TWI738948B - 包括分級配置的殼體的電源模組 - Google Patents

包括分級配置的殼體的電源模組 Download PDF

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TWI738948B
TWI738948B TW106144844A TW106144844A TWI738948B TW I738948 B TWI738948 B TW I738948B TW 106144844 A TW106144844 A TW 106144844A TW 106144844 A TW106144844 A TW 106144844A TW I738948 B TWI738948 B TW I738948B
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level
power module
connection structure
conductive
component
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TW106144844A
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TW201834196A (zh
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喬治 海哲特曼
馬丁 瑞特拿
尼可拉斯 梅伊爾
屋維 格蘭茲
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德商羅伯特博斯奇股份有限公司
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Abstract

本發明係關於一種電源模組。該電源模組包括至少一個電源半導體及至少一個其他電子組件。該電源模組包括藉由一模製本體形成之一殼體，該殼體藉由一嵌裝化合物形成。根據本發明，該殼體以至少兩個層級形成。至少一個電源半導體組件配置於一第一層級中，且該至少一個其他電子組件配置於第二層級中。至少一個導電層組態於該電源模組之一內部邊界的一表面處，該內部邊界在該等層級之間延伸，該至少一個導電層形成一導電連接結構。該連接結構直接施加於該表面上。該至少一個其他電子組件以導電方式連接至佈線結構，尤其是焊接或燒結至佈線結構。該第一層級中之該電源半導體組件藉助於該連接結構電連接至該第二層級中的該其他組件。

Description

包括分級配置的殼體的電源模組
本發明係關於一種包括殼體之電源模組，其中該殼體經分級組態。
本發明係關於一種電源模組。該電源模組包括至少一個電源半導體及至少一個其他電子組件。該電源模組包括藉由一模製本體形成之一殼體，該殼體藉由一嵌裝化合物形成。
根據本發明，殼體以至少兩個層級形成，尤其是數個層。至少一個電源半導體組件配置於一第一層級中，且該至少一個其他電子組件配置於第二層級中。
至少一個導電層，尤其是金屬層或含有至少一種金屬粒子或另外含有聚合物之層，形成於該電源模組之內部邊界的表面處，該內部邊界在該等層級之間延伸，該至少一個導電層形成一導電連接結構，尤其是佈線結構。該連接結構，尤其是該佈線結構，尤其直接施加於該表面上。該至少一個其他電子組件以導電方式連接至佈線結構，尤其是焊接或燒結至佈線結構。該第一層級中之該電源半導體組件藉助於該連接結構電連接至該第二層級中的該其他組件。有利地，因固持連接結構之電路載體(例如基板或印刷電路板)可被避免，該電源模組就支出而言可經合算地建構。該連接結構例如在第一層級已硬化之後可施加於電源模組之表面上，尤其是頂面上。在第一層級的相對位點處，尤 其是下表面處，該電源模組可包括用於發散熱量損耗的熱接觸區域。該電源模組可因此耦接至散熱片。
