KR20210157158A - Process table for laser machining and apparatus for laser machining having the same - Google Patents

Abstract

The present invention relates to a process table for laser processing and a laser processing device including the same, and more particularly, to a processing table which is easy to be assembled and disassembled and a laser processing device including the same. The process table for laser processing includes a base plate which has a vacuum part having a vacuum hole connecting with a vacuum line and an exhaust part for discharging a process byproduct through an exhaust hole connected to an exhaust line; a connection plate which has a first communication hole communicating with the vacuum hole and extending in a thickness direction and a second communication hole communicating with the exhaust hole and extending in the thickness direction; and a suction plate which has a suction hole communicating with the first communication hole and sucking a substrate and a sucking hole communicating with the second communication hole and extending in the thickness direction.

Description

Process table for laser processing and laser processing apparatus including the same

The present invention relates to a process table for laser processing and a laser processing apparatus including the same, and more particularly, to a processing table for laser processing that is easy to assemble and disassemble, and to a laser processing apparatus including the same.

A display device is used in a mobile device such as a smart phone, a tablet personal computer, a laptop computer, a digital camera, a camcorder, and a portable information terminal, or an electronic product such as a slim TV, an exhibition display, or a billboard.

Films used in such display devices are of the size and shape desired by the user in order to use the ledger sheet in products such as mobile, notebook-book, and watch. It is used by cutting in units of cells.

Conventionally, a process table is designed and manufactured so that cells of a desired size and shape can be cut, and process by-products such as fumes, particles, and contaminants generated during laser cutting was removed.

In a conventional process table, a cutting line groove is formed along a laser cutting line for laser processing according to the size and shape of the cell and the seating area of the substrate. In order to correspond to the shape and size of the cell, several process tables had to be separately manufactured according to the size and shape of the cell, and a person had to manually replace the process table according to the size and shape of the cell to be processed.

Korean Patent Publication No. 10-2017-0051598

The present invention provides a process table for laser processing in which a connection plate and a suction plate can be replaced according to the cell size for dividing a substrate, and a laser processing apparatus including the same.

A process table for laser processing according to an embodiment of the present invention includes: a base plate including a vacuum unit having a vacuum hole connected to a vacuum line, and an exhaust unit for discharging process by-products through an exhaust hole connected to the exhaust line; a connection plate including a first communication hole communicating with the vacuum hole and extending in a thickness direction and a second communication hole communicating with the exhaust hole and extending in a thickness direction; and a suction plate communicating with the first communication hole and including a suction hole for adsorbing a substrate and a suction hole communicating with the second communication hole and extending in a thickness direction.

The adsorption plate and the connection plate may be separable from the base plate.

The connection plate is formed between the exhaust hole and the second communication hole or between the second communication hole and the suction hole, and further includes an exhaust communication part through which the process by-product flows, the absorption plate is the first communication It may further include a vacuum chamber formed between the hole and the suction hole to communicate with the first communication hole and the suction hole.

a third communication hole communicating between the vacuum hole and the first communication hole and a fourth communication hole communicating between the exhaust hole and the exhaust communication part, and interposed between the base plate and the connection plate It may further include a sealing plate.

The sealing plate may be provided to correspond to the exhaust communication part, and the fourth communication hole may be provided to correspond to the exhaust hole.

The exhaust communication part may be provided separately from the first communication hole and the third communication hole.

It may further include; a first contact pad provided around the exhaust hole to be in close contact with the sealing plate.

It may further include a; provided around the vacuum hole, the second contact pad to be in close contact with the connection plate.

The vacuum unit may be located at a central portion of the base plate, and the exhaust unit may be located symmetrically around the vacuum unit at an edge portion of the base plate.

The base plate further includes a first alignment coupling portion formed on a surface facing the connection plate, the connection plate further comprising a second alignment coupling portion formed to correspond to the first alignment coupling portion on the surface facing the base plate may include

A cutting line groove communicating with the suction hole may be formed on the suction surface of the suction plate.

The bottom surface of the cutting line groove may be inclined or curved inward.

The cutting line groove is provided according to a cell size for cell division of the substrate, the suction plate is replaceable according to a cutting line groove corresponding to the cell size, and the connection plate is a suction of the corresponding cutting line groove. It may be replaceable according to the second communication hole corresponding to the hole.

Laser processing apparatus according to another embodiment of the present invention is a process table for laser processing according to an embodiment of the present invention; and a laser unit irradiating a laser along the arrangement of the suction holes on the substrate supported on the process table.

It may further include a; a suction hood disposed on the suction plate to suck the process by-products floating on the substrate.

The suction hood part may be disposed around the laser part.

The process table for laser processing according to an embodiment of the present invention is composed of a base plate, a connection plate and an adsorption plate in which the vacuum hole, the first communication hole and the suction hole communicate, and the exhaust hole, the second communication hole, and the suction hole communicate The base plate connected to the vacuum line and the exhaust line of It is possible to provide a process table corresponding to the size and shape of a desired cell simply by replacing only the adsorption plate and/or the connection plate without replacement.

Through this, in order to provide a process table corresponding to the size and shape of the cell, the process corresponding to the size and shape of the desired cell conveniently without repeating the process of disassembling the entire process table and fastening and combining a number of bolts as in the prior art A table can be provided. In addition, since the process table is not entirely replaced and the base plate is fixed, there is no need to separate and combine the vacuum line and the exhaust line, so it is possible to reduce the time for coupling and separating the vacuum line and the exhaust line to the process table, and It is possible to reduce the preparation time of the process table corresponding to the size and shape.

And it is possible to align the base plate and the connection plate only by coupling the base plate and the connection plate through the first alignment coupling part and the second alignment coupling part, and accordingly, flatness work on the process table and the base plate, connection plate and It is possible to complete the preparation of the process table corresponding to the size and shape of the desired cell without the need to align the position between the adsorption plates, and it may be possible to prepare the process table more quickly and conveniently.

In addition, since the bottom surface of the cutting line groove is inclined or curved inwardly, it is possible to effectively exhaust the process by-products without remaining process by-products because the airflow (or exhaust flow) does not affect the periphery of the suction hole.

