TWI743118B - High speed communication jack - Google Patents

Abstract

A method of manufacturing a high speed jack, the method including the steps of forming a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, forming a shielding case surrounding the housing, forming a top layer of a substrate, a first shielding layer on a first side of the top layer in the substrate, a second shielding layer adjacent the first shielding layer in the substrate, and forming a bottom layer adjacent to the second shielding layer, forming a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, forming a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing.

Description

High-speed communication socket

With reference to the related application, this disclosure is a partial continuation of the U.S. Patent Application No. 14/504,088 named "High Speed Communication Socket" dated October 1, 2014, and the request date of the application date is January 11, 2013. The priority of US Patent No. 8,858,266 for "High Speed Communication Socket", the full text of the second case is quoted here and incorporated into the disclosure of this specification.

FIELD OF THE INVENTION This disclosure relates to a network connection socket used to connect a network cable to a device.

BACKGROUND OF THE INVENTION As electrical communication devices and their associated applications become more complex and powerful, their ability to collect information and share information with other devices has also become more important. The proliferation of these smart Internet devices has led to the need for increased data throughput on connected networks to provide improved data rates to meet this demand. As a result, the existing communication protocol standards are constantly improved or new standards are created. Almost all of these standards directly or indirectly require or benefit significantly from the communication of high-resolution signals via wired networks. These high-resolution signals, which may have a larger bandwidth, and the compensation ground may have higher frequency requirements, must be supported in a consistent manner. However, even if the more recent versions of the standards provide theoretically higher data rates or speeds, their speed is still limited by the current design of certain physical components. Unfortunately, the design of these physical components still suffers from a lack of understanding of what is required to achieve consistent signal quality at billions of hertz and higher frequencies.

For example, communication sockets are used in communication devices and equipment for the connection or coupling of cables used to transmit and receive electrical signals representing communication data. Registered socket (RJ) is a standardized physical interface used to connect telecommunications and data equipment. The RJ standardized physical interface includes both socket structure and wiring pattern. The RJ standardized physical interface commonly used in data equipment is the RJ45 physical network interface, also known as the RJ45 socket. RJ45 sockets are widely used in local area networks, such as those that implement the IEEE 802.3 Ethernet protocol. RJ45 sockets are described in various standards, including those promulgated by the American National Standards Institute (ANSI)/American Telecommunications Industry Association (TIA) in ANSI/TIA-1096-A.

All electrical interface components, such as cables and sockets, including RJ45 sockets, not only resist the initial flow of current, but also resist any changes to it. This property is called reactance. The two types of related reactance are inductive reactance and capacitive reactance. Inductive reactance can be generated based on the movement of a current through a resisting cable, for example, which induces a magnetic field to induce a voltage in the cable. On the other hand, capacitive reactance is generated by electrostatic charges that appear when electrons from two opposing surfaces are placed close together.

In order to reduce or avoid any degradation of the transmitted signal, various components of the communication circuit preferably have matching impedances. If not, a load with one impedance value will reflect or echo part of the signal carried by the cable at different impedance levels, causing signal failure. For this reason, data communication equipment designers and manufacturers, such as cable vendors, design and test their cables to verify the impedance values of the cables, as well as the resistance and capacitance levels to comply with certain performance parameters. The RJ45 socket is also a significant component close to every communication circuit, however, socket manufacturers have not paid the same degree of attention to its performance. In this way, although the related problems of the existing RJ45 socket have been clearly documented in the test and the negative impact on the high-frequency signal line is understood, the industry seems reluctant to solve the problem of such an important component of the physical layer. As a result, there is a need for improved high-speed communication sockets.

SUMMARY OF THE INVENTION One embodiment of the present invention includes a high-speed communication socket including a housing including a port for receiving a plug. The port includes a plurality of pins each connected to a corresponding signal line in the plug, surrounding the A shielding shell of the housing, a circuit board in the housing has a base, extending through a plurality of first through holes of the base, and each of the first through holes is assembled to accommodate a pin on the housing, A plurality of second through holes extending through the base body and each second through hole is assembled to accommodate a stitch on the housing, and a first set of stitches on a top layer of the base body connects at least one first through hole A through hole and at least one corresponding second through hole, a first shielding layer on a first side of the top layer in the substrate, a second shielding layer adjacent to the first shielding layer in the substrate, and A second set of stitches on an opposite side of the base body and the top layer connects at least one first through hole and at least one second through hole.

In another embodiment, the stitches of the second set connect different through holes and the through holes are connected to the top surface.

In another embodiment, the socket includes a first isolation region on the top surface between a first set of traces.

In another embodiment, the socket includes a second isolation region on the top surface between the traces of a second set.

In another embodiment, the first shielding layer is covered in a conductive material.

In another embodiment, the conductive material does not cover an area surrounding the periphery of the first through holes and the second through holes.

In another embodiment, the second shielding layer is covered in a conductive material.

In another embodiment, the conductive material does not cover an area surrounding the periphery of the first through holes and the second through holes.

In another embodiment, the conductive material includes copper and refined silver.

In another embodiment, the conductive material includes copper and refined silver.

Another embodiment of the present invention includes a method of manufacturing a high-speed communication socket. The method includes the following steps: forming a housing including a port for receiving a plug, the port including a plurality of pins each connected to the One of the plugs corresponds to the signal line, forming a shielding shell surrounding the housing, forming a top layer of a base, and a first shielding layer on a first side of the top layer in the base is adjacent to the base A second shielding layer of the first shielding layer and a bottom layer adjacent to the second shielding layer form a plurality of first through holes extending through the substrate, and each first through hole is configured to accommodate the A pin on the housing forms a plurality of second through holes extending through the base, and each second through hole is assembled to accommodate a pin on the housing, forming a first set on a top layer of the base The stitches connect at least one first through hole and at least one corresponding second through hole, and a second set of stitches are formed on an opposite side of the substrate and the top layer, which connects at least one first through hole and at least A second through hole.

