KR102508913B1 - Process table for laser machining and apparatus for laser machining having the same - Google Patents

Abstract

The present invention relates to a process table for laser processing and a laser processing apparatus including the same, and more particularly, to a process table for laser processing that is easy to assemble and separate, and a laser processing apparatus including the same.
A process table for laser processing according to an embodiment of the present invention includes a base plate including a vacuum part having a vacuum hole connected to a vacuum line and an exhaust part for discharging process by-products through the exhaust hole connected to the exhaust line; a connecting plate including a first communication hole communicating with the vacuum hole and extending in a thickness direction and a second communication hole communicating with the exhaust hole and extending in a thickness direction; and an adsorption plate including an adsorption hole communicating with the first communication hole to adsorb a substrate and an adsorption hole communicating with the second communication hole and extending in a thickness direction.

Description

Process table for laser machining and laser processing apparatus including the same {Process table for laser machining and apparatus for laser machining having the same}

The present invention relates to a process table for laser processing and a laser processing apparatus including the same, and more particularly, to a process table for laser processing that is easy to assemble and separate, and a laser processing apparatus including the same.

Display devices are used in mobile devices such as smart phones, tablet personal computers, laptop computers, digital cameras, camcorders, and portable information terminals, and electronic products such as slim televisions, exhibition displays, and billboards.

The film used in these display devices is made of the size and shape desired by the user to use the ledger sheet for products such as mobile, notebook, and watch. It is used after cutting in a cell unit.

Conventionally, a process table is designed and manufactured so that it can be cut in units of desired size and shape, and process by-products such as fume, particles and contaminants generated during laser cutting has been removed.

In the conventional process table, a cutting line groove is formed along a laser cutting line for laser processing according to the size and shape of the cell and the seating area of the substrate, which results in various product sizes. In order to correspond to the shape and size of the cell, several process tables had to be separately manufactured according to the size and shape of the cell, and a person had to replace the process table directly according to the size and shape of the cell to be processed.

Korean Patent Publication No. 10-2017-0051598

The present invention provides a process table for laser processing capable of replacing a connection plate and an adsorption plate according to the size of a cell dividing a substrate and a laser processing apparatus including the same.

A process table for laser processing according to an embodiment of the present invention includes a base plate including a vacuum part having a vacuum hole connected to a vacuum line and an exhaust part for discharging process by-products through the exhaust hole connected to the exhaust line; a connecting plate including a first communication hole communicating with the vacuum hole and extending in a thickness direction and a second communication hole communicating with the exhaust hole and extending in a thickness direction; and an adsorption plate including an adsorption hole communicating with the first communication hole to adsorb a substrate and an adsorption hole communicating with the second communication hole and extending in a thickness direction.

The absorption plate and the connection plate may be separable from the base plate.

The connection plate further includes an exhaust communication part formed between the exhaust hole and the second communication hole or between the second communication hole and the suction hole, through which the process byproduct flows, and the adsorption plate is formed between the first communication hole and the suction hole. The vacuum chamber may be formed between the hole and the suction hole and communicate with the first communication hole and the suction hole.

A third communication hole communicating between the vacuum hole and the first communication hole and a fourth communication hole communicating between the exhaust hole and the exhaust communication part, interposed between the base plate and the connection plate A sealing plate; may be further included.

The sealing plate may be provided to correspond to the exhaust communication part, and the fourth communication hole may be provided to correspond to the exhaust hole.

The exhaust communication unit may be provided separately from the first communication hole and the third communication hole.

A first contact pad provided around the exhaust hole and brought into close contact with the sealing plate may be further included.

A second contact pad provided around the vacuum hole and brought into close contact with the connection plate may be further included.

The vacuum unit may be positioned at a central portion of the base plate, and the exhaust unit may be positioned symmetrically with respect to the vacuum unit at an edge portion of the base plate.

The base plate further includes a first alignment coupling portion formed on a surface facing the connection plate, and the connection plate further includes a second alignment coupling portion formed to correspond to the first alignment coupling portion on a surface facing the base plate. can include

A cutting line groove communicating with the suction hole may be formed on the suction surface of the suction plate.

A bottom surface of the cutting line groove may be inclined or curved in an inward direction.

The cutting line grooves are provided according to the cell size for cell division of the substrate, the suction plate is replaceable according to the cutting line groove corresponding to the cell size, and the connection plate sucks the corresponding cutting line groove. It may be replaceable according to the second communication hole corresponding to the hole.

A laser processing apparatus according to another embodiment of the present invention includes a process table for laser processing according to an embodiment of the present invention; and a laser unit for radiating laser light along the arrangement of the suction holes on the substrate supported on the process table.

A suction hood unit disposed on the suction plate to suck process by-products floating on the substrate; may be further included.

The suction hood unit may be disposed around the laser unit.

A process table for laser processing according to an embodiment of the present invention is composed of a base plate, a connection plate, and an adsorption plate in which a vacuum hole, a first communication hole, and an adsorption hole communicate, and an exhaust hole, a second communication hole, and a suction hole communicate with each other. The base plate connected to the vacuum line and the exhaust line of the fixed state can replace the adsorption plate and / or connection plate on which the substrate is supported according to the size and shape of the divided cell, and thus the overall process table A process table corresponding to the size and shape of a desired cell can be provided simply by replacing only the adsorption plate and/or the connection plate without replacement.

Through this, in order to provide a process table corresponding to the size and shape of the cell, the process corresponding to the size and shape of the desired cell is conveniently performed without repeatedly disassembling the entire process table and fastening and combining a plurality of bolts as in the prior art. table can be provided. In addition, since the process table is not entirely replaced and the base plate is fixed, there is no need to separate or combine the vacuum line and the exhaust line, so the time for combining and separating the vacuum line and the exhaust line from the process table can be reduced, and the desired cell The preparation time of the process table corresponding to the size and shape can be reduced.

And it is possible to align the base plate and the connection plate only by coupling the base plate and the connection plate through the first alignment coupling part and the second alignment coupling part, and thus flatness work for the process table and the base plate, connection plate and It is possible to complete the preparation of the process table corresponding to the desired size and shape of the cell without the need to align the positions between the adsorption plates, and more quickly and conveniently prepare the process table.

In addition, by inclining or bending the bottom surface of the cutting line groove inward, it is possible to effectively exhaust the process by-products without remaining process by-products because the air flow (or exhaust flow) does not affect the outer periphery of the suction hole.