On the other hand, the laser processing apparatus including the process table for laser processing effectively removes process by-products such as fumes and particles generated on the substrate during laser processing by adding a suction hood part around the laser part on the absorption plate. can be removed

1 is a perspective view showing a process table for laser processing according to an embodiment of the present invention.
2 is a cross-sectional view of a process table for laser processing according to an embodiment of the present invention.
3 is a conceptual diagram for explaining an exhaust communication part and a vacuum chamber part according to an embodiment of the present invention.
4 is a conceptual diagram for explaining a cutting line groove according to an embodiment of the present invention.
5 is a diagram showing a laser processing apparatus according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only these embodiments allow the disclosure of the present invention to be complete, and the scope of the invention to those of ordinary skill in the art completely It is provided to inform you. In the description, the same reference numerals are assigned to the same components, and the sizes of the drawings may be partially exaggerated in order to accurately describe the embodiments of the present invention, and the same reference numerals refer to the same elements in the drawings.

Figure 1 is a perspective view showing a process table for laser processing according to an embodiment of the present invention, Figure 2 is a cross-sectional view of the process table for laser processing according to an embodiment of the present invention, the assembled process table for laser processing of Figure 1 AA This is a cross-sectional view cut by '.

1 and 2 , the process table 100 for laser processing according to an embodiment of the present invention includes a vacuum unit 110a having a vacuum hole 111 connected to a vacuum line, and an exhaust connected to the exhaust line. a base plate 110 including an exhaust unit 110b for discharging process by-products through the hole 112; A connection plate 120 including a first communication hole 121 communicating with the vacuum hole 111 and extending in the thickness direction and a second communication hole 123 communicating with the exhaust hole 112 and extending in the thickness direction ); and a suction hole 132 communicating with the first communication hole 121 to adsorb the substrate 10 and a suction hole 133 communicating with the second communication hole 123 and extending in a thickness direction. plate 130; may include.

The base plate 110 may be fixedly connected to a vacuum line (not shown) and an exhaust line (not shown), and the vacuum unit 110a having at least one vacuum hole 111 connected to the vacuum line (not shown). ) and an exhaust unit 110b for discharging process by-products through at least one exhaust hole 112 connected to an exhaust line (not shown). The vacuum unit 110a may have one or more vacuum holes 111 , and the vacuum holes 111 may be connected to a vacuum line (not illustrated), and a vacuum may be formed by the vacuum line (not illustrated). Here, the vacuum unit 110a is in the first communication hole 121, the suction hole 132 and/or the vacuum chamber unit 131 communicating with the vacuum hole 111 by vacuum pressure by a vacuum line (not shown). A vacuum may be formed, and a vacuum pressure generated by the vacuum may be provided to the adsorption hole 132 .

The exhaust part 110b may have one or more exhaust holes 112 , and the exhaust hole 112 may be connected to an exhaust line (not shown), and the suction hole 133 and the second communication hole 123 that communicate with each other. And/or the process by-product transferred from the exhaust communication unit 122 may be discharged to the outside.

The connection plate 120 may be coupled and separated (or uncoupled) to the base plate 110 , may connect the base plate 110 and the suction plate 130 , and communicate with the vacuum hole 111 in the thickness direction It may include a first communication hole 121 extending to and a second communication hole 123 extending in the thickness direction in communication with the exhaust hole (112). The first communication hole 121 communicates with the vacuum hole 111 and may extend in the thickness direction (or upward direction), and the vacuum hole 111 and the suction hole 132 of the suction plate 130 and/or the vacuum The chamber part 131 may be connected (or communicated). Accordingly, a vacuum may be formed in the suction hole 132 , and a vacuum pressure for adsorbing the substrate 10 may be provided to the suction hole 132 .

The second communication hole 123 communicates with the exhaust hole 112 and may extend in the thickness direction, may connect between the exhaust hole 112 and the suction hole 133 , and may be separated from the communicating suction hole 133 . The transferred process by-products may be delivered to the exhaust hole 112 .

The adsorption plate 130 may adsorb and support (or fix) the substrate 10 , and communicate with the first communication hole 121 to adsorb the substrate 10 through an adsorption hole 132 and a second communication hole ( 123) and may include a suction hole 133 extending in the thickness direction.

The adsorption hole 132 communicates with the first communication hole 121 to extend in the thickness direction, and a vacuum may be formed, and the substrate 10 may be adsorbed by vacuum pressure generated by the vacuum formation. That is, the vacuum pressure formed by the vacuum hole 111 , the first communication hole 121 and the suction hole 132 communicate with each other may allow the substrate 10 to be adsorbed and fixed on the suction hole 132 . Here, the adsorption hole 132 may be composed of a plurality (pieces), and the substrate 10 may be completely adsorbed at a plurality of points through the adsorption holes 132 dispersed at a plurality of points (or positions), The substrate 10 can be stably adsorbed and supported.

The suction hole 133 communicates with the second communication hole 123 to extend in the thickness direction, and the process by-products such as fumes, particles, and contaminants generated in a laser processing process. This may be exhausted, and the process by-product may be delivered to the second communication hole 123 . Accordingly, the process by-products may be discharged through the suction hole 133 , the second communication hole 123 , and the exhaust hole 112 . Here, the suction hole 133 may be composed of a plurality (pieces), the plurality of suction holes 133 may communicate with each other through a line-shaped communication passage, and the communication passage is a cutting line groove ( 134) may be provided (or formed). The structure of the suction hole 133 is not limited thereto, and it is sufficient if the process by-product exhausted through the suction hole 133 can be effectively delivered to and discharged to the second communication hole 123 and the exhaust hole 112 .

The connection plate 120 is formed between the exhaust hole 112 and the second communication hole 123 or between the second communication hole 123 and the suction hole 133, the exhaust communication part through which the process by-product flows. It may further include 122 , and the adsorption plate 130 is formed between the first communication hole 121 and the adsorption hole 132 , and communicates with the first communication hole 121 and the adsorption hole 132 . It may further include a vacuum chamber unit 131 to be. The exhaust communication part 122 may be formed between the exhaust hole 112 and the second communication hole 123 or between the second communication hole 123 and the suction hole 133, the exhaust hole 112, It may communicate with the second communication hole 123 and the suction hole 133 , and communicate (or extend) in the longitudinal direction (or horizontal direction) of the connection plate 120 so that the process by-products may flow. When the exhaust communication part 122 is formed between the exhaust hole 112 and the second communication hole 123, by connecting the exhaust hole 112 and the second communication hole 123, the communication suction hole 133 ) and the process by-product transferred from the second communication hole 123 may flow and be discharged through the exhaust hole 112 . And when the exhaust communication part 122 is formed between the second communication hole 123 and the suction hole 133, by connecting the second communication hole 123 and the suction hole 133, the communication suction hole ( 133) may flow and be discharged through the second communication hole 123. In this case, the second communication hole 123 may communicate with the exhaust communication part 122 and extend from the exhaust communication part 122 in the thickness direction. Here, the exhaust communication unit 122 may communicate with one or more exhaust holes 112 , and the process by-products delivered through one second communication hole 123 or the suction hole 133 may be transferred to a plurality of exhaust holes ( 112 ), or the process by-products delivered through the plurality of second communication holes 123 or suction holes 133 may be discharged through one exhaust hole 112 . On the other hand, the process by-products delivered through the plurality of second communication holes 123 or suction holes 133 may be discharged to the plurality of exhaust holes 112 , and the shape of the exhaust communication part 122 is not limited thereto. Instead, it is sufficient if the process by-products can be effectively discharged through the exhaust hole 112 that communicates by providing a flow space for the process by-products.