較佳地，該電源模組包括至少兩個或僅兩個層級、三個層級、四個層級或四個以上層級，在該等層級中之每一者中，嵌入至少一個電子組件及/或電源組件，尤其是電源半導體。較佳地，在耦接至一鄰接層級之每一層級中，包含導電連接結構，尤其是佈線結構，該導電連接結構於在層級之間延伸的界面處耦接至、抵靠或固定地連接至鄰接層級的表面。
連接結構，尤其是佈線結構，較佳以無電路載體的方式組態，尤其是無沿著層級分離地組態之電路載體的方式組態。連接結構較佳由層級例如第一層級之表面攜載。嵌裝化合物因此有利地形成電源模組之電路載體及殼體本體兩者。
至少一個其他組件可因此直接焊接或燒結至佈線結構上。焊接或燒結製程可例如在回流焊接爐中進行。在第二層級之組件已焊接至佈線結構之後，另一嵌裝化合物可施加於第一層級上，該另一嵌裝化合物嵌入有其他組件。上文提及之表面因此在直接位於彼此頂部上之層級之間形成邊界，尤其是界面。
在一個較佳具體實例中，電源半導體藉由半導體開關半橋形成，且至少一個其他組件為驅動器，尤其是閘極驅動器。其他組件經由佈線結構連接至半導體開關半橋之控制端子，尤其是閘極端子。電源模組可因此就支出而言經有利地合算地提供。藉助於實例，電源模組可包括聯合地形成B6橋之三個半導體開關半橋，或包括聯合地形成H橋的至少兩個半導體開關半橋。
在一個較佳具體實例中，電源半導體(尤其是半導體開關半橋)之電端子藉助於至少一個金屬本體(尤其是經由觸點或金屬塊體)通向遠至表面。在另一偏好情況下，形成至少一個導體軌之佈線結構(尤其是金屬層)，該佈線結構例如以導電方式連接至金屬本體。佈線結構在硬化嵌裝化合物或藉助 於雷射圖案化組態之後可例如層合至第一層級的表面上。為此，藉助於實例，例如銅膜之導電金屬層可施加於第一層級之表面上，導電金屬層以導電方式連接至導電金屬本體，從而在每一狀況下形成朝向電源半導體之端子的連接元件。導電連接可例如藉助於焊接或光點焊合來實現。佈線結構(尤其是導體軌)可接著藉助於表面處之負型雷射圖案化在另一步驟中塑形。
在一個較佳具體實例中，嵌裝化合物為經組態以形成水泥結晶體之水泥化合物，較佳地為水泥複合物。除結晶體形成水泥基質外，水泥複合物亦包括至少一種填充劑，尤其是填充粒子。就此而言，每一層級可藉由連續結晶體複合物來形成。有利地，水泥化合物(尤其是水泥複合材料)具有良好熱導率。水泥化合物(尤其是水泥複合材料)之熱膨脹係數此外有利地靠近於銅之膨脹係數。有利地，僅低熱應力可因此出現於電源模組中。水泥起始物質較佳經組態以在吸收水情況下自含水嵌裝化合物(尤其是自泥漿)結晶。詳言之，嵌裝化合物較佳包括水合高鋁水泥、波特蘭水泥、磷酸鹽水泥或其一組合。藉助於實例，嵌裝化合物包括水合鈣鋁及/或鋁酸鈣。除前述水泥物質外或獨立於前述水泥物質，水泥基質可至少自包括以下各者中之至少一者的起始物質產生：氧化物，氧化鎂、氧化鋁、氧化鋅，及矽酸鋯。較佳地，取決於起始物質，硬化水泥包括磷酸鹽，例如，磷酸鋅及/或磷酸鎂。
較佳地，水泥基質材料具有介於5與10之間較佳為7ppm/K(ppm/K=百萬分點/克爾文)的熱膨脹係數。有利地，相對於作為金屬層或連接結構或電源半導體之端子之材料的銅之膨脹係數的差，因此相較於作為基質之環氧樹脂較小。銅具有為16ppm/K之膨脹係數，且環氧樹脂具有為大約30ppm/K的膨脹係數。
在另一具體實例中，嵌裝化合物藉由環氧樹脂形成。就針對電源半導體可產生低熱損耗之電源組件的支出而言，電源模組可因此經合算地提供。
在一個較佳具體實例中，嵌裝化合物包括填充粒子。填充粒子較佳為陶瓷粒子及/或碳粒子，尤其是奈米碳管。陶瓷粒子為例如碳化物粒子、硼化物粒子、氮化物或氧化物。氧化物之實例為氧化鋁、二氧化鈦、氧化鈹或氧化矽。
由氮化物形成之陶瓷粒子例如由氮化物即氮化矽、氮化鋁或氮化硼中之至少一者或一組合形成，該組合包括選自氮化物即氮化矽、氮化鋁或氮化硼中之至少兩者或選自前述氮化物中的所有三者。
由碳化物形成之陶瓷粒子由實例形成，由氮化矽、由碳化硼或由碳化鎢形成；在另一具體實例中，陶瓷粒子由例如矽化鉬之矽化物或例如二硼化鈦或二硼化鎂的硼化物形成。
