KR102362816B1 - 이방성 도전 필름 - Google Patents

이방성 도전 필름 Download PDF

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Publication number
KR102362816B1
KR102362816B1 KR1020197018608A KR20197018608A KR102362816B1 KR 102362816 B1 KR102362816 B1 KR 102362816B1 KR 1020197018608 A KR1020197018608 A KR 1020197018608A KR 20197018608 A KR20197018608 A KR 20197018608A KR 102362816 B1 KR102362816 B1 KR 102362816B1
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South Korea
Prior art keywords
conductive particles
conductive
anisotropic conductive
conductive film
group
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KR1020197018608A
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Korean (ko)
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KR20190079707A (ko
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야스시 아쿠츠
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데쿠세리아루즈 가부시키가이샤
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Priority to KR1020227004452A priority Critical patent/KR102677632B1/ko
Publication of KR20190079707A publication Critical patent/KR20190079707A/ko
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Publication of KR102362816B1 publication Critical patent/KR102362816B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29075—Plural core members
    • H01L2224/2908—Plural core members being stacked
    • H01L2224/29082—Two-layer arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29499—Shape or distribution of the fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020197018608A 2014-11-17 2015-11-17 이방성 도전 필름 Active KR102362816B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227004452A KR102677632B1 (ko) 2014-11-17 2015-11-17 이방성 도전 필름

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014232934 2014-11-17
JPJP-P-2014-232934 2014-11-17
KR1020177006100A KR101996737B1 (ko) 2014-11-17 2015-11-17 이방성 도전 필름
PCT/JP2015/082221 WO2016080379A1 (ja) 2014-11-17 2015-11-17 異方性導電フィルム

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020177006100A Division KR101996737B1 (ko) 2014-11-17 2015-11-17 이방성 도전 필름

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227004452A Division KR102677632B1 (ko) 2014-11-17 2015-11-17 이방성 도전 필름

Publications (2)

Publication Number Publication Date
KR20190079707A KR20190079707A (ko) 2019-07-05
KR102362816B1 true KR102362816B1 (ko) 2022-02-15

Family

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Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020197018608A Active KR102362816B1 (ko) 2014-11-17 2015-11-17 이방성 도전 필름
KR1020177006100A Active KR101996737B1 (ko) 2014-11-17 2015-11-17 이방성 도전 필름
KR1020227004452A Active KR102677632B1 (ko) 2014-11-17 2015-11-17 이방성 도전 필름

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020177006100A Active KR101996737B1 (ko) 2014-11-17 2015-11-17 이방성 도전 필름
KR1020227004452A Active KR102677632B1 (ko) 2014-11-17 2015-11-17 이방성 도전 필름

Country Status (6)

Country Link
US (4) US10026709B2 (enExample)
JP (3) JP6746898B2 (enExample)
KR (3) KR102362816B1 (enExample)
CN (5) CN112421262B (enExample)
TW (5) TWI733504B (enExample)
WO (1) WO2016080379A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170044766A (ko) 2012-08-01 2017-04-25 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법, 이방성 도전 필름, 및 접속 구조체
US10412837B2 (en) * 2012-08-29 2019-09-10 Dexerials Corporation Anisotropic conductive film and method of producing the same
KR102240963B1 (ko) * 2014-10-28 2021-04-16 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 그 제조 방법, 및 접속 구조체
CN112421262B (zh) * 2014-11-17 2023-06-20 迪睿合株式会社 各向异性导电膜、连接结构体及其制造方法
WO2017191779A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 異方性導電フィルム
JP7274810B2 (ja) * 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
WO2017191772A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 フィラー配置フィルム
KR102720762B1 (ko) * 2016-09-13 2024-10-22 데쿠세리아루즈 가부시키가이샤 필러 함유 필름
JP7081097B2 (ja) * 2016-09-13 2022-06-07 デクセリアルズ株式会社 フィラー含有フィルム
US20200299474A1 (en) * 2016-10-18 2020-09-24 Dexerials Corporation Filler-containing film
WO2018074318A1 (ja) * 2016-10-18 2018-04-26 デクセリアルズ株式会社 フィラー含有フィルム
JP7087305B2 (ja) * 2017-04-23 2022-06-21 デクセリアルズ株式会社 フィラー含有フィルム
JP7035370B2 (ja) * 2016-10-31 2022-03-15 デクセリアルズ株式会社 フィラー含有フィルム
JP7319578B2 (ja) * 2017-04-23 2023-08-02 デクセリアルズ株式会社 フィラー含有フィルム
US20190100663A1 (en) * 2017-10-03 2019-04-04 Shin-Etsu Chemical Co., Ltd. Anisotropic conductive film and method for manufacturing anisotropic conductive film
CN109801888A (zh) 2017-11-16 2019-05-24 群创光电股份有限公司 第一电子元件及包含第一电子元件的显示设备
FR3080427B1 (fr) 2018-04-24 2020-04-03 Faurecia Systemes D'echappement Vanne pour une ligne d'echappement
US20200156291A1 (en) * 2018-11-21 2020-05-21 Shin-Etsu Chemical Co., Ltd. Anisotropic film and method for manufacturing anisotropic film
JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
JP2024146277A (ja) 2023-03-31 2024-10-15 デクセリアルズ株式会社 フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法
KR20250156366A (ko) * 2024-04-25 2025-11-03 에이치엔에스하이텍 (주) 패턴 얼라인 정밀성을 향상시킨 이방도전성 접착필름

