CN113097113B - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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Publication number
CN113097113B
CN113097113B CN202011201480.XA CN202011201480A CN113097113B CN 113097113 B CN113097113 B CN 113097113B CN 202011201480 A CN202011201480 A CN 202011201480A CN 113097113 B CN113097113 B CN 113097113B
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Prior art keywords
substrate
turntable
chamber
ring
chambers
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CN202011201480.XA
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Chinese (zh)
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CN113097113A (en
Inventor
吴俊昊
朴永秀
柳守烈
金学杜
孙侐主
朴商弼
许成壹
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STI Co Ltd
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STI Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention aims to provide a substrate processing device capable of stably transferring substrates among a plurality of chambers. The substrate processing apparatus of the present invention for realizing this comprises: a plurality of chambers arranged at predetermined intervals in a circumferential direction for processing a substrate; a turntable provided to rotate in order to transfer the substrate between the plurality of chambers, wherein at least one chamber of the plurality of chambers is provided with a stage on which the substrate is placed and a stage driving part that provides a driving force for lifting and lowering the stage in an up-down direction, the turntable comprising: a turntable main body which is lifted and rotated by the turntable driving part; an annular turntable ring is provided so as to be separable from the turntable body in a state of being placed on the turntable body.

Description

Substrate processing apparatus
Technical Field
The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of stably transferring a substrate.
Background
In general, in a semiconductor process, a substrate processing process is performed under various conditions such as heating or cooling a substrate in a chamber isolated from the outside, and a substrate processing apparatus for performing the substrate processing process is being developed.
The substrate processing apparatus arranges a plurality of chambers in a circular shape, and is equipped with a turntable for transferring substrates between the respective chambers in order to sequentially transfer the substrates loaded inside the chambers to the respective chambers.
Such a conventional substrate processing apparatus is described in detail in korean patent No. 10-1796647.
The turntable described in the prior art is composed of a plurality of arms formed radially and a substrate support portion for supporting a substrate on the bottom surface of the end portion of the arms.
However, according to the turntable of such a structure, there is a problem in that the substrate becomes unstable during transfer with the turntable.
Disclosure of Invention
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate processing apparatus capable of stably transferring a substrate between a plurality of chambers.
The substrate processing apparatus according to the present invention for achieving the above object comprises: a plurality of chambers arranged at predetermined intervals in a circumferential direction for processing a substrate; a turntable provided to rotate in order to transfer the substrate between the plurality of chambers, at least one of the plurality of chambers being provided with a stage on which the substrate is placed and a stage driving part that provides a driving force for lifting and lowering the stage in an up-down direction, the turntable comprising: a turntable main body which is lifted and rotated by the turntable driving part; an annular turntable ring is provided so as to be separable from the turntable body in a state of being placed on the turntable body.
The first chamber for loading and unloading the substrate among the plurality of chambers includes a first space for loading and unloading the substrate at an upper portion thereof and a second space formed at a lower portion of the first space, the loading and unloading of the substrate is performed in a state where the first space and the second space are isolated from each other, and if the stage and the turntable ring are moved together in an upward direction by the stage driving part, the first space and the second space can be isolated by the turntable ring being closely attached to a sheet portion provided at a boundary of the first space and the second space.
A ring separating member may be provided, which applies a downward force to the turntable ring when the table is lowered by the table driving part in a state where the turntable ring is abutted against the sheet part.
The ring separating member may have a lower end portion penetrating the sheet portion in an up-down direction, and the penetrated lower end portion may contact an upper surface of the rotor ring to apply the downward force.
A first sealing member for maintaining air tightness is provided between the upper surface of the turntable ring and the thin sheet portion, and a second sealing member for maintaining air tightness may be provided between the bottom surface of the turntable ring and the upper surface of the edge position portion of the platform.
The plurality of chambers includes: a first chamber for loading and unloading the substrate; and a plurality of heat treatment chambers for transferring the substrate loaded in the first chamber and sequentially performing heat treatment on the substrate loaded in the first chamber, wherein the heat-treated substrate may be transferred to the first chamber to be cooled and then unloaded.