嵌裝化合物較佳包括一比例之填充粒子，尤其是至少百分之60的重量、更佳至少百分之70的重量、尤佳至少百分之80的重量選自前述填充粒子中之至少一者的填充粒子。藉由水泥結晶體形成之結晶結構較佳遍及嵌裝化合物並圍封填充粒子。較佳地，填充粒子之一部分以一方式形成，使得每一填充粒子藉由水泥基質之結晶體結構(尤其是藉由儘可能薄的層)完全圍封。
本發明亦係關於一種用於生產包括至少一個層級之電源模組的方法。在該方法中，為了形成電源模組之第一層級，至少一個電源半導體由嵌裝化合物嵌入。此外，形成電觸點，該等電觸點在嵌裝化合物已硬化之後在層級之表面處可接入。較佳地，觸點與層級之表面平齊地終止，或自層級之表面突出。
在另一步驟中，一佈線結構施加於表面上，該佈線結構以導電方式連接至表面處的觸點。至少一個其他組件施加於佈線結構上且以導電方式連接至佈線結構，尤其是焊接或燒結至佈線結構。在另一步驟中，至少一個其他組件經包圍，尤其是藉由嵌裝囊封，且因此由嵌裝化合物嵌入以便形成第二層 級。至少一個電源半導體可因此以無電路載體之形式，有利地以導電方式連接至至少一個其他組件。在形成第二層級之後，第一層級之上述表面形成兩個層級之間的界面。用於形成第二層級之嵌裝化合物可用確切地鎖定方式，有利地連接至形成第一層級的嵌裝化合物區塊，例如藉由形成於表面處之表面粗糙度，或例如藉助於雷射形成切割至表面中之切槽的凹槽或凹口。形成第二層級之嵌裝化合物可因此穿透至表面粗糙度中或穿透至凹槽或凹口中，使得在已硬化第二層級之後，第二層級之嵌裝化合物區塊以確切地鎖定並固定方式連接至第一層級之區塊。
在一個具體實例中，其他組件經燒結或焊接至佈線結構。在另一具體實例中，至少一個其他組件超音波焊合至佈線結構。佈線結構可例如藉助於雷射留下軌跡(traced)，且可在另一步驟中經電解施加。在另一具體實例中，佈線結構可層合至第一層級之表面上，且導體軌可藉助於雷射束而切出。
在另一具體實例中，連接結構(尤其是導體軌)可藉助於網板印刷或模板印刷產生於表面上。連接結構較佳藉由導電銅層、銀層或包括銅及/或銀之合金形成。
在另一具體實例中，連接結構(尤其是導體軌)藉助於以下各者施加於表面上且因此固定地連接至表面：施配包括金屬或另外包括聚合物或陶瓷的糊狀物，尤其是含銅糊狀物且隨後燒結；或噴塗，尤其是火焰噴塗或電漿噴塗。
在另一具體實例中，連接結構可藉由導電粒子含有於黏著劑基質中的導電黏著劑形成。
連接結構之施配或噴塗具有如下優點：連接結構可在第一或另一層級之表面不被工具接觸情況下產生。藉助於實例，以非平面樣式組態或上面已配置組件或其他結構部件的連接結構可施加於表面上。
在一個具體實例中，至少一個感測器藉助於連接結構而形成。感測器較佳為溫度感測器，其例如藉由在縱向截面上具有預定電阻的至少一個導體軌形成。導體軌較佳以曲折樣式組態。藉助於施加於表面上且尤其是直接連接至表面的溫度感測器，有利地有可能的是偵測位於彼此頂部上之層級之間的界面處之溫度。溫度感測器經組態以產生並輸出表示偵測到之溫度的溫度信號。
在另一個具體實例中，藉助於連接結構形成之感測器為經組態以偵測界面處之濕氣的電容式感測器。
較佳地，電容式感測器包括在表面上平行於彼此行進的兩個導體軌。有利地，聚合物層施加於導體軌上，該聚合物層經組態以取決於濕氣而改變其介電性質。聚合物為例如聚醯亞胺聚合物或醋酸丁酸纖維素聚合物。藉助於實例，藉助於連接至感測器之處理單元，尤其是微控制器或微處理器，或藉助於驅動器，尤其是電源模組的閘極驅動器，因此有可能的是以簡單方式偵測在水泥已硬化之後在層級中是否仍存在殘餘濕氣。因此形成之濕氣感測器經組態以產生表示偵測到之濕氣的濕氣信號，並將該濕氣信號分別傳輸至驅動器或處理單元。
處理單元較佳經組態以產生用於驅動電馬達之PWM信號。處理單元可取決於溫度信號或濕氣信號，改變(尤其是減小)藉由PWM信號表示的驅動電力。
電源模組，較佳連接至電源半導體之驅動器，尤其是閘極驅動器或處理單元，較佳經組態以取決於濕氣信號及/或溫度信號而關斷電源半導體。
較佳地，電容式感測器藉由平行於彼此行進且以用梳狀樣式互相嚙合的方式組態之交叉指結構而形成。
