TWI739219B - Connector for electrical connection - Google Patents

Connector for electrical connection Download PDF

Info

Publication number
TWI739219B
TWI739219B TW108142876A TW108142876A TWI739219B TW I739219 B TWI739219 B TW I739219B TW 108142876 A TW108142876 A TW 108142876A TW 108142876 A TW108142876 A TW 108142876A TW I739219 B TWI739219 B TW I739219B
Authority
TW
Taiwan
Prior art keywords
connector
elastic
electromagnetic wave
carbon nanotubes
wave shielding
Prior art date
Application number
TW108142876A
Other languages
Chinese (zh)
Other versions
TW202027351A (en
Inventor
鄭永倍
Original Assignee
韓商Isc 股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 韓商Isc 股份有限公司 filed Critical 韓商Isc 股份有限公司
Publication of TW202027351A publication Critical patent/TW202027351A/en
Application granted granted Critical
Publication of TWI739219B publication Critical patent/TWI739219B/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

Abstract

本發明提供一種位於檢查裝置與被檢查器件之間而將檢查裝置與被檢查器件電性連接之連接器。連接器包含複數個彈性導電部、及彈性絕緣部。複數個彈性導電部可沿上下方向導電。彈性絕緣部使複數個彈性導電部沿水平方向隔開及絕緣。彈性絕緣部包含複數個電磁波屏蔽部,複數個電磁波屏蔽部包含沿上下方向分佈及排列且具有磁性之多個奈米碳管。The invention provides a connector which is located between the inspection device and the inspected device and electrically connects the inspection device and the inspected device. The connector includes a plurality of elastic conductive parts and elastic insulating parts. The plurality of elastic conductive parts can conduct electricity in the up-down direction. The elastic insulating part separates and insulates the plurality of elastic conductive parts in the horizontal direction. The elastic insulating portion includes a plurality of electromagnetic wave shielding portions, and the plurality of electromagnetic wave shielding portions includes a plurality of carbon nanotubes that are distributed and arranged in the vertical direction and have magnetism.

Description

電性連接用連接器Connector for electrical connection

本發明係關於一種與兩個電子器件接觸而將兩個電子器件電性連接之連接器。The present invention relates to a connector which is in contact with two electronic devices and electrically connects the two electronic devices.

為了對被檢查器件進行電性檢查,於本領域中使用與被檢查器件及檢查裝置接觸而將被檢查器件與檢查裝置電性連接之連接器。連接器將檢查裝置之電氣信號傳輸至被檢查器件,將被檢查器件之電氣信號傳輸至檢查裝置。作為此種連接器,導電性橡膠片(conductive rubber sheet)於本領域中廣為人知。In order to perform electrical inspection on the inspected device, a connector that contacts the inspected device and the inspection device to electrically connect the inspected device and the inspection device is used in the art. The connector transmits the electrical signal of the inspection device to the inspected device, and transmits the electrical signal of the inspected device to the inspection device. As such a connector, a conductive rubber sheet is widely known in the art.

導電性橡膠片可根據施加至被檢查器件之外力而彈性變形。導電性橡膠片具有將被檢查器件與檢查裝置電性連接且傳輸電氣信號之複數個導電部、及使導電部隔開及絕緣之絕緣部。絕緣部可包含硬化之聚矽氧橡膠。The conductive rubber sheet can be elastically deformed according to an external force applied to the device to be inspected. The conductive rubber sheet has a plurality of conductive parts that electrically connect the inspected device and the inspection device and transmit electrical signals, and an insulating part that separates and insulates the conductive parts. The insulating part may include hardened silicone rubber.

為了對被檢查器件進行可靠性較高之檢查,需屏蔽會施加至導電部之電磁波。作為一例,韓國公開專利公報第10-2010-0020793號提出於絕緣部埋設包含如不鏽鋼之金屬材料之接地板。In order to perform high-reliability inspection on the inspected device, it is necessary to shield the electromagnetic waves that will be applied to the conductive part. As an example, Korean Laid-open Patent Publication No. 10-2010-0020793 proposes to bury a ground plate containing a metal material such as stainless steel in the insulating part.

[發明所欲解決之問題][The problem to be solved by the invention]

上述文獻需要將金屬材料之接地板埋設於絕緣部之製程、及對接地板進行接地處理之製程,因此使連接器之製造製程數及製造費用上升。為了使被檢查器件與連接器間之穩定接觸,需將連接器之彈性保持為特定水準以上,但埋設於絕緣部之接地板使連接器之彈性明顯地下降。The above-mentioned documents require the process of embedding the ground plate of metal material in the insulating part and the process of grounding the ground plate, which increases the number of manufacturing processes and the manufacturing cost of the connector. In order to make a stable contact between the inspected device and the connector, the elasticity of the connector must be maintained above a certain level, but the grounding plate embedded in the insulating part significantly reduces the elasticity of the connector.

隨著導電部間之間距微細化,導電部間發生串擾(crosstalk)之可能性及電磁波對導電部之影響增大。因此,於如導電性橡膠片之連接器中,需要以高水準具備針對導電部之電磁波屏蔽構造。特別是,此種電磁波屏蔽構造重要的是不降低連接器之彈性,並且以低費用及簡單之構造具備於連接器內。然而,先前技術之連接器之電磁波屏蔽構造不僅增加連接器之製造製程數,而且使連接器之彈性劣化。As the distance between the conductive parts becomes finer, the possibility of crosstalk between the conductive parts and the influence of electromagnetic waves on the conductive parts increase. Therefore, in a connector such as a conductive rubber sheet, it is necessary to provide a high-level electromagnetic shielding structure for the conductive part. In particular, it is important that such an electromagnetic wave shielding structure does not reduce the flexibility of the connector, and is provided in the connector with a low cost and a simple structure. However, the electromagnetic wave shielding structure of the connector of the prior art not only increases the number of manufacturing processes of the connector, but also deteriorates the elasticity of the connector.

本發明之一實施例提供一種將兩個電子器件電性連接且具有電磁波屏蔽構造之連接器。本發明之一實施例提供一種將兩個電子器件電性連接且具有同時成形之導電部支持構造與電磁波屏蔽構造之連接器。 [解決問題之技術手段]An embodiment of the present invention provides a connector that electrically connects two electronic devices and has an electromagnetic wave shielding structure. An embodiment of the present invention provides a connector that electrically connects two electronic devices and has a conductive part supporting structure and an electromagnetic wave shielding structure that are simultaneously formed. [Technical means to solve the problem]

本發明之實施例係關於一種位於兩個電子器件之間而將兩個電子器件電性連接之連接器。一實施例之連接器包含複數個彈性導電部、及彈性絕緣部。複數個彈性導電部可沿上下方向導電。彈性絕緣部使複數個彈性導電部沿水平方向隔開及絕緣。彈性絕緣部包含複數個電磁波屏蔽部。複數個電磁波屏蔽部包含沿上下方向分佈及排列且具有磁性之多個奈米碳管。The embodiment of the present invention relates to a connector that is located between two electronic devices and electrically connects the two electronic devices. The connector of an embodiment includes a plurality of elastic conductive parts and elastic insulating parts. The plurality of elastic conductive parts can conduct electricity in the up-down direction. The elastic insulating part separates and insulates the plurality of elastic conductive parts in the horizontal direction. The elastic insulating part includes a plurality of electromagnetic wave shielding parts. The plurality of electromagnetic wave shielding parts includes a plurality of carbon nanotubes which are distributed and arranged in the vertical direction and have magnetism.

於一實施例中,彈性絕緣部包含複數個第1間隔部,其等分別包圍複數個彈性導電部,沿上下方向延伸,使複數個彈性導電部與複數個電磁波屏蔽部沿水平方向隔開。In one embodiment, the elastic insulating portion includes a plurality of first spacers, which respectively surround the plurality of elastic conductive portions and extend in the vertical direction, so that the plurality of elastic conductive portions and the plurality of electromagnetic wave shielding portions are separated in the horizontal direction.

於一實施例中,複數個電磁波屏蔽部呈沿上下方向延伸之圓筒形狀,複數個第1間隔部分別位於複數個電磁波屏蔽部之各者之內側。In one embodiment, the plurality of electromagnetic wave shielding parts have a cylindrical shape extending in the vertical direction, and the plurality of first spacer parts are respectively located inside each of the plurality of electromagnetic wave shielding parts.

於一實施例中,彈性絕緣部包含配置於各電磁波屏蔽部之上端或下端之第2間隔部。In one embodiment, the elastic insulating part includes a second spacer disposed at the upper end or the lower end of each electromagnetic wave shielding part.

於一實施例中,連接器包含絕緣構件。絕緣構件包含與複數個彈性導電部對應之貫通孔,且附著於彈性絕緣部。In one embodiment, the connector includes an insulating member. The insulating member includes through holes corresponding to a plurality of elastic conductive parts, and is attached to the elastic insulating part.

於一實施例中,多個奈米碳管分別包含多個磁性粒子。多個奈米碳管藉由多個磁性粒子於磁場內排列之力而沿上下方向分佈並排列。In one embodiment, each of the plurality of carbon nanotubes includes a plurality of magnetic particles. A plurality of carbon nanotubes are distributed and arranged in the vertical direction by the force of a plurality of magnetic particles arranged in a magnetic field.

於一實施例中,多個磁性粒子位於多個奈米碳管之各者之內部。In one embodiment, a plurality of magnetic particles are located inside each of the plurality of carbon nanotubes.

於一實施例中,多個磁性粒子於多個奈米碳管之各者之外側化學鍵結於碳原子。In one embodiment, a plurality of magnetic particles are chemically bonded to carbon atoms outside each of the plurality of carbon nanotubes.

於一實施例中,多個奈米碳管分別具有多個六角孔,多個六角孔中之一部分六角孔分別具有多個磁性粒子中之一者。In an embodiment, each of the plurality of carbon nanotubes has a plurality of hexagonal holes, and a part of the hexagonal holes of the plurality of hexagonal holes respectively has one of the plurality of magnetic particles.

於一實施例中,多個磁性粒子可包含鎳、鈷、鉻、鐵、鐵碳化物、鐵氧化物、鉻氧化物、鎳氧化物、鎳鈷氧化物、鈷鐵及單分子磁鐵物質中之任一者。In one embodiment, the plurality of magnetic particles may include nickel, cobalt, chromium, iron, iron carbide, iron oxide, chromium oxide, nickel oxide, nickel cobalt oxide, cobalt iron, and monomolecular magnet materials. Either.

於一實施例中,兩個電子器件中之一者為檢查裝置,兩個電子器件中之另一者為由檢查裝置檢查之被檢查器件。In one embodiment, one of the two electronic devices is the inspection device, and the other of the two electronic devices is the inspected device inspected by the inspection device.

於一實施例中,彈性絕緣部與複數個電磁波屏蔽部一併由包含分別包含多個磁性粒子之多個奈米碳管、及分散有多個奈米碳管之第1液態聚矽氧橡膠材料之第1液態成形材料形成。複數個電磁波屏蔽部藉由如下方式形成:沿上下方向對第1液態成形材料施加磁場,多個奈米碳管藉由磁性粒子於磁場內排列之力而沿上下方向分佈及排列。複數個彈性導電部藉由如下方式形成:沿上下方向對包含多個導電性金屬粒子及分散有多個導電性金屬粒子之第2液態聚矽氧橡膠材料之第2液態成形材料施加磁場,多個導電性金屬粒子以可沿上下方向導電之方式接觸。In one embodiment, the elastic insulating portion and the plurality of electromagnetic wave shielding portions are composed of a plurality of carbon nanotubes each containing a plurality of magnetic particles, and a first liquid polysilicone rubber in which a plurality of carbon nanotubes are dispersed. The first liquid molding material of the material is formed. A plurality of electromagnetic wave shielding parts are formed by applying a magnetic field to the first liquid forming material in the vertical direction, and a plurality of carbon nanotubes are distributed and arranged in the vertical direction by the force of the magnetic particles arranged in the magnetic field. The plurality of elastic conductive parts are formed by applying a magnetic field to a second liquid molding material including a plurality of conductive metal particles and a second liquid silicone rubber material dispersed with a plurality of conductive metal particles in the vertical direction. The conductive metal particles are in contact with each other in a manner that can conduct electricity in the vertical direction.

於一實施例中,藉由沿上下方向對向地配置之各對環狀磁鐵部而沿上下方向對第1液態成形材料施加磁場,藉此複數個電磁波屏蔽部可分別形成為圓筒形狀。 [發明之效果]In one embodiment, by applying a magnetic field to the first liquid molding material in the vertical direction by the pairs of ring-shaped magnet portions arranged oppositely in the vertical direction, the plurality of electromagnetic wave shielding portions can be formed into cylindrical shapes, respectively. [Effects of Invention]

本發明之一實施例之連接器具備包含電磁波屏蔽部之彈性絕緣部。可於成形彈性絕緣部時形成電磁波屏蔽部,因此一實施例之連接器可無另外的製造製程而以簡單之構造形成電磁波屏蔽構造。根據一實施例,包含於彈性絕緣部之電磁波屏蔽部包含多個奈米碳管,因此不降低彈性絕緣部之彈性。根據一實施例,彈性絕緣部之電磁波屏蔽部包含沿上下方向分佈及排列且具有磁性之多個奈米碳管。藉由此種構造之電磁波屏蔽部,一實施例之連接器可具有提高之電磁波屏蔽效果及提高之防串擾效果。根據一實施例,具有磁性之奈米碳管分別包含多個磁性粒子,具有磁性粒子之奈米碳管具有優於純奈米碳管之電磁波屏蔽效果。又,具有磁性粒子之奈米碳管可利用沿上下方向施加之磁場於連接器內配置於所期望之區域。又,可藉由調整施加磁場之磁鐵之尺寸而變更電磁波屏蔽部之尺寸來將電磁波屏蔽性變更成各種水準。A connector according to an embodiment of the present invention includes an elastic insulating portion including an electromagnetic wave shielding portion. The electromagnetic wave shielding part can be formed when the elastic insulating part is formed. Therefore, the connector of an embodiment can form an electromagnetic wave shielding structure with a simple structure without additional manufacturing process. According to an embodiment, the electromagnetic wave shielding part included in the elastic insulating part includes a plurality of carbon nanotubes, so the elasticity of the elastic insulating part is not reduced. According to an embodiment, the electromagnetic wave shielding portion of the elastic insulating portion includes a plurality of carbon nanotubes that are distributed and arranged in the vertical direction and have magnetism. With the electromagnetic wave shielding part of this structure, the connector of one embodiment can have an improved electromagnetic wave shielding effect and an improved crosstalk prevention effect. According to one embodiment, the carbon nanotubes with magnetism each include a plurality of magnetic particles, and the carbon nanotubes with magnetic particles have an electromagnetic wave shielding effect superior to that of pure carbon nanotubes. In addition, carbon nanotubes with magnetic particles can be arranged in a desired area in the connector using a magnetic field applied in the vertical direction. In addition, the electromagnetic wave shielding performance can be changed to various levels by adjusting the size of the magnet that applies the magnetic field and changing the size of the electromagnetic wave shielding portion.

本發明之實施例係以說明本發明之技術思想為目的而例示。本發明之權利範圍並不限定於以下提出之實施例或該等實施例之具體說明。The embodiments of the present invention are exemplified for the purpose of explaining the technical idea of the present invention. The scope of rights of the present invention is not limited to the following embodiments or specific descriptions of these embodiments.

