TWI730763B - Suction plate, cutting apparatus, and cutting method - Google Patents

Suction plate, cutting apparatus, and cutting method Download PDF

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Publication number
TWI730763B
TWI730763B TW109115979A TW109115979A TWI730763B TW I730763 B TWI730763 B TW I730763B TW 109115979 A TW109115979 A TW 109115979A TW 109115979 A TW109115979 A TW 109115979A TW I730763 B TWI730763 B TW I730763B
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suction
base
ribs
frame
suction plate
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TW109115979A
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TW202042971A (en
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宮田和志
高森雄大
尾関貴俊
礒野早織
黄善夏
藤原直己
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日商Ｔｏｗａ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D79/00—Methods, machines, or devices not covered elsewhere, for working metal by removal of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042—Devices for removing chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/018—Holding the work by suction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Jigs For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

吸附板（10）包括：底座部（15），具有框部（16）及多個凸肋部（17A、17B）；以及載置部（12），以重合於多個凸肋部（17A、17B）的方式而配置且形成有多個吸附孔（12H），多個凸肋部（17A、17B）彼此交叉的部分的一部分朝向基台（21）所配置的一側突出。The suction plate (10) includes: a base portion (15) with a frame portion (16) and a plurality of ribs (17A, 17B); and a placement portion (12) to overlap the plurality of ribs (17A, 17B) 17B), a plurality of suction holes (12H) are formed, and a part of the intersecting portion of the plurality of ribs (17A, 17B) protrudes toward the side where the base (21) is arranged.

Description

吸附板、切斷裝置以及切斷方法Adsorption plate, cutting device and cutting method

本發明是有關於一種吸附板（plate）、切斷裝置以及切斷方法。The invention relates to an adsorption plate, a cutting device and a cutting method.

如下述日本專利特開2016-040060號公報所公開的那樣，已知有一種切斷裝置，其將已密封基板在吸附於吸附夾具上的狀態下予以切斷。已密封基板例如是包含印刷基板或引線框架（lead frame）等的基板，呈格子狀地假想地劃分有與各個電子零件對應的多個區域。通過切斷裝置將已密封基板切斷成各個區域單位而單片化的部分成為電子零件。As disclosed in the following Japanese Patent Laid-Open No. 2016-040060, there is known a cutting device that cuts a sealed substrate while being sucked on a suction jig. The sealed substrate is, for example, a substrate including a printed circuit board, a lead frame, or the like, and a plurality of regions corresponding to each electronic component are virtually divided in a grid shape. The sealed substrate is cut into individual area units by the cutting device and the singulated part becomes an electronic component.

近年來，電子零件的尺寸存在逐漸變小的傾向。吸附電子零件的吸附板（相當於日本專利特開2016-040060號公報的吸附夾具及蜂窩（honeycomb）板（支撐部））與電子零件的接觸面積也變小，伴隨於此，吸附電子零件的吸附孔的大小也變小，從而難以使吸附力作用於各個電子零件。為了獲得更大的吸附力，考慮擴大吸附板內所設的抽吸通路，但擴大抽吸通路會導致吸附板的剛性下降。In recent years, the size of electronic components has a tendency to gradually become smaller. The contact area between the suction plate (equivalent to the suction jig and honeycomb plate (supporting part) of Japanese Patent Laid-Open No. 2016-040060) and the electronic parts is also reduced. Accompanying this, the suction of electronic parts The size of the suction hole also becomes smaller, making it difficult for the suction force to act on each electronic component. In order to obtain a greater suction force, it is considered to expand the suction passage provided in the suction plate, but expanding the suction passage will cause the rigidity of the suction plate to decrease.

若吸附板的剛性下降，則在切斷加工時，吸附板容易受到伴隨切斷的應力而發生撓曲等變形。若吸附板發生撓曲等變形，則難以將切斷對象物以高精度予以切斷，從而經產品化的電子零件難以獲得高品質。If the rigidity of the suction plate decreases, the suction plate is likely to be deformed such as bending due to the stress accompanying the cutting during the cutting process. If the suction plate is deformed such as deflection, it is difficult to cut the object to be cut with high precision, and it is difficult to obtain high-quality electronic components that are commercialized.

本說明書的目的在於公開一種具備即使受到應力也難以發生撓曲等變形的結構的吸附板、具備此種吸附板的切斷裝置、以及使用此種吸附板來進行切斷的切斷方法。The purpose of this specification is to disclose an adsorption plate provided with a structure that is difficult to deform such as bending even when subjected to stress, a cutting device provided with such an adsorption plate, and a cutting method for cutting using such an adsorption plate.

本說明書所公開的吸附板包括：底座部，具有框部及多個凸肋部，且以多個所述凸肋部彼此交叉的方式而配置成格子狀，所述框部配置在設有抽吸機構的切斷裝置的基台上，所述多個凸肋部設在所述框部的內側；以及載置部，以重合於所述多個凸肋部的方式而配置，且形成有從表面側貫穿至背面側的多個吸附孔，通過所述多個凸肋部，在所述框部的所述內側形成有使所述抽吸機構與所述多個吸附孔連通的多個進氣路徑，在所述載置部的所述背面以覆蓋所述多個進氣路徑的方式而配置的狀態下，載置於所述表面上的切斷對象物通過所述吸附孔中產生的負壓而被吸附在所述表面上，多個所述凸肋部彼此交叉的部分的一部分朝向所述基台所配置的一側突出。The suction plate disclosed in this specification includes a base portion having a frame portion and a plurality of ribs, and is arranged in a lattice shape such that the plurality of ribs intersect each other, and the frame portion is arranged where the pump is provided. On the base of the cutting device of the suction mechanism, the plurality of ribs are provided on the inner side of the frame; and the placement portion is arranged so as to overlap the plurality of ribs, and is formed with A plurality of suction holes penetrating from the front side to the back side, through the plurality of ribs, are formed on the inner side of the frame portion to connect the suction mechanism with the plurality of suction holes In the air intake path, in a state where the back surface of the mounting portion is arranged so as to cover the plurality of air intake paths, the object to be cut placed on the surface is generated through the suction hole The negative pressure is adsorbed on the surface, and a part of the portion where the plurality of ribs intersect each other protrudes toward the side where the base is arranged.

本說明書所公開的切斷裝置包括：基台，設有抽吸機構；以及本說明書所公開的所述吸附板，被配置在所述基台上。The cutting device disclosed in this specification includes: a base provided with a suction mechanism; and the suction plate disclosed in this specification is arranged on the base.

本說明書所公開的切斷方法包括下述步驟：使切斷對象物吸附在本說明書所公開的所述吸附板上；以及將所述切斷對象物在被吸附於所述吸附板上的狀態下予以切斷。The cutting method disclosed in this specification includes the following steps: adsorbing a cutting object on the suction plate disclosed in this specification; and holding the cutting object in a state of being adsorbed on the suction plate To be cut off.

本發明的所述及其他目的、特徵、方面及優點，當根據與附圖關聯地理解的跟本發明相關的接下來的詳細說明而明確。The above and other objects, features, aspects and advantages of the present invention will be clarified from the following detailed description of the present invention understood in conjunction with the accompanying drawings.