有利地，藉助於交叉指結構，兩個梳狀物結構之間的電容或另外結構之間的電阻可藉由處理單元偵測，使得嵌裝化合物及/或層級的在層級之間 延伸的界面處之連接之機械或物理或化學變更，可在電源模組的操作期間藉由處理單元偵測。
在方法之一個較佳具體實例中，導電金屬本體形成於電源半導體之端子與佈線結構之間，於在與第二層級形成界面層的表面處形成第一層級之後，該等金屬本體之頂面可接入。
較佳地，金屬本體與表面平齊地終止，或自表面突出。佈線結構可接著例如藉助於焊料(尤其是藉由回流焊接)電連接至金屬本體。
在一個較佳具體實例中，在硬化第一層級之後產生切口，該切口尤其經由觸點延伸遠至導電組件之端子及導電金屬本體，該切口自端子直至界面層或界面而產生。金屬本體可例如藉由電解填充(electrolytic filling)或藉由諸如電漿噴塗或HVOF噴塗(HVOF=高速率氧化燃料)的熱噴塗方法來產生。
電源半導體的電端子可例如由引線框形成。引線框例如由金屬薄片(尤其是銅薄片)形成。電源半導體較佳藉由半導體開關半橋、至少一個H橋或B6橋形成。半導體開關半橋較佳包括低壓側電晶體及高壓側電晶體，其各自組態為例如場效電晶體。在另一具體實例中，半導體開關半橋的電晶體可組態為IGBT(IGBT=Insulated Gate Bipolar Transistor，絕緣閘極雙極電晶體)或HEMT(HEMT=High Electron Mobility Transistor，高電子遷移率電晶體)。電晶體經組態例如為亦稱作裸晶粒的無封裝半導體本體。
電源模組較佳包括自電源模組突出的電端子。電端子可例如由佈線結構形成，其中佈線結構之數個部件自電源模組突出且藉由突出之末端區段形成電端子。
在另一具體實例中，層級藉助於二分(bipartite)工具在每一狀況下產生，其中電源半導體及/或其他組件(例如驅動器組件)之電端子，可在工具半部之界面處突出於形成層級的模製本體。
1‧‧‧電源模組
2‧‧‧第二層級
3‧‧‧第一層級
4‧‧‧電源半導體
5‧‧‧汲極端子
6‧‧‧源極端子
7‧‧‧控制端子
8‧‧‧連接薄片-金屬部件/引線框
9‧‧‧引線框
10‧‧‧金屬本體
11‧‧‧金屬本體
12‧‧‧水泥結晶體
13‧‧‧填充粒子
14‧‧‧基板
15‧‧‧導熱介質
16‧‧‧散熱片
17‧‧‧電容器
18‧‧‧導體軌
19‧‧‧導體軌
20‧‧‧驅動器
21‧‧‧溫度感測器
22‧‧‧輸出端子
23‧‧‧連接件
24‧‧‧導體軌
25‧‧‧界面
26‧‧‧表面
27‧‧‧切口
28‧‧‧導體軌
29‧‧‧硬化嵌裝化合物
30‧‧‧電源模組
31‧‧‧第一層級
32‧‧‧第二層級
33‧‧‧基板
34‧‧‧半導體開關
35‧‧‧半導體開關
36‧‧‧源極端子
37‧‧‧控制端子
38‧‧‧汲極端子
39‧‧‧控制端子
40‧‧‧源極端子
41‧‧‧汲極端子
42‧‧‧導電層
43‧‧‧導電層
44‧‧‧引線框
45‧‧‧金屬本體
46‧‧‧金屬本體
47‧‧‧金屬本體
48‧‧‧驅動器/驅動器組件
49‧‧‧驅動器/驅動器組件
50‧‧‧濾波電容器
51‧‧‧導體軌
52‧‧‧導體軌
53‧‧‧導體軌/導電層
54‧‧‧導體軌/導電層
55‧‧‧控制輸出端子
56‧‧‧控制輸出端子
57‧‧‧金屬本體
58‧‧‧溫度感測器
59‧‧‧電連接件
60‧‧‧嵌裝部件/層級
61‧‧‧步驟
62‧‧‧步驟
63‧‧‧步驟
64‧‧‧導電層
65‧‧‧基板
66‧‧‧切口
67‧‧‧金屬本體
68‧‧‧金屬本體
現將在下文參看諸圖及其他例示性具體實例來解釋本發明。其他有利具體實例變化自諸圖中且附屬申請專利範圍中提及之特徵的組合為顯然的。
圖1展示包括電源半導體及作為其他組件之驅動器組件之電源模組的一個例示性具體實例，該電源半導體及驅動器組件分別配置於在彼此上方行進之層級中；圖2展示包括半導體開關半橋及作為其他組件的兩個驅動器組件之電源模組之一個例示性具體實例，該半導體開關半橋包括兩個電源半導體開關，其中電源半導體配置於共同層級中，且驅動器組件配置於位於共同層級上方的層級中；圖3展示用於產生相對於電源模組之基板之基板平面橫向的導電連接之方法。
