JP2022001382A - Process table for laser processing and laser processing device with the same - Google Patents

Abstract

To provide a process table for laser processing that can have a connection plate and a suction plate replaced according to the size of cells into which a substrate is divided, and a laser processing device with the same.SOLUTION: The present invention relates to a process table for laser processing which is easy to assemble and detach, and a laser processing device with the same. The process table for laser processing may comprise: a base plate which has a vacuum part having a vacuum hole connecting with a vacuum line and an exhaust part for discharging a process byproduct through an exhaust hole connected to an exhaust line; a connection plate which has a first communication hole communicated with the vacuum hole and extending along a thickness and a second communication hole communicated with the exhaust hole and extending along the thickness direction; and a suction plate which has a suction hole communicated with the first communication hole and sucking a substrate and a sucking hole communicated with the second communication hole and extending along the thickness direction.SELECTED DRAWING: Figure 1

Description

The present invention relates to a process table for laser processing and a laser processing device including the process table for laser processing, and more particularly to a process table for laser processing which is easy to assemble and disassemble and a laser processing device including the process table.

Display devices (display devices) are used in mobile devices such as smartphones, tablet PCs, laptop computers, digital cameras, cameras with videos, and personal digital assistants, and electronic products such as slim TVs, display displays, and billboards. ing.

The film used for such a display device is desired by the user to use the original sheet for products such as mobile, notebook personal computer (Note-book), and watch (Watch). It is used by cutting in units of size and shape cells.

Conventionally, a process table has been designed and manufactured so that it can be cut in cell units of a desired size and shape, and smoke, particles and contamination generated during laser cutting have been performed. Process by-products such as substances were removed.

In the conventional process table, a cutting line groove is formed along the laser cutting line in order to perform laser processing according to the mounting area of the substrate and the size and shape of the cell. It had been. This forces us to separately manufacture multiple process tables according to the size and shape of the cell in order to accommodate the size and shape of various products, and the size and shape of the cell to be processed. Workers were forced to replace the process table by themselves.

Republic of Korea Published Patent Gazette No. 10-2017-0051598

The present invention provides a process table for laser processing in which the connecting plate and the suction plate can be replaced according to the size of the cell that divides the substrate, and a laser processing apparatus including the process table.

A process table for laser processing according to an embodiment of the present invention includes a base plate having a vacuum portion having a vacuum hole connected to a vacuum line and an exhaust portion having a process by-product discharged through the exhaust hole connected to the exhaust line. , A connecting plate having a first communication hole communicated with the vacuum hole and extending in the thickness direction and a second communication hole communicated with the exhaust hole and extending in the thickness direction, and communication with the first communication hole. It may be provided with a suction plate having a suction hole for sucking the substrate and a suction hole which is communicated with the second communication hole and extends in the thickness direction.

The adsorption plate and the connecting plate may be separable from the base plate.

The connecting plate is further provided with an exhaust communication portion formed between the exhaust hole and the second communication hole, or between the second communication hole and the suction hole, through which the process by-products flow. The suction plate may further include a vacuum chamber portion formed between the first communication hole and the suction hole and communicated with the first communication hole and the suction hole.

The process table for laser machining has a third communication hole for communicating the vacuum hole and the first communication hole, and a fourth communication hole for communicating the exhaust hole and the exhaust communication portion. A seal plate interposed between the base plate and the connecting plate may be further provided.

The seal plate may be arranged corresponding to the exhaust communication portion, and the fourth communication hole may be arranged corresponding to the exhaust hole.

The exhaust communication portion may be arranged so as to be defined as the first communication hole and the third communication hole.

The process table for laser processing may further include a first contact pad that is disposed around the exhaust hole and is brought into close contact with the seal plate.

The process table for laser processing may further include a second contact pad that is disposed around the vacuum hole and is brought into close contact with the connecting plate.

The vacuum portion may be located at the center of the base plate, and the exhaust portion may be located at the peripheral edge of the base plate so as to be symmetrical with respect to the vacuum portion.

The base plate further comprises a first alignment joint formed on a surface facing the base plate, the connecting plate corresponding to the first alignment joint on a surface facing the base plate. It may further include a second alignment joint to be formed.

A cut line groove communicating with the suction hole may be formed on the suction surface of the suction plate.

The bottom surface of the cut line groove may be inclined inward or bent.

The cut line groove is arranged according to the size of the cell for dividing the cell of the substrate, and the suction plate can be replaced along the cut line groove corresponding to the size of the cell. The connecting plate may be replaceable along a second communication hole corresponding to the suction hole of the corresponding cut line groove.

The laser processing apparatus according to another embodiment of the present invention is a process table for laser processing according to one embodiment of the present invention, and a laser on a substrate supported on the process table according to an arrangement of suction holes. It may be provided with a laser unit for irradiating.

The laser processing apparatus may further include a suction hood portion that is arranged on the suction plate and sucks process by-products floating on the substrate.

The suction hood portion may be arranged around the laser portion.

The process table for laser machining according to the embodiment of the present invention includes a base plate, a connecting plate and a base plate through which a vacuum hole, a first communication hole and a suction hole are communicated, and an exhaust hole, a second communication hole and a suction hole are communicated with each other. The suction plate and the substrate are supported according to the size and shape of the cell to be divided, while the base plate composed of the suction plates and connected to the external vacuum line and the exhaust line is fixed. / Or the connecting plate can be replaced. This makes it possible to easily provide a process table corresponding to a desired cell size and shape by replacing only the adsorption plate and / or the connecting plate without replacing the entire process table.

Through this, in order to provide a process table corresponding to the size and shape of the cell, it is convenient without repeating the work of disassembling the process table as a whole and tightening and joining a large number of bolts as in the conventional case. Can provide a process table corresponding to the desired cell size and shape. In addition, since the base plate is fixed and the separation and connection of the vacuum line and the exhaust line are not required without replacing the process table as a whole, the time for connecting and separating the vacuum line and the exhaust line to the process table can be shortened. This makes it possible to shorten the preparation time of the process table corresponding to the desired cell size and shape.

Incidentally, the base plate and the connecting plate can be aligned only by connecting the base plate and the connecting plate via the first positioning joint portion and the second positioning joint portion. This makes it possible to complete the process table preparation work corresponding to the desired cell size and shape without the need to perform flattening work on the process table and alignment work between the base plate, the connecting plate and the suction plate. It is possible to prepare the process table more quickly and conveniently.

In addition, by inclining or bending the bottom surface of the cut line groove inward, there are no process by-products that remain because the airflow (or exhaust flow) does not affect the outer shell around the suction hole. In addition, process by-products can be effectively exhausted.

On the other hand, in a laser processing apparatus provided with such a process table for laser processing, a suction hood portion is attached around the laser portion on the adsorption plate to generate fume and particles on the substrate during laser processing. Process by-products such as (particle) can also be effectively removed.

