JP2001044270A - Semiconductor manufacturing device and carrying method for semiconductor substrate thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate generation of the problems where wafers come into contact with wafer carrying arms in a wafer cassette, the surfaces of the wafers are marred, and dusts are generated. SOLUTION: A wafer cassette is constituted of an odd numbered stage slot cassette 2 and an even numbered stage slot cassette 3, which respectively have a slot in each other stage. The cassette 2 and the cassette 3 are moved individually in the vertical directions by a cassette vertically driving motor 7 and an even numbered stage slot cassette vertically driving cylinder 8 to temporarily expand the pitch between the slots 12, and in short, the intervals between the slots 12 and a housing of wafers 1 in the cassette 2 or the cassette 3 and removing of the wafers 1 from the cassette 2 or the cassette 3 are performed by wafer carrying arms 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus and a semiconductor substrate transfer method, and more particularly to a wafer transfer mechanism provided with a plurality of slots (shelf-stage) type semiconductor substrate (hereinafter referred to as "wafer") cassettes. The present invention relates to the wafer transfer method.

[0002]

2. Description of the Related Art A wafer transfer mechanism provided with a multi-slot type wafer cassette and a wafer transfer method thereof (conventional example 1) of a conventional semiconductor manufacturing apparatus are shown in FIG. This will be described with reference to an operation explanatory diagram of the mechanism. As shown in FIG. 5, the wafer transfer mechanism includes an integrated wafer cassette 11 having a plurality of slots (shelf steps) 12 for accommodating the wafer 1 and having a fixed pitch (interval) between the slots 12. The support guide 10 is supported by the cassette drive fixing section 6 of the apparatus main body. In this state, the wafer cassette 11 has a structure in which the cassette vertical drive ball screw 5 is rotated by the cassette vertical drive motor 7 so as to move in the vertical direction and stop at an arbitrary position set in advance. This structure is referred to as a cassette vertical drive unit 13a). Then, a wafer transfer arm 4 that is inserted into the wafer cassette 11 and transfers the wafer 1 is provided.

Next, the wafer transfer operation will be described with reference to FIG. 6. When the wafer 1 stored in the wafer cassette 11 is taken out, as shown in FIG. Slot No2
The wafer cassette 11 is moved up and down by the cassette up / down drive motor 7 and stopped so that the wafer 1c of 4) and the wafer 1a of the slot 12 (for example, slot No. 23) immediately below the wafer 1c are located almost in the middle. And
The wafer transfer arm 4 is inserted into the wafer cassette 11.

[0006] As shown in FIG. 6 (b), the wafer cassette 11 is moved down by the cassette vertical drive motor 7 to transfer (load) the wafer 1 c to the wafer transfer arm 4. Then, the wafer transfer arm 4 on which the wafer 1c is placed
Is pulled out of the wafer cassette 11 to complete the operation of taking out the wafer 1c.

On the other hand, when the wafer 1 is stored in the wafer cassette 11, the wafer transfer arm 4 on which the wafer 1c is placed is moved to the wafer cassette 1 in the state shown in FIG.
Insert into 1. Then, as shown in FIG. 6A, the wafer cassette 11 is raised by the cassette up / down drive motor 7 and is placed and stored in the slot 12 (for example, slot No. 24) for storing the wafer 1c. Then, by pulling out the wafer transfer arm 4 from the inside of the wafer cassette 11, the storing operation of the wafer 1c is completed. With this transfer method, the transfer of the wafer 1 in another slot 12 is performed in the same manner.

As another prior art (conventional example 2), there is a semiconductor manufacturing apparatus shown in a sectional view of FIG. This is different from the conventional example 1 in that a carrier type wafer cassette 11a for storing the wafer 1 is used, the wafer cassette 11a is mounted on the cassette stage 14, and the cassette vertical drive motor 7a moves the wafer cassette 11a in the vertical direction. A stepping motor is used (this structure is referred to as a cassette vertical drive unit 13b), and an optical sensor 15 for detecting a wafer is provided at the tip of a wafer transfer arm 4 for transferring the wafer 1. .

