TWI743288B - Foreign body detection device, foreign body detection method and storage medium - Google Patents

Foreign body detection device, foreign body detection method and storage medium Download PDF

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TWI743288B
TWI743288B TW107100603A TW107100603A TWI743288B TW I743288 B TWI743288 B TW I743288B TW 107100603 A TW107100603 A TW 107100603A TW 107100603 A TW107100603 A TW 107100603A TW I743288 B TWI743288 B TW I743288B
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receiving element
flow path
foreign
width
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TW201834014A (en
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林聖人
野口耕平
梶原大介
東広大
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日商東京威力科創股份有限公司
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    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

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Abstract

[課題]提供一種能高精度地檢出在流路部流動的異物的技術。   [解決手段]一種異物檢出裝置,具備:供應至被處理體(W)的流體所流動的流路部(15A~15K);以流路部(15A~15K)中的流體的流動方向與光路交叉的方式,在流路部(15A~15K)內的異物檢出區域(50)照射雷射光的雷射光照射部;接收透過異物檢出區域(50)的光的受光元件(45A、45B);設置於流路部(15A~15K)與受光元件(45A、45B)之間的光路上,用以集光至受光元件(45A、45B)並形成集光點(63)的集光透鏡(57);用以基於從前述受光元件(45A、45B)輸出的信號,用以檢出流體中的異物的檢出部(6)。在上述受光元件(45A、45B)中面向集光點(63)的受光區域的寬度,比集光點(63)的寬度還小。[Problem] To provide a technology that can detect foreign objects flowing in the flow path with high accuracy. [Solution] A foreign object detection device including: a flow path part (15A-15K) through which the fluid supplied to the processed body (W) flows; and the flow direction of the fluid in the flow path part (15A-15K) and The light path crosses the foreign body detection area (50) in the flow path part (15A-15K). The laser light irradiation part irradiates the laser light; the light receiving element (45A, 45B) receives the light transmitted through the foreign body detection area (50) ); Set on the optical path between the flow path part (15A ~ 15K) and the light receiving element (45A, 45B) to collect light to the light receiving element (45A, 45B) and form a light collecting lens (63) (57); A detection unit (6) for detecting foreign matter in the fluid based on the signal output from the aforementioned light receiving element (45A, 45B). The width of the light receiving area facing the light collecting spot (63) in the light receiving element (45A, 45B) is smaller than the width of the light collecting spot (63).

Description

異物檢出裝置,異物檢出方法及記憶媒體Foreign body detection device, foreign body detection method and storage medium

[0001] 本發明係有關於光學地檢出供應至被處理體的流體中的異物的異物檢出裝置、異物檢出方法、及具備執行該方法的電腦程式的記憶媒體。[0001] The present invention relates to a foreign body detection device, a foreign body detection method, and a storage medium provided with a computer program for executing the method, which optically detect foreign bodies in a fluid supplied to a to-be-processed body.

[0002] 於半導體裝置的製造工程中,有例如對半導體晶圓(以下,記載成晶圓)進行液處理的工程。例如在形成光阻圖案的工程中,使用光阻等的各種藥液,藥液從藥液瓶,通過介設有閥門等機器的流路即配管,藉由噴嘴向晶圓上吐出。這種向晶圓供應的藥液中會有附著於配管或各機器的粒子混入的情形,又在該藥液中也會有氣泡產生的情形。且在含有樹脂材料的藥液例如光阻中,也有包含比正常的聚合物成分還大的,所謂的異常的聚合物成分的情形。   [0003] 例如在光阻中混入粒子及氣泡或異常的聚合物時,因為會成為顯影缺陷的要因,已知有監視該等異物直到異物的量低於設定值為止,例如在含有配管的供應系統內謀求藥液的清淨化的處理技術。作為監視異物的手法,有使用對流路內的藥液照射雷射光,並接收來自異物的散射光而量測異物的量的粒子計數器的手法。   [0004] 另一方面,隨著半導體裝置的設計規格的微細化的進展,被容許的粒子大小有漸漸地變小的傾向,要求有以高精度檢出更微細的異物的技術。不過,因為檢出對象的異物越小,S(信號位階)/N(雜訊位階)也會變小,高精度檢出變得困難。又欲檢出光阻中尺寸大的異常聚合物時,因為對應尺寸小的正常的聚合物的雷射光強度會成為雜訊,就異常聚合物的高精度檢出會變得困難。例如在專利文獻1中,雖記載關於使雷射光透過流路而檢出藥液中的粒子的技術,但要求以更高精度來進行異物的檢出。 [先前技術文獻] [專利文獻]   [0005]   [專利文獻1]特開2016-103590號公報[0002] In the manufacturing process of a semiconductor device, there is, for example, a process of liquid processing a semiconductor wafer (hereinafter referred to as a wafer). For example, in the process of forming a photoresist pattern, various chemical liquids such as photoresist are used. The chemical liquid is discharged from a chemical liquid bottle through a pipe that is a flow path through a device such as a valve, and is discharged onto a wafer through a nozzle. In the chemical liquid supplied to the wafer, particles adhering to the pipes or various devices may be mixed, and bubbles may also be generated in the chemical liquid. In addition, a chemical solution containing a resin material, such as a photoresist, may also contain a so-called abnormal polymer component that is larger than the normal polymer component. [0003] For example, when particles, bubbles, or abnormal polymers are mixed into the photoresist, they may become a cause of development defects. It is known to monitor these foreign matters until the amount of foreign matters is lower than a set value. Pursue the treatment technology of the liquid medicine in the system. As a method of monitoring the foreign matter, there is a method of using a particle counter that irradiates the liquid medicine in the flow path with laser light and receives scattered light from the foreign matter to measure the amount of the foreign matter.  [0004] On the other hand, with the progress of the miniaturization of the design specifications of semiconductor devices, the allowable particle size tends to gradually become smaller, and a technique for detecting finer foreign objects with high accuracy is required. However, because the smaller the foreign object to be detected, the smaller S (signal level)/N (noise level), and high-precision detection becomes difficult. When an abnormal polymer with a large size is to be detected in the photoresist, since the laser light intensity corresponding to a normal polymer with a small size will become noise, the high-precision detection of the abnormal polymer becomes difficult. For example, Patent Document 1 describes a technique for detecting particles in a chemical liquid by passing laser light through a flow path, but it is required to detect foreign objects with higher accuracy. [Prior Art Document] [Patent Document]   [0005]    [Patent Document 1] JP 2016-103590 A

[發明所欲解決的問題]   [0006] 本發明係基於該等情事而完成,其目的為提供一種能高精度地檢出在流路部流動的異物的技術。 [解決問題的手段]   [0007] 本發明的異物檢出裝置,係在檢出供應至被處理體的流體中的異物之異物檢出裝置中,具備:   供應至前述被處理體的流體所流動的流路部;   以前述流路部中的流體的流動方向與光路交叉的方式,對該流路部內的異物檢出區域照射雷射光的雷射光照射部;   接收透過前述異物檢出區域的光的受光元件;   設置於前述流路部與前述受光元件之間的光路上,用以集光至該受光元件並形成集光點的集光透鏡;   用以基於從前述受光元件輸出的信號,檢出前述流體中的異物的檢出部;   其中,   在前述受光元件中面向前述集光點的受光區域的寬度,比該集光點的寬度還小。   [0008] 本發明的異物檢出方法,係在檢出供應至被處理體的流體中的異物之異物檢出方法中,具備:   為了對前述被處理體供應前述流體而向流路部供應該流體的工程;   藉由雷射光照射部,以前述流路部中的流體的流動方向與光路交叉的方式,對該流路部內的異物檢出區域照射雷射光的工程;   藉由受光元件接收透過前述異物檢出區域的光的工程;   藉由設置於前述流路部與前述受光元件之間的光路上的集光透鏡,集光至該受光元件並形成集光點的工程;   藉由檢出部,基於前述信號,檢出前述流體中的異物的工程;   在前述受光元件中面向前述集光點的受光區域的寬度,比該集光點的寬度還小。   [0009] 本發明的記憶媒體,係記憶用於檢出供應至被處理體的流體中的異物的異物檢出裝置的電腦程式的記憶媒體,其中,   前述電腦程式,組入步驟群以執行本發明的異物檢出方法。 [發明的效果]   [0010] 在本發明的異物檢出裝置中,具備:以被供應至被處理體的流體所流動的流路部中的流體的流動方向與光路交叉的方式,對該流路部內的異物檢出區域照射雷射光用的雷射光照射部、以及將透過前述異物檢出區域的光集光並使集光點形成於受光元件的集光透鏡,在該受光元件中面向前述集光點的受光區域的寬度,比集光點的寬度還小。藉由這樣的構成,能抑制從受光元件輸出的信號中含有雜訊,能夠高精度地進行異物的檢出。[Problems to be Solved by the Invention]   [0006] The present invention was completed based on these circumstances, and its purpose is to provide a technology that can detect foreign objects flowing in the flow path with high accuracy. [Means to Solve the Problem]   [0007] The foreign object detection device of the present invention is a foreign object detection device that detects foreign objects in the fluid supplied to the object to be processed, and includes:    flow of the fluid supplied to the object to be processed  The laser light irradiating part that irradiates the foreign body detection area in the flow path part with laser light in such a way that the flow direction of the fluid in the flow path part crosses the light path;    receives the light passing through the foreign body detection area The light-receiving element;    is provided on the optical path between the flow path portion and the light-receiving element to collect light to the light-receiving element and form a light-collecting point; The detection part of the foreign matter in the fluid;    wherein the width of the light receiving area facing the light collecting point in the light receiving element is smaller than the width of the light collecting point. [0008] The foreign object detection method of the present invention is a foreign object detection method for detecting foreign objects in a fluid supplied to a processed body, and includes: The process of fluid;    the process of irradiating the foreign object detection area in the flow path with laser light by the laser light irradiating part in such a way that the flow direction of the fluid in the flow path crosses the light path;    through the light receiving element The process of light in the aforementioned foreign matter detection area;    the process of collecting light to the light-receiving element by a light-collecting lens arranged on the optical path between the flow path portion and the light-receiving element to form a light-collecting point;    by detecting Part, the process of detecting foreign matter in the fluid based on the aforementioned signal;    the width of the light-receiving area facing the light-collecting point in the light-receiving element is smaller than the width of the light-collecting point. [0009] The storage medium of the present invention is a storage medium that stores a computer program of a foreign object detection device for detecting foreign objects in a fluid supplied to a processed body, wherein the aforementioned computer program is grouped into a group of steps to execute this Invented foreign body detection method. [Effects of the invention]   [0010] The foreign object detection device of the present invention includes: the flow direction of the fluid in the flow path part through which the fluid supplied to the object flows crosses the optical path, and the flow The laser light irradiating part for irradiating the laser light in the foreign object detection area in the path, and the light collecting lens that collects the light passing through the foreign object detection area and forms the light collecting point on the light receiving element. The light receiving element faces the aforementioned The width of the light-receiving area of the light-gathering spot is smaller than the width of the light-gathering spot. With such a configuration, it is possible to suppress the inclusion of noise in the signal output from the light-receiving element, and it is possible to detect foreign objects with high accuracy.