The perspective view which shows the process table for laser processing which concerns on one Embodiment of this invention. Sectional drawing of the process table for laser processing which concerns on one Embodiment of this invention. The conceptual diagram for demonstrating the exhaust communication part and the vacuum chamber part which concerns on one Embodiment of this invention. The conceptual diagram for demonstrating the cut line groove which concerns on one Embodiment of this invention. The figure which shows the laser processing apparatus which concerns on other embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but is embodied in various different forms, and these embodiments merely complete the disclosure of the present invention and provide ordinary knowledge. It is provided to fully inform the owner of the scope of the invention. In explaining the present invention, the same components may be designated by the same reference numerals, and the drawings may be partially exaggerated in size in order to accurately explain the embodiments of the present invention. , The same sign points to the same component.

FIG. 1 is a perspective view showing a process table for laser processing according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a process table for laser processing according to an embodiment of the present invention. It is sectional drawing which cut out the process table for laser processing of FIG. 1 along AA'.

Referring to FIGS. 1 and 2, the process table 100 for laser processing according to the embodiment of the present invention has a vacuum portion 110a having a vacuum hole 111 connected to a vacuum line and an exhaust hole 112 connected to the exhaust line. A base plate 110 having an exhaust portion 110b for discharging process by-products, a first communication hole 121 communicating with the vacuum hole 111 and extending in the thickness direction, and a first communication hole 121 communicating with the exhaust hole 112 and extending in the thickness direction. A connecting plate 120 having two communication holes 123, a suction hole 132 communicating with the first communication hole 121 to attract the substrate 10, and a suction hole extending in the thickness direction with the second communication hole 123. A suction plate 130 having 133 may be provided.

The base plate 110 may be connected and fixed to a vacuum line (not shown) and an exhaust line (not shown), and has a vacuum portion 110a having at least one vacuum hole 111 connected to the vacuum line (not shown) and an exhaust gas. It may be provided with an exhaust unit 110b that discharges process by-products through at least one exhaust hole 112 connected to a line (not shown). The vacuum portion 110a may have one or more vacuum holes 111, the vacuum holes 111 may be connected to a vacuum line (not shown), or may be evacuated by the vacuum line (not shown). May be good. Here, even if the vacuum portion 110a is evacuated to the first communication hole 121, the suction hole 132, and / or the vacuum chamber portion 131 that are communicated with the vacuum hole 111 by the vacuum pressure from the vacuum line (not shown). Often, a vacuum pressure due to evacuation may be applied to the suction holes 132.

The exhaust portion 110b may have one or more exhaust holes 112, and the exhaust holes 112 may be connected to an exhaust line (not shown), and the suction holes 133 and the second communication hole to be communicated with each other. Process by-products delivered from 123 and / or the exhaust communication unit 122 may be discharged to the outside.

The connecting plate 120 may be coupled and separated (or discoupled) from the base plate 110, or the base plate 110 and the suction plate 130 may be coupled to each other, and the first one that is communicated with the vacuum hole 111 and extends in the thickness direction. A second communication hole 123 that is communicated with the communication hole 121 and the exhaust hole 112 and extends in the thickness direction may be provided. The first communication hole 121 may be communicated with the vacuum hole 111 and extend in the thickness direction (or the upper direction), and connects the vacuum hole 111 with the suction hole 132 and / or the vacuum chamber portion 131 of the suction plate 130 ( Alternatively, it may be communicated). As a result, the suction hole 132 can be evacuated, and a vacuum pressure for sucking the substrate 10 can be applied to the suction hole 132.

The second communication hole 123 may communicate with the exhaust hole 112 and extend in the thickness direction, may communicate the exhaust hole 112 with the suction hole 133, and may be delivered from the suction hole 133 to be communicated. By-products may be delivered to the exhaust hole 112.

The suction plate 130 may suck and support (or fix) the substrate 10, or communicate with the first communication hole 121 and communicate with the suction hole 132 and the second communication hole 123 for sucking the substrate 10. It may be provided with a suction hole 133 extending in the thickness direction.

The suction hole 132 may be communicated with the first communication hole 121 and extend in the thickness direction, may be evacuated, or the substrate 10 may be sucked by the vacuum pressure due to the vacuum drawing. That is, the substrate 10 may be suction-fixed on the suction hole 132 by the vacuum pressure formed by communicating the vacuum hole 111, the first communication hole 121, and the suction hole 132. Here, the suction holes 132 may be composed of a plurality of parts, or the substrate 10 may be totally sucked at a plurality of places via the suction holes 132 dispersed at a plurality of places (or positions). The substrate 10 can be stably adsorbed and supported.

The suction hole 133 may be communicated with the second communication hole 123 and extend in the thickness direction, and the process by-products such as smoke, particles and contaminants generated in the laser processing process may be formed. It may be exhausted, or the process by-product may be delivered to the second communication hole 123. This makes it possible for the process by-products to be discharged through the suction hole 133, the second communication hole 123, and the exhaust hole 112. Here, the suction holes 133 may be composed of a plurality of suction holes 133, or the plurality of suction holes 133 may be communicated with each other via a line-shaped communication flow path, and the communication flow path is a cut line groove. It may be arranged (or formed) corresponding to 134. The structure of the suction hole 133 is not limited to this, as long as the process by-product exhausted through the suction hole 133 can be effectively delivered to the second communication hole 123 and the exhaust hole 112 and discharged.

The connecting plate 120 is formed between the exhaust hole 112 and the second communication hole 123, or between the second communication hole 123 and the suction hole 133, and further includes an exhaust communication portion 122 through which the process by-products flow. The suction plate 130 may be further provided with a vacuum chamber portion 131 formed between the first communication hole 121 and the suction hole 132 and communicated with the first communication hole 121 and the suction hole 132. May be. The exhaust communication portion 122 may be formed between the exhaust hole 112 and the second communication hole 123, or between the second communication hole 123 and the suction hole 133, and the exhaust hole 112 and the second communication hole may be formed. It may be communicated with 123 and the suction hole 133, or may be communicated (or extended) in the longitudinal direction (or horizontal direction) of the connecting plate 120, and the process by-product may flow. When the exhaust communication portion 122 is formed between the exhaust hole 112 and the second communication hole 123, the suction hole 133 and the suction hole 133 that communicate with each other by communicating the exhaust hole 112 and the second communication hole 123 and the second communication hole 123. The process by-product delivered from the second communication hole 123 can flow and be discharged through the exhaust hole 112. Incidentally, when the exhaust communication portion 122 is formed between the second communication hole 123 and the suction hole 133, the suction hole is communicated by communicating the second communication hole 123 and the suction hole 133. The process by-product delivered from 133 can flow and be discharged through the second communication hole 123. At this time, the second communication hole 123 may be communicated with the exhaust communication portion 122 and extend from the exhaust communication portion 122 in the thickness direction. Here, the exhaust communication portion 122 may communicate with one or more exhaust holes 112. For example, the process by-product delivered through one second communication hole 123 or suction hole 133 may be discharged to the plurality of exhaust holes 112, and may be discharged through the plurality of second communication holes 123 or suction hole 133. The process by-product delivered may be discharged into one exhaust hole 112. On the other hand, the process by-product delivered through the plurality of second communication holes 123 or the suction hole 133 may be discharged to the plurality of exhaust holes 112. Here, the shape of the exhaust communication portion 122 is not limited to this, and it is sufficient that the process by-products can be effectively discharged through the exhaust holes 112 that are communicated with each other by providing a flow space for the process by-products.