圖1以截面圖示意性地展示電源模組1的一個例示性具體實例。電源模組1包括兩個層級，即第一層級3及第二層級2。層級2及3在每一狀況下由包括陶瓷粒子的嵌裝部件形成，詳言之，該嵌裝部件由水泥結合之嵌裝化合物產生。界面25在層級2與層級3之間延伸。在形成層級2及3之嵌裝本體直接彼此抵靠的區中，界面25形成用於第一層級3之水泥結晶體及第二層級2之水泥結晶體的晶界(grain boundary)。層級之水泥結晶體取決於第一層級3之表面粗糙度在界面25處，以確切地鎖定方式彼此互鎖。
除兩個層級2及3外，電源模組1亦可包括電連接至彼此的一或多個其他層級。
電源模組1包括電源半導體4，其嵌入於形成第一層級3之嵌裝部 件中。在此例示性具體實例中，電源半導體4藉由場效電晶體形成，尤其是由MIS-FET(MIS=Metal Insulated Semiconductor，金屬絕緣半導體)、MOS-FET(MOS=Metal Oxide Semiconductor，金屬氧化物半導體)或IGBT(IGBT=Insulated Gate Bipolar Transistor，絕緣閘極雙極電晶體)或HEMT(HEMT=High Electron Mobility Transistor，高電子遷移率電晶體)形成。
在此例示性具體實例中，電源半導體4包括藉由金屬層形成之汲極端子5、與汲極端子相對之側上藉由金屬層形成的源極端子6，以及藉由金屬層形成之控制端子7，尤其是閘極端子。電源半導體4藉由汲極端子5焊接或燒結至例如由引線框形成的連接薄片-金屬部件8上。源極端子6連接至另一引線框9。引線框8及9各自自形成層級3之嵌裝部件以末端區段突出，且因此形成用於電源半導體4的切換路徑端子，從而在此例示性具體實例中形成半導體開關。
引線框8及9可各自藉由末端區段配置於共同平面上，且因此在同一平面中自形成層級3之嵌裝部件聯合地突出。
第一層級3可因此亦例如藉助於二分嵌裝產生。
在此例示性具體實例中，在此例示性具體實例中藉由銅塊形成的金屬本體10，以導電方式連接至藉由引線框9形成的薄片-金屬部件，尤其是銅薄片-金屬部件。在此例示性具體實例中，金屬本體10經焊接至引線框9，尤其是回流焊接或焊合至引線框9。
在此例示性具體實例中，金屬本體10在層級3中突出而遠至經組態用於連接至另一層級2的表面26。
為此，舉例而言，表面26可具有足夠表面粗糙度或如在此例示性具體實例中所說明具有藉助於雷射產生之帶凹槽切口，諸如切口27，形成層級2之嵌裝化合物可穿透至該切口27中。表面26接著在包圍連接結構之區中形成界面25。
在此例示性具體實例中，控制端子7連接至金屬本體11，該金屬本體11類似於金屬本體10以表面26終止。金屬本體11因此在產生層級2之前可自外部接觸。為此，連接結構施加於表面26上。在此例示性具體實例中，連接結構藉由導電層或軌形成，該等導電層或軌例如藉助於網板印刷、模板印刷，藉助於施配或藉助於轉印方法而施加於表面26上。在另一具體實例中，在此例示性具體實例中包括導體軌18、19及24之連接結構，藉助於層合及後續負型雷射圖案化於表面26上產生且連接至表面26。導體軌之層厚度例如藉由用銅進行電鍍來形成。
在此例示性具體實例中，導體軌19藉助於回流焊接或藉助於光點焊合而連接至金屬本體10。在此例示性具體實例中，導體軌24藉助於焊接或焊合以導電方式連接至金屬本體11。
電容，尤其是電容器17(尤其是鏈路電容器(link capacitor))之電容的各別電端子連接，尤其是焊接至導體軌19且焊接至導體軌18。在此例示性具體實例中，電容器17形成上文提及之其他電子組件。
在此例示性具體實例中，驅動器20，尤其是微控制器、FPGA(FPGA=Field-Programmable Gate Array，場域可程式化閘陣列)或ASIC(ASIC=Application-Specific integrated Circuit，特殊應用積體電路)，亦以導電方式連接至連接結構，尤其是連接至導體軌24。驅動器20包括焊接至導體軌24的輸出端子22。端子22例如藉由球狀柵格陣列之焊珠形成。