以下，一邊參照附圖，一邊說明實施方式。在以下的說明中，對於相同的零件及相當的零件標注相同的參照編號，且有時不再重複其說明。Hereinafter, the embodiments will be described with reference to the drawings. In the following description, the same reference numbers are assigned to the same parts and equivalent parts, and the descriptions may not be repeated in some cases.

[切斷裝置50（切斷方法）] 圖1是示意性地表示實施方式中的切斷裝置50的圖。切斷裝置50包括供給單元A、切斷單元B、檢查單元C及收容單元D。供給單元A具備閘盒（magazine），收容有多個已密封基板1。供給單元A具有供給機構30，作為切斷對象物的已密封基板1從供給機構30被搬送至切斷單元B。[Cutting device 50 (cutting method)] FIG. 1 is a diagram schematically showing a cutting device 50 in the embodiment. The cutting device 50 includes a supply unit A, a cutting unit B, an inspection unit C, and a storage unit D. The supply unit A is equipped with a magazine and accommodates a plurality of sealed substrates 1. The supply unit A has a supply mechanism 30, and the sealed substrate 1 as a cutting object is transported from the supply mechanism 30 to the cutting unit B.

在切斷單元B設有切斷用平臺2。切斷用平臺2包括移動機構31、旋轉機構32及吸附板10。吸附板10在吸附保持有已密封基板1的基板面的狀態下，能夠通過移動機構31及旋轉機構32來移動及轉動。切斷單元B具有搬送部33與切斷部34。在搬送部33設有攝像機35，基於攝像機35的拍攝結果，在已密封基板1上呈格子狀地設定多條切斷線L（參照圖2）。吸附板10上的已密封基板1被移送至切斷部34。吸附板10上的已密封基板1在經切斷部34切斷後，經由第一清潔器（cleaner）36而返回切斷前的原本位置。另外，圖1的切斷用平臺2圖示了移送前的位置與移送後的切斷位置這兩者。吸附板10在切斷前的位置有圖示，但在切斷部34的切斷位置未圖示。The cutting unit B is provided with a cutting platform 2. The cutting platform 2 includes a moving mechanism 31, a rotating mechanism 32 and a suction plate 10. The suction plate 10 can be moved and rotated by the moving mechanism 31 and the rotating mechanism 32 in a state in which the substrate surface of the sealed substrate 1 is adsorbed and held. The cutting unit B has a conveying unit 33 and a cutting unit 34. The conveyance part 33 is provided with a camera 35, and based on the imaging result of the camera 35, a plurality of cutting lines L are set in a grid on the sealed substrate 1 (refer to FIG. 2). The sealed substrate 1 on the suction plate 10 is transferred to the cutting part 34. After the sealed substrate 1 on the suction plate 10 is cut by the cutting part 34, it returns to the original position before cutting via the first cleaner 36. In addition, the cutting platform 2 of FIG. 1 illustrates both the position before the transfer and the cutting position after the transfer. The position of the suction plate 10 before cutting is shown in the figure, but the cutting position of the cutting portion 34 is not shown.

在切斷部34，設有安裝有旋轉刀片37的主軸（spindle）3。作為切斷對象物的已密封基板1的密封面被吸附在吸附板10上，在此狀態下，一邊使吸附板10與主軸相對地移動，一邊通過旋轉刀片37來切斷已密封基板1。通過切斷，已密封基板1被單片化為多個電子零件P，通過第一清潔器36，使用水來進行清洗，並使用空氣進行乾燥。多個電子零件P從吸附板10上被統一交接給卸載器（unloader）38，在被卸載器38吸附而提起的狀態下，通過第二清潔器39來對密封面進行清洗及乾燥。The cutting part 34 is provided with a spindle 3 to which a rotating blade 37 is attached. The sealing surface of the sealed substrate 1 as the cutting object is sucked on the suction plate 10. In this state, the suction plate 10 is moved relative to the main shaft, and the sealed substrate 1 is cut by the rotary blade 37. By cutting, the sealed substrate 1 is singulated into a plurality of electronic components P, and the first cleaner 36 is used for washing with water and drying with air. The plurality of electronic components P are collectively transferred from the suction plate 10 to an unloader 38, and in a state of being sucked and lifted by the unloader 38, the sealing surface is cleaned and dried by the second cleaner 39.

在檢查單元C，設有檢查攝像機40及檢查用載台41。多個電子零件P從卸載器38被統一交接給檢查用載台41，由檢查攝像機40來進行外觀檢查。多個電子零件P被篩分為良品與不良品，隨後，被統一移送至索引平臺（index table）42。多個電子零件P由移送機構43分別收容至收容單元D的良品用托盤45及不良品用托盤46，並被移送至收容部47。從托盤供給部48供給新的托盤來作為良品用托盤45及不良品用托盤46。In the inspection unit C, an inspection camera 40 and an inspection stage 41 are provided. The plurality of electronic components P are collectively transferred from the unloader 38 to the inspection stage 41, and the inspection camera 40 performs an appearance inspection. A plurality of electronic parts P are screened into good products and defective products, and then transferred to an index table 42 in a unified manner. The plurality of electronic components P are respectively stored in the good product tray 45 and the defective product tray 46 of the storage unit D by the transfer mechanism 43 and transferred to the storage unit 47. New trays are supplied from the tray supply unit 48 as the good product tray 45 and the defective product tray 46.

（切斷裝置50的基台21） 圖2是表示已密封基板1、吸附板10與切斷裝置50的基台21的立體圖。如上所述，吸附板10在此作為切斷用平臺發揮功能。切斷裝置50包含設有抽吸機構20的基台21與吸附板10來作為其構成元件。(Base 21 of cutting device 50) FIG. 2 is a perspective view showing the base 21 of the sealed substrate 1, the suction plate 10, and the cutting device 50. As shown in FIG. As described above, the suction plate 10 functions here as a platform for cutting. The cutting device 50 includes the base 21 provided with the suction mechanism 20 and the suction plate 10 as its constituent elements.

切斷裝置50的基台21包括：框狀支撐部21A，從下方側支撐吸附板10的框部16（參照圖3）；以及多個凸狀支撐部22，設在框狀支撐部21A的內側。在框狀支撐部21A的內側形成有凹狀的抽吸空間23，多個凸狀支撐部22是以從基台21中的位於抽吸空間23下方的底面21B豎立的方式而設。抽吸空間23通過設在基台21的底面21B的開口部24而連接於抽吸機構20。The base 21 of the cutting device 50 includes: a frame-shaped support portion 21A that supports the frame portion 16 of the suction plate 10 from below (see FIG. 3); and a plurality of convex support portions 22 provided on the frame-shaped support portion 21A Inside. A concave suction space 23 is formed inside the frame-shaped support portion 21A, and a plurality of convex support portions 22 are provided to stand upright from the bottom surface 21B of the base 21 below the suction space 23. The suction space 23 is connected to the suction mechanism 20 through an opening 24 provided on the bottom surface 21B of the base 21.

[吸附板10] 圖3是表示從上表面側觀察吸附板10的分解狀態的樣子的立體圖，圖4是表示從底面側觀察吸附板10的分解狀態的樣子的立體圖。圖5是表示在切斷裝置50的基台21上配置有吸附板10的狀態的剖面圖。[Adsorption board 10] 3 is a perspective view showing how the disassembled state of the suction plate 10 is viewed from the upper surface side, and FIG. 4 is a perspective view showing how the disassembled state of the suction plate 10 is viewed from the bottom surface side. FIG. 5 is a cross-sectional view showing a state in which the suction plate 10 is arranged on the base 21 of the cutting device 50.