The vacuum chamber portion 131 may be formed between the first communication hole 121 and the suction hole 132, or may be communicated with the first communication hole 121 and the suction hole 132. That is, the vacuum chamber portion 131 may be communicated with the first communication hole 121 to perform evacuation, and the first communication hole 121 and the suction hole 132 are communicated with each other to apply a vacuum pressure to the suction hole 132. You may. Here, the vacuum chamber portion 131 may be communicated with one or more first communication holes 121, or one first communication hole 121 may be communicated with a plurality of suction holes 132, or a plurality of first communication holes 132 may be communicated with each other. The communication hole 121 of 1 may be communicated with a plurality of suction holes 132. The shape of the vacuum chamber portion 131 is not limited to this, and it is sufficient that a vacuum pressure capable of stably sucking the substrate 10 can be applied through the suction holes 132.

The process table 100 is provided along the laser cutting line in order to perform laser cutting on the substrate 10 according to the mounting area of the substrate 10 and the size and shape of the desired cell. A cutting line groove 134 may be formed. Since the laser cut line differs depending on the size and shape of the cell, the cut line groove 134 must also differ according to the different laser cut line according to the size and shape of the cell.

In the past, in order to accommodate various product sizes and shapes, it was necessary to separately manufacture multiple process tables according to the cell size and shape, and the size and shape of the cell to be processed and Workers were forced to replace the entire process table by themselves according to the shape.

However, in the process table 100 for laser processing of the present invention, the adsorption plate 130 and the connecting plate 120 are separable from the base plate 110. That is, the process table 100 for laser processing of the present invention may be composed of a base plate 110, a connecting plate 120 and a suction plate 130, and the base plate 110, the connecting plate 120 and the suction plate 130 may be assembled and removed. Thereby, in the process table 100, only the suction plate 130 on which the cut line groove 134 is formed can be replaced according to the size and shape of the desired cell. Further, the first communication hole 121, the exhaust communication portion 122 and / or depending on the position of the suction hole 133 and / or the structure (or shape) of the vacuum chamber portion 131 determined according to the position of the cut line groove 134. The position (or structure) of the second communication hole 123 may be different. Further, depending on the suction plate 130 to be replaced, the connecting plate 120 also has a first communication hole 121, an exhaust communication part 122 and a second communication hole 123 according to the position of the suction hole 133 and the structure of the vacuum chamber portion 131. It may be replaced with the connecting plate 120 in which the is formed. At this time, depending on the size and shape of the cell, the suction plate 130 that is paired (or corresponds to each other) and the connecting plate 120 may be integrated. As a result, the process table 100 corresponding to the desired cell size and shape can be easily obtained by simply replacing the integrated suction plate 130 and the connecting plate 120 collectively according to the desired cell size and shape. It can be provided, and the preparation time of the process table 100 (that is, the replacement time of the adsorption plate and the connecting plate) suitable for the desired cell size and shape can be shortened.

In other words, the base plate 110 connected to the external vacuum line (not shown) and the exhaust line (not shown) is fixed, and the substrate 10 is divided according to the size and shape of the cells to be divided. Only the supported suction plate 130 may be replaced, or only the suction plate 130 and the connecting plate 120 may be replaced. Thereby, the process table 100 corresponding to the desired cell size and shape can be easily provided by replacing only the suction plate 130 or only the suction plate 130 and the connecting plate 120 without replacing the entire process table 100. can do. Through this, in order to provide the process table 100 corresponding to the size and shape of the cell, it is not necessary to repeatedly disassemble the process table as a whole and tighten and connect a large number of bolts as in the conventional case. It is possible to conveniently provide a process table 100 corresponding to a desired cell size and shape. Further, since the base plate 110 is fixed and the separation and coupling of the vacuum line (not shown) and the exhaust line (not shown) become unnecessary without replacing the process table 100 as a whole, the vacuum line (not shown) is not required. ) And the exhaust line (not shown) can be combined and separated from the process table 100 in a short time. As a result, the preparation time of the process table 100 corresponding to the desired cell size and shape can be shortened.

In the connecting plate 120, the first communication hole 121 may be aligned with the vacuum hole 111 and laminated (or coupled) on the base plate 110, and in the suction plate 130, the suction hole 133 has a second communication hole. It may be aligned with 123 and laminated (or bonded) on the connecting plate 120. In order to effectively form a vacuum pressure in the suction hole 132, the vacuum line is provided so that the vacuum chamber portion 131 communicating with the suction hole 132 and the first communication hole 121 are effectively evacuated. It is important to align the vacuum hole 111 connected to (not shown) with the first communication hole 121 and the position of the first communication hole 121 with the vacuum chamber portion 131. In order to effectively discharge the process by-products to the exhaust hole 112 via the second communication hole 123 and the exhaust communication portion 122 via the suction hole 133, the suction hole 133 and the second communication hole 123 are provided. Alignment and alignment of the exhaust communication portion 122 and the exhaust hole 112 are important.

The connecting plate 120 may be coupled and separated from the base plate 110, may be laminated and coupled on the base plate 110, or the first communication hole 121 may be aligned and coupled to the vacuum hole 111. .. Since the vacuum hole 111 and the first communication hole 121 have substantially the same size, they will be displaced from each other if they are not aligned with each other. Therefore, the vacuum hole 111 and the first communication hole 121 are aligned with each other as the center. It is also good. When the vacuum holes 111 and the first communication hole 121 having substantially the same size are aligned, most of the exhaust holes 112 because the flat area of the exhaust communication portion 122 is further larger than the flat area of the exhaust hole 112. Is located within the flat area of the exhaust communication portion 122, and the exhaust hole 112 and the exhaust communication portion 122 can be aligned (or effectively communicated).