Each of the plurality of heat treatment chambers may be respectively provided with a partition wall that moves in order to isolate or communicate the respective chamber internal space with the space of the other chamber during the treatment of the substrate transferred to the inside of the respective chamber.
The partition wall is provided to be lifted up and down, and is lowered to be connected to an upper surface of the turntable ring located in each of the plurality of heat treatment chambers, and a bottom surface of the turntable ring is contacted and supported by a turntable ring support portion.
According to the present invention, the turntable ring is provided so as to be separable from the turntable body, and the substrate is transferred while being supported by the turntable ring, whereby the substrate can be stably transferred.
Further, the turntable ring provided in the chamber for loading and unloading the substrate can be prevented from adhering to the sheet portion.
Drawings
Fig. 1 is a plan view showing a substrate processing apparatus according to the present invention.
Fig. 2 is a perspective view showing the internal structure of each chamber in the substrate processing apparatus of the present invention.
Fig. 3 (a) and (b) are perspective views showing the turntable of the present invention.
Fig. 4 is a cross-sectional view showing a state in which a substrate is supported by lift pins in a state in which a first space and a second space are isolated in the substrate processing apparatus of the present invention.
Fig. 5 is a cross-sectional view showing a state in which the lift pins are lowered and the substrate is placed on the upper surface of the stage in the state of fig. 4.
Fig. 6 is a cross-sectional view showing a state in which the platform and the lift pins are lowered to a position in which the turntable ring is mounted on the turntable body in the state of fig. 5.
Fig. 7 is a cross-sectional view showing a state in which the turntable is raised in the state of fig. 6, so that the substrate is spaced apart from the upper surface of the stage.
Fig. 8 is a cross-sectional view showing a state in which the turntable is rotated in the state of fig. 7, so that the substrate of the first chamber is transferred to the second chamber.
Fig. 9 is a cross-sectional view showing a state in which a substrate of the second chamber is placed on the upper surface of the stage in the state of fig. 8.
Fig. 10 is a diagram showing a state where the first space and the second space in the first chamber are isolated, and showing a state where the inner space of the second chamber in the second chamber is isolated from the inner spaces of the other chambers by the partition wall.
Reference numerals illustrate:
1: substrate processing apparatus 2: front end module of equipment
2a: the substrate loading unit 2b: substrate transfer part
20: carousel ring support 100: first chamber
100a: upper chamber 100b: lower chamber
100c: sheet portion 101: inner wall
110. 210, 310, 410, 510: platform 120: ring separating member
160: lifting pin 171: first sealing member
172: second sealing member 200: a second chamber
271: third sealing member 300: third chamber
400: fourth chamber 500: fifth chamber
600: carousel 610: turntable main body
620: opening 630: rotating disc ring
640: substrate support pins 700: partition wall
Detailed Description
The present invention will be described in detail below with reference to the drawings.
Referring to fig. 1 to 3, a substrate processing apparatus 1 of the present invention includes: : a plurality of chambers 100, 200, 300, 400, 500 arranged at predetermined intervals in a circumferential direction for processing a substrate; a turntable 600 configured to rotate in order to transfer substrates between the plurality of chambers 100, 200, 300, 400, 500; a control part (not shown) for controlling the constitution of the substrate processing apparatus 1 including the turntable 600.
In the substrate processing apparatus 1 of the present invention, for example, a reflow process may be performed. In the substrate processing apparatus 1 of the present invention, the process using heat may be performed without performing the reflow process.
The plurality of chambers 100, 200, 300, 400, 500 may include: a first chamber 100 for loading and unloading the substrate; a second chamber 200, a third chamber 300, and a fourth chamber 400 for heating the substrate loaded in the first chamber 100 to perform a heat treatment; and a fifth chamber 500 for cooling the substrate heat-treated in the fourth chamber 400.
The loading and unloading of the substrate in the first chamber 100 may be performed, and the cooling of the substrate which is heat-treated sequentially through the second chamber 200, the third chamber 300, the fourth chamber 400, and the fifth chamber 500 may be performed. In the second chamber 200, the third chamber 300, the fourth chamber 400, and the fifth chamber 500, a process accompanied by a heat treatment of a substrate may be performed, thereby performing a function as a heat treatment chamber.