The position of the wafer 1 is determined by the number of steps of the stepping motor by an optical sensor 15 provided at the tip of the wafer transfer arm 4 for detecting a wafer and a stepping motor as a cassette vertical drive motor 7a. Remember. Then, an intermediate step number (position) between the two wafers 1 is calculated, and the operation of inserting the wafer transfer arm 4 at that position is performed.

[0008]

The wafer transfer mechanism and the wafer transfer method of the above-described conventional (both Conventional Example 1 and Conventional Example 2) semiconductor manufacturing apparatuses are particularly suitable for use in a load lock chamber (for example, a vacuum lock chamber) using a vacuum chamber. Due to restrictions on the storage space of the wafer cassette (11 or 11a) and the storage space of the cassette vertical drive unit (13a or 13b) such as the wafer transfer mechanism of the semiconductor manufacturing apparatus installed in the
If the interval (pitch) between the slots 12 of the wafer cassette 11 or 11a cannot be increased and is fixed, the wafer transfer arm 4 or the cassette vertical drive unit 13
The problem that the wafer 1 stored in the wafer cassette 11 or 11a comes into contact with the inserted wafer transfer arm 4 due to a slight displacement or inclination of the wafer a or 13b, thereby damaging or dusting the surface of the wafer 1 Occurs.

In the conventional example 2, although the position of the wafer 1 is detected by the optical sensor 15 provided at the tip of the wafer transfer arm 4, this problem similarly occurs.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a semiconductor manufacturing apparatus and a semiconductor substrate transfer apparatus which do not cause a problem that a wafer and a wafer transfer arm come into contact with each other in a wafer cassette and cause damage or dust generation on the wafer surface. It is to provide a method.

[0011]

According to the present invention, there is provided a semiconductor manufacturing apparatus comprising: a semiconductor substrate cassette for storing a semiconductor substrate; a semiconductor substrate storing and extracting means for storing and extracting the semiconductor substrate in the semiconductor substrate cassette; In a semiconductor manufacturing apparatus having a semiconductor substrate transport mechanism configured by a semiconductor substrate cassette vertical moving means for vertically moving the semiconductor substrate cassette to store and take out the semiconductor substrate at a predetermined position of the cassette,
The semiconductor substrate cassette is characterized by comprising an odd-numbered slot cassette and an even-numbered slot cassette each having a plurality of slots each of which is a plurality of shelves for accommodating the semiconductor substrate.

The semiconductor substrate cassette vertical moving means is provided in each of the odd-numbered slot cassette and the even-numbered slot cassette.

The odd-numbered slot cassette or the even-numbered slot cassette is connected to the other slot cassette via the semiconductor substrate cassette vertical moving means provided in one of the slot cassettes.

The means for vertically moving the semiconductor substrate cassette is provided in either the odd-numbered slot cassette or the even-numbered slot cassette.

The means for vertically moving the semiconductor substrate cassette comprises a servomotor and a ball screw.

According to the semiconductor substrate transfer method of the present invention, the semiconductor substrate transfer mechanism of the semiconductor manufacturing apparatus moves the semiconductor substrate cassette for housing the semiconductor substrate to a predetermined position in the vertical direction by the semiconductor substrate cassette vertical moving means. In the semiconductor substrate transport method for storing and removing the semiconductor substrate from the semiconductor substrate cassette by the substrate storing and removing means, when transporting the semiconductor substrate, a plurality of shelves of the semiconductor substrate cassette, which are slots for storing the semiconductor substrate, are provided. Temporarily increase the pitch, or interval,
The semiconductor substrate transfer arm stores and retrieves the semiconductor substrate in the semiconductor substrate cassette.

Further, the semiconductor substrate cassette comprises an odd-numbered slot cassette and an even-numbered slot cassette each having the slots at every other level, and the odd-numbered slot cassette and the even-numbered slot cassette are individually moved vertically. To temporarily increase the pitch of the slot.

According to the present invention, when transferring a semiconductor substrate, the pitch, that is, the interval between the slots, which are a plurality of shelves for storing the semiconductor substrates of the semiconductor substrate cassette, is temporarily enlarged, and the semiconductor substrate transfer arm is provided. The semiconductor substrate is stored in and taken out of the semiconductor substrate cassette.

