TWI744671B - 電子光學系統及多射束圖像取得裝置 - Google Patents
電子光學系統及多射束圖像取得裝置 Download PDFInfo
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- TWI744671B TWI744671B TW108126976A TW108126976A TWI744671B TW I744671 B TWI744671 B TW I744671B TW 108126976 A TW108126976 A TW 108126976A TW 108126976 A TW108126976 A TW 108126976A TW I744671 B TWI744671 B TW I744671B
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- electron beam
- yoke
- magnetic field
- substrate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/10—Lenses
- H01J37/14—Lenses magnetic
- H01J37/141—Electromagnetic lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical or photographic arrangements associated with the tube
- H01J37/222—Image processing arrangements associated with the tube
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/045—Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/05—Electron or ion-optical arrangements for separating electrons or ions according to their energy or mass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/09—Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/153—Electron-optical or ion-optical arrangements for the correction of image defects, e.g. stigmators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
- G01N2223/6113—Specific applications or type of materials patterned objects; electronic devices printed circuit board [PCB]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
- G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/10—Lenses
- H01J2237/14—Lenses magnetic
- H01J2237/1405—Constructional details
- H01J2237/141—Coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/10—Lenses
- H01J2237/14—Lenses magnetic
- H01J2237/1405—Constructional details
- H01J2237/1415—Bores or yokes, i.e. magnetic circuit in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24592—Inspection and quality control of devices
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Public Health (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862714245P | 2018-08-03 | 2018-08-03 | |
US62/714,245 | 2018-08-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202032114A TW202032114A (zh) | 2020-09-01 |
TWI744671B true TWI744671B (zh) | 2021-11-01 |
Family
ID=69227875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108126976A TWI744671B (zh) | 2018-08-03 | 2019-07-30 | 電子光學系統及多射束圖像取得裝置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11621144B2 (ja) |
JP (1) | JP2020021733A (ja) |
KR (2) | KR20200015425A (ja) |
TW (1) | TWI744671B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7442375B2 (ja) * | 2020-04-06 | 2024-03-04 | 株式会社ニューフレアテクノロジー | マルチ電子ビーム検査装置及びマルチ電子ビーム検査方法 |
JP2021183942A (ja) * | 2020-05-22 | 2021-12-02 | 株式会社ニューフレアテクノロジー | パターン検査装置及びパターン検査方法 |
US20230377836A1 (en) * | 2020-09-28 | 2023-11-23 | Hitachi High-Tech Corporation | Analysis System |
KR20230042105A (ko) * | 2020-10-28 | 2023-03-27 | 가부시키가이샤 뉴플레어 테크놀로지 | 빈 필터 및 멀티 전자 빔 검사 장치 |
NL2034496B1 (en) * | 2023-04-04 | 2024-03-05 | Phe Nx Knowledge B V | Electro-magnetic lens for charged particle apparatus. |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070138390A1 (en) * | 2004-04-05 | 2007-06-21 | Hidetoshi Nishiyama | Inspection method and inspection system using charged particle beam |
JP2007260222A (ja) * | 2006-03-29 | 2007-10-11 | Osaka Univ | 荷電粒子線偏向装置および荷電粒子線照射装置 |
US20080135755A1 (en) * | 2006-12-11 | 2008-06-12 | Hitachi High-Technologies Corporation | Scanning Electron Microscope |
US20150294833A1 (en) * | 2012-10-29 | 2015-10-15 | Hitachi High-Technologies Corporation | Charged particle beam apparatus |
US20170025241A1 (en) * | 2015-07-21 | 2017-01-26 | Hermes Microvision, Inc. | Apparatus of Plural Charged-Particle Beams |
Family Cites Families (29)
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JPS4929089B1 (ja) * | 1970-05-13 | 1974-08-01 | ||
US3984687A (en) * | 1975-03-17 | 1976-10-05 | International Business Machines Corporation | Shielded magnetic lens and deflection yoke structure for electron beam column |
US4469948A (en) * | 1982-01-26 | 1984-09-04 | The Perkin-Elmer Corp. | Composite concentric-gap magnetic lens |