[實施形態]   [0012] 圖1為適用本發明的異物檢出裝置的塗佈、顯像裝置1的概略圖。該塗佈、顯像裝置1具備:對被處理體即基板例如晶圓W分別供應藥液而進行處理的光阻塗佈模組1A、1B,抗反射膜形成模組1C、1D,保護膜形成模組1E、1F。該等模組1A~1F,為對晶圓W供應藥液而進行處理的藥液供應模組。塗佈、顯像裝置1由該等模組1A~1F對晶圓W供應各種藥液,在依序形成抗反射膜、光阻膜、及曝光時用以保護光阻膜的保護膜之後,例如將經浸潤曝光的晶圓W顯像。   [0013] 上述模組1A~1F具備藥液的供應路,塗佈、顯像裝置1可以檢出流通於該供應路中的藥液中之異物。流通於上述供應路中的藥液,被供應至晶圓W。接著,同時進行向晶圓W的藥液供應與異物的檢出。所謂異物,例如是粒子、氣泡、及粒徑比構成藥液的正常的聚合物還大的異常的聚合物等。所謂的異物的檢出,具體上例如是在預定的期間中,流經藥液的流路的預定的檢出區域的異物總數與各異物的尺寸的檢出。在塗佈、顯像裝置1中設有光供應部2,光供應部2藉由光纖23將從光源21輸出的例如波長532nm的雷射光導光至設於模組1A~1F的異物檢出單元4。   [0014] 模組1A~1F具有概略相同的構成,在此說明圖1所示的光阻塗佈模組1A的概略構成。光阻塗佈模組1A具備例如11個噴嘴11A~11K,其中10個噴嘴11A~11J向晶圓W作為藥液吐出光阻,而形成塗佈膜即光阻膜。噴嘴11K向晶圓W吐出稀釋液。稀釋液被供應至被供應光阻前的晶圓W,為提高光阻的潤濕性的預濕潤用藥液,為光阻的溶劑。   [0015] 噴嘴11A~11J連接至形成藥液的供應路的藥液供應管12A~12J之下游端,藥液供應管12A~12J的上游端,藉由閥門V1各自連接至光阻的供應源13A~13J。各光阻的供應源13A~13J具備:儲留例如光阻的瓶、及將從瓶所供應的光阻壓送至噴嘴11A~11J的泵。儲留於供應源13A~13J的各瓶中的光阻的種類互為不同,對晶圓W供應從10種光阻中所選擇出的1種光阻。   [0016] 噴嘴11K連接至藥液供應管12K之下游端,藥液供應管12K的上游端,通過閥門V1連接至供應源13K。供應源13K除了儲留上述的稀釋液來取代光阻以外,與供應源13A~13J具有相同的構成。亦即,當處理晶圓W時,藥液流經藥液供應管12A~12K的時點互相不同。藥液供應管12A~12K由具有可撓性的材質,例如由樹脂所構成,以不妨礙後述的噴嘴11A~11K的移動的方式來構成。在藥液供應管12A~12K中的噴嘴11A~11K與閥門V1之間,介設有分光液槽15A~15K。分光液槽15A~15K作為異物的測定用的流路部而構成,檢出通過其內部的異物。有關於分光液槽15A~15K於之後詳述。   [0017] 圖2中就光阻塗佈模組1A表示更詳細的構成之一例。圖中31、31為轉盤,在吸附保持各個晶圓W的裏面中央部使其維持水平的同時,使保持的晶圓W繞鉛直軸旋轉。圖中32、32為罩杯,包圍住被保持於轉盤31、31的晶圓W的下方及側方,抑制藥液的飛散。圖中33為繞鉛直軸旋轉的旋轉台,在旋轉台33的上方設置有可在水平方向自由移動的垂直支柱34、及噴嘴11A~11K的支架35。36為沿著支柱34可自由升降的升降部,37為可以使升降部36在與支柱34的移動方向垂直之水平方向上自由移動的臂。臂37的前端設置有噴嘴11A~11K的裝卸機構38。藉由旋轉台33、支柱34、升降部36及臂37的協動動作,在各轉盤31上及支架35之間移動噴嘴11A~11K。   [0018] 在上述旋轉台33及罩杯32的側方,以不干涉移動的臂37及支柱34的方式設置異物檢出單元4。藉由該異物檢出單元4、上述光供應部2、及後述控制部6來構成本發明的異物檢出裝置。圖3表示該異物檢出單元4的平面圖。異物檢出單元4具備:雷射光照射部51、受光部52、流路陣列16,例如作為利用前方散射光的光散射方式的粒子計數器而構成。也就是說,在受光元件接收到因異物而產生的散射光時,基於從該受光元件輸出的信號的變化來進行異物的檢出。   [0019] 上述光纖23的下游端,通過準直器42連接至雷射光照射部51。例如在塗佈、顯像裝置1的運轉中,從光供應部2常時地供應光至光纖23,藉由後述的閘門41的光路的開關,切換向流路陣列16供應光的狀態、與停止向流路陣列16供應光的狀態。光纖23以不妨礙後述的雷射光照射部51的移動的方式而具有可撓性。   [0020] 關於流路陣列16,參照圖4的斜視圖進行說明。形成藥液的流路部的流路陣列16為石英製,作為角形的橫長區塊而構成,在上下方向具備各別形成的11個貫通口。各貫通口沿著流路陣列16的長度方向配列,各貫通口與該貫通口周圍的壁部作為上述的分光液槽15A~15K而構成。接著,分光液槽15A~15K形成立起的管,藥液於構成該分光液槽15A~15K的各貫通口從上方向下方流動。將分光液槽15A~15K的各貫通口作為流路17A~17K。流路17A~17K相互同樣地構成,如同既述在各藥液供應管12A~12K分別介設。   [0021] 回到圖3繼續說明。上述雷射光照射部51及受光部52,將流路陣列16從前後夾持並以互相對向的方式設置。圖中43為將雷射光照射部51及受光部52從流路陣列16的下方側支持的載台,藉由圖未示的驅動機構在左右方向移動自如而構成。藉由這樣的載台43移動,雷射光照射部51能夠將從光纖23導出的光照射至流路17A~17K之中選擇出的一個流路17,受光部52接收以此方式照射至流路17而透過該流路17的光。也就是說,相對於藥液的流動方向以交叉的方式在流路17形成光路。   [0022] 圖5為雷射光照射部51及受光部52的概略構成圖。在說明的方便上,將從雷射光照射部51朝向受光部52的方向作為後方。雷射光照射部51具備光學系統,在該光學系統中例如包含集光透鏡53。又,在圖5中雖省略圖示,但如圖3所示在雷射光照射部51中,設有上述的閘門41。   [0023] 上述的準直器42朝向後方側在水平方向上照射雷射光。閘門41在遮蔽準直器42及集光透鏡53之間的光路的遮蔽位置(圖3中以鏈線表示)、與從該光路退避的開放位置(圖3中以實線表示)之間移動,使該光路開閉。集光透鏡53包含:柱狀透鏡及例如稱為鮑威爾透鏡或雷射線產生透鏡的透鏡,使從準直器42照射的雷射光集光至流路17A,並就光路的橫剖面,以使與該藥液的流動方向垂直的方向長於藥液的流動方向的方式,使雷射光平化。在比集光透鏡53還前方側,光路的橫剖面(向前後方向觀察時的剖面)例如為略真圓的圓形,藉由集光透鏡53而在分光液槽15內的光路的橫剖面,設為例如具有沿著左右方向的長徑的橢圓形。   [0024] 形成於流路17A的光路中,能量密度較高的集光區域成為異物的檢出區域50,對進入該檢出區域50的異物進行檢出。因為如同上述而在流路17A形成光路,該檢出區域50為左右橫長,以平面視時相對於流路17A的面積的檢出區域50的面積比例較大。藉由形成這樣的檢出區域50,在流經流路17A內的異物總數之中,被檢出的異物的數量的比例變高。   [0025] 接著說明關於受光部52。該受光部52,具備由前方側向後方側依序配列的光學系統54、遮罩61、光檢出部40。光學系統54具備分別配置於前方側、後方側的對物透鏡56、及集光透鏡57,藉由對物透鏡56使透過分光液槽15A的光成為平行光,藉由集光透鏡57集光至光檢出部40。   [0026] 接著關於光檢出部40參照圖6的正視圖進行說明。此外,圖6表示從遮罩61的前方位置向後方觀察時的光檢出部40。光檢出部40例如藉由由各個光二極體而形成的64個受光元件來構成,各受光元件相互具有同樣的構成。受光元件例如以形成2×32的行列的方式相互隔著間隔而配置。將配置於上側的受光元件作為受光元件45A、配置於下側的受光元件作為受光元件45B。圖中以L4表示的受光元件45A、45B的左右的寬度在此例中為53μm。關於照射至該光檢出部40的光路的橫剖面也一樣,長邊為沿著左右方向的平橢圓,以受光元件45A位於該光路的上半分、受光元件45B位於該光路的下半分的方式,來配置該等各受光元件45A、45B。在左右方向的相同位置的受光元件45A、受光元件45B成為一組。關於該等受光元件45A、45B,向後方側觀察時具有從左側依序作為1通道、2通道、3通道・・・32通道(ch)而附加通道(ch)編號來表示的情形。   [0027] 異物檢出單元4具備對應受光元件45A、45B的各通道而各別設置的計32個電路部46。參照圖7說明關於該電路部46的話,電路部46具備:分別設置於受光元件45A及受光元件45B後段的互阻抗放大器(TIA)47A、47B、分別設於TIA47A、47B的後段的差分電路48。受光元件45A及受光元件45B將因應受光的光強度的電流供應至TIA47A、47B,而TIA47A、47B將對應各供應的電流的電壓信號輸出至差分電路48。差分電路48將來自TIA47A的電壓信號與來自TIA47B的電壓信號間的差分的電壓信號輸出至後述的控制部6。控制部6基於從上述差分電路48輸出的信號來進行異物的檢出。這樣基於對應至來自受光元件45A、45B的各輸出的差分的信號而進行的異物檢出,是為了除去在受光元件45A、45B所共通檢出的雜訊。關於上述電路部46也一樣,有與連接的受光元件45A、45B的通道編號附上相同通道編號來表示的情形。   [0028] 關於受光元件45A、45B與上述分光液槽的檢出區域50間的關係,利用圖8的模式圖來更詳加說明。圖中的二點鏈線的箭頭表示向分光液槽15A的流路17A進行光照射時的從雷射光照射部51至受光元件45A群的光路。此外,在該圖8中為了方便說明而省略遮罩61。在流路17A的光路中向前方側觀察時,將集光區域即檢出區域50的上半分在長度方向分割成32個的分割檢出區域的各者,從右端依序稱為1ch的分割檢出區域~32ch的分割檢出區域。圖中以L21表示的1個分割檢出區域的左右寬度,例如為0.85μm,在各分割檢出區域附加符號59。   [0029] 在光學系統54中,1ch的分割檢出區域59與1ch的受光元件45A以1對1對應、2ch的分割檢出區域59與2ch的受光元件45A以1對1對應、3ch的分割檢出區域59與3ch的受光元件45A以1對1對應,同樣地順序相同的通道的分割檢出區域59與受光元件45A以1對1對應的方式構成。亦即,於1ch的分割檢出區域59與異物反應而產生的反應光(因反應而受到攝動的光)幾乎全部照射到1ch的受光元件45A、於2ch的分割檢出區域59與異物反應而產生的反應光(因反應而受到攝動的光)幾乎全部照射到2ch的受光元件45A。以這種進行受光的方式,透過各通道的分割檢出區域59的雷射光的例如85%以上在所對應的通道的受光元件45A被受光。在圖8中,以實線的箭頭、虛線的箭頭來表示從相互不同的通道的分割檢出區域59照射至相互不同的通道的受光元件45A的反應光的光路。   [0030] 以這樣進行光照射,對應於進入檢出區域50的異物的信號,從任一個通道的受光元件45A產生。例如僅未照射至該反應光所對應的通道的受光元件45A而跨越至其他通道的受光元件45A入光的話,流至受光元件45A的電流位階會變低,而檢出精度變低。也就是說,藉由如同上述的方式將分割檢出區域59與受光元件45A以對應的方式來構成,提高異物的檢出精度。   [0031] 同樣地,將集光區域即檢出區域50的下半分在長度方向分割成32個的分割檢出區域59的各者,稱為1ch的分割檢出區域59~32ch的分割檢出區域59的話,1個通道的分割檢出區域59對應1個通道的受光元件45B。也就是說,以1個通道的分割檢出區域59的反應光照射至1個通道的受光元件45B的方式來構成光學系統54。   [0032] 又,以上述那樣具有複數通道的受光元件45A、45B的方式來構成,是因為藉由抑制1個受光元件45(45A、45B)所接收到的雷射光的能量,而使因雷射光的光子波動而引起的射擊雜訊降低,並使SN比(S/N)提升,也是因為藉由抑制流經對應於1個受光元件45的檢出區域的正常的聚合物之數,抑制該聚合物所引起的雜訊,而使SN比提升。此外,雖例示了在分光液槽15A形成檢出區域50時的光路,但在其他分光液槽15B~15K形成檢出區域50的情形也同樣形成光路,進行異物的檢出。   [0033] 這裡更詳細地說明有關遮罩61。遮罩61如圖6所示,例如具備32個上下細長的開口部62,該等開口部62沿著左右配列,各通道的受光元件45A、45B位於前方。開口部62的左右的開口寬度L5比上述受光元件45A、45B的寬度L4還小。因此,從上述分割檢出區域59向受光元件45A、45B照射的光之中的一部分被遮光,僅其他的一部分被受光元件45A、45B所受光。受光元件45A、45B之中與開口部62重疊的區域,面向後述集光點63,形成從該受光元件45A、45B使信號輸出的受光區域。   [0034] 圖9中,將從檢出區域50的上半分的3ch的分割檢出區域59向3ch的受光元件45A的光路以點線來模式地表示。該圖9及圖6中,示出作為未設置遮罩61的情形中的從3ch的分割檢出區域59照射至3ch的受光元件45A而形成的雷射光的集光點63。因為如同上述一個分割檢出區域59的光幾乎全部,照射至對應該分割檢出區域59的受光元件45A,集光點63的左右的寬度L6與受光元件45A、45B的寬度L4相同,例如為53μm。也就是說,上述遮罩61的開口部62的寬度L5,比該集光點63的寬度L6還小。因此,向光路的形成方向即前後方向觀察時,受光元件45A及45B的受光區域的面積比集光點63的面積還小。   [0035] 此外,關於3ch的受光元件45A以外的受光元件45A、45B也一樣,面向從對應的分割檢出區域59一樣進行光照射而形成的集光點63。也就是說,從集光透鏡57以橫跨各通道的受光元件45A、45B的方式形成集光點來進行光照射,圖6、圖9所示的集光點63表示對應以此方式橫跨各受光元件45A、45B的集光點中的一個分割檢出區域59的區域。也就是說,在該例中從構成各個異物檢出區域的64個分割檢出區域59,向64個受光元件45各自照射光而形成集光點63,各集光點63的寬度比各受光元件45的寬度還小。   [0036] 說明關於設置上述遮罩61的理由。在流經流路17A~17J的光阻中,包含用以形成光阻膜的正常的聚合物,該聚合物藉由通過上述分割檢出區域59而向受光元件45A、45B照射該聚合物所引起的散射光,在從該受光元件45A、45B輸出的信號中會產生背景雜訊。對應1個受光元件45A或45B的分割檢出區域59越大,因為會受到該正常的聚合物所造成的影響,該雜訊信號的振幅變得越大。   [0037] 即便異物通過分割檢出區域59,而輸出異物的檢出信號,檢出具有比該雜訊信號的振幅還小的振幅的信號是困難的。也就是說,藉由雜訊的信號來決定異物的測定可能的最小粒徑(最小可測粒徑)。其中,設置上述遮罩61而使得受光元件45A、45B的左右的寬度比集光點63的左右的寬度還小,抑制在受光元件45A、45B中因受光而可輸出信號的受光區域的面積,抑制了檢出的聚合物之數。藉此,抑制了從受光元件45A、45B輸出的雜訊信號的位階而使SN比提升,也能夠檢出較小的異物,進而高異物的檢出精度。   [0038] 此外,因為上述雜訊信號的振幅,會被包含於藥液中的聚合物大小及聚合物與溶劑間的折射率差所影響,上述遮罩61的開口寬度L5的適切值因藥液的種類而有所不同。在這裡作為代表,作為設定對應在流路17A流通的光阻的開口寬度L5者,參照圖10的圖形同時說明該設定方法。圖形的橫軸表示開口寬度L5(單位:μm)。圖形的縱軸表示從受光元件45A或45B輸出的電壓信號的振幅。   [0039] 圖形的曲線A1為關於光阻中的檢出對象的異物之中,具有最小粒徑者,表示開口寬度L5與振幅間的對應關係。關於該曲線A1,雖隨著圖形所示的開口寬度L5變大振幅也漸漸地變大,但漸漸地振幅的上升被抑制,最終到達頂點。又,開口寬度L5與從受光元件45A或45B輸出的雜訊振幅之間的對應關係,在圖形中作為直線A2所示的一次函數來表現,隨著開口寬度L5變大該雜訊振幅也跟著變大。因這樣異物的檢出信號的特性與雜訊的特性互為相異者經由發明者的實驗而變得明朗化。此外,該等曲線A1、直線A2基於例如由實驗取得的資料,例如由最小平方法等來算出。   [0040] 因為若異物的檢出信號的振幅比雜訊的振幅還小的話,難以區別該檢出信號與雜訊,故就信號強度在成為曲線A1>直線A2的範圍內設定開口寬度L5的值。也就是說,圖形所示的B1~B2的範圍內成為開口寬度L5的候補。此外,如同上述開口寬度L5小者檢出流路17A的聚合物的量少,能夠抑制雜訊。但是,如圖形所示開口寬度L5變得越小曲線A1的斜率就越陡,若曲線A1的斜率變比直線A2的斜率還大的話,因為檢出信號比雜訊更快降低,難以提升SN比。在此,在上述B1~B2的範圍內,以曲線A1的切線的斜率與直線A2的斜率相互一致的方式來設定開口寬度L5較佳。   [0041] 上述斜率相互一致指的是將直線A2的斜率作為Y1/X1時,曲線A1的切線的斜率包含於0.95×(Y1/X1)~1.05×(Y1/X1)的範圍內。在圖中以此方式將該斜率一致於直線A2的斜率的曲線A1的切線作為A3表示,將對應該切線A3的開口寬度L5作為B3表示。此外,雖如同上述根據藥液的種類而適切的開口寬度L5有所不同,但關於在流路17A~17J流通的光阻,適切的開口寬度L5為一致,在該實施形態中,於該等流路17A~17J設為共用遮罩61。   [0042] 接著,說明有關設置於塗佈、顯像裝置1的異物的檢出部即控制部6(參照圖1)。控制部6例如由電腦所構成,具有未圖示的程式儲存部。在該程式儲存部中,儲存有進行在各模組的晶圓W的處理、及如同上述的基於從受光元件的各通道輸出的信號的異物的檢出、由後述的搬送機構進行的在塗佈、顯像裝置1內的晶圓W的搬送等的各動作的命令(步驟群)組入而成的程式。藉由該程式,從控制部6輸出控制信號至塗佈、顯像裝置1的各部,藉此進行上述的各動作。該程式例如以收納於硬碟、光碟、磁光碟、或記憶卡等的記憶媒體的狀態,被儲存於程式儲存部。   [0043] 關於圖1所示的光阻塗佈模組1A以外的模組已預先說明,光阻塗佈模組1B與模組1A具有一樣的構成。抗反射膜形成模組1C、1D及保護膜形成模組1E、1F,例如除了供應抗反射膜形成用的藥液、及保護膜形成用的藥液來取代光阻及稀釋液以外,與模組1A與1B具有同樣的構成。抗反射膜形成用的藥液與光阻一樣含有聚合物。例如在模組1C~1F中,也與模組1A、1B一樣供應藥液至晶圓W。   [0044] 接著邊參照圖11的時序流程,邊說明有關於在上述光阻塗佈模組1A中進行的晶圓W的處理及異物的檢出。該時序流程中,各別表示:整定13A~13K之中的一個供應源13中的泵的壓力的時點、藉由臂37來移動對應11A~11K之中的一個供應源13的一個噴嘴11的時點、對應12A~12K之中一個供應源13的藥液供應管12的閥門V1的開關時點、切換從雷射光照射部51照射雷射光的狀態與停止照射該雷射光的狀態的時點、藉由控制部6取得來自光檢出部40的各通道的信號的時點。上述切換照射雷射光的狀態與照射停止狀態的時點,也可以稱之為異物檢出單元4的閘門41開關的時點。   [0045] 實際上,在晶圓W雖以稀釋液、光阻的順序進行塗佈,但為了方便說明,從塗佈光阻時的動作開始說明。首先,以將晶圓W至搬送轉盤31上並保持的狀態,例如將噴嘴11A搬送至晶圓W上,並由供應源13A的泵進行光阻的吸引,藉此以成為預定壓力的方式開始進行整定(時刻t1)。例如一同進行該噴嘴的移動及泵的動作,雷射光照射部51及受光部52移動至夾持分光液槽15A的位置。此時將異物檢出單元4的閘門41關閉。   [0046] 噴嘴11A在晶圓W上靜止(時刻t2),晶圓W以預定的旋轉數成為旋轉的狀態。接著將藥液供應管12A的閥門V1開啟,在從泵向噴嘴11A以預定的流量壓送光阻的同時將閘門41開啟,從雷射光照射部51照射雷射光,透過分光液槽15A。亦即,在分光液槽15A的流路17A,如圖8、圖9所說明的形成檢出區域50,向受光部45A、45B進行光照射(時刻t3)。如圖9所說明的,藉由遮罩61來將構成檢出區域50的分割檢出區域59中的光的一部分遮光,從各受光元件45A、45B向電路部46輸出的信號中所包含的,因光阻中的正常的聚合物所引起的雜訊變小。   [0047] 接著,被壓送的光阻通過分光液槽15A,從噴嘴11A向晶圓W的中心部吐出。閥門V1的開度上升,直到成為預定的開度後開度的上升停止(時刻t4)。然後,由控制部6開始取得來自各通道的電路部46的輸出信號(時刻t5)。異物流經流路17A,在檢出區域50從上方向下方流動時,從對應異物流經的分割檢出區域59的通道的受光元件45A或受光元件45B,輸出對應該異物的信號,來自電路部46的輸出信號的位階發生變化。之後,控制部6停止取得來自各通道的受光元件45的輸出信號(時刻t6),接著在關閉閘門41,在停止來自雷射光照射部51的光照射的同時,關閉藥液供應管12A的閥門V1(時刻t7),停止向晶圓W的光阻的吐出。被吐出的光阻因離心力而延伸至晶圓W的周圍部,形成光阻膜。   [0048] 在上述時刻t5~t6間,基於從各通道的電路部46取得的輸出信號,進行受光元件45的每個通道的異物計數。再來基於該輸出信號,測定異物的粒徑,並進行分級。也就是說,就粒徑在設定的複數的每個範圍中,計數異物的數量。接著,將在每個通道檢出的異物的數量合計,算出在檢出區域50全體檢出的異物的數量(作為異物的總數)。然後,進行異物的總數是否在閾值以上的判定、及比預定的粒徑還大的異物的數量是否在閾值以上的判定。   [0049] 接著,當判定上述異物總數在閾值以上時或判定比預定的粒徑還大的異物的數量在閾值以上時,在輸出警告的同時,停止模組1A的動作,中止晶圓W的處理。該警告,具體來說例如是向構成控制部6的監視器的預定顯示、或從構成控制部6的揚聲器的預定聲音的輸出。此外,該警告的輸出,包含例如是用以將15A~15K之中輸出異常的分光液槽15通報給使用者的顯示或聲音的輸出。當判定異物總數不在閾值以上,且判定比預定的粒徑還大的異物的數量不在閾值以上時,不進行警告的輸出,也不進行模組1A動作的停止。此外,上述的各演算及各判定藉由形成計數部的控制部6來進行。   [0050] 在向晶圓W吐出稀釋液時,除了取代噴嘴11A而將噴嘴11K搬送至晶圓W上、取代供應源13A的泵而使供應源13K的泵動作、取代藥液供應管12A的閥門V1而開關藥液供應管12K的閥門V1、及取代向分光液槽15A進行光照射而向分光液槽15K進行光照射以外,依照圖11的時序流程使各部動作。藉由該動作,與向晶圓W的稀釋液的供應一同,進行該稀釋液中的異物的檢出。此外,雖然在稀釋液中未含有聚合物,但如同後述的評價試驗所示,與檢出光阻中的異物的情形一樣,確認到藉由適切地設定遮罩61的開口寬度L5能夠使雜訊降低而使異物的檢出精度提升。供應至晶圓W的稀釋液與光阻一樣藉由晶圓W的旋轉而供應至晶圓W的表面全體。通過上述流路17A所供應的光阻,以其方式對供應有稀釋液的晶圓W進行供應。   [0051] 向晶圓W的稀釋液供應後,當對該晶圓W供應包含於供應源13A以外的供應源的光阻時,除了將使用的光阻吐出的噴嘴被搬送至晶圓W上、對應使用的光阻的供應源的泵進行動作、對應使用的光阻的供應管的閥門V1進行開關、及照射光至對應使用的光阻的分光液槽以外,進行與將供應源13A的光阻供應至晶圓W的情形一樣的動作。   [0052] 在上述圖11的流程說明的異物的檢出中,為了在分光液槽15A的液流在穩定的狀態下藉由進行異物的檢出而使測定精度提高,如以上所述將閥門V1開關的時點、與控制部6開始及結束輸出信號的取得的時點互相錯開。例如上述的時刻t4~t5間為10微秒~1000微秒,時刻t6~t7間為10微秒~100微秒。作為代表雖說明關於模組1A的動作,但有關其他的模組1B~1F也和模組1A一樣,進行向晶圓W的藥液的供應及異物的檢出。   [0053] 根據該塗佈、顯像裝置1,設置有:供應至晶圓W的光阻的流路的一部分即構成光阻中的異物的測定區域的分光液槽15A~15K、接收從雷射光照射部51照射而透過該分光液槽15A~15K的光的受光元件45A、45B、用來使能檢出受光元件45A、45B的光的區域的寬度比對應形成於分光液槽15A~15K的檢出區域50的各分割檢出區域59的集光點63的寬度還小的遮罩61。因此,抑制了包含於來自受光元件45A、45B的輸出信號的雜訊的位階,其結果能夠增大該輸出信號的SN比。接著,設置於塗佈、顯像裝置1的控制部6,就光阻中的異物能夠進行高精度的檢出。此外,集光點63的寬度與受光元件45A、45B的寬度間的適切對應關係係因應藥液而決定。也就是說未設置遮罩61時,因為每種藥液其適切的集光透鏡57及受光元件45A、45B的寬度不同,如同上述為了設為適切的對應關係需調整該等寬度,但如同本實施形態設置遮罩61時,藉由進行將遮罩61的開口寬度(狹縫的寬度)因應在裝置使用的藥液而調整的這種簡易的調整,能夠設為上述適切的對應關係。因此,能夠防止集光透鏡57及受光元件45A、45B的大型化而使裝置構成簡素化,具有能使裝置的製造成本降低的優點。   [0054] 此外,藉由進行這種異物的檢出,可監視對晶圓W供應的光阻的清淨度。接著當光阻的清淨度低於預定的基準時,如同上述將模組的動作停止,藉此中止在該模組的後續晶圓W的處理。因此,因為可防止供應清淨度低的光阻至後續的晶圓W,可防止降低產能。再來,在藥液供應管12A~12K之中,因為特定出檢出異物的供應管12,故塗佈、顯像裝置1的使用者能夠在模組的動作停止後迅速地進行保養及修理。因此,能夠抑制模組的動作停止的時間變長,其結果,能夠抑制於塗佈、顯像裝置1中的半導體製品的生產性降低。   [0055] 再來,當如同上述判定在檢出區域50流通的異物總數在閾值以上時、及/或當判定具有比預定的粒徑還大的粒徑的異物的數量在閾值以上時,作為對應於此的處理,不限於警告的輸出及模組的動作停止。例如,光阻的供應源13A~13J之中,從對應作出如此判定的分光液槽15的供應源13,將光阻作為供應管12的洗淨液供應至噴嘴11,將藥液供應管12中含有的異物從噴嘴11去除。亦即,自動地將藥液供應管12洗淨。在該動作後,對後續的晶圓W再度開始處理也可以。   [0056] 接著,有關塗佈、顯像裝置1的具體構成例,一邊參照圖12、圖13一邊進行說明。圖12、13分別為該塗佈、顯像裝置1的平面圖、及概略縱斷側面圖。該塗佈、顯像裝置1將載體區塊D1、處理區塊D2、及介面區塊D3以直線狀連接而構成。介面區塊D3連接曝光裝置D4。載體區塊D1將載體C對塗佈、顯像裝置1內進行搬入及搬出,並備:載體C的載置台71、開關部72、通過開關部72用以從載體C搬送晶圓W的搬送機構73。   [0057] 處理區塊D2由對晶圓W進行液處理的第1~第6的單位區塊E1~E6從下往上依序層積所構成。在互相畫分各單位區塊E1~E6的同時,分別具備搬送機構F1~F6,於各單位區塊E中互相並行而進行晶圓W的搬送及處理。在這裡,單位區塊之中作為代表參照圖12說明第3單位區塊E3。從載體區塊D1向介面區塊D3搬送區域74延伸形成,在該搬送區域74設置上述的搬送機構F3。又,從載體區塊D1向介面區塊D3觀察時,在搬送區域74的左側配置有棚單元U。棚單元U具備加熱模組。又,從載體區塊D1向介面區塊D3觀察時,在搬送區域74的右側,將上述光阻塗佈模組1A、保護膜形成模組1E沿著搬送區域74設置。   [0058] 第4單位區塊E4和第3單位區塊E3具有相同的構成,設置有光阻塗佈模組1B及保護膜形成模組1F。在單位區塊E1、E2中,除了分別設置抗反射膜形成模組1C、1D來取代光阻塗佈模組1A、1B及保護膜形成模組1E、1F以外,和單位區塊E3、E4具有相同的構成。單位區塊E5、E6具備:供應顯像液至晶圓W,來使光阻膜顯像的顯像模組。顯像模組除了作為藥液將顯像液供應至晶圓W以外,和模組1A~1F具有相同的構成。   [0059] 於處理區塊D2中的載體區塊D1側,設置有:橫跨各單位區塊E1~E6並上下延伸的塔T1、用以對塔T1進行晶圓W的收授的升降自如之搬送機構75。塔T1由互相層積的複數模組所構成,於單位區塊E1~E6的各高度設置的模組,能夠在該單位區塊E1~E6的各搬送機構F1~F6之間收授晶圓W。作為該等模組,包含:設置於各單位區塊的高度位置的收授模組TRS、進行晶圓W的溫度調整的調溫模組CPL、暫時保管複數枚晶圓W的緩衝模組、及對晶圓W的表面進行疏水化的疏水化處理模組等。為了簡化說明,關於前述疏水化處理模組、調溫模組、前述緩衝模組在圖式中省略。   [0060] 介面區塊D3具備橫跨單位區塊E1~E6而上下延伸的塔T2、T3、T4,且設置:用以對塔T2及塔T3進行晶圓W的收授的升降自如的收授機構即搬送機構76、用以對塔T2及塔T4進行晶圓W的收授的升降自如的收授機構即搬送機構77、及用以在塔T2與曝光裝置D4之間進行晶圓W的收授之搬送機構78。   [0061] 塔T2以互相層積:收授模組TRS、存放曝光處理前的複數枚晶圓W並使其滯留的緩衝模組、存放曝光處理後的複數枚晶圓W的緩衝模組、及進行晶圓W的溫度調整的調溫模組等的方式構成,但在此省略緩衝模組及調溫模組的圖式。   [0062] 在處理區塊D2的上方設置既述的光供應部2,為了從光供應部2連接至單位區塊E1~E4的模組1A~1F,使光纖23向下方引繞。又,在處理區塊D2上方構成上述的控制部6,設置有進行基於來自既述的各通道的電路部46的輸出信號的每個通道的異物的數量的算出、異物的總數的算出及各異物的粒徑的算出的演算部60,藉由圖未示的配線將演算部60與模組1A~1F連接。   [0063] 說明有關於該塗佈、顯像裝置1的晶圓W的搬送經路。晶圓W藉由搬送機構73從載體C搬送至處理區塊D2中的塔T1的收授模組TRS0。從該收授模組TRS0晶圓W被分配搬送至單位區塊E1、E2。例如將晶圓W收授至單位區塊E1時,塔T1的收授模組TRS之中,相對於對應單位區塊E1的收授模組TRS1(藉由搬送機構F1而可進行晶圓W的收授的收授模組),從前述TRS0收授晶圓W。又將晶圓W收授至單位區塊E2時,塔T1的收授模組TRS之中,相對於對應單位區塊E2的收授模組TRS2,從前述TRS0收授晶圓W。該等晶圓W的收授,藉由搬送機構75來進行。   [0064] 經由這樣分配的晶圓W,以TRS1(TRS2)→抗反射膜形成模組1C(1D)→加熱模組→TRS1(TRS2)的順序進行搬送,接著藉由搬送機構75分配至對應單位區塊E3的收授模組TRS3、及對應單位區塊E4的收授模組TRS4。   [0065] 以此方式分配至TRS3(TRS4)的晶圓W,以TRS3(TRS4)→光阻塗佈模組1A(1B)→加熱模組→保護膜形成模組1E(1F)→加熱模組→塔T2的收授模組TRS的順序進行搬送。然後,該晶圓W藉由搬送機構76、78,通過塔T3被搬入曝光裝置D4。曝光後的晶圓W,藉由搬送機構78、77,在塔T2、T4之間被搬送,分別被搬送至對應單位區塊E5、E6的塔T2的收授模組TRS15、TRS16。然後,以加熱模組→顯像模組→加熱模組→收授模組TRS5(TRS6)的順序進行搬送後,通過搬送機構73被送回至載體C。   [0066] 此時,如圖14所示,受光元件45A、45B的寬度L4以小於上述集光點63的寬度L6來構成也可以。此外,該圖14所示的集光點63,為形成於受光元件45的前面及與該前面相同的平面上的點。也就是說,即便未設置遮罩61,而使受光元件45A、45B中能檢出光的受光區域的寬度比集光點63的寬度L6還小,能夠抑制正常的聚合物及溶劑所造成的散射光照射至受光元件45A、45B。   [0067] 此外,對應1個集光點63的受光元件45A之數不限於1個,將複數微小的受光元件45A對應1個集光點63而配置,將各受光元件45A的輸出信號合計進行檢出也可以。同樣地就受光元件45B而言對1個集光點63設置複數個也可以。又,在既述的例中,雖設置複數受光元件45,而集光至各受光元件45的方式來構成,但僅設置1個受光元件45,以面向該受光元件45的方式形成1個既述的集光點63,使該受光元件45的受光區域的寬度變得比該集光點63的寬度還小的方式來構成也可以。   [0068] 此外,在圖15所示的受光部52,既述的遮罩61以在前後方向重疊的方式設置。在受光部設置有使該等遮罩61在左右方向各自移動的移動機構64。藉由各移動機構64來移動遮罩61,各遮罩61的開口部62的重疊區域的寬度會變化。該2個遮罩61形成1個遮罩65,藉由各遮罩61的移動而能夠變更該遮罩65的開口寬度L5。藉由這樣的構成,流路17A~17K之中,以成為對應在進行異物的檢出的流路流動的藥液的開口寬度L5的方式,來調整受光部52中的各遮罩61的位置。因此,在遮罩65中,因應成為異物的檢出對象的藥液,來變更開口寬度L5的大小。因此,能夠更高精度進行各流路中的藥液中的異物的檢出。   [0069] 此外,雖說明本發明適用利用前方散射光的光散射光方式的粒子計數器之例,但本發明也能適用於將雷射光照射異物所生成的繞射光(繞射紋)在光檢出部40受光,基於該繞射紋的受光所造成的輸出信號的變化,來檢出異物的粒子計數器,也能夠適用於由稱為IPSA法的手法來進行檢出的粒子計數器。也就是說,本發明的適用並不限定於具有特定的測定原理的粒子計數器。   [0070] 此外,成為檢出異物的對象的藥液並不限於上述光阻及稀釋液。例如,本發明適用於保護膜形成模組1E、1F、顯像模組,進行保護膜形成用的藥液中的異物及顯像液中的異物的檢出也可以。其他,例如用以在晶圓W形成絕緣膜的藥液供應裝置、或供應用以洗淨晶圓W的藥液即洗淨液的洗淨裝置、用以將複數晶圓W互相貼合的黏接劑作為藥液向晶圓W供應的裝置等的各藥液供應裝置也能夠適用於本發明。   [0071] 此外,本發明並不限於適用於藥液供應裝置。例如在流路陣列16設置與流通藥液的分光液槽15不同的氣體流通用的分光液槽15。接著,藉由吸引泵等能夠將塗佈、顯像裝置1中的搬送區域74等的搬送晶圓W的區域的氛圍供應至該氣體流通用的分光液槽15。搬送晶圓W的區域,也包含處理光阻塗佈模組1A等的處理晶圓W的區域。接著,和檢出藥液中的異物的情況一樣,將氣體流通用的分光液槽在氣體的流通中,於該分光液槽形成光路而進行異物的檢出。因此,本發明不只是能夠檢出包含於供應至晶圓W的液體中的異物,也能檢出包含於周邊環境中的異物。也就是說,能夠檢出包含於流體中的異物。此外,本發明並不限於既述的各實施形態,能夠將各實施形態作相互組合、適宜變更。   [0072] [評價試驗]說明關於與本發明關連而進行的評價試驗。 ・評價試驗1   作為評價試驗1,在設有上述遮罩61的異物檢出單元4中,從雷射光照射部51通過流路17(17A~17K)將雷射光照射至受光部52,測定從受光元件45A、45B輸出的雜訊位階。該雜訊位階為電壓波形中的峰值間的差。又,將雷射光的照射中的流路17的藥液流通狀態在每次試驗中變更。   [0073] 評價試驗1之中,雷射光的照射中,將在流路17中以儲留純水的狀態而不形成液流者作為評價試驗1-1。將在流路17中以5mL/分流通純水者作為評價試驗1-2。將在流路17中以5mL/分流通稀釋液者作為評價試驗1-3。將在流路17中以5mL/分流通抗反射膜形成用的藥液者作為評價試驗1-4。又,關於該等各評價試驗1-1~1-4,利用開口寬度L5不同的遮罩61進行複數次,該開口寬度L5為5μm、15μm或53μm。   [0074] 圖16的圖形表示評價試驗1的結果,圖形的橫軸表示遮罩61的開口寬度(單位:μm)、圖形的縱軸表示雜訊位階(單位:mVpp)。根據圖形,得知在流路17流通藥液的評價試驗1-2~1-4中,開口寬度越小雜訊位階就越小,在雜訊位階與開口寬度之間,概略具有線性關係。因此,得知能夠取得圖10說明的直線A2。又,藉由適切地設定開口寬度,能夠使雜訊位階降低並提高SN比。   [0075] ・評價試驗2   在異物檢出單元4中,從雷射光照射部51通過流路17將雷射光照射至受光部52,就從受光元件45A、45B輸出的信號檢出SN比。在該受光部52中,也與在評價試驗1使用的受光部52一樣,設置遮罩61。