只要無其他定義,則本發明中使用之所有技術用語及科學用語具有於本發明所屬之技術領域內具有常識者通常理解之含義。本發明中使用之所有用語係以更明確地說明本發明為目的而選擇者,並非係為了限制本發明之權利範圍而選擇者。As long as there are no other definitions, all technical and scientific terms used in the present invention have the meanings commonly understood by those with common sense in the technical field to which the present invention belongs. All terms used in the present invention are selected for the purpose of more clearly describing the present invention, and not for the purpose of limiting the scope of rights of the present invention.

本發明中使用之如“包含”、“具備”、“具有”等之表達係只要未於包含相應之表達的語句或句子中提及其他含義,則應理解為具有包含其他實施例之可能性之開放型用語(open-ended terms)。The expression system used in the present invention such as "include", "have", "have", etc., as long as other meanings are not mentioned in the sentence or sentence containing the corresponding expression, it should be understood as having the possibility of including other embodiments The open-ended terms (open-ended terms).

只要未提及其他含義,則本發明中所記述之單數型表達可包含複數型含義,此種情形亦相同地適用於發明申請專利範圍中所記載之單數型表達。As long as no other meaning is mentioned, the singular expression described in the present invention may include the plural meaning, and this situation is equally applicable to the singular expression described in the scope of the invention application.

本發明中使用之“第1”、“第2”等表達用於相互區分複數個構成要素,並非限定相應構成要素之順序或重要度。The expressions such as "first" and "second" used in the present invention are used to distinguish plural constituent elements from each other, and do not limit the order or importance of corresponding constituent elements.

於本發明中,在提及某個構成要素“連接”或“結合”於另一構成要素之情形時,應理解為上述某個構成要素可直接連接或結合於上述另一構成要素,或者能夠以其他新的構成要素為媒介連接或結合。In the present invention, when a certain component is referred to as being “connected” or “coupled” to another component, it should be understood that a certain component can be directly connected or combined with another component, or can be Use other new components as a medium to connect or combine.

本發明中使用之“上方”之方向指示語係基於連接器相對於檢查裝置定位之方向,“下方”之方向指示語係指上方之相反方向。本發明中使用之“上下方向”之方向指示語包含上方方向與下方方向,但應理解為並不指上方方向與下方方向中之特定之一個方向。The direction indicator of "above" used in the present invention is based on the direction in which the connector is positioned relative to the inspection device, and the direction indicator of "below" refers to the opposite direction of the upper. The direction indicator of "up and down direction" used in the present invention includes an upper direction and a lower direction, but it should be understood as not referring to a specific one of the upper direction and the lower direction.

參照隨附圖式所示之例對實施例進行說明。於隨附圖式中,對相同或對應之構成要素賦予相同之參照符號。又,於以下之實施例之說明中,可省略重複記述相同或對應之構成要素之內容。然而,即便省略有關構成要素之記述,亦不意味著此種構成要素不包含於某個實施例。The embodiments will be described with reference to the embodiments shown in the accompanying drawings. In the accompanying drawings, the same or corresponding components are given the same reference signs. In addition, in the description of the following embodiments, repetitive description of the same or corresponding constituent elements may be omitted. However, even if the description of the constituent elements is omitted, it does not mean that such constituent elements are not included in a certain embodiment.

以下說明之實施例與隨附圖式所示之例係關於一種位於兩個電子器件之間而將該等兩個電子器件電性連接之連接器。於實施例之連接器之應用例中,上述兩個電子器件中之一者可為檢查裝置,上述兩個電子器件中之另一者可為由檢查裝置檢查之被檢查器件,但連接器之應用例並不限定於此。實施例之連接器可用於藉由與需進行電性連接之任意兩個電子器件接觸而執行電性連接。於實施例之連接器應用於檢查裝置與被檢查器件之情形時,實施例之連接器可用於在對被檢查器件進行電性檢查時將檢查裝置與被檢查器件電性連接。作為一例,實施例之連接器可用於在半導體器件之製造製程中之後續製程中對被檢查器件進行最終之電性檢查。然而,應用實施例之連接器之檢查之例並不限定於上述檢查。The embodiments described below and the examples shown in the accompanying drawings relate to a connector that is located between two electronic devices and electrically connects the two electronic devices. In the application example of the connector of the embodiment, one of the above-mentioned two electronic devices may be the inspection device, and the other of the above-mentioned two electronic devices may be the inspected device inspected by the inspection device, but the connector is The application example is not limited to this. The connector of the embodiment can be used to perform electrical connection by contacting any two electronic devices that need to be electrically connected. When the connector of the embodiment is applied to the inspection device and the inspected device, the connector of the embodiment can be used to electrically connect the inspection device and the inspected device when the inspected device is electrically inspected. As an example, the connector of the embodiment can be used for the final electrical inspection of the inspected device in the subsequent process of the semiconductor device manufacturing process. However, the inspection example of the connector of the application embodiment is not limited to the above-mentioned inspection.

圖1係表示應用一實施例之連接器之例。為了對實施例進行說明,圖1表示連接器、配置連接器之電子器件、與連接器接觸之電子器件之例示性形狀。Fig. 1 shows an example of a connector to which an embodiment is applied. To illustrate the embodiment, FIG. 1 shows an exemplary shape of a connector, an electronic device configuring the connector, and an electronic device contacting the connector.

參照圖1,一實施例之連接器100配置於兩個電子器件之間而藉由接觸執行兩個電子器件間之電性連接。於圖1所示之例中,兩個電子器件中之一者可為檢查裝置10,另一者可為由檢查裝置10檢查之被檢查器件20。於對被檢查器件20進行電性檢查時,連接器100分別與檢查裝置10及被檢查器件20接觸而將檢查裝置10與被檢查器件20彼此電性連接。1, a connector 100 of an embodiment is disposed between two electronic devices to perform electrical connection between the two electronic devices by contact. In the example shown in FIG. 1, one of the two electronic devices may be the inspection device 10, and the other may be the inspected device 20 inspected by the inspection device 10. When performing an electrical inspection on the inspected device 20, the connector 100 contacts the inspection device 10 and the inspected device 20 respectively to electrically connect the inspection device 10 and the inspected device 20 to each other.

作為一例,連接器100可作為薄片(sheet)形狀之構造物結合至測試插座30。測試插座30可具有保持並支持連接器100之框架31,可藉由框架31而可去除地附著於插座外殼40。插座外殼40能夠可去除地安裝於檢查裝置10。插座外殼40於其內部收容藉由搬運裝置搬運至檢查裝置10之被檢查器件20而使被檢查器件20位於檢查裝置10。As an example, the connector 100 can be combined to the test socket 30 as a sheet-shaped structure. The test socket 30 can have a frame 31 for holding and supporting the connector 100, and can be removably attached to the socket housing 40 by the frame 31. The socket housing 40 can be removably attached to the inspection device 10. The socket housing 40 accommodates therein the device to be inspected 20 that is transported to the inspection device 10 by the conveying device, so that the device to be inspected 20 is located in the inspection device 10.

被檢查器件20可為半導體封裝體,但並不限定於此。半導體封裝體係使用樹脂材料將半導體IC(Integrated Circuit,積體電路)晶片、多個引線框架(lead frame)及多個端子封裝成六面體形態之半導體器件。上述半導體IC晶片可為記憶體IC晶片或非記憶體IC晶片。作為上述端子,可使用接腳或焊球(solder ball)。圖1所示之被檢查器件20於其下側具有半球形之多個端子21。The inspected device 20 may be a semiconductor package, but it is not limited to this. The semiconductor packaging system uses resin materials to encapsulate semiconductor IC (Integrated Circuit) chips, multiple lead frames, and multiple terminals into a hexahedral semiconductor device. The aforementioned semiconductor IC chip may be a memory IC chip or a non-memory IC chip. As the above-mentioned terminal, pins or solder balls can be used. The device to be inspected 20 shown in FIG. 1 has a plurality of hemispherical terminals 21 on its lower side.

檢查裝置10可對被檢查器件20之電特性、功能特性、動作速度等進行檢查。檢查裝置10可於執行檢查之板內具有可輸出電氣測試信號且可接收響應信號之多個端子11。連接器100能夠以藉由測試插座30及插座外殼40而與檢查裝置10之端子11接觸之方式配置。被檢查器件20之端子21藉由連接器100與對應之檢查裝置10之端子11電性連接。即,連接器100沿上下方向VD將被檢查器件之端子21與對應於其之檢查裝置之端子11電性連接,藉此藉由檢查裝置10執行被檢查器件20之檢查。The inspection device 10 can inspect the electrical characteristics, functional characteristics, and operating speed of the inspected device 20. The inspection device 10 may have a plurality of terminals 11 capable of outputting electrical test signals and receiving response signals in the board for performing inspection. The connector 100 can be arranged in such a way that it is in contact with the terminal 11 of the inspection device 10 through the test socket 30 and the socket housing 40. The terminal 21 of the inspected device 20 is electrically connected to the corresponding terminal 11 of the inspection device 10 through the connector 100. That is, the connector 100 electrically connects the terminal 21 of the inspected device and the terminal 11 of the inspection device corresponding to the terminal 21 of the inspected device along the vertical direction VD, thereby performing the inspection of the inspected device 20 by the inspection device 10.

連接器100之大部分可包含彈性高分子物質,連接器100可沿上下方向VD與水平方向HD具有彈性。若外力朝上下方向VD中之下方施加至連接器100,則連接器100可向下方方向與水平方向HD彈性變形。上述外力可藉由推動器裝置向檢查裝置10側按壓被檢查器件20而產生。藉由此種外力,被檢查器件之端子21與連接器100可沿上下方向VD接觸,連接器100與檢查裝置之端子11可沿上下方向VD接觸。若去除上述外力,則連接器100可恢復至其原先之形狀。Most of the connector 100 can contain elastic polymer materials, and the connector 100 can be elastic in the vertical direction VD and the horizontal direction HD. If an external force is applied to the connector 100 downward in the vertical direction VD, the connector 100 can be elastically deformed in the downward direction and the horizontal direction HD. The above-mentioned external force can be generated by the pusher device pressing the inspected device 20 toward the inspection device 10 side. With this external force, the terminal 21 of the inspected device and the connector 100 can be in contact in the vertical direction VD, and the connector 100 and the terminal 11 of the inspection device can be in contact in the vertical direction VD. If the above-mentioned external force is removed, the connector 100 can be restored to its original shape.

參照圖1,連接器100包含複數個彈性導電部110、及彈性絕緣部120。複數個彈性導電部110以沿上下方向VD定位且可沿上下方向VD導電之方式構成。彈性絕緣部120使複數個彈性導電部110於水平方向HD上隔開,且使複數個彈性導電部110彼此絕緣。1, the connector 100 includes a plurality of elastic conductive parts 110 and elastic insulating parts 120. The plurality of elastic conductive parts 110 are positioned in the vertical direction VD and are configured to be conductive in the vertical direction VD. The elastic insulating portion 120 separates the plurality of elastic conductive portions 110 in the horizontal direction HD, and insulates the plurality of elastic conductive portions 110 from each other.

彈性導電部110於其上端與被檢查器件之端子21接觸,於其下端與檢查裝置之端子11接觸。藉此,於與一個彈性導電部110對應之端子11與端子21之間以彈性導電部110為媒介而形成上下方向之導電路徑。因此,檢查裝置之測試信號可自端子11藉由彈性導電部110傳輸至被檢查器件20之端子21,被檢查器件20之響應信號可自端子21藉由彈性導電部110傳輸至檢查裝置10之端子11。彈性導電部110之上端與下端可與彈性絕緣部120之上表面及下表面形成同一平面或較其略微突出。The elastic conductive portion 110 is in contact with the terminal 21 of the inspected device at its upper end, and is in contact with the terminal 11 of the inspection device at its lower end. Thereby, a conductive path in the vertical direction is formed between the terminal 11 and the terminal 21 corresponding to one elastic conductive portion 110 with the elastic conductive portion 110 as a medium. Therefore, the test signal of the inspection device can be transmitted from the terminal 11 through the elastic conductive portion 110 to the terminal 21 of the inspected device 20, and the response signal of the inspected device 20 can be transmitted from the terminal 21 via the elastic conductive portion 110 to the inspection device 10 Terminal 11. The upper and lower ends of the elastic conductive portion 110 may form the same plane as the upper surface and the lower surface of the elastic insulating portion 120 or slightly protrude from it.

彈性導電部110之平面排列可根據被檢查器件20之端子21之平面排列而實現各種排列。例如,彈性導電部110可於四邊形彈性絕緣部120內排列成一個矩陣形態或一對矩陣形態。或者,彈性導電部110可沿四邊形彈性絕緣部120之各邊排列成複數行。The planar arrangement of the elastic conductive portion 110 can realize various arrangements according to the planar arrangement of the terminals 21 of the inspected device 20. For example, the elastic conductive parts 110 may be arranged in a matrix form or a pair of matrix forms in the quadrangular elastic insulating part 120. Alternatively, the elastic conductive parts 110 may be arranged in a plurality of rows along each side of the quadrangular elastic insulating part 120.

於實施例之連接器中,彈性絕緣部120於其內具備複數個電磁波屏蔽部121,複數個電磁波屏蔽部121配置於複數個彈性導電部110之間且沿上下方向VD延伸。即,彈性絕緣部120包含複數個電磁波屏蔽部121而使複數個彈性導電部110於水平方向HD上隔開及絕緣。複數個電磁波屏蔽部121包含具有磁性之屏蔽物質,因此屏蔽來自各彈性導電部110之電磁波,防止相鄰之彈性導電部110間之串擾(crosstalk)。In the connector of the embodiment, the elastic insulating portion 120 includes a plurality of electromagnetic wave shielding portions 121 therein, and the plurality of electromagnetic wave shielding portions 121 are arranged between the plurality of elastic conductive portions 110 and extend in the vertical direction VD. That is, the elastic insulating portion 120 includes a plurality of electromagnetic wave shielding portions 121 to isolate and insulate the plurality of elastic conductive portions 110 in the horizontal direction HD. The plurality of electromagnetic wave shielding parts 121 includes a magnetic shielding material, so that electromagnetic waves from each elastic conductive part 110 are shielded to prevent crosstalk between adjacent elastic conductive parts 110.

為了對連接器之實施例進行說明,參照圖2至圖19。圖2至圖19係概略性地表示連接器之形狀、彈性導電部之形狀、構成彈性導電部之要素之形狀、彈性絕緣部之形狀、構成電磁波屏蔽部之要素之形狀,該等僅係為了理解實施例而選擇之例。In order to describe the embodiment of the connector, refer to FIG. 2 to FIG. 19. Figures 2 to 19 schematically show the shape of the connector, the shape of the elastic conductive part, the shape of the element constituting the elastic conductive part, the shape of the elastic insulating part, and the shape of the element constituting the electromagnetic wave shielding part. These are only for An example selected for understanding the embodiment.

圖2係表示一實施例之連接器之一部分之俯視圖,圖3係概略性地表示一實施例之連接器之一部分之剖視圖。參照圖2及圖3,一實施例之連接器100包含上述彈性導電部110與上述彈性絕緣部120。FIG. 2 is a plan view showing a part of the connector of an embodiment, and FIG. 3 is a cross-sectional view schematically showing a part of the connector of an embodiment. 2 and 3, the connector 100 of an embodiment includes the elastic conductive portion 110 and the elastic insulating portion 120.