The fifth chamber 500 may be configured to perform a cooling process prior to the cooling of the first chamber 100. At this time, the fifth chamber 500 may be configured to be provided with a heater to heat the substrate, but the heating temperature of the substrate is set to be lower than that of the fourth chamber 400 to heat the substrate, thereby achieving cooling of the substrate.
One side of the first chamber 100 is coupled to an equipment front end module 2 (EFEM: equipment Front End Module).
The device front-end module 2 has the following functions: the unprocessed substrate loaded on the substrate loading section 2a is loaded on the first chamber 100 of the substrate processing apparatus 1 by a transfer robot (not shown) provided on the substrate transfer section 2b, or the substrate processed in the substrate processing apparatus 1 is unloaded from the first chamber 100 and loaded on the substrate loading section 2a.
The temperature of the heated substrate in the second, third, fourth, and fifth chambers 200, 300, 400, and 500 may be set to 100 to 450 ℃. Also, the second chamber 200, the third chamber 300, the fourth chamber 400, and the fifth chamber 500 may be respectively equipped with heaters that generate heat for heating the substrate. The shape and size of the heater may be variously changed, and the heater may be provided at upper and lower portions of the substrate, respectively.
The first chamber 100, the second chamber 200, the third chamber 300, the fourth chamber 400, the fifth chamber 500 may be equipped with a platform 110, 210, 310, 410, 510, respectively. The upper surface of the stage 110 of the first chamber 100 is provided with a substrate, which may be cooled by a cooling unit. The stages 210, 310, 410, 510 of the remaining chambers 200, 300, 400, 500 except the stage 110 of the first chamber 100 are provided with heaters, so that a process of applying heat to the substrate can be realized.
A main body casing 10 is provided, and the main body casing 10 surrounds the entire outer sides of the first chamber 100, the second chamber 200, the third chamber 300, the fourth chamber 400, the fifth chamber 500, and the turntable 600, and has a function of a supporting frame capable of setting the respective components.
The turntable 600 includes: the turntable body 610 is rotated by a turntable driving part (not shown); a plurality of opening parts 620 penetrating the turntable body 610 and formed along a circumferential periphery in a number corresponding to the plurality of chambers 100, 200, 300, 400, 500; an annular turntable ring 630 provided so as to be separable from the turntable body 610 in a state of being supported and placed at an edge position of each of the opening portions 620.
The turntable driving part may be provided to be capable of rotating the turntable 600 and elevating the turntable 600 in the up-down direction. With this configuration, a function of transferring the substrate from one chamber to an adjacent chamber can be performed.
The turntable ring 630 incorporates substrate support pins 640 for supporting the bottom surface of the substrate. The substrate support pins 640 are provided in plurality along the circumferential periphery of the turntable ring 630, one side end of the substrate support pins 640 is coupled to the turntable ring 630 with a fastening member (not shown), and the other side end is provided toward the center of the turntable ring 630.
The first chamber 100, the second chamber 200, the third chamber 300, the fourth chamber 400, and the fifth chamber 500 are each provided with a plurality of the substrate support pins 640. The plurality of substrate support pins 6400 provided in each of the chambers are provided to be spaced apart at predetermined intervals along the periphery of the central stage 110, 210, 310, 410, 510. A substrate support pin insertion groove 110a opened in an upward direction in a concave shape is formed on an upper surface of the stage 110 provided in the first chamber 100, and a substrate support pin 640 is inserted into the substrate support pin insertion groove 110 a.
Fig. 3 (a) shows a state in which the dial ring 630 is seated on the dial body 610, and fig. 3 (b) shows a state in which the dial ring 630 is separated from the dial body 610.
If the dial driving part is driven, the dial 600 is rotated in a state where the upper and lower heights are fixed. The turntable ring 630 is lifted and lowered together with the lifting and lowering of the platform 110, which will be described later, and the turntable ring 630 is lifted and lowered in a state of being separated from the turntable body 610.
