TWI734376B - 皮料與布料結合之鞋材料製程及其所製成之鞋材料 - Google Patents

皮料與布料結合之鞋材料製程及其所製成之鞋材料 Download PDF

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TWI734376B
TWI734376B TW109104198A TW109104198A TWI734376B TW I734376 B TWI734376 B TW I734376B TW 109104198 A TW109104198 A TW 109104198A TW 109104198 A TW109104198 A TW 109104198A TW I734376 B TWI734376 B TW I734376B
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leather
cloth
shoe material
manufacturing process
adhesive layer
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TW202130518A (zh
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洪溢駿
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豐泰企業股份有限公司
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Priority to US17/118,243 priority patent/US20210246520A1/en
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    • A43BCHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
    • A43B23/00Uppers; Boot legs; Stiffeners; Other single parts of footwear
    • A43B23/02Uppers; Boot legs
    • A43B23/0205Uppers; Boot legs characterised by the material
    • A43B23/0235Different layers of different material
    • CCHEMISTRY; METALLURGY
    • C14SKINS; HIDES; PELTS; LEATHER
    • C14BMECHANICAL TREATMENT OR PROCESSING OF SKINS, HIDES OR LEATHER IN GENERAL; PELT-SHEARING MACHINES; INTESTINE-SPLITTING MACHINES
    • C14B1/00Manufacture of leather; Machines or devices therefor
    • C14B1/02Fleshing, unhairing, samming, stretching-out, setting-out, shaving, splitting, or skiving skins, hides, or leather
    • AHUMAN NECESSITIES
    • A43FOOTWEAR
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    • A43B23/02Uppers; Boot legs
    • A43B23/0205Uppers; Boot legs characterised by the material
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    • A43B23/02Uppers; Boot legs
    • A43B23/0205Uppers; Boot legs characterised by the material
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    • A43B23/02Uppers; Boot legs
    • A43B23/0245Uppers; Boot legs characterised by the constructive form
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Abstract

一種皮料與布料結合之鞋材料製程及其所製成之鞋材料,製程包含有:a)材料準備:準備布料和皮料;b)皮料處理:削皮處理:該皮料具有正面和背面,削去皮料正面之部分形成接合區;c)上膠:將第一熱熔膠層設置在接合區或是布料;d)上TPU膜:TPU膜,具有第二熱熔膠層;將TPU膜蓋設於接合區和布料,使得該膠層接觸接合區和布料組合成鞋材料;以及e)熱熔接:將鞋材料放置在治具,再蓋上矽膠墊進入熱壓機壓合。藉此,可較車縫製程節省時間。而,鞋材料包含布料;皮料;第一熱熔膠層,設置在該皮料或是該布料;以及TPU膜,具有第二熱熔膠層,該TPU膜蓋設於該皮料和該布料,該膠層接觸該皮料和該布料。藉此,避免接著劑外溢問題。