The vacuum chamber part 131 may be formed between the first communication hole 121 and the suction hole 132 , and may communicate with the first communication hole 121 and the suction hole 132 . That is, the vacuum chamber unit 131 communicates with the first communication hole 121 to form a vacuum, and connects the first communication hole 121 and the suction hole 132 to apply a vacuum pressure to the suction hole 132 . can provide Here, the vacuum chamber unit 131 may communicate with one or more first communication holes 121 , and may communicate one first communication hole 121 with the plurality of adsorption holes 132 , or may communicate with the plurality of first communication holes 121 . One communication hole 121 may communicate with the plurality of adsorption holes 132 . The shape of the vacuum chamber part 131 is not limited thereto, and it is sufficient as long as it can provide a vacuum pressure capable of stably adsorbing the substrate 10 through the suction hole 132 .

The process table 100 has a cutting line groove along a laser cutting line for laser cutting the substrate 10 according to the seating area of the substrate 10 and the size and shape of a desired cell. A line groove 134 may be formed, and since the laser cutting line varies depending on the size and shape of the cell, the cutting line groove 134 will inevitably vary according to the laser cutting line that varies depending on the size and shape of the cell. .

Conventionally, in order to respond to various product sizes and shapes, several process tables were separately manufactured according to the size and shape of cells, and a person had to manually replace the entire process table according to the size and shape of the cell to be processed.

However, in the process table 100 for laser processing of the present invention, the suction plate 130 and the connection plate 120 may be separable from the base plate 110 . That is, the process table 100 for laser processing of the present invention is composed of a base plate 110 , a connecting plate 120 and an adsorption plate 130 , and the base plate 110 , the connecting plate 120 and the adsorption plate 130 . can be assembled and separated, and only the suction plate 130 in which the cutting line groove 134 is formed in the process table 100 can be replaced according to the size and shape of a desired cell. In addition, according to the position of the suction hole 133 and/or the structure (or shape) of the vacuum chamber part 131 determined according to the position of the cutting line groove 134 , the first communication hole 121 and the exhaust communication part ( 122) and/or the position (or structure) of the second communication hole 123 may be changed, and the connection plate 120 also has the position of the suction hole 133 and the vacuum chamber part ( According to the structure of the 131 ), the connection plate 120 in which the first communication hole 121 , the exhaust communication part 122 , and the second communication hole 123 are formed may be replaced. At this time, according to the size and shape of the cell, the matching (or corresponding) adsorption plate 130 and the connecting plate 120 may be integrated, and the integrated adsorbing plate 130 and the connecting plate 120 may be installed. It is possible to provide the process table 100 corresponding to the size and shape of the desired cell simply by replacing it at once according to the size and shape of the desired cell, and the process table 100 suitable for the size and shape of the desired cell It is possible to shorten the preparation time (ie, the replacement time of the adsorption plate and the connection plate).

In other words, the base plate 110 connected to the external vacuum line (not shown) and the exhaust line (not shown) is fixed, and the adsorption plate 130 on which the substrate 10 is supported according to the size and shape of the divided cell. ) or only the adsorption plate 130 and the connecting plate 120 can be replaced, and thus only the adsorption plate 130 or only the adsorption plate 130 and the connecting plate 120 can be replaced without replacing the entire process table 100 . It is possible to provide the process table 100 corresponding to the size and shape of a desired cell simply by replacing it. Through this, in order to provide the process table 100 corresponding to the size and shape of the cell, as in the prior art, the process table as a whole is disassembled and the desired cell size and shape are conveniently performed without repeating the operation of fastening and combining a number of bolts. A process table 100 corresponding to may be provided. In addition, since the process table 100 is not entirely replaced and the base plate 110 is fixed, separation and coupling of the vacuum line (not shown) and the exhaust line (not shown) are not required, so the vacuum line (not shown) and exhaust It is possible to reduce the time for coupling and separating the line (not shown) to the process table 100 , and it is possible to reduce the preparation time for the process table 100 corresponding to the size and shape of a desired cell.

In the connection plate 120 , the first communication hole 121 is aligned with the vacuum hole 111 to be stacked (or combined) on the base plate 110 , and the suction plate 130 has a suction hole 133 . It may be stacked (or combined) on the connection plate 120 in alignment with the second communication hole 123 . In order to effectively form a vacuum pressure in the suction hole 132 , the vacuum line (not shown) can effectively form a vacuum in the vacuum chamber part 131 and the first communication hole 121 communicating with the suction hole 132 . Alignment of the vacuum hole 111 and the first communication hole 121 connected to the , and the alignment of the first communication hole 121 and the vacuum chamber part 131 are important. And in order to effectively discharge the process by-products to the exhaust hole 112 through the second communication hole 123 and the exhaust communication part 122 through the suction hole 133, the suction hole 133 and the second communication hole 123 ) and alignment of the exhaust communication part 122 and the exhaust hole 112 are important.

The connection plate 120 may be coupled to and separated from the base plate 110 , and may be laminated and coupled on the base plate 110 , and the first communication hole 121 is aligned with the vacuum hole 111 and combined. can be Since the vacuum hole 111 and the first communication hole 121 are similar in size to each other and are misaligned when they are not aligned, the vacuum hole 111 and the first communication hole 121 may be aligned around the vacuum hole 111 and the first communication hole 121 . When the vacuum hole 111 and the first communication hole 121, which are similar in size, are aligned, the plane area of the exhaust communication part 122 is much larger than that of the exhaust hole 112, so that most of the exhaust holes 112 are exhausted. The exhaust hole 112 and the exhaust communication part 122 may be aligned (or effectively communicated) by being located within the planar area of the communication part 122 .