[0019]

Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a first embodiment of the invention.
2 and FIG. 3 show the first embodiment of FIG.
It is an operation explanatory view showing the operation of the embodiment.

As shown in FIG. 1, the wafer transfer mechanism of the semiconductor manufacturing apparatus of
The slot cassette 2 includes an odd-numbered slot cassette 2 and an even-numbered slot cassette 3, each of which has a plurality of slots (shelf steps) 12 for storing every other row. The pitch (interval) of each slot 12 of the odd-numbered slot cassette 2 and the even-numbered slot cassette 3 is fixed.

The odd-numbered slot cassette 2 is supported on a cassette drive fixing section 6 of the apparatus main body by a cassette support guide 10. In this state, the odd-numbered slot cassette 2 has a structure in which the cassette up-down drive ball screw 5 is rotated by the cassette up-down drive motor 7 to move up and down and stop at an arbitrary preset position. I have.

Here, as the cassette vertical drive motor 7,
The odd-numbered slot cassette 2 is positioned by using a DC servomotor based on the positioning accuracy and by the rotation speed of the DC servomotor. A pulse motor may be used as the cassette vertical drive motor 7, and the odd-numbered slot cassette 2 may be positioned by the number of pulses of the pulse motor.

The even-numbered slot cassette 3 is connected to one end of the odd-numbered slot cassette 2 by an even-numbered slot cassette support guide 9, and is driven by an even-numbered slot cassette vertical drive cylinder 8.
Is moved in the up-down direction relative to.

Here, the cylinder 8 driven by compressed air or the like (vertical drive of the even-numbered slot cassette) is used for the vertical drive of the even-numbered slot cassette 3, but similarly to the cassette vertical drive motor 7 and the cassette vertical drive ball screw 5. If a motor and a ball screw are used, a more accurate positioning operation can be performed.

Further, a wafer transfer arm 4 is provided which is inserted into the odd-numbered slot cassette 2 and the even-numbered slot cassette 3, and stores, takes out and transfers the wafer 1.

Here, the wafer transfer arm 4 is driven by a cylinder (not shown).

Next, the wafer transfer operation of the wafer transfer mechanism of the semiconductor manufacturing apparatus according to the present embodiment will be described with reference to FIG. First, FIG. 2 shows a case in which the wafer 1 stored in the slot 12 of the odd-numbered slot cassette 2 is transferred, and is a diagram in which, for example, the wafer 1a in the slot No. 23 is transferred. When taking out the wafer 1a in the slot No. 23 stored in the odd-numbered slot cassette 2,
As shown in FIG. 2A, the even-numbered slot cassette vertical drive cylinder 8 is lowered (shrinked) to lower the even-numbered slot cassette 3, and the wafer 1a of the slot No. 23 to be taken out and the wafer 1b of the slot No. 22 immediately below are taken out. Increase the interval. In this state, the odd-numbered slot cassette 2 is moved up and down while the even-numbered slot cassette 3 is connected to one end by the cassette up / down driving motor 7 so that the wafer transfer arm 4 is located at a substantially middle position of the gap. Move in the direction to stop. Then, the wafer transfer arm 4 is inserted into the odd-numbered slot cassette 2 (and the even-numbered slot cassette 3).

Then, as shown in FIG. 2B, the odd-numbered slot cassette 2 is moved down by the cassette vertical drive motor 7 to transfer (load) the wafer 1a to the wafer transfer arm 4. At the same time, the even-numbered slot cassette vertical drive cylinder 8 is raised (extended) by the amount by which the odd-numbered slot cassette 2 is lowered (that is, slot No. 2).
(The position-height of the wafer 1b stored in the wafer 2 does not change.)

Then, the wafer transfer arm 4 on which the wafer 1a is mounted is pulled out from the odd-numbered slot cassette 2 (and the even-numbered slot cassette 3), whereby the wafer 1
The take-out operation of a is completed.