如圖3～圖5所示，吸附板10包括：罩11；載置部12，在其表面上載置已密封基板1；以及底座部15，用於將吸附板10固定至切斷裝置50的基台21上。吸附板10被配置在設有抽吸機構20（圖2、圖5）的切斷裝置50的基台21上。As shown in FIGS. 3 to 5, the suction plate 10 includes: a cover 11; a mounting portion 12 on which the sealed substrate 1 is placed; and a base 15 for fixing the suction plate 10 to the cutting device 50 On the abutment 21. The suction plate 10 is arranged on the base 21 of the cutting device 50 provided with the suction mechanism 20 (FIGS. 2 and 5 ).

（底座部15） 主要參照圖3，底座部15具有框部16與多個凸肋部17A、17B。框部16具有大致相同的厚度，且具有矩形狀。框部16的底面形狀對應於設在基台21的框狀支撐部21A（圖2）的形狀，框部16是由框狀支撐部21A予以支撐。(Base part 15) Referring mainly to FIG. 3, the base portion 15 has a frame portion 16 and a plurality of rib portions 17A, 17B. The frame portion 16 has substantially the same thickness and has a rectangular shape. The shape of the bottom surface of the frame portion 16 corresponds to the shape of the frame-shaped support portion 21A (FIG. 2) provided on the base 21, and the frame portion 16 is supported by the frame-shaped support portion 21A.

多個凸肋部17A、17B被設在框部16的內側。多個凸肋部17A是以沿第一方向延伸且彼此平行的方式而配置，多個凸肋部17B是以沿與第一方向交叉的第二方向彼此平行的方式而配置。在框部16配置在框狀支撐部21A上的狀態下，多個凸肋部17A、17B接觸至凸狀支撐部22（圖2）的頂面22A，多個凸肋部17A、17B由凸狀支撐部22予以支撐。A plurality of ribs 17A and 17B are provided inside the frame portion 16. The plurality of ribs 17A are arranged to extend in the first direction and be parallel to each other, and the plurality of ribs 17B are arranged to be parallel to each other in the second direction crossing the first direction. In the state where the frame portion 16 is arranged on the frame-shaped support portion 21A, the plurality of convex ribs 17A, 17B contact the top surface 22A of the convex support portion 22 (FIG. 2), and the plurality of convex ribs 17A, 17B are protruded from The shaped support portion 22 supports it.

在框部16的內側，多個凸肋部17A與多個凸肋部17B交叉，即，多個凸肋部以彼此交叉的方式配置成格子狀，通過多個凸肋部17A、17B，在框部16的內側形成有多個進氣路徑18。多個凸肋部17A、17B的上端（載置部12所配置的一側的端部）以無階差（所謂的齊平）的方式而形成（參照圖3）。On the inner side of the frame portion 16, the plurality of ribs 17A intersect with the plurality of ribs 17B, that is, the plurality of ribs are arranged in a lattice so as to cross each other, and the plurality of ribs 17A, 17B are A plurality of air intake paths 18 are formed inside the frame portion 16. The upper ends (ends on the side where the mounting portion 12 is arranged) of the plurality of ribs 17A and 17B are formed without step (so-called flush) (refer to FIG. 3 ).

另一方面，如圖4所示，在多個凸肋部17A、17B的下端（基台21所處的一側的端部）側，多個凸肋部17A、17B交叉的部分的一部分朝向基台21所配置的一側突出。換言之，當將多個凸肋部17A、17B交叉的部分作為交叉部分時，多個中的一部分交叉部分相對於與此交叉部分鄰接的凸肋部17A、凸肋部17B而朝向基台21所配置的一側（此處為下方側）突出。On the other hand, as shown in FIG. 4, on the lower end (end of the side where the base 21 is located) of the plurality of ribs 17A, 17B, a part of the intersecting portion of the plurality of ribs 17A, 17B faces The side where the base 21 is arranged protrudes. In other words, when the part where the plurality of ribs 17A, 17B intersect is taken as the intersection, a part of the intersection of the plurality of ribs 17A and 17B is facing the base 21 with respect to the ribs 17A and 17B adjacent to the intersection. One side of the configuration (here, the lower side) protrudes.

本實施方式中，在多個凸肋部17A、17B交叉的部分，形成有後退部17C及突出部17D。多個凸肋部17A、17B交叉的部分（交叉部分）的若干個構成後退部17C，多個凸肋部17A、17B交叉的部分（交叉部分）的另外若干個構成突出部17D。後退部17C形成在與設有突出部17D的交叉部分鄰接的凸肋部17A、凸肋部17B。In the present embodiment, a recessed portion 17C and a protruding portion 17D are formed at a portion where the plurality of rib portions 17A and 17B intersect. Some of the portions (intersections) where the plurality of ribs 17A and 17B intersect constitute the retreat portion 17C, and the other some of the portions (intersections) where the plurality of ribs 17A and 17B intersect constitute the protrusion 17D. The retreat portion 17C is formed in the convex rib portion 17A and the convex rib portion 17B adjacent to the intersection portion where the protrusion 17D is provided.

多個突出部17D中，各個突出部17D在突出方向上的端面17DS（圖5）與框部16的底面16S（圖5）齊平。多個後退部17C中，各個後退部17C的端面17CS（圖5）位於從框部16的底面16S朝向載置部12所配置的一側後退（偏移（offset））的位置。Among the plurality of protrusions 17D, the end surface 17DS (FIG. 5) of each protrusion 17D in the protrusion direction is flush with the bottom surface 16S (FIG. 5) of the frame portion 16. Among the plurality of retreat portions 17C, the end surface 17CS (FIG. 5) of each retreat portion 17C is located at a position retreated (offset) from the bottom surface 16S of the frame portion 16 toward the side where the placement portion 12 is arranged.

在底座部15的框部16設有環狀槽15G（圖3、圖5）。環狀槽15G包圍底座部15中的設有多個凸肋部17A、17B的區域。在環狀槽15G中，收容有作為後述的密封構件的一例的O型環11S（圖4、圖5）。作為密封構件的另一例，也可採用襯墊或墊片（gasket）。在使用襯墊或墊片的情況下，環狀槽15G為可適當省略的結構。The frame portion 16 of the base portion 15 is provided with an annular groove 15G (FIGS. 3 and 5 ). The annular groove 15G surrounds the area of the base 15 where the plurality of ribs 17A, 17B are provided. In the annular groove 15G, an O-ring 11S (FIGS. 4 and 5) as an example of a sealing member described later is accommodated. As another example of the sealing member, a gasket or a gasket may also be used. In the case of using a gasket or a gasket, the annular groove 15G has a structure that can be omitted appropriately.

包括具有如上所述的結構的框部16及多個凸肋部17A、17B的底座部15例如能夠由樹脂所形成。可較佳地利用射出成型法。底座部15也可為鋁或不銹鋼等金屬製。The base portion 15 including the frame portion 16 having the above-mentioned structure and the plurality of rib portions 17A, 17B can be formed of, for example, resin. The injection molding method can be preferably used. The base 15 may be made of metal such as aluminum or stainless steel.

