TWI743288B - 異物檢出裝置，異物檢出方法及記憶媒體 - Google Patents

異物檢出裝置，異物檢出方法及記憶媒體 Download PDF

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Publication number
TWI743288B
TWI743288B TW107100603A TW107100603A TWI743288B TW I743288 B TWI743288 B TW I743288B TW 107100603 A TW107100603 A TW 107100603A TW 107100603 A TW107100603 A TW 107100603A TW I743288 B TWI743288 B TW I743288B
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Taiwan
Prior art keywords
light
receiving element
flow path
foreign
width
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TW107100603A
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English (en)
Chinese (zh)
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TW201834014A (zh
Inventor
林聖人
野口耕平
梶原大介
東広大
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日商東京威力科創股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/85—Investigating moving fluids or granular solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW107100603A 2017-01-20 2018-01-08 異物檢出裝置，異物檢出方法及記憶媒體 TWI743288B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017008751 2017-01-20
JP2017-008751 2017-01-20

Publications (2)

Publication Number Publication Date
TW201834014A TW201834014A (zh) 2018-09-16
TWI743288B true TWI743288B (zh) 2021-10-21

Family

ID=62909134

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107100603A TWI743288B (zh) 2017-01-20 2018-01-08 異物檢出裝置，異物檢出方法及記憶媒體

Country Status (3)

Country Link
JP (1) JP6947190B2 (ja)
TW (1) TWI743288B (ja)
WO (1) WO2018135488A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115702338A (zh) * 2020-06-17 2023-02-14 东京毅力科创株式会社 异物检查基板、基板处理装置以及基板处理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63292039A (ja) * 1987-05-26 1988-11-29 Fuji Electric Co Ltd 液体中微粒子検出装置
JPH11173969A (ja) * 1997-12-10 1999-07-02 Fuji Electric Co Ltd 前方散乱光受光光学系及びその製造方法
US20160358829A1 (en) * 2015-06-03 2016-12-08 Tokyo Electron Limited Substrate processing apparatus and substrate processing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786457B2 (ja) * 1987-07-14 1995-09-20 興和株式会社 液中微粒子測定方法及び装置
JPH03235037A (ja) * 1990-02-09 1991-10-21 Canon Inc 粒子解析装置
JP2009536727A (ja) * 2006-04-04 2009-10-15 シングレックス，インコーポレイテッド 高感度のマーカー分析および分子検出のための方法および組成物
US7948621B2 (en) * 2007-06-28 2011-05-24 Perry Equipment Corporation Systems and methods for remote monitoring of contaminants in fluids
JP5033712B2 (ja) * 2008-05-28 2012-09-26 株式会社日立ハイテクノロジーズ 表面検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63292039A (ja) * 1987-05-26 1988-11-29 Fuji Electric Co Ltd 液体中微粒子検出装置
JPH11173969A (ja) * 1997-12-10 1999-07-02 Fuji Electric Co Ltd 前方散乱光受光光学系及びその製造方法
US20160358829A1 (en) * 2015-06-03 2016-12-08 Tokyo Electron Limited Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
JP6947190B2 (ja) 2021-10-13
WO2018135488A1 (ja) 2018-07-26
TW201834014A (zh) 2018-09-16
JPWO2018135488A1 (ja) 2019-12-26

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