Here, the base plate 110 may further include a first alignment joint 115 formed on a surface facing the connecting plate 120, the connecting plate 120 having a first position on a surface facing the base plate 110. A second alignment joint portion 125 formed in correspondence with the alignment joint portion 115 may be further provided. The first alignment joint portion 115 may be formed on a surface (for example, an upper surface) of the base plate 110 facing the connection plate 120. As a result, the base plate 110 and the connecting plate 120 can be aligned by simply interacting with (for example, coupling) the second alignment coupling portion 125, and the vacuum hole is formed together with the second alignment coupling portion 125. The base plate 110 and the connecting plate 120 can be joined by aligning the 111 and the first communication hole 121.

The second alignment joint portion 125 may be formed on a surface (for example, a lower surface) of the connection plate 120 facing the base plate 110, or may be formed in correspondence with the first alignment joint portion 115. .. Here, the second alignment coupling portion 125 has a shape (for example, a protruding pin shape) of the first alignment coupling portion 115 in order to interact (for example, bond) with the first alignment coupling portion 115. ) May be formed in a shape (for example, a recessed groove or a hole), or may be arranged at a position corresponding to the first alignment coupling portion 115. The first alignment coupling portion 115 and the second alignment coupling portion 125 may align the base plate 110 and the connection plate 120 while interacting with each other such as coupling. As a result, the vacuum hole 111 and the first communication hole 121 can be easily aligned with each other only by the coupling (or interaction) between the first alignment coupling portion 115 and the second alignment coupling portion 125, and the base plate. The 110 and the connecting plate 120 can be coupled.

For example, the first alignment coupling portion 115 and the second alignment coupling portion 125 may be configured so that the base plate 110 and the coupling plate 120 are coupled and separated by a one-touch (one-touch) method. It may have a pneumatic clamp structure. Either one of the first alignment coupling portion 115 and the second alignment coupling portion 125 may be a protruding coupling projection, and the other may be a coupling projection to be fitted and fitted. It may be a pneumatic clamp that presses and fixes the coupling protrusion by air pressure.

The coupling projection and the pneumatic clamp may be arranged at positions corresponding to each other on the base plate 110 and the coupling plate 120, respectively. For example, one of the base plate 110 and the connecting plate 120 may be formed with a clamp mounting groove to which the pneumatic clamp can be mounted, and a fitting member for applying pneumatic pressure to the pneumatic clamp. A separate pneumatic flow path (not shown) may be formed that connects to an external pneumatic pump (not shown) via (not shown). The coupling protrusion fitted to the pneumatic clamp may be projected from the other of the base plate 110 and the connecting plate 120.

Depending on the structure of the first alignment joint portion 115 and the second alignment joint portion 125, the base plate 110 and the connection plate 120 can be connected and separated, and the replacement work of the connection plate 120 can be performed. It can be done very conveniently and quickly. That is, when the connecting plate 120 is placed on the base plate 110 and the corresponding first alignment coupling portion 115 and the second alignment coupling portion 125 are coupled, the coupling projection is fitted into the pneumatic clamp. By adopting a method of supplying air pressure to the pneumatic clamp in a state so that the coupling projection is pressed against the pneumatic clamp and fixed, the replacement work of the connecting plate 120 can be conveniently performed by a one-touch method. Can be done. At this time, connecting the first alignment coupling portion 115 and the second alignment coupling portion 125 means that the coupling protrusion is fitted into the pneumatic clamp.

Therefore, the base plate 110 and the connecting plate 120 can be connected and separated without the work of tightening and removing a large number of bolts, and the connecting plate 120 can be conveniently connected without repeating the work of tightening and removing a large number of bolts. Replacement work can be performed. Further, the vacuum hole 111 and the first communication hole 121 are aligned and the base plate 110 and the connecting plate 120 are aligned only by the coupling between the first alignment coupling portion 115 and the second alignment coupling portion 125. can do. Therefore, the preparation work of the process table 100 corresponding to the desired cell size and shape can be performed without the need to perform the flattening work on the process table 100 and the separate alignment work of the base plate 110 and the connecting plate 120. It can be completed, and the preparation work of the process table 100 can be performed more quickly and conveniently.

The suction plate 130 may be coupled and separated from the coupling plate 120, may be laminated and coupled on the coupling plate 120, and the suction holes 133 may be aligned and coupled to the second communication hole 123. May be good. Since the second communication hole 123 and the suction hole 133 are substantially the same in size, they will be displaced from each other if they are not aligned with each other. Therefore, the second communication hole 123 and the suction hole 133 are aligned with each other as the center. It is also good. If the second communication hole 123 and the suction hole 133 having substantially the same size are aligned, the flat area of the vacuum chamber portion 131 is even larger than the flat area of the first communication hole 121, so that most of them are present. The first communication hole 121 is located within the flat area of the vacuum chamber portion 131, and the first communication hole 121 and the vacuum chamber portion 131 can be aligned (or effectively communicated).

Here, the connecting plate 120 may further include a third positioning portion (not shown) formed on a surface facing the suction plate 130, and the suction plate 130 may have a surface facing the connecting plate 120. May further include a fourth alignment portion (not shown) formed in correspondence with the third alignment portion (not shown). The third alignment portion (not shown) may be formed on a surface (for example, an upper surface) of the connecting plate 120 facing the suction plate 130. Through this, the connecting plate 120 and the suction plate 130 can be aligned by simply interacting (for example, coupling) with the fourth alignment portion (not shown), and the second communication hole 123 and the suction plate 123 can be sucked. It can be aligned with the hole 133. At this time, the third alignment portion (not shown) may be coupled to the fourth alignment portion (not shown) while the connecting plate 120 and the suction plate 130 may be coupled to each other.

The fourth alignment portion (not shown) may be formed on the surface (for example, the lower surface) of the suction plate 130 facing the connecting plate 120, and corresponds to the third alignment portion (not shown). May be formed. Here, the fourth alignment portion (not shown) has a third alignment portion (not shown) in order to interact (for example, combine) with the third alignment portion (not shown). It may be formed in a shape corresponding to the shape of the above, or may be arranged at a position corresponding to a third alignment portion (not shown). The third alignment portion (not shown) and the fourth alignment portion (not shown) may align the connecting plate 120 and the suction plate 130 while interacting with each other such as bonding. .. As a result, the second communication hole 123 and the suction hole 133 can be easily aligned only by the interaction between the third alignment portion (not shown) and the fourth alignment portion (not shown). can do.

For example, the third alignment portion (not shown) and the fourth alignment portion (not shown) are configured so that the connecting plate 120 and the suction plate 130 are coupled and separated by a one-touch method. It may be a pneumatic clamp structure. On the other hand, even if the connecting plate 120 and the suction plate 130 are arranged in a state where the second communication hole 123 and the suction hole 133 are aligned and integrated by screwing, bonding, or the like. good. Through this, the process table 100 can be assembled (or prepared) by connecting the connecting plate 120 (that is, the integrated suction plate and the connecting plate) to the base plate 110.