（罩11） 參照圖2～圖4，罩11具有框狀的形狀。罩11既可為樹脂製，也可為鋁或不銹鋼等金屬製。罩11具有與底座部15的框部16對應的形狀，在罩11的內側設有開口部11H。罩11是使用未圖示的緊固構件或黏合構件等而固定於底座部15。也可在罩11與底座部15之間設置嵌合結構，通過此嵌合結構來將罩11固定至底座部15。而且，也可通過超聲波熔接來將罩11固定至底座部15。(Hood 11) 2 to 4, the cover 11 has a frame-like shape. The cover 11 may be made of resin, or may be made of metal such as aluminum or stainless steel. The cover 11 has a shape corresponding to the frame portion 16 of the base portion 15, and an opening 11H is provided inside the cover 11. The cover 11 is fixed to the base 15 using a fastening member, an adhesive member, or the like, which is not shown. It is also possible to provide a fitting structure between the cover 11 and the base portion 15, and the cover 11 is fixed to the base portion 15 by this fitting structure. Furthermore, the cover 11 may be fixed to the base 15 by ultrasonic welding.

（載置部12） 如圖3、圖4所示，載置部12整體上形成為薄板狀，具有表面12A、及位於表面12A的相反側的背面12B。載置部12的背面12B以重合於多個凸肋部17A、17B的上端的方式而配置。載置部12形成有從表面12A側貫穿至背面12B側的多個吸附孔12H。所述吸附孔吸附經單片化的各個電子零件。(Placement part 12) As shown in FIGS. 3 and 4, the placement portion 12 is formed in a thin plate shape as a whole, and has a front surface 12A and a back surface 12B located on the opposite side of the front surface 12A. The back surface 12B of the mounting portion 12 is arranged so as to overlap the upper ends of the plurality of ribs 17A and 17B. The mounting portion 12 is formed with a plurality of suction holes 12H penetrating from the surface 12A side to the back surface 12B side. The adsorption hole adsorbs individual electronic parts that are singulated.

本實施方式的載置部12包含橡膠部13及金屬製板狀部14以作為其構成元件。橡膠部13是載置部12的表面12A側的構成元件，金屬製板狀部14是載置部12的背面12B側的構成元件。金屬製板狀部14可包含鋁或不銹鋼等金屬製的薄板。The mounting portion 12 of the present embodiment includes a rubber portion 13 and a metal plate-shaped portion 14 as its constituent elements. The rubber portion 13 is a component on the surface 12A side of the mounting portion 12, and the metal plate-shaped portion 14 is a component on the back surface 12B side of the mounting portion 12. The metal plate-shaped portion 14 may include a thin plate made of metal such as aluminum or stainless steel.

橡膠部13中的與金屬製板狀部14為相反側的表面構成「載置部12的表面12A」。橡膠部13的背面接合於金屬製板狀部14的表面。金屬製板狀部14的背面構成「載置部12的背面12B」。橡膠部13可通過黏合劑等而接合於金屬製板狀部14。The surface of the rubber portion 13 on the opposite side to the metal plate-shaped portion 14 constitutes the "surface 12A of the mounting portion 12". The back surface of the rubber portion 13 is joined to the surface of the metal plate-shaped portion 14. The back surface of the metal plate-shaped portion 14 constitutes the "rear surface 12B of the placing portion 12". The rubber portion 13 can be joined to the metal plate-shaped portion 14 with an adhesive or the like.

金屬製板狀部14在平面方向上大於橡膠部13。在金屬製板狀部14與橡膠部13經接合的狀態下，產生從橡膠部13的外緣突出至外側的、金屬製板狀部14的周圍部分（圖3）。所述周圍部分由具有環狀形狀的罩11予以覆蓋（圖2）。罩11將載置部12的所述周圍部分固定至底座部15。The metal plate portion 14 is larger than the rubber portion 13 in the plane direction. In a state where the metal plate-shaped portion 14 and the rubber portion 13 are joined, a peripheral portion of the metal plate-shaped portion 14 that protrudes from the outer edge of the rubber portion 13 to the outside is generated (FIG. 3 ). The surrounding part is covered by a cover 11 having a ring shape (FIG. 2 ). The cover 11 fixes the surrounding part of the placing part 12 to the base part 15.

在罩11與框部16之間，設有密封構件，所述密封構件包圍底座部15中的設有多個凸肋部17A、17B的區域。本實施方式中，在設於底座部15（框部16）的環狀槽15G內配置有O型環11S（圖4、圖5），O型環11S包圍底座部15中的設有多個凸肋部17A、17B的區域。O型環11S可被包夾在罩11與框部16之間（圖5）。在採用襯墊或墊片來作為密封構件的情況下，襯墊等也包圍底座部15中的設有多個凸肋部17A、17B的區域。襯墊等可被包夾在罩11與框部16之間。此時，環狀槽15G為可適當省略的結構。Between the cover 11 and the frame portion 16, there is provided a sealing member that surrounds the area of the base portion 15 where the plurality of ribs 17A, 17B are provided. In this embodiment, an O-ring 11S (FIG. 4, FIG. 5) is arranged in the annular groove 15G provided in the base portion 15 (frame portion 16), and the O-ring 11S surrounds the base portion 15 provided with a plurality of The area of the convex ribs 17A, 17B. The O-ring 11S can be sandwiched between the cover 11 and the frame 16 (Figure 5). When a gasket or a gasket is used as the sealing member, the gasket or the like also surrounds the area of the base portion 15 where the plurality of ribs 17A, 17B are provided. A gasket or the like may be sandwiched between the cover 11 and the frame 16. At this time, the annular groove 15G has a structure that can be omitted appropriately.

在橡膠部13形成有多個貫穿孔13H，在金屬製板狀部14也形成有多個貫穿孔14H。貫穿孔13H、貫穿孔14H以彼此大致一致的方式形成為同軸狀，在橡膠部13接合於金屬製板狀部14的狀態下，由貫穿孔13H、貫穿孔14H構成從表面12A側貫穿至背面12B側的吸附孔12H。即，本實施方式中，吸附孔12H是由貫穿孔13H與貫穿孔14H所形成（圖5）。A plurality of through holes 13H are formed in the rubber portion 13, and a plurality of through holes 14H are also formed in the metal plate-shaped portion 14. The through hole 13H and the through hole 14H are formed coaxially so as to substantially coincide with each other. When the rubber portion 13 is joined to the metal plate-shaped portion 14, the through hole 13H and the through hole 14H penetrate from the surface 12A side to the back surface. Adsorption hole 12H on the side of 12B. That is, in this embodiment, the adsorption hole 12H is formed by the through hole 13H and the through hole 14H (FIG. 5 ).

如圖5所示，載置部12的背面12B以覆蓋多個進氣路徑18的方式而配置。多個進氣路徑18連通於抽吸空間23，並且使設於基台21的抽吸機構20與多個吸附孔12H連通。在此狀態下，載置於載置部12的表面12A上的已密封基板1通過吸附孔12H中產生的負壓而被吸附在表面12A上。As shown in FIG. 5, the back surface 12B of the mounting part 12 is arrange|positioned so that the several air intake path 18 may be covered. The plurality of air intake paths 18 communicate with the suction space 23 and the suction mechanism 20 provided on the base 21 communicates with the plurality of suction holes 12H. In this state, the sealed substrate 1 placed on the surface 12A of the mounting portion 12 is sucked on the surface 12A by the negative pressure generated in the suction hole 12H.