In another embodiment, the stitches of the second set connect different through holes and the through holes are connected to the top surface.

In another embodiment, the method includes the step of forming a first isolation region between a first set of traces on the top surface.

In another embodiment, the method includes the step of forming a second isolation region between the traces of a second set on the top surface.

In another embodiment, the first shielding layer is covered in a conductive material.

In another embodiment, the conductive material does not cover an area surrounding the periphery of the first through holes and the second through holes.

In another embodiment, the second shielding layer is covered in a conductive material.

In another embodiment, the conductive material does not cover an area surrounding the periphery of the first through holes and the second through holes.

In another embodiment, the conductive material includes copper and refined silver.

In another embodiment, the conductive material includes copper and refined silver.

Detailed Description of the Preferred Embodiment FIG. 1 illustrates a high-speed communication socket assembled according to an embodiment of various aspects of the present disclosure, which includes an RJ45 socket 110, a flexible printed circuit board (PCB) 120, and a socket cover 130. As described herein, according to various aspects of the present disclosure, the flexible PCB 120 provides a balanced radio frequency tuning circuit that can be directly soldered to each pin of the RJ45 socket 110, and the socket cover 130 provides the RJ45 socket 110 and the flexible PCB 120 shielding, and as a grounding base. When the RJ45 socket 110, the flexible PCB 120, and the socket cover 130 are combined, they can provide a function similar to a tuning waveguide and a tube through which communication signals can be transmitted, where the energy part of the communication signal travels outside the tube through the socket cover 130; and the information part of the communication signal travels along the non-resistance gold wire inside the tube; thereby allowing high-speed data signal speed to be obtained. For example, it is expected to support data speeds of 40 gigabit (Gb) and above.

Although RJ45 communication sockets are used below, this communication socket is not limited to RJ45 communication sockets and can be used for any type of high-speed communication sockets, including all types of modular RJ connectors and universal serial bus (USB) connectors And sockets, Firewire (1394) connectors and sockets, high-definition multimedia interface (HDMI) connectors and sockets, D-subminiature connectors and sockets, ribbon connectors and sockets, or receive high-speed communication signals Any other connectors and sockets.

In all aspects of the present disclosure, the various pins and traces disclosed herein can be composed of any suitable conductive elements, such as gold, silver, or copper, or alloys and any combination of conductive elements. For example, the set of pins and plug connectors of the RJ45 socket 110 may include gold-plated copper pins or wires, and the set of traces of the flexible PCB 120 may include gold-plated copper paths. Gold plating is used to provide an anti-corrosion conductive layer on copper, which is usually a material that is easily oxidized. In addition, a layer of suitable barrier metal, such as nickel, can be deposited on the copper substrate before applying the gold plating. The nickel layer improves the wear resistance of gold plating by providing a mechanical backing to the gold layer. The nickel layer can also reduce the influence of the pore size that may be present in the gold layer. At higher frequencies, gold plating may not only reduce signal loss, but also increase the bandwidth from the skin effect, where the current density on the outer edge of the conductor is the highest. Conversely, the use of nickel alone will cause higher frequency signal degradation due to the same effect. As such, it may not be possible to achieve higher speeds in RJ45 sockets that use nickel plating alone. For example, a pin or trace that is only plated with nickel may shorten the useful signal length by as much as three times once the signal enters the GHz range. Although the benefits of using gold plating on the copper path have been described here, others can be used. Conductive elements to plate the copper path. For example, platinum is also non-reactive but a good conductor, and platinum can be used instead of gold to plate copper paths.

The main components of the high-speed communication socket, namely, the RJ45 socket 110, the flexible printed circuit board (PCB) 120, and the socket cover 130 will each provide a brief description here before discussing how these components interact to support high-speed communication.

FIG. 2 illustrates a bottom perspective view of the front of the RJ45 socket 110 of FIG. 1, where it can be seen that there is a plug opening 230 for inserting a plug (not shown in the figure). The plug opening 230 can be configured to receive a plug to couple the contacts on the plug to the set 212 of plug contacts in the RJ45 socket 110. The plug can be a RJ45 8-position 8-contact (8P8C) modular plug. The set 212 of plug contacts is formed as a set 210 of pins assembled to attach to the communication circuit on the circuit board. For example, the RJ45 socket 110 can be mounted to the circuit board of the network switching device through the use of a pair of posts 220, and then the pin assembly 210 can be soldered to individual contact pads on the circuit board of the device. By itself, a socket similar to the RJ45 socket 110 illustrated in FIG. 2 provides basic connectivity between the plug of the RJ45 cable and the circuit board of the device into which the socket is integrated. However, the socket is not designed to handle the communication frequency required for high-speed communication. For example, the RJ45 socket 110 for assembly according to the disclosed method as described herein can integrate other components such as the socket cover 130 and the flexible PCB 120, so that it can be used to communicate at a higher speed without interfering with transient signals. .

FIG. 3 illustrates the bottom and right side views of the socket cover used to provide shielding for the RJ45 socket 110 and the flexible PCB 120. The socket cover 130 includes a top 302, a bottom 304, a rear 306, a front 308, a left side (not shown in the figure but substantially the same as the right side), and a right side 310. In order to provide the desired shielding properties, in one embodiment of the present disclosure, the socket cover 130 may include a conductive material, such as, but not limited to, steel, copper, or any other conductive material. A pair of lugs 320 near the bottom 304 on the right side 310 and the left side (not shown in the figure) of the socket cover 130 can be used to ground and fix the socket cover 130 to the circuit board inside the device (not shown in the figure). For example, the pair of lugs 320 on the socket cover 130 can be inserted into a pair of matching mounting holes on the circuit board and soldered to it.