On the other hand, the laser processing apparatus including the process table for laser processing effectively removes process by-products such as fume and particles generated on the substrate during laser processing by adding a suction hood unit around the laser unit on the adsorption plate. can be removed

1 is a perspective view showing a process table for laser processing according to an embodiment of the present invention;
Figure 2 is a cross-sectional view of a process table for laser processing according to an embodiment of the present invention.
3 is a conceptual diagram illustrating an exhaust communication unit and a vacuum chamber unit according to an embodiment of the present invention;
4 is a conceptual diagram for explaining a cutting line groove according to an embodiment of the present invention.
5 is a diagram showing a laser processing apparatus according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only these embodiments will complete the disclosure of the present invention, and will fully cover the scope of the invention to those skilled in the art. It is provided to inform you. During the description, the same reference numerals are assigned to the same components, and the drawings may be partially exaggerated in size in order to accurately describe the embodiments of the present invention, and the same numerals refer to the same elements in the drawings.

1 is a perspective view showing a process table for laser processing according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the process table for laser processing according to an embodiment of the present invention, showing the assembled process table for laser processing of FIG. 1 from A-A It is a cross-section cut at .

1 and 2, the process table 100 for laser processing according to an embodiment of the present invention includes a vacuum part 110a having a vacuum hole 111 connected to a vacuum line, and an exhaust gas connected to an exhaust line. a base plate 110 including an exhaust unit 110b discharging process by-products through a hole 112; A connection plate 120 including a first communication hole 121 communicating with the vacuum hole 111 and extending in the thickness direction and a second communication hole 123 communicating with the exhaust hole 112 and extending in the thickness direction. ); and a suction hole 132 that communicates with the first communication hole 121 to adsorb the substrate 10 and a suction hole 133 that communicates with the second communication hole 123 and extends in the thickness direction. Plate 130; may include.

The base plate 110 may be connected to and fixed to a vacuum line (not shown) and an exhaust line (not shown), and has a vacuum part 110a having at least one vacuum hole 111 connected to a vacuum line (not shown). ) and an exhaust unit 110b for discharging process by-products through at least one exhaust hole 112 connected to an exhaust line (not shown). The vacuum unit 110a may have one or more vacuum holes 111, the vacuum holes 111 may be connected to a vacuum line (not shown), and a vacuum may be formed by the vacuum line (not shown). Here, the vacuum unit 110a is applied to the first communication hole 121, the suction hole 132, and/or the vacuum chamber unit 131 communicating with the vacuum hole 111 by vacuum pressure from a vacuum line (not shown). A vacuum may be formed, and vacuum pressure may be provided to the suction hole 132 by vacuum formation.

The exhaust unit 110b may have one or more exhaust holes 112, and the exhaust holes 112 may be connected to an exhaust line (not shown), and the suction hole 133 and the second communication hole 123 communicate with each other. And/or process by-products delivered from the exhaust communication unit 122 may be discharged to the outside.

The connection plate 120 can be coupled and separated (or uncoupled) from the base plate 110, can connect the base plate 110 and the suction plate 130, and are communicated with the vacuum hole 111 in the thickness direction. It may include a first communication hole 121 extending to and a second communication hole 123 extending in the thickness direction in communication with the exhaust hole 112 . The first communication hole 121 communicates with the vacuum hole 111 and may extend in the thickness direction (or upward direction), and the vacuum hole 111 and the suction hole 132 of the suction plate 130 and / or vacuum The chamber unit 131 may be connected (or communicated with). Accordingly, a vacuum may be formed in the suction hole 132 , and vacuum pressure for adsorbing the substrate 10 may be provided to the suction hole 132 .

The second communication hole 123 communicates with the exhaust hole 112 and may extend in the thickness direction, and may connect between the exhaust hole 112 and the suction hole 133, and from the communication suction hole 133 The delivered process by-products may be delivered to the exhaust hole 112 .

The adsorption plate 130 may adsorb and support (or fix) the substrate 10, and may include an adsorption hole 132 adsorbing the substrate 10 in communication with the first communication hole 121 and a second communication hole ( 123) and may include a suction hole 133 extending in the thickness direction.

The adsorption hole 132 communicates with the first communication hole 121 and may extend in the thickness direction, and a vacuum may be formed, and the substrate 10 may be adsorbed by a vacuum pressure generated by the vacuum formation. That is, the substrate 10 may be adsorbed and fixed on the adsorption hole 132 by vacuum pressure formed by communication between the vacuum hole 111 , the first communication hole 121 , and the adsorption hole 132 . Here, the suction holes 132 may be composed of a plurality (piece), and the substrate 10 may be entirely absorbed at a plurality of points through the suction holes 132 distributed at a plurality of points (or positions), The substrate 10 can be stably adsorbed and supported.

The suction hole 133 may communicate with the second communication hole 123 and extend in the thickness direction, and process by-products such as fume, particles, and contaminants generated in the laser processing process This can be exhausted, and the process by-products can be delivered to the second communication hole 123 . Accordingly, the process by-products may be discharged through the suction hole 133 , the second communication hole 123 , and the exhaust hole 112 . Here, the suction hole 133 may be composed of a plurality (piece), and the plurality of suction holes 133 may communicate with each other through a line-shaped communication passage, and the communication passage is a cutting line groove ( 134) may be provided (or formed). The structure of the suction hole 133 is not limited thereto, and it is sufficient as long as the process by-products exhausted through the suction hole 133 can be effectively transferred to the second communication hole 123 and the exhaust hole 112 and discharged.

The connection plate 120 is formed between the exhaust hole 112 and the second communication hole 123 or between the second communication hole 123 and the suction hole 133, and is an exhaust communication part through which the process by-product flows. 122 may be further included, and the suction plate 130 is formed between the first communication hole 121 and the suction hole 132 to communicate with the first communication hole 121 and the suction hole 132. A vacuum chamber unit 131 may be further included. The exhaust communication unit 122 may be formed between the exhaust hole 112 and the second communication hole 123 or between the second communication hole 123 and the suction hole 133, and the exhaust hole 112, It can communicate with the second communication hole 123 and the suction hole 133 and communicate (or extend) in the longitudinal direction (or horizontal direction) of the connection plate 120 so that the process by-products can flow. When the exhaust communication part 122 is formed between the exhaust hole 112 and the second communication hole 123, the exhaust hole 112 and the second communication hole 123 are connected to each other, thereby communicating the suction hole 133. ) and the process by-products transferred from the second communication hole 123 may flow and be discharged through the exhaust hole 112 . And when the exhaust communication part 122 is formed between the second communication hole 123 and the suction hole 133, by connecting the second communication hole 123 and the suction hole 133, the communication suction hole ( 133), the process by-products may flow and be discharged through the second communication hole 123. At this time, the second communication hole 123 communicates with the exhaust communication part 122 and may extend from the exhaust communication part 122 in the thickness direction. Here, the exhaust communication unit 122 may be in communication with one or more exhaust holes 112, and the process by-products transmitted through one second communication hole 123 or suction hole 133 may be passed through a plurality of exhaust holes ( 112), or the process by-products delivered through the plurality of second communication holes 123 or suction holes 133 may be discharged through one exhaust hole 112. Meanwhile, the process by-products transmitted through the plurality of second communication holes 123 or the suction hole 133 may be discharged to the plurality of exhaust holes 112, and the shape of the exhaust communication part 122 is not limited thereto. It is sufficient if the process by-products can be effectively discharged through the communicating exhaust hole 112 by providing a flow space for the process by-products.

The vacuum chamber unit 131 may be formed between the first communication hole 121 and the suction hole 132 and communicate with the first communication hole 121 and the suction hole 132 . That is, the vacuum chamber unit 131 communicates with the first communication hole 121 to form a vacuum, and connects the first communication hole 121 and the suction hole 132 to apply vacuum pressure to the suction hole 132. can provide. Here, the vacuum chamber unit 131 may communicate with one or more first communication holes 121, one first communication hole 121 may communicate with a plurality of suction holes 132, or a plurality of first communication holes 121. One communication hole 121 may be communicated with a plurality of suction holes 132 . The shape of the vacuum chamber unit 131 is not limited thereto, and it is sufficient as long as it can provide vacuum pressure capable of stably adsorbing the substrate 10 through the adsorption hole 132 .

The process table 100 has a cutting line groove along a laser cutting line to laser cut the substrate 10 according to the size and shape of the desired cell and the seating area of the substrate 10. line groove, 134) can be formed, and since the laser cutting line varies according to the size and shape of the cell, the cutting line groove 134 is inevitably changed according to the laser cutting line that varies according to the size and shape of the cell .

Conventionally, in order to respond to various product sizes and shapes, several process tables were separately manufactured according to the size and shape of the cell, and a person had to replace the entire process table directly according to the size and shape of the cell to be processed.

However, in the process table 100 for laser processing according to the present invention, the adsorption plate 130 and the connection plate 120 may be separable from the base plate 110 . That is, the process table 100 for laser processing of the present invention is composed of a base plate 110, a connection plate 120, and an adsorption plate 130, and the base plate 110, the connection plate 120, and the adsorption plate 130 can be assembled and separated, and only the adsorption plate 130 on which the cutting line groove 134 is formed can be replaced according to the size and shape of the desired cell. In addition, according to the position of the suction hole 133 determined by the position of the cutting line groove 134 and / or the structure (or shape) of the vacuum chamber unit 131, the first communication hole 121, the exhaust communication unit ( 122) and/or the position (or structure) of the second communication hole 123 may vary, and depending on the replacement suction plate 130, the connection plate 120 may also have the position of the suction hole 133 and the vacuum chamber unit ( 131) may be replaced with a connecting plate 120 having a first communication hole 121, an exhaust communication portion 122, and a second communication hole 123 formed thereon. At this time, depending on the size and shape of the cell, the matching (or corresponding to each other) adsorption plate 130 and connection plate 120 may be integrated, and the integrated adsorption plate 130 and connection plate 120 may be integrated. The process table 100 corresponding to the size and shape of the desired cell can be provided simply by replacing it at once according to the size and shape of the desired cell, and the process table 100 suitable for the size and shape of the desired cell It is possible to shorten the preparation time (that is, the replacement time of the adsorption plate and the connection plate).

In other words, the base plate 110 connected to an external vacuum line (not shown) and an exhaust line (not shown) is fixed to the suction plate 130 on which the substrate 10 is supported according to the size and shape of the cell to be divided. ) or only the adsorption plate 130 and the connection plate 120 can be replaced, and accordingly, only the adsorption plate 130 or the adsorption plate 130 and the connection plate 120 can be replaced without replacing the entire process table 100 It is possible to provide a process table 100 corresponding to the size and shape of a desired cell simply by replacing it. Through this, in order to provide the process table 100 corresponding to the size and shape of the cell, as in the prior art, the process table is dismantled as a whole and a plurality of bolts are tightened and combined without repeatedly performing the desired size and shape of the cell. A process table 100 corresponding to may be provided. In addition, since the process table 100 is not entirely replaced and the base plate 110 is fixed, it is not necessary to separate and combine the vacuum line (not shown) and the exhaust line (not shown), so the vacuum line (not shown) and the exhaust line (not shown) It is possible to reduce the time for coupling and separating the line (not shown) to and from the process table 100 and the preparation time for the process table 100 corresponding to the size and shape of a desired cell.

The connection plate 120 may be stacked (or combined) on the base plate 110 with the first communication hole 121 aligned with the vacuum hole 111, and the suction plate 130 has the suction hole 133 It may be stacked (or combined) on the connection plate 120 while being aligned with the second communication hole 123 . In order to effectively form a vacuum pressure in the adsorption hole 132, the vacuum line (not shown) is provided so that a vacuum can be effectively formed in the vacuum chamber unit 131 and the first communication hole 121 communicating with the adsorption hole 132. The alignment of the vacuum hole 111 connected to the first communication hole 121 and the alignment of the first communication hole 121 and the vacuum chamber unit 131 are important. In addition, in order to effectively discharge the process by-products to the exhaust hole 112 via the second communication hole 123 and the exhaust communication part 122 through the suction hole 133, the suction hole 133 and the second communication hole 123 ) and the alignment of the exhaust communication part 122 and the exhaust hole 112 are important.

The connection plate 120 may be coupled to and separated from the base plate 110, may be stacked on and coupled to the base plate 110, and the first communication hole 121 may be aligned and coupled to the vacuum hole 111. It can be. Since the vacuum hole 111 and the first communication hole 121 have similar sizes and are misaligned when they are not aligned, the vacuum hole 111 and the first communication hole 121 may be aligned. When the vacuum hole 111 having a similar size and the first communication hole 121 are aligned, the exhaust communication part 122 has a much larger plane area than the exhaust hole 112, so that the exhaust hole 112 is almost exhausted. Located within the plane area of the communication unit 122, the exhaust hole 112 and the exhaust communication unit 122 may be aligned (or communicate effectively).