Description

皮料與布料結合之鞋材料製程及其所製成之鞋材料
本發明係與鞋材料有關,特別是指一種皮料與布料結合之鞋材料製程及其所製成之鞋材料。
隨著時代的發展,人們對於鞋子的看法,已經從只是人們移動所需穿戴的用具,漸漸地轉化到時尚潮流的配件之一。因此,製鞋廠商對於鞋材料的需求也開始產生多樣化及複合化的發展。例如,傳統的認知中,運動鞋多採用布料為主要製鞋材料,而傳統的休閒鞋則多以皮料為主要製料,而時至今日,則有採用皮料與布料結合,或是人造皮料與布料結合的鞋材料製作鞋產品的運用。
然而,目前採用皮料與布料結合,或是人造皮料與布料結合的鞋材料,多是以車縫結合方式,此種製作方式耗時且成品表面會顯露出車縫線。此外,也可以運用熱熔接製程,其係在布料上施以接著劑,再將皮料熱壓熔接。不過,此種方式雖然較車縫方式省時,但是除了需依照不同種類布料挑選接著劑之外,還為了確保皮料和布料可以緊密貼合,須讓布料上的佈膠區域大於布料與皮料的黏合區域,使得熔接完成的產品表面顯露接著劑,產生接著劑外溢問題,影響成品外觀。
本發明之主要目的,乃在於提供一種皮料與布料結合之鞋材料製程及其所製成之鞋材料,其鞋材料製程可較車縫製程節省時間,所製成之鞋材料可以避免接著劑外溢問題。
緣是,依據本發明所提供之一種皮料與布料結合之鞋材料製程,包含有:a)材料準備:準備一布料和一皮料;b)皮料處理:削皮處理:該皮料具有一正面和一背面,削去該皮料正面之部分形成一接合區;c)上膠:將一第一熱熔膠層設置該皮料背面或是該布料;d)上TPU (Thermoplastic polyurethane)膜:一TPU膜,具有一第二熱熔膠層;將該TPU膜蓋設於該接合區和該布料,使得該第二熱熔膠層接觸該接合區和該布料組合成一鞋材料;以及e)熱熔接:將該鞋材料放置在一治具,再蓋上一矽膠墊進入一熱壓機壓合。藉此,可較車縫製程節省鞋材料的製作時間。
須說明的是,該皮料處理步驟裡的該削皮處理中,該皮料之接合區的厚度不低於0.4公厘。此為皮料接合強度上的考量。
此外,該削皮處理之後更有一添加處理劑步驟,係將一處理劑施加於該皮料之背面和該接合區,讓處理劑能夠填充被削皮的區域,使削皮後的粗糙表面都塗佈有處理劑,以利後續貼合的步驟。在本發明中,適合的處理劑包括:南寶樹脂化學工廠股份有限公司所生產的NP99、 NP200、71KMN、111GN、122 KN、UE-31。
而且,更好的是在該削皮處理之前,更有一片皮處理,係將該皮料背面片薄。其中,該片皮處理讓該皮料厚度不低於0.8公厘,以便後續加工製程所需。
另外,值得一提的是在步驟e)中,該矽膠墊厚度約8公厘。此係為確保熱壓合效果。
還有,在步驟e)中,該熱壓合機的熱壓合條件為壓合溫度攝氏150-170度、壓合壓力25-30公斤/平方公分、壓合時間30-50秒。在此條件下,確保鞋材料熱壓合效果。
此外,更包含一步驟f) 冷壓定型:將經過步驟e)熱熔接的該鞋材料放入一冷壓機壓合定型。其中:在步驟f)中,該壓合機的冷壓合條件為壓合壓力15-20公斤/平方公分、壓合時間15-30秒。
本發明還提供一種鞋材料包含有:一布料;一皮料;一第一熱熔膠層,設置在該皮料或是該布料;以及一TPU膜,具有一第二熱熔膠層,該TPU膜蓋設於該皮料和該布料,該熱熔膠層接觸該皮料和該布料。藉此,採用第一熱熔膠層和第二熱熔膠層固接材料的效果,可避免接著劑外溢問題。
值得一提的是,其中:該皮料具有一正面和一背面;該皮料正面被削去部分形成一接合區,該TPU膜,蓋設於該接合區和該布料,該膠層接觸該接合區和該布料。如此一來,可以加強鞋材料的結構強度,較不易產生脫膠。
為了詳細說明本發明之技術特點所在,茲舉以下之較佳實施例並配合圖式說明如後,其中:
如圖1、3所示,本發明第一較佳實施例所提供之一種皮料與布料結合之鞋材料製程,主要包含以下步驟:
a)材料準備:準備一布料11和一皮料21。
b)皮料處理:削皮處理:該皮料具有一正面211和一背面212,削去該皮料正面211之部分形成一接合區213。該正面211在本實施例中為該皮料21要與其他材料結合的表面。而該接合區213,若以天然皮革為例,則係將皮料21的表皮層削去而露出真皮層的部分。此舉,係去除油脂含量高的表皮層,露出接合能力較表皮層佳的真皮層,以提升皮料接合後的強度。須說明的是,該皮料處理步驟裡的該削皮處理中,該皮料21之接合區213的厚度不低於0.4公厘,此為皮料接合強度上的考量所需要的皮料厚度條件。
此外,還可以選擇讓該削皮處理之後,更有一添加處理劑的步驟,係將一處理劑施加於該皮料21。該處理劑可以是水性或是油性,考量施作便利性,以水性為佳。
另外,更好的是在進行該削皮處理之前,選擇更有一片皮處理,係將該皮料21背面片薄。其中,該片皮處理讓該皮料21厚度不低於0.8公厘,以便後續加工製程所需。
c)上膠:將一第一熱熔膠層214設置該皮料21背面212或是該布料11,用來將該皮料21和該布料11固接在一起。
d)上TPU (Thermoplastic polyurethane)膜:一TPU膜31,具有一第二熱熔膠層311。將該TPU膜31蓋設於該接合區213和該布料11,使得該第二熱熔膠層311接觸該接合區213和該布料11組合成一鞋材料。以及
e)熱熔接:將該鞋材料放置在一治具,再蓋上一壓墊進入一熱壓機壓合。完成該鞋材料的製作過程。值得一提的是,在本實施例中該壓墊為矽膠壓墊,該矽膠壓墊厚度約8公厘。此係為確保熱壓合效果。該熱壓合機的熱壓合條件為壓合溫度攝氏150-170度、壓合壓力25-30公斤/平方公分、壓合時間30-50秒。在此條件下,確保鞋材料熱壓合效果。
藉此,可較車縫製程節省鞋材料的製作時間。
另外,為了確保熱壓合效果,可以選擇地更包含一步驟f) 冷壓定型:將經過步驟e)熱熔接的該鞋材料放入一冷壓機壓合定型。其中:在步驟f)中,該壓合機的冷壓合條件為壓合壓力15-20公斤/平方公分、壓合時間15-30秒。
請參閱圖2,本發明第二實施例提供一種鞋材料,包含有:一布料11、一皮料21、一第一熱熔膠層214以及一TPU膜31。
該第一熱熔膠層214設置在該皮料21或是該布料11。
該TPU膜31,具有一第二熱熔膠層311,該TPU膜31蓋設於該皮料21和該布料11,該第二熱熔膠層311接觸該皮料和該布料。
藉此,採用第一熱熔膠層214和第二熱熔膠層311固接材料的效果,可避免接著劑外溢問題。
值得一提的是,請參閱圖3,本發明第三實施例提供一種鞋材料:該皮料21具有一正面211和一背面212。該皮料21正面211被削去部分形成一接合區213。該TPU膜31,蓋設於該接合區213和該布料11,該第二熱熔膠層311接觸該接合區213和該布料11。如此一來,可以加強鞋材料的結構強度。
10:鞋材料
11:布料
21:皮料
211:正面
212:背面
213:接合區
214:第一熱熔膠層
31:TPU膜
311:第二熱熔膠層
第1圖係本發明第一較佳實施例之流程方塊圖。 第2圖係本發明第二較佳實施例之剖面示意圖。 第3圖係本發明第三較佳實施例之剖面示意圖。