The structure and internal configuration of the first chamber 100, which is one of the chambers 100, 200, 300, 400, 500, will be described with reference to fig. 4.
The first chamber 100 is composed of an upper chamber 100a and a lower chamber 100b provided at a lower side of the upper chamber 100 a.
A first space S1 is formed inside the upper chamber 100a, and a second space S2 is formed inside the lower chamber 100 b.
The loading and unloading of the substrate W in the first chamber 100 is performed in a state where the first space S1 and the second space S2 are spatially separated from each other and are not communicated with each other.
The first space S1 has a function as a load lock portion for loading the substrate W on the substrate loading portion 2a by the transfer robot or unloading the substrate W on which the substrate processing has been completed to the substrate loading portion 2a by the transfer robot.
The second space S2 is provided with a turntable 600 and communicates with the adjacent additional chambers 200, 300, 400, 500 to provide a path for transferring the substrate W between the respective chambers 100, 200, 300, 400, 500. That is, the second space S2 has a function of a passage for transferring the loaded substrate from the first chamber 100 to the second chamber 200, a function of a passage for transferring the processed substrate in the fifth chamber 500 to the load lock portion, and a function as a process chamber for performing cooling of the substrate before unloading.
An opening (not shown) for allowing the loaded and unloaded substrates to go in and out is formed on one side of the upper chamber 100a, and the opening is opened and closed by a gate valve (not shown).
The first chamber 100 is equipped with: a stage 110 for accommodating a substrate W; a lift pin 160 for supporting the bottom surface of the substrate W to lift the substrate; a cooling unit (not shown) for cooling the substrate loaded on the upper portion of the stage 110. Also, a stage driving part (not shown) providing a driving force to enable the stage 110 to be lifted and lowered in the up-down direction may be provided.
The boundary portion between the upper chamber 100a and the lower chamber 100b is formed with a sheet portion 100c protruding inward. The platform 110 and the turntable ring 630 are raised so that the upper surface of the turntable ring 630 is closely attached to the sheet portion 100c. A first sealing member 171 is interposed between the upper surface of the turntable ring 630 and the sheet portion 100c, thereby maintaining airtight. And, a second sealing member 172 is interposed between the bottom surface of the turntable ring 630 and the upper surface of the platform 110, thereby maintaining airtight.
In this state, the inner space of the first chamber 100 is isolated from the upper first space S1 and the lower second space S2 with respect to the stage 110.
The lift pins 160 are provided to penetrate the platform 110 in the up-down direction. A lift pin driving part (not shown) for lifting the lift pin 160 in the up-down direction is provided. When the lift pin driving unit is driven to raise or lower the lift pins 160, the substrate W is lifted up or down in a state where the bottom surface of the substrate W is supported by the upper ends of the lift pins 160.
The platform 110 and the lift pins 160 are lifted by the driving of the platform driving part and the lift pin driving part, and the turntable ring 630 is in a state of being separated from the turntable body 610 to be moved upward together with the platform 110.
In this state, the substrate W is loaded from the substrate loading part 2a into the upper chamber 100a or unloaded from the upper chamber 100a into the substrate loading part 2a by the transfer robot.
The first chamber 100 may be provided with a ring separating member 120, and the ring separating member 120 applies a downward force to the turntable ring 630 in order to prevent the turntable ring 630 from adhering to the bottom surface of the sheet part 100c when the table 110 is lowered by the table driving part in a state where the turntable ring 630 is closely adhered to the sheet part 100c.
The ring separating member 120 may be provided with a lower end portion penetrating the sheet portion 100c, and may be lifted by driving of a separating member driving portion (not shown) that provides a force for lifting the ring separating member 120.
The second chamber 200 is provided with a stage 210 on an upper surface thereof for placing a substrate W for substrate processing, and is provided with an inner wall 101 for surrounding an upper space of the stage 210 and a partition wall 700 moving in an up-down direction from an outer side surface of the inner wall 101.
The inner wall 101 may be integrally formed with a housing surrounding the second chamber 200. The partition 700 is provided so as to be movable up and down while being closely attached to the outer surface of the inner wall 101. A partition wall driving part (not shown) for moving the partition wall 700 up and down may be provided.