在此例示性具體實例中，電源模組1亦包括溫度感測器21，其在此例示性具體實例中嵌入於形成層級3之嵌裝部件中。溫度感測器21突出遠至表面26且此處連接至上文提及之連接結構的導體軌28。溫度感測器21例如為電阻感測器或熱偶元件。導體軌28(藉由以短劃線方式所說明之連接件23)通向驅動器20的其他端子。
與展示於圖1中之圖解形成對比，溫度感測器亦可連接至表面26作為曲折電導體軌，該曲折電導體軌係作為連接結構的部件。連接件23可連接至表面26作為連接結構的導體軌。
在此例示性具體實例中，引線框8配置於基板14上，例如，陶瓷基板上，且以導熱方式連接至陶瓷基板14。以此方式，來自電源半導體4之熱損耗可經由引線框8及基板耗散。在此例示性具體實例中，基板14經由導熱介質15(例如導熱糊)以導熱方式連接至散熱片16。
在此例示性具體實例中，形成層級3之嵌裝部件藉由水泥本體(尤其是水泥複合物本體)形成，該水泥複合物本體由硬化嵌裝化合物29形成。在此例示性具體實例中，形成層級3之水泥本體或水泥複合物本體包括水泥基質材料，該水泥基質材料由以結晶樣式連接至彼此之水泥結晶體形成，該等結晶體中之一個水泥結晶體12藉助於實例來指定。在此例示性具體實例中，水泥結晶體12圍封填充粒子，該等填充粒子中之一個填充粒子13藉助於實例來指定。舉例而言，填充粒子13為陶瓷填充粒子。
在焊接諸如電容器17及驅動器20之其他電子組件之後，其他組件可藉由水泥化合物與連接結構一起經聯合嵌裝，且因此以此方式嵌入至水泥化合物中，在已產生層級3之後，形成層級2，層級2以固定且確切地鎖定之方式，尤其是藉助於表面粗糙度或凹槽、切口或諸如凹槽27的凹口，連接至層級3。
圖2以截面圖示意性地展示電源模組30的一個例示性具體實例。類似於說明於圖1中之電源模組1，電源模組30由兩個層級形成，其中電源半導體容納於第一層級31中，且諸如驅動器49、驅動器48及電容器50的其他電子組件容納於第二層級32中，該第二層級藉由嵌裝至經硬化之第一層級31上而固定連接至第一層級31。
在此例示性具體實例中，藉由水泥嵌裝部件形成之第一層級31 圍封半導體開關34及半導體開關35。半導體開關34及35聯合地形成半導體開關半橋。半導體開關34及35之切換路徑端子(尤其是汲極端子)各自面向相互相對的方向。在此例示性具體實例中，半導體開關35之汲極端子41面向基板33，該基板33經由導熱介質15以導熱方式連接至散熱片16，且半導體開關34之汲極端子38面向層級31的表面26，層級31經組態用於連接至藉由水泥嵌裝部件形成的第二層級32。
與展示於圖2中之圖解形成對比，半導體開關34及35可亦在汲極端子面向同一方向(例如面向基板33)的情況下嵌入於第一層級31中。
半導體開關35包括控制端子39及源極端子40，其聯合地面向經提供從而連接至第二層級32之表面26。控制端子39經由金屬本體47鏈接至表面26。源極端子40藉助於金屬本體46鏈接至表面26。金屬本體46及47可因此例如藉助於佈線結構或其他組件之端子在表面26處接觸，金屬本體46及47可例如分別焊接至控制端子39及源極端子40，或金屬本體46及47可作為空腔中之通孔而被產生。為此，金屬本體47在表面26處連接至施加於表面26上之佈線結構的導體軌53。導體軌52電連接至金屬本體46。驅動器組件49之控制輸出端子56係藉由焊接而連接至導體軌53。濾波電容器50的端子藉由焊接連接至導體軌52。
半導體開關34之汲極端子38面向表面26且連接至導電層，尤其是引線框44。藉助於金屬本體45(例如通孔或銅塊)形成遠至表面26的引線框44，且引線框44可在此處被電接觸。施加於表面26上之已提及之佈線結構的導體軌51，接觸金屬本體45且連接該金屬本體45至濾波電容器50的其他端子。
