TWI732746B - 異向性導電膜之製造方法 - Google Patents

異向性導電膜之製造方法 Download PDF

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Publication number
TWI732746B
TWI732746B TW104137995A TW104137995A TWI732746B TW I732746 B TWI732746 B TW I732746B TW 104137995 A TW104137995 A TW 104137995A TW 104137995 A TW104137995 A TW 104137995A TW I732746 B TWI732746 B TW I732746B
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Taiwan
Prior art keywords
conductive particles
conductive
anisotropic conductive
conductive film
base layer
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TW104137995A
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English (en)
Chinese (zh)
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TW201638970A (zh
Inventor
阿久津恭志
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日商迪睿合股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
TW104137995A 2014-11-17 2015-11-17 異向性導電膜之製造方法 TWI732746B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014232934 2014-11-17
JPJP2014-232934 2014-11-17

Publications (2)

Publication Number Publication Date
TW201638970A TW201638970A (zh) 2016-11-01
TWI732746B true TWI732746B (zh) 2021-07-11

Family

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Family Applications (5)

Application Number Title Priority Date Filing Date
TW104137995A TWI732746B (zh) 2014-11-17 2015-11-17 異向性導電膜之製造方法
TW109121589A TWI733504B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW110121248A TWI785642B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW111104942A TWI862897B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW111144850A TWI863031B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體

Family Applications After (4)

Application Number Title Priority Date Filing Date
TW109121589A TWI733504B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW110121248A TWI785642B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW111104942A TWI862897B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體
TW111144850A TWI863031B (zh) 2014-11-17 2015-11-17 異向性導電膜及連接構造體

Country Status (6)

Country Link
US (4) US10026709B2 (enExample)
JP (3) JP6746898B2 (enExample)
KR (3) KR102362816B1 (enExample)
CN (5) CN114512832B (enExample)
TW (5) TWI732746B (enExample)
WO (1) WO2016080379A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI785642B (zh) * 2014-11-17 2022-12-01 日商迪睿合股份有限公司 異向性導電膜及連接構造體

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KR20170044766A (ko) * 2012-08-01 2017-04-25 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법, 이방성 도전 필름, 및 접속 구조체
KR20210082571A (ko) * 2012-08-29 2021-07-05 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그 제조 방법
CN110265843B (zh) * 2014-10-28 2021-05-11 迪睿合株式会社 各向异性导电膜
WO2017191772A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 フィラー配置フィルム
JP7274810B2 (ja) 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
WO2017191779A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 異方性導電フィルム
KR102720762B1 (ko) * 2016-09-13 2024-10-22 데쿠세리아루즈 가부시키가이샤 필러 함유 필름
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CN115746361A (zh) * 2016-10-18 2023-03-07 迪睿合株式会社 含填料膜
JP7087305B2 (ja) * 2017-04-23 2022-06-21 デクセリアルズ株式会社 フィラー含有フィルム
JP7035370B2 (ja) * 2016-10-31 2022-03-15 デクセリアルズ株式会社 フィラー含有フィルム
JP7319578B2 (ja) * 2017-04-23 2023-08-02 デクセリアルズ株式会社 フィラー含有フィルム
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CN109801888A (zh) * 2017-11-16 2019-05-24 群创光电股份有限公司 第一电子元件及包含第一电子元件的显示设备
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US20200156291A1 (en) * 2018-11-21 2020-05-21 Shin-Etsu Chemical Co., Ltd. Anisotropic film and method for manufacturing anisotropic film
TWI846756B (zh) 2018-11-21 2024-07-01 日商信越化學工業股份有限公司 異向性薄膜、及異向性薄膜的製造方法
JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
JP2024146277A (ja) 2023-03-31 2024-10-15 デクセリアルズ株式会社 フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法
KR20250156366A (ko) * 2024-04-25 2025-11-03 에이치엔에스하이텍 (주) 패턴 얼라인 정밀성을 향상시킨 이방도전성 접착필름

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US12087722B2 (en) 2014-11-17 2024-09-10 Dexerials Corporation Anisotropic electrically conductive film

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