When the wafers 1 are to be stored in the slots 12 of the odd-numbered slot cassette 2, the reverse is true.
In the state shown in (b), the wafer transfer arm 4 on which the wafer 1a is placed is inserted into the odd-numbered slot cassette 2 (and the even-numbered slot cassette 3). Then, as shown in FIG. 2 (a), the odd-numbered slot cassette 2 is raised by the cassette up / down drive motor 7, and is placed and stored in the slot 12 (slot No. 23) for storing the wafer 1a. At the same time, the vertical drive cylinder 8 of the even-numbered slot cassette is lowered (reduced) by the amount by which the odd-numbered slot cassette 2 is raised (that is, the position-height of the wafer 1b stored in the slot No. 22 does not change).

Then, by pulling the wafer transfer arm 4 out of the odd-numbered slot cassette 2 (and the even-numbered slot cassette 3), the storing operation of the wafer 1a is completed. With this transport method, the other odd-numbered slot cassette 2
The transfer of the wafer 1 in the slot 12 is similarly performed.

Next, FIG. 3 shows a case where the wafer 1 stored in the slot 12 of the even-numbered slot cassette 3 is transferred, for example, a case where the wafer 1c in the slot No. 24 is transferred. To take out the wafer 1c in the slot No. 24 stored in the even-numbered slot cassette 3, as shown in FIG. 3A, raise (extend) the even-numbered slot cassette vertical drive cylinder 8 to extend the even-numbered slot cassette. 3 to raise and take out slot N
The space between the wafer 1c of o24 and the wafer 1a of the slot No23 immediately below is widened. In this state, the cassette vertical drive motor 7 drives the even-numbered slot cassette 3 so that the wafer transfer arm 4 is at a position substantially in the middle of the gap.
The odd-numbered slot cassette 2 is moved up and down and stopped in a state where is connected to one end. Then, the wafer transfer arm 4 is inserted into the even-numbered slot cassette 3 (and the odd-numbered slot cassette 2).

Then, as shown in FIG. 3B, the even-numbered slot cassette vertical drive cylinder 8 is lowered (contracted), and the wafer 1c is transferred (placed) to the wafer transfer arm 4. (At this time, the position-height of the wafer 1a stored in the slot No. 23 of the odd-numbered slot cassette 2 does not change.)

Then, the wafer transfer arm 4 on which the wafer 1c is placed is pulled out of the even-numbered slot cassette 3 (and the odd-numbered slot cassette 2), whereby the wafer 1
The take-out operation of c is completed.

When the wafers 1 are stored in the slots 12 of the even-numbered slot cassette 3, the reverse is true.
In the state shown in (b), the wafer transfer arm 4 on which the wafer 1c is placed is inserted into the even-numbered slot cassette 3 (and the odd-numbered slot cassette 2). Then, as shown in FIG. 3 (a), the even-numbered slot cassette vertical drive cylinder 8 is raised (extended) and placed in the slot 12 (slot No. 24) for storing the wafer 1c. (At this time, the slot number of the odd-numbered slot cassette 2
(The position-height of the wafer 1a stored in 23 does not change.)

Then, when the wafer transfer arm 4 is pulled out from the even-numbered slot cassette 3 (and the odd-numbered slot cassette 2), the storing operation of the wafer 1c is completed. With this transport method, the other even-numbered slot cassette 3
The transfer of the wafer 1 in the slot 12 is similarly performed.

FIG. 4 is a block diagram showing a second embodiment of the present invention. As shown in FIG. 4, the wafer transfer mechanism of the semiconductor manufacturing apparatus of the present embodiment is different from the first embodiment shown in FIG. 1 in that the odd-numbered slot cassette 2 is fixed to the cassette drive fixing section 6 of the apparatus main body. I have. The even-numbered slot cassette 3 is supported by the cassette drive fixing portion 6 of the apparatus main body by an even-numbered slot cassette support guide 9, and is configured to be independently moved vertically by the even-numbered slot cassette vertical drive cylinder 8. I have. The wafer transfer arm 4a has a structure in which the wafer transfer arm 4a is inserted into or pulled out of the wafer cassette and is also moved vertically.

Here, the vertical movement of the wafer transfer arm 4a is driven by a DC servomotor (not shown) according to its positioning accuracy.