Here, the base plate 110 may further include a first alignment coupling part 115 formed on the surface facing the connection plate 120 , and the connection plate 120 is formed on the surface facing the base plate 110 . It may further include a second alignment coupling part 125 formed to correspond to the first alignment coupling part 115 . The first alignment coupling part 115 may be formed on a surface (eg, an upper surface) of the base plate 110 facing the connection plate 120 , and interacting with the second alignment coupling part 125 (eg, the alignment coupling part 125 ). For example, it is possible to align the base plate 110 and the connection plate 120 only by coupling), and align the vacuum hole 111 and the first communication hole 121 together with the second alignment coupling part 125 . to couple between the base plate 110 and the connection plate 120 .

The second alignment coupling part 125 may be formed on a surface (eg, a lower surface) of the connection plate 120 facing the base plate 110 , and may be formed to correspond to the first alignment coupling part 115 . can Here, the second alignment coupling part 125 has a shape (eg, a protruding pin shape) of the first alignment coupling part 115 in order to interact (eg, couple) with the first alignment coupling part 115 . ) may be formed in a shape corresponding to (eg, a concave groove or hole shape), and may be provided at a position corresponding to the first alignment coupling part 115 . The first alignment coupling part 115 and the second alignment coupling part 125 may align the base plate 110 and the connection plate 120 while interacting such as coupling, and the first alignment coupling part 115 and By simply aligning the vacuum hole 111 and the first communication hole 121 with only the coupling (or interaction) of the second alignment coupling part 125 , the base plate 110 and the connection plate 120 can be coupled. .

For example, the first alignment coupling unit 115 and the second alignment coupling unit 125 may be configured such that the base plate 110 and the connection plate 120 are coupled and separated in a one-touch manner. , may have a pneumatic clamp structure. Any one of the first alignment coupling part 115 and the second alignment coupling part 125 may be a coupling protrusion formed to protrude, and the other one may be a coupling protrusion into which the coupling protrusion is inserted, and the inserted coupling protrusion is pressed by air pressure. It may be a pneumatic clamp for fixing.

The coupling protrusion and the pneumatic clamp may be disposed at positions corresponding to each other on the base plate 110 and the connection plate 120 , and the pneumatic clamp is mounted on any one of the base plate 110 and the connection plate 120 . A separate pneumatic flow path (not shown) connected to an external pneumatic pump (not shown) through a connecting fitting member (not shown) to provide a pneumatic pressure to the pneumatic clamp. city) can be formed. In addition, the other one of the base plate 110 and the connection plate 120 may be formed with the coupling protrusion inserted into and coupled to the pneumatic clamp to protrude.

According to the structure of the first alignment coupling part 115 and the second alignment coupling part 125, the base plate 110 and the connection plate 120 can be coupled and separated, so that the replacement operation of the connection plate 120 is very easy. It can be done conveniently and quickly. That is, when the connection plate 120 is seated on the base plate 110 and the corresponding first alignment coupling part 115 and the second alignment coupling part 125 are coupled, the coupling protrusion is inserted into the pneumatic clamp and , In this state, by supplying air pressure to the pneumatic clamp, the replacement operation of the connection plate 120 can be conveniently performed in a one-touch manner in such a way that the coupling protrusion is press-fixed to the pneumatic clamp. At this time, coupling the first alignment coupling part 115 and the second alignment coupling part 125 means inserting the coupling protrusion into the pneumatic clamp.

Therefore, it is possible to couple and separate the base plate 110 and the connection plate 120 without a plurality of bolt fastening and disassembling operations, and the connection plate 120 can be conveniently connected without repeatedly performing a plurality of bolt fastening and disassembling operations. replacement can be performed. In addition, by aligning the vacuum hole 111 and the first communication hole 121 only by combining the first alignment coupling part 115 and the second alignment coupling part 125, the base plate 110 and the connection plate 120 are connected. Because it can be aligned, it corresponds to the size and shape of a desired cell without the need to perform a flatness operation for the process table 100 and a separate position alignment operation between the base plate 110 and the connection plate 120 . The preparation of the process table 100 may be completed, and the preparation of the process table 100 may be performed more quickly and conveniently.

The suction plate 130 may be coupled to and separated from the connection plate 120 , and may be stacked and coupled on the connection plate 120 , and the suction hole 133 is aligned with the second communication hole 123 and combined. can be Since the second communication hole 123 and the suction hole 133 are different from each other when they are not aligned because the sizes are similar to each other, the second communication hole 123 and the suction hole 133 can be aligned as the center. When the second communication hole 123 and the suction hole 133, which are similar in size, are aligned, most of the first communication hole ( The first communication hole 121 and the vacuum chamber part 131 may be aligned (or effectively communicated with each other) because the 121 is positioned within the planar area of the vacuum chamber part 131 .

Here, the connecting plate 120 may further include a third alignment part (not shown) formed on the surface facing the adsorption plate 130 , and the adsorption plate 130 is disposed on the surface facing the connecting plate 120 . It may further include a fourth alignment unit (not shown) formed to correspond to the third alignment unit (not shown). The third alignment unit (not shown) may be formed on a surface (eg, upper surface) of the connection plate 120 facing the suction plate 130 , and interacts with the fourth alignment unit (not shown) (eg, For example, it is possible to align the connection plate 120 and the suction plate 130 only by coupling), and the second communication hole 123 and the suction hole 133 may be aligned. In this case, the third alignment unit (not shown) may be coupled between the connection plate 120 and the adsorption plate 130 while being coupled to the fourth alignment unit (not shown).

The fourth alignment unit (not shown) may be formed on a surface (eg, a lower surface) of the suction plate 130 facing the connection plate 120 , and may be formed to correspond to the third alignment unit (not shown). can Here, the fourth alignment unit (not shown) may be formed in a shape corresponding to the shape of the third alignment unit (not shown) in order to interact (eg, couple) with the third alignment unit (not shown). , may be provided at a position corresponding to the third alignment unit (not shown). The third alignment unit (not shown) and the fourth alignment unit (not shown) may align the connection plate 120 and the adsorption plate 130 while interacting with each other, such as coupling, and the third alignment unit (not shown) time) and the fourth alignment part (not shown), it is possible to simply align the second communication hole 123 and the suction hole 133 .

For example, the third alignment unit (not shown) and the fourth alignment unit (not shown) may be configured such that the connection plate 120 and the suction plate 130 are coupled and separated in a one-touch manner, and a pneumatic clamp can be a structure. On the other hand, the connection plate 120 and the suction plate 130 may be provided in an integrated state by screwing, bonding, etc. in a state in which the second communication hole 123 and the suction hole 133 are aligned, The process table 100 may be assembled (or prepared) by coupling the connection plate 120 (ie, the integrated suction plate and the connection plate) to the base plate 110 .