各彈性導電部110於檢查裝置與被檢查器件之間作為導電部發揮功能而執行上下方向VD之信號傳輸。彈性導電部110可呈沿上下方向VD延伸之圓柱形狀。於此種圓柱形狀中,中間之直徑可小於上端及下端之直徑。Each elastic conductive portion 110 functions as a conductive portion between the inspection device and the device to be inspected, and performs signal transmission in the vertical direction VD. The elastic conductive portion 110 may have a cylindrical shape extending in the vertical direction VD. In this cylindrical shape, the diameter in the middle can be smaller than the diameters of the upper and lower ends.

各彈性導電部110包含以可沿上下方向VD導電之方式接觸之多個導電性金屬粒子111。以可沿上下方向導電之方式接觸之導電性金屬粒子111於彈性導電部110內形成執行上下方向VD之信號傳輸之導電路徑。導電性金屬粒子111之間可由形成彈性絕緣部120之彈性高分子材料填充。又,各彈性導電部110具有保持沿上下方向VD接觸之導電性金屬粒子111之粒子保持部112。粒子保持部112可包含構成彈性絕緣部120之彈性高分子材料,可將導電性金屬粒子111保持為彈性導電部110之形狀。因此,彈性導電部110沿上下方向VD與水平方向HD1、HD2具有彈性。於藉由被檢查器件之端子向上下方向VD之下方按壓彈性導電部110時,彈性導電部110可沿水平方向HD1、HD2略微膨脹,彈性絕緣部120可容許彈性導電部110之此種膨脹。Each elastic conductive portion 110 includes a plurality of conductive metal particles 111 that can be contacted in a manner of conducting electricity in the vertical direction VD. The conductive metal particles 111 that can be electrically conductive in the up-down direction form a conductive path in the elastic conductive portion 110 for signal transmission in the up-down direction VD. The conductive metal particles 111 can be filled with the elastic polymer material forming the elastic insulating portion 120. In addition, each elastic conductive portion 110 has a particle holding portion 112 that holds conductive metal particles 111 in contact in the vertical direction VD. The particle holding part 112 may include an elastic polymer material constituting the elastic insulating part 120 and may hold the conductive metal particles 111 in the shape of the elastic conductive part 110. Therefore, the elastic conductive portion 110 has elasticity in the vertical direction VD and the horizontal directions HD1 and HD2. When the elastic conductive portion 110 is pressed downward in the vertical direction VD by the terminal of the inspected device, the elastic conductive portion 110 can slightly expand in the horizontal directions HD1 and HD2, and the elastic insulating portion 120 can allow such expansion of the elastic conductive portion 110.

可利用高傳導性金屬被覆核心粒子之表面而構成導電性金屬粒子111。核心粒子可包含鐵、鎳、鈷等金屬材料,或者包含具有彈性之樹脂材料。作為被覆於核心粒子之表面之高傳導性金屬,可使用金、銀、銠、鉑、鉻等。The conductive metal particles 111 can be formed by coating the surface of the core particles with a highly conductive metal. The core particles may include metallic materials such as iron, nickel, and cobalt, or may include elastic resin materials. As the highly conductive metal covering the surface of the core particle, gold, silver, rhodium, platinum, chromium, etc. can be used.

彈性絕緣部120可形成連接器100之四邊形之彈性區域。複數個彈性導電部110藉由彈性絕緣部120而沿水平方向HD1、HD2按照等間隔或不等間隔彼此隔開並絕緣。彈性絕緣部120作為一個彈性體而形成,複數個彈性導電部110於彈性絕緣部120之厚度方向(上下方向VD)上插入於彈性絕緣部120。彈性絕緣部120包含彈性高分子材料,沿上下方向VD與水平方向HD具有彈性。彈性絕緣部120不僅使彈性導電部110保持為其形狀,而且沿上下方向保持彈性導電部110。The elastic insulating portion 120 can form a quadrangular elastic area of the connector 100. The plurality of elastic conductive parts 110 are separated and insulated from each other at equal or unequal intervals along the horizontal directions HD1 and HD2 by the elastic insulating part 120. The elastic insulating part 120 is formed as an elastic body, and a plurality of elastic conductive parts 110 are inserted into the elastic insulating part 120 in the thickness direction of the elastic insulating part 120 (vertical direction VD). The elastic insulating portion 120 includes an elastic polymer material and has elasticity in the vertical direction VD and the horizontal direction HD. The elastic insulating portion 120 not only maintains the elastic conductive portion 110 in its shape, but also maintains the elastic conductive portion 110 in the up and down direction.

彈性絕緣部120可包含硬化之聚矽氧橡膠材料。例如,可藉由將液態之聚矽氧橡膠注入至用以成形連接器100之成形模具內並硬化而形成彈性絕緣部120。作為用以成形彈性絕緣部120之液態之聚矽氧橡膠材料,可使用加成型液態聚矽氧橡膠、縮合型液態聚矽氧橡膠、包含乙烯基或羥基之液態聚矽氧橡膠等。作為具體例,上述液態聚矽氧橡膠材料可包含二甲基聚矽氧生橡膠、甲基乙烯基聚矽氧生橡膠、甲基苯基乙烯基聚矽氧生橡膠等。The elastic insulating portion 120 may include a hardened silicone rubber material. For example, the elastic insulating portion 120 can be formed by injecting liquid silicone rubber into a forming mold for forming the connector 100 and hardening. As the liquid silicone rubber material for forming the elastic insulating portion 120, addition-molding liquid silicone rubber, condensation type liquid silicone rubber, liquid silicone rubber containing vinyl or hydroxyl groups, etc. can be used. As a specific example, the above-mentioned liquid silicone rubber material may include dimethyl silicone rubber, methyl vinyl silicone rubber, methyl phenyl vinyl silicone rubber, and the like.

彈性絕緣部120包含複數個電磁波屏蔽部121,因此屏蔽來自彈性導電部110之電磁波,防止彈性導電部110間之串擾。複數個電磁波屏蔽部121至少沿水平方向HD1、HD2與各彈性導電部110隔開。The elastic insulating portion 120 includes a plurality of electromagnetic wave shielding portions 121, so that electromagnetic waves from the elastic conductive portion 110 are shielded, and crosstalk between the elastic conductive portions 110 is prevented. The plurality of electromagnetic wave shielding portions 121 are spaced apart from each elastic conductive portion 110 at least in the horizontal directions HD1 and HD2.

於一實施例中,彈性絕緣部120具備分別包圍複數個彈性導電部110之複數個第1間隔部124。第1間隔部124呈大致圓筒形狀,可沿上下方向VD於彈性絕緣部120之上端與下端之間延伸。彈性導電部110位於第1間隔部124內。於彈性絕緣部120內,電磁波屏蔽部121位於一個第1間隔部124之外側。第1間隔部124使彈性導電部110與電磁波屏蔽部121於水平方向HD1、HD2上隔開而使彈性導電部110與電磁波屏蔽部121隔離。第1間隔部124包含與構成彈性絕緣部120之上述彈性高分子材料相同之材料。In one embodiment, the elastic insulating portion 120 includes a plurality of first spacer portions 124 surrounding the plurality of elastic conductive portions 110 respectively. The first spacer 124 has a substantially cylindrical shape and can extend between the upper end and the lower end of the elastic insulating portion 120 in the vertical direction VD. The elastic conductive portion 110 is located in the first spacer portion 124. In the elastic insulating portion 120, the electromagnetic wave shielding portion 121 is located on the outer side of one first spacer portion 124. The first spacing portion 124 separates the elastic conductive portion 110 and the electromagnetic wave shielding portion 121 in the horizontal directions HD1 and HD2 and separates the elastic conductive portion 110 from the electromagnetic wave shielding portion 121. The first spacer 124 includes the same material as the aforementioned elastic polymer material constituting the elastic insulating portion 120.

於一實施例中,電磁波屏蔽部121包含沿上下方向VD分佈及排列且具有磁性之多個奈米碳管122。電磁波屏蔽部121因具有磁性之奈米碳管122而實現屏蔽電磁波之功能。作為一例,扶手椅型奈米碳管、單壁奈米碳管或多壁奈米碳管可用作構成電磁波屏蔽部121之奈米碳管。又,根據一實施例,由在無外部磁場之狀態下磁化之鐵磁性物質形成之磁性粒子包含於純奈米碳管,藉此奈米碳管122具有磁性。即,奈米碳管122包含發揮磁性之多個磁性粒子。In one embodiment, the electromagnetic wave shielding portion 121 includes a plurality of carbon nanotubes 122 distributed and arranged along the vertical direction VD and having magnetism. The electromagnetic wave shielding part 121 realizes the function of shielding electromagnetic waves due to the magnetic carbon nanotube 122. As an example, armchair-type carbon nanotubes, single-wall carbon nanotubes, or multi-wall carbon nanotubes can be used as the carbon nanotubes constituting the electromagnetic wave shield 121. Furthermore, according to one embodiment, magnetic particles formed from ferromagnetic materials magnetized in the absence of an external magnetic field are contained in pure carbon nanotubes, whereby carbon nanotubes 122 have magnetism. That is, the carbon nanotube 122 includes a plurality of magnetic particles that exert magnetism.

如圖2所示,包含多個奈米碳管122之電磁波屏蔽部121可於彈性絕緣部120內沿水平方向HD1、HD2以不等間隔隨機地配置。電磁波屏蔽部121可具有不同之形狀與尺寸。圖2所示之電磁波屏蔽部121之平面配置為例示。電磁波屏蔽部121較圖2所示之排列更稠密地配置於複數個第1間隔部124之各者之外側,因此可幾乎無縫隙地彼此相鄰。As shown in FIG. 2, the electromagnetic wave shielding portion 121 including a plurality of carbon nanotubes 122 can be randomly arranged in the elastic insulating portion 120 along the horizontal directions HD1 and HD2 at unequal intervals. The electromagnetic wave shielding portion 121 can have different shapes and sizes. The planar configuration of the electromagnetic wave shield 121 shown in FIG. 2 is an example. The electromagnetic wave shielding portion 121 is more densely arranged on the outer side of each of the plurality of first spacer portions 124 than the arrangement shown in FIG. 2, and therefore can be adjacent to each other almost seamlessly.

多個奈米碳管122藉由構成彈性絕緣部120之彈性高分子材料保持為電磁波屏蔽部121之形狀。因此,電磁波屏蔽部121可包含多個奈米碳管122與上述彈性高分子材料。如圖3所示,於電磁波屏蔽部121內,多個奈米碳管122沿上下方向VD均勻地分佈及排列。又,於沿上下方向VD均勻地分佈及排列之奈米碳管122中,相鄰之至少兩個奈米碳管122可於上下方向VD、水平方向HD或上下方向與水平方向之間之傾斜方向上彼此接觸。此處,奈米碳管沿上下方向均勻地分佈及排列之情形可包括:屬於一個電磁波屏蔽部之奈米碳管122沿上下方向VD、相對於上下方向VD略微傾斜之方向或與上下方向VD正交之方向分佈並排列。The plurality of carbon nanotubes 122 are held in the shape of the electromagnetic wave shielding portion 121 by the elastic polymer material constituting the elastic insulating portion 120. Therefore, the electromagnetic wave shielding portion 121 may include a plurality of carbon nanotubes 122 and the above-mentioned elastic polymer material. As shown in FIG. 3, in the electromagnetic wave shield 121, a plurality of carbon nanotubes 122 are uniformly distributed and arranged along the vertical direction VD. In addition, in the carbon nanotubes 122 uniformly distributed and arranged along the vertical direction VD, at least two adjacent carbon nanotubes 122 can be inclined in the vertical direction VD, the horizontal direction HD, or the vertical direction and the horizontal direction. Contact each other in the direction. Here, the situation where the carbon nanotubes are uniformly distributed and arranged in the up and down direction may include: the carbon nanotubes 122 belonging to an electromagnetic wave shielding part along the up and down direction VD, the direction slightly inclined with respect to the up and down direction VD, or the up and down direction VD Distributed and arranged in orthogonal directions.

如圖3所示,於一個電磁波屏蔽部121內,多個奈米碳管122沿上下方向、水平方向、傾斜方向中之任一方向定位,從而可沿上下方向分佈及排列。如上所述般定位之多個奈米碳管122例如可於成形連接器100之中途藉由硬化之液態聚矽氧橡膠而保持。即,液態聚矽氧橡膠硬化而形成彈性絕緣部120,從而多個奈米碳管122沿上下方向排列,奈米碳管122可分別沿上下方向、水平方向及傾斜方向中之任一方向定位。多個奈米碳管122藉由包含於各奈米碳管122之多個上述磁性粒子於磁場內排列之力而沿上下方向VD分佈及排列。例如,於沿上下方向VD施加磁場時,多個奈米碳管122可藉由上述磁性粒子於磁場內藉由磁力沿磁力線排列之力而沿上下方向分佈及排列並接觸。又,於此種奈米碳管122之行為之中途,奈米碳管122可沿上下方向、水平方向或傾斜方向定位,從而沿上下方向均勻地分佈及排列。與此相關,奈米碳管中之磁性粒子之位置、包含於奈米碳管之磁性粒子之量、具有磁性粒子之奈米碳管之量、液態聚矽氧橡膠材料之黏度等可對奈米碳管之行為產生影響。As shown in FIG. 3, in one electromagnetic wave shield 121, a plurality of carbon nanotubes 122 are positioned along any one of the vertical direction, the horizontal direction, and the oblique direction, so that they can be distributed and arranged in the vertical direction. The plurality of carbon nanotubes 122 positioned as described above can be held by hardened liquid silicone rubber in the middle of forming the connector 100, for example. That is, the liquid silicone rubber is hardened to form the elastic insulating portion 120, so that a plurality of carbon nanotubes 122 are arranged in the vertical direction, and the carbon nanotubes 122 can be positioned in any one of the vertical direction, the horizontal direction, and the oblique direction, respectively. . The plurality of carbon nanotubes 122 are distributed and arranged in the vertical direction VD by the force of the magnetic particles included in each carbon nanotube 122 being arranged in a magnetic field. For example, when a magnetic field is applied in the vertical direction VD, the plurality of carbon nanotubes 122 can be distributed and arranged in the vertical direction and contact with each other by the force of the magnetic particles arranged in the magnetic field along the lines of magnetic force by the magnetic force. In addition, in the middle of the behavior of the carbon nanotubes 122, the carbon nanotubes 122 can be positioned in the up-down direction, the horizontal direction, or the oblique direction, so as to be evenly distributed and arranged in the up-down direction. Related to this, the position of the magnetic particles in the carbon nanotubes, the amount of magnetic particles contained in the carbon nanotubes, the amount of carbon nanotubes with magnetic particles, the viscosity of the liquid silicone rubber material, etc. can be compared The behavior of rice carbon tubes has an impact.

如圖3所示,多個奈米碳管122可於電磁波屏蔽部121內沿上下方向VD排列成直線形狀。例如,於奈米碳管之長度相對較短且包含於奈米碳管之磁性粒子之量相對較多之情形時,奈米碳管可於電磁波屏蔽部121內取直線形狀。As shown in FIG. 3, a plurality of carbon nanotubes 122 may be arranged in a linear shape along the vertical direction VD in the electromagnetic wave shield 121. For example, when the length of the carbon nanotube is relatively short and the amount of magnetic particles contained in the carbon nanotube is relatively large, the carbon nanotube may take a linear shape in the electromagnetic wave shield 121.