Next, the wafer transfer operation of the wafer transfer mechanism of the semiconductor manufacturing apparatus according to the present embodiment will be described with reference to FIG. FIG. 4 shows a case in which the wafer 1 stored in the slot 12 of the odd-numbered slot cassette 2 is transported, and is a diagram in which, for example, the wafer 1a in the slot No. 23 is transported. To take out the wafer 1a in the slot No. 23 stored in the odd-numbered slot cassette 2, FIG.
As shown in (a), the even-numbered slot cassette vertical drive cylinder 8 is lowered (contracted) to lower the even-numbered slot cassette 3, and the distance between the wafer 1a in the slot No. 23 to be taken out and the wafer 1b in the slot No. 22 immediately below is taken out. Spread out. Then, in this state, the wafer transfer arm 4a is moved up and down and stopped so that the wafer transfer arm 4a is located at a substantially middle position of the gap. Then, the wafer transfer arm 4a is inserted into the odd-numbered slot cassette 2 (and the even-numbered slot cassette 3).

Then, the wafer transfer arm 4a is raised, and the wafer 1a is moved (placed) on the wafer transfer arm 4a. At the same time, the even-numbered slot cassette vertical drive cylinder 8 is raised (extended) by the amount by which the wafer transfer arm 4a is raised, and the even-numbered slot cassette 3 is raised (that is, the wafer 1 stored in the slot No. 22).
The distance between b and the wafer transfer arm 4a does not change.)

Then, the wafer transfer arm 4a on which the wafer 1a is mounted is pulled out from the odd-numbered slot cassette 2 (and the even-numbered slot cassette 3), whereby the unloading operation of the wafer 1a is completed.

On the other hand, when the wafers 1 are stored in the slots 12 of the odd-numbered slot cassettes 2, the upper and lower drive cylinders 8 of the even-numbered slot cassettes are raised (extended), and the even-numbered slot cassettes 3 are raised and stored. Wafer 1c of slot No. 23 and slot No. 24 immediately above
To increase the interval. Then, in this state, the wafer transfer arm 4a on which the wafer 1a is mounted is moved up and down and stopped so that the wafer transfer arm 4a is located substantially at the center of the gap. Then, the wafer transfer arm 4a carrying the wafer 1a is inserted into the odd-numbered slot cassette 2 (and the even-numbered slot cassette 3).

Then, as shown in FIG. 4, the wafer transfer arm 4a on which the wafer 1a is
Is placed on the slot 12 (slot No. 23) for storage. At the same time, the even-numbered slot cassette vertical drive cylinder 8 is lowered (shrinked) by the amount of lowering of the wafer transfer arm 4a, and the even-numbered slot cassette 3 is lowered (that is, the wafer 1 stored in the slot No. 24).
The distance between c and the wafer transfer arm 4a does not change.)

Then, the wafer transfer arm 4a is moved to the odd-numbered slot cassette 2 (and the even-numbered slot cassette 3).
When the wafer 1a is pulled out from the inside, the storing operation of the wafer 1a is completed. With this transfer method, the transfer of the wafers 1 in the slots 12 of the other odd-numbered slot cassettes 2 is similarly performed.

The same operation is performed when the wafers 1 stored in the slots 12 of the even-numbered slot cassette 3 are transferred. That is, the combination of the vertical movement of the even-numbered slot cassette vertical drive cylinder 8 and the vertical movement of the wafer transfer arm 4a allows the wafer 1 (slot 12) to be taken out or stored when the wafer transfer arm 4a is inserted or pulled out. The distance between the wafer 1 (slot 12) immediately above and below the wafer 1 is increased so that the position of the wafer transfer arm 4a is substantially in the middle of the gap (interval).

[0046]

As described above, according to the present invention, a mechanism for temporarily expanding the pitch (interval) of the target slot of the wafer cassette during the transfer of a wafer is provided, and the size of the wafer cassette is almost increased. Gap (interval) between the wafer transfer arm and the wafer (slot) in the wafer cassette without increasing the vertical movement stroke of the wafer cassette and the wafer transfer arm.
, The displacement and inclination of the wafer transfer arm or the cassette vertical drive unit can be absorbed, and the effect of preventing contact between the wafer and the wafer transfer arm in the wafer cassette can be obtained. As a result, it is possible to prevent the generation of scratches and dust on the wafer surface. In particular, the pitch (interval) of the slots of the wafer cassette cannot be increased due to the limitation of the storage space of the wafer cassette and the storage space of the cassette vertical drive unit such as the wafer transfer mechanism of a semiconductor manufacturing apparatus installed in a load lock chamber using a vacuum chamber. It is effective in the case.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a first embodiment of a semiconductor manufacturing apparatus and a semiconductor substrate transport method thereof according to the present invention.