3 is a conceptual view for explaining an exhaust communication part and a vacuum chamber part according to an embodiment of the present invention. FIG. 3 (a) shows the exhaust communication part, and FIG.

Referring to FIG. 3 , the vacuum unit 110a may be located at the center of the base plate 110 , and the exhaust unit 110b is symmetrical about the vacuum unit 110a at the edge of the base plate 110 . can be located The vacuum unit 110a may be a region in which one or more vacuum holes 111 are gathered (or grouped), and may be located in the center of the base plate 110 . In order to increase the processing precision of laser processing, it is necessary to stably support (or fix) the substrate 10 during laser processing. Here, the stable support of the substrate 10 means that the substrate 10 is not bent or shaken or warped even during laser processing. When the substrate 10 is adsorbed by vacuum pressure through the plurality of adsorption holes 132 and the vacuum pressure in the plurality of adsorption holes 132 is not uniform, the substrate 10 is bent due to the non-uniform vacuum pressure. As the cell is divided into cells, the divided cell may be sucked from the suction hole 132 with a low vacuum pressure to the suction hole 132 with a high vacuum pressure, so that the divided cell may move. Accordingly, in order to form a uniform vacuum pressure in the plurality of adsorption holes 132 , the vacuum unit 110a may be disposed in the center of the base plate 110 .

That is, as the vacuum unit 110a sucks air from the center of the base plate 110 , a uniform vacuum pressure may be formed in the plurality of suction holes 132 , and the substrate 10 is not bent and the suction hole is not bent. It can be stably adsorbed and supported on (132). Since the vacuum unit 110a provides a vacuum pressure for adsorbing the substrate 10 to the plurality of suction holes 132 through the plurality of vacuum holes 111 , the vacuum unit 110a is formed at the edge of the base plate 110 . In the case where it is located in the part, the plurality of vacuum holes 111 cannot be symmetrically disposed around one vacuum pump (not shown), or even if the plurality of vacuum holes 111 are symmetrically disposed, the vacuum line ( The length of the vacuum pressure (or vacuum suction power) may be lowered because the length of the tube is too long (not shown). In addition, when a plurality of vacuum pumps (not shown) are used, it is difficult to match vacuum pressures between the plurality of vacuum pumps (not shown). In addition, the distance from the plurality of vacuum holes 111 to the suction hole 132 in the center of the absorption plate 130 may be increased, so that the absorption (fixing) force of the central portion of the absorption plate 130 in which the cells are mainly located may be weakened. Accordingly, it may not be possible to stably support the divided cell.

However, when the vacuum part 110a is located in the center of the base plate 110, a plurality of vacuum holes centering on one vacuum pump (not shown) while preventing the length of the vacuum line (not shown) from becoming too long. (111) can be arranged symmetrically, and thus a uniform vacuum pressure can be stably formed in the plurality of suction holes 132, and a plurality of vacuum pumps ( (not shown) may not perform matching of vacuum pressure. In addition, the distance from the plurality of vacuum holes 111 located at the center of the base plate 110 to the suction hole 132 at the center of the suction plate 130 may be short, so the center of the substrate 10 in which the cells are mainly located. can be adsorbed stably, and the divided cells can also be adsorbed and supported stably.

The exhaust part 110b may be a region in which one or more exhaust holes 112 are gathered (or grouped), and may be positioned symmetrically around the vacuum part 110a at the edge of the base plate 110 . . That is, a plurality of regions of the exhaust unit 110b may be symmetrically positioned with respect to the vacuum unit 110a. Here, since the exhaust unit 110b only needs to discharge the process by-product from the suction hole 133 to the exhaust hole 112 , it is a big problem even if the suction power (or suction pressure) of the plurality of suction holes 133 is not uniform. does not go Accordingly, since the suction power of the plurality of suction holes 133 does not have to be uniform, the exhaust unit 110b may be disposed at the edge of the base plate 110 to discharge the process by-products to the edge of the base plate 110 . .

At this time, when the exhaust part 110b is asymmetrically disposed on the edge of the base plate 110 with the vacuum part 110a as the center, the exhaust hole 112 is not provided at the opposite edge of the exhaust part 110b. The suction hole 133 located at the opposite edge of the suction plate 130 is too far from the exhaust hole 112, so suction power may not be properly provided, and the process by-products are well exhausted ( or emission) may not be present.

Accordingly, the exhaust part 110b may be symmetrically disposed on the edge of the base plate 110 with the vacuum part 110a as the center, and the process by-products are effectively discharged without accumulating parts without evacuating the process by-products well. can do.

The process table 100 for laser processing according to the present invention is between the third communication hole 141 and the exhaust hole 112 and the exhaust communication part 122 that communicate between the vacuum hole 111 and the first communication hole 121 . A fourth communication hole 142 for communicating with the sealing plate 140 is interposed between the base plate 110 and the connection plate 120; may further include.

The sealing plate 140 may be interposed between the base plate 110 and the connection plate 120 , and a gap between the connection plate 120 and the base plate 110 that are detachably attached (or coupled and separated). can eliminate Since the connection plate 120 is detachably attached to the base plate 110 , a gap may occur between the connection plate 120 and the base plate 110 , and the gap may cause leakage and/or vacuum of the process by-products. of leakage may occur. Accordingly, by interposing the sealing plate 140 between the base plate 110 and the connection plate 120, the connection plate 120 and the base plate ( 110), it is possible to suppress or prevent the gap, and it is possible to suppress or prevent leakage of the process by-product and/or leakage of the vacuum due to the gap between the connection plate 120 and the base plate 110 .

Here, the sealing plate 140 is a third communication hole 141 that communicates between the vacuum hole 111 and the first communication hole 121 and a third communication hole 141 that communicates between the exhaust hole 112 and the exhaust communication part 122 . 4 may include a communication hole 142 . The third communication hole 141 may communicate between the vacuum hole 111 and the first communication hole 121 , and a vacuum hole 111 connected to a vacuum line (not shown) and a third communication hole 141 . , the first communication hole 121 , the vacuum chamber part 131 , and the suction hole 132 may communicate with each other to provide a vacuum pressure to the suction hole 132 . The third communication hole 141 may be provided to correspond to the vacuum hole 111 and the first communication hole 121 , and is aligned with the vacuum hole 111 and the first communication hole 121 to form the vacuum hole 111 . It is possible to prevent a vacuum leak from occurring between it and the first communication hole 121 . Meanwhile, the third communication hole 141 may be provided so that at least a portion of the first communication hole 121 is inserted.