圖4係表示奈米碳管沿上下方向分佈及排列之另一例。如圖4所示,奈米碳管122可沿上下方向VD排列成曲線形狀。例如,於奈米碳管之長度相對較長且包含於奈米碳管之磁性粒子之量相對較少之情形時,奈米碳管122可於電磁波屏蔽部121內取曲線形狀。取曲線形狀之奈米碳管122可沿上下方向、水平方向或傾斜方向定位。Figure 4 shows another example of the distribution and arrangement of carbon nanotubes in the vertical direction. As shown in FIG. 4, the carbon nanotubes 122 can be arranged in a curved shape along the vertical direction VD. For example, when the length of the carbon nanotube is relatively long and the amount of magnetic particles contained in the carbon nanotube is relatively small, the carbon nanotube 122 may take a curved shape in the electromagnetic wave shield 121. The carbon nanotube 122 in a curved shape can be positioned along the up and down direction, the horizontal direction, or the oblique direction.

多個奈米碳管122藉由上述磁性粒子藉由磁力沿磁力線排列之力而沿上下方向VD分佈及排列。關於藉由此種奈米碳管之分佈及排列形成電磁波屏蔽部,參照表示製造一實施例之連接器之例之圖5至圖8。The plurality of carbon nanotubes 122 are distributed and arranged in the vertical direction VD by the force of the magnetic particles arranged along the lines of magnetic force by the magnetic force. Regarding the formation of the electromagnetic wave shielding portion by the distribution and arrangement of such carbon nanotubes, refer to FIGS. 5 to 8 showing an example of manufacturing a connector according to an embodiment.

圖5係概略性地表示製造一實施例之連接器之例。參照圖5,一實施例之連接器可使用成形模具411與上下配置於成形模具411之磁場施加部421、422成形。可於成形模具411之成形空腔412注入第1液態成形材料413作為形成連接器之彈性高分子材料。第1液態成形材料413包含第1液態聚矽氧橡膠材料與上述多個奈米碳管122,多個奈米碳管分散於第1液態聚矽氧橡膠材料內。第1液態聚矽氧橡膠材料可為以上例示之液態聚矽氧橡膠材料中之一者。各奈米碳管122包含上述多個磁性粒子。Fig. 5 schematically shows an example of manufacturing a connector according to an embodiment. Referring to FIG. 5, the connector of an embodiment can be formed by using a forming mold 411 and the magnetic field applying parts 421 and 422 arranged up and down on the forming mold 411. The first liquid forming material 413 can be injected into the forming cavity 412 of the forming mold 411 as the elastic polymer material for forming the connector. The first liquid molding material 413 includes the first liquid silicone rubber material and the plurality of carbon nanotubes 122, and the plurality of carbon nanotubes are dispersed in the first liquid silicone rubber material. The first liquid silicone rubber material can be one of the liquid silicone rubber materials exemplified above. Each carbon nanotube 122 includes the above-mentioned plurality of magnetic particles.

於將第1液態成形材料413注入至成形空腔412後,可藉由第1及第2磁場施加部421、422沿上下方向VD施加磁場。第1磁場施加部421與第2磁場施加部422以沿成形模具411之上下方向(即,連接器之上下方向)彼此對向之方式配置。第1及第2磁場施加部421、422具有施加磁場之磁鐵部423、424及不施加磁場之複數個孔部425、426。磁鐵部423、424與孔部425、426可形成為於四邊形平板穿設有孔之形態。複數個孔部425、426分別於連接器之各彈性導電部沿上下方向定位。因此,不沿上下方向VD對上下定位之孔部425、426施加磁場。After the first liquid forming material 413 is injected into the forming cavity 412, the first and second magnetic field applying parts 421 and 422 can apply a magnetic field in the vertical direction VD. The first magnetic field application portion 421 and the second magnetic field application portion 422 are arranged to face each other in the up-down direction of the molding die 411 (ie, the connector up-down direction). The first and second magnetic field applying parts 421 and 422 have magnet parts 423 and 424 for applying a magnetic field and a plurality of holes 425 and 426 for not applying a magnetic field. The magnet portions 423, 424 and the hole portions 425, 426 may be formed in a shape in which holes are pierced in a quadrilateral flat plate. A plurality of holes 425 and 426 are respectively positioned along the up-down direction in each elastic conductive portion of the connector. Therefore, no magnetic field is applied to the vertically positioned holes 425 and 426 in the vertical direction VD.

若藉由磁鐵部423、424施加磁場,則包含於各奈米碳管122之上述磁性粒子由磁場之磁力吸引而於磁場內沿磁力線排列。奈米碳管122藉由上述磁性粒子於磁場內沿磁力線排列之力而沿上下方向VD均勻地分佈及排列。如上所述般藉由磁性粒子移動之奈米碳管122形成電磁波屏蔽部121。由於不對沿上下方向配置之孔部425、426施加磁場,因此於成形空腔412內上下對向之孔部425、426幾乎不存在奈米碳管122。If a magnetic field is applied by the magnet parts 423 and 424, the magnetic particles contained in each carbon nanotube 122 are attracted by the magnetic force of the magnetic field and arranged along the lines of magnetic force in the magnetic field. The carbon nanotubes 122 are uniformly distributed and arranged in the vertical direction VD by the force of the magnetic particles arranged along the lines of magnetic force in the magnetic field. As described above, the electromagnetic wave shield 121 is formed by the carbon nanotube 122 in which the magnetic particles move. Since no magnetic field is applied to the holes 425 and 426 arranged in the vertical direction, there are almost no carbon nanotubes 122 in the holes 425 and 426 facing up and down in the forming cavity 412.

上述第1液態聚矽氧橡膠材料之黏度可對奈米碳管之移動產生阻力。因此,可選擇具有可使奈米碳管以所期望之水準沿上下方向定位之黏度之第1液態聚矽氧橡膠材料。例如,可考量沿奈米碳管之方向之電磁波屏蔽部之屏蔽性而選擇具有適當的黏度之液態聚矽氧橡膠材料。The viscosity of the first liquid silicone rubber material can produce resistance to the movement of carbon nanotubes. Therefore, it is possible to select the first liquid silicone rubber material with a viscosity that allows the carbon nanotubes to be positioned in the vertical direction at a desired level. For example, considering the shielding properties of the electromagnetic wave shielding part along the direction of the carbon nanotubes, a liquid silicone rubber material with an appropriate viscosity can be selected.

又,可藉由調整設置於磁場施加部421、422之孔部425、426之尺寸而調整奈米碳管122聚集之尺寸。藉此,可調整電磁波屏蔽部之尺寸及屏蔽性。In addition, the size of the carbon nanotubes 122 can be adjusted by adjusting the size of the holes 425 and 426 provided in the magnetic field applying portions 421 and 422. Thereby, the size and shielding properties of the electromagnetic wave shielding part can be adjusted.

於多個奈米碳管122沿上下方向VD分佈及排列後,第1液態成形材料413之第1液態聚矽氧橡膠材料硬化。於是,如圖6所示,可成形與連接器對應之素材(workpiece)430。該素材430因與連接器之彈性導電部對應之孔部425、426而沿上下方向形成僅包含聚矽氧橡膠材料之聚矽氧橡膠部431。除聚矽氧橡膠部431以外之素材430之部分可成為包含沿上下方向VD分佈及排列之奈米碳管形成的電磁波屏蔽部之彈性絕緣部。因此,連接器之彈性絕緣部可包含電磁波屏蔽部而與電磁波屏蔽部一併形成。After the plurality of carbon nanotubes 122 are distributed and arranged in the vertical direction VD, the first liquid silicone rubber material of the first liquid molding material 413 is hardened. Thus, as shown in FIG. 6, a workpiece 430 corresponding to the connector can be formed. The material 430 forms a silicone rubber part 431 containing only silicone rubber material in the vertical direction due to the holes 425 and 426 corresponding to the elastic conductive parts of the connector. The part of the material 430 other than the silicone rubber part 431 can become an elastic insulating part including an electromagnetic wave shielding part formed by carbon nanotubes distributed and arranged in the vertical direction. Therefore, the elastic insulating part of the connector may include an electromagnetic wave shielding part and be formed together with the electromagnetic wave shielding part.

參照圖7,於素材430之各聚矽氧橡膠部431沿上下方向VD形成貫通孔432。作為一例,可沿上下方向VD對素材430照射雷射而形成貫通孔432。聚矽氧橡膠部431中除貫通孔432以外之部分可成為上述彈性絕緣部之第1間隔部。7, each silicone rubber portion 431 of the material 430 has a through hole 432 along the vertical direction VD. As an example, the material 430 may be irradiated with a laser in the vertical direction VD to form the through hole 432. The part of the silicone rubber part 431 other than the through hole 432 can be the first partition part of the above-mentioned elastic insulating part.

參照圖8,於貫通孔432注入第2液態成形材料414而填充貫通孔432。第2液態成形材料414包含第2液態聚矽氧橡膠材料與上述多個導電性金屬粒子111,多個導電性金屬粒子111分散於第2液態聚矽氧橡膠材料內。第2液態聚矽氧橡膠材料可為以上例示之液態聚矽氧橡膠材料中之一者,且可與第1液態聚矽氧橡膠材料相同。此後,若沿上下方向VD對填充於貫通孔432之第2液態成形材料414施加磁場,則第2液態成形材料414內之導電性金屬粒子111於磁場內排列,並且以可沿上下方向VD導電之方式接觸。藉此,沿上下方向VD彼此接觸之導電性金屬粒子111可形成連接器之彈性導電部。又,第2液態成形材料414中除導電性金屬粒子111以外之液態聚矽氧橡膠材料可於貫通孔432內形成上述彈性導電部之粒子保持部。此後,貫通孔432內之液態聚矽氧橡膠材料硬化而可成形圖2所示之連接器100。Referring to FIG. 8, the second liquid molding material 414 is injected into the through hole 432 to fill the through hole 432. The second liquid molding material 414 includes a second liquid silicone rubber material and the plurality of conductive metal particles 111, and the plurality of conductive metal particles 111 are dispersed in the second liquid silicone rubber material. The second liquid silicone rubber material can be one of the liquid silicone rubber materials exemplified above, and can be the same as the first liquid silicone rubber material. After that, if a magnetic field is applied to the second liquid molding material 414 filled in the through hole 432 in the vertical direction VD, the conductive metal particles 111 in the second liquid molding material 414 are arranged in the magnetic field and can conduct electricity in the vertical direction VD. The way to contact. Thereby, the conductive metal particles 111 contacting each other in the vertical direction VD can form the elastic conductive portion of the connector. In addition, the liquid silicone rubber material other than the conductive metal particles 111 in the second liquid molding material 414 can form the particle holding portion of the elastic conductive portion in the through hole 432. After that, the liquid silicone rubber material in the through hole 432 hardens to form the connector 100 shown in FIG. 2.

如上所述,一實施例之連接器100可由第1液態成形材料413與第2液態成形材料414成形。第1液態成形材料413包含分別包含多個磁性粒子之多個奈米碳管122、及分散有多個奈米碳管122之上述第1液態聚矽氧橡膠材料。第2液態成形材料414包含多個導電性金屬粒子111、及分散有多個導電性金屬粒子111之第2液態聚矽氧橡膠材料。彈性絕緣部120可由第1液態成形材料413形成,且可與複數個電磁波屏蔽部121一併形成。複數個電磁波屏蔽部121可藉由如下方式形成:沿上下方向VD對第1液態成形材料413施加磁場,多個奈米碳管122藉由上述磁性粒子於上述磁場內藉由磁力排列之力而沿上下方向VD分佈及排列。即,複數個電磁波屏蔽部121可藉由如下方式形成:多個奈米碳管122藉由施加磁場、及磁性粒子於所施加之磁場內之行為而沿上下方向VD分佈及排列。連接器100之彈性絕緣部120可藉由如下方式形成:於形成包含多個奈米碳管122之複數個電磁波屏蔽部121後,第1液態成形材料413內之上述第1液態聚矽氧橡膠材料硬化。複數個彈性導電部110可藉由如下方式形成:沿上下方向VD對包含多個導電性金屬粒子111及分散有多個導電性金屬粒子111之上述第2液態聚矽氧橡膠材料之第2液態成形材料414施加磁場,多個導電性金屬粒子111以可沿上下方向VD導電之方式接觸。關於複數個彈性導電部110之成形,可於自第1液態成形材料413成形彈性絕緣部120後,於在彈性絕緣部120針對複數個彈性導電部110之各者形成之複數個貫通孔432注入第2液態成形材料414。As described above, the connector 100 of an embodiment can be formed by the first liquid forming material 413 and the second liquid forming material 414. The first liquid molding material 413 includes a plurality of carbon nanotubes 122 each containing a plurality of magnetic particles, and the above-mentioned first liquid silicone rubber material in which a plurality of carbon nanotubes 122 are dispersed. The second liquid molding material 414 includes a plurality of conductive metal particles 111 and a second liquid silicone rubber material in which the plurality of conductive metal particles 111 are dispersed. The elastic insulating portion 120 may be formed of the first liquid molding material 413, and may be formed together with a plurality of electromagnetic wave shielding portions 121. The plurality of electromagnetic wave shielding portions 121 can be formed by applying a magnetic field to the first liquid forming material 413 in the vertical direction VD, and the plurality of carbon nanotubes 122 are formed by the force of the magnetic particles arranged in the magnetic field by the magnetic force. VD distribution and arrangement along the up and down direction. That is, a plurality of electromagnetic wave shielding parts 121 can be formed by the following method: a plurality of carbon nanotubes 122 are distributed and arranged along the vertical direction VD by applying a magnetic field and the behavior of magnetic particles in the applied magnetic field. The elastic insulating portion 120 of the connector 100 can be formed by the following method: after forming a plurality of electromagnetic wave shielding portions 121 including a plurality of carbon nanotubes 122, the first liquid silicone rubber in the first liquid molding material 413 The material hardens. The plurality of elastic conductive parts 110 can be formed by the following method: the second liquid of the above-mentioned second liquid silicone rubber material including a plurality of conductive metal particles 111 and a plurality of conductive metal particles 111 dispersed along the vertical direction VD A magnetic field is applied to the molding material 414, and the plurality of conductive metal particles 111 are in contact with each other in a manner capable of conducting VD in the vertical direction. Regarding the formation of the plurality of elastic conductive parts 110, after the elastic insulating part 120 is formed from the first liquid forming material 413, the elastic insulating part 120 can be injected into the plurality of through holes 432 formed in the elastic insulating part 120 for each of the plurality of elastic conductive parts 110. The second liquid molding material 414.

