CN212397181U

CN212397181U - Reworking jig for LGA/BGA chip dispensing line

Info

Publication number: CN212397181U
Application number: CN202020278057.9U
Authority: CN
Inventors: 马晓波; 李刚; 王冬冬; 吴江雪
Original assignee: Suzhou Tongfu Chaowei Semiconductor Co ltd
Current assignee: Suzhou Tongfu Chaowei Semiconductor Co ltd
Priority date: 2020-03-09
Filing date: 2020-03-09
Publication date: 2021-01-26
Anticipated expiration: 2030-03-09

Abstract

The application discloses a tool of doing over again that is used for LGA/BGA chip dispensing line includes: a base plate; the bearing platform is arranged on the bottom plate and used for supporting the LGA/BGA chip on the carrier and separating the LGA/BGA chip from the carrier; and at least one adsorption component arranged in the bearing platform and used for adsorbing and fixing the LGA/BGA chip. The rework fixture enables the chip rework process to be free of manual product taking and placing, on one hand, contact pollution to the Pad surface of the chip caused by manual chip taking and placing during the chip rework is effectively avoided, on the other hand, glue on the chip can be prevented from contacting with the fixture or gloves, therefore, the pollution generation probability is effectively reduced, and the accuracy and operability of chip rework are improved.

Description

Reworking jig for LGA/BGA chip dispensing line

Technical Field

The application relates to the technical field of semiconductor chips, in particular to a reworking jig for an LGA/BGA packaged chip dispensing line.

Background

In the case of the LGA/BGA package chip having a plurality of chips and a heat-dissipating adhesive or an indium sheet or Flux on the chip, it is inconvenient to remove the adhesive by using a suction pen, and thus the chip needs to be placed in a rework tool for rework to remove the adhesive. Generally, during rework, a user needs to touch the side face of the chip to take the chip from the carrier and then put the chip into the rework fixture for rework, and then put the chip into the carrier after the rework is completed.

The dirty gloves with glue attached in the process can possibly touch the Pad surfaces of the LGA/BGA chips, if the glue is not adhered to the Pad surfaces in the process, after the chips pass through an ASA station at high temperature, the glue can be solidified on the nickel layer of the Pad surfaces, so that the Pad surfaces are discolored, signal conduction is influenced, or the BGA chips cannot be planted with balls, and the chips can only be scrapped under the condition, so that serious economic loss is caused.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide a rework fixture for LGA/BGA chip dispensing line, which can effectively avoid the contact contamination to the Pad surface of the product caused by manually picking and placing the product during the rework of the chip.

As a first aspect of the present application, the present application provides a rework fixture for an LGA/BGA chip dispensing line.

Preferably, the rework jig includes:

a base plate;

the bearing platform is arranged on the bottom plate and used for supporting the LGA/BGA chip on the carrier and separating the LGA/BGA chip from the carrier;

and at least one adsorption component arranged in the bearing platform and used for adsorbing and fixing the LGA/BGA chip.

Preferably, the bearing platform includes first bearing platform and second bearing platform, first bearing platform set up in the up end of bottom plate, the second bearing platform set up in the up end of first bearing platform is used for supporting LGA/BGA chip, wherein, be equipped with the through-hole of mutual intercommunication on second bearing platform, first bearing platform and the bottom plate, it sets up to run through in the through-hole of second bearing platform, first bearing platform and bottom plate adsorption component.

Preferably, the adsorption assembly comprises an adsorption column and a suction nozzle, one end of the adsorption column extends out of the through hole of the bottom plate, the other end of the adsorption column is connected with the suction nozzle, the opening of the suction nozzle faces upwards, and the upper end face of the opening is higher than the upper end face of the second bearing platform; wherein, be equipped with the gas pocket that the axial runs through on the absorption cylinder, the suction nozzle with the gas pocket is linked together.