JPS60178960U (ja) * | 1984-05-09 | 1985-11-28 | 日本電子株式会社 | 走査電子顕微鏡用対物レンズ |
JPH06325721A (ja) | 1993-05-13 | 1994-11-25 | Hitachi Ltd | 電子線装置 |
DE69633505T2 (de) * | 1996-07-25 | 2005-03-03 | Advantest Corp. | Ablenksystem |
JP3449198B2 (ja) * | 1997-10-22 | 2003-09-22 | 日新電機株式会社 | イオン注入装置 |
JP4234242B2 (ja) | 1997-12-19 | 2009-03-04 | 株式会社東芝 | 電子ビーム描画装置 |
US6891167B2 (en) * | 2000-06-15 | 2005-05-10 | Kla-Tencor Technologies | Apparatus and method for applying feedback control to a magnetic lens |
US6768117B1 (en) * | 2000-07-25 | 2004-07-27 | Applied Materials, Inc. | Immersion lens with magnetic shield for charged particle beam system |
JP2002170764A (ja) * | 2000-12-04 | 2002-06-14 | Nikon Corp | 荷電粒子線露光装置、荷電粒子線露光装置の調整方法及び半導体デバイスの製造方法 |
JP3968334B2 (ja) * | 2002-09-11 | 2007-08-29 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置及び荷電粒子線照射方法 |
CN101630623B (zh) | 2003-05-09 | 2012-02-22 | 株式会社荏原制作所 | 基于带电粒子束的检查装置及采用了该检查装置的器件制造方法 |
DE102004019834B4 (de) * | 2004-04-23 | 2007-03-22 | Vistec Electron Beam Gmbh | Korrekturlinsen-System für ein Partikelstrahl-Projektionsgerät |
JP4431459B2 (ja) * | 2004-07-29 | 2010-03-17 | 株式会社日立ハイテクノロジーズ | 集束イオン・ビーム装置及び集束イオン・ビーム照射方法 |
JP4732917B2 (ja) * | 2006-02-15 | 2011-07-27 | 株式会社日立ハイテクノロジーズ | 走査型電子顕微鏡及び欠陥検出装置 |
JP4922962B2 (ja) * | 2008-02-14 | 2012-04-25 | 株式会社日立ハイテクノロジーズ | 回路パターンの検査方法及び検査装置 |
KR101431950B1 (ko) * | 2008-06-25 | 2014-08-19 | 가부시키가이샤 히다치 하이테크놀로지즈 | 반도체 검사 장치 |
JP5380206B2 (ja) * | 2009-08-27 | 2014-01-08 | 株式会社日立ハイテクノロジーズ | 走査型電子顕微鏡装置及びそれを用いた試料の検査方法 |
US20130134322A1 (en) * | 2010-10-27 | 2013-05-30 | Param Corporation | Electron lens and the electron beam device |
DE102011106433B4 (de) * | 2011-07-04 | 2016-10-13 | Integrated Dynamics Engineering Gmbh | Integrierbare Magnetfeldkompensation für den Einsatz an Raster- und Transmissionselektronenmikroskopen, Schwingungsisolationssystem sowie Verfahren zum Abbilden, Untersuchen und / oder Bearbeiten einer Probe |
JP5953314B2 (ja) * | 2011-10-31 | 2016-07-20 | 株式会社日立ハイテクノロジーズ | 走査電子顕微鏡 |
JP5836838B2 (ja) * | 2012-02-27 | 2015-12-24 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
US10460905B2 (en) * | 2015-09-23 | 2019-10-29 | Kla-Tencor Corporation | Backscattered electrons (BSE) imaging using multi-beam tools |
US10453645B2 (en) * | 2016-12-01 | 2019-10-22 | Applied Materials Israel Ltd. | Method for inspecting a specimen and charged particle multi-beam device |
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JP6901572B2 (ja) * | 2017-09-04 | 2021-07-14 | 株式会社日立ハイテク | 荷電粒子線装置 |
JP6812561B2 (ja) * | 2017-09-04 | 2021-01-13 | 株式会社日立ハイテク | 荷電粒子線装置 |
JP7016969B2 (ja) * | 2018-05-02 | 2022-02-07 | エーエスエムエル ネザーランズ ビー.ブイ. | 電子ビーム装置 |
-
2019
- 2019-07-30 TW TW108126976A patent/TWI744671B/zh active
- 2019-07-30 US US16/525,792 patent/US11621144B2/en active Active
- 2019-08-01 JP JP2019142544A patent/JP2020021733A/ja active Pending
- 2019-08-02 KR KR1020190094323A patent/KR20200015425A/ko not_active IP Right Cessation
-
2021
- 2021-11-11 KR KR1020210154547A patent/KR102532712B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070138390A1 (en) * | 2004-04-05 | 2007-06-21 | Hidetoshi Nishiyama | Inspection method and inspection system using charged particle beam |
JP2007260222A (ja) * | 2006-03-29 | 2007-10-11 | Osaka Univ | 荷電粒子線偏向装置および荷電粒子線照射装置 |
US20080135755A1 (en) * | 2006-12-11 | 2008-06-12 | Hitachi High-Technologies Corporation | Scanning Electron Microscope |
US20150294833A1 (en) * | 2012-10-29 | 2015-10-15 | Hitachi High-Technologies Corporation | Charged particle beam apparatus |
US20170025241A1 (en) * | 2015-07-21 | 2017-01-26 | Hermes Microvision, Inc. | Apparatus of Plural Charged-Particle Beams |
Also Published As
Publication number | Publication date |
---|---|
KR20210137966A (ko) | 2021-11-18 |
TW202032114A (zh) | 2020-09-01 |
KR20200015425A (ko) | 2020-02-12 |
JP2020021733A (ja) | 2020-02-06 |
KR102532712B1 (ko) | 2023-05-15 |
US20200043698A1 (en) | 2020-02-06 |
US11621144B2 (en) | 2023-04-04 |
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