圖9係表示一實施例之連接器之變化例。參照圖9,彈性絕緣部120包含配置於各電磁波屏蔽部121之上端及下端之第2間隔部125。第2間隔部125可於上下方向VD上配置於電磁波屏蔽部121之上端之上方與電磁波屏蔽部121之下端之下方。位於上側之第2間隔部125之上表面可成為彈性絕緣部120之上表面的一部分,位於下側之第2間隔部125之下表面可成為彈性絕緣部120之下表面的一部分。第2間隔部125不使電磁波屏蔽部121之上端與下端露出,於對被檢查器件(參照圖1)進行檢查時,可防止被檢查器件之端子21與電磁波屏蔽部121接觸。第2間隔部125能夠以於成形彈性導電部110之中途覆蓋電磁波屏蔽部121之上端與下端之方式形成。例如,如圖8所示,於將第2液態成形材料注入至貫通孔而成形彈性導電部之製程中,第2液態成形材料之第2液態聚矽氧橡膠材料可覆蓋素材430之上下表面。於是,位於電磁波屏蔽部121之上端之上方與下端之下方的第2液態聚矽氧橡膠材料硬化,從而可形成第2間隔部125。Fig. 9 shows a modification of the connector of an embodiment. Referring to FIG. 9, the elastic insulating portion 120 includes a second spacer 125 disposed at the upper end and the lower end of each electromagnetic wave shielding portion 121. The second spacer 125 may be arranged above the upper end of the electromagnetic wave shielding portion 121 and below the lower end of the electromagnetic wave shielding portion 121 in the vertical direction VD. The upper surface of the second spacer 125 on the upper side may become a part of the upper surface of the elastic insulating part 120, and the lower surface of the second spacer 125 on the lower side may become a part of the lower surface of the elastic insulating part 120. The second spacer 125 does not expose the upper and lower ends of the electromagnetic wave shielding portion 121, and can prevent the terminal 21 of the inspected device from contacting the electromagnetic wave shielding portion 121 when the device to be inspected (see FIG. 1) is inspected. The second spacer 125 can be formed so as to cover the upper end and the lower end of the electromagnetic wave shielding portion 121 in the middle of forming the elastic conductive portion 110. For example, as shown in FIG. 8, in the process of injecting the second liquid forming material into the through hole to form the elastic conductive part, the second liquid silicone rubber material of the second liquid forming material can cover the upper and lower surfaces of the material 430. Then, the second liquid silicone rubber material located above the upper end and below the lower end of the electromagnetic wave shielding portion 121 is hardened, so that the second spacer 125 can be formed.

於圖9所示之例中,第2間隔部125配置於電磁波屏蔽部121之上端之上方及下端之下方。作為另一例,第2間隔部125亦可僅配置於電磁波屏蔽部121之上端之上方或下端之下方。In the example shown in FIG. 9, the second spacer 125 is arranged above the upper end of the electromagnetic wave shielding portion 121 and below the lower end. As another example, the second spacer 125 may be arranged only above the upper end or below the lower end of the electromagnetic wave shielding portion 121.

圖10係概略性地表示另一實施例之連接器之剖視圖。圖10所示之連接器200包含覆蓋彈性絕緣部120之絕緣構件230,絕緣構件230能夠以分別覆蓋彈性絕緣部120之上表面與下表面之方式附著於彈性絕緣部120之上表面與下表面。由於絕緣構件230覆蓋彈性絕緣部120之上表面與下表面,因此電磁波屏蔽部121之上端與下端位於絕緣構件230之內側。Fig. 10 is a cross-sectional view schematically showing a connector of another embodiment. The connector 200 shown in FIG. 10 includes an insulating member 230 covering the elastic insulating portion 120. The insulating member 230 can be attached to the upper and lower surfaces of the elastic insulating portion 120 by covering the upper and lower surfaces of the elastic insulating portion 120, respectively. . Since the insulating member 230 covers the upper surface and the lower surface of the elastic insulating portion 120, the upper and lower ends of the electromagnetic wave shielding portion 121 are located inside the insulating member 230.

絕緣構件230可形成為薄膜形狀。絕緣構件230包含沿上下方向VD穿設之複數個貫通孔231。複數個貫通孔231分別與複數個彈性導電部110對應。各彈性導電部110之上端部或下端部填充貫通孔231。各彈性導電部110之上端部與下端部可與絕緣構件230之上側表面或下側表面位於同一水平高度。作為另一例,各彈性導電部110之上端部與下端部亦可較絕緣構件230之上側表面或下側表面更突出。The insulating member 230 may be formed in a thin film shape. The insulating member 230 includes a plurality of through holes 231 pierced along the vertical direction VD. The plurality of through holes 231 respectively correspond to the plurality of elastic conductive parts 110. The upper end or lower end of each elastic conductive portion 110 is filled with the through hole 231. The upper end and the lower end of each elastic conductive part 110 may be at the same level as the upper or lower surface of the insulating member 230. As another example, the upper end and the lower end of each elastic conductive portion 110 may also protrude more than the upper surface or the lower surface of the insulating member 230.

作為一例,絕緣構件230可包括具有絕緣性之聚醯亞胺膜或包含具有絕緣性之聚合物之膜。於對被檢查器件進行檢查時,被檢查器件之端子21(參照圖1)與彈性導電部110之上端接觸。然而,由於電磁波屏蔽部121藉由絕緣構件230與插入於貫通孔231之彈性導電部110之上端部隔開,因此絕緣構件230可防止被檢查器件之端子21與電磁波屏蔽部121間接觸。As an example, the insulating member 230 may include a polyimide film having insulating properties or a film including a polymer having insulating properties. When the inspected device is inspected, the terminal 21 (refer to FIG. 1) of the inspected device is in contact with the upper end of the elastic conductive portion 110. However, since the electromagnetic wave shielding portion 121 is separated from the upper end portion of the elastic conductive portion 110 inserted into the through hole 231 by the insulating member 230, the insulating member 230 can prevent contact between the terminal 21 of the device under inspection and the electromagnetic wave shielding portion 121.

於圖10所示之例中,絕緣構件230提供於彈性絕緣部120之上表面及下表面。作為另一例,絕緣構件230亦可僅提供至與被檢查器件面對之彈性絕緣部120之上表面。In the example shown in FIG. 10, the insulating member 230 is provided on the upper surface and the lower surface of the elastic insulating portion 120. As another example, the insulating member 230 may also be provided only on the upper surface of the elastic insulating portion 120 facing the inspected device.

可於成形連接器200之中途形成絕緣構件230之貫通孔231。作為另一實施例,穿設有貫通孔231之絕緣構件230亦可接著於所成形之連接器200之彈性絕緣部120的上表面與下表面。如圖10所示,貫通孔231之內周面可垂直。作為另一例,貫通孔231之內周面亦可相對於上下方向VD以特定角度傾斜。The through hole 231 of the insulating member 230 may be formed in the middle of forming the connector 200. As another embodiment, the insulating member 230 with the through hole 231 can also be attached to the upper surface and the lower surface of the elastic insulating portion 120 of the formed connector 200. As shown in FIG. 10, the inner peripheral surface of the through hole 231 may be vertical. As another example, the inner peripheral surface of the through hole 231 may also be inclined at a specific angle with respect to the vertical direction VD.

圖11至圖14係表示成形圖10所示之實施例之連接器之例。參照圖11,可將絕緣構件230與第1液態成形材料413一併投入至成形空腔412內。圖11所示之絕緣構件230未形成有上述貫通孔。利用與參照圖5進行說明之方法相同之方法而藉由施加磁場使奈米碳管122沿上下方向VD分佈及排列,藉此形成本實施例之連接器之電磁波屏蔽部。如圖12所示,於第1液態成形材料413之第1液態聚矽氧橡膠材料硬化後成形素材430A。絕緣構件230覆蓋素材430A之上表面與下表面。如圖13所示,藉由雷射加工而於素材430A形成貫通孔432。可藉由雷射加工形成貫通孔432。又,藉由雷射加工形成貫通孔432而去除絕緣構件230之一部分,藉此於絕緣構件230形成上述貫通孔231。又,聚矽氧橡膠部431中除貫通孔432以外之部分可成為彈性絕緣部之第1間隔部。如圖14所示,於貫通孔432注入第2液態成形材料414。沿上下方向VD對填充貫通孔432之第2液態成形材料414施加磁場,導電性金屬粒子111藉由磁場之磁力以可沿上下方向VD導電之方式接觸。此後,貫通孔432內之第2液態聚矽氧橡膠材料硬化。藉此,可成形圖10所示之連接器200。11 to 14 show examples of forming the connector of the embodiment shown in FIG. 10. 11, the insulating member 230 and the first liquid molding material 413 can be put into the molding cavity 412 together. The insulating member 230 shown in FIG. 11 is not formed with the above-mentioned through hole. Using the same method as the method described with reference to FIG. 5, the carbon nanotubes 122 are distributed and arranged in the vertical direction VD by applying a magnetic field, thereby forming the electromagnetic wave shielding portion of the connector of this embodiment. As shown in FIG. 12, the material 430A is formed after the first liquid silicone rubber material of the first liquid molding material 413 is hardened. The insulating member 230 covers the upper surface and the lower surface of the material 430A. As shown in FIG. 13, a through hole 432 is formed in the material 430A by laser processing. The through hole 432 can be formed by laser processing. In addition, the through hole 432 is formed by laser processing to remove a part of the insulating member 230, thereby forming the through hole 231 in the insulating member 230. In addition, the part of the silicone rubber part 431 other than the through hole 432 can be the first partition part of the elastic insulating part. As shown in FIG. 14, the second liquid molding material 414 is injected into the through hole 432. A magnetic field is applied to the second liquid molding material 414 filled with the through-hole 432 in the vertical direction VD, and the conductive metal particles 111 are contacted in a manner capable of conducting conduction in the vertical direction VD by the magnetic force of the magnetic field. After that, the second liquid silicone rubber material in the through hole 432 hardens. Thereby, the connector 200 shown in FIG. 10 can be formed.

圖15係概略性地表示又一實施例之連接器之一部分之立體圖,圖16係概略性地表示又一實施例之連接器之一部分之剖視圖。FIG. 15 is a perspective view schematically showing a part of the connector of still another embodiment, and FIG. 16 is a cross-sectional view schematically showing a part of the connector of still another embodiment.

參照圖15及圖16,本實施例之連接器300之電磁波屏蔽部121呈圓筒形狀或環狀,沿上下方向VD於彈性絕緣部120之上端與下端之間延伸。彈性絕緣部120之第1間隔部124位於電磁波屏蔽部121之內側。即,電磁波屏蔽部121形成為包圍第1間隔部124之圓筒形狀或環狀。又,本實施例中之電磁波屏蔽部121作為完全包圍一個彈性導電部110之一個構造物而形成。又,於本實施例中,圓筒形狀或環狀之複數個電磁波屏蔽部121可於水平方向HD1或水平方向HD2上按照等間隔隔開。15 and 16, the electromagnetic wave shielding portion 121 of the connector 300 of the present embodiment has a cylindrical shape or a ring shape, and extends between the upper end and the lower end of the elastic insulating portion 120 in the vertical direction VD. The first spacing portion 124 of the elastic insulating portion 120 is located inside the electromagnetic wave shielding portion 121. That is, the electromagnetic wave shielding portion 121 is formed in a cylindrical shape or a ring shape surrounding the first spacer portion 124. In addition, the electromagnetic wave shielding portion 121 in this embodiment is formed as a structure that completely surrounds an elastic conductive portion 110. In addition, in this embodiment, a plurality of electromagnetic wave shielding portions 121 having a cylindrical shape or a ring shape may be spaced at equal intervals in the horizontal direction HD1 or the horizontal direction HD2.

圖17及圖18係表示成形圖15及圖16所示之連接器之一例。圖15及圖16所示之連接器300可與上述實施例相同地藉由如下方式成形:利用藉由施加磁場沿上下方向分佈及排列之多個奈米碳管形成電磁波屏蔽部,於所成形之素材形成用以形成彈性導電部之貫通孔,藉由施加磁場使導電性金屬粒子以可導電之方式接觸。Figs. 17 and 18 show an example of forming the connector shown in Figs. 15 and 16. The connector 300 shown in FIGS. 15 and 16 can be formed in the same manner as in the above-mentioned embodiment by using a plurality of carbon nanotubes distributed and arranged in the up and down direction by applying a magnetic field to form an electromagnetic wave shielding portion, and then forming an electromagnetic wave shielding portion. The material is used to form through holes for forming elastic conductive parts, and conductive metal particles are contacted in a conductive manner by applying a magnetic field.

參照圖17,第1及第2磁場施加部421、422具備於各彈性導電部之位置沿上下方向VD對向地配置之磁鐵部463、464。磁鐵部463、464呈圓筒形狀或環狀,於此種環狀之內部形成有圓形之孔部465、466。於各彈性導電部之位置沿上下方向VD對向地配置之磁鐵部463、464構成一對。若各對磁鐵部463、464沿上下方向VD施加磁場,則第1液態成形材料413內之奈米碳管122因其磁性粒子而於各磁鐵部463、464聚集成圓筒形狀或環狀。又,奈米碳管122聚集成圓筒形狀,並且沿上下方向VD均勻地分佈及排列,從而形成圖15所示之圓筒形狀之電磁波屏蔽部121。即,根據本實施例,藉由沿上下方向VD對向地配置之圓筒形狀之磁鐵部463、464而沿上下方向VD對第1液態成形材料413施加磁場,藉此電磁波屏蔽部可形成為圓筒形狀或環狀。又,可藉由調整磁鐵部463、464之直徑與孔部465、466之尺寸而對電磁波屏蔽部之尺寸及屏蔽性進行各種變更。Referring to FIG. 17, the first and second magnetic field applying parts 421 and 422 are provided with magnet parts 463 and 464 arranged opposite to each other in the vertical direction VD at the position of each elastic conductive part. The magnet parts 463, 464 are cylindrical or ring-shaped, and circular holes 465, 466 are formed inside the ring. The magnet parts 463 and 464 arranged opposite to each other along the vertical direction VD at the position of each elastic conductive part constitute a pair. If each pair of magnet portions 463, 464 applies a magnetic field in the vertical direction VD, the carbon nanotube 122 in the first liquid molding material 413 gathers in each magnet portion 463, 464 into a cylindrical shape or ring shape due to its magnetic particles. In addition, the carbon nanotubes 122 are gathered into a cylindrical shape, and are uniformly distributed and arranged in the vertical direction VD, thereby forming the cylindrical electromagnetic wave shielding portion 121 shown in FIG. 15. That is, according to this embodiment, by applying a magnetic field to the first liquid molding material 413 in the vertical direction VD by the cylindrical magnet portions 463 and 464 arranged opposite to each other in the vertical direction VD, the electromagnetic wave shielding portion can be formed as Cylindrical shape or ring shape. In addition, by adjusting the diameter of the magnet portions 463 and 464 and the size of the holes 465 and 466, the size and shielding properties of the electromagnetic wave shielding portion can be variously changed.

參照圖18,於與本實施例之連接器對應之素材430B形成有圓筒形狀或環狀之電磁波屏蔽部121,於電磁波屏蔽部121之內部形成有聚矽氧橡膠部431。藉由雷射加工而於聚矽氧橡膠部431形成用以成形彈性導電部之貫通孔432。聚矽氧橡膠部431中除貫通孔432以外之部分可成為彈性絕緣部之第1間隔部。此後,將上述第2液態成形材料注入至貫通孔432,藉由施加磁場使導電性金屬粒子以可沿上下方向VD導電之方式接觸,第2液態成形材料內之第2液態聚矽氧橡膠材料硬化。藉此,可成形圖15所示之連接器300。Referring to FIG. 18, a cylindrical or annular electromagnetic wave shielding portion 121 is formed on the material 430B corresponding to the connector of this embodiment, and a silicone rubber portion 431 is formed inside the electromagnetic wave shielding portion 121. A through hole 432 for forming an elastic conductive part is formed in the silicone rubber part 431 by laser processing. The part of the silicone rubber part 431 excluding the through hole 432 can be the first partition part of the elastic insulating part. Thereafter, the above-mentioned second liquid molding material is injected into the through hole 432, and the conductive metal particles are brought into contact with each other in a manner capable of conducting VD in the vertical direction by applying a magnetic field. The second liquid silicone rubber material in the second liquid molding material hardening. Thereby, the connector 300 shown in FIG. 15 can be formed.