The partition 700 is provided to isolate the upper space of the stage 210 from other chambers during the substrate processing in the second chamber 200 or to be lifted up and down to communicate with other chambers after the substrate processing is completed. The partition 700 may be provided in the third to fifth chambers 300, 400, 500, respectively.
As shown in fig. 4, when the partition wall 700 moves upward, the internal space of the second chamber 200 is in communication with other chambers, and if the partition wall 700 moves downward and the lower end portion contacts the turntable ring 630, the internal space of the second chamber 200 is in an isolated state from communication with other chambers. The upper surface 630 of the turntable ring 630 is provided with a third sealing member 271, and the third sealing member 271 is interposed between the lower end portion of the partition wall 700 and the upper surface of the turntable ring 630, so that airtightness can be maintained.
The second chamber 200 is provided with a rotating disc ring support 20, and the bottom surface of the rotating disc ring 630 is contacted and supported on the upper surface of the rotating disc ring support 20 and is supported.
In the above embodiment, the lower end portion of the partition wall 700 is in contact with the turntable ring 630, and the bottom surface of the turntable ring 630 is in contact with the turntable ring support portion 20, but the upper surface and the bottom surface of the turntable body 610 may be in contact with the lower end portion of the partition wall 700 and the upper surface of the turntable ring support portion 20, respectively.
Fig. 5 shows a state in which the lift pin driving unit is driven to lower the lift pin 160 in the state of fig. 4. If the lift pins 160 are lowered, the substrate W is placed on the stage 110.
Fig. 6 shows a state in which the stage driving unit is driven to lower the stage 110 in the state of fig. 5. At this time, the lift pin 160 is moved downward by the driving of the lift pin driving part. The turntable ring 630 and substrate support pins 640 are lowered with the platform 110 until the turntable ring 630 is seated on the turntable body 610.
The state of fig. 5 is a state in which the upper surface of the rotor ring 630 is in close contact with the sheet portion 100c, and the first space S1 and the second space S2 are isolated. In this state, when the platform 110 is lowered, the rotor ring 630 may adhere to the bottom surface of the sheet portion 100c. When the first space S1 functions as a load lock portion, the first space S1 may be formed as a vacuum, and a phenomenon in which the turntable loop 630 adheres to the bottom surface of the sheet portion 100c may frequently occur.
Therefore, in the state of fig. 5, when the platform 110 is lowered and the separating member driving part is driven to lower the ring separating member 120, the lower end of the ring separating member 120 presses the upper surface of the turntable ring 630, thereby preventing the upper surface of the turntable ring 630 from adhering to the bottom surface of the sheet part 100c, and the turntable ring 630 is lowered together with the platform 110.
Fig. 7 shows a state in which the turntable driving unit is driven to raise the turntable 600 in the state of fig. 6. When the turntable 600 is lifted, the substrate W is lifted together with the turntable 600 in a state where the bottom surface thereof is supported by the substrate support pins 640.
Fig. 8 shows a state in which the turntable driving unit is driven to rotate the turntable 600 in the state of fig. 7. If the turntable 600 rotates, the substrate W is transferred from the first chamber 100 to the adjacent second chamber 200. If the fifth chamber 500 has a substrate that has been subjected to a substrate process, the substrate that was located in the fifth chamber 500 may be moved to the first chamber 100 by the rotation of the turntable 600.
Fig. 9 illustrates a state in which the turntable 600 is lowered by driving of the turntable driving part in the state of fig. 8, and thus the substrate W is seated on the upper surface of the stage 210.
Fig. 10 shows a state in which the barrier 700 is lowered by the driving of the barrier driving unit in the state of fig. 9, and the lower end portion of the barrier 700 is brought into contact with the upper surface of the turntable ring 630. The lower end of the partition wall 700 contacts the upper surface of the turntable ring 630 via the third sealing member 271, and the bottom surface of the turntable ring 630 is supported by the turntable ring support portion 20. Therefore, the upper internal space S3 and the lower internal space S4 of the second chamber 200 are isolated from communication with the internal spaces of the other chambers 100, 300, 400, 500.