FIG. 2 is an operation explanatory diagram showing an operation of the first embodiment of FIG. 1;

FIG. 3 is an operation explanatory diagram showing another operation of the first embodiment of FIG. 1;

FIG. 4 is a configuration diagram showing a second embodiment of the present invention.

FIG. 5 is a configuration diagram illustrating a conventional technique.

FIG. 6 is an operation explanatory diagram for explaining the operation of the conventional technique of FIG. 5;

FIG. 7 is a cross-sectional view illustrating another related art.

[Explanation of symbols]

1, 1a, 1b, 1c Wafer 2 Odd-numbered slot cassette 3 Even-numbered slot cassette 4, 4a Wafer transfer arm 5 Cassette vertical drive ball screw 6 Cassette drive fixing unit 7 Cassette vertical drive motor 7a Cassette vertical drive motor (stepping motor) 8 Even number Step slot cassette vertical drive cylinder 9 Even number slot slot cassette support guide 10 Cassette support guide 11 Wafer cassette (integrated type) 11a Wafer cassette (carrier type) 12 Slot (shelf level) 13a, 13b Cassette vertical drive section 14 Cassette stage 15 Optical sensor

Claims (7)

[Claims] A semiconductor substrate cassette for accommodating a semiconductor substrate; a semiconductor substrate accommodating / extracting means for accommodating / extracting the semiconductor substrate in / from the semiconductor substrate cassette; and a semiconductor substrate accommodating / extracting at a predetermined position in the semiconductor substrate cassette. A semiconductor substrate transport mechanism configured to move the semiconductor substrate cassette vertically in order to perform the semiconductor substrate cassette. In the semiconductor manufacturing apparatus, the semiconductor substrate cassette includes a plurality of shelf stages for storing the semiconductor substrates. A semiconductor manufacturing apparatus comprising an odd-numbered slot cassette and an even-numbered slot cassette each having a slot at every other stage. 2. The semiconductor manufacturing apparatus according to claim 1, wherein said semiconductor substrate cassette vertical moving means is provided in each of said odd-numbered slot cassette and said even-numbered slot cassette. 3. The slot cassette of the odd-numbered stage or the slot cassette of the even-numbered stage is connected to the other slot cassette via the semiconductor substrate cassette vertical moving means provided in one of the slot cassettes. Semiconductor manufacturing equipment. 4. The semiconductor manufacturing apparatus according to claim 1, wherein said semiconductor substrate cassette vertical moving means is provided in either said odd-numbered slot cassette or said even-numbered slot cassette. 5. The semiconductor manufacturing apparatus according to claim 1, wherein said semiconductor substrate cassette vertical moving means is formed by a servomotor and a ball screw. 6. A semiconductor substrate transport mechanism of a semiconductor manufacturing apparatus, wherein a semiconductor substrate cassette accommodating a semiconductor substrate is moved vertically to a predetermined position by a semiconductor substrate cassette up / down moving means, and said semiconductor substrate cassette is taken out by a semiconductor substrate accommodating / unloading means. In the semiconductor substrate transfer method for storing and taking out the semiconductor substrate in the substrate cassette, when transferring the semiconductor substrate, the pitch, that is, the interval of the plurality of shelf slots for storing the semiconductor substrate in the semiconductor substrate cassette is temporarily changed. A method for transporting a semiconductor substrate, comprising enlarging and storing the semiconductor substrate in the semiconductor substrate cassette by a semiconductor substrate transport arm. 7. The semiconductor substrate cassette comprises an odd-numbered slot cassette and an even-numbered slot cassette each having the slot at every other level, and individually moves the odd-numbered slot cassette and the even-numbered slot cassette in the vertical direction. 7. The method according to claim 6, wherein the pitch of the slots is temporarily increased by using the method.