半導體開關35之汲極端子41及半導體開關34之源極端子36以及又半導體開關34之控制端子37各自面向基板33。汲極端子41電連接至導電層43，例如引線框，其中引線框43以導熱方式連接至基板33，例如陶瓷基板。導電層43連接汲極端子41至半導體開關34的源極端子36。以此方式，導電層43形 成半導體開關半橋的輸出端子，該半導體開關半橋係藉助於半導體開關34及35而形成。為此(圖2中未說明)導電層43可自末端區段中形成層級31的模製本體突出，且可在此處被電接觸。
控制端子37以導電且導熱方式連接至導電層42，例如，引線框。導電層42以導熱方式連接至基板33且將控制端子37連接至驅動器組件48的控制輸出端子55。類似於驅動器組件49，驅動器組件48容納於第二層級32中。導電層42藉助於金屬本體57(例如銅塊或電解地產生之通孔)而通向表面26，且導電層42可藉由連接結構之部件(即導體軌54)在此處被電接觸。為此，導體軌54在表面26處焊接或焊合至金屬本體57。
電源模組30亦包括溫度感測器58。溫度感測器58經由以短劃線方式說明之電連接件59在輸出側上連接至驅動器組件48。除電連接件59外或獨立於該電連接件59，溫度感測器58亦可連接至驅動器組件49。驅動器組件48及/或驅動器組件49可因此取決於由溫度感測器58產生之溫度信號，關斷第一層級31中的半導體開關半橋。
在此實例中，溫度感測器58連接至表面26作為曲折導體軌，尤其是作為佈線結構的部件。連接件59可組態為導體軌，且尤其是作為佈線結構的部件連接至表面26。
驅動器組件48及49之輸出端子55及56分別組態例如為焊球。驅動器組件48及49可因此藉助於回流焊接爐中之焊料分別焊接至導電層54及53。
說明於圖1及圖2中之電源模組可各自包括嵌入有電子組件的甚至其他層級。
圖3示意性地展示用於在水泥接合嵌裝部件中產生金屬本體的一個例示性具體實例，其中嵌裝之嵌裝件例如由於圖1及圖2中形成之第一層級形成。圖解展示嵌裝部件60，其在步驟61中嵌裝至基板65上，例如陶瓷基板上， 或在該嵌裝部件中嵌裝基板65。導電層64(例如銅引線框)以導熱方式連接至基板65。
在步驟62中，自表面26進行，產生切口66，該切口66延伸穿過至導電層64。切口66可例如藉助於鑽孔、研磨、衝壓或藉助於雷射束而產生。
切口66亦可藉助於插入件(例如塑膠插入件)保持可用於形成層級60之水泥塊體中，且此可在水泥嵌裝化合物已硬化之後被抽出或藉助於雷射光燃燒掉。
在步驟63中，在步驟62中產生之切口66藉助於導電材料，尤其是銅，在此例示性具體實例中藉助於金屬本體67填充。金屬本體67(例如銅塊)在此狀況下電接觸導電層64。在此例示性具體實例中，金屬本體67與表面26平齊地終止。
與展示於步驟63中之圖解形成對比，金屬本體67可用末端區段自表面26突出。以此方式，有可能補償水泥鑄造期間之公差、水泥化合物之收縮及/或關於金屬本體67之尺寸的製造容許度，使得表面26之區中的金屬本體67可藉由連接結構之一部件或直接藉由另一組件之電端子自外部可靠地電接觸。
圖3在步驟62中亦展示以短劃線方式說明的導電線或金屬本體68，其電連接至導電層64。金屬本體68或導線可已在形成第一層級之嵌裝部件60的生產期間伴隨地嵌裝，且以末端區段突出超出表面26。已被提及連接結構或連接結構之一部件可電接觸金屬本體66之末端區段或導線，且因此產生穿過第一層級60遠至導電層64的電連接。
15‧‧‧導熱介質
16‧‧‧散熱片
25‧‧‧界面
26‧‧‧表面
30‧‧‧電源模組
31‧‧‧第一層級
32‧‧‧第二層級
33‧‧‧基板
34‧‧‧半導體開關
35‧‧‧半導體開關
36‧‧‧源極端子
37‧‧‧控制端子
38‧‧‧汲極端子
39‧‧‧控制端子
40‧‧‧源極端子
41‧‧‧汲極端子
42‧‧‧導電層
43‧‧‧導電層
44‧‧‧引線框
45‧‧‧金屬本體
46‧‧‧金屬本體
47‧‧‧金屬本體
48‧‧‧驅動器/驅動器組件
49‧‧‧驅動器/驅動器組件
50‧‧‧濾波電容器
51‧‧‧導體軌
52‧‧‧導體軌
53‧‧‧導體軌/導電層
54‧‧‧導體軌/導電層
55‧‧‧控制輸出端子
56‧‧‧控制輸出端子
57‧‧‧金屬本體
58‧‧‧溫度感測器
59‧‧‧電連接件