圖19係概略性地表示又一實施例之連接器之變化例。參照圖19,本實施例之連接器300可具備圖10所示之絕緣構件230。於該情形時,可藉由參照圖11至圖14進行說明之成形方法成形具備絕緣構件之連接器300。Fig. 19 schematically shows a modification of the connector of another embodiment. Referring to FIG. 19, the connector 300 of this embodiment may include the insulating member 230 shown in FIG. 10. In this case, the connector 300 provided with the insulating member can be formed by the forming method described with reference to FIGS. 11 to 14.

沿上下方向均勻地分佈及排列而形成電磁波屏蔽部之奈米碳管能夠以各種形態具有磁性粒子。作為上述磁性粒子,可使用由在無外部磁場之狀態下磁化之鐵磁性物質形成之粒子。例如,上述磁性粒子可包含鎳、鈷、鉻、鐵、鐵碳化物、鐵氧化物、鉻氧化物、鎳氧化物、鎳鈷氧化物、鈷鐵及單分子磁鐵物質中之任一者。作為上述鐵碳化物,可使用碳化三鐵(Fe3 C)。作為上述鐵氧化物,可使用三氧化二鐵(Fe2 O3 )、四氧化三鐵(Fe3 O4 )、鐵氧體(ferrite)。作為上述單分子磁鐵物質,可使用Mn12單分子磁鐵、乙醯丙酮鏑(III)(Dysprosium(III) acetylacetonate hydrate)、雙-酞菁鋱(III)(Terbium(III) bis-phthalocyanine)。Carbon nanotubes that are uniformly distributed and arranged in the vertical direction to form an electromagnetic wave shield can have magnetic particles in various forms. As the above-mentioned magnetic particles, particles formed of a ferromagnetic substance magnetized in a state without an external magnetic field can be used. For example, the above-mentioned magnetic particles may include any one of nickel, cobalt, chromium, iron, iron carbide, iron oxide, chromium oxide, nickel oxide, nickel cobalt oxide, cobalt iron, and monomolecular magnet materials. As the iron carbide, triiron carbide (Fe 3 C) can be used. As the iron oxide, ferrite (Fe 2 O 3 ), ferrite tetroxide (Fe 3 O 4 ), or ferrite can be used. As the monomolecular magnet material, Mn12 monomolecular magnet, Dysprosium(III) acetylacetonate hydrate, or Terbium(III) bis-phthalocyanine can be used.

參照圖20至圖31,對實施例之連接器中包含磁性粒子之奈米碳管之各種例進行說明。參照圖20至圖31進行說明之奈米碳管之例中之磁性粒子僅係為了例示性地說明包含磁性粒子之奈米碳管而選擇之例。上述磁性粒子之例中之一例的磁性粒子能夠以參照圖20至圖31進行說明之形態包含於奈米碳管。20 to 31, various examples of carbon nanotubes containing magnetic particles in the connector of the embodiment will be described. The magnetic particles in the examples of carbon nanotubes described with reference to FIG. 20 to FIG. 31 are only examples selected for the illustrative description of carbon nanotubes containing magnetic particles. The magnetic particles in one of the above examples of the magnetic particles can be included in the carbon nanotube in the form described with reference to FIGS. 20 to 31.

圖20係表示包含磁性粒子之奈米碳管之一例。參照圖20,多個磁性粒子123可位於一個奈米碳管122之內部。即,奈米碳管122能夠以磁性粒子123插入於奈米碳管122之內部空間之形態包含磁性粒子123。關於磁性粒子插入奈米碳管之內部空間之例,參照圖21至圖25。Figure 20 shows an example of carbon nanotubes containing magnetic particles. Referring to FIG. 20, a plurality of magnetic particles 123 may be located inside a carbon nanotube 122. That is, the carbon nanotube 122 can contain the magnetic particles 123 in a form in which the magnetic particles 123 are inserted into the inner space of the carbon nanotube 122. For an example of inserting magnetic particles into the inner space of the carbon nanotube, refer to Figures 21 to 25.

可藉由化學氣相沈積(chemical vapor deposition,CVD)生成及生長奈米碳管。於藉由化學氣相沈積生成及生長奈米碳管之中途,上述磁性粒子可用作觸媒而插入於奈米碳管之內部空間。作為一例,可藉由如下方式進行使用化學氣相沈積之奈米碳管之生成與生長:將烴氣作為移送氣體供給至用以進行化學氣相沈積之反應器,自設置於反應器內之基板沿垂直方向生長奈米碳管。圖21至圖23係概略性地表示藉由化學氣相沈積生成及生長奈米碳管而磁性粒子插入於奈米碳管之內部空間之例。Carbon nanotubes can be generated and grown by chemical vapor deposition (CVD). In the middle of generating and growing carbon nanotubes by chemical vapor deposition, the above-mentioned magnetic particles can be used as a catalyst to be inserted into the inner space of the carbon nanotubes. As an example, the production and growth of carbon nanotubes using chemical vapor deposition can be carried out by the following method: hydrocarbon gas is supplied as a transfer gas to a reactor for chemical vapor deposition, and it is installed in the reactor. The substrate grows carbon nanotubes in the vertical direction. Figures 21 to 23 schematically show examples of carbon nanotubes being generated and grown by chemical vapor deposition and magnetic particles are inserted into the inner space of the carbon nanotubes.

參照圖21,磁性粒子123或磁性粒子123之簇較弱地結合於包含矽或鋁之基板511之表面。作為移送氣體供給之烴氣於磁性粒子123之上部藉由發熱分解而分解成碳與氫。於磁性粒子123之上端,因發熱分解而溫度與碳濃度增加,磁性粒子123自基板511分離。隨著碳向更冰冷之區域擴撒沈澱,奈米碳管122可自基板511沿上下方向包含磁性粒子123而形成。21, the magnetic particles 123 or clusters of magnetic particles 123 are weakly bonded to the surface of the substrate 511 containing silicon or aluminum. The hydrocarbon gas supplied as the transfer gas is decomposed into carbon and hydrogen by thermal decomposition on the upper portion of the magnetic particles 123. At the upper end of the magnetic particles 123, the temperature and carbon concentration increase due to thermal decomposition, and the magnetic particles 123 are separated from the substrate 511. As the carbon spreads and precipitates in a colder area, the carbon nanotube 122 can be formed by including the magnetic particles 123 from the substrate 511 in the vertical direction.

參照圖22,磁性粒子簇513沈積於基板511之表面。基板511之表面之磁性粒子簇513暴露於烴氣。烴氣於簇513之表面催化性地發熱分解而分解成氫與碳。分解之碳自更高濃度之高溫區域擴散沈澱至簇513之冰冷的區域,從而奈米碳管122可包含磁性粒子簇513而自基板511沿上下方向形成。Referring to FIG. 22, the magnetic particle clusters 513 are deposited on the surface of the substrate 511. The magnetic particle clusters 513 on the surface of the substrate 511 are exposed to the hydrocarbon gas. The hydrocarbon gas is catalytically heated and decomposed on the surface of the cluster 513 to be decomposed into hydrogen and carbon. The decomposed carbon diffuses and precipitates from the high-concentration high-temperature region to the cold region of the cluster 513, so that the carbon nanotube 122 can include the magnetic particle cluster 513 and is formed from the substrate 511 in the up and down direction.

參照圖23,於藉由化學氣相沈積生長奈米碳管之同時,可利用磁性粒子填充奈米碳管之內部。於奈米碳管122以緩慢之速度生長之中途,裝於坩堝之磁性粒子簇汽化而可投入至生長之奈米碳管。磁性粒子簇附著於奈米碳管122之開放端部,藉此奈米碳管122能夠以較快之速度生長。因於磁性粒子簇513周邊快速生長之奈米碳管之力而簇513發生變形。若中止作為觸媒物質之磁性粒子簇513之供給,則奈米碳管122可再次緩慢地生長。Referring to FIG. 23, while carbon nanotubes are grown by chemical vapor deposition, the inside of the carbon nanotubes can be filled with magnetic particles. In the middle of the carbon nanotube 122 growing at a slow speed, the magnetic particle clusters installed in the crucible vaporize and can be put into the growing carbon nanotube. The magnetic particle clusters are attached to the open ends of the carbon nanotubes 122, so that the carbon nanotubes 122 can grow at a faster speed. The cluster 513 is deformed due to the force of the rapidly growing carbon nanotubes around the magnetic particle cluster 513. If the supply of the magnetic particle clusters 513 as the catalyst material is stopped, the carbon nanotubes 122 can grow slowly again.

能夠以成為奈米碳管之方式捲起附著有磁性粒子之石墨烯片(graphine sheet)而形成內部空間插入有磁性粒子之奈米碳管。圖24係概略性地表示捲起附著有磁性粒子之石墨烯片而形成奈米碳管之一例。參照圖24,可使用電弧放電將磁性粒子123附著於石墨烯片521,捲起此種石墨烯片521而形成插入有磁性粒子之奈米碳管122。例如,可將包含磁性粒子之溶液投入至具有由石墨製成之陰極電極與陽極電極之容器,對陰極電極與陽極電極供給直流電而於陰極電極與陽極電極之間執行電弧放電。藉由電弧放電,容器內部之溫度可上升至約3000度。於此種溫度下,磁性粒子離子化成奈米粒子,自石墨製成之電極形成石墨烯片,可於石墨烯片附著磁性粒子。A graphine sheet with magnetic particles can be rolled up in a way to become a carbon nanotube to form a carbon nanotube with magnetic particles inserted in the internal space. Fig. 24 schematically shows an example of rolling up a graphene sheet with magnetic particles attached to form a carbon nanotube. 24, the magnetic particles 123 can be attached to the graphene sheet 521 using arc discharge, and the graphene sheet 521 is rolled up to form a carbon nanotube 122 with magnetic particles inserted. For example, a solution containing magnetic particles can be put into a container having a cathode electrode and an anode electrode made of graphite, and a direct current is supplied to the cathode electrode and the anode electrode to perform arc discharge between the cathode electrode and the anode electrode. With arc discharge, the temperature inside the container can rise to about 3000 degrees. At this temperature, the magnetic particles are ionized into nanoparticles, and graphene sheets are formed from electrodes made of graphite, and magnetic particles can be attached to the graphene sheets.

亦可利用毛細管效應形成內部空間插入有磁性粒子之奈米碳管。圖25係表示利用毛細管效應於奈米碳管之內部插入磁性粒子之一例。參照圖25,藉由化學氣相沈積而於包含氧化鋁之基板531之孔之表面生長有奈米碳管532。將包含上述磁性粒子之搬運流體533滴落至奈米碳管532。於是,搬運流體533藉由毛細管效應填充奈米碳管532。搬運流體533可整體或局部填充奈米碳管532。此後,若將搬運流體533乾燥,則磁性粒子123投入於奈米碳管532之內部。藉此,可形成內部空間插入有磁性粒子123之奈米碳管122。若將包含氧化鋁之基板531溶解於氫氧化鈉(NaOH)溶液,則可獲得內部空間插入有磁性粒子123之奈米碳管122。作為另一例,藉由將基板531溶解於氫氧化鈉(NaOH)溶液而使藉由化學氣相沈積生成及生長於包含氧化鋁之基板531之奈米碳管532自基板531分離。此後,將上述搬運流體533滴落至奈米碳管532,藉由毛細管效應以搬運流體533填充奈米碳管532之內部。此後,將搬運流體533乾燥,藉此可獲得內部空間插入有磁性粒子123之奈米碳管122。Capillary effect can also be used to form carbon nanotubes with magnetic particles inserted into the internal space. Figure 25 shows an example of using capillary effect to insert magnetic particles into carbon nanotubes. Referring to FIG. 25, carbon nanotubes 532 are grown on the surface of the holes of the substrate 531 containing alumina by chemical vapor deposition. The transport fluid 533 containing the above-mentioned magnetic particles is dropped onto the carbon nanotube 532. Thus, the conveying fluid 533 fills the carbon nanotube 532 by the capillary effect. The conveying fluid 533 can be filled with the carbon nanotube 532 entirely or partially. After that, when the conveying fluid 533 is dried, the magnetic particles 123 are put into the inside of the carbon nanotube 532. Thereby, a carbon nanotube 122 with magnetic particles 123 inserted into the inner space can be formed. If the substrate 531 containing alumina is dissolved in a sodium hydroxide (NaOH) solution, a carbon nanotube 122 with magnetic particles 123 inserted into the inner space can be obtained. As another example, by dissolving the substrate 531 in a sodium hydroxide (NaOH) solution, the carbon nanotubes 532 generated by chemical vapor deposition and grown on the substrate 531 containing alumina are separated from the substrate 531. After that, the transfer fluid 533 is dropped onto the carbon nanotube 532, and the inside of the carbon nanotube 532 is filled with the transfer fluid 533 by the capillary effect. Thereafter, the conveying fluid 533 is dried, thereby obtaining a carbon nanotube 122 in which magnetic particles 123 are inserted in the inner space.

於參照圖21至圖25進行說明之奈米碳管之例中,奈米碳管122可具有封閉之端部。圖26係表示插入有磁性粒子且一側端部封閉之奈米碳管。參照圖26,一側端部封閉之奈米碳管122可防止插入於其內部空間之磁性粒子123自奈米碳管122脫離。In the example of the carbon nanotube described with reference to FIGS. 21 to 25, the carbon nanotube 122 may have a closed end. Figure 26 shows a carbon nanotube with magnetic particles inserted and one end closed. Referring to FIG. 26, the carbon nanotube 122 with one end closed can prevent the magnetic particles 123 inserted into the inner space from escaping from the carbon nanotube 122.

圖27係表示包含磁性粒子之奈米碳管之另一例。參照圖27,磁性粒子123可於一個奈米碳管122之外側鍵結於奈米碳管122。詳細而言,各磁性粒子123可藉由化學鍵結與奈米碳管122之碳原子鍵結。圖28與圖29係概略性地表示磁性粒子藉由化學鍵結而鍵結於奈米碳管之碳原子之例。Figure 27 shows another example of carbon nanotubes containing magnetic particles. Referring to FIG. 27, the magnetic particles 123 may be bonded to the carbon nanotube 122 on the outer side of a carbon nanotube 122. In detail, each magnetic particle 123 can be bonded to the carbon atom of the carbon nanotube 122 by chemical bonding. Figures 28 and 29 schematically show examples of magnetic particles bonded to carbon atoms of carbon nanotubes through chemical bonding.