Preferably, the number of the adsorption components is one, a group of through holes which are mutually communicated are formed in the second bearing platform, the first bearing platform and the bottom plate, and the adsorption components are located in the center of the second bearing platform.

Preferably, the upper end surface of the second supporting platform is provided with an inward-recessed clearance area, and when the LGA/BGA chip is supported on the second supporting platform, the clearance area at least covers the sensitive area of the LGA/BGA chip.

Preferably, the number of the adsorption components is multiple, multiple groups of through holes which are communicated with each other are arranged on the second bearing platform, the first bearing platform and the bottom plate, the adsorption components correspond to the multiple groups of through holes one to one, and the adsorption components are arranged around the clearance area in a surrounding mode.

Preferably, the second supporting platform is made of teflon.

Preferably, one end of the adsorption column body, which extends out of the through hole of the bottom plate, is connected with a vacuum air source through a vacuum pipeline, and a branch switch is arranged on the vacuum pipeline.

Preferably, the rework fixture further comprises a transparent cover body, and a first boss and a second boss which are used for supporting the cover body, the first boss and the second boss are arranged on the base plate, the supporting platform is located between the first boss and the second boss, and the cover body is rotatably connected to the second boss.

Preferably, a plurality of independent supporting platforms are arranged on the base plate and are used for simultaneously supporting a plurality of LGA/BGA chips.

The beneficial effect of this application:

the utility model provides a tool of doing over again passes through the bearing platform and separates chip and carrier on with the carrier and supports the chip on the bearing platform, further fix the chip through adsorption component, make the chip do over again in-process need not the manual work and get the product of putting, effectively avoided the chip to get during the chip is done over again the artifical contact pollution to chip Pad face of getting the chip and leading to, on the other hand can avoid glue and tool or the gloves contact on the chip, thereby effectively reduce the production probability of pollution, the precision and the maneuverability of chip are done over again have been improved.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

fig. 1 is a top view of a rework fixture according to an embodiment of the present application;

fig. 2 is a left side view of the rework fixture of fig. 1 of the present application;

FIG. 3 is a cross-sectional view A-A of the rework fixture of FIG. 1 of the present application;

fig. 4 is a top view of a rework fixture according to another embodiment of the present application;

FIG. 5 is a schematic view of the distribution of the adsorption assembly on the second support platform according to an embodiment of the present disclosure;

FIG. 6 is a schematic view of the distribution of the adsorption assembly on the second support platform according to another embodiment of the present disclosure;

FIG. 7 is a schematic view illustrating the distribution of the adsorption assembly on the second supporting platform according to still another embodiment of the present disclosure;

fig. 8 is a top view of a rework fixture according to another embodiment of the present application;

fig. 9 is a process flow diagram of rework of the chip dispensing line.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

It should be noted that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in an orientation or positional relationship indicated in the drawings for convenience and simplicity of description only, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting.

It should be noted that in the description of the present application, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

It should be noted that unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and include, for example, fixed or removable connections or integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In order to prevent the solder joint of the LGA/BGA chip from generating solder cracks due to vibration and deformation in the use environment, the dispensing process is an essential procedure in the production process of the LGA/BGA package chip, the main method is that after the reflow soldering of two surfaces of the SMT is completed on the substrate, the dispensing machine is used for dispensing, and then the reflow soldering furnace is used for streamline heating and curing. When the dispensing is abnormal, the chip needs to be reworked (i.e. repaired) after the glue is cleaned, for example, the reworking operations such as dispensing soldering flux, attaching indium sheet, dispensing and the like are performed again after the glue is removed.

Referring to fig. 1 to 3, a rework fixture for an LGA/BGA chip dispensing line of the present application is shown, the rework fixture includes a base plate 1, a supporting platform 2 and an adsorption component 3, wherein the supporting platform 2 is disposed on an upper end surface 10 of the base plate 1 for supporting an LGA/BGA chip 5 on a carrier 4, and separating the LGA/BGA chip 5 from the carrier 4, and the adsorption component 3 is disposed in the supporting platform 2 for adsorbing and fixing the LGA/BGA chip 5.