FIG. 4A illustrates a schematic top view of the front surface of the PCB 120 of the RJ45 socket. The PCB 120 includes a multilayer substrate 402 made of a dielectric material combining strip-line bending or equivalent technology. A protective layer 404 surrounds the edge of the base 402. The protective layer 404 is made of a non-conductive material, such as, but not limited to, plastic or a flexible welding mask. The front surface of the base 402 includes a plurality of through holes 406, 408, 410, 412, 414, 416, 418 and 420 made through the base 402. Each through hole 406, 408, 410, 412, 414, 416, 418, and 420 penetrates through the base 402 and its size can accommodate the stitch 210. The area surrounding each through hole 406, 408, 410, 412, 414, 416, 418, and 420 is coated with a conductive material, such as gold. The coating surrounding each of the through holes 406, 408, 410, 412, 414, 416, 418, and 420 may be substantially square or substantially rectangular. In another embodiment, depicted in FIG. 4B, the coating surrounding each of the through holes 406, 408, 410, 412, 414, 416, 418, and 420 may be substantially circular. By making the covering layer into a circular shape, interference between adjacent through holes 406, 408, 410, 412, 414, 416, 418, and 420 can be reduced.

A plurality of stitches 422, 424, 426, 428, 430, 432, 434, and 436 extend from the respective through holes 406, 408, 410, 412, 414, 416, 418, and 420 toward one end of the PCB 120. The individual traces 422, 424, 426, 428, 430, 432, 434, and 436 are made from conductive materials including copper or gold. In one embodiment, the nickel layer is formed on the substrate 402, and the gold layer is formed on the nickel layer to form the respective traces 422, 424, 426, 428, 430, 432, 434, and 436. Each trace 422, 424, 426, 428, 430, 432, 434, and 436 extends toward a rear end of the PCB 120 until the trace 422, 424, 426, 428, 430, 432, 434, or 436 reaches close to the PCB 120 One edge of the through holes 406, 408, 410, 412, 414, 416, 418, and 420 is shielded to the trace layer 490. Each of the stitches 422, 424, 426, 428, 430, 432, 434, and 436 includes the first portions 454, 456, 458, 460, and 460 of the adjacent second portions 470, 472, 474, 476, 478, 480, 482, and 462, 464, 466, and 468, and the respective second portions 470, 472, 474, 476, 478, 480, 482, and 484 extend to the shielding trace layer 490 without contacting the shielding trace layer 490. The respective first portions 454, 456, 458, 460, 462, 464, 466, and 468 are directed from the respective second portions 470, 472, 474, 476, 478, 480, 482, and 484 to a separate through hole 406, 408, 410, 412 , 414, 416, 418 or 420 are tapered. Each of the second portions 470, 472, 474, 476, 478, 480, 482, and 484 has a length that changes with the stitches 422, 424, 426, 428, 430, 432, 434, or 436.

The two shielding lugs 486 and 488 are located on the opposite edges of the PCB 120. Each of the shielding lugs 486 and 488 is made of a substrate covered in a conductive material such as gold or copper. The shielding lugs 486 and 488 are electrically connected on the base 402 by a shielding trace layer 490, which extends between the shielding lugs 486 and 488 and is located on the respective traces 422, 424, 426, 428 The second parts 470, 472, 474, 476, 478, 480, 482, and 484 of 430, 432, 434, and 436 are opposite to the through holes 406, 408, 410, 412, 414, 416, 418, and 420 of the PCB 120 The margin.

FIG. 5A illustrates a schematic top view representative view of the back surface of the printed circuit board of FIG. 4A. The back surface includes through holes 406, 408, 410, 412, 414, 416, 418, and 420, shielding lugs 486 and 488, and a shielding trace layer 502 extending between the back surfaces of the respective shielding lugs 486 and 488. The shielding trace layer 502 covers the part of the rear surface of the PCB 120 between the shielding lugs 486 and 488. The shielding lugs 486 and 488 include return through holes 504, 506, 508, 510, 512, 514, 516 and 518, which penetrate the substrate 402 by connecting the shielding trace layer 490 and the shielding trace layer 502. FIG. 5B depicts another embodiment of a top view of the back surface of the printed circuit board of FIG. 4B.

FIG. 6A illustrates a cross-sectional view of the multilayer substrate 402 in the PCB 120 along the line BB of FIG. 4. The first layer 602 of the multilayer substrate 402 includes a welding shield portion made of a flexible welding shield material such as PSR9000FST. The second layer 604 is formed under the top layer and includes each of the stitches 422, 424, 426, 428, 430, 432, 434, and 436. Each of the stitches 422, 424, 426, 428, 430, 432, 434, and 436 has a length (L), a height (H), and a width (W), and is separated from an adjacent stitch by a distance (S). The length (L) of each trace is the length of the trace extending from the edge of the individual through holes 406, 408, 410, 412, 414, 416, 418, and 420 along the surface of the flexible circuit board 120 to the shielding trace layer 490 .

The stitches 422, 424, 426, 428, 430, 432, 434, and 436 extend through the first layer 602 so that the stitches 422, 424, 426, 428, 430, 432, 434, and 436 are not covered by flexible welding Cover up. The shielding trace layer 490 is also formed over a portion of the second layer 604 and the shielding trace layer 490 extends through the first layer 602. The third dielectric layer 606 is formed under the second layer 604. The third layer 606 has a depth (D) of about 0.002 mils to about 0.005 mils, and is made of materials with a dielectric constant greater than 3.0, such as, but not limited to, RO XT8100, Rogerson Material ) Or any other material that can isolate high-frequency electrical signals.