參照圖28,若利用硝酸(HNO3 )處理純奈米碳管541,則於奈米碳管541之碳原子附著羥基(OH)與羧基(COOH)。此後,將鎳與鈷作為前驅物而附著於具有羥基(OH)與羧基(COOH)之奈米碳管541。此後,可藉由水熱(hydrothermal)處理及退火(annealing)處理獲得圖27所示之奈米碳管122、即磁性粒子123藉由化學鍵結而鍵結於奈米碳管之碳原子之奈米碳管122。此時之磁性粒子123可為鎳鈷氧化物(NiCo2 O4 )。28, if the pure carbon nanotubes 541 are treated with nitric acid (HNO 3 ), hydroxyl (OH) and carboxyl groups (COOH) are attached to the carbon atoms of the carbon nanotubes 541. Thereafter, nickel and cobalt are used as precursors to be attached to the carbon nanotubes 541 with hydroxyl (OH) and carboxyl (COOH). Thereafter, the carbon nanotube 122 shown in FIG. 27, that is, the magnetic particles 123 bonded to the carbon atoms of the carbon nanotube by chemical bonding, can be obtained by hydrothermal treatment and annealing treatment. Meter carbon tube 122. The magnetic particles 123 at this time may be nickel cobalt oxide (NiCo 2 O 4 ).

圖29係表示磁性粒子藉由化學鍵結與奈米碳管之碳原子鍵結之另一例,且表示磁性粒子藉由所謂之點擊化學反應與奈米碳管之碳原子鍵結之情形。如圖29之左側所示,將經炔烴改性之奈米碳管542與具有包含磁性粒子123(圖29中為鐵氧化物之磁性粒子)之疊氮化物之樹枝狀聚合物鍵結。於該情形時,將奈米碳管542與上述樹枝狀聚合物連同抗壞血酸鈉(sodium ascorbate)及硫酸銅(CuSO4 )一併投入於以3:1之比率混合四氫葉酸(tetrahydrofolic acid)與水(H2 O)而成之溶液而進行反應。藉此,如圖29之右側所示,可獲得於奈米碳管122之碳原子鍵結有磁性粒子123、即於奈米碳管之外側表面結合有磁性粒子123之奈米碳管122。FIG. 29 shows another example of magnetic particles bonding to carbon atoms of carbon nanotubes through chemical bonding, and shows a situation in which magnetic particles are bonded to carbon atoms of carbon nanotubes through a so-called click chemical reaction. As shown on the left side of FIG. 29, carbon nanotubes 542 modified with alkyne are bonded to a dendrimer having an azide containing magnetic particles 123 (magnetic particles of iron oxide in FIG. 29). In this case, the carbon nanotube 542 and the above-mentioned dendrimer together with sodium ascorbate and copper sulfate (CuSO 4 ) were put into mixing tetrahydrofolic acid and tetrahydrofolic acid at a ratio of 3:1. It reacts with a solution of water (H 2 O). As a result, as shown on the right side of FIG. 29, a carbon nanotube 122 with magnetic particles 123 bonded to the carbon atoms of the carbon nanotube 122, that is, a carbon nanotube 122 with magnetic particles 123 bonded to the outer surface of the carbon nanotube, can be obtained.

圖30係表示包含磁性粒子之奈米碳管之又一例。參照圖30,奈米碳管122於石墨壁(graphitic wall)具有6個碳原子構成之多個六角孔。多個六角孔中之一部分六角孔分別具有多個磁性粒子123中之一者。多個磁性粒子123分別隨機地位於多個六角孔中之一者。於圖30所示之奈米碳管中,磁性粒子不位於奈米碳管之內部空間或奈米碳管之外部,磁性粒子123位於奈米碳管之六角孔而拘束於六角孔內。即,圖30所示之奈米碳管122呈無粒子表面(particle-free surface)之構造,因此不對奈米碳管122間之接觸產生影響。Figure 30 shows another example of carbon nanotubes containing magnetic particles. Referring to FIG. 30, the carbon nanotube 122 has a plurality of hexagonal holes composed of 6 carbon atoms on the graphitic wall. A part of the hexagonal holes among the plurality of hexagonal holes respectively have one of the plurality of magnetic particles 123. The plurality of magnetic particles 123 are randomly located in one of the plurality of hexagonal holes, respectively. In the carbon nanotube shown in FIG. 30, the magnetic particles are not located in the inner space of the carbon nanotube or the outside of the carbon nanotube, and the magnetic particles 123 are located in the hexagonal hole of the carbon nanotube and are confined in the hexagonal hole. That is, the carbon nanotube 122 shown in FIG. 30 has a particle-free surface structure, and therefore does not affect the contact between the carbon nanotubes 122.

圖31係概略性地表示磁性粒子位於奈米碳管之六角孔之奈米碳管之例。如圖31之左側所示,可使用包括包含鋁之板552、及板552上之包含陽極氧化鋁(anodic aluminum oxide)且具有多個孔554之模板553之基板551。可沿模板553之孔554之圓筒形壁面555生成奈米碳管。利用上述磁性粒子(例如,四氧化三鐵(Fe3 O4 ))塗覆圓筒形壁面555。以磁性粒子塗覆圓筒形壁面555之基板551配置於化學氣相沈積用反應器內。藉由反應器內之加熱,Fe3 O4 還原成FeC。如圖31之右側所示,藉由化學氣相沈積而奈米碳管122沿圓筒形壁面555生成及生長。圓筒形壁面555與奈米碳管122之間無空間,因此磁性粒子無法向奈米碳管122之外部脫離而拘束於奈米碳管122之六角孔內。Figure 31 schematically shows an example of a carbon nanotube with magnetic particles located in the hexagonal hole of the carbon nanotube. As shown on the left side of FIG. 31, a substrate 551 including a plate 552 containing aluminum and a template 553 containing anodic aluminum oxide and having a plurality of holes 554 on the plate 552 can be used. Carbon nanotubes can be generated along the cylindrical wall 555 of the hole 554 of the template 553. The cylindrical wall surface 555 is coated with the above-mentioned magnetic particles (for example, Fe 3 O 4 ). The substrate 551 on which the cylindrical wall surface 555 is coated with magnetic particles is arranged in a reactor for chemical vapor deposition. By heating in the reactor, Fe 3 O 4 is reduced to FeC. As shown on the right side of FIG. 31, the carbon nanotube 122 is generated and grown along the cylindrical wall 555 by chemical vapor deposition. There is no space between the cylindrical wall 555 and the carbon nanotube 122, so the magnetic particles cannot escape to the outside of the carbon nanotube 122 and are confined in the hexagonal hole of the carbon nanotube 122.

以上,藉由一部分實施例與隨附圖式所示之例對本發明之技術思想進行了說明,但應瞭解,可於不脫離本發明所屬之技術領域內具有常識者可理解之本發明之技術思想及範圍的範圍內進行各種置換、變化及變更。又,此種置換、變化及變更應理解為屬於隨附之發明申請專利範圍內。Above, the technical idea of the present invention has been described by some embodiments and the examples shown in the accompanying drawings. However, it should be understood that the technology of the present invention can be understood by those with common sense in the technical field to which the present invention belongs. Various substitutions, changes, and changes are made within the scope of thought and scope. In addition, such replacements, changes and alterations should be understood as falling within the scope of the attached invention application patent.

10:檢查裝置 11:端子 20:被檢查器件 21:端子 30:測試插座 31:框架 40:插座外殼 100:連接器 110:彈性導電部 111:導電性金屬粒子 112:粒子保持部 120:彈性絕緣部 121:電磁波屏蔽部 122:奈米碳管 123:磁性粒子 124:第1間隔部 125:第2間隔部 200:連接器 230:絕緣構件 231:貫通孔 300:連接器 411:成形模具 412:成形空腔 413:第1液態成形材料 414:第2液態成形材料 421:第1磁場施加部 422:第2磁場施加部 423、424:磁鐵部 425、426:孔部 430:素材 430A:素材 430B:素材 431:聚矽氧橡膠部 432:貫通孔 463、464:磁鐵部 465、466:孔部 511:基板 513:磁性粒子簇(簇) 521:石墨烯片 531:基板 532:奈米碳管 533:搬運流體 541:奈米碳管 542:奈米碳管 551:基板 552:板 553:模板 554:孔 555:圓筒形壁面 HD:水平方向 HD1:水平方向 HD2:水平方向 VD:上下方向10: Check the device 11: Terminal 20: Device under inspection 21: Terminal 30: Test socket 31: Frame 40: socket shell 100: connector 110: Elastic conductive part 111: Conductive metal particles 112: Particle holding part 120: Elastic insulating part 121: Electromagnetic wave shielding part 122: Carbon Nanotube 123: Magnetic particles 124: The first compartment 125: The second compartment 200: Connector 230: Insulating member 231: Through hole 300: Connector 411: forming die 412: forming cavity 413: The first liquid forming material 414: The second liquid forming material 421: The first magnetic field application part 422: The second magnetic field application part 423, 424: Magnet part 425, 426: Hole 430: Material 430A: Material 430B: Material 431: Silicone Rubber Department 432: Through hole 463, 464: Magnet part 465, 466: Hole 511: substrate 513: Magnetic particle cluster (cluster) 521: Graphene sheet 531: Substrate 532: Carbon Nanotube 533: Handling fluids 541: Carbon Nanotube 542: Carbon Nanotube 551: Substrate 552: Board 553: template 554: hole 555: Cylindrical wall HD: horizontal direction HD1: horizontal direction HD2: horizontal direction VD: Up and down direction

圖1係概略性地表示應用一實施例之連接器之例之剖視圖。Fig. 1 is a cross-sectional view schematically showing an example of a connector to which an embodiment is applied.

圖2係概略性地表示一實施例之連接器之俯視圖。Fig. 2 is a plan view schematically showing a connector of an embodiment.

圖3係概略性地表示一實施例之連接器之一部分之剖視圖。Fig. 3 is a cross-sectional view schematically showing a part of the connector of an embodiment.

圖4係概略性地表示奈米碳管沿上下方向分佈及排列之另一例之剖視圖。Fig. 4 is a cross-sectional view schematically showing another example of the distribution and arrangement of carbon nanotubes in the vertical direction.

圖5係概略性地表示製造圖2所示之連接器之一例之剖視圖。Fig. 5 is a cross-sectional view schematically showing an example of manufacturing the connector shown in Fig. 2.

圖6係概略性地表示製造圖2所示之連接器之一例之剖視圖,且表示與連接器對應之素材。Fig. 6 is a cross-sectional view schematically showing an example of manufacturing the connector shown in Fig. 2 and showing materials corresponding to the connector.

圖7係表示於圖6所示之素材形成與彈性導電部對應之貫通孔之例。FIG. 7 shows an example in which through holes corresponding to the elastic conductive portions are formed in the material shown in FIG. 6.

圖8係表示於圖7所示之貫通孔注入液態成形材料而成形一實施例之連接器之例。FIG. 8 shows an example of forming a connector of an embodiment by injecting a liquid molding material into the through hole shown in FIG. 7.

圖9係概略性地表示一實施例之連接器之變化例之剖視圖。Fig. 9 is a cross-sectional view schematically showing a modification of the connector of an embodiment.

圖10係概略性地表示另一實施例之連接器之剖視圖。Fig. 10 is a cross-sectional view schematically showing a connector of another embodiment.

圖11係概略性地表示製造圖10所示之連接器之一例之剖視圖。Fig. 11 is a cross-sectional view schematically showing an example of manufacturing the connector shown in Fig. 10.

圖12係概略性地表示製造圖10所示之連接器之一例之剖視圖,且表示與連接器對應之素材。Fig. 12 is a cross-sectional view schematically showing an example of manufacturing the connector shown in Fig. 10, and shows materials corresponding to the connector.

圖13係表示於圖12所示之素材形成與彈性導電部對應之貫通孔之例。FIG. 13 shows an example in which through holes corresponding to the elastic conductive portions are formed in the material shown in FIG. 12.

圖14係表示於圖13所示之貫通孔注入液態成形材料而成形另一實施例之連接器之例。FIG. 14 shows an example of forming a connector of another embodiment by injecting a liquid molding material into the through hole shown in FIG. 13.

圖15係概略性地表示又一實施例之連接器之一部分之立體圖。Fig. 15 is a perspective view schematically showing a part of a connector of another embodiment.

圖16係概略性地表示又一實施例之連接器之一部分之剖視圖。Fig. 16 is a cross-sectional view schematically showing a part of a connector of another embodiment.

圖17係概略性地表示製造圖15所示之連接器之一例之剖視圖。Fig. 17 is a cross-sectional view schematically showing an example of manufacturing the connector shown in Fig. 15.

圖18係表示於素材形成與彈性導電部對應之貫通孔之例。Fig. 18 shows an example of forming a through hole corresponding to the elastic conductive portion in the material.

圖19係概略性地表示又一實施例之連接器之變化例之剖視圖。Fig. 19 is a cross-sectional view schematically showing a modification of the connector of another embodiment.

圖20係表示包含磁性粒子之奈米碳管之一例。Figure 20 shows an example of carbon nanotubes containing magnetic particles.

圖21係概略性地表示形成圖20中例示之奈米碳管之一例。Fig. 21 schematically shows an example of forming the carbon nanotube illustrated in Fig. 20.

圖22係概略性地表示形成圖20中例示之奈米碳管之另一例。Fig. 22 schematically shows another example of forming the carbon nanotube illustrated in Fig. 20.

圖23係概略性地表示形成圖20中例示之奈米碳管之又一例。Fig. 23 schematically shows another example of forming the carbon nanotube illustrated in Fig. 20.

圖24係概略性地表示形成圖20中例示之奈米碳管之又一例。Fig. 24 schematically shows another example of forming the carbon nanotube illustrated in Fig. 20.

圖25係概略性地表示形成圖20中例示之奈米碳管之又一例。Fig. 25 schematically shows another example of forming the carbon nanotube illustrated in Fig. 20.

圖26係概略性地表示具有封閉端部之奈米碳管。Figure 26 schematically shows a carbon nanotube with closed ends.

圖27係表示包含磁性粒子之奈米碳管之另一例。Figure 27 shows another example of carbon nanotubes containing magnetic particles.

圖28係概略性地表示形成圖27中例示之奈米碳管之一例。Fig. 28 schematically shows an example of forming the carbon nanotube illustrated in Fig. 27.

圖29係概略性地表示形成圖27中例示之奈米碳管之另一例。Fig. 29 schematically shows another example of forming the carbon nanotube illustrated in Fig. 27.

圖30係表示包含磁性粒子之奈米碳管之又一例。Figure 30 shows another example of carbon nanotubes containing magnetic particles.

圖31係概略性地表示形成圖30中例示之奈米碳管之一例。Fig. 31 schematically shows an example of forming the carbon nanotube illustrated in Fig. 30.