又,在向流路17的雷射光的照射中,將在流路17流通的藥液於每次試驗變更。作為評價試驗2-1在流路17使純水流通、作為評價試驗2-2在流路17使稀釋液流通、作為評價試驗2-3在流路17使抗反射膜形成用的藥液流通、作為評價試驗2-4在流路17使光阻流通。但是,在該等評價試驗2-1~2-4在流路17中流通的各藥液中,會將由粒徑為46nm的PSL(聚苯乙烯乳膠)所形成的粒子作為異物混入。關於該等各評價試驗2-1~2-4,分別利用開口寬度L5為5μm、25μm、53μm的遮罩61進行測定。該評價試驗中的集光點63的寬度L6,與發明的實施形態相同為53μm。   [0076] 圖17的圖形表示評價試驗2的結果,圖形的橫軸表示遮罩61的開口寬度L5(單位:μm)、圖形的縱軸表示SN比(無單位)。如圖形所示,關於評價試驗2-1~2-4,開口寬度為25μm、5μm時的SN比會比開口寬度為53μm時還大,開口寬度為25μm時的SN比特別大。開口寬度為5μm或53μm時,最小可測粒徑為60nm左右,但開口寬度為25μm時最小可測粒徑為40nm左右。藉由這樣將開口寬度L5設定成比集光點63的寬度L6還小,因為SN比變高,而表現出本發明的效果。[Embodiment]   [0012] Fig. 1 is a schematic diagram of a coating and developing device 1 to which a foreign matter detection device of the present invention is applied. The coating and developing device 1 includes: photoresist coating modules 1A, 1B for processing by supplying chemical solutions to substrates such as wafers W to be processed, anti-reflective film forming modules 1C, 1D, and protective film Form modules 1E, 1F. These modules 1A to 1F are chemical liquid supply modules for supplying chemical liquid to the wafer W for processing. The coating and developing device 1 supplies various chemicals to the wafer W from the modules 1A to 1F, and after forming an anti-reflection film, a photoresist film, and a protective film for protecting the photoresist film during exposure, For example, the immersion-exposed wafer W is developed.  [0013] The above-mentioned modules 1A to 1F are equipped with a liquid medicine supply path, and the coating and developing device 1 can detect foreign objects in the liquid medicine flowing in the supply path. The chemical liquid circulating in the above-mentioned supply path is supplied to the wafer W. Then, the supply of the chemical solution to the wafer W and the detection of foreign objects are simultaneously performed. The foreign matter includes, for example, particles, bubbles, and abnormal polymers having a larger particle diameter than the normal polymers constituting the chemical liquid. The detection of foreign objects is specifically, for example, detection of the total number of foreign objects flowing through a predetermined detection area of the flow path of the medical solution and the size of each foreign object during a predetermined period. The coating and developing device 1 is provided with a light supply unit 2 which guides the laser light output from the light source 21, for example, with a wavelength of 532 nm, to the detection of foreign objects provided in the modules 1A to 1F through the optical fiber 23. Unit 4.  [0014] The modules 1A to 1F have roughly the same configuration. Here, the schematic configuration of the photoresist coating module 1A shown in FIG. 1 will be described. The photoresist coating module 1A includes, for example, 11 nozzles 11A to 11K, and 10 nozzles 11A to 11J discharge a photoresist to the wafer W as a chemical solution to form a photoresist film as a coating film. The nozzle 11K discharges the diluent to the wafer W. The diluent is supplied to the wafer W before the photoresist is supplied, and is a pre-wetting chemical solution for improving the wettability of the photoresist, and is a solvent for the photoresist. [0015] The nozzles 11A-11J are connected to the downstream ends of the liquid chemical supply pipes 12A-12J forming the supply path of the liquid chemical, and the upstream ends of the liquid chemical supply pipes 12A-12J are respectively connected to the supply source of the photoresist through the valve V1 13A~13J. The supply sources 13A to 13J of each photoresist include a bottle storing, for example, the photoresist, and a pump that pressure-feeds the photoresist supplied from the bottle to the nozzles 11A to 11J. The types of photoresist stored in the bottles of the supply sources 13A to 13J are different from each other, and one type of photoresist selected from ten types of photoresist is supplied to the wafer W.  [0016] The nozzle 11K is connected to the downstream end of the liquid chemical supply pipe 12K, and the upstream end of the liquid chemical supply pipe 12K is connected to the supply source 13K through the valve V1. The supply source 13K has the same configuration as the supply sources 13A to 13J except that the aforementioned diluent is stored instead of the photoresist. That is, when the wafer W is processed, the timing at which the chemical liquid flows through the chemical liquid supply pipes 12A to 12K are different from each other. The liquid medicine supply pipes 12A to 12K are made of a flexible material, such as resin, and are configured so as not to hinder the movement of the nozzles 11A to 11K described later. Between the nozzles 11A to 11K and the valve V1 in the chemical liquid supply pipes 12A to 12K, there are interposed spectroscopic liquid tanks 15A to 15K. The spectroscopic liquid tanks 15A to 15K are configured as flow passages for measuring foreign objects, and foreign objects passing through the inside are detected. The details of the spectroscopic liquid tanks 15A to 15K will be described later.  [0017] FIG. 2 shows an example of a more detailed configuration of the photoresist coating module 1A. In the figure, 31 and 31 are turntables, which suck and hold the inner center portion of each wafer W to maintain the level while rotating the held wafer W around a vertical axis. In the figure, 32 and 32 are cups, which surround the lower side and the side of the wafer W held by the turntables 31 and 31 to suppress the scattering of the chemical liquid. 33 in the figure is a rotating table that rotates around a vertical axis. Above the rotating table 33, a vertical support 34 that can move freely in the horizontal direction and a holder 35 for the nozzles 11A to 11K are provided. 36 is a free liftable along the support 34. The elevating portion 37 is an arm that can freely move the elevating portion 36 in a horizontal direction perpendicular to the moving direction of the pillar 34. An attachment/detachment mechanism 38 for the nozzles 11A to 11K is provided at the tip of the arm 37. The nozzles 11A to 11K are moved on the turntables 31 and between the brackets 35 by the coordinated operation of the rotating table 33, the support column 34, the elevating portion 36, and the arm 37.  [0018] On the side of the rotating table 33 and the cup 32, a foreign object detection unit 4 is provided so as not to interfere with the moving arm 37 and the support 34. The foreign object detection unit 4, the light supply unit 2 described above, and the control unit 6 described later constitute the foreign object detection device of the present invention. FIG. 3 shows a plan view of the foreign object detection unit 4. The foreign object detection unit 4 includes a laser light irradiation unit 51, a light receiving unit 52, and a flow path array 16, and is configured as a particle counter of a light scattering method using forward scattered light, for example. In other words, when the light-receiving element receives scattered light caused by a foreign object, the foreign object is detected based on a change in the signal output from the light-receiving element.  [0019] The downstream end of the above-mentioned optical fiber 23 is connected to the laser light irradiation section 51 through a collimator 42. For example, during the operation of the coating and developing device 1, light is constantly supplied from the light supply unit 2 to the optical fiber 23, and the light path of the shutter 41 described below is switched to switch the state of supplying light to the flow path array 16 and stop The state in which light is supplied to the flow path array 16. The optical fiber 23 has flexibility so as not to hinder the movement of the laser light irradiation unit 51 described later.  [0020] The flow path array 16 will be described with reference to the perspective view of FIG. 4. The flow path array 16 forming the flow path portion of the chemical solution is made of quartz, is configured as an angular, horizontally long block, and includes 11 through-holes respectively formed in the vertical direction. The through openings are arranged along the longitudinal direction of the flow path array 16, and the through openings and the walls around the through openings are configured as the aforementioned spectroscopic liquid tanks 15A to 15K. Next, the spectroscopic liquid tanks 15A to 15K are formed as upright pipes, and the chemical liquid flows from above to below through the respective through ports constituting the spectroscopic liquid tanks 15A to 15K. The respective through ports of the spectroscopic liquid tanks 15A to 15K are defined as flow paths 17A to 17K. The flow passages 17A to 17K are configured in the same manner as each other, and are respectively interposed in each of the medicinal solution supply pipes 12A to 12K as previously described.  [0021] Return to Figure 3 to continue the description. The above-mentioned laser light irradiation unit 51 and the light receiving unit 52 are provided so as to face each other while sandwiching the flow path array 16 from front to back. In the figure, 43 denotes a stage that supports the laser light irradiating unit 51 and the light receiving unit 52 from the lower side of the flow path array 16, and is constituted by a drive mechanism not shown in the figure to move freely in the left and right directions. By moving the stage 43 in this way, the laser light irradiation unit 51 can irradiate the light derived from the optical fiber 23 to one of the channels 17 selected from the channel 17A to 17K, and the light receiving unit 52 receives the light and irradiates it to the channel in this way. 17 and the light passing through the flow path 17. In other words, an optical path is formed in the flow path 17 so as to cross with the flow direction of the chemical liquid.  [0022] FIG. 5 is a schematic configuration diagram of the laser light irradiation unit 51 and the light receiving unit 52. For the convenience of description, the direction from the laser light irradiation unit 51 to the light receiving unit 52 is referred to as the rear. The laser light irradiation unit 51 includes an optical system, and the optical system includes, for example, a condensing lens 53. In addition, although illustration is omitted in FIG. 5, as shown in FIG. 3, the above-mentioned shutter 41 is provided in the laser light irradiation unit 51.  [0023] The above-mentioned collimator 42 irradiates laser light in a horizontal direction toward the rear side. The shutter 41 moves between the shielding position (shown as a chain line in FIG. 3) that shields the optical path between the collimator 42 and the collecting lens 53 and the open position (shown as a solid line in FIG. 3) retreated from the optical path. , Make the light path open and close. The condensing lens 53 includes a cylindrical lens and a lens called Powell lens or a lens for generating a ray of light, for example. The vertical direction of the flow direction of the liquid medicine is longer than the flow direction of the liquid medicine, so that the laser light is flattened. On the front side than the condenser lens 53, the cross section of the optical path (the cross section when viewed in the front and rear direction) is, for example, a slightly rounded shape. , For example, an ellipse having a long diameter along the left-right direction.  [0024] In the optical path formed in the flow path 17A, a light collection area with a higher energy density becomes a foreign object detection area 50, and foreign objects entering the detection area 50 are detected. Since the optical path is formed in the flow path 17A as described above, the detection area 50 is horizontally long from side to side, and the area ratio of the detection area 50 to the area of the flow path 17A when viewed in plan is large. By forming such a detection area 50, the ratio of the number of detected foreign objects among the total number of foreign objects flowing in the flow path 17A becomes higher.  [0025] Next, the light receiving unit 52 will be described. The light receiving unit 52 includes an optical system 54, a mask 61, and a light detecting unit 40 that are sequentially arranged from the front side to the rear side. The optical system 54 includes an objective lens 56 and a condenser lens 57 arranged on the front side and the rear side, respectively. The objective lens 56 turns the light passing through the dichroic liquid tank 15A into parallel light and collects the light by the condenser lens 57 To the light detection section 40.  [0026] Next, the light detection unit 40 will be described with reference to the front view of FIG. 6. In addition, FIG. 6 shows the light detection unit 40 when viewed from the front position of the mask 61 to the rear. The light detection unit 40 is constituted by, for example, 64 light receiving elements formed of respective photodiodes, and the light receiving elements have the same configuration as each other. The light-receiving elements are arranged with an interval therebetween so as to form a 2×32 row and column, for example. Let the light-receiving element arranged on the upper side be the light-receiving element 45A, and the light-receiving element arranged on the lower side as the light-receiving element 45B. The left and right widths of the light receiving elements 45A and 45B indicated by L4 in the figure are 53 μm in this example. The same is true for the cross section of the optical path irradiated to the light detecting section 40. The long side is a flat ellipse along the left and right direction, and the light receiving element 45A is located in the upper half of the optical path and the light receiving element 45B is located in the lower half of the optical path. , To arrange the respective light-receiving elements 45A, 45B. The light-receiving element 45A and the light-receiving element 45B at the same position in the left-right direction form a set. Regarding these light receiving elements 45A and 45B, when viewed to the rear side, they may be indicated as 1 channel, 2 channel, 3 channel, ... 32 channels (ch) in order from the left, with channel (ch) numbers attached.  [0027] The foreign object detection unit 4 includes a total of 32 circuit sections 46 respectively provided corresponding to the respective channels of the light receiving elements 45A and 45B. Referring to FIG. 7 to describe the circuit section 46, the circuit section 46 includes: transimpedance amplifiers (TIA) 47A and 47B provided at the rear of the light-receiving element 45A and the light-receiving element 45B, respectively, and a differential circuit 48 provided at the rear of the TIA 47A, 47B, respectively . The light-receiving element 45A and the light-receiving element 45B supply currents corresponding to the light intensity of the received light to the TIA 47A and 47B, and the TIA 47A and 47B output voltage signals corresponding to the supplied currents to the differential circuit 48. The differential circuit 48 outputs the voltage signal of the difference between the voltage signal from the TIA47A and the voltage signal from the TIA47B to the control unit 6 described later. The control unit 6 detects foreign objects based on the signal output from the above-mentioned differential circuit 48. Such foreign object detection based on the signals corresponding to the difference of the respective outputs from the light receiving elements 45A and 45B is for removing noise that is commonly detected in the light receiving elements 45A and 45B. The same is true for the above-mentioned circuit unit 46, and there are cases where the same channel number is attached to the channel number of the connected light-receiving elements 45A and 45B.  [0028] The relationship between the light-receiving elements 45A and 45B and the detection area 50 of the spectroscopic liquid tank will be described in more detail using the schematic diagram of FIG. 8. The arrow of the two-dot chain line in the figure indicates the optical path from the laser light irradiation unit 51 to the light receiving element 45A group when light is irradiated to the flow path 17A of the spectroscopic liquid tank 15A. In addition, in FIG. 8, the mask 61 is omitted for convenience of description. When viewing the front side in the optical path of the flow path 17A, the upper half of the light collection area, that is, the detection area 50, is divided into 32 divided detection areas in the longitudinal direction, each of which is called 1ch division in order from the right end Detection area ~ 32ch divided detection area. The left-right width of one divided detection area indicated by L21 in the figure is, for example, 0.85 μm, and a symbol 59 is attached to each divided detection area. [0029] In the optical system 54, the 1ch divided detection area 59 corresponds to the 1ch light-receiving element 45A in one-to-one correspondence, the 2ch divided detection area 59 corresponds to the 2ch light-receiving element 45A in one-to-one correspondence, and the 3ch division The detection area 59 corresponds to the light-receiving element 45A of the 3ch in a one-to-one correspondence, and similarly, the divided detection area 59 and the light-receiving element 45A of the same order are configured to correspond to the light-receiving element 45A in a one-to-one manner. That is, the reaction light (light perturbed by the reaction) generated by the reaction of the foreign matter in the 1ch divided detection area 59 is almost completely irradiated to the 1ch light receiving element 45A, and the 2ch divided detection area 59 reacts with the foreign matter. Almost all of the generated reaction light (light perturbed by the reaction) irradiates the 2ch light-receiving element 45A. In this way of receiving light, for example, 85% or more of the laser light passing through the divided detection area 59 of each channel is received by the light receiving element 45A of the corresponding channel. In FIG. 8, solid arrows and dashed arrows indicate the optical paths of the reaction light irradiated from the divided detection regions 59 of different channels to the light receiving elements 45A of different channels.  [0030] Light irradiation is performed in this way, and a signal corresponding to the foreign matter entering the detection area 50 is generated from the light receiving element 45A in any channel. For example, if only the light-receiving element 45A of the channel corresponding to the reaction light is not irradiated and the light-receiving element 45A of the other channel enters the light, the level of the current flowing to the light-receiving element 45A will be lowered, and the detection accuracy will be lowered. In other words, by configuring the divided detection area 59 and the light receiving element 45A to correspond to each other as described above, the detection accuracy of foreign objects is improved. [0031] Similarly, each of the divided detection areas 59 divided into 32 longitudinally divided into the lower half of the detection area 50, which is the light collection area, is called 1ch divided detection area 59 to 32ch divided detection area In the case of the area 59, the divided detection area 59 of one channel corresponds to the light-receiving element 45B of one channel. That is, the optical system 54 is configured such that the reaction light of the divided detection area 59 of one channel is irradiated to the light receiving element 45B of one channel. [0032] Furthermore, the light receiving elements 45A, 45B having multiple channels as described above are constructed because the energy of the laser light received by one light receiving element 45 (45A, 45B) is suppressed, so that the The shooting noise caused by the fluctuation of the photon of the emitted light is reduced and the SN ratio (S/N) is increased. This is also because the number of normal polymers flowing through the detection area corresponding to one light receiving element 45 is suppressed. The noise caused by the polymer increases the SN ratio. In addition, although the optical path when the detection area 50 is formed in the spectroscopic liquid tank 15A is exemplified, the same optical path is formed when the detection area 50 is formed in the other spectroscopic liquid tanks 15B to 15K, and the detection of foreign objects is performed.  [0033] Here, the mask 61 is explained in more detail. As shown in FIG. 6, the mask 61 includes, for example, 32 vertical and elongated openings 62, the openings 62 are arranged along the left and right, and the light-receiving elements 45A and 45B of each channel are located at the front. The left and right opening width L5 of the opening 62 is smaller than the width L4 of the light receiving elements 45A and 45B. Therefore, a part of the light irradiated from the divided detection area 59 to the light receiving elements 45A and 45B is blocked, and only the other part is received by the light receiving elements 45A and 45B. Among the light-receiving elements 45A and 45B, the area overlapping the opening 62 faces a light collecting point 63 described later, and forms a light-receiving area from which signals are output from the light-receiving elements 45A and 45B.   [0034] In FIG. 9, the optical path from the 3ch divided detection area 59 divided into the upper half of the detection area 50 to the 3ch light receiving element 45A is schematically represented by a dotted line. 9 and FIG. 6 show the condensing point 63 of laser light formed by irradiating the 3ch divided detection area 59 to the 3ch light receiving element 45A when the mask 61 is not provided. Because almost all of the light in the above-mentioned divided detection area 59 is irradiated to the light receiving element 45A corresponding to the divided detection area 59, the left and right width L6 of the light collection spot 63 is the same as the width L4 of the light receiving elements 45A and 45B, for example, 53μm. In other words, the width L5 of the opening 62 of the mask 61 is smaller than the width L6 of the light collecting spot 63. Therefore, when viewed in the direction in which the optical path is formed, that is, the front-rear direction, the area of the light-receiving regions of the light-receiving elements 45A and 45B is smaller than the area of the light-collecting spot 63.  [0035] The same applies to the light receiving elements 45A and 45B other than the 3ch light receiving element 45A, facing the light collecting point 63 formed by irradiating light from the corresponding divided detection area 59 in the same manner. In other words, the light collecting point is formed from the light collecting lens 57 to cross the light receiving elements 45A and 45B of each channel for light irradiation. The light collecting point 63 shown in FIG. 6 and FIG. One of the light collection points of each of the light receiving elements 45A and 45B divides the detection area 59 into an area. That is, in this example, from the 64 divided detection areas 59 constituting each foreign object detection area, light is irradiated to each of the 64 light receiving elements 45 to form a light collection point 63, and the width of each light collection point 63 is larger than that of each light reception element. The width of the element 45 is still small.  [0036] The reason for setting the above-mentioned mask 61 is explained. The photoresist flowing through the flow paths 17A to 17J contains a normal polymer for forming a photoresist film, and the polymer is irradiated to the light-receiving elements 45A, 45B by passing through the divided detection regions 59. The resulting scattered light generates background noise in the signals output from the light-receiving elements 45A and 45B. The larger the divided detection area 59 corresponding to one light receiving element 45A or 45B is, the larger the amplitude of the noise signal becomes because it is affected by the normal polymer.  [0037] Even if a foreign object passes through the divided detection area 59 and a detection signal of the foreign object is output, it is difficult to detect a signal having an amplitude smaller than the amplitude of the noise signal. In other words, the smallest possible particle size (minimum measurable particle size) of the foreign matter is determined by the signal of the noise. Wherein, the above-mentioned mask 61 is provided so that the left and right widths of the light receiving elements 45A and 45B are smaller than the left and right widths of the light collection spot 63, thereby suppressing the area of the light receiving area in the light receiving elements 45A and 45B that can output signals due to light reception, The number of polymers detected is suppressed. Thereby, the level of the noise signal output from the light receiving elements 45A and 45B is suppressed, the SN ratio is improved, and smaller foreign objects can be detected, and the detection accuracy of foreign objects can be improved. [0038] In addition, because the amplitude of the noise signal is affected by the size of the polymer contained in the chemical solution and the refractive index difference between the polymer and the solvent, the appropriate cut value of the opening width L5 of the mask 61 depends on the drug. The type of liquid varies. As a representative here, as a setting method of the opening width L5 corresponding to the photoresist flowing through the flow path 17A, the setting method will be described with reference to the graph of FIG. 10. The horizontal axis of the graph represents the opening width L5 (unit: μm). The vertical axis of the graph represents the amplitude of the voltage signal output from the light receiving element 45A or 45B.  [0039] The curve A1 of the graph is the one with the smallest particle size among the foreign objects to be detected in the photoresist, and represents the correspondence between the opening width L5 and the amplitude. Regarding the curve A1, the amplitude gradually increases as the opening width L5 shown in the graph increases, but the increase in the amplitude is gradually suppressed and finally reaches the apex. In addition, the corresponding relationship between the aperture width L5 and the noise amplitude output from the light receiving element 45A or 45B is expressed as a linear function shown by the straight line A2 in the graph. As the aperture width L5 increases, the noise amplitude also follows Get bigger. The fact that the characteristics of the detection signal of the foreign material and the noise are different from each other has become clear through experiments by the inventor. In addition, the curve A1 and the straight line A2 are calculated based on, for example, data obtained by experiments, for example, by the least square method. [0040] If the amplitude of the detection signal of the foreign object is smaller than the amplitude of the noise, it is difficult to distinguish the detection signal from the noise. Therefore, the signal intensity is set to the value of the opening width L5 in the range of the curve A1>the straight line A2. value. That is, the range of B1 to B2 shown in the graph becomes a candidate for the opening width L5. In addition, as in the case where the opening width L5 is small, the amount of polymer in the flow path 17A is small, and noise can be suppressed. However, as shown in the graph, the smaller the opening width L5 becomes, the steeper the slope of the curve A1 is. If the slope of the curve A1 becomes larger than the slope of the straight line A2, because the detected signal decreases faster than the noise, it is difficult to increase the SN Compare. Here, in the above-mentioned range of B1 to B2, it is preferable to set the opening width L5 so that the slope of the tangent to the curve A1 and the slope of the straight line A2 coincide with each other.  [0041] The above-mentioned mutual agreement of the slopes means that when the slope of the straight line A2 is Y1/X1, the slope of the tangent to the curve A1 is included in the range of 0.95×(Y1/X1) to 1.05×(Y1/X1). In the figure, the tangent to the curve A1 whose slope coincides with the slope of the straight line A2 in this manner is represented as A3, and the opening width L5 corresponding to the tangent A3 is represented as B3. In addition, although the appropriate opening width L5 differs depending on the type of chemical liquid as described above, the appropriate opening width L5 is the same for the photoresist flowing through the flow paths 17A-17J. In this embodiment, the appropriate opening width L5 is the same. The flow paths 17A to 17J are provided as a common mask 61.  [0042] Next, the control unit 6 (refer to FIG. 1) that is a detection unit for foreign matter installed in the coating and developing device 1 will be described. The control unit 6 is composed of, for example, a computer, and has a program storage unit (not shown). The program storage section stores the processing of the wafer W in each module, the detection of foreign matter based on the signal output from each channel of the light-receiving element as described above, and the in-coating performed by the transfer mechanism described later. A program in which commands (step groups) for each operation such as the transportation of the wafer W in the developing device 1 and the like are integrated. With this program, a control signal is output from the control section 6 to each section of the coating and developing device 1, thereby performing the above-mentioned operations. The program is stored in the program storage unit in a state of being stored in a storage medium such as a hard disk, an optical disk, a magneto-optical disk, or a memory card, for example.  [0043] The modules other than the photoresist coating module 1A shown in FIG. 1 have been explained in advance, and the photoresist coating module 1B has the same configuration as the module 1A. Anti-reflective film forming modules 1C, 1D and protective film forming modules 1E, 1F, for example, in addition to supplying anti-reflective film forming chemicals and protective film forming chemicals instead of photoresist and diluents, and molds Groups 1A and 1B have the same configuration. The chemical solution for forming the anti-reflective film contains a polymer like the photoresist. For example, in the modules 1C to 1F, the chemical liquid is supplied to the wafer W as in the modules 1A and 1B.  [0044] Next, referring to the sequence flow of FIG. 11, the processing of the wafer W and the detection of foreign matter performed in the photoresist coating module 1A will be described. In this sequence flow, each represents: the timing of setting the pressure of the pump in one of the supply sources 13 among 13A to 13K, and the movement of one nozzle 11 corresponding to one of the supply sources 13 among 11A to 11K by the arm 37 The time corresponding to the opening and closing time of the valve V1 of the liquid medicine supply tube 12 of one of the supply sources 13 from 12A to 12K, the time when the state of irradiating the laser light from the laser light irradiating section 51 and the state of stopping the laser light are switched, by The control unit 6 obtains the time point of the signal of each channel from the light detection unit 40. The above-mentioned time point at which the laser light irradiation state and the irradiation stop state are switched can also be referred to as the time point when the gate 41 of the foreign object detection unit 4 is opened and closed.  [0045] Actually, although the wafer W is coated in the order of the diluent and the photoresist, for the convenience of description, the description will start from the operation when the photoresist is applied. First, in a state where the wafer W is transferred to the transfer turntable 31 and held, for example, the nozzle 11A is transferred to the wafer W, and the photoresist is sucked by the pump of the supply source 13A, thereby starting with a predetermined pressure. Perform tuning (time t1). For example, the movement of the nozzle and the operation of the pump are performed together, and the laser light irradiation unit 51 and the light receiving unit 52 are moved to a position where the spectroscopic liquid tank 15A is sandwiched. At this time, the shutter 41 of the foreign object detection unit 4 is closed.  [0046] The nozzle 11A is stationary on the wafer W (time t2), and the wafer W is in a rotating state at a predetermined number of revolutions. Next, the valve V1 of the chemical liquid supply pipe 12A is opened, the shutter 41 is opened while the photoresist is pumped from the pump to the nozzle 11A at a predetermined flow rate, and the laser light is irradiated from the laser light irradiating unit 51 to pass through the spectroscopic liquid tank 15A. That is, in the flow path 17A of the spectroscopic liquid tank 15A, the detection area 50 is formed as described in FIGS. 8 and 9, and light is irradiated to the light receiving parts 45A and 45B (time t3). As illustrated in FIG. 9, a part of the light in the divided detection area 59 constituting the detection area 50 is shielded by the mask 61, and the signal output from each of the light receiving elements 45A and 45B to the circuit unit 46 is included in , The noise caused by the normal polymer in the photoresist becomes smaller.  [0047] Next, the pressure-fed photoresist passes through the spectroscopic liquid tank 15A, and is ejected from the nozzle 11A to the center of the wafer W. The opening degree of the valve V1 increases until it reaches a predetermined opening degree and the increase in the opening degree stops (time t4). Then, the control unit 6 starts to obtain the output signal from the circuit unit 46 of each channel (time t5). When the foreign material flows through the flow path 17A and the detection area 50 flows from the top to the bottom, the light-receiving element 45A or the light-receiving element 45B corresponding to the channel of the divided detection area 59 through which the foreign material flows is outputted by the signal corresponding to the foreign matter, from the circuit The level of the output signal of section 46 changes. After that, the control unit 6 stops obtaining the output signal from the light receiving element 45 of each channel (time t6), and then closes the shutter 41, stops the light irradiation from the laser light irradiation unit 51, and closes the valve of the chemical liquid supply pipe 12A V1 (time t7), the discharge of the photoresist to the wafer W is stopped. The ejected photoresist extends to the periphery of the wafer W due to the centrifugal force, forming a photoresist film.  [0048] Between the aforementioned time t5 and t6, the foreign matter count for each channel of the light-receiving element 45 is performed based on the output signal obtained from the circuit section 46 of each channel. Then, based on the output signal, the particle size of the foreign matter is measured and classified. In other words, the number of foreign objects is counted in each range of the plural number of particle diameters. Next, the number of foreign objects detected in each channel is totaled, and the number of foreign objects detected in the entire detection area 50 (as the total number of foreign objects) is calculated. Then, it is judged whether the total number of foreign substances is equal to or greater than the threshold value, and whether the number of foreign substances larger than a predetermined particle diameter is equal to or greater than the threshold value is judged. [0049] Next, when it is determined that the total number of foreign materials is greater than the threshold or the number of foreign materials larger than the predetermined particle size is determined to be greater than the threshold, the operation of the module 1A is stopped while a warning is output, and the wafer W is stopped. deal with. Specifically, the warning is, for example, a predetermined display on a monitor constituting the control unit 6 or a predetermined sound output from a speaker constituting the control unit 6. In addition, the output of the warning includes, for example, a display or a sound output for notifying the user of the spectroscopic liquid tank 15 whose output is abnormal among 15A to 15K. When it is determined that the total number of foreign materials is not greater than the threshold value and the number of foreign materials larger than the predetermined particle diameter is not determined to be greater than the threshold value, a warning output is not performed, and the operation of the module 1A is not stopped. In addition, each calculation and each determination mentioned above are performed by the control part 6 which forms a counting part. [0050] When the diluent is discharged to the wafer W, the nozzle 11K is transported to the wafer W instead of the nozzle 11A, the pump of the supply source 13A is replaced, and the pump of the supply source 13K is operated, and the liquid chemical supply pipe 12A is replaced. The valve V1 opens and closes the valve V1 of the chemical liquid supply pipe 12K, and instead of irradiating light to the spectroscopic liquid tank 15A and irradiating light to the spectroscopic liquid tank 15K, each part is operated in accordance with the sequence flow of FIG. 11. With this operation, along with the supply of the diluent to the wafer W, detection of foreign matter in the diluent is performed. In addition, although no polymer was contained in the diluent, as shown in the evaluation test described later, it was confirmed that by appropriately setting the opening width L5 of the mask 61, the impurities can be increased as in the case of detecting foreign matter in the photoresist. The signal is reduced and the detection accuracy of foreign objects is improved. The diluent supplied to the wafer W is supplied to the entire surface of the wafer W by the rotation of the wafer W like the photoresist. The photoresist supplied through the aforementioned flow path 17A supplies the wafer W supplied with the diluent in this manner. [0051] After supplying the diluent to the wafer W, when the photoresist included in a supply source other than the supply source 13A is supplied to the wafer W, the nozzle except for the used photoresist is transported to the wafer W , The pump corresponding to the supply source of the photoresist used is activated, the valve V1 of the supply pipe corresponding to the photoresist used is opened and closed, and the light is irradiated outside the spectroscopic liquid tank corresponding to the photoresist used, and the supply source 13A is connected The operation is the same when the photoresist is supplied to the wafer W. [0052] In the detection of foreign matter described in the flowchart of FIG. 11, in order to improve the measurement accuracy by detecting the foreign matter in a stable state in the liquid flow of the spectroscopic liquid tank 15A, the valve is adjusted as described above. The timing of the V1 switch and the timing when the control unit 6 starts and ends the acquisition of the output signal are shifted from each other. For example, the aforementioned time period t4 to t5 is 10 microseconds to 1000 microseconds, and the time period t6 to t7 is 10 microseconds to 100 microseconds. Although the operation of the module 1A will be described as a representative, the other modules 1B to 1F also perform the supply of the chemical solution to the wafer W and the detection of foreign objects like the module 1A. [0053] According to the coating and developing device 1, a part of the flow path of the photoresist supplied to the wafer W, that is, the spectroscopic liquid tanks 15A to 15K constituting the measurement area of the foreign matter in the photoresist, is provided, and the The light-receiving elements 45A, 45B, which are irradiated by the light irradiating section 51 and transmitted through the spectroscopic liquid tanks 15A to 15K, and the width ratios of the regions for enabling the light of the light-receiving elements 45A, 45B to be detected, are formed in the spectroscopic liquid tanks 15A to 15K. The width of the light collection point 63 of each of the divided detection areas 59 of the detection area 50 is also a small mask 61. Therefore, the level of noise included in the output signal from the light receiving elements 45A and 45B is suppressed, and as a result, the SN ratio of the output signal can be increased. Next, the control unit 6 provided in the coating and developing device 1 can detect foreign matter in the photoresist with high accuracy. In addition, the appropriate correspondence between the width of the light collecting spot 63 and the width of the light receiving elements 45A and 45B is determined in accordance with the chemical liquid. That is to say, when the mask 61 is not provided, because the widths of the appropriate light-collecting lens 57 and the light-receiving elements 45A and 45B are different for each chemical solution, the widths need to be adjusted in order to set the appropriate correspondence relationship as described above, but the same as this When the mask 61 is provided in the embodiment, the opening width (width of the slit) of the mask 61 is adjusted in accordance with the chemical solution used in the device by simple adjustment, so that the appropriate correspondence relationship described above can be set. Therefore, it is possible to prevent the condensing lens 57 and the light-receiving elements 45A, 45B from increasing in size and simplify the device configuration, which has the advantage that the manufacturing cost of the device can be reduced.  [0054] In addition, by performing such foreign matter detection, the cleanliness of the photoresist supplied to the wafer W can be monitored. Then, when the cleanness of the photoresist is lower than the predetermined reference, the operation of the module is stopped as described above, thereby suspending the processing of the subsequent wafer W in the module. Therefore, since the photoresist with low cleanliness can be prevented from being supplied to the subsequent wafer W, the reduction in production capacity can be prevented. Furthermore, among the chemical liquid supply pipes 12A to 12K, because the supply pipe 12 where the foreign matter is detected is specified, the user of the coating and developing device 1 can quickly perform maintenance and repairs after the operation of the module is stopped. . Therefore, it is possible to suppress the increase in the time during which the operation of the module is stopped, and as a result, it is possible to suppress the decrease in the productivity of the semiconductor product in the coating and developing device 1. [0055] Furthermore, when it is determined that the total number of foreign objects circulating in the detection area 50 is greater than or equal to the threshold as described above, and/or when it is determined that the number of foreign objects having a particle size larger than a predetermined particle size is greater than or equal to the threshold, it is regarded as The processing corresponding to this is not limited to warning output and module operation stop. For example, among the supply sources 13A to 13J of the photoresist, the photoresist is supplied to the nozzle 11 as the cleaning solution of the supply tube 12 from the supply source 13 corresponding to the spectroscopic liquid tank 15 that has made this determination, and the chemical liquid supply tube 12 is supplied to the nozzle 11 The foreign matter contained in it is removed from the nozzle 11. That is, the liquid medicine supply tube 12 is automatically washed. After this operation, the subsequent wafer W may be processed again.  [0056] Next, a specific configuration example of the coating and developing device 1 will be described with reference to FIGS. 12 and 13. 12 and 13 are a plan view and a schematic longitudinal side view of the coating and developing device 1, respectively. The coating and developing device 1 is formed by linearly connecting a carrier block D1, a processing block D2, and an interface block D3. The interface block D3 is connected to the exposure device D4. The carrier block D1 carries the carrier C into and out of the coating and developing device 1, and is equipped with: a carrier C mounting table 71, a switch section 72, and a switch section 72 for transporting wafer W from the carrier C Agency 73.  [0057] The processing block D2 is formed by sequentially layering the first to sixth unit blocks E1 to E6 for liquid processing of the wafer W from bottom to top. While dividing the unit blocks E1 to E6 into each other, the transfer mechanisms F1 to F6 are respectively provided, and the wafers W are transferred and processed in parallel to each other in the unit blocks E. Here, among the unit blocks, the third unit block E3 will be described with reference to FIG. 12 as a representative. The conveyance area 74 extends from the carrier block D1 to the interface block D3, and the aforementioned conveyance mechanism F3 is provided in the conveyance area 74. In addition, when viewed from the carrier block D1 to the interface block D3, a shelf unit U is arranged on the left side of the transport area 74. The shed unit U is equipped with a heating module. Moreover, when viewed from the carrier block D1 to the interface block D3, on the right side of the conveying area 74, the photoresist coating module 1A and the protective film forming module 1E are installed along the conveying area 74.  [0058] The fourth unit block E4 and the third unit block E3 have the same configuration, and are provided with a photoresist coating module 1B and a protective film forming module 1F. In the unit blocks E1 and E2, in addition to the anti-reflective film forming modules 1C and 1D respectively replacing the photoresist coating modules 1A and 1B and the protective film forming modules 1E and 1F, and the unit blocks E3 and E4 Have the same composition. The unit blocks E5 and E6 are equipped with a developing module that supplies a developing liquid to the wafer W to develop the photoresist film. The development module has the same configuration as the modules 1A to 1F except for supplying the development liquid to the wafer W as a chemical liquid. [0059] On the side of the carrier block D1 in the processing block D2, there are provided: a tower T1 that spans the unit blocks E1 to E6 and extends up and down, and is freely liftable for receiving and transferring wafers W to the tower T1 The transport mechanism 75. The tower T1 is composed of a plurality of modules stacked on each other. The modules installed at each height of the unit blocks E1 to E6 can receive wafers between the transport mechanisms F1 to F6 of the unit blocks E1 to E6 W. These modules include: a receiving module TRS installed at the height position of each unit block, a temperature control module CPL for adjusting the temperature of the wafer W, a buffer module for temporarily storing a plurality of wafers W, And a hydrophobization treatment module that hydrophobizes the surface of the wafer W. In order to simplify the description, the above-mentioned hydrophobic treatment module, temperature control module, and the above-mentioned buffer module are omitted in the drawings. [0060] The interface block D3 is provided with towers T2, T3, and T4 extending up and down across the unit blocks E1 to E6, and is provided with a free lift for receiving and transferring the wafer W to the tower T2 and the tower T3. The transfer mechanism 76 is the transfer mechanism 76, the transfer mechanism 77 that is the liftable transfer mechanism for receiving and transferring the wafers W to the tower T2 and the tower T4, and the transfer mechanism 77 is used to transfer the wafer W between the tower T2 and the exposure device D4. The transfer agency 78 of the acceptance and entitlement. [0061] The towers T2 are stacked on each other: a receiving module TRS, a buffer module storing and holding a plurality of wafers W before exposure processing, a buffer module storing a plurality of wafers W after exposure processing, It is configured as a temperature control module for adjusting the temperature of the wafer W, but the drawings of the buffer module and the temperature control module are omitted here.  [0062] The aforementioned light supply unit 2 is provided above the processing block D2, and the optical fiber 23 is routed downward in order to connect the light supply unit 2 to the modules 1A to 1F of the unit blocks E1 to E4. In addition, the above-mentioned control unit 6 is formed above the processing block D2, and is provided with the calculation of the number of foreign matter per channel based on the output signal from the circuit section 46 of each channel described above, the calculation of the total number of foreign matter, and the calculation of each channel. The calculation unit 60 for calculating the particle size of the foreign matter connects the calculation unit 60 and the modules 1A to 1F by wiring not shown.  [0063] The following describes the transport path of the wafer W of the coating and developing device 1. The wafer W is transported from the carrier C by the transport mechanism 73 to the receiving module TRS0 of the tower T1 in the processing block D2. From the receiving module TRS0, the wafer W is distributed and transported to the unit blocks E1 and E2. For example, when the wafer W is transferred to the unit block E1, among the transfer module TRS of the tower T1, compared to the transfer module TRS1 corresponding to the unit block E1 (the transfer mechanism F1 can perform the wafer W The receiving and receiving module) to receive the wafer W from the aforementioned TRS0. When the wafer W is transferred to the unit block E2, among the transfer modules TRS of the tower T1, the transfer module TRS2 corresponding to the unit block E2 receives the wafer W from the aforementioned TRS0. The transfer of these wafers W is performed by the transfer mechanism 75. [0064] The wafer W distributed in this way is transported in the order of TRS1 (TRS2)→anti-reflective film forming module 1C(1D)→heating module→TRS1(TRS2), and then distributed to the corresponding by the transport mechanism 75 The receiving module TRS3 of the unit block E3 and the receiving module TRS4 corresponding to the unit block E4. [0065] The wafer W allocated to TRS3 (TRS4) in this way is divided into TRS3 (TRS4)→photoresist coating module 1A(1B)→heating module→protective film forming module 1E(1F)→heating mold The group is transported in the order of the receiving module TRS of the tower T2. Then, the wafer W is transported into the exposure apparatus D4 through the tower T3 by the transport mechanisms 76 and 78. The exposed wafer W is transported between the towers T2 and T4 by the transport mechanisms 78 and 77, and is transported to the receiving modules TRS15 and TRS16 of the tower T2 corresponding to the unit blocks E5 and E6, respectively. Then, it is conveyed in the order of heating module → developing module → heating module → receiving module TRS5 (TRS6), and is returned to the carrier C by the conveying mechanism 73.  [0066] At this time, as shown in FIG. In addition, the light collection point 63 shown in FIG. 14 is a point formed on the front surface of the light receiving element 45 and on the same plane as the front surface. In other words, even if the mask 61 is not provided, the width of the light-receiving area that can detect light in the light-receiving elements 45A and 45B is smaller than the width L6 of the light-collecting spot 63, which can suppress normal polymers and solvents. The scattered light is irradiated to the light receiving elements 45A and 45B. [0067] In addition, the number of light receiving elements 45A corresponding to one light collecting point 63 is not limited to one, and a plurality of minute light receiving elements 45A are arranged corresponding to one light collecting point 63, and the output signals of each light receiving element 45A are summed up. Checkout is also possible. Similarly, for the light receiving element 45B, a plurality of light collecting points 63 may be provided. Also, in the aforementioned example, although a plurality of light-receiving elements 45 are provided and the light is condensed to each light-receiving element 45, only one light-receiving element 45 is provided, and one light-receiving element 45 is formed so as to face the light-receiving element 45. The aforementioned light collection point 63 may be configured such that the width of the light receiving area of the light receiving element 45 is smaller than the width of the light collection point 63.  [0068] In addition, in the light receiving unit 52 shown in FIG. 15, the aforementioned mask 61 is provided so as to overlap in the front-rear direction. The light receiving unit is provided with a moving mechanism 64 that moves the masks 61 in the left-right direction. When each moving mechanism 64 moves the mask 61, the width of the overlapping area of the opening 62 of each mask 61 changes. The two masks 61 form one mask 65, and the opening width L5 of the mask 65 can be changed by the movement of each mask 61. With this configuration, among the flow paths 17A to 17K, the positions of the masks 61 in the light receiving unit 52 are adjusted so as to correspond to the opening width L5 of the liquid medicine flowing in the flow path for detecting foreign objects. . Therefore, in the mask 65, the size of the opening width L5 is changed in accordance with the chemical liquid that is the detection target of the foreign matter. Therefore, it is possible to detect foreign matter in the liquid medicine in each flow path with higher accuracy. [0069] In addition, although an example in which the present invention is applied to a light-scattered light method that uses forward scattered light is described, the present invention can also be applied to the diffraction light (diffraction pattern) generated by irradiating a foreign object with laser light. The particle counter that receives light by the light-receiving unit 40 and detects foreign matter based on the change in the output signal caused by the received light of the diffraction pattern can also be applied to a particle counter that detects foreign matter by a method called the IPSA method. In other words, the application of the present invention is not limited to a particle counter having a specific measurement principle.  [0070] In addition, the chemical liquid that is the subject of foreign matter detection is not limited to the above-mentioned photoresist and diluent. For example, the present invention is applicable to protective film forming modules 1E, 1F, and developing modules, and it is also possible to detect foreign matter in a chemical solution for protective film formation and foreign matter in a developing solution. Others, for example, a chemical solution supply device for forming an insulating film on the wafer W, a cleaning device for supplying a cleaning solution that is a chemical solution for cleaning the wafer W, and a device for bonding a plurality of wafers W to each other The adhesive can also be applied to the present invention as a device for supplying the chemical liquid to the wafer W and other chemical liquid supply devices.  [0071] In addition, the present invention is not limited to being applied to a medical liquid supply device. For example, the flow path array 16 is provided with a spectroscopic liquid tank 15 common to a gas flow different from the spectroscopic liquid tank 15 through which the chemical liquid flows. Then, the atmosphere of the area where the wafer W is transported, such as the transport area 74 in the coating and developing device 1, can be supplied to the spectroscopic liquid tank 15 for the gas flow by a suction pump or the like. The area where the wafer W is transported also includes the area where the wafer W is processed such as the photoresist coating module 1A. Next, as in the case of detecting foreign matter in the chemical solution, a spectroscopic liquid tank common to gas flow is used in the flow of gas, and an optical path is formed in the spectroscopic liquid tank to detect foreign matter. Therefore, the present invention can not only detect foreign objects contained in the liquid supplied to the wafer W, but also detect foreign objects contained in the surrounding environment. In other words, foreign objects contained in the fluid can be detected. In addition, the present invention is not limited to the above-mentioned respective embodiments, and the respective embodiments can be combined with each other and changed as appropriate.  [0072] [Evaluation Test] The evaluation test performed in connection with the present invention will be described.・Evaluation test 1    As evaluation test 1, in the foreign object detection unit 4 provided with the above-mentioned mask 61, laser light is irradiated to the light receiving section 52 from the laser light irradiating section 51 through the flow path 17 (17A to 17K), and the measurement The noise level output by the light-receiving elements 45A and 45B. The noise level is the difference between the peaks in the voltage waveform. In addition, the flow state of the liquid medicine in the flow path 17 during laser light irradiation was changed in each test.  [0073] In the evaluation test 1, in the laser light irradiation, a state where pure water was stored in the flow path 17 without forming a liquid stream was regarded as the evaluation test 1-1. A person who circulates pure water at 5 mL/min in the flow path 17 was used as the evaluation test 1-2. A person who circulated the diluent at 5 mL/min in the flow path 17 was used as the evaluation test 1-3. An evaluation test 1-4 was used to circulate a drug solution for forming an anti-reflection film in the flow path 17 at 5 mL/min. In addition, with respect to each of these evaluation tests 1-1 to 1-4, multiple masks 61 with different opening widths L5 were used for multiple times, and the opening width L5 was 5 μm, 15 μm, or 53 μm.  [0074] The graph in FIG. 16 shows the result of Evaluation Test 1, the horizontal axis of the graph represents the opening width of the mask 61 (unit: μm), and the vertical axis of the graph represents the noise level (unit: mVpp). According to the graph, it is known that in the evaluation tests 1-2 to 1-4 in which the liquid medicine flows through the flow path 17, the smaller the opening width, the smaller the noise level, and there is roughly a linear relationship between the noise level and the opening width. Therefore, it is found that the straight line A2 described in FIG. 10 can be obtained. In addition, by appropriately setting the opening width, the noise level can be reduced and the SN ratio can be improved.  [0075] ・Evaluation test 2    In the foreign object detection unit 4, the laser light is irradiated to the light receiving unit 52 from the laser light irradiating unit 51 through the flow path 17, and the SN ratio is detected from the signals output by the light receiving elements 45A and 45B. In this light-receiving unit 52, a mask 61 was provided in the same way as the light-receiving unit 52 used in the evaluation test 1. In addition, in the irradiation of the laser light to the flow path 17, the chemical liquid circulating in the flow path 17 is changed for each test. As the evaluation test 2-1, pure water was circulated in the flow path 17, as the evaluation test 2-2, the diluent was circulated in the flow path 17, and as the evaluation test 2-3, the anti-reflection film formation chemical solution was circulated in the flow path 17. , As the evaluation test 2-4, let the photoresist circulate in the flow path 17. However, in these evaluation tests 2-1 to 2-4, in each of the chemical liquids circulating in the flow path 17, particles formed of PSL (polystyrene latex) with a particle size of 46 nm were mixed as foreign matter. For each of these evaluation tests 2-1 to 2-4, the measurement was performed using a mask 61 having an opening width L5 of 5 μm, 25 μm, and 53 μm, respectively. The width L6 of the light collecting spot 63 in this evaluation test is 53 μm as in the embodiment of the invention.  [0076] The graph in FIG. 17 shows the result of Evaluation Test 2, the horizontal axis of the graph represents the opening width L5 of the mask 61 (unit: μm), and the vertical axis of the graph represents the SN ratio (unitless). As shown in the graph, in the evaluation tests 2-1 to 2-4, the SN ratio when the opening width is 25 μm and 5 μm is larger than when the opening width is 53 μm, and the SN ratio when the opening width is 25 μm is particularly large. When the opening width is 5μm or 53μm, the smallest measurable particle size is about 60nm, but when the opening width is 25μm, the smallest measurable particle size is about 40nm. By setting the opening width L5 to be smaller than the width L6 of the light collecting spot 63 in this way, the SN ratio becomes higher, and the effect of the present invention is exhibited.