Here, the base plate 110 may further include a first alignment coupling part 115 formed on a surface facing the connection plate 120, and the connection plate 120 is provided on a surface facing the base plate 110. A second alignment coupling portion 125 formed to correspond to the first alignment coupling portion 115 may be further included. The first alignment coupling portion 115 may be formed on a surface of the base plate 110 facing the connection plate 120 (eg, an upper surface), and interact with the second alignment coupling portion 125 (eg For example, it is possible to align the base plate 110 and the connection plate 120 only by coupling), and align the vacuum hole 111 and the first communication hole 121 together with the second alignment coupling part 125. It is possible to couple between the base plate 110 and the connection plate 120.

The second alignment coupling portion 125 may be formed on a surface (eg, a lower surface) of the connection plate 120 facing the base plate 110, and may be formed in correspondence with the first alignment coupling portion 115. can Here, the second alignment coupling portion 125 is shaped (eg, protruding pin shape) of the first alignment coupling portion 115 to interact (eg, couple) with the first alignment coupling portion 115. ) It may be formed in a shape corresponding to (for example, a concave groove or hole shape), and may be provided at a position corresponding to the first alignment coupling part 115. The first alignment coupling portion 115 and the second alignment coupling portion 125 can align the base plate 110 and the connection plate 120 while interacting with each other, such as coupling, and the first alignment coupling portion 115 and The base plate 110 and the connection plate 120 can be coupled by simply aligning the vacuum hole 111 and the first communication hole 121 only by coupling (or interaction) of the second alignment coupling part 125. .

For example, the first alignment coupling unit 115 and the second alignment coupling unit 125 may be configured such that the base plate 110 and the connection plate 120 are coupled and separated in a one-touch manner. , it may be a pneumatic clamp structure. One of the first aligning coupling part 115 and the second aligning coupling part 125 may be a protruding coupling protrusion, and the other one has the coupling protrusion inserted therein, and presses the inserted coupling protrusion by air pressure. It may be a pneumatic clamp that secures.

The coupling protrusion and the pneumatic clamp may be disposed at positions corresponding to each other on the base plate 110 and the connection plate 120, and the pneumatic clamp is mounted on one of the base plate 110 and the connection plate 120. A clamp mounting groove may be formed, and a separate air pressure passage (not shown) connected to an external air pressure pump (not shown) through a connecting fitting member (not shown) to provide air pressure to the pneumatic clamp. ) can be formed. In addition, the other one of the base plate 110 and the connection plate 120 may be formed by protruding the coupling protrusion inserted into and coupled to the pneumatic clamp.

According to the structure of the first alignment coupling part 115 and the second alignment coupling part 125, the base plate 110 and the connection plate 120 can be coupled and separated, so the replacement of the connection plate 120 is very difficult. It can be done conveniently and quickly. That is, when the connecting plate 120 is seated on the base plate 110 and the corresponding first alignment coupling portion 115 and the second alignment coupling portion 125 are coupled, the coupling protrusion is inserted into the pneumatic clamp and In this state, the replacement of the connection plate 120 can be conveniently performed in a one-touch manner by supplying air pressure to the pneumatic clamp so that the coupling protrusion is pressurized and fixed to the pneumatic clamp. At this time, combining the first alignment coupling portion 115 and the second alignment coupling portion 125 means inserting the coupling protrusion into the pneumatic clamp.

Therefore, the base plate 110 and the connection plate 120 can be combined and separated without a number of bolt fastening and disassembly operations, and the connection plate 120 can be conveniently connected without repeatedly performing a plurality of bolt fastening and disassembly operations. replacement can be performed. In addition, the base plate 110 and the connection plate 120 are formed by aligning the vacuum hole 111 and the first communication hole 121 only by combining the first alignment coupling portion 115 and the second alignment coupling portion 125. It can be aligned, corresponding to the size and shape of a desired cell without the need to perform a flatness operation on the process table 100 and a separate position alignment operation between the base plate 110 and the connection plate 120. It is possible to complete the preparation work of the process table 100 to be used, and more rapid and convenient preparation work of the process table 100 may be possible.

The adsorption plate 130 may be combined with and separated from the connection plate 120, stacked on the connection plate 120 and combined, and the suction hole 133 is aligned with the second communication hole 123 and combined. It can be. Since the second communication hole 123 and the suction hole 133 are similar in size and misaligned when they are not aligned, the second communication hole 123 and the suction hole 133 may be aligned. When the second communication hole 123 and the suction hole 133 having similar sizes are aligned, since the plane area of the vacuum chamber part 131 is much larger than the plane area of the first communication hole 121, most of the first communication hole ( 121 is located within the plane area of the vacuum chamber part 131, so that the first communication hole 121 and the vacuum chamber part 131 may be aligned (or communicate effectively).

Here, the connection plate 120 may further include a third alignment part (not shown) formed on the surface facing the absorption plate 130, and the absorption plate 130 is provided on the surface facing the connection plate 120. A fourth alignment unit (not shown) formed to correspond to the third alignment unit (not shown) may be further included. The third aligning unit (not shown) may be formed on a surface (eg, upper surface) of the connection plate 120 facing the adsorption plate 130 and interact with the fourth aligning unit (not shown) (eg For example, the coupling plate 120 and the adsorption plate 130 may be aligned, and the second communication hole 123 and the suction hole 133 may be aligned. In this case, the third aligning unit (not shown) may couple the connecting plate 120 and the adsorption plate 130 while being combined with the fourth aligning unit (not shown).

The fourth aligning unit (not shown) may be formed on a surface (eg, a lower surface) of the adsorption plate 130 facing the connection plate 120, and may be formed in correspondence with the third aligning unit (not shown). can Here, the fourth aligning unit (not shown) may be formed in a shape corresponding to the shape of the third aligning unit (not shown) to interact (eg, combine) with the third aligning unit (not shown), , It may be provided at a position corresponding to the third alignment unit (not shown). The third aligning unit (not shown) and the fourth aligning unit (not shown) may align the connection plate 120 and the suction plate 130 while interacting with each other, such as coupling, and the third aligning unit (not shown) It is possible to align the second communication hole 123 and the suction hole 133 simply by the interaction between the second communication hole 123 and the fourth alignment unit (not shown).

For example, the third aligning unit (not shown) and the fourth aligning unit (not shown) may be configured to couple and separate the connection plate 120 and the adsorption plate 130 in a one-touch manner, and pneumatic clamps. may be a rescue. On the other hand, the connection plate 120 and the suction plate 130 may be provided in an integrated state by screwing, bonding, etc. in a state in which the second communication hole 123 and the suction hole 133 are aligned, The process table 100 may be assembled (or prepared) by coupling the connection plate 120 (ie, the suction plate and the connection plate integrated) to the base plate 110 .