（作用及效果） 參照圖5，在底座部15被配置在基台21上的狀態下，多個凸肋部17A、17B各自的突出部17D在突出方向上的端面17DS（圖5）接觸至凸狀支撐部22的頂面22A，由此，多個凸肋部17A、17B由凸狀支撐部22予以支撐。因此，在切斷加工時，即使吸附板10受到伴隨切斷的應力，也能有效地抑制吸附板10產生撓曲等變形的現象。另一方面，後退部17C的端面17CS離開凸狀支撐部22的頂面22A，空氣能夠通過後退部17C的端面17CS與凸狀支撐部22的頂面22A之間的間隙而流通。(Function and effect) 5, in the state in which the base portion 15 is arranged on the base 21, the end surface 17DS (FIG. 5) of the protruding portion 17D of each of the plurality of ribs 17A, 17B in the protruding direction is in contact with the convex support portion 22 Therefore, the plurality of convex ribs 17A, 17B are supported by the convex supporting portion 22. Therefore, even if the suction plate 10 is subjected to stress accompanying cutting during the cutting process, it is possible to effectively suppress the phenomenon of deformation such as bending of the suction plate 10. On the other hand, the end surface 17CS of the retreat portion 17C is separated from the top surface 22A of the convex support portion 22, and air can circulate through the gap between the end surface 17CS of the retreat portion 17C and the top surface 22A of the convex support portion 22.

假設多個凸肋部17A、17B全部以基台21側的端面與後退部17C的端面17CS在同一高度變得齊平的方式而形成。此時，儘管能通過多個凸肋部17A、17B與凸狀支撐部22的頂面22A之間的間隙而獲得空氣的流通，但與所述實施方式的情況相比，多個凸肋部17A、17B的高度低，多個凸肋部17A、17B其自身的剛性也低。It is assumed that all the plurality of ribs 17A and 17B are formed so that the end surface on the side of the base 21 and the end surface 17CS of the retreat portion 17C become flush at the same height. At this time, although the air circulation can be obtained through the gaps between the plurality of ribs 17A, 17B and the top surface 22A of the convex supporting portion 22, compared with the case of the above-mentioned embodiment, the plurality of ribs The heights of 17A, 17B are low, and the rigidity of the plurality of ribs 17A, 17B itself is also low.

假設多個凸肋部17A、17B全部以基台21側的端面與突出部17D的端面17DS在同一高度齊平的方式而形成。此時，與所述實施方式的情況相比，儘管多個凸肋部17A、17B其自身的剛性變高，但難以在多個凸肋部17A、17B與凸狀支撐部22的頂面22A之間形成充分的間隙，從而難以獲得空氣的流通即充分的抽吸力。It is assumed that all of the plurality of ribs 17A and 17B are formed so that the end surface on the side of the base 21 and the end surface 17DS of the protrusion 17D are flush with each other at the same height. At this time, compared with the case of the above-mentioned embodiment, although the rigidity of the plurality of ribs 17A, 17B becomes higher, it is difficult to connect the plurality of ribs 17A, 17B and the top surface 22A of the convex support 22 A sufficient gap is formed between them, so that it is difficult to obtain air circulation, that is, sufficient suction power.

與所述兩個假設的結構相比，根據實施方式的吸附板10，若將多個凸肋部17A、17B交叉的部分設為交叉部分，則多個中的一部分交叉部分相對於與所述交叉部分鄰接的凸肋部17A、凸肋部17B而朝向基台21所配置的一側突出。通過採用此種結構，能夠獲得作為吸附板10整體的高剛性與對已密封基板1的高抽吸力。Compared with the two hypothetical structures, according to the suction plate 10 of the embodiment, if the portion where the plurality of ribs 17A, 17B intersect is set as the intersection, a part of the intersection of the plurality of The protruding rib 17A and the protruding rib 17B adjacent to the crossing portion protrude toward the side where the base 21 is arranged. By adopting such a structure, high rigidity as the entire suction plate 10 and high suction force to the sealed substrate 1 can be obtained.

在底座部15由樹脂形成的情況下，通過射出成型，能夠以高生產性來容易地製作底座部15。也能夠實現作為吸附板10整體的輕量化，與底座部15為金屬的情況相比，吸附板10的生產性及處理性也提高，也能獲得成本優勢。在底座部15由樹脂所形成的情況下，更優選採用考慮到吸附板10的剛性的如上所述的結構。根據具備所述結構的吸附板10，每當製作吸附板10時，根據作為吸附對象物的電子零件的規格來設計載置部12，而對於底座部15，能夠使具有各種結構的載置部12共同地通用。When the base portion 15 is formed of resin, the base portion 15 can be easily manufactured with high productivity by injection molding. It is also possible to reduce the weight of the suction plate 10 as a whole. Compared with the case where the base portion 15 is made of metal, the productivity and handling properties of the suction plate 10 are also improved, and cost advantages can also be obtained. When the base portion 15 is formed of resin, it is more preferable to adopt the structure as described above in consideration of the rigidity of the suction plate 10. According to the suction plate 10 having the above-mentioned structure, each time the suction plate 10 is manufactured, the mounting portion 12 is designed according to the specifications of the electronic component to be adsorbed, and for the base portion 15, mounting portions having various structures can be used. 12 commonly used in common.

所述吸附板10中，使用將載置部12的周圍部分固定至底座部15的罩11。通過罩11，能夠將載置部12穩定地固定至底座部15，也能夠實現吸附板10的設計性的提高。In the suction plate 10, a cover 11 that fixes the surrounding part of the mounting portion 12 to the base portion 15 is used. With the cover 11, the mounting portion 12 can be stably fixed to the base portion 15, and the design of the suction plate 10 can also be improved.

所述吸附板10中，O型環11S包圍底座部15中的設有多個凸肋部17A、17B的區域，且被包夾在罩11與框部16之間（圖5）。O型環11S的存在抑制空氣從罩11與底座部15之間的間隙泄漏而導致抽吸力下降。In the suction plate 10, the O-ring 11S surrounds the area of the base 15 where the plurality of ribs 17A and 17B are provided, and is sandwiched between the cover 11 and the frame 16 (FIG. 5 ). The presence of the O-ring 11S prevents air from leaking from the gap between the cover 11 and the base portion 15, resulting in a decrease in the suction force.

如圖5所示，也可在底座部15的框部16與基台21的框狀支撐部21A之間實現與O型環11S同樣的結構。圖5所示的示例中，在框狀支撐部21A設有環狀槽25G，在環狀槽25G的內側配置有O型環25S。O型環25S包圍抽吸空間23，且被包夾在底座部15的框部16與基台21的框狀支撐部21A之間。O型環25S的存在抑制空氣從底座部15的框部16與基台21的框狀支撐部21A之間的間隙泄漏而導致抽吸力下降。As shown in FIG. 5, the same structure as the O-ring 11S may be realized between the frame portion 16 of the base portion 15 and the frame-shaped support portion 21A of the base 21. In the example shown in FIG. 5, the frame-shaped support part 21A is provided with the annular groove 25G, and the O-ring 25S is arrange|positioned inside the annular groove 25G. The O-ring 25S surrounds the suction space 23 and is sandwiched between the frame portion 16 of the base portion 15 and the frame-shaped support portion 21A of the base 21. The presence of the O-ring 25S prevents air from leaking from the gap between the frame portion 16 of the base portion 15 and the frame-shaped support portion 21A of the base 21, resulting in a decrease in suction force.