The fourth layer 608 is formed under the third layer 606, and the fourth layer 608 includes a signal return portion and a shielding trace portion 502. Both the signal return portion and the shielding trace portion 502 are made of conductive materials, preferably gold or copper. The fifth layer 610 is formed on the fourth layer 608 and the fifth layer 610 has a flexible solder mask portion and a shielding trace layer 502 portion. The flexible welding shield is made of the same material as the flexible welding shield of the first layer 602. In an alternative example, the flexible welding mask part is made of a different material from the flexible welding mask part of the first layer 602. In an alternative example, the second signal return layer (not shown in the figure) may be located in the dielectric material.

In order to eliminate the crosstalk caused by adjacent traces, each trace 422, 424, 426, 428, 430, 432, 434, and 436 are electrically coupled to adjacent traces 422, 424, 426, 428, 430, 432, 434 And 436. As an illustrative example, the trace 422 may be coupled to the trace 424. During operation, the first signal is transmitted through the first trace, and the same signal with the opposite polarity is transmitted through the matching trace, thereby differentially coupling the traces together. Because the traces are differentially coupled together, the impedance of each trace determines how the trace is driven. In this way, the impedances of the matching traces of each set must be substantially equal.

The physical characteristics of each trace 422, 424, 426, 428, 430, 432, 434, and 436 in a matching set of traces are adjusted to balance the matching trace for transmission and the return signal transmitted through each trace的impedance. The impedance of each stitch 422, 424, 426, 428, 430, 432, 434, and 436 is adjusted by adjusting the length (L), width (W), height (H) of each stitch , 426, 428, 430, 432, 434, and 436 transmit each signal's matching line spacing (S) any one or a combination of them. The height (H) of each stitch 422, 424, 426, 428, 430, 432, 434, and 436 can be about 2 mils to about 6 mils, and adjacent stitches 422, 424, 426, 428, 430, The interval (S) between 432, 434, and 436 may be about 3 mils to about 10 mils.

Referring back to FIG. 4, each stitch has a variable width in the first part 454, 456, 458, 460, 462, 464, 466, and 468 and in the second part 470, 472, 474, 476, 478, 480, 482 And 484 have a substantially constant width. Accordingly, the width of each stitch 422, 424, 426, 428, 430, 432, 434, and 436 is along the height H of the stitch 422, 424, 426, 428, 430, 432, 434, and 436 in the first part 454, 456 , 458, 460, 462, 464, 466 and 468 or the second part 470, 472, 474, 476, 478, 480, 482 and 484 adjusted in the first part 454, 456, 458, 460, 462, 464 , 466 and 468 and the second parts 470, 472, 474, 476, 478, 480, 482, and 484 are adjusted so that when the matching traces are separated by a distance S, each trace in a matching set has substantially The same impedance.

Due to inconsistencies in manufacturing and materials, the signals driving through the different sets of matching traces 422, 424, 426, 428, 430, 432, 434, and 436 may be different, which causes part of the signal to be reflected back and cause common mode interference . In order to eliminate common mode interference, each trace 422, 424, 426, 428, 430, 432, 434, or 436 in a matching trace set includes a common mode filter, which is tuned to eliminate any in the matching set Common mode interference. Each filter includes a through hole 406, 408, 410, 412, 414, 416, 418, or 420 of each trace 422, 424, 426, 428, 430, 432, 434, or 436, and a fourth layer 608 of a multilayer substrate 402. The formed capacitor. Each of the through holes 406, 408, 410, 412, 414, 416, 418, and 420 includes through holes 406, 408, 410, 412, 414, 416, 418 and the through holes 406, 408, 410, 412, 414, 416, 418 surrounding the second layer 604 and the fourth layer 608 of the substrate 402. A layer of conductive material formed around the 420, such as gold or copper. The conductive material on the first layer 602 is connected to the traces 422, 424, 426, 428, 430, 432, 434, and 436 associated with the vias 406, 408, 410, 412, 414, 416, 418, and 420, And the conductive material on the fourth layer 608 is connected to the signal return part of the fourth layer 608. The size of each capacitor is determined by the distance between the conductive materials on the second layer 604 and the fourth layer 608. Accordingly, adjusting the depth of the third layer 606 of the conductive material on the vias 406, 408, 410, 412, 414, 416, 418, and 420 allows adjustment of the respective vias 406, 408, 410, 412, 414, 416 , 418 and 420 capacitance effect. The size of the capacitor generated by the through holes 406, 408, 410, 412, 414, 416, 418, and 420 and the return portion of the fourth layer 608 is about 0.1 picofarad (pf) to about 0.5 pf. The top and bottom surfaces of the base 402 can be covered in a plastic insulating layer to further enhance circuit operation.

The combination of the characteristic inductance of the capacitor and the signal return layer generated in each of the through holes 406, 408, 410, 412, 414, 416, 418, and 420 affects each trace 422, 424, 426, 428, 430, 432, 434 or 436 generates a common mode filter. By adjusting the capacitance value of each capacitor based on the impedance of traces 422, 424, 426, 428, 430, 432, 434, and 436, the common mode noise is greatly reduced, thereby improving on the traces 422, 424, 426, 428, 430 , 432, 434, and 436.