3 is a conceptual diagram for explaining an exhaust communication unit and a vacuum chamber unit according to an embodiment of the present invention, FIG. 3(a) shows an exhaust communication unit, and FIG. 3(b) shows a vacuum chamber unit.

Referring to FIG. 3 , the vacuum part 110a may be located at the center of the base plate 110, and the exhaust part 110b is symmetrical about the vacuum part 110a at the edge of the base plate 110. can be located The vacuum unit 110a may be an area in which one or more vacuum holes 111 are gathered (or grouped) and disposed, and may be located in the center of the base plate 110 . In order to increase the processing precision of laser processing, stable support (or fixation) of the substrate 10 is required during laser processing. Here, the stable support of the substrate 10 means that the substrate 10 is not shaken or distorted during laser processing without being bent. When the substrate 10 is adsorbed by vacuum pressure through the plurality of adsorption holes 132 and the vacuum pressure in the plurality of adsorption holes 132 is not uniform, the substrate 10 is bent by the uneven vacuum pressure. In addition, while being divided into cells, the divided cells may be sucked from the suction hole 132 having a low vacuum pressure to the suction hole 132 having a high vacuum pressure, and thus the divided cells may move. Accordingly, the vacuum unit 110a may be disposed at the central portion of the base plate 110 to form a uniform vacuum pressure in the plurality of suction holes 132 .

That is, as the vacuum part 110a sucks air from the central part of the base plate 110, a uniform vacuum pressure can be formed in the plurality of suction holes 132, and the substrate 10 does not bend and the suction holes It can be stably adsorbed and supported on (132). Since the vacuum unit 110a provides vacuum pressure for adsorbing the substrate 10 to the plurality of adsorption holes 132 through the plurality of vacuum holes 111, the vacuum unit 110a is applied to the edge of the base plate 110. When located in the vacuum line (not shown), even if the plurality of vacuum holes 111 cannot be symmetrically arranged around one vacuum pump (not shown), or the plurality of vacuum holes 111 are symmetrically arranged. The length of the vacuum (not shown) may be too long, and the vacuum pressure (or vacuum suction power) may decrease. In addition, when a plurality of vacuum pumps (not shown) are used, matching of vacuum pressures between the plurality of vacuum pumps (not shown) becomes difficult. In addition, the distance from the plurality of vacuum holes 111 to the suction hole 132 at the center of the suction plate 130 becomes longer, so that the suction (fixing) force of the central portion of the suction plate 130, where the cells are mainly located, may be weakened. It may not be possible to stably support the divided cells along the

However, when the vacuum part 110a is located at the center of the base plate 110, a plurality of vacuum holes are centered on one vacuum pump (not shown) while preventing the length of the vacuum line (not shown) from being too long. (111) can be symmetrically arranged, and thus a uniform vacuum pressure can be stably formed in the plurality of suction holes 132, and a plurality of vacuum pumps (not shown) can be used. Matching of vacuum pressure due to (not shown) may not be performed. In addition, since the distance from the plurality of vacuum holes 111 located in the central part of the base plate 110 to the suction hole 132 located in the central part of the suction plate 130 can be short, the central part of the substrate 10 where the cells are mainly located. can be stably adsorbed, and divided cells can also be stably adsorbed and supported.

The exhaust unit 110b may be a region in which one or more exhaust holes 112 are gathered (or grouped), and may be located symmetrically around the vacuum unit 110a at the edge of the base plate 110. . That is, in the exhaust unit 110b, a plurality of regions may be positioned symmetrically around the vacuum unit 110a. Here, since the exhaust unit 110b only needs to discharge the process by-products from the suction hole 133 to the exhaust hole 112, it is a big problem even if the suction power (or suction pressure) of the plurality of suction holes 133 is not uniform. doesn't go Therefore, since the suction force of the plurality of suction holes 133 does not have to be uniform, the process by-products can be discharged to the edge of the base plate 110 by disposing the exhaust unit 110b at the edge of the base plate 110. .

At this time, when the exhaust unit 110b is asymmetrically disposed around the vacuum unit 110a at the edge of the base plate 110, the exhaust hole 112 is not provided at the opposite edge of the exhaust unit 110b. The suction hole 133 located at the opposite edge of the suction plate 130 is too far from the exhaust hole 112, so suction power may not be properly provided, and the process by-products are well exhausted ( or discharge) may not be released.

Accordingly, the exhaust part 110b can be symmetrically disposed around the vacuum part 110a at the edge of the base plate 110, and the process by-products are effectively discharged without being easily exhausted and accumulated. can do.

In the process table 100 for laser processing according to the present invention, the vacuum hole 111 and the first communication hole 121 communicate with each other through the third communication hole 141 and between the exhaust hole 112 and the exhaust communication part 122. It may further include a sealing plate 140 including a fourth communication hole 142 communicating the , and interposed between the base plate 110 and the connection plate 120 .

The sealing plate 140 may be interposed between the base plate 110 and the connection plate 120, and is a gap between the connection plate 120 and the base plate 110 that are detachable (or coupled and separated). can eliminate Since the connection plate 120 is attached to and detached from the base plate 110, a gap may occur between the connection plate 120 and the base plate 110, and this gap may cause leakage of the process by-product and/or vacuum. of leaks may occur. Accordingly, by interposing the sealing plate 140 between the base plate 110 and the connection plate 120, the connection plate 120 and the base plate ( 110) and the gap between the connection plate 120 and the base plate 110, it is possible to suppress or prevent leakage of the process by-product and/or vacuum leakage.

Here, the sealing plate 140 is a third communication hole 141 that communicates between the vacuum hole 111 and the first communication hole 121 and a third communication hole 141 that communicates between the exhaust hole 112 and the exhaust communication part 122. 4 communication holes 142 may be included. The third communication hole 141 may communicate between the vacuum hole 111 and the first communication hole 121, and the vacuum hole 111 and the third communication hole 141 connected to a vacuum line (not shown) , the first communication hole 121, the vacuum chamber unit 131 and the suction hole 132 communicate with each other so that vacuum pressure can be provided to the suction hole 132. The third communication hole 141 may be provided to correspond to the vacuum hole 111 and the first communication hole 121, and is aligned with the vacuum hole 111 and the first communication hole 121 to form a vacuum hole 111. It is possible to prevent leakage of vacuum from occurring between the gap and the first communication hole 121 . Meanwhile, the third communication hole 141 may be provided so that at least a portion of the first communication hole 121 is inserted.