Specifically, when the LGA/BGA chip 5 with abnormal dispensing needs to be returned, the chip 5 placed on the carrier 4 and the carrier 4 are simultaneously transferred to the rework tool of the present application, and when the carrier 4 is placed into the rework tool of the present application from top to bottom, the carrier 2 contacts with the back surface of the substrate of the chip 5 on the carrier 4 to jack up the chip 5, and the carrier 4 passes through the carrier 2, so that the carrier 4 and the chip 5 are separated from each other. Further, at least one adsorption component 3 arranged in the supporting platform 2 is contacted with the back surface of the substrate of the chip 5, and the adsorption and the release of the target are realized through the vacuum adsorption effect.

In the present embodiment, the support base 2 plays at least the following roles: 1) the chip 5 is supported; 2) as a mounting platform for the adsorption component 3; 3) conveniently with carrier 4 and chip 5 separation, realize chip 5 from carrier 4 to the contactless transfer of doing over again tool. In this mode, make the chip by stable, firmly fix on bearing platform 2 through the supporting role of bearing platform 2 and the adsorption of adsorption component 3, then can clear up glue with the help of instruments such as inhale glue pen, glue cleaning machine, cotton stick, cotton, and then carry out the operation of doing over again to the chip, conveniently realized the chip and done over again.

In the present embodiment, the carrier 4 is a chip carrier commonly used in the art, and in a plurality of steps of the chip packaging process, the carrier needs to be used to fix the chip substrate so as to keep the substrate flat. In the present application, the carrier 4 is a rectangular frame structure formed by sequentially connecting four side plates, wherein the carrier 4 has a chip accommodating groove, and when the chip 5 and the carrier 4 are placed in the rework apparatus of the present application from top to bottom, the accommodating groove on the carrier 4 can pass through the supporting platform, so that the chip 5 is separated from the carrier 4.

It should be understood that the rework fixture of the present application may be regarded as a fixing device for chip rework or inspection, and may also be applied to processes of removing residual glue of chip semi-finished products and removing impurities attached to chips.

In some preferred embodiments, as shown in fig. 2 and 3, the supporting platform 2 includes a first supporting platform 21 and a second supporting platform 22, the first supporting platform 21 is disposed on the upper end surface 10 of the base plate 1, the second supporting platform 22 is disposed on the upper end surface 210 of the first supporting platform 21, and when the chip 5 is supported on the supporting platform 2, the upper end surface 220 of the second supporting platform 22 is in contact with the back surface of the substrate of the chip 5, that is, the chip 5 is supported on the second supporting platform 22. The adsorption component 3 is installed in the support platform 2, wherein through holes which are communicated with each other are respectively arranged on the second support platform 22, the first support platform 21 and the bottom plate 1, the adsorption component 3 is arranged in the through holes of the second support platform 22, the first support platform 21 and the bottom plate 3 in a penetrating manner, namely, the through holes which are communicated with each other and are arranged on the second support platform 22, the first support platform 21 and the bottom plate 3 jointly form an accommodating cavity of the adsorption component 3, and the adsorption component 3 is installed in the through holes, wherein the side walls of the through holes on the second support platform 22, the first support platform 21 and the bottom plate 1 can play a fixed clamping role on the adsorption component 3, or only play a fixed clamping role on the adsorption component 3 through the side walls of the through holes of the bottom plate, or fix the adsorption component 3 in the through holes in an adhesion and fusion manner.