3A and 3B are conceptual diagrams for explaining an exhaust communication part and a vacuum chamber part according to an embodiment of the present invention, FIG. 3A shows an exhaust communication part, and FIG. 3B shows an exhaust communication part. Indicates a vacuum chamber section.

Referring to FIG. 3, the vacuum portion 110a may be located at the center of the base plate 110, and the exhaust portion 110b may be located at the peripheral edge of the base plate 110 so as to be symmetrical with respect to the vacuum portion 110a. .. The vacuum portion 110a may be a region in which one or more vacuum holes 111 are gathered (or grouped) and arranged, or may be located in the central portion of the base plate 110. In order to improve the processing accuracy of laser processing, stable support (or fixing) of the substrate 10 is required during laser processing. Here, stable support of the substrate 10 means that the substrate 10 is not shaken or twisted even during laser processing while maintaining a state in which the substrate 10 does not bend. When the substrate 10 is sucked by the vacuum pressure through the plurality of suction holes 132, if the vacuum pressures in the plurality of suction holes 132 are dispersed, the substrate 10 may be bent due to the dispersed vacuum pressure. As the cells are divided, the divided cells may be sucked from the suction holes 132 having a low vacuum pressure into the suction holes 132 having a high vacuum pressure, and the divided cells may move. Therefore, in order to form a uniform vacuum pressure in the plurality of suction holes 132, the vacuum portion 110a may be arranged in the central portion of the base plate 110.

That is, the vacuum portion 110a sucks air in the central portion of the base plate 110, so that a uniform vacuum pressure can be formed in the plurality of suction holes 132, and the substrate 10 does not bend, and the suction holes 132 of the suction holes 132. It becomes possible to be stably adsorbed and supported on the top. Since the vacuum portion 110a applies a vacuum pressure for sucking the substrate 10 to the plurality of suction holes 132 through the plurality of vacuum holes 111, if the vacuum portion 110a is located on the peripheral edge of the base plate 110, one A plurality of vacuum holes 111 cannot be arranged symmetrically around a vacuum pump (not shown), or even if a plurality of vacuum holes 111 are arranged symmetrically, a vacuum line (not shown). There is a risk that the length of the vacuum will be too long and the vacuum pressure (or vacuum suction force) will decrease. Further, when a plurality of vacuum pumps (not shown) are used, it becomes difficult to match the vacuum pressure among the plurality of vacuum pumps (not shown). The distance from the plurality of vacuum holes 111 to the suction hole 132 at the center of the suction plate 130 may become long, and the suction (fixing) force at the center of the suction plate 130 in which the cell is mainly located may be weakened. As a result, there is a risk that the divided cells cannot be stably supported.

However, when the vacuum portion 110a is located in the central portion of the base plate 110, a plurality of vacuum lines (not shown) are centered around one vacuum pump (not shown) while preventing the length of the vacuum line (not shown) from becoming too long. The vacuum holes 111 of the above may be arranged symmetrically. As a result, uniform vacuum pressure can be stably formed in the plurality of suction holes 132, and vacuum pressure matching by a plurality of vacuum pumps (not shown) is performed using one vacuum pump (not shown). You don't have to do it. Further, since the distance from the plurality of vacuum holes 111 located in the center of the base plate 110 to the suction holes 132 in the center of the suction plate 130 is shortened, the center of the substrate 10 in which the cell is mainly located is stably sucked. The divided cells can also be stably adsorbed and supported.

The exhaust portion 110b may be a region in which one or more exhaust holes 112 are gathered (or grouped) and arranged so as to be symmetrical with respect to the vacuum portion 110a at the peripheral edge portion of the base plate 110. It may be located. That is, the exhaust portion 110b may be positioned so that the plurality of regions are symmetrical with respect to the vacuum portion 110a. Here, since the exhaust unit 110b only needs to discharge the process by-product from the suction hole 133 to the exhaust hole 112, even if the suction force (or suction pressure) of the plurality of suction holes 133 varies. It doesn't matter much. Therefore, since the suction forces of the plurality of suction holes 133 may vary, the exhaust unit 110b can be arranged on the peripheral edge of the base plate 110 and the process by-products can be discharged to the peripheral edge of the base plate 110.

At this time, if the exhaust portion 110b is asymmetrically arranged on the peripheral edge portion of the base plate 110 with the vacuum portion 110a as the center, there is a possibility that the exhaust hole 112 is not arranged on the peripheral edge portion on the opposite side of the exhaust portion 110b. Since the suction hole 133 located on the opposite peripheral edge of the suction plate 130 is too far from the exhaust hole 112, the suction force may not be normally applied, and the process by-products are smoothly exhausted. (Or it may not be discharged).

Therefore, if the exhaust portion 110b is arranged symmetrically with respect to the vacuum portion 110a on the peripheral edge portion of the base plate 110, the process by-product can be effectively discharged without a portion where the process by-product is not smoothly exhausted and accumulates. can.

The process table 100 for laser machining according to the present invention has a third communication hole 141 for communicating the vacuum hole 111 and the first communication hole 121, and a fourth communication for communicating the exhaust hole 112 and the exhaust communication portion 122. A hole 142 may be provided, further including a seal plate 140 interposed between the base plate 110 and the connecting plate 120.

The seal plate 140 may be interposed between the base plate 110 and the connecting plate 120, or may eliminate the gap (gap) between the connecting plate 120 and the base plate 110 to be attached / detached (or bonded and separated). Since the connecting plate 120 is attached to and detached from the base plate 110, a gap may occur between the connecting plate 120 and the base plate 110, and the process by-product leaks (leaks) and / or vacuum leaks (leaks) into such a gap. Leak) may occur. Therefore, by interposing the seal plate 140 between the base plate 110 and the connecting plate 120, the gap between the connecting plate 120 and the base plate 110 is suppressed or prevented in a state where the connecting plate 120 and the base plate 110 are coupled. can do. Thereby, it is possible to suppress or prevent the leakage of the process by-products and / or the leakage of the vacuum due to the gap between the connecting plate 120 and the base plate 110.

Here, the seal plate 140 includes a third communication hole 141 that communicates the vacuum hole 111 and the first communication hole 121, and a fourth communication hole 142 that communicates the exhaust hole 112 and the exhaust communication portion 122. You may. The third communication hole 141 may allow the vacuum hole 111 and the first communication hole 121 to communicate with each other, and the vacuum hole 111 connected to the vacuum line (not shown), the third communication hole 141, and the first communication hole 141. The hole 121, the vacuum chamber portion 131, and the suction hole 132 may be communicated with each other to apply a vacuum pressure to the suction hole 132. The third communication hole 141 may be arranged corresponding to the vacuum hole 111 and the first communication hole 121, and is positioned between the vacuum hole 111 and the first communication hole 121 and between the vacuum hole 111 and the first communication hole 111. And vacuum leakage may be prevented from occurring between the first communication hole 121 and the first communication hole 121. On the other hand, the third communication hole 141 may be arranged so that at least a part of the first communication hole 121 is fitted.