The fourth communication hole 142 may communicate between the exhaust hole 112 and the exhaust communication unit 122, the exhaust hole 112 connected to an exhaust line (not shown), the fourth communication hole 142, The exhaust communication unit 122 , the second communication hole 123 , and the suction hole 133 communicate with each other so that the process by-products can be discharged from the suction hole 133 .

In this case, the sealing plate 140 may be provided to correspond to the exhaust communication unit 122 , and the fourth communication hole 142 may be provided to correspond to the exhaust hole 112 . The sealing plate 140 is provided to correspond to the exhaust communication part 122, so that it can provide a bottom surface of the exhaust communication part 122, and the process by-product is provided in the wide exhaust communication part 122 through the fourth communication hole ( 142 and may be discharged (or delivered) to the exhaust hole 112 . A wide exhaust communication part 122 is formed in the connection plate 120 so that the process by-products can flow, and the first communication hole 121 can communicate the vacuum hole 111 and the vacuum chamber part 131. Since the first communication hole 121 can sufficiently prevent leakage of vacuum even with the second contact pad 152 or the like, the exhaust communication part 122 has a large area and the first contact pad 121 has a large area. Since it is difficult to prevent leakage of the process by-products with only the pad 151, it can necessarily be provided to correspond to the exhaust communication unit 122. For example, at least a portion of the sealing plate 140 may be inserted into an internal space of the exhaust communication unit 122 to provide a bottom surface of the exhaust communication unit 122 . Also, the sealing plate 140 may be configured such that at least a portion of the first communication hole 121 can be inserted into the third communication hole 141 .

Here, the sealing plate 140 may be made of a metal material (eg, aluminum), and may be made of a material that does not affect (eg, deformation) even when the temperature is increased by laser processing. In addition, the sealing plate 140 may be provided by being coupled to the connection plate 120 (or integrally with the connection plate), and may be bonded to the connection plate 120 by bonding with an adhesive or the like. Meanwhile, the sealing plate 140 may be made of a material having elasticity (eg, rubber), and may increase adhesion between the base plate 110 and the connection plate 120 .

The fourth communication hole 142 may be provided to correspond to the exhaust hole 112, communicate the exhaust hole 112 and the exhaust communication part 122, and be provided within the area of the exhaust communication part 122. It can be. Accordingly, it is possible to prevent leakage of the process by-products between the exhaust hole 112 and the exhaust communication unit 122 by being aligned with the exhaust hole 112 and the exhaust communication unit 122 .

In addition, the exhaust communication unit 122 may be provided separately from the first communication hole 121 and the third communication hole 141 . That is, a space (or flow path) through which the process by-products flow and a space in which a vacuum is formed may be separated for discharging the process by-products. Accordingly, the process by-products can be effectively discharged, and a vacuum can be well formed in the space where the vacuum is formed. The exhaust communication unit 122 is formed on the connection plate 120 to have a wide space in which the process by-products can flow, so that one exhaust hole 112 and a plurality of second communication holes communicate with each other through the wide space. 123 and the suction hole 133 can be communicated, and accordingly, even with one (or a small number) of exhaust holes 112, the process by-products are exhausted (or discharged) from the plurality (or multiple) suction holes 133. ) can be made.

Meanwhile, the suction plate 130 is separated from the suction hole 133 and the second communication hole 123 to form a vacuum chamber 131, so that a vacuum can be formed in a wide space inside the suction plate 130. , Through this, it is possible to form an effective and uniform vacuum pressure over a large area of the adsorption plate 130 (that is, the plurality of adsorption holes).

The process table 100 for laser processing according to the present invention may further include a first contact pad 151 provided around the exhaust hole 112 and closely attached to the sealing plate 140 .

The first contact pad 151 may be provided around the exhaust hole 112 and may come into close contact with the sealing plate 140 . Accordingly, leakage of the process by-product between the exhaust hole 112 and the fourth communication hole 142 can be prevented. That is, in the first contact pad 151, the sealing plate 140 interposed between the base plate 110 and the connection plate 120 can come into close contact with the connection plate 120 coupled to the base plate 110, The base plate 110 may be in close contact with the opposite surface. Accordingly, gaps between the base plate 110 and the first contact pad 151 and between the first contact pad 151 and the sealing plate 140 may be eliminated.

Here, the first contact pad 151 may have a through hole that communicates with the exhaust hole 112 and the fourth communication hole 142, and has elasticity for coupling between the connection plate 120 and the base plate 110. It may be in close contact with the sealing plate 140 and the base plate 110 while being compressed by the pressure. For example, the first contact pad 151 may be configured in a bellows type or may be in the form of an O-ring, but is not limited thereto, and the connection plate 120 and the base plate 110 It is sufficient as long as it can be in close contact with the sealing plate 140 and the base plate 110 while being compressed by the coupling.

Meanwhile, when the sealing plate 140 is not used, the first contact pad 151 may be in close contact with the connection plate 120, and the first contact pad 151 communicates with the exhaust hole 112 through a through hole. The process by-products may be discharged from the exhaust communication unit 122 to the exhaust hole 112 through the through hole of the first contact pad 151. At this time, the connection plate 120 may have an exhaust communication unit 122 formed as an internal conduit, a fifth communication hole (not shown) communicating with the exhaust hole 112 may be further formed, and a first contact pad. The through hole of 151 may communicate with the exhaust hole 112 and the fifth communication hole (not shown).

The process table 100 for laser processing according to the present invention may further include a second contact pad 152 provided around the vacuum hole 111 and closely attached to the connection plate 120 .

The second contact pad 152 may be provided around the vacuum hole 111 and may adhere to the connection plate 120 . Accordingly, it is possible to prevent a vacuum leak from occurring between the vacuum hole 111 and the first communication hole 121 . That is, while the connection plate 120 is coupled to the base plate 110, the connection plate 120 may be brought into close contact with the second contact pad 152, and the base plate 110 may be brought into close contact with the opposite surface. Accordingly, gaps between the base plate 110 and the first contact pad 151 and between the first contact pad 151 and the connection plate 120 may be eliminated, and leakage of the vacuum may be prevented.

Here, the second contact pad 152 may have the same shape (or structure) as the first contact pad 151 or may have a different shape, but is not limited thereto, and the connection plate 120 and the base plate ( 110) is sufficient as long as it can be in close contact with the connection plate 120 and the base plate 110 while being compressed.

