TWI743076B - 洗淨裝置 - Google Patents

洗淨裝置 Download PDF

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Publication number
TWI743076B
TWI743076B TW106101030A TW106101030A TWI743076B TW I743076 B TWI743076 B TW I743076B TW 106101030 A TW106101030 A TW 106101030A TW 106101030 A TW106101030 A TW 106101030A TW I743076 B TWI743076 B TW I743076B
Authority
TW
Taiwan
Prior art keywords
cleaning
wafer
roller
cleaning roller
washing
Prior art date
Application number
TW106101030A
Other languages
English (en)
Chinese (zh)
Other versions
TW201735148A (zh
Inventor
保羅 亞天迪多
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201735148A publication Critical patent/TW201735148A/zh
Application granted granted Critical
Publication of TWI743076B publication Critical patent/TWI743076B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • B08B1/20—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
TW106101030A 2016-02-25 2017-01-12 洗淨裝置 TWI743076B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-034321 2016-02-25
JP2016034321A JP6609197B2 (ja) 2016-02-25 2016-02-25 洗浄装置

Publications (2)

Publication Number Publication Date
TW201735148A TW201735148A (zh) 2017-10-01
TWI743076B true TWI743076B (zh) 2021-10-21

Family

ID=59717914

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106101030A TWI743076B (zh) 2016-02-25 2017-01-12 洗淨裝置

Country Status (4)

Country Link
JP (1) JP6609197B2 (ja)
KR (1) KR102518002B1 (ja)
CN (1) CN107123609B (ja)
TW (1) TWI743076B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6951199B2 (ja) * 2017-11-09 2021-10-20 株式会社ディスコ ウェーハ洗浄装置
CN107931179B (zh) * 2017-11-15 2020-10-02 宜都同创光电科技有限公司 一种光学玻璃镜片洗前半自动擦油机
JP7100475B2 (ja) * 2018-03-30 2022-07-13 株式会社ディスコ 加工装置
JP7288370B2 (ja) * 2019-08-20 2023-06-07 株式会社ディスコ ウェーハ洗浄機構
CN114425492B (zh) * 2022-02-17 2023-01-20 江苏正永地面装饰材料有限公司 一种pvc板材的生产加工系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05347287A (ja) * 1992-04-14 1993-12-27 Sony Corp 洗浄装置
JP2002307023A (ja) * 2001-04-13 2002-10-22 Display Technologies Inc 自己洗浄機能付きのブラシ洗浄装置、及びこれを用いる平面表示装置または半導体素子の製造方法
JP2009279536A (ja) * 2008-05-23 2009-12-03 Hitachi High-Technologies Corp 基板洗浄装置及び、基板洗浄方法
JP2013239498A (ja) * 2012-05-11 2013-11-28 Disco Abrasive Syst Ltd 洗浄装置
JP2015126033A (ja) * 2013-12-25 2015-07-06 株式会社ディスコ 洗浄装置および加工装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139062A (ja) * 1994-11-11 1996-05-31 M Setetsuku Kk 基板のスクラビング装置
JP2930580B1 (ja) * 1998-03-27 1999-08-03 株式会社カイジョー 半導体ウエーハ等用洗浄装置
JP2009117765A (ja) 2007-11-09 2009-05-28 Aion Kk 洗浄用スポンジローラ
JP5886224B2 (ja) * 2012-05-23 2016-03-16 株式会社荏原製作所 基板洗浄方法
JP6054805B2 (ja) * 2013-04-25 2016-12-27 株式会社荏原製作所 基板洗浄装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05347287A (ja) * 1992-04-14 1993-12-27 Sony Corp 洗浄装置
JP2002307023A (ja) * 2001-04-13 2002-10-22 Display Technologies Inc 自己洗浄機能付きのブラシ洗浄装置、及びこれを用いる平面表示装置または半導体素子の製造方法
JP2009279536A (ja) * 2008-05-23 2009-12-03 Hitachi High-Technologies Corp 基板洗浄装置及び、基板洗浄方法
JP2013239498A (ja) * 2012-05-11 2013-11-28 Disco Abrasive Syst Ltd 洗浄装置
JP2015126033A (ja) * 2013-12-25 2015-07-06 株式会社ディスコ 洗浄装置および加工装置

Also Published As

Publication number Publication date
JP2017152565A (ja) 2017-08-31
JP6609197B2 (ja) 2019-11-20
CN107123609B (zh) 2022-02-11
KR20170100428A (ko) 2017-09-04
KR102518002B1 (ko) 2023-04-04
CN107123609A (zh) 2017-09-01
TW201735148A (zh) 2017-10-01

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