TWI748014B - 含羧酸基之高分子化合物及含有此高分子化合物的黏接劑組成物 - Google Patents

含羧酸基之高分子化合物及含有此高分子化合物的黏接劑組成物 Download PDF

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Publication number
TWI748014B
TWI748014B TW106142314A TW106142314A TWI748014B TW I748014 B TWI748014 B TW I748014B TW 106142314 A TW106142314 A TW 106142314A TW 106142314 A TW106142314 A TW 106142314A TW I748014 B TWI748014 B TW I748014B
Authority
TW
Taiwan
Prior art keywords
molecular weight
carboxylic acid
polymer polyol
average molecular
number average
Prior art date
Application number
TW106142314A
Other languages
English (en)
Chinese (zh)
Other versions
TW201833172A (zh
Inventor
芝拓也
伊藤武
Original Assignee
日商東洋紡股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商東洋紡股份有限公司 filed Critical 日商東洋紡股份有限公司
Publication of TW201833172A publication Critical patent/TW201833172A/zh
Application granted granted Critical
Publication of TWI748014B publication Critical patent/TWI748014B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/40—Polyesters derived from ester-forming derivatives of polycarboxylic acids or of polyhydroxy compounds, other than from esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/91—Polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Laminated Bodies (AREA)
TW106142314A 2016-12-06 2017-12-04 含羧酸基之高分子化合物及含有此高分子化合物的黏接劑組成物 TWI748014B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016236480 2016-12-06
JP2016-236480 2016-12-06

Publications (2)

Publication Number Publication Date
TW201833172A TW201833172A (zh) 2018-09-16
TWI748014B true TWI748014B (zh) 2021-12-01

Family

ID=62491127

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106142314A TWI748014B (zh) 2016-12-06 2017-12-04 含羧酸基之高分子化合物及含有此高分子化合物的黏接劑組成物

Country Status (5)

Country Link
JP (1) JP6380710B1 (ja)
KR (1) KR102502362B1 (ja)
CN (1) CN110036054B (ja)
TW (1) TWI748014B (ja)
WO (1) WO2018105543A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022080470A1 (ja) 2020-10-16 2022-04-21
WO2023063386A1 (ja) * 2021-10-14 2023-04-20 東洋紡株式会社 架橋ポリエステル樹脂、接着剤組成物および接着シート

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201033314A (en) * 2008-12-26 2010-09-16 Toyo Boseki Resin composition for adhesive, adhesive containing it, adhesive sheet and printed wiring board containing it as adhesive layer

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02138333A (ja) * 1988-11-17 1990-05-28 Toyo Ink Mfg Co Ltd ポリエステル樹脂組成物
JPH05287068A (ja) * 1992-04-09 1993-11-02 Showa Highpolymer Co Ltd 飽和ポリエステル樹脂の製造方法
JP3133015B2 (ja) * 1996-04-26 2001-02-05 株式会社巴川製紙所 トナー用ポリエステル樹脂とその製造方法およびそれを用いた電子写真用トナー
JP4423513B2 (ja) 1997-10-20 2010-03-03 東洋紡績株式会社 接着用樹脂組成物及び接着用フィルム
JP5151003B2 (ja) * 2004-11-10 2013-02-27 東洋紡株式会社 接着剤およびそれを用いた回路基板
JP2008205370A (ja) 2007-02-22 2008-09-04 Sumitomo Bakelite Co Ltd 樹脂組成物、支持基材付き接着剤および補強板付プリント回路板
JP2010013527A (ja) * 2008-07-02 2010-01-21 Toyobo Co Ltd ポリエステル樹脂、光硬化性・熱硬化性樹脂組成物、光硬化性・熱硬化性層、インキ、接着剤、及び、プリント回路基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201033314A (en) * 2008-12-26 2010-09-16 Toyo Boseki Resin composition for adhesive, adhesive containing it, adhesive sheet and printed wiring board containing it as adhesive layer

Also Published As

Publication number Publication date
KR20190090831A (ko) 2019-08-02
TW201833172A (zh) 2018-09-16
CN110036054A (zh) 2019-07-19
JP6380710B1 (ja) 2018-08-29
KR102502362B1 (ko) 2023-02-21
CN110036054B (zh) 2021-11-02
WO2018105543A1 (ja) 2018-06-14
JPWO2018105543A1 (ja) 2018-12-06

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