In some preferred embodiments, as shown in fig. 3, the suction assembly 3 includes a suction cylinder 30 and a suction nozzle 31, one end of the suction cylinder 30 extends from the through hole 11 of the base plate, and the other end of the suction cylinder 30 is close to the upper end surface 220 of the second supporting platform 22 and is connected to the suction nozzle 31, wherein an opening 310 of the suction nozzle 31 faces upward and an upper end surface 311 of the opening is higher than the upper end surface 220 of the second supporting platform 22; wherein, the adsorption column 30 is provided with an air hole 33 which axially penetrates through, and the suction nozzle 31 is communicated with the air hole 33.

In the present embodiment, a vacuum is generated at the opening 310 of the suction nozzle 31 by forming a vacuum channel in the air hole 33 of the suction cylinder 30, so that the chip to be reworked is suction-fixed by using a negative pressure. In the present embodiment, the shape of the suction nozzle 31 is a horn shape, and the shape of the nozzle opening 310 is a circle.

In the present embodiment, the height of the nozzle opening upper end surface 311 above the upper end surface 220 of the second supporting platform 22 is preferably 1-5 mm, which can ensure the nozzle 31 to effectively adsorb the chip 5, and can prevent the chip 5 from being unstably placed due to an excessive height difference between the two.

In some preferred forms, the suction nozzle 31 is made of rubber.

Referring to fig. 1 and 3, a rework fixture of a preferred embodiment of the present application is shown, in this embodiment, the number of the suction assemblies 3 is one, and a set of through holes communicated with each other are correspondingly formed on the second supporting platform 22, the first supporting platform 21 and the bottom plate 1, wherein the suction assemblies 3 are located at a central position of the second supporting platform 22, that is, the central position of the second supporting platform 22 is provided with the through holes, and the suction nozzles 31 of the suction assemblies 3 are located in the through holes of the second supporting platform 22.

The rework fixture of the present embodiment is suitable for LGA/BGA chips without capacitance on the back surface of the substrate, and the contact between the back surface of the chip substrate and the second supporting platform 22 and the suction nozzle 31 does not adversely affect the performance of the chip.

Referring to fig. 4, there is shown another preferred embodiment of the rework fixture of the present application, wherein the upper end surface of the second supporting platform 22 is provided with an inward recessed void-avoiding region 221, and when the LGA/BGA chip 5 is supported on the second supporting platform 22, the void-avoiding region 221 at least covers the sensitive region of the LGA/BGA chip 5.

In the present embodiment, the sensitive region of the chip 5 may be a region where a passive element such as a capacitor is provided on the back surface of the chip, and the void-free region 221 may be provided on the upper end surface 220 of the second support table 22, so that the second support table 22 may be prevented from adversely affecting the capacitor of the chip when the chip 5 is supported on the second support table 22. In the present embodiment, the clearance area 221 is located at the center of the second supporting platform 22, that is, a hollowed-out pit is located at the center of the second supporting platform 22, wherein the hollowed-out pit may be located only on the upper end surface 220 of the second supporting platform 22, or the area where the second supporting platform 22 is located at the center may be hollowed out from the upper end surface to the lower end surface.

Further, in this embodiment, the number of the adsorption assemblies 3 is multiple, multiple sets of through holes are formed in the second supporting platform 22, the first supporting platform 21 and the bottom plate 1, the multiple adsorption assemblies 3 correspond to the multiple sets of through holes one to one, and the multiple adsorption assemblies 3 are disposed around the clearance area 221. In this embodiment, the second supporting platform 22 has a plurality of corresponding through holes around the clearance area 221, and the first supporting platform 21 and the bottom plate 1 are correspondingly provided with through holes communicated with the through holes on the second supporting platform 22, so that the plurality of adsorption assemblies 3 corresponding to the through holes one by one are arranged in the through holes.

In the present embodiment, the number of the adsorption assemblies 3 may be 2, 3, 4, 5, 6 or more, and the present application is not limited thereto. In some preferred manners, as shown in fig. 4, in order to ensure the stability and the robustness of the adsorption and the uniformity of the stress on the chip, the number of the adsorption assemblies 3 is 4, and the 4 adsorption assemblies 3 are arranged in a rectangular array around the clearance area 222. As shown in FIGS. 5-7, the number of the adsorption elements 3 may be 2, 3 or 8.