FIG. 6B illustrates a schematic representation of a cross-sectional view of through holes 406, 408, 410, 412, 414, 416, 418, or 420. Each through hole 406, 408, 410, 412, 414, 416, 418 and 420 is formed to penetrate through the first layer 602, the second layer 604, the third layer 606, the fourth layer 608 and the fifth layer 610. The second layer 604 is made of a conductive material such as gold or copper and surrounds the periphery of each through hole 406, 408, 410, 412, 414, 416, 418, and 420. The second layer 604 also connects each via 406, 408, 410, 412, 414, 416, 418, and 420 to its individual traces 422, 424, 426, 428, 430, 432, 434, or 436. The third layer 606 serves as a dielectric layer as described in FIG. 6A. The fourth layer 608 is formed in the third layer 606 and serves as a signal return layer. The fifth layer 610 is also made of conductive material such as gold or copper, and also surrounds the periphery of the via in the same manner as the first layer 602. A sealing layer (not shown in the figure) can also be formed on the fifth layer 610.

The fourth layer 608 is separated from the second layer 604 by a distance D1 and from 610 by a distance D2. The combination of the second layer 604, the third dielectric layer 606, and the fourth return signal layer 608 produces a capacitor having a capacitance value of about 0.1 pf to 0.5 pf. By adjusting the distance D1 between the fourth layer 608 and the second layer 604, the capacitance value of the through-hole capacitor is adjusted. Since the through hole connects its associated trace and the fourth return signal layer 608, the combination of the second layer 604, the third dielectric layer 606, and the fourth return signal layer 608 forms a common mode filter, and its removal is caused by Any interference caused by signal reflection caused by process defects. By adjusting the capacitance value of the through-hole capacitor, the common mode filter can be tuned to eliminate substantially all signal noise caused by the reflection of the transmitted signal or the return signal.

FIG. 6C illustrates another example of the cross-sectional view of the through holes 406, 408, 410, 412, 414, 416, 418, and 420. The second return signal layer 612 is added to the third layer 606 between the first return signal layer 608 and the fifth layer 610. The second return signal layer 612 is parallel to the first return signal layer 608 and provides the filtering effect of a common mode filter. By adjusting the distance D3 between the first return signal layer 608 and the second return signal layer 612, the first return signal layer 608, the third layer 606, and the second return signal layer 612 are formed in the through hole. The second capacitor. By adjusting the distance D3, the value of the second via capacitor can be adjusted to enhance the operation of the common mode filter. Furthermore, as known by the inventor, forming a second capacitor in the through hole allows the traces on the divided ends of the PCB 102 to be matched. As for an alternative example, the stitch 422 may be matched with the stitch 436. Accordingly, by forming the second capacitor, the pair of signal lines positioned according to the RJ45 standard can be adjusted.

Figure 7 illustrates a schematic representation of an RJ45 socket with matching transmit and receive traces. By adjusting the height H, width W, and length L of each trace 422, 424, 426, 428, 430, 432, 434, or 436, the transmitting line and the receiving line can be impedance matched. In order to enhance the operation of the socket, the same high frequency signal with opposite polarity is emitted along each pair. Because the matching traces are coupled through the shield, the paired signal lines act as common mode filters for each other. Also, if a signal cannot be delivered, the corresponding opposite signal line will deliver the same signal. Because the matching trace acts as a filter coupled to the shield, the noise caused by high-bandwidth transmission is filtered out of the signal. Furthermore, because the transmitting line matches the receiving line, the filtering of the signal is performed with higher accuracy. The reason is that, contrary to the ground connection, the reference point of the filter is the signal itself.

Fig. 8 illustrates a schematic representation diagram of differentially balanced paired signal lines. As depicted in the figure, the characteristics of each trace are adjusted so that the impedance of the first trace matches the impedance of the second trace using the method previously discussed. In addition, the capacitor formed in each through hole and the return signal line embedded in the PCB 120 form a common mode filter. By differentially balancing the two traces during the transmission period of both the transmission signal and the response signal, a fully balanced two-way communication circuit is achieved.

FIG. 9 illustrates a schematic representative diagram of a method of balancing and matching traces for the transmission signal and the return signal. In step 902, the physical characteristics of each trace in the matched pair of traces are adjusted so that the impedance of the traces is substantially equal. The physical characteristics may include the height, length, and width of each stitch in the matching stitch set and the distance separating each stitch. In step 904, the first signal with the first polarity is transmitted along the first trace in the set of matched traces. The first signal may be a high-frequency communication signal operating at a frequency greater than 10 gigahertz (GHz). In step 906, a second signal that is substantially the same as the first signal but has a polarity opposite to the polarity of the first signal is simultaneously transmitted on the second trace in the set of matched traces along with the first signal. In step 908, the first signal is measured at the origin and end of the trace, and the two metric values are compared to determine the amount of data loss along the length of the trace. In step 910, at least one physical characteristic of the first stitch or the second stitch is adjusted based on the measured signal loss. The processing procedure may return to step 904 until the signal loss is less than about 10 decibels (db).

In step 912, the third signal is transmitted on the second trace of the set of matched traces. In step 914, a fourth signal that is substantially the same as the third signal but has the opposite polarity of the third signal is transmitted on the first trace. In step 916, the third signal is measured at the generating and ending ends of the trace, and the two metrics are compared to determine the amount of data loss along the length of the trace. In step 918, at least one physical characteristic of the first stitch or the second stitch is adjusted based on the measured signal loss. The processing procedure may return to step 912 until the signal loss is less than about 10 decibels (db). In another example, the processing procedure may return to step 904 to determine that the loss of the third signal is not affected by adjustments made in response to the loss of the third signal.