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003286457A (ja) 2002-03-28 2003-10-10 Asahi Kasei Corp 異方導電性接着シートおよびその製造方法
JP2014063729A (ja) 2012-08-29 2014-04-10 Dexerials Corp 異方性導電フィルム及びその製造方法

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1512525A (en) * 1921-01-25 1924-10-21 George W Davis Valve for internal-combustion engines
DE3486101T2 (de) * 1983-10-14 1993-07-01 Hitachi Chemical Co Ltd Anisotrop elektrisch leitender klebefilm und verfahren zum verbinden von schaltungen unter dessen anwendung.
JPH0582199A (ja) 1991-05-28 1993-04-02 Minato Electron Kk 異方導電性コネクタを有するコネクタ配置構造および異方導電性コネクタ
JPH0513119A (ja) 1991-07-04 1993-01-22 Sharp Corp 電子部品接続用テープコネクタ
JPH0645024A (ja) * 1992-07-22 1994-02-18 Hitachi Chem Co Ltd 異方導電性接着フィルム
US5372750A (en) * 1992-09-11 1994-12-13 Johnson Service Company Electrically conductive screen printable compositions and method of making the same
JP3472987B2 (ja) * 1993-01-29 2003-12-02 日立化成工業株式会社 接続部材の製造法及びその製造装置
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
JP3103956B2 (ja) * 1993-06-03 2000-10-30 ソニーケミカル株式会社 異方性導電膜
TW277152B (enExample) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
JPH09320345A (ja) 1996-05-31 1997-12-12 Whitaker Corp:The 異方導電性フィルム
US20010008169A1 (en) 1998-06-30 2001-07-19 3M Innovative Properties Company Fine pitch anisotropic conductive adhesive
JP2000129218A (ja) * 1998-10-26 2000-05-09 Nitto Denko Corp シート状接着剤組成物およびそれを用いた電子部品装置ならびにそのリペアー方法
CN100360597C (zh) * 2000-12-08 2008-01-09 积水化学工业株式会社 绝缘基材的原料及由其生产的制品
CN1246932C (zh) * 2001-02-09 2006-03-22 Jsr株式会社 各向异性导电性连接器、其制造方法以及探针构件
JP2002270099A (ja) * 2001-03-07 2002-09-20 Sony Corp 平面型表示装置におけるノッキング処理方法、及び、平面型表示装置用基板におけるノッキング処理方法
JP3847227B2 (ja) * 2001-10-02 2006-11-22 日本碍子株式会社 コンタクトシート
DE10164494B9 (de) * 2001-12-28 2014-08-21 Epcos Ag Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung
JP3994335B2 (ja) * 2002-10-04 2007-10-17 日立化成工業株式会社 接続部材の製造方法
DE60335074D1 (de) * 2002-12-27 2011-01-05 Panasonic Corp Kondensator und Verfahren zu dessen Herstellung, und Leiterplatte mit einem eingebauten Kondensator und Verfahren zu deren Herstellung
JP3753145B2 (ja) * 2003-04-21 2006-03-08 Ｊｓｒ株式会社 異方導電性シートおよびその製造方法、アダプター装置およびその製造方法並びに回路装置の電気的検査装置
JP2004335663A (ja) * 2003-05-06 2004-11-25 Sumitomo Bakelite Co Ltd 異方導電フィルムの製造方法
EP1633019B1 (en) * 2003-06-12 2012-09-05 JSR Corporation Anisotropc conductive connector device and production method therefor and circuit device inspection device
JP2005019274A (ja) * 2003-06-27 2005-01-20 Sumitomo Bakelite Co Ltd 異方導電フィルムの製造方法
US20070175579A1 (en) 2003-12-04 2007-08-02 Asahi Kasei Emd Corporation Anisotropic conductive adhesive sheet and connecting structure
JP2005209454A (ja) * 2004-01-21 2005-08-04 Sumitomo Bakelite Co Ltd 異方導電フィルムの製造方法
US20060024551A1 (en) * 2004-02-20 2006-02-02 Nuvant Systems, Inc. Array fuel cell reactors with a switching system
JP2006024551A (ja) * 2004-06-11 2006-01-26 Sumitomo Bakelite Co Ltd 異方導電フィルムの製造方法
JP2006049783A (ja) 2004-06-29 2006-02-16 Yuji Suda 異方性導電接着フィルムの製造方法と電極接続方法
TWI472037B (zh) * 2005-01-28 2015-02-01 半導體能源研究所股份有限公司 半導體裝置，電子裝置，和半導體裝置的製造方法