（其他結構1） 參照圖2，吸附板10還包括貫穿載置部12及底座部15的導通構件19。圖2所示的示例中，形成有沿厚度方向貫穿載置部12及底座部15的貫穿孔12J，在貫穿孔12J中收容有導通構件19。導通構件19例如包含可沿軸方向彈性伸縮的球柱塞（ball plunger）。(Other structure 1) 2, the suction plate 10 further includes a conductive member 19 penetrating the mounting portion 12 and the base portion 15. In the example shown in FIG. 2, a through hole 12J that penetrates the mounting portion 12 and the base portion 15 in the thickness direction is formed, and the conduction member 19 is accommodated in the through hole 12J. The conduction member 19 includes, for example, a ball plunger that can be elastically expanded and contracted in the axial direction.

導通構件19將載置於載置部12上的已密封基板1與基台21予以電連接。在底座部15由樹脂形成的情況下，載置部12上的已密封基板1容易帶電。根据導通構件19，能夠防止此種帶電。根據球柱塞，通過受到按壓而沿軸方向收縮，因此幾乎不會在已密封基板1與基台21之間產生不必要的應力，在切斷加工時，也幾乎不會使已密封基板1產生位置偏離。另外，作為球柱塞，僅在一端側配置有球的球柱塞、在兩端側分別配置有球的雙球柱塞皆可使用，但優選可在兩端側收縮的雙球柱塞。The conductive member 19 electrically connects the sealed substrate 1 placed on the mounting portion 12 and the base 21. When the base portion 15 is formed of resin, the sealed substrate 1 on the mounting portion 12 is easily charged. According to the conduction member 19, such electrification can be prevented. According to the ball plunger, it shrinks in the axial direction by being pressed. Therefore, unnecessary stress is hardly generated between the sealed substrate 1 and the base 21, and the sealed substrate 1 is hardly affected during cutting. A positional deviation occurs. In addition, as the ball plunger, a ball plunger in which a ball is arranged only on one end side and a double ball plunger in which balls are respectively arranged on both ends can be used, but a double ball plunger that can be retracted on both ends is preferable.

（其他結構2） 參照圖4、圖5，優選的是，在金屬製板狀部14的載置部12側的面（此處為載置部12的背面12B）形成有槽部14G。槽部14G使形成在金屬製板狀部14的多個中的相鄰的貫穿孔14H連通。槽部14G並非整體上貫穿金屬製板狀部14，而是包括貫穿孔14H在內，在貫穿孔14H的形成位置貫穿金屬製板狀部14，在未形成貫穿孔14H的位置並不貫穿金屬製板狀部14。(Other structure 2) Referring to FIGS. 4 and 5, it is preferable that a groove portion 14G is formed on the surface of the metal plate-shaped portion 14 on the side of the mounting portion 12 (here, the back surface 12B of the mounting portion 12 ). The groove portion 14G connects adjacent through holes 14H formed in the plurality of metal plate-shaped portions 14. The groove portion 14G does not penetrate the metal plate-shaped portion 14 as a whole, but includes the through hole 14H, penetrates the metal plate-shaped portion 14 at the position where the through hole 14H is formed, and does not penetrate the metal at the position where the through hole 14H is not formed.制板状部14。 System plate portion 14.

參照圖5，假設在未形成槽部14G的情況下，隨著吸附孔12H被凸肋部17A、凸肋部17B堵塞的面積變大，進氣路徑18更難與吸附孔12H連通。若形成有槽部14G，則即使吸附孔12H被凸肋部17A、凸肋部17B堵塞，進氣路徑18也能夠經由槽部14G而連通於吸附孔12H，從而能夠獲得抽吸力。5, assuming that the groove 14G is not formed, as the area of the suction hole 12H blocked by the rib 17A and the rib 17B becomes larger, the air intake path 18 is more difficult to communicate with the suction hole 12H. If the groove 14G is formed, even if the suction hole 12H is blocked by the rib 17A and the rib 17B, the air intake path 18 can communicate with the suction hole 12H via the groove 14G, and suction power can be obtained.

另外，作為具有槽部14G的金屬製板狀部14，能夠使用將多個金屬製板狀構件接合而成的積層體。所述積層體例如能夠通過下述方式而製作，即：在一片金屬製板狀構件，通過蝕刻加工或衝壓加工而形成與槽部的形狀對應的貫穿孔，在另一片金屬製板狀構件，通過蝕刻加工或衝壓加工而形成與吸附孔12H的形狀對應的貫穿孔，將這些金屬製板狀構件予以重合，並使用導電性黏合劑等加以接合。若是此種積層體，則即便使用厚度相對較薄的金屬製薄板也能夠容易地製作。In addition, as the metal plate-shaped portion 14 having the groove portion 14G, a laminate in which a plurality of metal plate-shaped members are joined can be used. The laminated body can be produced, for example, by forming a through hole corresponding to the shape of the groove by etching or press working on one sheet of metal plate-shaped member, and in another sheet of metal plate-shaped member, A through hole corresponding to the shape of the suction hole 12H is formed by etching or press processing, and these metal plate-shaped members are superimposed and joined using a conductive adhesive or the like. If it is such a laminated body, even if it uses the metal thin plate of relatively thin thickness, it can manufacture easily.

（其他結構3） 參照圖3～圖5，也可在多個凸肋部17A、17B交叉的部分形成有貫穿孔17H。貫穿孔17H能夠使抽吸機構20與多個吸附孔12H連通，從而能夠獲得更大的抽吸力。通過將貫穿孔17H的結構與所述其他結構2中的槽部14G加以組合來實施，從而能夠獲得更大的抽吸力。(Other structure 3) 3 to 5, a through hole 17H may be formed in a portion where the plurality of ribs 17A, 17B intersect. The through hole 17H enables the suction mechanism 20 to communicate with the plurality of suction holes 12H, so that a greater suction force can be obtained. By combining the structure of the through hole 17H with the groove portion 14G in the other structure 2 described above, a larger suction force can be obtained.

（其他結構4） 所述吸附板10中，多個凸肋部17A、17B被設在框部16的內側。多個凸肋部17A以沿第一方向延伸且彼此平行的方式而配置，多個凸肋部17B以沿與第一方向交叉的第二方向彼此平行的方式而配置。由此，在框部16的內側形成具有大致四邊形狀的進氣路徑18。多個凸肋部只要以彼此交叉的方式形成為格子狀，則例如也可構成為，進氣路徑18在俯視時具有三角形或六邊形等多邊形狀，還可為圓形狀等。(Other structure 4) In the suction plate 10, a plurality of ribs 17A and 17B are provided inside the frame 16. The plurality of ribs 17A are arranged to extend in the first direction and be parallel to each other, and the plurality of ribs 17B are arranged to be parallel to each other in the second direction crossing the first direction. As a result, the air intake path 18 having a substantially quadrangular shape is formed inside the frame portion 16. As long as the plurality of ribs are formed in a lattice shape so as to cross each other, for example, the intake path 18 may have a polygonal shape such as a triangle or a hexagon in plan view, or may have a circular shape or the like.