[0077]1‧‧‧塗佈、顯像裝置1A、1B‧‧‧光阻塗佈模組15A~15K‧‧‧分光液槽17A~17K‧‧‧流路4‧‧‧異物檢出單元40‧‧‧光檢出部50‧‧‧檢出區域51‧‧‧雷射光照射部45A、45B‧‧‧受光元件6‧‧‧控制部61‧‧‧遮罩62‧‧‧開口部[0077]1‧‧‧Coating and developing device 1A, 1B‧‧‧Photoresist coating module 15A~15K‧‧‧Spectroscopic liquid tank 17A~17K‧‧‧Flow path 4‧‧‧Foreign object detection unit 40‧‧‧Light detection part 50‧‧‧Detection area 51‧‧‧Laser light irradiation part 45A, 45B‧‧‧Light receiving element 6‧‧‧Control part 61‧‧‧Mask 62‧‧‧Aperture

[0011]   [圖1]有關本發明的實施的形態之塗佈、顯像裝置的概略構成圖。   [圖2]包含於前述塗佈、顯像裝置中的光阻塗佈模組的斜視圖。   [圖3]包含於前述塗佈、顯像裝置的異物檢出單元的概略構成圖。   [圖4]構成前述異物檢出單元的藥液的流路的構成構件的斜視圖。   [圖5]前述異物檢出單元的平面圖。   [圖6]構成前述異物檢出單元的光檢出部及遮罩的正視圖。   [圖7]表示包含於前述異物檢出單元的電路構成的區塊圖。   [圖8]表示前述異物檢出單元中的光路的概略圖。   [圖9]表示從前述流路至形成前述光檢出部的受光元件的光路的俯視圖。   [圖10]用來說明前述遮罩的適切的開口寬度的圖形。   [圖11]表示塗佈、顯像裝置的各部的動作之時序流程。   [圖12]前述塗佈、顯像裝置的平面圖。   [圖13]前述塗佈、顯像裝置的概略緃斷側面圖。   [圖14]表示其他異物檢出單元的構成的概略圖。   [圖15]表示異物檢出單元的受光部的構成的概略圖。   [圖16]表示評價試驗結果之圖形。   [圖17]表示評價試驗結果之圖形。[0011]    [FIG. 1] A schematic configuration diagram of a coating and developing device according to an embodiment of the present invention.  [Figure 2] A perspective view of the photoresist coating module included in the aforementioned coating and developing device.   [FIG. 3] A schematic configuration diagram of a foreign matter detection unit included in the aforementioned coating and developing device.   [FIG. 4] A perspective view of the constituent members constituting the flow path of the liquid medicine of the foreign body detection unit.  [Figure 5] A plan view of the aforementioned foreign object detection unit.   [Fig. 6] A front view of the light detection part and the mask constituting the foreign object detection unit.   [FIG. 7] shows a block diagram of the circuit configuration included in the aforementioned foreign object detection unit.   [FIG. 8] shows a schematic diagram of the optical path in the aforementioned foreign object detection unit.   [FIG. 9] shows a plan view of the optical path from the flow path to the light receiving element forming the light detecting portion.  [Figure 10] is used to illustrate the appropriate opening width of the aforementioned mask.  [Figure 11] shows the sequence flow of the operations of each part of the coating and developing device.  [Figure 12] A plan view of the aforementioned coating and developing device.   [Figure 13] A schematic side view of the aforementioned coating and developing device.   [Fig. 14] A schematic diagram showing the configuration of another foreign object detection unit.   [FIG. 15] A schematic diagram showing the configuration of the light receiving section of the foreign object detection unit.  [Figure 16] shows the graph of the evaluation test results.  [Figure 17] shows the graph of the evaluation test results.