Claims (8)

  1. 一種電源模組(1、30)，其包括至少一個電源半導體組件(4、34、35)，至少一個其他電子組件(20、48、49、17、50)，以及一殼體，其藉由一模製本體形成，並且藉由一嵌裝化合物(12、13)形成，其中該殼體以至少第一和第二層級(2、3、31、32)而形成，且該至少一個電源半導體組件(4、34、35)配置於該第一層級(3、31)中，且該至少一個其他電子組件(20、48、49、17、50)配置於該第二層級(2)中，至少一個導電層形成一導電連接結構(18、19、24、51、52、53、54)於一內部界面(25)之一表面(26)處，該內部界面(25)在該電源模組的該第一和第二層級(2、3)之間延伸，該至少一個導電層施加於該表面(26)上，該至少一個其他電子組件(20、48、49、17、50)以導電方式連接至該導電連接結構(18、19、24、51、52、53、54)，該第一層級(3、31)中之該至少一個電源半導體組件(4、34、35)藉由該導電連接結構(18、19、24、51、52、53、54)電連接至該第二層級(2)中之該至少一個其他電子組件，其中該嵌裝化合物(29)為一水泥化合物，其以形成水泥結晶體(12)而形成，使得該第一和第二層級(2、3、31、32)中之每一層級藉由一連續結晶體結構形成，以及其中該導電連接結構形成一電容式感測器，其經組態於偵測該內部界面(25)上之濕氣。
  2. 如申請專利範圍第1項之電源模組(1、30)，其特徵在於該嵌裝化合物(29)包括填充粒子(13)。
  3. 如申請專利範圍第2項之電源模組(1、30)，其特徵在於該導電連接結構形成一溫度感測器(58)，其經組態以偵測該內部界面(25) 處該電源模組的一溫度，且產生表示該溫度之一溫度信號，且該電源模組(1、30)經組態以取決於該溫度信號關斷該至少一個電源半導體組件(4、34、35)。
  4. 一種用於生產包括至少一個層級之一電源模組的方法，其中為了形成該電源模組(1、30)之一第一層級(3、31)，至少一個電源半導體(4、34、35)由一嵌裝化合物(29)嵌入，其中形成電觸點，該等電觸點在該嵌裝化合物(29)已硬化之後在該第一層級(3)之一表面(26)處可接入，其中在一另一步驟中，施加一連接結構(18、19、24、51、52、53、54)，且至少一個其他組件(17、20、48、49、50)施加於該連接結構(18、19、24、51、52、53、54)上且電連接至該連接結構(18、19、24、51、52、53、54)，且該至少一個其他組件(17、20、48、49、50)被嵌裝化合物(29)包圍以便形成一第二層級(2)。
  5. 如申請專利範圍第4項之方法，其中該至少一個其他組件(17、20、48、49、50)經燒結或焊接至該連接結構(18、19、24、51、52、53、54)。
  6. 如申請專利範圍第4項或第5項之方法，其中該連接結構(18、19、24、51、52、53、54)藉助於雷射束留下軌跡並被電解地施加。
  7. 如申請專利範圍第4項或第5項之方法，其中導電金屬本體(10、11、46、47、57、67、68)形成於該至少一個電源半導體的端子與該連接結構(18、19、24、51、52、53、54)之間，該等導電金屬本體之一頂面在該第一層級在形成與該第二層級之一界面(25)的一表面(26)處之該形成之後可接入，該頂面尤其與該表面(26)平齊地終止或突出，其中該連接結構(18、19、24、51、52、53、54)電連接至該等導電金屬本體(10、11、46、47、57、67、68)。
  8. 如申請專利範圍第7項之方法，其中在該第一層級(3)已硬化之後，產生一切口(66)，該切口延伸遠至該至少一個電源半導體(34)之該端子 (64、42)，且一導電金屬本體(57、67)，尤其經由觸點自該端子(64、42)直至該界面(25)而產生。
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