FIG. 10 illustrates the PCB 120 located in the socket 110. The base 402 of the PCB 120 is made from a flexible material, which allows the first part of the PCB 120 to be oriented at an angle of about 90 degrees with respect to the second part of the PCB 120. Accordingly, the PCB 120 is bent so that the through holes 406, 408, 410, 412, 414, 416, 418, and 420 are located above the pins 210 in the socket, and the traces 422, 424, 426, 428, 430, 432, 434 and 436 extends from the through holes 406, 408, 410, 412, 414, 416, 418, and 420 to the contact pads for the socket. The shielding lugs 486 and 488 are bent so that they form an angle of about 90 degrees with the PCB 120. The shielding lugs 486 and 488 are placed along the sides of the socket so that the socket cover 130 of the socket engages the shielding lugs 486 and 488.

The flexible PCB 120 can be implemented using any flexible plastic substrate that allows the flexible PCB 120 to be bent. As described herein, the flexible PCB 120 can be bent or bent to conform to the existing form factor of the RJ45 socket 110 and be shielded by the socket cover 130. For example, the flexible PCB 120 can be attached to the RJ45 socket 110 between the RJ45 socket 110 and the socket cover 130. The shielding lugs 486 and 488 of the flexible PCB 120 can be attached to the socket cover 130 to provide a flexible circuit commonly connected to the flexible PCB 120. The set 210 of pins of the RJ45 socket 110 can then be electrically coupled to a circuit board of a device in which the RJ45 socket 110 is used.

The flexible PCB 120 can be assembled to fold and conform to the shape of the RJ45 socket 110 to better match the existing housing, such as the socket cover 130. For example, in one aspect of the disclosed method, the flexible PCB 120 is bent toward the middle section of the flexible PCB 120 at an angle of about 90 degrees to be folded into the socket cover 130. The shielding lugs 486 and 488 of the flexible PCB 120 are folded onto the socket cover 130 and contact the socket cover 130, and can be welded to fix the flexible PCB 120 to the socket cover 130. Those skilled in the art will understand that the directionality of the flexible PCB 120 inside the socket cover 130 relative to the RJ45 socket 110 can be changed according to various aspects of the present disclosure. For example, the flexible PCB 120 can be thin enough to be bent and folded to the other sides of the socket cover 130. The flexible PCB 120 can be formed to be completely flat along the bottom section 304 of the socket cover 130 without bending or bending into the socket cover 130.

The foregoing detailed description is only a few explanations and embodiments of the present disclosure, and many changes can be made to the disclosed embodiments based on the disclosure herein without departing from the spirit or scope thereof. Therefore, the foregoing description does not mean to limit the scope of disclosure, but to provide sufficient disclosure to those skilled in the invention who use undue burdens to implement the present invention.

Figure 11 depicts an embodiment of a high-speed communication socket with a rigid base. The high-speed communication socket 1100 includes a socket housing 1102, which is assembled to receive a communication plug (not shown in the figure). The base 1300 is placed on the lower surface of the housing so that the pins 1306 extend from the base 1300 for engagement with the circuit board on which the socket is mounted during installation.

Figure 12 depicts a schematic representation of each layer in a rigid high-speed communication socket. The base 1300 includes a top layer 1202 containing a plurality of through holes (not shown in the figure) each of which size can accommodate a pin, a second layer 1204 containing one of the plurality of impedance matching traces discussed above, and a series of through holes. A third layer 1206 and a fourth layer 1208 of the through holes in the first layer 1202 are concentrically aligned. The first layer 1202 is separated from the second layer 1204 by a non-conductive material, such as, but not limited to, a first intermediate layer 1210 made of Rogers material. The second layer 1204 is separated from the third layer 1206 by the second intermediate layer 1212, and the third layer 1206 and the fourth layer 1208 are separated by the third intermediate layer 1214. The top solder mask layer 1216 is formed on the side of the first layer 1202 opposite to the first intermediate layer 1210. In one embodiment, the first layer 1202, the second layer 1204, the third layer 1206, and the fourth layer 1208 include 1/4 ounce of copper and 1/4 ounce of finished silver. In one embodiment, the first intermediate layer 1210, the second intermediate layer 1212, and the third intermediate layer 1214 are made of Rogers R04003 material. In another embodiment, the first layer 1202 is bonded to the first intermediate layer 1210 by an adhesive, the second and third layers 1204 and 1206 are bonded to the second intermediate layer 1212 by an adhesive, and the third layer 1206 and The fourth layer 1208 is bonded to the third intermediate layer 1214 by an adhesive.

Figure 13A depicts a side view of a high-speed communication socket. The socket includes a rigid base 1300 including a first set of pins 1302 on the bottom side of the base 1300 and a second set of pins 1304 on the top side of the base 1300. FIG. 13B depicts a top view of the rigid base 1300. As shown in FIG. The rigid base 1300 includes a plurality of first through holes 1306, 1308, 1310, 1312, 1314, 1316, 1318 and 1320 extending through the base 1300, which are joined to the first set of pins 1302 on opposite sides of the base 1300. The pins 1302 of the first set are assembled to engage through holes (not shown in the figure) on the circuit board to provide a communication link between the socket and the circuit board. Each of the stitches 1304 of the second set is engaged with the second through holes 1322, 1324, 1326, and the second through holes 1322, 1324, 1326, 1326, 1326, 1326, 1326, 1326, 1326, 1326, 1326, 1326, 1326, 1326, 1326, 1326 of the opposite side of the base 1300. 1328, 1330, 1332, 1334, and 1336. The pins 1304 of the second set are assembled to engage the corresponding pins of the plug when the plug is inserted into the socket.