The fourth communication hole 142 may communicate between the exhaust hole 112 and the exhaust communication part 122, and an exhaust hole 112 connected to an exhaust line (not shown), a fourth communication hole 142, The exhaust communication part 122 , the second communication hole 123 , and the suction hole 133 may communicate with each other, so that the process by-products may be discharged from the suction hole 133 .

In this case, the sealing plate 140 may be provided to correspond to the exhaust communication part 122 , and the fourth communication hole 142 may be provided to correspond to the exhaust hole 112 . The sealing plate 140 is provided corresponding to the exhaust communication part 122, thereby providing a bottom surface of the exhaust communication part 122, and the fourth communication hole ( 142) and may be discharged (or delivered) to the exhaust hole 112 . A wide exhaust communication part 122 is formed in the connection plate 120 so that the process by-products can flow, and the first communication hole 121 can communicate the vacuum hole 111 and the vacuum chamber part 131 . Since it only penetrates in the thickness direction so that it is possible, the first communication hole 121 can sufficiently prevent leakage of vacuum even with the second contact pad 152, etc., but the exhaust communication part 122 has a large area and thus the first contact hole 121 has a large area. Since it is difficult to prevent leakage of the process by-products using only the pad 151 , the pad 151 may inevitably correspond to the exhaust communication unit 122 . For example, at least a portion of the sealing plate 140 may be inserted into the internal space of the exhaust communication part 122 to provide a bottom surface of the exhaust communication part 122 . Also, the sealing plate 140 may be configured such that at least a portion of the first communication hole 121 can be inserted into the third communication hole 141 .

Here, the sealing plate 140 may be made of a metal material (eg, aluminum), and may be made of a material that is not affected (eg, deformed) even when the temperature is increased by laser processing. In addition, the sealing plate 140 may be provided by being coupled to (or integrated with) the connection plate 120 , and may be bonded to the connection plate 120 by bonding with an adhesive or the like. Meanwhile, the sealing plate 140 may be made of a material having elasticity (eg, rubber), and may increase adhesion between the base plate 110 and the connection plate 120 .

And the fourth communication hole 142 may be provided in correspondence with the exhaust hole 112 , may communicate the exhaust hole 112 and the exhaust communication part 122 , and be provided within the area of the exhaust communication part 122 . can be Accordingly, it is aligned with the exhaust hole 112 and the exhaust communication part 122 to prevent leakage of the process by-products between the exhaust hole 112 and the exhaust communication part 122 .

In addition, the exhaust communication part 122 may be provided separately from the first communication hole 121 and the third communication hole 141 . That is, for discharging the process by-products, a space (or flow path) through which the process by-products flow and a space in which a vacuum is formed may be separated. Accordingly, the process by-products can be effectively discharged, and a vacuum can be well formed even in the space where the vacuum is formed. The exhaust communication part 122 is formed on the connection plate 120 to have a wide space in which the process by-products can flow, so that one exhaust hole 112 and a plurality of second communication holes are communicated through a wide space. 123 and the suction hole 133 can be communicated, and thus the process by-products are exhausted (or discharged) from the plurality (or a plurality) of the suction holes 133 even with one (or a small number) of the exhaust holes 112 . ) can be done.

On the other hand, the suction plate 130 is separated from the suction hole 133 and the second communication hole 123, the vacuum chamber 131 is formed, so that a vacuum can be formed in a large space inside the suction plate 130, , through this, it is possible to effectively form a uniform vacuum pressure in a large area (ie, the plurality of adsorption holes) of the adsorption plate 130 .

The process table 100 for laser processing according to the present invention is provided around the exhaust hole 112 , and may further include a first contact pad 151 that is in close contact with the sealing plate 140 .

The first contact pad 151 may be provided around the exhaust hole 112 and may be in close contact with the sealing plate 140 . Accordingly, it is possible to prevent leakage of the process by-products between the exhaust hole 112 and the fourth communication hole 142 . That is, the sealing plate 140 interposed between the base plate 110 and the connection plate 120 may be in close contact with the first contact pad 151 while the connection plate 120 is coupled to the base plate 110 , The base plate 110 may be in close contact with the opposite surface. Accordingly, gaps between the base plate 110 and the first adhesion pad 151 and between the first adhesion pad 151 and the sealing plate 140 may be eliminated.

Here, the first contact pad 151 may have a through hole that communicates with the exhaust hole 112 and the fourth communication hole 142 , and has elasticity for coupling of the connection plate 120 and the base plate 110 . It can be pressed into close contact with the sealing plate 140 and the base plate 110 . For example, the first contact pad 151 may be configured in a bellows type or may have an O-ring shape, but is not limited thereto. It is sufficient if it can be in close contact with the sealing plate 140 and the base plate 110 while being compressed by bonding.

On the other hand, when the sealing plate 140 is not used, the first contact pad 151 may be in close contact with the connection plate 120 , and the first contact pad 151 may communicate with the exhaust hole 112 through a through hole. Thus, the process by-products may be discharged from the exhaust communication part 122 to the exhaust hole 112 through the through hole of the first contact pad 151 . At this time, the exhaust communication part 122 may be formed as an inner pipe in the connection plate 120 , and a fifth communication hole (not shown) communicating with the exhaust hole 112 may be further formed, and the first contact pad may be formed. The through hole of 151 may communicate with the exhaust hole 112 and the fifth communication hole (not shown).

The process table 100 for laser processing according to the present invention is provided around the vacuum hole 111 , and may further include a second contact pad 152 that is in close contact with the connection plate 120 .

The second contact pad 152 may be provided around the vacuum hole 111 and may be in close contact with the connection plate 120 . Accordingly, it is possible to prevent vacuum leakage between the vacuum hole 111 and the first communication hole 121 . That is, the second contact pad 152 may be in close contact with the connecting plate 120 while the connecting plate 120 is coupled to the base plate 110 , and the base plate 110 may be in close contact with the opposite surface thereof. Accordingly, gaps between the base plate 110 and the first adhesion pad 151 and between the first adhesion pad 151 and the connection plate 120 may be eliminated, and leakage of vacuum may be prevented.

Here, the second contact pad 152 may have the same shape (or structure) as the first contact pad 151 or may have a different shape, but is not limited thereto, and the connection plate 120 and the base plate ( It is sufficient if it can be in close contact with the connection plate 120 and the base plate 110 while being compressed by the coupling of the 110).

Meanwhile, when the sealing plate 140 is used, the second contact pad 152 may be in close contact with the sealing plate 140 .