17A‧‧‧流路 17A‧‧‧Flow Path

40‧‧‧光檢出部 40‧‧‧Light Detection Department

45A‧‧‧受光元件 45A‧‧‧Light receiving element

50‧‧‧檢出區域 50‧‧‧Checkout area

56‧‧‧對物透鏡 56‧‧‧Objective lens

57‧‧‧集光透鏡 57‧‧‧Condensing lens

59‧‧‧分割檢出區域 59‧‧‧Divided detection area

62‧‧‧開口部 62‧‧‧Opening

63‧‧‧集光點 63‧‧‧Light Spot

Claims (7)

一種異物檢出裝置,係檢出供應至被處理體的流體中的異物,具備:供應至前述被處理體的流體所流動的流路部;以前述流路部中的流體的流動方向與光路交叉的方式,對該流路部內的異物檢出區域照射雷射光的雷射光照射部;接收透過前述異物檢出區域的光的受光元件;設置於前述流路部與前述受光元件之間的光路上,用以集光至該受光元件並形成集光點的集光透鏡;用以基於從前述受光元件輸出的信號,檢出前述流體中的異物的檢出部;其中,在前述受光元件中面向前述集光點的受光區域的寬度,比該集光點的寬度還小;設置具備用以形成前述受光區域的開口部的遮罩。 A foreign object detection device detects foreign objects in a fluid supplied to an object to be processed, and includes: a flow path part in which the fluid supplied to the object to be processed flows; and the flow direction and optical path of the fluid in the flow path part In an intersecting manner, a laser light irradiating section that irradiates laser light on the foreign body detection area in the flow path section; a light receiving element that receives light passing through the foreign body detection area; and light disposed between the flow path section and the light receiving element On the road, a light-collecting lens for collecting light to the light-receiving element and forming a light-collecting point; a detection unit for detecting foreign objects in the fluid based on the signal output from the light-receiving element; wherein, in the light-receiving element The width of the light-receiving area facing the light-collecting point is smaller than the width of the light-collecting point; and a mask provided with an opening for forming the light-receiving area is provided. 如請求項1所記載的異物檢出裝置,其中,前述流體為包含用以對前述被處理體進行成膜的聚合物的藥液。 The foreign body detection device according to claim 1, wherein the fluid is a chemical liquid containing a polymer for forming a film on the object to be processed. 如請求項1所記載的異物檢出裝置,其中,前述流體為包含前述聚合物的藥液,因應在前述流路部流動的藥液的種類,變更前述開口部的寬度。 The foreign object detection device according to claim 1, wherein the fluid is a chemical liquid containing the polymer, and the width of the opening is changed in accordance with the type of chemical liquid flowing through the flow path. 如請求項1所記載的異物檢出裝置,其中,在橫軸、縱軸分別設定前述受光區域的寬度、及從前述受光元件輸出的信號的振幅的圖形中,在表示因檢出前述異物而由前述受光元件所輸出的信號的特性的曲線,與表示由前述受光元件所輸出的雜訊的信號的特性的直線相比就前述振幅而言還大的範圍內,設定前述受光區域的寬度。 The foreign object detection device according to claim 1, wherein the width of the light-receiving area and the amplitude of the signal output from the light-receiving element are set on the horizontal axis and the vertical axis, respectively. The curve of the characteristic of the signal output from the light receiving element is set to the width of the light receiving area in a range that is larger in terms of the amplitude than the straight line representing the characteristic of the signal of the noise output from the light receiving element. 如請求項4所記載的異物檢出裝置,其中,在前述圖形中,以前述曲線的切線的斜率,一致於前述直線的斜率的方式來設定前述受光區域的寬度。 The foreign object detection device according to claim 4, wherein in the pattern, the width of the light receiving area is set such that the slope of the tangent to the curve coincides with the slope of the straight line. 一種異物檢出方法,係檢出供應至被處理體的流體中的異物,具備:為了對前述被處理體供應前述流體而向流路部供應該流體的工程;藉由雷射光照射部,以前述流路部中的流體的流動方向與光路交叉的方式,對該流路部內的異物檢出區域照射雷射光的工程;藉由受光元件接收透過前述異物檢出區域的光的工程;藉由設置於前述流路部與前述受光元件之間的光路上的集光透鏡,集光至該受光元件並形成集光點的工程;藉由檢出部,基於前述信號,檢出前述流體中的異物 的工程;在前述受光元件中面向前述集光點的受光區域的寬度,比該集光點的寬度還小;設置具備用以形成前述受光區域的開口部的遮罩。 A method for detecting foreign objects that detects foreign objects in a fluid supplied to an object to be processed, and includes: a process of supplying the fluid to the flow path part in order to supply the fluid to the object to be processed; The process of irradiating laser light on the foreign body detection area in the flow path part in the way that the flow direction of the fluid in the aforementioned flow path section crosses the light path; the process of receiving the light passing through the foreign body detection area through the light-receiving element; The process of collecting light to the light-receiving element and forming a light-collecting point by a light-collecting lens arranged on the optical path between the flow path part and the light-receiving element; the detection part detects the fluid in the fluid based on the signal foreign body The width of the light-receiving area facing the light-collecting point in the light-receiving element is smaller than the width of the light-collecting point; a mask with an opening for forming the light-receiving area is provided. 一種記憶媒體,係記憶用於檢出供應至被處理體的流體中的異物的異物檢出裝置的電腦程式,其中,前述電腦程式,組入步驟群以執行請求項6記載的異物檢出方法。 A storage medium that stores a computer program of a foreign object detection device for detecting foreign objects in a fluid supplied to a processed body, wherein the aforementioned computer program is grouped into a group of steps to execute the foreign object detection method described in claim 6 .
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