渡す。 Next, as shown in FIG. 5C, the robot arm 202b is raised to bring the robot arm 202b into contact with the substrate K. Further, by raising the robot arm 202b, the substrate is delivered from the substrate support pin 221b of the support portion 221 to the robot arm 202b.

次いで、図５（ｄ）に示すように、基板Ｋが基板支持ピン２２１ｂから十分に離間された後、基板Ｋを保持したままのロボットアーム２０２ｂを、チャンバの搬出入口２１５から水平方向に引き出す。このようにして、カセット２２０から基板Ｋを搬出する。 Then, as shown in FIG. 5D, after the substrate K is sufficiently separated from the substrate support pin 221b, the robot arm 202b holding the substrate K is pulled out horizontally from the carry-in / out port 215 of the chamber. In this way, the substrate K is carried out from the cassette 220.

本実施形態の基板処理装置１のカセット２０内におけるロボットアーム２ｂの上昇時の変位または下降時の変位量（以下、変位量という）をΔＬ１とし、従来の基板処理装置におけるロボットアーム２０２ａの上昇時の変位量または下降時の変位量（変位量）をΔＬ２とすると、本実施形態の変位量ΔＬ１は、従来の変位量ΔＬ２に比べて小さくなる。これは、ロボットアーム２ｂが上昇または下降する際に、カセット２１がロボットアーム２ｂの動く方向とは逆方向に動くためである。このように、本実施形態では、ロボットアーム２ｂの変位量ΔＬ１が従来の変位量ΔＬ２よりも小さくなるため、搬出入口１５、１６の高さ方向の寸法を小さくすることができ、これにより、搬出入口１５、１６の開口面積を小さくすることができる。 The displacement of the robot arm 2b in the cassette 20 of the substrate processing device 1 of the present embodiment when ascending or the amount of displacement when descending (hereinafter referred to as the displacement amount) is set to ΔL 1, and the robot arm 202a in the conventional substrate processing apparatus rises. Assuming that the displacement amount at the time or the displacement amount (displacement amount) at the time of descent is ΔL 2 , the displacement amount ΔL 1 of the present embodiment is smaller than the conventional displacement amount ΔL 2 . This is because when the robot arm 2b moves up or down, the cassette 21 moves in the direction opposite to the direction in which the robot arm 2b moves. As described above, in the present embodiment, since the displacement amount ΔL 1 of the robot arm 2b is smaller than the conventional displacement amount ΔL 2 , the dimensions of the carry-in / out ports 15 and 16 in the height direction can be reduced. , The opening area of the carry-in / out ports 15 and 16 can be reduced.

以上説明したように、本実施形態の基板処理装置１によれば、制御部１００が、カセット２０内においてロボットアーム２ｂを下降させる場合はカセット２０を上昇させ、カセット２０内においてロボットアーム２ｂを上昇させる場合はカセット２０を下降させるので、従来の基板搬送装置に比べて、基板Ｋをチャンバ１０に搬出入する際のロボットアーム２ｂの上昇時の変位量及び下降時の変位量を小さくすることができ、これにより、搬出入口１５、１６の開口面積を小さくすることができる。これにより、チャンバ１０の搬出入口１５、１６の開閉機構に対する熱負荷を軽減することができ、チャンバ１０のメンテナンス頻度を少なくして、基板処理の生産性を向上させることができる。 As described above, according to the substrate processing device 1 of the present embodiment, when the control unit 100 lowers the robot arm 2b in the cassette 20, it raises the cassette 20 and raises the robot arm 2b in the cassette 20. Since the cassette 20 is lowered in the case of lowering the cassette 20, the amount of displacement of the robot arm 2b when the robot arm 2b is carried in and out of the chamber 10 and the amount of displacement when the robot arm 2b is lowered can be made smaller than those of the conventional board transfer device. This makes it possible to reduce the opening area of the carry-in / out ports 15 and 16. As a result, the heat load on the opening / closing mechanism of the loading / unloading ports 15 and 16 of the chamber 10 can be reduced, the maintenance frequency of the chamber 10 can be reduced, and the productivity of substrate processing can be improved.

また、本実施形態の基板処理装置１によれば、カセット２１から基板Ｋを搬出する動作として、制御部１００が、ロボットアーム２ｂをカセット２０内に挿入させた後に、ロボットアーム２ｂを上昇させて基板Ｋの下から持ち上げるとともに、昇降機構によってカセット２０を下降させるので、従来の基板搬送装置に比べてロボットアーム２ｂの上昇時の変位量を小さくすることができる。これにより、搬出入口１５、１６の開口面積を小さくすることでき、また、基板Ｋの搬出時間を短縮することもできる。 Further, according to the substrate processing device 1 of the present embodiment, as an operation of carrying out the substrate K from the cassette 21, the control unit 100 inserts the robot arm 2b into the cassette 20 and then raises the robot arm 2b. Since the cassette 20 is lowered by the elevating mechanism while being lifted from under the substrate K, the amount of displacement of the robot arm 2b when ascending can be reduced as compared with the conventional substrate transport device. As a result, the opening areas of the carry-out ports 15 and 16 can be reduced, and the carry-out time of the substrate K can be shortened.