At this time, when the substrate W transferred from the fifth chamber 500 is positioned in the first chamber 100, the first chamber 100 cools the substrate W and, at the same time, the upper surface of the turntable ring 630 may be brought into close contact with the sheet portion 100c in order to unload the substrate W after cooling, while the stage 110 is raised. Thereafter, when the lift pins 160 are lifted and the bottom surface of the substrate W is spaced apart from the upper surface of the stage 110, unloading of the substrate W is achieved.
According to the above configuration, the substrate is transferred by rotating the substrate in a state where the substrate is supported by the turntable ring 630 of the turntable 600, and thus the substrate can be transferred stably. Also, the phenomenon that the rotor ring 630 adheres to the sheet portion 100c when the stage 110 is lowered can be prevented.
While the present invention has been described in detail with reference to the preferred embodiments, the present invention is not limited to the foregoing embodiments, and may be variously modified and practiced within the scope of the claims and the detailed description of the invention and the accompanying drawings.

Claims (7)

1. A substrate processing apparatus comprising: a plurality of chambers arranged at predetermined intervals in a circumferential direction for processing a substrate; a turntable configured to rotate for transferring the substrate between the plurality of chambers,
at least one of the plurality of chambers is provided with a stage on which the substrate is placed and a stage driving part that provides a driving force for lifting and lowering the stage in an up-down direction,
the turntable comprises:
a turntable main body which is lifted and rotated by the turntable driving part;
an annular turntable ring provided so as to be separable from the turntable body in a state of being placed on the turntable body,
wherein a first chamber for loading and unloading the substrate among the plurality of chambers includes a first space at an upper portion for loading and unloading the substrate and a second space formed at a lower portion of the first space, loading and unloading the substrate in a state where the first space and the second space are isolated from each other,
if the stage and the turntable ring are moved together in an upward direction by the stage driving part, the turntable ring is closely attached to a sheet part provided at the boundary of the first space and the second space, so that the first space and the second space are isolated.
2. The substrate processing apparatus according to claim 1, wherein,
a ring separating member is provided, which applies a downward force to the turntable ring when the table is lowered by the table driving section in a state where the turntable ring is abutted against the sheet section.
3. The substrate processing apparatus according to claim 2, wherein,
the lower end portion of the ring separating member penetrates the sheet portion in the up-down direction, and the penetrated lower end portion contacts the upper surface of the rotor ring to apply the downward force.
4. The substrate processing apparatus according to claim 1, wherein,
a first sealing member for maintaining air tightness is provided between the upper surface of the turntable loop and the sheet part,
a second sealing member for maintaining air tightness is provided between the bottom surface of the rotor ring and the upper surface of the edge position portion of the stage.
5. The substrate processing apparatus according to claim 1, wherein,
the plurality of chambers includes: a first chamber for loading and unloading the substrate; a plurality of heat treatment chambers for transferring the substrate loaded in the first chamber and sequentially performing heat treatment on the substrate loaded in the first chamber,
the substrates heat-treated in the plurality of heat-treating chambers are unloaded after being transferred to the first chamber to be cooled.
6. The substrate processing apparatus according to claim 1, wherein,
the plurality of chambers includes: a first chamber for loading and unloading the substrate; a plurality of heat treatment chambers for transferring the substrate loaded in the first chamber and sequentially performing heat treatment on the substrate loaded in the first chamber,
each of the plurality of heat treatment chambers is provided with a partition wall that moves in order to isolate or communicate the space inside each chamber with the space of the other chamber during the treatment of the substrate transferred inside the respective chamber.
7. The substrate processing apparatus according to claim 6, wherein,
the partition wall is provided to be lifted up and down, and is lowered to contact an upper surface of the turntable ring located in each of the plurality of heat treatment chambers, and a bottom surface of the turntable ring contacts and is supported by a turntable ring support portion.
CN202011201480.XA 2019-12-23 2020-11-02 Substrate processing apparatus Active CN113097113B (en)

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