The fourth communication hole 142 may communicate the exhaust hole 112 and the exhaust communication portion 122, and the exhaust hole 112 connected to the exhaust line (not shown), the fourth communication hole 142, the exhaust communication portion 122, and the fourth communication hole 142. The communication hole 123 and the suction hole 133 of 2 may be communicated with each other and the process by-product may be discharged from the suction hole 133.

At this time, the seal plate 140 may be arranged corresponding to the exhaust communication portion 122, and the fourth communication hole 142 may be arranged corresponding to the exhaust hole 112. By disposing the seal plate 140 corresponding to the exhaust communication portion 122, the bottom surface of the exhaust communication portion 122 can be provided, and the process by-product is wide from the exhaust communication portion 122 to the fourth communication hole 142. It may be accumulated and discharged (or delivered) to the exhaust hole 112. The connecting plate 120 is formed with a wide exhaust communication portion 122 so that the process by-products can flow, and the first communication hole 121 is thick enough to allow the vacuum hole 111 and the vacuum chamber portion 131 to communicate with each other. Since it is only penetrated in the direction, the first communication hole 121 can sufficiently prevent the leakage of vacuum even with the second contact pad 152 or the like. However, since the exhaust communication portion 122 has a large area, it is difficult to prevent leakage of the process by-products only with the first contact pad 151. Therefore, the seal plate 140 must be arranged corresponding to the exhaust communication portion 122. be. For example, the seal plate 140 may be configured so that at least a part thereof is fitted into the internal space of the exhaust communication portion 122 to provide the bottom surface of the exhaust communication portion 122. The seal plate 140 may be configured so that at least a part of the first communication hole 121 can be fitted into the third communication hole 141.

Here, the seal plate 140 may be made of a metal material (for example, aluminum), or may be formed of a material that is not affected (for example, distortion) even if the temperature is raised by laser processing. The seal plate 140 may be bonded (or integrated with the connecting plate) to the connecting plate 120, or may be bonded to the connecting plate 120 by an adhesive (adhesive) or the like. good. On the other hand, the seal plate 140 may be formed of an elastic material (for example, rubber), and can increase the adhesion to the base plate 110 and the connecting plate 120.

Incidentally, the fourth communication hole 142 may be arranged corresponding to the exhaust hole 112, or the exhaust hole 112 and the exhaust communication portion 122 may be communicated with each other, and may be arranged within the area of the exhaust communication portion 122. May be done. As a result, the process by-products can be prevented from leaking between the exhaust hole 112 and the exhaust communication portion 122 so as to be aligned with the exhaust hole 112 and the exhaust communication portion 122.

Further, the exhaust communication portion 122 may be arranged so as to be defined (or partitioned) from the first communication hole 121 and the third communication hole 141. That is, the space (or flow path) through which the process by-products flow and the space where the vacuum is drawn may be partitioned for the discharge of the process by-products. As a result, the process by-products can be effectively discharged, and the evacuation can be smoothly performed even in the space where the evacuation is performed. The exhaust communication portion 122 is formed in the connecting plate 120 to have a wide space through which the process by-products can flow, so that the one exhaust hole 112 and the plurality of second communication holes 123 pass through the wide space communicated with each other. And the suction hole 133 can be communicated with each other. Thereby, even with a single (or a small number) exhaust holes 112, the process by-products can be exhausted (or discharged) from a plurality (or a large number) of suction holes 133.

On the other hand, the suction plate 130 is defined (or separated) from the suction hole 133 and the second communication hole 123 to form the vacuum chamber portion 131, so that the suction plate 130 has a large space inside. It becomes possible to evacuate. Through this, it is possible to effectively form a uniform vacuum pressure in a wide area of the suction plate 130 (that is, the plurality of the suction holes).

The process table 100 for laser processing according to the present invention may further include a first contact pad 151 that is disposed around the exhaust hole 112 and is brought into close contact with the seal plate 140.

The first contact pad 151 may be disposed around the exhaust hole 112 or may be in close contact with the seal plate 140. This makes it possible to prevent the process by-products from leaking between the exhaust hole 112 and the fourth communication hole 142. That is, in the first contact pad 151, the seal plate 140 interposed between the base plate 110 and the connection plate 120 may be adhered to the first contact pad 151 while the connection plate 120 is bonded to the base plate 110, and the base plate 110 may be in close contact with the opposite surface. May be in close contact. As a result, it is possible to eliminate the gap between the base plate 110 and the first contact pad 151 and between the first contact pad 151 and the seal plate 140.

Here, the first contact pad 151 may have a through hole that communicates with the exhaust hole 112 and the fourth communication hole 142, and has elasticity due to the connection between the connecting plate 120 and the base plate 110. It may be brought into close contact with the seal plate 140 and the base plate 110 while being crimped. For example, the first close contact pad 151 may be configured as a bellows type or may have an O-ring shape. However, the present invention is not limited to this, and it is sufficient that the sealing plate 140 and the base plate 110 can be brought into close contact with each other while being crimped by the bonding between the connecting plate 120 and the base plate 110.

On the other hand, when the seal plate 140 is not used, the first contact pad 151 may be in close contact with the connecting plate 120, and the first contact pad 151 has a through hole for communicating with the exhaust hole 112. The process by-product may be discharged from the exhaust communication portion 122 to the exhaust hole 112 through the through hole of the first close contact pad 151. At this time, the exhaust communication portion 122 may be formed in the internal pipeline, or a fifth communication hole (not shown) that communicates with the exhaust hole 112 may be further formed in the connecting plate 120. The through hole of the first contact pad 151 may be communicated with the exhaust hole 112 and the fifth communication hole (not shown).

The process table 100 for laser processing according to the present invention may further include a second contact pad 152 that is disposed around the vacuum hole 111 and is brought into close contact with the connecting plate 120.

The second contact pad 152 may be disposed around the vacuum hole 111 or may be in close contact with the connecting plate 120. This makes it possible to prevent a vacuum from leaking between the vacuum hole 111 and the first communication hole 121. That is, in the second contact pad 152, the connection plate 120 may be in close contact with the base plate 110 while the connection plate 120 is connected to the base plate 110, or the base plate 110 may be in close contact with the opposite surface. As a result, it is possible to eliminate the gap between the base plate 110 and the first contact pad 151 and between the first contact pad 151 and the connecting plate 120, and it is possible to prevent vacuum leakage.

Here, the second contact pad 152 may have the same shape (or structure) as the first contact pad 151, or may have a different shape, but is not limited thereto. It suffices if the connecting plate 120 and the base plate 110 can be brought into close contact with each other while being crimped by the connection between the connecting plate 120 and the base plate 110.