4 is a conceptual view for explaining a cutting line groove according to an embodiment of the present invention. FIG. 4 (a) is a plan view (or top view) of the cutting line groove, and FIG. A cross-sectional view taken along BB' is shown.

Referring to FIG. 4 , a cutting line groove 134 communicating with the suction hole 133 may be formed on the suction surface of the suction plate 130 . The cutting line groove 134 may be formed along a laser cutting line for laser cutting the substrate 10 according to the size and shape of a desired cell, and a (plural) suction holes 133 along the cutting line groove 134 . ) may be arranged to communicate with the suction hole 133 . In this way, when the cutting line groove 134 is formed, it is possible to suppress or prevent the strong energy of the laser from touching the surface of the absorption plate 130 during laser cutting, so that the absorption plate 130 and the process table ( 100) can be prevented.

Since laser cutting is performed along the cutting line grooves 134 , the process by-products are mostly accumulated in the cutting line grooves 134 . Accordingly, by disposing the suction hole 133 in the cutting line groove 134, it is possible to exhaust (or discharge) the process by-products intensively in a portion where a lot of the process by-products are generated. In addition, the substrate 10 and the divided cell may be stably adsorbed and supported (or fixed) by disposing the adsorption hole 132 in other portions where the divided cell is to be located.

Here, the bottom surface of the cutting line groove 134 may be inclined or curved inward. When an edge is formed between the bottom surface of the cutting line groove 134 and the side wall of the cutting line groove 134, the airflow (or exhaust flow) by the exhaust suction force does not affect the inner edge, so that the process by-product remains. . That is, the airflow by the exhaust suction force is formed vertically along the sidewall of the cutting line groove 134 due to the Coanda effect, and the bottom surface of the cutting line groove 134 and the sidewall of the cutting line groove 134 . The process by-products accumulated at the corners between them are not guided to the suction hole 133 . Accordingly, by making the bottom surface of the cutting line groove 134 inclined or curved inwardly, it is possible to prevent a corner from being formed between the bottom surface of the cutting line groove 134 and the side wall of the cutting line groove 134, By the Coanda effect, an airflow by the exhaust suction force is formed along the bottom surface of the cutting line groove 134, so that the airflow due to the exhaust suction force does not affect the periphery of the suction hole 133, so that the process byproduct remains Process by-products can be effectively exhausted.

The cutting line groove 134 may be provided according to the cell size for cell division of the substrate 10, and the suction plate 130 may be replaceable according to the cutting line groove 134 corresponding to the cell size, The connection plate 120 may be replaceable according to the second communication hole 123 corresponding to the suction hole 133 of the corresponding cutting line groove 134 . That is, by replacing the suction plate 130 having the cutting line grooves 134 formed in accordance with the seating area of the substrate 10 and the size and shape of the desired cell, the process table 100 corresponding to the size and shape of the desired cell is simple. ) can be provided.

Since the laser cutting line varies depending on the size and shape of the cell, the cutting line groove 134 may be provided according to the cell size for cell division of the substrate 10, and the laser cutting line varies depending on the size and shape of the cell. It may be provided corresponding to the line.

Since the cutting line groove 134 is formed on the suction surface of the suction plate 130, it is necessary to replace the suction plate 130 in order to provide the cutting line groove 134 corresponding to the size and shape of the desired cell, Accordingly, the suction plate 130 may be provided to be replaceable according to the cutting line groove 134 corresponding to the size of the cell.

And when the suction plate 130 is changed, the arrangement of the suction holes 133 may be changed depending on the position (and shape) of the cutting line groove 134 . Accordingly, the connection plate 120 is connected to the corresponding cutting line. It may be replaceable according to the second communication hole 123 corresponding to the suction hole 133 of the groove 134 . That is, the connection plate 120 having the second communication hole 123 formed therein according to the arrangement of the suction hole 133 changed according to the position of the cutting line groove 134 can be replaced (or changed) like the suction plate 130 . can

Figure 5 is a diagram showing a laser processing apparatus according to another embodiment of the present invention, Figure 5 (a) shows a perspective view of the laser processing apparatus, Figure 5 (b) shows a side view of the laser processing apparatus.

A laser processing apparatus according to another embodiment of the present invention will be looked at in more detail with reference to FIG. 5, and the details overlapping with those described above in relation to the process table for laser processing according to an embodiment of the present invention will be omitted.

Laser processing apparatus 200 according to another embodiment of the present invention is a process table 100 for laser processing according to an embodiment of the present invention; and a laser unit 210 irradiating a laser along the arrangement of the suction holes 133 on the substrate 10 supported on the process table 100 .

The process table 100 for laser processing may be a process table 100 for laser processing according to an embodiment of the present invention, and not only can stably adsorb and support (or fix) the substrate 10, but also be generated during laser processing. The process by-products accumulated on the process table 100 may also be removed by discharging to the outside.

The laser unit 210 laser cuts the substrate 10 by irradiating a laser along the arrangement of the suction holes 133 on the substrate 10 supported on the process table 100 to separate the substrate 10 from the cell. Can be divided into piles. Here, the suction holes 133 may be arranged along the cutting line groove 134 , and the laser unit 210 may irradiate a laser along the cutting line groove 134 .

The laser processing apparatus 200 according to the present invention may further include a suction hood unit 220 disposed on the suction plate 130 to suck the process by-products floating on the substrate 10 .

The suction hood unit 220 may be disposed on the adsorption plate 130 , and may suck process by-products floating on the substrate 10 . Through this, the process by-products accumulated on the process table 100 can be discharged through the suction hole 133 , and the process by-products floating on the substrate 10 can be discharged through the suction hood 220 , , it is possible to effectively remove process by-products generated during laser processing.

For example, the suction hood unit 220 may include a gas injection unit (not shown) configured to suspend a process by-product on the substrate 10 by injecting a gas along the surface of the substrate 10 ; and a suction unit (not shown) for sucking the floating process by-products. The gas spraying unit (not shown) can suspend the process by-products on the substrate 10 by spraying gas along the surface of the substrate 10, and removes even the process by-products adhering to the surface of the substrate 10 to remove particles, etc. Cell defects caused by process by-products can be suppressed or prevented.

The suction unit (not shown) can suck the floating process by-products, and it can suck and discharge not only the process by-products floating naturally during laser processing, but also the process by-products suspended by the gas injection unit (not shown). .

In addition, the suction hood unit 220 may be disposed around the laser unit 210 , and may move integrally with the laser unit 210 . For example, the laser processing apparatus 200 of the present invention may further include a driving unit (not shown) for moving the laser unit 210 and the suction hood unit 220 .