Claims (12)

  1. 一種皮料與布料結合之鞋材料製程,包含有: a)    材料準備: 準備一布料和一皮料; b)    皮料處理: 削皮處理:該皮料具有一正面和一背面,削去該皮料正面之部分形成一接合區; c)    上膠:將一第一熱熔膠層設置該皮料背面或是該布料; d)    上TPU (Thermoplastic polyurethane)膜:一TPU膜,具有一第二熱熔膠層;將該TPU膜蓋設於該接合區和該布料,使得該第二熱熔膠層接觸該接合區和該布料組合成一鞋材料;以及 e)    熱熔接:將該鞋材料放置在一治具,再蓋上一壓墊進入一熱壓機壓合。
  2. 依據申請專利範圍第1項之皮料與布料結合之鞋材料製程,其中:該皮料處理步驟裡的該削皮處理中,該皮料之接合區的厚度不低於0.4公厘。
  3. 依據申請專利範圍第1項之皮料與布料結合之鞋材料製程,其中:該壓墊係為矽膠壓墊。
  4. 依據申請專利範圍第1項之皮料與布料結合之鞋材料製程,其中:該削皮處理之後更有一添加處理劑步驟,係將一處理劑施加於該皮料之背面和該接合區。
  5. 依據申請專利範圍第1項之皮料與布料結合之鞋材料製程,其中:在該削皮處理之前,更有一片皮處理,係將該皮料背面片薄。
  6. 依據申請專利範圍第5項之皮料與布料結合之鞋材料製程,其中:該片皮處理讓該皮料厚度不低於0.8公厘。
  7. 依據申請專利範圍第1項之皮料與布料結合之鞋材料製程,其中:在步驟e)中,該矽膠墊厚度約8公厘。
  8. 依據申請專利範圍第1項之皮料與布料結合之鞋材料製程,其中:在步驟e)中,該熱壓合機的熱壓合條件為壓合溫度攝氏150-170度、壓合壓力25-30公斤/平方公分、壓合時間30-50秒。
  9. 依據申請專利範圍第1項之皮料與布料結合之鞋材料製程,其中:更包含一步驟f) 冷壓定型:將經過步驟e)熱熔接的該鞋材料放入一冷壓機壓合定型。
  10. 依據申請專利範圍第9項之皮料與布料結合之鞋材料製程,其中:在步驟f)中,該壓合機的冷壓合條件為壓合壓力15-20公斤/平方公分、壓合時間15-30秒。
  11. 一種皮料與布料結合之鞋材料,包含有: 一布料; 一皮料; 一第一熱熔膠層,設置在該皮料或是該布料;以及 一TPU膜,具有一第二熱熔膠層,該TPU膜蓋設於該皮料和該布料,該第二熱熔膠層接觸該皮料和該布料。
  12. 依據申請專利範圍第11項之皮料與布料結合之鞋材料,其中:該皮料具有一正面;該皮料正面被削去部分形成一接合區,該TPU膜,蓋設於該接合區和該布料,該第二熱熔膠層接觸該接合區和該布料。
TW109104198A 2020-02-11 2020-02-11 皮料與布料結合之鞋材料製程及其所製成之鞋材料 TWI734376B (zh)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203262416U (zh) * 2013-05-03 2013-11-06 阿瘦实业股份有限公司 具有减压吸震记忆垫体的鞋垫改良结构
CN209644016U (zh) * 2019-01-28 2019-11-19 福建小爱科技有限公司 一种增强后跟安定的运动鞋垫

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203262416U (zh) * 2013-05-03 2013-11-06 阿瘦实业股份有限公司 具有减压吸震记忆垫体的鞋垫改良结构
CN209644016U (zh) * 2019-01-28 2019-11-19 福建小爱科技有限公司 一种增强后跟安定的运动鞋垫

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