On the other hand, when the seal plate 140 is used, the second adhesion pad 152 may be in close contact with the seal plate 140.

4A and 4B are conceptual views for explaining a cutline groove according to an embodiment of the present invention, and FIG. 4A is a plan view (or a top view) of the cutline groove and FIG. 4A. (B) is a cross-sectional view of a cut line groove cut along BB'.

Referring to FIG. 4, a cut line groove 134 communicating with the suction hole 133 may be formed on the suction surface of the suction plate 130. The cut line groove 134 may be formed along a laser cut line for performing a laser cut on the substrate 10 according to a desired cell size and shape, and may be formed along the cut line groove 134 (s). ) The suction holes 133 may be arranged and communicated with the suction holes 133. In this way, when the cut line groove 134 is formed, it is possible to suppress or prevent the strong energy of the laser from hitting the surface of the suction plate 130 while performing laser cutting, and the suction plate 130 and the process table by the laser can be suppressed. 100 damage can be prevented.

Since the laser cut is performed along the cut line groove 134, most of the process by-products are accumulated in the cut line groove 134. Thereby, the suction hole 133 can be arranged in the cut line groove 134, and the process by-product can be intensively exhausted (or discharged) from the portion where a large amount of the process by-product is generated. It should be noted that the adsorption holes 132 can be arranged in other portions where the divided cells should be located so that the substrate 10 and the divided cells can be stably adsorbed and supported (or fixed).

Here, the bottom surface of the cut line groove 134 may be inclined inward or bent. If a corner is formed between the bottom surface of the cut line groove 134 and the side wall of the cut line groove 134, the air flow (or exhaust flow) due to the exhaust suction force affects the corner on the back side. Since there is no such process by-product, the process by-product remains. That is, due to the Coanda effect, the airflow due to the exhaust suction force is formed vertically along the side wall of the cut line groove 134, and is formed at the corner portion between the bottom surface of the cut line groove 134 and the side wall of the cut line groove 134. The accumulated process by-products cannot be guided to the suction hole 133. Therefore, by inclining or bending the bottom surface of the cut line groove 134 inward, it is possible to prevent an angle portion from being generated between the bottom surface of the cut line groove 134 and the side wall of the cut line groove 134. Can be done. It should be noted that the Coanda effect forms an airflow due to the exhaust suction force along the bottom surface of the cut line groove 134, and the process by-product that remains because the influence of the airflow due to the exhaust suction force does not affect the outer shell around the suction hole 133. Without it, the process by-products can be effectively exhausted.

The cut line groove 134 may be arranged according to the size of the cell for dividing the cell of the substrate 10. The suction plate 130 can be replaced along the cut line groove 134 corresponding to the size of the cell, and the connecting plate 120 has a second communication corresponding to the suction hole 133 of the corresponding cut line groove 134. It can be replaced along the hole 123. That is, a step of easily corresponding to the desired cell size and shape by replacing the adsorption plate 130 in which the cut line groove 134 is formed according to the mounting area of the substrate 10 and the desired cell size and shape. Table 100 can be provided.

Since the laser cut line differs depending on the size and shape of the cell, the cut line groove 134 may be arranged according to the size of the cell for dividing the cell of the substrate 10, and the size of the cell may be arranged. And may be arranged corresponding to the laser cut line which differs depending on the shape.

Since the cut line groove 134 is formed on the suction surface of the suction plate 130, it is necessary to replace the suction plate 130 in order to dispose the cut line groove 134 corresponding to the desired cell size and shape. Is. Therefore, the suction plate 130 may be arranged so as to be replaceable along the cut line groove 134 corresponding to the size of the cell.

Incidentally, if the suction plate 130 is changed, the arrangement of the suction holes 133 can be changed according to the position (and shape) of the cut line groove 134, whereby the connecting plate 120 can be cut by the corresponding cut. It can be replaced according to the second communication hole 123 corresponding to the suction hole 133 of the line groove 134. That is, the connecting plate 120 in which the second communication hole 123 is formed is replaced (or changed) in the same manner as the suction plate 130 according to the arrangement of the suction holes 133 that has changed according to the position of the cut line groove 134. Can be done.

5A and 5B are views showing a laser processing apparatus according to another embodiment of the present invention, FIG. 5A is a perspective view of the laser processing apparatus, and FIG. 5B is a laser processing apparatus. It is a side view of the apparatus.

The laser processing apparatus according to another embodiment of the present invention will be described in more detail with reference to FIG. 5, but the matters overlapping with the parts described above with respect to the process table for laser processing according to one embodiment of the present invention. Is omitted.

The laser processing apparatus 200 according to another embodiment of the present invention has the process table 100 for laser processing according to the embodiment of the present invention and the suction hole on the substrate 10 supported on the process table 100. A laser unit 210 that irradiates a laser according to the arrangement of 133 may be provided.

The process table 100 for laser processing may be the process table 100 for laser processing according to the embodiment of the present invention, and not only can the substrate 10 be stably adsorbed and supported (or fixed), but also. The process by-products generated during laser processing and accumulated on the process table 100 can also be discharged to the outside and removed.

The laser unit 210 irradiates the substrate 10 supported on the process table 100 with a laser according to the arrangement of the suction holes 133 to perform laser cutting on the substrate 10, thereby forming the substrate 10 into a cell and a dummy. Can be split. Here, the suction holes 133 may be arranged along the cut line groove 134, and the laser unit 210 may irradiate the laser along the cut line groove 134.

The laser processing apparatus 200 according to the present invention may further include a suction hood portion 220 arranged on the suction plate 130 and sucking process by-products floating on the substrate 10.

The suction hood portion 220 may be arranged on the suction plate 130, or may suck process by-products floating on the substrate 10. Through this, the process by-products accumulated on the process table 100 can be discharged through the suction hole 133, and the process by-products floating on the substrate 10 can be discharged via the suction hood unit 220. This allows for effective removal of process by-products generated during laser processing.

For example, the suction hood unit 220 has a gas injection unit (not shown) that blows gas along the surface of the substrate 10 to suspend the process by-products on the substrate 10, and a suction unit that sucks the floating process by-products (FIG. (Not shown) and may be provided. The gas injection unit (not shown) may spray gas along the surface of the substrate 10 to suspend the process by-products on the substrate 10, or remove even the process by-products attached to the surface of the substrate 10 to form particles. It is possible to suppress or prevent cell defects due to process by-products such as.

The suction section (not shown) may suck in the floating process by-products, and while performing laser processing, not only the naturally floating process by-products but also the process by-products suspended by the gas injection section (not shown). Can also be inhaled and discharged.

Incidentally, the suction hood portion 220 may be arranged around the laser portion 210, or may move integrally with the laser portion 210. For example, the laser processing apparatus 200 of the present invention may further include a drive unit (not shown) for moving the laser unit 210 and the suction hood unit 220.