（其他結構5） 所述實施方式中，基於吸附板10被用作切斷單元B的切斷用平臺的示例進行了說明。與吸附板10具有相同結構的吸附板也可被用作切斷單元B中的卸載器38，還可被用作檢查單元C中的檢查用載台41及/或索引平臺42。(Other structure 5) In the above-mentioned embodiment, the description is based on an example in which the suction plate 10 is used as the cutting platform of the cutting unit B. The suction plate having the same structure as the suction plate 10 can also be used as the unloader 38 in the cutting unit B, and can also be used as the inspection stage 41 and/or the index platform 42 in the inspection unit C.

對實施方式進行了說明，但應認為，本次公開的實施方式在所有方面僅為例示而非限制者。本發明的範圍是由權利要求書所示，且意圖包含與權利要求書均等的含義及範圍內的所有變更。Although the embodiment has been described, it should be considered that the embodiment disclosed this time is merely illustrative in all points and not restrictive. The scope of the present invention is shown by the claims, and is intended to include the meanings equivalent to the claims and all changes within the scope.

1:已密封基板 2:切斷用平臺 3:主軸 10:吸附板 11:罩 11H、24:開口部 11S、25S:O型環 12:載置部 12A:表面 12B:背面 12H:吸附孔 12J、13H、14H、17H:貫穿孔 13:橡膠部 14:金屬製板狀部 14G:槽部 15:底座部 15G、25G:環狀槽 16:框部 16S、21B:底面 17A、17B:凸肋部 17C:後退部 17CS、17DS:端面 17D:突出部 18:進氣路徑 19:導通構件 20:抽吸機構 21:基台 21A:框狀支撐部 22:凸狀支撐部 22A:頂面 23:空間 30:供給機構 31:移動機構 32:旋轉機構 33:搬送部 34:切斷部 35:攝像機 36:第一清潔器 37:旋轉刀片 38:卸載器 39:第二清潔器 40:檢查攝像機 41:檢查用載台 42:索引平臺 43:移送機構 45:良品用托盤 46:不良品用托盤 47:收容部 48:托盤供給部 50:切斷裝置 A:供給單元 B:切斷單元 C:檢查單元 D:收容單元 L:切斷線 P:電子零件1: Sealed substrate 2: Cut off the platform 3: Spindle 10: Adsorption board 11: Hood 11H, 24: Opening 11S, 25S: O-ring 12: Placement Department 12A: Surface 12B: Back 12H: adsorption hole 12J, 13H, 14H, 17H: through hole 13: Rubber Department 14: Metal plate part 14G: Groove 15: Base 15G, 25G: ring groove 16: Frame 16S, 21B: bottom surface 17A, 17B: convex ribs 17C: Retreat 17CS, 17DS: end face 17D: protrusion 18: intake path 19: Conduction member 20: Suction mechanism 21: Abutment 21A: Frame-shaped support 22: Convex support 22A: Top surface 23: space 30: Supply organization 31: mobile agency 32: Rotating mechanism 33: Transport Department 34: Cut off part 35: Camera 36: The first cleaner 37: Rotating blade 38: Uninstaller 39: second cleaner 40: Check the camera 41: Inspection stage 42: index platform 43: transfer mechanism 45: good product tray 46: Tray for defective products 47: Containment Department 48: Pallet Supply Department 50: cutting device A: Supply unit B: Cut off unit C: Inspection unit D: Containment unit L: cut line P: Electronic parts

圖1是示意性地表示實施方式中的切斷裝置50的圖。 圖2是表示已密封基板1、吸附板10與切斷裝置50的基台21的立體圖。 圖3是表示從上表面側觀察吸附板10的分解狀態的樣子的立體圖。 圖4是表示從底面側觀察吸附板10的分解狀態的樣子的立體圖。 圖5是表示在切斷裝置50的基台21上配置有吸附板10的狀態的剖面圖。FIG. 1 is a diagram schematically showing a cutting device 50 in the embodiment. FIG. 2 is a perspective view showing the base 21 of the sealed substrate 1, the suction plate 10, and the cutting device 50. As shown in FIG. Fig. 3 is a perspective view showing a state where the disassembled state of the suction plate 10 is viewed from the upper surface side. FIG. 4 is a perspective view showing how the disassembled state of the suction plate 10 is viewed from the bottom surface side. FIG. 5 is a cross-sectional view showing a state in which the suction plate 10 is arranged on the base 21 of the cutting device 50.

1:已密封基板 1: Sealed substrate

11:罩 11: Hood

11S、25S:O型環 11S, 25S: O-ring

11H:開口部 11H: Opening

12:載置部 12: Placement Department

12A:表面 12A: Surface

12B:背面 12B: Back

12H:吸附孔 12H: adsorption hole

13H、14H、17H:貫穿孔 13H, 14H, 17H: through hole

13:橡膠部 13: Rubber Department

14:金屬製板狀部 14: Metal plate part

14G:槽部 14G: Groove

15:底座部 15: Base

15G、25G:環狀槽 15G, 25G: ring groove

16:框部 16: Frame

16S、21B:底面 16S, 21B: bottom surface

17C:後退部 17C: Retreat

17CS、17DS:端面 17CS, 17DS: end face

17D:突出部 17D: protrusion

18:進氣路徑 18: intake path

20:抽吸機構 20: Suction mechanism

21:基台 21: Abutment

21A:框狀支撐部 21A: Frame-shaped support

22:凸狀支撐部 22: Convex support

22A:頂面 22A: Top surface

23:空間 23: space

50:切斷裝置 50: cutting device

Claims (10)