また、本実施形態の基板処理装置１によれば、カセット２１に基板Ｋを搬入する動作として、制御部１００が、基板Ｋを保持したロボットアーム２ｂをカセット２０内に挿入させた後に、ロボットアーム２ｂを下降させて基板Ｋをカセット２０内に載置するとともに、昇降機構によってカセット２０を上昇させるので、従来の基板搬送装置に比べてロボットアーム２ｂの下降時の変位量を小さくすることができる。これにより、搬出入口１５、１６の開口面積を小さくすることでき、また、基板Ｋの搬入時間を短縮することもできる。 Further, according to the substrate processing device 1 of the present embodiment, as an operation of carrying the substrate K into the cassette 21, the control unit 100 inserts the robot arm 2b holding the substrate K into the cassette 20, and then the robot arm. Since the substrate K is placed in the cassette 20 by lowering 2b and the cassette 20 is raised by the elevating mechanism, the amount of displacement of the robot arm 2b during lowering can be reduced as compared with the conventional substrate transport device. .. As a result, the opening areas of the carry-in / out ports 15 and 16 can be reduced, and the carry-in time of the substrate K can be shortened.

１…基板処理装置、２ａ…搬送ロボット、２ｂ…ロボットアーム、１２ｅ…側面部、１５、１６…搬出入口、１０…チャンバ、２０…カセット、１００…制御部、Ｋ…基板。 1 ... Substrate processing device, 2a ... Transfer robot, 2b ... Robot arm, 12e ... Side surface, 15, 16 ... Carry-in / out port, 10 ... Chamber, 20 ... Cassette, 100 ... Control unit, K ... Substrate.

Claims (3)

複数枚の基板を多段に収納するカセットと、
前記カセットを密閉可能に収納するチャンバと、
前記カセットを前記チャンバ内で昇降させる昇降機構と、
前記基板を前記カセットに対して搬出入する搬送ロボットと、
前記昇降機構及び前記搬送ロボットの動作を制御する制御部と、を備え、
前記チャンバの側面部には、前記基板を前記カセットに搬出入する際に開口する搬出入口が設けられ、
前記搬送ロボットには、前記基板が載置されるロボットアームが備えられ、
前記ロボットアームは、水平方向に移動して前記搬出入口から前記カセット内に挿入可能とされ、かつ、前記カセット内において上昇または下降が可能とされ、
前記制御部は、前記カセット内において前記ロボットアームを下降させる場合は前記昇降機構によって前記カセットを上昇させ、前記カセット内において前記ロボットアームを上昇させる場合は前記昇降機構によって前記カセットを下降させることを特徴とする基板処理装置。 A cassette that stores multiple boards in multiple stages,
A chamber that houses the cassette so that it can be sealed,
An elevating mechanism that elevates and elevates the cassette in the chamber,
A transfer robot that carries in and out the substrate to and from the cassette,
The elevating mechanism and the control unit for controlling the operation of the transfer robot are provided.
The side surface of the chamber is provided with a carry-in / out port that opens when the substrate is carried in / out of the cassette.
The transfer robot is provided with a robot arm on which the substrate is placed.
The robot arm can move in the horizontal direction and can be inserted into the cassette from the carry-in / out port, and can be raised or lowered in the cassette.
When the robot arm is lowered in the cassette, the control unit raises the cassette by the elevating mechanism, and when raising the robot arm in the cassette, the control unit lowers the cassette by the elevating mechanism. A featured substrate processing device. 前記カセットから前記基板を搬出する動作として、前記制御部は、前記チャンバの前記搬出入口から前記ロボットアームを前記カセット内に挿入させ、次いで、前記ロボットアームを上昇させて前記基板を下から持ち上げるとともに、前記昇降機構によって前記カセットを下降させ、次いで、前記ロボットアームを前記カセットから引き抜かせることを特徴とする請求項１に記載の基板処理装置。 As an operation of carrying out the board from the cassette, the control unit inserts the robot arm into the cassette from the carry-out port of the chamber, and then raises the robot arm to lift the board from below. The substrate processing apparatus according to claim 1, wherein the cassette is lowered by the elevating mechanism, and then the robot arm is pulled out from the cassette. 前記カセットに前記基板を搬入する動作として、前記制御部は、前記チャンバの前記搬出入口から、前記基板を保持した前記ロボットアームを前記カセット内に挿入させ、次いで、前記ロボットアームを下降させて前記基板を前記カセット内に載置するとともに、前記昇降機構によって前記カセットを上昇させ、次いで、前記ロボットアームを前記カセットから引き抜かせることを特徴とする請求項１に記載の基板処理装置。 As an operation of carrying the substrate into the cassette, the control unit inserts the robot arm holding the substrate into the cassette from the carry-in / out port of the chamber, and then lowers the robot arm to obtain the robot arm. The substrate processing apparatus according to claim 1, wherein the substrate is placed in the cassette, the cassette is raised by the elevating mechanism, and then the robot arm is pulled out from the cassette.
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