EP3453081A4 - High speed grounded communication jack - Google Patents

High speed grounded communication jack Download PDF

Info

Publication number
EP3453081A4
EP3453081A4 EP17793306.6A EP17793306A EP3453081A4 EP 3453081 A4 EP3453081 A4 EP 3453081A4 EP 17793306 A EP17793306 A EP 17793306A EP 3453081 A4 EP3453081 A4 EP 3453081A4
Authority
EP
European Patent Office
Prior art keywords
high speed
communication jack
grounded
grounded communication
jack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17793306.6A
Other languages
German (de)
French (fr)
Other versions
EP3453081A1 (en
Inventor
Brett D. Robinson
Justin Wagner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sentinel Connector Systems Inc
Original Assignee
Sentinel Connector Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/146,019 external-priority patent/US9627816B2/en
Application filed by Sentinel Connector Systems Inc filed Critical Sentinel Connector Systems Inc
Publication of EP3453081A1 publication Critical patent/EP3453081A1/en
Publication of EP3453081A4 publication Critical patent/EP3453081A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00—Four or more poles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
EP17793306.6A 2016-05-04 2017-05-04 High speed grounded communication jack Pending EP3453081A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/146,019 US9627816B2 (en) 2012-02-13 2016-05-04 High speed grounded communication jack
PCT/US2017/030968 WO2017192800A1 (en) 2016-05-04 2017-05-04 High speed grounded communication jack

Publications (2)

Publication Number Publication Date
EP3453081A1 EP3453081A1 (en) 2019-03-13
EP3453081A4 true EP3453081A4 (en) 2020-01-22

Family

ID=60203392

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17793306.6A Pending EP3453081A4 (en) 2016-05-04 2017-05-04 High speed grounded communication jack

Country Status (13)

Country Link
EP (1) EP3453081A4 (en)
JP (1) JP7339734B2 (en)
KR (1) KR102318866B1 (en)
CN (1) CN109478747B (en)
AU (1) AU2017260462B2 (en)
BR (1) BR112018071868A2 (en)
CA (1) CA3022689A1 (en)
IL (1) IL262491B (en)
MX (1) MX2018013320A (en)
PH (1) PH12018502285A1 (en)
RU (1) RU2713644C1 (en)
TW (1) TWI743118B (en)
WO (1) WO2017192800A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023028712A (en) * 2021-08-20 2023-03-03 日本航空電子工業株式会社 connector assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130210277A1 (en) * 2012-02-13 2013-08-15 Sentinel Connector Systems, Inc. High speed communication jack
US20140206240A1 (en) * 2013-01-23 2014-07-24 Commscope, Inc. Of North Carolina Communications Connectors Having Printed Circuit Boards that Include Floating Image Planes

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69421798T2 (en) * 1994-03-26 2004-07-15 Molex Inc., Lisle Modular Jack connector
JP2003224408A (en) * 2002-01-30 2003-08-08 Kyocera Corp High-frequency wiring board
US6769937B1 (en) * 2003-05-13 2004-08-03 Molex Incorporated Modular jack assembly for jack plugs with varying numbers of wires
US7182649B2 (en) * 2003-12-22 2007-02-27 Panduit Corp. Inductive and capacitive coupling balancing electrical connector
EP2675022B1 (en) * 2004-07-13 2014-09-03 Panduit Corporation Communications connector with flexible printed circuit board
US7601034B1 (en) * 2008-05-07 2009-10-13 Ortronics, Inc. Modular insert and jack including moveable reactance section
WO2009138168A1 (en) 2008-05-15 2009-11-19 Adc Gmbh Circuit board for electrical connector and electrical connector
US8167661B2 (en) * 2008-12-02 2012-05-01 Panduit Corp. Method and system for improving crosstalk attenuation within a plug/jack connection and between nearby plug/jack combinations
US8660424B2 (en) 2010-08-26 2014-02-25 Cisco Technology, Inc. Scalable high speed gigabit active bundle link and tester
US8637987B2 (en) 2011-08-09 2014-01-28 Micron Technology, Inc. Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
US9337592B2 (en) 2012-02-13 2016-05-10 Sentinel Connector Systems, Inc. High speed communication jack
TWM445286U (en) * 2012-09-03 2013-01-11 Simula Technology Inc Signal connector
CN103390818B (en) * 2013-08-09 2015-08-12 浙江一舟电子科技股份有限公司 A kind of ultrahigh speed communication resistance to crosstalk interface circuit and comprise the socket of this interface circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130210277A1 (en) * 2012-02-13 2013-08-15 Sentinel Connector Systems, Inc. High speed communication jack
US20140206240A1 (en) * 2013-01-23 2014-07-24 Commscope, Inc. Of North Carolina Communications Connectors Having Printed Circuit Boards that Include Floating Image Planes

Also Published As

Publication number Publication date
CN109478747A (en) 2019-03-15
AU2017260462A1 (en) 2018-11-15
IL262491B (en) 2022-04-01
AU2017260462B2 (en) 2021-05-20
PH12018502285A1 (en) 2019-07-15
JP2019519068A (en) 2019-07-04
RU2713644C1 (en) 2020-02-05
CN109478747B (en) 2021-03-05
TWI743118B (en) 2021-10-21
KR102318866B1 (en) 2021-10-28
EP3453081A1 (en) 2019-03-13
JP7339734B2 (en) 2023-09-06
WO2017192800A1 (en) 2017-11-09
TW201813215A (en) 2018-04-01
CA3022689A1 (en) 2017-11-09
IL262491A (en) 2018-12-31
KR20190000888A (en) 2019-01-03
BR112018071868A2 (en) 2019-02-19
MX2018013320A (en) 2019-03-01

Similar Documents

Publication Publication Date Title
EP3314835A4 (en) High speed communications system
EP3507105A4 (en) Airless tire
EP3636460A4 (en) Tire
EP3659826A4 (en) Tire
EP3640058A4 (en) Tire
EP3258729A4 (en) Communication apparatus
EP3445090A4 (en) Communication method
EP3708386A4 (en) Nonpneumatic tire
EP3643525A4 (en) Tire
EP3702177A4 (en) Tire
EP3636458A4 (en) Tire
EP3623172A4 (en) Tire
EP3458398A4 (en) Elevator communication arrangement
EP3705316A4 (en) Tire
EP3659829A4 (en) Tire
EP3643515A4 (en) Tire
EP3640056A4 (en) Tire
EP3640057A4 (en) Tire
EP3636452A4 (en) Tire
EP3590733A4 (en) Tire
EP3581400A4 (en) Tire
EP3466716A4 (en) Deformable tire
EP3698983A4 (en) Tire
EP3640047A4 (en) Tire
EP3603993A4 (en) Tire

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20181019

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20191219

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 1/02 20060101ALI20191213BHEP

Ipc: H05K 1/16 20060101ALI20191213BHEP

Ipc: H01R 43/16 20060101ALI20191213BHEP

Ipc: H01R 107/00 20060101ALI20191213BHEP

Ipc: H01R 13/6473 20110101ALI20191213BHEP

Ipc: H01R 13/6466 20110101AFI20191213BHEP

Ipc: H01R 24/64 20110101ALI20191213BHEP

Ipc: H01R 13/6585 20110101ALI20191213BHEP