The stitch 1338 is formed on the top surface of the base 1300 and connects the second through hole 1326 to the first through hole 1310, and the stitch 1340 connects the second through hole 1328 to the first through hole 1312. The first isolation region 1342 is formed between the stitches 1338 and 1340 to provide isolation between the two stitches 1338 and 1340. The stitch 1344 connects the second through hole 1334 to the first through hole 1318, and the stitch 1346 connects the second through hole 1336 to the first through hole 1320. The second isolation region 1348 isolates the stitch 1340 and the stitch 1344, and the third isolation region 1350 isolates the stitch 1344 and the stitch 1346. The isolation plane 1352 extends around the periphery of the base 1302 between the second through holes 1322, 1324, 1326, 1328, 1330, 1332, 1334, and 1336 and the edge of the base, and between the stitches 1338 and 1346 and the edge of the base 1302. In one embodiment, the isolation region and the plane are made of 1/4 ounce copper and 1/4 ounce silver. By providing isolation between different traces, the effect of electrical interference between traces is reduced or eliminated. In one embodiment, through holes are formed in each isolation region to connect the isolation region to the ground layer below.

Figure 14A depicts the ground layer 1400 of the base 1300. The ground floor 1400 is placed adjacent to the top floor 1300. The ground layer 1400 includes a ground plane 1402. The ground plane 1402 covers the surface of the ground layer 1400 but surrounds the first through holes 1306, 1308, 1310, 1312, 1314, 1316, 1318, and 1320 and the second through holes 1322, 1324, 1326, 1328, 1330, 1332, 1334, and 1336 Except for the area surrounding it. The surface of the ground layer 1400 is covered with a conductive material to form a ground plane 1402. In one embodiment, the material is 1/4 ounce of copper and 1/4 ounce of silver.

FIG. 14B depicts the second ground layer 1404 of the base 1300. The second ground layer 1404 is covered with a conductive material, which substantially covers the entire surface of the second ground layer 1404, but surrounds the first through holes 1306, 1308, 1310, 1312, 1314, 1316, 1318 and 1320 and the second through holes Except this area around 1322, 1324, 1326, 1328, 1330, 1332, 1334 and 1336. In one embodiment, the material covering the second ground layer 1404 is 1/4 ounce of copper and 1/4 ounce of silver.

FIG. 14C depicts the bottom layer 1406 of the substrate 1300. The bottom layer 1406 includes first through holes 1306, 1308, 1310, 1312, 1314, 1316, 1318, and 1320 and second through holes 1322, 1324, 1326, 1328, 1330, 1332, 1334, and 1336. The stitch 1408 connects the second through hole 1322 and the first through hole 1306, and the stitch 1410 connects the second through hole 1324 and the first through hole 1308. The isolation region 1412 separates the stitch 1408 and the stitch 1410. The second isolation region 1418 separates the stitch 1410 and the stitch 1414, and the third isolation region 1420 separates the stitch 1414 and the stitch 1416. The isolation plane 1422 extends around the periphery of the bottom layer 1406 between the second through holes 1322, 1324, 1326, 1328, 1330, 1332, 1334, and 1336 and the edge of the base 1302, and between the stitches 1408 and 1416 and the edge of the base 1302.

Figures 15A-15F depict a line graph representation of the test results for high-speed communication sockets. Figure 15A shows the insertion loss of the differential mode version of the socket during normal operation. As the line graph shows, the insertion loss is about 1.8 db when approaching the speed of 2000 MHz. Figures 15B and 15C depict a line graph representation of the near-field crosstalk of the socket during normal operation. Figure 15D depicts the return loss for the socket during normal operation. The line graph also shows the performance requirements for the IEEE 40GBase-T standard. As indicated by the line graph, when approaching the speed of 2000 MHz, the performance of the socket is better than the performance requirements of the IEEE 40GBase-T standard. Figure 15E depicts a line graph representation of the far-end crosstalk of the socket during normal operation. The line graph also shows the performance requirements for the IEEE 40GBase-T standard. As indicated by the line graph, when approaching the speed of 2000 MHz, the performance of the socket is better than the performance requirements of the IEEE 40GBase-T standard. Figure 15F depicts another line graph representation of the far-end crosstalk of the socket during normal operation.

As verified in Figures 15A-15F, by connecting the trace and the ground plane to the base 1300, the socket can transmit data at a very high speed without interference. In addition, by arranging the layers of the substrate to provide multiple grounding layers, the separation of the traces on the substrate is increased, which further improves the performance of the socket.

In this disclosure, the term "一(a)" or "一(an)" is taken to include both the singular and the plural. Conversely, if appropriate, any mention of plural items will include the singular.

It should be understood that the various changes and modifications of the preferred embodiment disclosed here will be obvious to those skilled in the art. Changes and modifications can be made without departing from the essence and scope of this disclosure and without reducing the expected advantages. Therefore, it is expected that these changes and amendments will be covered by the scope of the attached patent application.