TWI569441B (zh) * 2005-01-28 2017-02-01 半導體能源研究所股份有限公司 半導體裝置，電子裝置，和半導體裝置的製造方法
US8802214B2 (en) * 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
JP2007115560A (ja) * 2005-10-21 2007-05-10 Sumitomo Bakelite Co Ltd 異方導電フィルム及びその製造方法
JP2008153626A (ja) * 2006-11-21 2008-07-03 Fujifilm Corp 光導電体および放射線検出器並びに放射線撮像パネル
WO2008117513A1 (ja) * 2007-03-23 2008-10-02 Panasonic Corporation 導電性バンプとその製造方法および電子部品実装構造体
JP4880533B2 (ja) * 2007-07-03 2012-02-22 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電膜及びその製造方法、並びに接合体
JP2009152160A (ja) * 2007-12-25 2009-07-09 Tokai Rubber Ind Ltd 粒子転写型およびその製造方法、粒子転写膜の製造方法ならびに異方性導電膜
JP2010033793A (ja) 2008-07-28 2010-02-12 Tokai Rubber Ind Ltd 粒子転写膜の製造方法
JPWO2010027017A1 (ja) * 2008-09-05 2012-02-02 住友ベークライト株式会社 導電接続材料およびそれを用いた端子間の接続方法ならびに接続端子の製造方法
WO2011091717A1 (en) * 2010-01-29 2011-08-04 The Hong Kong University Of Science And Technology Architectural pattern detection and modeling in images
TWM393834U (en) * 2010-03-18 2010-12-01 Hon Hai Prec Ind Co Ltd Electrical connector and assembly thereof
US20120295098A1 (en) 2011-05-19 2012-11-22 Trillion Science, Inc. Fixed-array anisotropic conductive film using surface modified conductive particles
CN103636068B (zh) * 2011-07-07 2017-09-08 日立化成株式会社 电路连接材料和电路基板的连接结构体
KR102208591B1 (ko) 2012-08-24 2021-01-27 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법 및 이방성 도전 필름
JP5972844B2 (ja) * 2012-09-18 2016-08-17 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法
JP2014065765A (ja) * 2012-09-24 2014-04-17 Dexerials Corp 異方性導電接着剤
CN103903683A (zh) * 2012-12-28 2014-07-02 鸿富锦精密工业（深圳）有限公司 各向异性导电膜及其制备方法
JP2015018209A (ja) * 2013-04-12 2015-01-29 株式会社リコー 記録媒体、画像記録装置、画像記録セット
CN105143923B (zh) * 2013-04-17 2018-03-09 国立研究开发法人科学技术振兴机构 光子晶体以及利用该光子晶体的光学功能设备
JP6289831B2 (ja) * 2013-07-29 2018-03-07 デクセリアルズ株式会社 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
JP6581331B2 (ja) * 2013-07-29 2019-09-25 デクセリアルズ株式会社 導電性接着フィルムの製造方法、接続体の製造方法
JP2015149451A (ja) * 2014-02-07 2015-08-20 デクセリアルズ株式会社 アライメント方法、電子部品の接続方法、接続体の製造方法、接続体、異方性導電フィルム
US9556640B2 (en) * 2014-04-25 2017-01-31 Designer Direct, Inc. Cantilevered watercraft canopy
CN105013119A (zh) 2014-05-01 2015-11-04 白希安 可盘卷输送管
JP2016029698A (ja) * 2014-07-22 2016-03-03 デクセリアルズ株式会社 接続体、及び接続体の製造方法
JP6476747B2 (ja) * 2014-10-28 2019-03-06 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
JP6661969B2 (ja) * 2014-10-28 2020-03-11 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
KR102240963B1 (ko) * 2014-10-28 2021-04-16 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 그 제조 방법, 및 접속 구조체
WO2016068083A1 (ja) * 2014-10-31 2016-05-06 デクセリアルズ株式会社 異方性導電フィルム
CN112421262B (zh) * 2014-11-17 2023-06-20 迪睿合株式会社 各向异性导电膜、连接结构体及其制造方法
WO2016148075A1 (ja) * 2015-03-13 2016-09-22 浜松ホトニクス株式会社 半導体発光素子
JP7095227B2 (ja) * 2016-05-05 2022-07-05 デクセリアルズ株式会社 異方性導電フィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003286457A (ja) 2002-03-28 2003-10-10 Asahi Kasei Corp 異方導電性接着シートおよびその製造方法
JP2014063729A (ja) 2012-08-29 2014-04-10 Dexerials Corp 異方性導電フィルム及びその製造方法

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