TWI743118B - 高速通訊插座 - Google Patents

高速通訊插座 Download PDF

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Publication number
TWI743118B
TWI743118B TW106114632A TW106114632A TWI743118B TW I743118 B TWI743118 B TW I743118B TW 106114632 A TW106114632 A TW 106114632A TW 106114632 A TW106114632 A TW 106114632A TW I743118 B TWI743118 B TW I743118B
Authority
TW
Taiwan
Prior art keywords
layer
socket
holes
signal
shielding
Prior art date
Application number
TW106114632A
Other languages
English (en)
Chinese (zh)
Other versions
TW201813215A (zh
Inventor
布瑞特 D. 羅賓森
賈斯汀 瓦格納
Original Assignee
美商哨兵連接器系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/146,019 external-priority patent/US9627816B2/en
Application filed by 美商哨兵連接器系統股份有限公司 filed Critical 美商哨兵連接器系統股份有限公司
Publication of TW201813215A publication Critical patent/TW201813215A/zh
Application granted granted Critical
Publication of TWI743118B publication Critical patent/TWI743118B/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6464Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473Impedance matching
    • H01R13/6474Impedance matching by variation of conductive properties, e.g. by dimension variations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581Shield structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00Four or more poles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/056Folded around rigid support or component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09336Signal conductors in same plane as power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303Pin-in-hole mounted pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
TW106114632A 2016-05-04 2017-05-03 高速通訊插座 TWI743118B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/146,019 2016-05-04
US15/146,019 US9627816B2 (en) 2012-02-13 2016-05-04 High speed grounded communication jack

Publications (2)

Publication Number Publication Date
TW201813215A TW201813215A (zh) 2018-04-01
TWI743118B true TWI743118B (zh) 2021-10-21

Family

ID=60203392

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106114632A TWI743118B (zh) 2016-05-04 2017-05-03 高速通訊插座

Country Status (13)

Country Link
EP (1) EP3453081A4 (ko)
JP (1) JP7339734B2 (ko)
KR (1) KR102318866B1 (ko)
CN (1) CN109478747B (ko)
AU (1) AU2017260462B2 (ko)
BR (1) BR112018071868A2 (ko)
CA (1) CA3022689A1 (ko)
IL (1) IL262491B (ko)
MX (1) MX2018013320A (ko)
PH (1) PH12018502285A1 (ko)
RU (1) RU2713644C1 (ko)
TW (1) TWI743118B (ko)
WO (1) WO2017192800A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023028712A (ja) * 2021-08-20 2023-03-03 日本航空電子工業株式会社 コネクタ組立体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM445286U (zh) * 2012-09-03 2013-01-11 Simula Technology Inc 訊號連接器
TW201340474A (zh) * 2012-02-13 2013-10-01 Sentinel Connector Systems Inc 高速通訊插座
US20140206240A1 (en) * 2013-01-23 2014-07-24 Commscope, Inc. Of North Carolina Communications Connectors Having Printed Circuit Boards that Include Floating Image Planes

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69421798T2 (de) * 1994-03-26 2004-07-15 Molex Inc., Lisle Verbinder vom Typ Modular Jack
JP2003224408A (ja) * 2002-01-30 2003-08-08 Kyocera Corp 高周波用配線基板
US6769937B1 (en) * 2003-05-13 2004-08-03 Molex Incorporated Modular jack assembly for jack plugs with varying numbers of wires
US7182649B2 (en) * 2003-12-22 2007-02-27 Panduit Corp. Inductive and capacitive coupling balancing electrical connector
EP2675022B1 (en) * 2004-07-13 2014-09-03 Panduit Corporation Communications connector with flexible printed circuit board
US7601034B1 (en) * 2008-05-07 2009-10-13 Ortronics, Inc. Modular insert and jack including moveable reactance section
WO2009138168A1 (de) 2008-05-15 2009-11-19 Adc Gmbh Leiterplatte für elektrischen verbinder und elektrischer verbinder
US8167661B2 (en) * 2008-12-02 2012-05-01 Panduit Corp. Method and system for improving crosstalk attenuation within a plug/jack connection and between nearby plug/jack combinations
US8660424B2 (en) 2010-08-26 2014-02-25 Cisco Technology, Inc. Scalable high speed gigabit active bundle link and tester
US8637987B2 (en) 2011-08-09 2014-01-28 Micron Technology, Inc. Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
US9337592B2 (en) 2012-02-13 2016-05-10 Sentinel Connector Systems, Inc. High speed communication jack
CN103390818B (zh) * 2013-08-09 2015-08-12 浙江一舟电子科技股份有限公司 一种超高速通信用抗串扰接口电路及包含该接口电路的插座

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201340474A (zh) * 2012-02-13 2013-10-01 Sentinel Connector Systems Inc 高速通訊插座
TWI571005B (zh) * 2012-02-13 2017-02-11 哨兵連接器系統股份有限公司 高速通訊插座
TWM445286U (zh) * 2012-09-03 2013-01-11 Simula Technology Inc 訊號連接器
US20140206240A1 (en) * 2013-01-23 2014-07-24 Commscope, Inc. Of North Carolina Communications Connectors Having Printed Circuit Boards that Include Floating Image Planes

Also Published As

Publication number Publication date
CN109478747A (zh) 2019-03-15
AU2017260462A1 (en) 2018-11-15
IL262491B (en) 2022-04-01
AU2017260462B2 (en) 2021-05-20
PH12018502285A1 (en) 2019-07-15
JP2019519068A (ja) 2019-07-04
RU2713644C1 (ru) 2020-02-05
EP3453081A4 (en) 2020-01-22
CN109478747B (zh) 2021-03-05
KR102318866B1 (ko) 2021-10-28
EP3453081A1 (en) 2019-03-13
JP7339734B2 (ja) 2023-09-06
WO2017192800A1 (en) 2017-11-09
TW201813215A (zh) 2018-04-01
CA3022689A1 (en) 2017-11-09
IL262491A (en) 2018-12-31
KR20190000888A (ko) 2019-01-03
BR112018071868A2 (pt) 2019-02-19
MX2018013320A (es) 2019-03-01

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