一種吸附板，包括：底座部，具有框部及多個凸肋部，且以所述多個凸肋部彼此交叉的方式而配置成格子狀，所述框部配置在設有抽吸機構的切斷裝置的基台上，所述多個凸肋部設在所述框部的內側；以及載置部，以重合於所述多個凸肋部的方式而配置，且形成有從表面側貫穿至背面側的多個吸附孔，通過所述多個凸肋部，在所述框部的所述內側形成有使所述抽吸機構與多個所述吸附孔連通的多個進氣路徑，在所述載置部的所述背面以覆蓋所述多個進氣路徑的方式而配置的狀態下，載置於所述表面上的切斷對象物通過所述吸附孔中產生的負壓而被吸附在所述表面上，所述多個凸肋部彼此交叉的部分的一部分朝向所述基台所配置的一側突出。 A suction plate includes: a base part having a frame part and a plurality of convex ribs, and the plurality of convex ribs are arranged in a lattice shape such that the plurality of convex ribs cross each other, and the frame part is arranged on a suction mechanism. On the base of the cutting device, the plurality of ribs are provided on the inner side of the frame; and the placement portion is arranged so as to overlap the plurality of ribs, and is formed from the surface side A plurality of suction holes penetrating to the back side, through the plurality of ribs, a plurality of air intake paths that communicate the suction mechanism with the plurality of suction holes are formed on the inner side of the frame portion , In a state where the back surface of the placing portion is arranged to cover the plurality of air intake paths, the cut object placed on the surface passes through the negative pressure generated in the suction hole While being adsorbed on the surface, a part of the intersecting portion of the plurality of ribs protrudes toward the side where the base is arranged. 如請求項1所述的吸附板，其中所述底座部是由樹脂所形成。 The adsorption board according to claim 1, wherein the base portion is formed of resin. 如請求項2所述的吸附板，還包括：導通構件，貫穿所述載置部及所述底座部，用於將配置在所述載置部上的切斷對象物與所述基台予以電連接。 The suction plate according to claim 2, further comprising: a conductive member penetrating the mounting portion and the base portion, and for separating the cut object placed on the mounting portion and the base Electric connection. 如請求項1至請求項3中任一項所述的吸附板，其中在所述多個凸肋部彼此交叉的部分，形成有使所述抽吸機構與多個所述吸附孔連通的貫穿孔。 The suction plate according to any one of claims 1 to 3, wherein a through-hole connecting the suction mechanism and the plurality of suction holes is formed at a portion where the plurality of ribs intersect each other hole. 如請求項1至請求項3中任一項所述的吸附板，還包括：罩，具有框狀的形狀，將所述載置部的周圍部分固定至所述底座部。 The suction plate according to any one of claims 1 to 3, further comprising: a cover having a frame-like shape, and fixing the surrounding part of the placing part to the base part. 如請求項5所述的吸附板，還包括：密封構件，在所述罩與所述框部之間，包圍所述底座部中的設有所述多個凸肋部的區域。 The suction plate according to claim 5, further comprising: a sealing member that surrounds the area of the base portion where the plurality of ribs are provided between the cover and the frame portion. 如請求項1至請求項3中任一項所述的吸附板，其中所述載置部包括：橡膠部，作為所述載置部的所述表面側的構成元件；以及金屬製板狀部，作為所述載置部的所述背面側的構成元件，在所述金屬製板狀部的所述底座部側的面，形成有槽部，所述槽部用於連通多個形成在所述金屬製板狀部的所述吸附孔。 The suction plate according to any one of claims 1 to 3, wherein the mounting portion includes: a rubber portion as a constituent element on the surface side of the mounting portion; and a metal plate-shaped portion As a constituent element on the back side of the mounting portion, a groove portion is formed on the surface of the metal plate-shaped portion on the side of the base portion, and the groove portion is used to communicate a plurality of formed in the The suction hole of the metal plate-shaped portion. 一種切斷裝置，包括：基台，設有抽吸機構；以及如請求項1至請求項7中任一項所述的吸附板，被配置在所述基台上。 A cutting device includes: a base provided with a suction mechanism; and the suction plate according to any one of claim 1 to 7, which is arranged on the base. 如請求項8所述的切斷裝置，其中所述基台包括：框狀支撐部，支撐所述框部；以及多個凸狀支撐部，設在所述框狀支撐部的內側，支撐所述多個凸肋部。 The cutting device according to claim 8, wherein the base includes: a frame-shaped support portion to support the frame portion; and a plurality of convex support portions provided on the inner side of the frame-shaped support portion to support the Mentioned multiple protruding ribs. 一種切斷方法，包括下述步驟：使切斷對象物吸附在如請求項1至請求項7中任一項所述的 吸附板上；以及將所述切斷對象物在被吸附於所述吸附板上的狀態下予以切斷。 A cutting method, comprising the following steps: making the cut object adsorbed on any one of claims 1 to 7 Suction plate; and cutting the object to be cut in a state of being adsorbed on the suction plate.
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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6701910B1 (en) * 1999-04-16 2004-03-09 Micron Technology, Inc. Film frame substrate fixture
EP1614505A1 (en) * 2000-01-31 2006-01-11 Shin-Etsu Handotai Company Limited Polishing device and method
TWM334600U (en) * 2007-12-07 2008-06-11 Shenq Fang Yuan Technology Co Ltd Vacuum sucking device used in cutting printed circuit board
TW201112351A (en) * 2009-03-30 2011-04-01 Mitsuboshi Diamond Ind Co Ltd Apparatus for fixing substrate
JP2012187645A (en) * 2011-03-09 2012-10-04 Apic Yamada Corp Workpiece chuck and workpiece holding method
TWM493142U (en) * 2014-09-03 2015-01-01 Wecon Automation Corp Die bonding apparatus generating negative pressure to adhere material sheet and die
JP2016054256A (en) * 2014-09-04 2016-04-14 Ｔｏｗａ株式会社 Cutting device and suction jig and device using the same
TW201628812A (en) * 2014-10-24 2016-08-16 Towa Corp Workpiece sucking plate, workpiece cutting device, workpiece cutting method and manufacture method of workpiece sucking plate
TW201801227A (en) * 2016-06-20 2018-01-01 舒語科技股份有限公司 Vacuum suction device prevents vacuum pressure loss in the process of grinding molding protection layer of semiconductor stripes or semiconductor wafers
TW201803693A (en) * 2016-07-13 2018-02-01 迪思科股份有限公司 Chuck table mechanism to rotatably and suctionably support a chuck table without using a tube and shorten maintenance time

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5627618B2 (en) * 2012-02-23 2014-11-19 Ｔｏｗａ株式会社 Fixing jig manufacturing method and fixing jig
JP5918003B2 (en) * 2012-04-27 2016-05-18 Ｔｏｗａ株式会社 Vacuum suction sheet for singulation device and method for manufacturing fixing jig using the same
JP6218511B2 (en) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 Cutting apparatus and cutting method
JP6235391B2 (en) * 2014-03-27 2017-11-22 Ｔｏｗａ株式会社 Inspection jig, cutting device, and cutting method
JP6338478B2 (en) * 2014-07-18 2018-06-06 Ｔｏｗａ株式会社 Cutting method and product manufacturing method
JP6430170B2 (en) * 2014-08-12 2018-11-28 Ｔｏｗａ株式会社 Cutting apparatus, cutting method, adsorption mechanism and apparatus using the same
JP6338555B2 (en) * 2015-07-10 2018-06-06 Ｔｏｗａ株式会社 Adsorption mechanism, adsorption method, production apparatus and production method

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6701910B1 (en) * 1999-04-16 2004-03-09 Micron Technology, Inc. Film frame substrate fixture
EP1614505A1 (en) * 2000-01-31 2006-01-11 Shin-Etsu Handotai Company Limited Polishing device and method
TWM334600U (en) * 2007-12-07 2008-06-11 Shenq Fang Yuan Technology Co Ltd Vacuum sucking device used in cutting printed circuit board
TW201112351A (en) * 2009-03-30 2011-04-01 Mitsuboshi Diamond Ind Co Ltd Apparatus for fixing substrate
JP2012187645A (en) * 2011-03-09 2012-10-04 Apic Yamada Corp Workpiece chuck and workpiece holding method
TWM493142U (en) * 2014-09-03 2015-01-01 Wecon Automation Corp Die bonding apparatus generating negative pressure to adhere material sheet and die
JP2016054256A (en) * 2014-09-04 2016-04-14 Ｔｏｗａ株式会社 Cutting device and suction jig and device using the same
TW201628812A (en) * 2014-10-24 2016-08-16 Towa Corp Workpiece sucking plate, workpiece cutting device, workpiece cutting method and manufacture method of workpiece sucking plate
TW201801227A (en) * 2016-06-20 2018-01-01 舒語科技股份有限公司 Vacuum suction device prevents vacuum pressure loss in the process of grinding molding protection layer of semiconductor stripes or semiconductor wafers
TW201803693A (en) * 2016-07-13 2018-02-01 迪思科股份有限公司 Chuck table mechanism to rotatably and suctionably support a chuck table without using a tube and shorten maintenance time

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