110‧‧‧RJ45 socket 120‧‧‧Flexible printed circuit board (PCB) 130‧‧‧Socket cover 210,1302,1304‧‧‧Pin collection 212‧‧‧Plug contact collection 220‧‧‧One Column 230‧‧‧Plug opening 302‧‧‧Top 304‧‧‧Bottom 306‧‧‧Back 308‧‧‧Front 310‧‧‧Right 320‧‧‧Pair of lugs 402,1300‧‧Base 404‧‧‧Protection layer 406, 408, 410, 412, 414, 416, 418, 420‧‧‧ Through holes 422, 424, 426, 428, 430, 432, 434, 436, 1338, 1340, 1344, 1346, 1408, 1410, 1414, 1416‧‧‧Stitch 454,456,458,460,462,464,466,468‧‧‧Part 470,472,474,476,478,480,482,484‧‧‧ The second part 486, 488‧‧‧shielding lugs 490, 502‧‧‧shielding trace layer 504, 506, 508, 510, 512, 514, 516, 518‧‧‧ return through hole 602, 1202‧‧ Floor 604, 1204‧‧‧Second floor 606, 1206‧‧‧ Third floor 608, 1208‧‧‧ Fourth floor 610‧‧‧Fifth floor 612‧‧‧Second return signal layer 902-918‧‧ ‧Step 1100‧‧‧High-speed communication socket 1102‧‧‧Socket housing 1202‧‧‧Top layer 1210‧‧‧First middle layer 1212‧‧‧Second middle layer 1214‧‧‧Third middle layer 1216‧‧‧Top Weld cover layer 1306, 1308, 1310, 1312, 1314, 1316, 1318, 1320‧‧‧ First through hole 1322, 1324, 1326, 1328, 1330, 1332, 1334, 1336‧‧‧ Second through hole 1342, 1412 ‧‧‧First isolation zone 1348, 1418‧‧‧Second isolation zone 1350, 1420‧‧‧ Third isolation zone 1352 ‧Second Ground Floor 1406‧‧‧Bottom Floor

Fig. 1 illustrates a high-speed communication socket assembled according to an embodiment of the various aspects of the present disclosure, which includes an RJ45 socket,

FIG. 2 illustrates a bottom perspective view of the left side of the RJ45 socket 110 of FIG. 1,

Fig. 3 illustrates the bottom and right side views of the socket cover used to provide shielding for the RJ45 socket and flexible printed circuit board of Fig. 1,

4A illustrates a schematic top view representative view of the front surface of the printed circuit board of FIG. 1,

FIG. 4B illustrates another embodiment of the schematic representation of the top view of the front surface of the printed circuit board of FIG. 1,

FIG. 5A illustrates a schematic top view representative view of the back surface of the printed circuit board of FIG. 4,

FIG. 5B illustrates another embodiment of the top view schematic representation of the front surface of the printed circuit board of FIG. 4,

6A illustrates a cross-sectional view of the substrate of the printed circuit board of FIG. 4 along line BB,

6B illustrates a cross-sectional view of a through hole in the printed circuit board of FIG. 4,

6C illustrates a cross-sectional view of another example of a through hole in the printed circuit board of FIG. 4,

Figure 7 illustrates a schematic representation of an RJ45 socket with matched and balanced transmitting and receiving cable pairs,

Figure 8 illustrates a schematic representation of the signal line of a differential balanced pair,

FIG. 9 illustrates a schematic representation of the method used to differentially balance the two traces in FIG. 4 based on a first signal and a second signal,

Figure 10A illustrates a rear perspective view of the RJ45 socket of Figure 1 with its cover removed;

FIG. 10B illustrates a rear perspective view of another embodiment of the RJ45 socket of FIG. 1 with its cover removed; FIG.

Figure 11 depicts an embodiment of a high-speed communication socket including a rigid base;

Figure 12 depicts a schematic representation of the layers in a rigid high-speed communication socket,

Figure 13A depicts a side view of a high-speed communication socket;

Figure 13B depicts a top view of the rigid substrate;

Figure 14A depicts a ground layer of the substrate;

Figure 14B depicts a second ground layer of the substrate;

Figure 14C depicts a bottom layer of the substrate;

Figure 14D depicts a fourth layer of the rigid substrate;

Figure 15A shows the insertion loss of the differential mode version of the socket during normal operation;

Figure 15B depicts a line graph representation of the near-field crosstalk of the socket during normal operation;

Figure 15C depicts a line graph representation of the near-field crosstalk of the socket in normal operation;

Figure 15D depicts the return loss for the socket during normal operation;

Figure 15E depicts a line diagram representation of the far-end crosstalk of the socket during normal operation; and

Figure 15F depicts another line graph representation of the far-end crosstalk of the socket during normal operation.

110‧‧‧RJ45 socket

120‧‧‧Flexible PCB

130‧‧‧Socket cover

Claims (8)

A high-speed communication socket, comprising: a shell, the shell includes a port for receiving a plug, the port includes a plurality of pins each connected to a corresponding signal line in the plug; A shielding shell; a circuit board in the housing, the circuit board has a base, extending through the base of a plurality of first through holes, and each first through hole is assembled to accommodate a pin on the housing , A plurality of second through holes extending through the base body and each second through hole is assembled to accommodate a stitch on the housing, a first set of stitches on the top layer of the base body, which connect at least A first through hole and at least one corresponding second through hole; a first shielding layer on a first side of the top layer in the substrate; a second shielding adjacent to the first shielding layer in the substrate Layer; and a second set of stitches on the side of the substrate opposite to the top layer, which connects at least one first through hole and at least one second through hole, wherein one of the first set of stitches Each stitch is separated by an isolation area of a first set on the top surface, and each stitch in the second set of stitches is separated from the top surface It is separated by a second set of isolation regions on the surface of the pair. Such as the socket of claim 1, wherein the stitches of the second set connect different through holes and the through holes are connected to the top surface. Such as the socket of claim 1, wherein the first shielding layer is covered in a conductive material. Such as the socket of claim 3, wherein the conductive material does not cover an area surrounding the peripheries of the first through holes and the second through holes. Such as the socket of claim 1, wherein the second shielding layer is covered in a conductive material. Such as the socket of claim 5, wherein the conductive material does not cover an area surrounding the peripheries of the first through holes and the second through holes. Such as the socket of claim 3, wherein the conductive material includes copper and refined silver. Such as the socket of claim 5, wherein the conductive material includes copper and refined silver.

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