Meanwhile, when the sealing plate 140 is used, the second contact pad 152 may come into close contact with the sealing plate 140 .

4 is a conceptual diagram for explaining a cutting line groove according to an embodiment of the present invention, FIG. 4 (a) shows a plan view (or top view) of the cutting line groove, and FIG. 4 (b) shows a cutting line groove A cross-sectional view cut at B-B' is shown.

Referring to FIG. 4 , a cutting line groove 134 communicating with the suction hole 133 may be formed on the suction surface of the suction plate 130 . The cutting line groove 134 may be formed along a laser cutting line for laser cutting the substrate 10 according to the size and shape of a desired cell, and (plural) suction holes 133 along the cutting line groove 134. ) may be arranged to communicate with the suction hole 133. In this way, in the case of forming the cutting line groove 134, it is possible to suppress or prevent strong energy of the laser from contacting the surface of the adsorption plate 130 while laser cutting, so that the adsorption plate 130 and the process table by the laser ( 100) can be prevented.

Since the laser cutting is performed along the cutting line groove 134, the process by-products are mostly accumulated in the cutting line groove 134. Accordingly, by arranging the suction hole 133 in the cutting line groove 134, the process by-products can be intensively exhausted (or discharged) from a portion where a lot of the process by-products are generated. In addition, suction holes 132 may be arranged in other parts where the divided cells are located to stably adsorb and support (or fix) the substrate 10 and the divided cells.

Here, the bottom surface of the cutting line groove 134 may be inclined or curved in an inward direction. When a corner is formed between the bottom surface of the cutting line groove 134 and the side wall of the cutting line groove 134, the influence of the air flow (or exhaust flow) by the exhaust suction force is not affected at the inner corner, and the process by-products remain. . That is, by the Coanda effect, the airflow by the exhaust suction force is formed vertically along the sidewall of the cutting line groove 134, and the bottom surface of the cutting line groove 134 and the sidewall of the cutting line groove 134 The process by-products accumulated at the corners between them are prevented from being guided to the suction hole 133. Accordingly, by inclining or bending the bottom surface of the cutting line groove 134 inward, it is possible to prevent a corner from being formed between the bottom surface of the cutting line groove 134 and the side wall of the cutting line groove 134, By the Coanda effect, the air flow by the exhaust suction force is formed along the bottom surface of the cutting line groove 134 so that the air flow by the exhaust suction force does not affect the outer circumference of the suction hole 133 without the process by-products remaining. Process by-products can be effectively exhausted.

The cutting line grooves 134 may be provided according to the cell size for cell division of the substrate 10, and the adsorption plate 130 may be replaceable according to the cutting line grooves 134 corresponding to the cell size, The connecting plate 120 may be replaceable according to the second communication hole 123 corresponding to the suction hole 133 of the corresponding cutting line groove 134 . That is, the process table 100 corresponding to the size and shape of the desired cell is simply replaced by replacing the adsorption plate 130 having the cutting line groove 134 according to the seating area of the substrate 10 and the size and shape of the desired cell. ) can be provided.

Since the laser cutting line varies depending on the size and shape of the cell, the cutting line groove 134 may be provided according to the size of the cell for cell division of the substrate 10, and the laser cutting line varies depending on the size and shape of the cell. It may be provided corresponding to the line.

Since the cutting line grooves 134 are formed on the suction surface of the suction plate 130, it is necessary to replace the suction plate 130 in order to provide cutting line grooves 134 corresponding to the size and shape of the desired cell. Accordingly, the suction plate 130 may be provided to be replaced according to the cutting line groove 134 corresponding to the size of the cell.

Also, when the suction plate 130 is changed, the arrangement of the suction holes 133 may be changed according to the position (and shape) of the cutting line groove 134, and accordingly, the connection plate 120 is provided with the corresponding cutting line. It may be replaceable according to the second communication hole 123 corresponding to the suction hole 133 of the groove 134. That is, the connection plate 120 in which the second communication hole 123 is formed according to the arrangement of the suction hole 133 changed according to the position of the cutting line groove 134 can be replaced (or changed) like the suction plate 130. can

5 is a diagram showing a laser processing device according to another embodiment of the present invention, FIG. 5 (a) shows a perspective view of the laser processing device, and FIG. 5 (b) shows a side view of the laser processing device.

Referring to FIG. 5, a laser processing apparatus according to another embodiment of the present invention will be looked at in more detail. Items overlapping with those described above in relation to the process table for laser processing according to an embodiment of the present invention will be omitted.

A laser processing apparatus 200 according to another embodiment of the present invention includes a process table 100 for laser processing according to an embodiment of the present invention; and a laser unit 210 radiating laser along the arrangement of the suction holes 133 on the substrate 10 supported on the process table 100 .

The process table 100 for laser processing may be the process table 100 for laser processing according to an embodiment of the present invention, and not only can stably absorb and support (or fix) the substrate 10, but also can generate during laser processing. The process by-products accumulated on the process table 100 can also be removed by discharging them to the outside.

The laser unit 210 irradiates a laser along the arrangement of the suction holes 133 on the substrate 10 supported on the process table 100 and laser cuts the substrate 10, thereby cutting the substrate 10 with cells. Can be split into piles. Here, the suction hole 133 may be arranged along the cutting line groove 134, and the laser unit 210 may irradiate a laser along the cutting line groove 134.

The laser processing apparatus 200 according to the present invention may further include a suction hood unit 220 disposed on the suction plate 130 to suck process by-products floating on the substrate 10 .

The suction hood unit 220 may be disposed on the suction plate 130 and may suck process by-products floating on the substrate 10 . Through this, the process by-products accumulated on the process table 100 can be discharged through the suction hole 133, and the process by-products floating on the substrate 10 can be discharged through the suction hood unit 220, , Accordingly, process by-products generated during laser processing can be effectively removed.

For example, the suction hood unit 220 may include a gas spraying unit (not shown) that sprays gas along the surface of the substrate 10 to suspend process by-products on the substrate 10; and a suction unit (not shown) for sucking the floating process by-products. The gas spraying unit (not shown) may spray gas along the surface of the substrate 10 to float process by-products on the substrate 10, and even remove process by-products attached to the surface of the substrate 10 to remove particles and the like. Cell defects caused by process by-products can be suppressed or prevented.

The suction unit (not shown) can suck in the floating process by-products, and can suck and discharge not only process by-products that naturally float during laser processing, but also process by-products floating by the gas injection unit (not shown). .

