BR112018071868A2 - plugue de comunicação de alta velocidade - Google Patents
plugue de comunicação de alta velocidadeInfo
- Publication number
- BR112018071868A2 BR112018071868A2 BR112018071868-8A BR112018071868A BR112018071868A2 BR 112018071868 A2 BR112018071868 A2 BR 112018071868A2 BR 112018071868 A BR112018071868 A BR 112018071868A BR 112018071868 A2 BR112018071868 A2 BR 112018071868A2
- Authority
- BR
- Brazil
- Prior art keywords
- substrate
- housing
- protective layer
- high speed
- pathway
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
- H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
- H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2107/00—Four or more poles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09336—Signal conductors in same plane as power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
a presente invenção refere-se a um método para fabricar um conector de alta velocidade, o método incluindo as etapas de formar um invólucro incluindo uma abertura para aceitar um plugue, a abertura incluindo vários pinos, cada um conectado com uma linha de sinal correspondente no plugue, formar uma caixa de proteção envolvendo o invólucro, formar uma camada superior de um substrato, uma primeira camada de proteção em um primeiro lado da camada superior no substrato, um segunda camada de proteção adjacente à primeira camada de proteção no substrato, e formar uma camada inferior adjacente à segunda camada de proteção, formar várias primeiras vias se estendendo através do substrato com cada primeira via sendo configurada para acomodar um pino no invólucro, formar várias segundas vias se estendendo através do substrato com cada segunda via sendo configurada para acomodar um pino no invólucro.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/146,019 | 2016-05-04 | ||
US15/146,019 US9627816B2 (en) | 2012-02-13 | 2016-05-04 | High speed grounded communication jack |
PCT/US2017/030968 WO2017192800A1 (en) | 2016-05-04 | 2017-05-04 | High speed grounded communication jack |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112018071868A2 true BR112018071868A2 (pt) | 2019-02-19 |
Family
ID=60203392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112018071868-8A BR112018071868A2 (pt) | 2016-05-04 | 2017-05-04 | plugue de comunicação de alta velocidade |
Country Status (13)
Country | Link |
---|---|
EP (1) | EP3453081A4 (pt) |
JP (1) | JP7339734B2 (pt) |
KR (1) | KR102318866B1 (pt) |
CN (1) | CN109478747B (pt) |
AU (1) | AU2017260462B2 (pt) |
BR (1) | BR112018071868A2 (pt) |
CA (1) | CA3022689A1 (pt) |
IL (1) | IL262491B (pt) |
MX (1) | MX2018013320A (pt) |
PH (1) | PH12018502285A1 (pt) |
RU (1) | RU2713644C1 (pt) |
TW (1) | TWI743118B (pt) |
WO (1) | WO2017192800A1 (pt) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023028712A (ja) * | 2021-08-20 | 2023-03-03 | 日本航空電子工業株式会社 | コネクタ組立体 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69421798T2 (de) * | 1994-03-26 | 2004-07-15 | Molex Inc., Lisle | Verbinder vom Typ Modular Jack |
JP2003224408A (ja) * | 2002-01-30 | 2003-08-08 | Kyocera Corp | 高周波用配線基板 |
US6769937B1 (en) * | 2003-05-13 | 2004-08-03 | Molex Incorporated | Modular jack assembly for jack plugs with varying numbers of wires |
US7182649B2 (en) * | 2003-12-22 | 2007-02-27 | Panduit Corp. | Inductive and capacitive coupling balancing electrical connector |
EP1774625B1 (en) * | 2004-07-13 | 2014-06-25 | Panduit Corporation | Communications connector with flexible printed circuit board |
US7601034B1 (en) * | 2008-05-07 | 2009-10-13 | Ortronics, Inc. | Modular insert and jack including moveable reactance section |
AU2009248414B2 (en) | 2008-05-15 | 2014-05-29 | Tyco Electronics Services Gmbh | Circuit board for electrical connector and electrical connector |
US8167661B2 (en) * | 2008-12-02 | 2012-05-01 | Panduit Corp. | Method and system for improving crosstalk attenuation within a plug/jack connection and between nearby plug/jack combinations |
US8660424B2 (en) | 2010-08-26 | 2014-02-25 | Cisco Technology, Inc. | Scalable high speed gigabit active bundle link and tester |
US8637987B2 (en) | 2011-08-09 | 2014-01-28 | Micron Technology, Inc. | Semiconductor assemblies with multi-level substrates and associated methods of manufacturing |
US8858266B2 (en) * | 2012-02-13 | 2014-10-14 | Sentinel Connector Systems, Inc. | High speed communication jack |
US9337592B2 (en) | 2012-02-13 | 2016-05-10 | Sentinel Connector Systems, Inc. | High speed communication jack |
TWM445286U (zh) * | 2012-09-03 | 2013-01-11 | Simula Technology Inc | 訊號連接器 |
US8915756B2 (en) * | 2013-01-23 | 2014-12-23 | Commscope, Inc. Of North Carolina | Communication connector having a printed circuit board with thin conductive layers |
CN103390818B (zh) * | 2013-08-09 | 2015-08-12 | 浙江一舟电子科技股份有限公司 | 一种超高速通信用抗串扰接口电路及包含该接口电路的插座 |
-
2017
- 2017-05-03 TW TW106114632A patent/TWI743118B/zh active
- 2017-05-04 WO PCT/US2017/030968 patent/WO2017192800A1/en unknown
- 2017-05-04 MX MX2018013320A patent/MX2018013320A/es unknown
- 2017-05-04 JP JP2018557872A patent/JP7339734B2/ja active Active
- 2017-05-04 RU RU2018138613A patent/RU2713644C1/ru active
- 2017-05-04 EP EP17793306.6A patent/EP3453081A4/en active Pending
- 2017-05-04 BR BR112018071868-8A patent/BR112018071868A2/pt not_active Application Discontinuation
- 2017-05-04 CN CN201780027344.3A patent/CN109478747B/zh active Active
- 2017-05-04 CA CA3022689A patent/CA3022689A1/en not_active Abandoned
- 2017-05-04 KR KR1020187031440A patent/KR102318866B1/ko active IP Right Grant
- 2017-05-04 AU AU2017260462A patent/AU2017260462B2/en not_active Ceased
-
2018
- 2018-10-21 IL IL262491A patent/IL262491B/en unknown
- 2018-10-26 PH PH12018502285A patent/PH12018502285A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
TWI743118B (zh) | 2021-10-21 |
IL262491B (en) | 2022-04-01 |
RU2713644C1 (ru) | 2020-02-05 |
MX2018013320A (es) | 2019-03-01 |
KR20190000888A (ko) | 2019-01-03 |
JP2019519068A (ja) | 2019-07-04 |
AU2017260462A1 (en) | 2018-11-15 |
EP3453081A1 (en) | 2019-03-13 |
CA3022689A1 (en) | 2017-11-09 |
TW201813215A (zh) | 2018-04-01 |
IL262491A (en) | 2018-12-31 |
CN109478747A (zh) | 2019-03-15 |
WO2017192800A1 (en) | 2017-11-09 |
CN109478747B (zh) | 2021-03-05 |
KR102318866B1 (ko) | 2021-10-28 |
JP7339734B2 (ja) | 2023-09-06 |
EP3453081A4 (en) | 2020-01-22 |
PH12018502285A1 (en) | 2019-07-15 |
AU2017260462B2 (en) | 2021-05-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B350 | Update of information on the portal [chapter 15.35 patent gazette] | ||
B06W | Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette] | ||
B11B | Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements |