TWI747100B - 附有流路之板件 - Google Patents

附有流路之板件 Download PDF

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Publication number
TWI747100B
TWI747100B TW108145427A TW108145427A TWI747100B TW I747100 B TWI747100 B TW I747100B TW 108145427 A TW108145427 A TW 108145427A TW 108145427 A TW108145427 A TW 108145427A TW I747100 B TWI747100 B TW I747100B
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TW
Taiwan
Prior art keywords
flow path
embedded
plate
buried
shape
Prior art date
Application number
TW108145427A
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English (en)
Chinese (zh)
Other versions
TW202025414A (zh
Inventor
荒木良仁
諸田修平
花待年彥
橫山響
Original Assignee
日商日本發條股份有限公司
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Application filed by 日商日本發條股份有限公司 filed Critical 日商日本發條股份有限公司
Publication of TW202025414A publication Critical patent/TW202025414A/zh
Application granted granted Critical
Publication of TWI747100B publication Critical patent/TWI747100B/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0246—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid heat-exchange elements having several adjacent conduits forming a whole, e.g. blocks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0233—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
    • F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
    • F28D1/05358—Assemblies of conduits connected side by side or with individual headers, e.g. section type radiators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/02—Tubular elements of cross-section which is non-circular
    • F28F1/025—Tubular elements of cross-section which is non-circular with variable shape, e.g. with modified tube ends, with different geometrical features
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/02—Tubular elements of cross-section which is non-circular
    • F28F1/04—Tubular elements of cross-section which is non-circular polygonal, e.g. rectangular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0282—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by varying the geometry of conduit ends, e.g. by using inserts or attachments for modifying the pattern of flow at the conduit inlet or outlet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
TW108145427A 2018-12-14 2019-12-12 附有流路之板件 TWI747100B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018-234929 2018-12-14
JP2018234929 2018-12-14
JP2019-184146 2019-10-04
JP2019184146 2019-10-04

Publications (2)

Publication Number Publication Date
TW202025414A TW202025414A (zh) 2020-07-01
TWI747100B true TWI747100B (zh) 2021-11-21

Family

ID=71075302

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108145427A TWI747100B (zh) 2018-12-14 2019-12-12 附有流路之板件

Country Status (7)

Country Link
US (1) US20220026151A1 (enExample)
EP (1) EP3896722A4 (enExample)
JP (1) JP7324230B2 (enExample)
KR (1) KR102590641B1 (enExample)
CN (1) CN113169112B (enExample)
TW (1) TWI747100B (enExample)
WO (1) WO2020121898A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230036346A (ko) 2021-09-07 2023-03-14 선문대학교 산학협력단 Cyp125a13 효소를 이용한 스테로이드의 히드록시화 생물전환 방법
KR20230036348A (ko) 2021-09-07 2023-03-14 선문대학교 산학협력단 7α-히드록시스테로이드 탈수소 효소를 이용한 스테로이드의 탈수소화 생물전환 방법
KR102823387B1 (ko) 2021-09-07 2025-06-23 선문대학교 산학협력단 CYP154C3s 효소를 이용한 스테로이드의 하이드록시화 생물전환 방법
KR102638205B1 (ko) 2021-09-13 2024-02-20 선문대학교 산학협력단 Cyp105d18 효소를 이용한 이소퀴놀린 알칼로이드 화합물의 n-산화 생물전환 방법
KR102854914B1 (ko) * 2021-10-20 2025-09-03 니혼도꾸슈도교 가부시키가이샤 유지 장치
CN118280801A (zh) * 2022-12-29 2024-07-02 中微半导体设备(上海)股份有限公司 一种多孔塞组件、静电吸盘及等离子体刻蚀装置
KR102721433B1 (ko) * 2023-02-27 2024-10-25 엔지케이 인슐레이터 엘티디 웨이퍼 적재대
KR102685150B1 (ko) * 2023-10-12 2024-07-16 주식회사 미코세라믹스 세라믹 서셉터 및 그 제조 방법
JP7784470B2 (ja) * 2024-04-08 2025-12-11 日本特殊陶業株式会社 保持装置
KR102823869B1 (ko) 2024-08-26 2025-06-23 주식회사 리더티앤디 Mdf용 분체 도장 자동화 시스템

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040190215A1 (en) * 1996-04-26 2004-09-30 Applied Materials, Inc. Electrostatic chuck having dielectric member with stacked layers and manufacture
TW201438141A (zh) * 2013-03-29 2014-10-01 Toto Ltd 靜電吸盤

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2559123Y2 (ja) * 1992-03-31 1998-01-14 株式会社神戸製鋼所 真空アーク蒸着装置
JP3965258B2 (ja) * 1999-04-30 2007-08-29 日本碍子株式会社 半導体製造装置用のセラミックス製ガス供給構造
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
JP2003338492A (ja) * 2002-05-21 2003-11-28 Tokyo Electron Ltd プラズマ処理装置
JP4557814B2 (ja) * 2005-06-09 2010-10-06 パナソニック株式会社 プラズマ処理装置
JP5331519B2 (ja) * 2008-03-11 2013-10-30 日本碍子株式会社 静電チャック
JP4590597B2 (ja) * 2008-03-12 2010-12-01 国立大学法人東北大学 シャワープレートの製造方法
JP5449750B2 (ja) * 2008-11-19 2014-03-19 株式会社日本セラテック 静電チャックおよびその製造方法
MY154101A (en) * 2008-11-26 2015-04-30 Nhk Spring Co Ltd Probe-unit base member and probe unit
JP3154629U (ja) * 2009-08-04 2009-10-22 日本碍子株式会社 静電チャック
JP6263484B2 (ja) * 2015-01-30 2018-01-17 日本特殊陶業株式会社 静電チャックおよびその製造方法
JP6257540B2 (ja) * 2015-01-30 2018-01-10 日本特殊陶業株式会社 静電チャックおよびその製造方法
JP6509139B2 (ja) * 2016-01-29 2019-05-08 日本特殊陶業株式会社 基板支持装置及びその製造方法
CN108649012B (zh) * 2018-05-11 2021-10-01 北京华卓精科科技股份有限公司 新型陶瓷塞及具有该新型陶瓷塞的静电卡盘装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040190215A1 (en) * 1996-04-26 2004-09-30 Applied Materials, Inc. Electrostatic chuck having dielectric member with stacked layers and manufacture
TW201438141A (zh) * 2013-03-29 2014-10-01 Toto Ltd 靜電吸盤

Also Published As

Publication number Publication date
EP3896722A4 (en) 2022-08-24
KR20210087536A (ko) 2021-07-12
US20220026151A1 (en) 2022-01-27
JPWO2020121898A1 (ja) 2021-11-25
CN113169112B (zh) 2024-05-07
KR102590641B1 (ko) 2023-10-17
WO2020121898A1 (ja) 2020-06-18
EP3896722A1 (en) 2021-10-20
TW202025414A (zh) 2020-07-01
JP7324230B2 (ja) 2023-08-09
CN113169112A (zh) 2021-07-23

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