Further, the suction hood unit 220 may be disposed around the laser unit 210 and may move together with the laser unit 210 integrally. For example, the laser processing apparatus 200 of the present invention may further include a driving unit (not shown) for moving the laser unit 210 and the suction hood unit 220.

The driving unit (not shown) may move the laser unit 210 and the suction hood unit 220, and may move the laser unit 210 and the suction hood unit 220 integrally. Accordingly, the process by-products floating during laser processing may be directly suctioned and discharged through the suction hood unit 220 .

In this way, the laser processing apparatus 200 of the present invention adds a suction hood unit 220 around the laser unit 210 on the suction plate 130 to remove fume and particles generated on the substrate 10 during laser processing. Process by-products such as can also be effectively removed.

As such, in the present invention, the vacuum hole, the first communication hole, the vacuum chamber part and the suction hole are in communication, and the exhaust hole, the exhaust communication part, the second communication hole and the suction hole are in communication with the base plate, the connection plate and the suction plate. The base plate connected to the external vacuum line and the exhaust line can be replaced with the adsorption plate and/or the connection plate on which the substrate is supported according to the size and shape of the cell to be divided in a fixed state, and thus without replacing the entire process table. A process table corresponding to the size and shape of a desired cell can be provided simply by replacing only the adsorption plate and/or the connection plate. Through this, in order to provide a process table corresponding to the size and shape of the cell, the process corresponding to the size and shape of the desired cell is conveniently performed without repeatedly disassembling the entire process table and fastening and combining a plurality of bolts as in the prior art. table can be provided. In addition, since the process table is not entirely replaced and the base plate is fixed, there is no need to separate or combine the vacuum line and the exhaust line, so the time for combining and separating the vacuum line and the exhaust line from the process table can be reduced, and the desired cell The preparation time of the process table corresponding to the size and shape can be reduced. And it is possible to align the base plate and the connection plate only by coupling the base plate and the connection plate through the first alignment coupling part and the second alignment coupling part, and thus flatness work for the process table and the base plate, connection plate and It is possible to complete the preparation of the process table corresponding to the desired size and shape of the cell without the need to align the positions between the adsorption plates, and more quickly and conveniently prepare the process table. In addition, by inclining or bending the bottom surface of the cutting line groove inward, it is possible to effectively exhaust the process by-products without remaining process by-products because the airflow does not affect the outer periphery of the suction hole. Meanwhile, in a laser processing apparatus including a process table for laser processing, by adding a suction hood unit around the laser unit on the suction plate, process by-products such as fumes and particles generated on the substrate during laser processing can be effectively removed.

The meaning of "on" used in the above description includes the case of direct contact and the case of not directly contacting but located opposite to the upper or lower surface, as well as partially opposite to the upper or lower surface as a whole. It is also possible to be located oppositely, and it is used in the sense of facing away from each other or directly contacting the upper or lower surface.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the above embodiments, and common knowledge in the field to which the present invention pertains without departing from the gist of the present invention claimed in the claims. Those who have will understand that various modifications and other equivalent embodiments are possible from this. Therefore, the technical protection scope of the present invention should be determined by the claims below.

10: substrate 100: process table
110: base plate 110a: vacuum unit
110b: exhaust unit 111: vacuum hole
112: exhaust hole 115: first alignment coupling part
120: connection plate 121: first communication hole
122: exhaust communication part 123: second communication hole
125: second alignment coupling part 130: adsorption plate
131: vacuum chamber unit 132: adsorption hole
133: suction hole 134: cutting line groove
140: sealing plate 141: third communication hole
142: fourth communication hole 151: first contact pad
152: second contact pad 200: laser processing device
210: laser unit 220: suction hood unit

Claims (16)

a base plate including a vacuum unit having a vacuum hole connected to the vacuum line and an exhaust unit discharging process by-products through the exhaust hole connected to the exhaust line;
a connecting plate including a first communication hole communicating with the vacuum hole and extending in a thickness direction and a second communication hole communicating with the exhaust hole and extending in a thickness direction; and
An adsorption plate including an adsorption hole communicating with the first communication hole to adsorb a substrate and an adsorption hole communicating with the second communication hole and extending in a thickness direction;
The connection plate further includes an exhaust communication portion formed between the exhaust hole and the second communication hole or between the second communication hole and the suction hole, through which the process by-product flows,
The suction plate further includes a vacuum chamber portion formed between the first communication hole and the suction hole and communicating with the first communication hole and the suction hole. The method of claim 1,
The absorption plate and the connection plate are separable from the base plate for laser processing process table. delete The method of claim 1,
A third communication hole communicating between the vacuum hole and the first communication hole and a fourth communication hole communicating between the exhaust hole and the exhaust communication part, interposed between the base plate and the connection plate Sealing plate; process table for laser processing further comprising. The method of claim 4,
The sealing plate is provided to correspond to the exhaust communication unit,
The fourth communication hole is a process table for laser processing provided to correspond to the exhaust hole. The method of claim 4,
The process table for laser processing wherein the exhaust communication unit is provided separately from the first communication hole and the third communication hole. The method of claim 4,
The process table for laser processing further comprising a first contact pad provided around the exhaust hole and brought into close contact with the sealing plate. The method of claim 1,
A process table for laser processing further comprising a second contact pad provided around the vacuum hole and brought into close contact with the connection plate. The method of claim 1,
The vacuum unit is located in the center of the base plate,
The exhaust unit is positioned symmetrically around the vacuum unit at an edge portion of the base plate. The method of claim 1,
The base plate further includes a first alignment coupling part formed on a surface facing the connection plate,
The connection plate further comprises a second alignment coupling portion formed to correspond to the first alignment coupling portion on a surface facing the base plate. The method of claim 1,
A process table for laser processing in which a cutting line groove communicating with the suction hole is formed on the suction surface of the suction plate. The method of claim 11,
The bottom surface of the cutting line groove is inclined inward or curved, the process table for laser processing. The method of claim 11,
The cutting line groove is provided according to the cell size for cell division of the substrate,
The adsorption plate is replaceable according to the cutting line groove corresponding to the cell size,
The connection plate is a process table for laser processing that is replaceable according to a second communication hole corresponding to the suction hole of the corresponding cutting line groove. Claims 1 to 2 and claims 4 to 13 of any one of the process table for laser processing; and
Laser processing apparatus including a; laser unit for irradiating a laser along the arrangement of the suction hole on the substrate supported on the process table. The method of claim 14,
The laser processing apparatus further includes; a suction hood unit disposed on the suction plate to suck process by-products floating on the substrate. The method of claim 15
The suction hood part is disposed around the laser part laser processing apparatus.

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