In some preferred forms of the present invention, the shape of the second supporting platform 22 or the cross section of the upper end surface 220 of the second supporting platform 22 may be rectangular, square, circular, etc., and the present invention is not limited thereto.

Further, in some preferred embodiments of the present application, the second supporting platform 22 is made of teflon. The second supporting platform made of Teflon material has at least the following advantages: 1) the antistatic performance is good; 2) teflon has low friction coefficient and lubricity, and cannot generate adverse effect on the Pad surface of the chip; 3) the heat-resistant and low-temperature-resistant performance is good; 4) has good corrosion resistance.

Further, in some preferred embodiments of the present application, as shown in fig. 2 and 3, the end of the adsorption cylinder 30 protruding from the through hole 11 of the base plate is connected to a vacuum source through a vacuum pipe 60, and a vacuum is applied to the adsorption module 3 through the vacuum source to generate an adsorption effect. In some embodiments, the adsorption cylinder 31 is connected to a vacuum generator 61 through a vacuum pipe 60, and compressed air enters the vacuum generator 61 through an air inlet pipe to generate vacuum, wherein a main switch 62 of the vacuum generator is provided on the air inlet pipe of the compressed air, and a branch switch 63 is provided on the vacuum pipe 60 where the vacuum generator 61 is connected to the adsorption cylinder 30.

Wherein, each adsorption component 3 is respectively connected with a vacuum generator 61 through a vacuum pipeline 60, and each vacuum pipeline 60 leading to each adsorption component 3 is provided with a corresponding branch switch 63.

Further, in some preferred embodiments of the present application, as shown in fig. 1 and 4, the rework fixture further includes a transparent cover 7, and the cover 7 protects the chip 5 supported on the second supporting platform 22. The cover 7 may be made of an antistatic organic polymer material or organic glass.

Further, in some preferred embodiments of the present application, as shown in fig. 1 to 4, the rework fixture further includes a first boss 81 and a second boss 82 for supporting the cover 7, the first boss 81 and the second boss 82 are disposed on the bottom plate 1, the first supporting platform 21 is located between the first boss 81 and the second boss 82, and the cover 7 is rotatably connected to the second boss 82.

In the present embodiment, there are gaps between the first boss 81 and the first supporting platform 21, and between the second boss 82 and the first supporting platform 21, respectively, when the chip 5 and the carrier 4 are placed in the rework apparatus of the present application from top to bottom, the carrier 4 passes through the second supporting platform 22, the right side plate of the carrier is located in the gap between the first boss 81 and the first supporting platform 21, the left side plate of the carrier is located in the gap between the second boss 82 and the first supporting platform 21, and the lower end surfaces of the left side plate and the right side plate of the carrier respectively abut against the upper end surface 10 of the bottom plate 1. In other ways, the carrier passing through the second support platform 22 may also be supported on the first support platform 21.

In the present embodiment, the cover 7 may be fixed to the second boss 82 by fastening, screwing, clipping, welding, or the like. In some preferred forms, the cover 7 is secured to the second boss 82 by a hinge 9 that can be rotated up and down to be opened or closed.

Further, in some preferred embodiments, as shown in fig. 1 to 4, a third boss 82 is further provided on the base plate 1, and the third boss 83 is located outside the second boss 82 and is also used for supporting the cover 7, specifically, when the cover 7 is in a closed state, the free end of the cover overlaps the first boss 81, and when the cover 7 is in an open state, the free end of the cover 7 overlaps the third boss 83.