The drive unit (not shown) may move the laser unit 210 and the suction hood unit 220, or may move the laser unit 210 and the suction hood unit 220 integrally and collectively. As a result, the floating process by-products can be immediately sucked in and discharged through the suction hood portion 220 while performing laser processing.

As described above, in the laser processing apparatus 200 of the present invention, the suction hood portion 220 is attached around the laser portion 210 on the suction plate 130, and process by-products such as fume and particles generated on the substrate 10 during laser processing are provided. Can also be effectively removed.

As described above, in the present invention, the base plate through which the vacuum hole, the first communication hole, the vacuum chamber portion and the suction hole are communicated, and the exhaust hole, the exhaust communication portion, the second communication hole and the suction hole are communicated, and connected. The base plate, which is composed of a plate and a suction plate and is connected to an external vacuum line and an exhaust line, is fixed, and a suction plate and / Alternatively, the connecting plate can be replaced. This makes it possible to easily provide a process table corresponding to a desired cell size and shape by replacing only the adsorption plate and / or the connecting plate without replacing the entire process table. Through this, in order to provide a process table corresponding to the size and shape of the cell, it is not necessary to repeatedly disassemble the process table as a whole and tighten and connect a large number of bolts as in the conventional case. It is possible to conveniently provide a process table corresponding to a desired cell size and shape. In addition, since the base plate is fixed and the separation and connection of the vacuum line and the exhaust line are not required without replacing the process table as a whole, the time for connecting and separating the vacuum line and the exhaust line to the process table can be shortened. This makes it possible to shorten the preparation time of the process table corresponding to the desired cell size and shape. Further, the base plate and the connecting plate can be aligned only by connecting the base plate and the connecting plate via the first alignment joint portion and the second alignment joint portion. This completes the process table preparation work corresponding to the desired cell size and shape without the need to perform flattening work on the process table and alignment work between the base plate, connecting plate and suction plate. It is possible to prepare the process table more quickly and conveniently. By inclining or bending the bottom surface of the cut line groove inward, the process by-product is effective without the process by-product that remains because the outer shell around the suction hole is not affected by the air flow. Can be exhausted to. On the other hand, in a laser processing apparatus provided with such a process table for laser processing, a suction hood portion is attached around the laser portion on the adsorption plate, and processes such as fume and particles generated on the substrate during laser processing are performed. By-products can also be effectively removed.

The meaning of "on top of" used in the above description includes the case of direct contact and the case of not directly contacting but being located facing the upper part or the lower part, and includes the upper surface or the lower part. It can be located facing the entire surface, or it can be located partially opposed, facing away from the position, or in direct contact with the upper or lower surface. It was used in the sense of doing.

Although the preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the above-described embodiments and does not deviate from the gist of the claimed invention within the scope of the claims. Anyone who has ordinary knowledge in the field to which the present invention belongs should be able to understand that various modifications can be made and other uniform embodiments can be adopted. Therefore, the technical protection scope of the present invention should be defined by the following claims.

10: Substrate 100: Process table 110: Base plate 110a: Vacuum part 110b: Exhaust part 111: Vacuum hole 112: Exhaust hole 115: First alignment joint part 120: Connecting plate 121: First communication hole 122: Exhaust communication Part 123: Second communication hole 125: Second alignment joint part 130: Suction plate 131: Vacuum chamber part 132: Suction hole 133: Suction hole 134: Cut line groove 140: Seal plate 141: Third communication hole 142: Fourth communication hole 151: First contact pad 152: Second contact pad 200: Laser processing device 210: Laser section 220: Suction hood section

Claims (16)

A base plate having a vacuum part having a vacuum hole connected to the vacuum line and an exhaust part having an exhaust part for discharging process by-products through the exhaust hole connected to the exhaust line.
A connecting plate having a first communication hole that communicates with the vacuum hole and extends in the thickness direction and a second communication hole that communicates with the exhaust hole and extends in the thickness direction.
A suction plate having a suction hole that communicates with the first communication hole to suck the substrate and a suction hole that communicates with the second communication hole and extends in the thickness direction.
A process table for laser machining. The process table for laser processing according to claim 1, wherein the adsorption plate and the connecting plate are separable from the base plate. The connecting plate is further provided with an exhaust communication portion formed between the exhaust hole and the second communication hole or between the second communication hole and the suction hole to allow the process by-products to flow. ,
The laser according to claim 1, wherein the suction plate is further provided with a vacuum chamber portion formed between the first communication hole and the suction hole and communicated with the first communication hole and the suction hole. Process table for processing. It has a third communication hole for communicating the vacuum hole and the first communication hole and a fourth communication hole for communicating the exhaust hole and the exhaust communication portion, and is between the base plate and the connection plate. The process table for laser processing according to claim 3, further comprising a seal plate interposed therein. The seal plate is arranged so as to correspond to the exhaust communication portion.
The process table for laser processing according to claim 4, wherein the fourth communication hole is arranged corresponding to the exhaust hole. The process table for laser processing according to claim 4, wherein the exhaust communication portion is arranged so as to be defined as the first communication hole and the third communication hole. The process table for laser machining according to claim 4, further comprising a first contact pad disposed around the exhaust hole and brought into close contact with the seal plate. The process table for laser machining according to claim 1, further comprising a second contact pad disposed around the vacuum hole and brought into close contact with the connecting plate. The vacuum portion is located in the central portion of the base plate.
The process table for laser processing according to claim 1, wherein the exhaust portion is located on the peripheral edge portion of the base plate so as to be symmetrical with respect to the vacuum portion. The base plate further comprises a first alignment joint formed on a surface facing the connecting plate.
The process table for laser machining according to claim 1, wherein the connecting plate further includes a second aligned joint formed on a surface facing the base plate so as to correspond to the first aligned joint. The process table for laser processing according to claim 1, wherein a cut line groove communicating with the suction hole is formed on the suction surface of the suction plate. The process table for laser machining according to claim 11, wherein the bottom surface of the cut line groove is inclined inward or bent. The cut line groove is arranged according to the size of the cell for dividing the cell of the substrate.
The suction plate can be replaced along a cut line groove corresponding to the size of the cell.
The process table for laser machining according to claim 11, wherein the connecting plate is replaceable along a second communication hole corresponding to the suction hole of the corresponding cut line groove. The process table for laser processing according to any one of claims 1 to 13.
A laser unit that irradiates a laser on a substrate supported on the process table according to the arrangement of the suction holes.
Laser processing equipment equipped with. The laser processing apparatus according to claim 14, further comprising a suction hood portion that is arranged on the suction plate and sucks process by-products floating on the substrate. The laser processing apparatus according to claim 15, wherein the suction hood portion is arranged around the laser portion.

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