100:連接器 100: connector

110:彈性導電部 110: Elastic conductive part

111:導電性金屬粒子 111: Conductive metal particles

112:粒子保持部 112: Particle holding part

120:彈性絕緣部 120: Elastic insulating part

121:電磁波屏蔽部 121: Electromagnetic wave shielding part

122:奈米碳管 122: Carbon Nanotube

124:第1間隔部 124: The first compartment

HD1:水平方向 HD1: horizontal direction

HD2:水平方向 HD2: horizontal direction

VD:上下方向 VD: Up and down direction

Claims (13)

一種連接器,其係位於兩個電子器件之間而將上述兩個電子器件電性連接者,其包含:複數個彈性導電部,其可沿上下方向導電;及彈性絕緣部,其使上述複數個彈性導電部於水平方向上隔開及絕緣,其中上述彈性絕緣部包括:複數個電磁波屏蔽部,其等位於上述複數個彈性導電部之間且包含具有磁性之多個奈米碳管;及複數個第1間隔部,其分別包圍上述複數個彈性導電部,上述複數個第1間隔部沿上述上下方向延伸,使上述複數個彈性導電部與上述複數個電磁波屏蔽部沿上述水平方向隔開,其中上述複數個電磁波屏蔽部屏蔽上述複數個彈性導電部之彈性電磁波及防止上述複數個彈性導電部之間之串擾(crosstalk),及其中上述多個奈米碳管沿上述上下方向分佈及排列且彼此接觸,進而形成上述複數個電磁波屏蔽部。 A connector, which is located between two electronic devices and electrically connects the two electronic devices, comprising: a plurality of elastic conductive parts, which can conduct electricity in the vertical direction; The elastic conductive parts are separated and insulated in the horizontal direction, wherein the elastic insulating part includes: a plurality of electromagnetic wave shielding parts, which are located between the plurality of elastic conductive parts and include a plurality of carbon nanotubes with magnetism; and A plurality of first spacers respectively surround the plurality of elastic conductive parts, the plurality of first spacers extend in the vertical direction, and the plurality of elastic conductive parts and the plurality of electromagnetic wave shielding parts are separated in the horizontal direction , Wherein the plurality of electromagnetic wave shielding parts shield the elastic electromagnetic waves of the plurality of elastic conductive parts and prevent crosstalk between the plurality of elastic conductive parts, and the plurality of carbon nanotubes are distributed and arranged along the up and down direction And contact each other to form the above-mentioned plural electromagnetic wave shielding parts. 如請求項1之連接器,其中上述複數個電磁波屏蔽部呈沿上述上下方向延伸之圓筒形狀,上述複數個第1間隔部分別位於上述複數個電磁波屏蔽部之各者之內側。 The connector of claim 1, wherein the plurality of electromagnetic wave shielding portions are in a cylindrical shape extending in the vertical direction, and the plurality of first spacer portions are respectively located inside each of the plurality of electromagnetic wave shielding portions. 如請求項1之連接器,其中上述彈性絕緣部包含配置於各電磁波屏蔽 部之上端或下端之第2間隔部。 The connector of claim 1, wherein the elastic insulating portion includes an electromagnetic wave shield The second spacer at the upper or lower end. 如請求項1之連接器,其中上述連接器進而包含絕緣構件,上述絕緣構件包含與上述複數個彈性導電部對應之複數個貫通孔,附著於上述彈性絕緣部。 The connector of claim 1, wherein the connector further includes an insulating member, and the insulating member includes a plurality of through holes corresponding to the plurality of elastic conductive portions, and is attached to the elastic insulating portion. 如請求項1之連接器,其中上述多個奈米碳管之各者包含多個磁性粒子。 The connector of claim 1, wherein each of the plurality of carbon nanotubes includes a plurality of magnetic particles. 如請求項5之連接器,其中上述多個奈米碳管藉由上述多個磁性粒子於磁場內藉由磁力排列之力而沿上述上下方向分佈及排列。 The connector of claim 5, wherein the plurality of carbon nanotubes are distributed and arranged in the up-down direction by the force of the magnetic arrangement of the plurality of magnetic particles in a magnetic field. 如請求項5之連接器,其中上述多個磁性粒子位於上述多個奈米碳管之各者之內部。 The connector of claim 5, wherein the plurality of magnetic particles are located inside each of the plurality of carbon nanotubes. 如請求項5之連接器,其中上述多個磁性粒子於上述多個奈米碳管之各者之外側化學鍵結於碳原子。 The connector of claim 5, wherein the plurality of magnetic particles are chemically bonded to carbon atoms outside each of the plurality of carbon nanotubes. 如請求項5之連接器,其中上述多個奈米碳管分別具有多個六角孔,上述多個六角孔中之一部份六角孔分別具有上述多個磁性粒子中之一者。 Such as the connector of claim 5, wherein each of the plurality of carbon nanotubes has a plurality of hexagonal holes, and a part of the hexagonal holes of the plurality of hexagonal holes respectively has one of the plurality of magnetic particles. 如請求項7至9中任一項之連接器,其中上述多個磁性粒子包含鎳、鈷、鉻、鐵、鐵碳化物、鐵氧化物、鉻氧化物、鎳氧化物、鎳鈷氧化物、 鈷鐵及單分子磁鐵物質中之任一者。 The connector according to any one of claims 7 to 9, wherein the plurality of magnetic particles include nickel, cobalt, chromium, iron, iron carbide, iron oxide, chromium oxide, nickel oxide, nickel cobalt oxide, Any of cobalt iron and monomolecular magnet materials. 如請求項1之連接器,其中上述兩個電子器件中之一者為檢查裝置,上述兩個電子器件中之另一者為由上述檢查裝置檢查之被檢查器件。 Such as the connector of claim 1, wherein one of the two electronic devices is an inspection device, and the other of the two electronic devices is a device to be inspected by the inspection device. 一種連接器,其係位於檢查裝置與被檢查器件之間而將上述檢查裝置與上述被檢查器件電性連接者,其包含:複數個彈性導電部,其可沿上下方向導電;及彈性絕緣部,其使上述複數個彈性導電部於水平方向上隔開及絕緣,其中上述彈性絕緣部包含:複數個電磁波屏蔽部,其等位於上述複數個彈性導電部之間,上述複數個電磁波屏蔽部屏蔽上述複數個彈性導電部之彈性電磁波及防止上述複數個彈性導電部之間之串擾(crosstalk);及複數個第1間隔部,其分別包圍上述複數個彈性導電部,上述複數個第1間隔部沿上述上下方向延伸,使上述複數個彈性導電部與上述複數個電磁波屏蔽部沿上述水平方向隔開,其中上述複數個電磁波屏蔽部包含多個奈米碳管,上述多個奈米碳管各包含多個磁性粒子,其中上述彈性絕緣部與上述複數個電磁波屏蔽部一併由包含上述多個奈米碳管、及分散有上述多個奈米碳管之第1液態聚矽氧橡膠材料之第1液態成形材料形成,其中上述複數個電磁波屏蔽部藉由如下方式形成,即,沿上述上下 方向對上述第1液態成形材料施加磁場,上述多個奈米碳管藉由上述磁性粒子於上述磁場內排列之力而沿上述上下方向分佈及排列及使上述多個奈米碳管彼此接觸,及其中上述複數個彈性導電部藉由如下方式形成,即,沿上述上下方向對包含多個導電性金屬粒子、及分散有上述多個導電性金屬粒子之第2液態聚矽氧橡膠材料之第2液態成形材料施加磁場,上述多個導電性金屬粒子以可沿上述上下方向導電之方式接觸。 A connector, which is located between an inspection device and a device to be inspected and electrically connects the inspection device and the device to be inspected, comprising: a plurality of elastic conductive parts, which can conduct electricity in the vertical direction; and an elastic insulating part , Which separates and insulates the plurality of elastic conductive parts in the horizontal direction, wherein the elastic insulating part includes: a plurality of electromagnetic wave shielding parts, which are located between the plurality of elastic conductive parts, and the plurality of electromagnetic wave shielding parts shield The elastic electromagnetic waves of the plurality of elastic conductive parts and the prevention of crosstalk between the plurality of elastic conductive parts; and a plurality of first spacers respectively surrounding the plurality of elastic conductive parts, the plurality of first spacers Extending in the vertical direction, the plurality of elastic conductive parts and the plurality of electromagnetic wave shielding parts are separated in the horizontal direction, wherein the plurality of electromagnetic wave shielding parts include a plurality of carbon nanotubes, each of the plurality of carbon nanotubes Comprising a plurality of magnetic particles, wherein the elastic insulating part and the plurality of electromagnetic wave shielding parts are composed of a first liquid silicone rubber material comprising the plurality of carbon nanotubes and the plurality of carbon nanotubes dispersed The first liquid molding material is formed, in which the plurality of electromagnetic wave shielding portions are formed in the following manner, namely, along the upper and lower sides A magnetic field is applied to the first liquid forming material in the direction, and the plurality of carbon nanotubes are distributed and arranged in the vertical direction by the force of the magnetic particles being arranged in the magnetic field, and the plurality of carbon nanotubes are brought into contact with each other, And the plurality of elastic conductive portions are formed by forming a second liquid silicone rubber material including a plurality of conductive metal particles and a second liquid polysiloxane rubber material dispersed with the plurality of conductive metal particles in the vertical direction. 2. A magnetic field is applied to the liquid molding material, and the plurality of conductive metal particles are brought into contact with each other so as to be conductive in the vertical direction. 如請求項12之連接器,其中藉由沿上述上下方向對向地配置之各對環狀磁鐵部而沿上述上下方向對上述第1液態成形材料施加磁場,從而上述複數個電磁波屏蔽部分別形成為圓筒形狀。 The connector of claim 12, wherein the plurality of electromagnetic wave shielding portions are respectively formed by applying a magnetic field to the first liquid molding material in the vertical direction by each pair of ring-shaped magnet portions arranged oppositely in the vertical direction It is cylindrical.
TW108142876A 2018-11-27 2019-11-26 Connector for electrical connection TWI739219B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0148023 2018-11-27
KR1020180148023A KR102127229B1 (en) 2018-11-27 2018-11-27 Connector for electrical connection

Publications (2)

Publication Number Publication Date
TW202027351A TW202027351A (en) 2020-07-16
TWI739219B true TWI739219B (en) 2021-09-11

Family

ID=70852861

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108142876A TWI739219B (en) 2018-11-27 2019-11-26 Connector for electrical connection

Country Status (4)

Country Link
KR (1) KR102127229B1 (en)
CN (1) CN113169495B (en)
TW (1) TWI739219B (en)
WO (1) WO2020111709A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102359547B1 (en) * 2020-09-25 2022-02-08 (주)티에스이 Test socket and test apparatus having the same
KR102471471B1 (en) * 2020-11-25 2022-11-28 (주)티에스이 Data signal transmission connector and manufacturing method for the same
KR102575597B1 (en) * 2021-05-17 2023-09-07 (주)위드멤스 Contactor and method for manufacturing the same
US11898920B2 (en) * 2022-05-10 2024-02-13 Sensata Technologies, Inc. Electromagnetic interference absorbing sensor connector

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW561266B (en) * 1999-09-17 2003-11-11 Jsr Corp Anisotropic conductive sheet, its manufacturing method, and connector
TW200617995A (en) * 2004-11-26 2006-06-01 Hon Hai Prec Ind Co Ltd Anisotropic conductive material
KR20100020793A (en) * 2008-08-13 2010-02-23 (주)리뉴젠 Test socket for high-frequency semiconductor ic test
KR101588844B1 (en) * 2014-12-30 2016-01-26 주식회사 아이에스시 Test connector with coil type Carbon Nano Tube

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3903662B2 (en) * 1999-09-17 2007-04-11 Jsr株式会社 Anisotropic conductive sheet and manufacturing method thereof
JP2004335450A (en) * 2003-04-16 2004-11-25 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
CN101348936B (en) * 2008-09-17 2010-08-25 吉林大学 Orientational alignment carbon nano-tube and carbon coating cobalt nano-particle complex and preparation thereof
KR101138963B1 (en) * 2010-01-21 2012-04-25 주식회사 아이에스시테크놀러지 Test socket and the fabrication method therefor
DE102010002447A1 (en) * 2010-02-26 2011-09-01 Tutech Innovation Gmbh Adhesive with anisotropic electrical conductivity and process for its preparation and use
KR101246301B1 (en) * 2012-01-18 2013-03-22 이재학 Socket for electrical test with micro-line
RU2014135452A (en) * 2012-02-01 2016-03-20 Конинклейке Филипс Н.В. RADIO-FREQUENCY SCREEN OF NANOPARTICLES FOR APPLICATION IN A MAGNETIC RESONANT VISUALIZATION DEVICE
KR101266124B1 (en) * 2012-04-03 2013-05-27 주식회사 아이에스시 Test socket with high density conduction section and fabrication method thereof
KR101417270B1 (en) * 2012-05-08 2014-07-08 현대자동차주식회사 Hybrid filler for shielding electromagnetic wave and manufacturing method of the same
KR101522624B1 (en) * 2013-12-12 2015-05-22 주식회사 아이에스시 Electrical test socket
KR101573450B1 (en) * 2014-07-17 2015-12-11 주식회사 아이에스시 Test socket
JP2016181657A (en) * 2015-03-25 2016-10-13 星和電機株式会社 Waterproof shield structure
US9912187B2 (en) * 2015-09-01 2018-03-06 Dell Products, Lp Wireless power transmission antenna with thermally conductive magnetic shield and method therefor
KR101839949B1 (en) * 2016-10-14 2018-03-19 부경대학교 산학협력단 Socket for Testing Semiconductor Devices And Method for Manufacturing the Same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW561266B (en) * 1999-09-17 2003-11-11 Jsr Corp Anisotropic conductive sheet, its manufacturing method, and connector
TW200617995A (en) * 2004-11-26 2006-06-01 Hon Hai Prec Ind Co Ltd Anisotropic conductive material
KR20100020793A (en) * 2008-08-13 2010-02-23 (주)리뉴젠 Test socket for high-frequency semiconductor ic test
KR101588844B1 (en) * 2014-12-30 2016-01-26 주식회사 아이에스시 Test connector with coil type Carbon Nano Tube

Also Published As

Publication number Publication date
CN113169495B (en) 2023-05-05
WO2020111709A1 (en) 2020-06-04
CN113169495A (en) 2021-07-23
KR20200062528A (en) 2020-06-04
KR102127229B1 (en) 2020-06-29
TW202027351A (en) 2020-07-16

Similar Documents

Publication Publication Date Title
TWI739219B (en) Connector for electrical connection
US6604953B2 (en) Anisotropically conductive sheet and connector
KR101586340B1 (en) Electrical test socket and fabrication method of conductive powder for electrical test socket
TWI411781B (en) And an inspection device for the electrically conductive connector device and the circuit device
TWI730498B (en) Connector for electrical connection
TWI248519B (en) Anisotropic conductive connector and wafer inspection device
US6849335B2 (en) Anisotropic conductive sheet
JP4415968B2 (en) Anisotropic conductive sheet and connector, and method for manufacturing anisotropic conductive sheet
CN104034773B (en) Gold film microelectrode array and manufacture method thereof
JP5018612B2 (en) Anisotropic conductive sheet and method for producing anisotropic conductive sheet
JP2000322938A (en) Anisotropic conductive sheet, its manufacture, and electrical test device and electrical test method for circuit device
JP2002158051A (en) Anisotropy conductive sheet
JP4288783B2 (en) Anisotropic conductive sheet and electrical inspection device for circuit device
JP2002157918A (en) Conductive composite particle and applied product using it
JPH10247536A (en) Anisotropic conductive sheet and its manufacture
JP2007279014A (en) Apparatus for inspecting integrated circuit and method of manufacturing the same
JP4099905B2 (en) Support for anisotropic conductive sheet and anisotropic conductive sheet with support
JP2001093599A (en) Anisotropic electrical connector and checker including same
JPH11273772A (en) Anisotropic conductive sheet and its manufacture
JP2008164476A (en) Anisotropic conductive connector apparatus and manufacturing method of the same, and inspection apparatus for circuit apparatus
JP2001067940A (en) Anisotropic conductive sheet
TW201830779A (en) Anisotropic conductive sheet and method for producing same
JP2001246626A (en) Mold and method for manufacturing anisotropic conductive sheet
JP2001091579A (en) Sheet-like connector, manufacturing method thereof, semiconductor device connecting apparatus and inspecting apparatus
JP2004227829A (en) Anisotropic conductive sheet and its manufacturing method as well as testing device of circuit device