The driving unit (not shown) may move the laser unit 210 and the suction hood unit 220 , and may move the laser unit 210 and the suction hood unit 220 together. Accordingly, the process by-products floating while laser processing can be directly sucked and discharged through the suction hood 220 .

In this way, the laser processing apparatus 200 of the present invention adds a suction hood 220 around the laser unit 210 on the absorption plate 130 to generate fumes and particles on the substrate 10 during laser processing. Process by-products such as etc. can be effectively removed.

As such, in the present invention, the vacuum hole, the first communication hole, the vacuum chamber part and the suction hole communicate with each other, and the exhaust hole, the exhaust communication part, the second communication hole and the suction hole communicate with the base plate, the connection plate and the suction plate. The base plate connected to the external vacuum line and the exhaust line is fixed, and the adsorption plate and/or the connecting plate on which the substrate is supported can be replaced according to the size and shape of the divided cell, and thus the entire process table can be replaced without replacement. It is possible to provide a process table corresponding to the size and shape of a desired cell simply by replacing only the adsorption plate and/or the connection plate. Through this, in order to provide a process table corresponding to the size and shape of the cell, the process corresponding to the size and shape of the desired cell conveniently without repeating the process of disassembling the entire process table and fastening and combining a number of bolts as in the prior art A table can be provided. In addition, since the process table is not entirely replaced and the base plate is fixed, there is no need to separate and combine the vacuum line and the exhaust line, so it is possible to reduce the time for coupling and separating the vacuum line and the exhaust line to the process table, and It is possible to reduce the preparation time of the process table corresponding to the size and shape. And it is possible to align the base plate and the connection plate only by coupling the base plate and the connection plate through the first alignment coupling part and the second alignment coupling part, and accordingly, flatness work on the process table and the base plate, connection plate and It is possible to complete the preparation of the process table corresponding to the size and shape of the desired cell without the need to align the position between the adsorption plates, and it may be possible to prepare the process table more quickly and conveniently. In addition, since the bottom surface of the cutting line groove is inclined or curved inward, it is possible to effectively exhaust the process by-products without remaining process by-products because the air flow does not affect the periphery of the suction hole. On the other hand, by adding a suction hood part around the laser part on the absorption plate in the laser processing apparatus including the process table for laser processing, process by-products such as fumes and particles generated on the substrate during laser processing can be effectively removed.

The meaning of “on” used in the above description includes cases in direct contact and cases in which direct contact is not made but is located opposite to the upper or lower surface, and not only partially faces the upper surface or the lower surface but also partially It is also possible to be positioned to face each other, and it is used to mean that they face away from each other or directly contact the upper surface or the lower surface.

Although preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the above-described embodiments, and common knowledge in the field to which the present invention pertains without departing from the gist of the present invention as claimed in the claims It will be understood by those having the above that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the technical protection scope of the present invention should be defined by the following claims.

10: substrate 100: process table
110: base plate 110a: vacuum unit
110b: exhaust 111: vacuum hole
112: exhaust hole 115: first alignment coupling part
120: connection plate 121: first communication hole
122: exhaust communication part 123: second communication hole
125: second alignment coupling unit 130: adsorption plate
131: vacuum chamber part 132: suction hole
133: suction hole 134: cutting line groove
140: sealing plate 141: third communication hole
142: fourth communication hole 151: first contact pad
152: second contact pad 200: laser processing device
210: laser unit 220: suction hood unit

Claims (16)

a base plate comprising: a vacuum unit having a vacuum hole connected to the vacuum line;
a connection plate including a first communication hole communicating with the vacuum hole and extending in a thickness direction and a second communication hole communicating with the exhaust hole and extending in a thickness direction; and
A process table for laser processing including a; a suction plate communicating with the first communication hole and including a suction hole for adsorbing a substrate and a suction hole communicating with the second communication hole and extending in a thickness direction. The method according to claim 1,
The adsorption plate and the connection plate are detachable from the base plate for laser processing. The method according to claim 1,
The connection plate further includes an exhaust communication part formed between the exhaust hole and the second communication hole or between the second communication hole and the suction hole, through which the process by-product flows,
The suction plate is formed between the first communication hole and the suction hole, the laser processing process table further comprising a vacuum chamber communicating with the first communication hole and the suction hole. 4. The method according to claim 3,
a third communication hole communicating between the vacuum hole and the first communication hole and a fourth communication hole communicating between the exhaust hole and the exhaust communication part, and interposed between the base plate and the connection plate Process table for laser processing further comprising a; sealing plate. 5. The method according to claim 4,
The sealing plate is provided corresponding to the exhaust communication part,
The fourth communication hole is provided in correspondence with the exhaust hole for a laser processing process table. 5. The method according to claim 4,
The exhaust communication portion is provided separately from the first communication hole and the third communication hole for a laser processing process table. 5. The method according to claim 4,
The process table for laser processing further comprising a; provided around the exhaust hole, the first contact pad in close contact with the sealing plate. The method according to claim 1,
The process table for laser processing further comprising a; provided around the vacuum hole, a second contact pad in close contact with the connection plate. The method according to claim 1,
The vacuum unit is located in the center of the base plate,
The process table for laser processing in which the exhaust unit is symmetrically positioned around the vacuum unit at an edge of the base plate. The method according to claim 1,
The base plate further includes a first alignment coupling portion formed on a surface facing the connection plate,
The connection plate is a laser processing process table further comprising a second alignment coupling portion formed to correspond to the first alignment coupling portion on a surface facing the base plate. The method according to claim 1,
A process table for laser processing in which a cutting line groove communicating with the suction hole is formed on the suction surface of the suction plate. 12. The method of claim 11,
The bottom surface of the cutting line groove is inwardly inclined or curved for a laser processing process table. 12. The method of claim 11,
The cutting line groove is provided according to a cell size for cell division of the substrate,
The suction plate is replaceable according to the cutting line groove corresponding to the cell size,
The connection plate is replaceable according to the second communication hole corresponding to the suction hole of the corresponding cutting line groove for laser processing process table. Process table for laser processing according to any one of claims 1 to 13; and
Laser processing apparatus including a; laser unit for irradiating a laser along the arrangement of the suction holes on the substrate supported on the process table. 15. The method of claim 14,
The laser processing apparatus further comprising a; a suction hood disposed on the suction plate to suck the process by-products floating on the substrate. 16. The method of claim 15,
The suction hood unit is a laser processing device disposed around the laser unit.

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