Further, in some preferred embodiments of this application, be equipped with a plurality of bearing platform 2 of mutually independent on bottom plate 1 for support a plurality of LGA/BGA chips 5 simultaneously, this application promptly the tool of doing over again has a plurality of absorption fixed unit of constituteing by bearing platform 2 and adsorption component 3, can fix a plurality of chips on it simultaneously and do over again, wherein every adsorbs fixed unit and is connected with vacuum generator 61 through vacuum pipe 60, is equipped with branch switch 63 on every vacuum pipe 60 respectively, thereby independently carries out the control that the vacuum lets in and close to each absorption unit.

As shown in fig. 1 and 4, a first supporting platform 21 may be disposed on the upper end surface 10 of the bottom plate 1, and then a plurality of second supporting platforms 22 may be uniformly spaced on the first supporting platform 21. Or, as shown in fig. 8, a plurality of first supporting platforms 21 are uniformly distributed on the upper end surface 10 of the bottom plate 1 at intervals, and a second supporting platform 22 is respectively disposed on each of the plurality of first supporting platforms 21.

Correspondingly, the carrier 4 carrying the chip may have various receiving grooves thereon, which can simultaneously receive a plurality of chips.

The application method of the rework fixture comprises the following steps:

1) opening all the cover bodies 7, putting the carrier 4 into the base plate from top to bottom (putting the carrier into the area shown by the dotted line frame in fig. 1), jacking the chip 5 in the carrier 4 by the second supporting table 22 and supporting the chip on the second supporting table 22, penetrating the carrier 4 through the second supporting table 22, and respectively abutting the left side plate and the right side plate of the carrier 4 against the upper end surface 10 of the base plate 1;

2) turning off the branch switch 63 of the vacuum generator 61 corresponding to the vacant position where no chip is placed in the plurality of adsorption and fixation units;

3) opening a main switch 62 of the vacuum generator, closing the cover bodies 7 of other adsorption fixing units, and only opening the cover bodies 7 of the adsorption fixing units corresponding to the target reworked chips;

4) reworking the target chip by using a glue cleaner or other reworking jigs;

5) after the rework is finished, closing the cover body 7, and continuing to perform the rework operation on the next chip to be reworked;

6) after all chips are reworked, the vacuum generator main switch 62 is closed, all the cover bodies 7 are opened, and the carrier 4 is lifted to enable the chips to be in place, so that the reworking operation of the chips is completed.

In the use method, the cover body 7 can be covered to protect the chip, so that the phenomenon that when an operator carries out rework operation, sleeves or arms touch other chips at the position near the chip which is carrying out the rework operation, and the chip is polluted is prevented.

Referring to fig. 9, a rework flow chart of the dispensing line according to the present application is shown, when dispensing abnormality occurs, the chip needs to be transferred to the rework fixture of the present application for rework operation, so as to ensure chip quality.

The reworking jig of this application need not the manual work at the chip transfer in-process and gets and take the chip, has effectively avoided the manual work to get the contact pollution that probably brings when taking the transfer chip to adsorb the chip base plate back through adsorbing the subassembly, avoided the contact of glue on the chip with the reworking jig, thereby reduced the pollution probability of reworking in-process to the chip.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims

1. A rework fixture for an LGA/BGA chip dispensing line, comprising:

a base plate;

2. The rework fixture for LGA/BGA chip dispensing line of claim 1, wherein the supporting platform comprises a first supporting platform and a second supporting platform, the first supporting platform is disposed on the upper end surface of the bottom plate, the second supporting platform is disposed on the upper end surface of the first supporting platform for supporting the LGA/BGA chip, wherein the second supporting platform, the first supporting platform and the bottom plate are provided with through holes communicating with each other, and the through holes of the second supporting platform, the first supporting platform and the bottom plate are provided with the adsorption component.

3. The rework fixture for LGA/BGA chip dispensing line of claim 2, wherein said suction assembly comprises a suction cylinder and a suction nozzle, one end of said suction cylinder extends out of said through hole of said bottom plate, and the other end of said suction cylinder is connected to said suction nozzle, wherein said suction nozzle has an upward opening and an upper end surface higher than the upper end surface of said second supporting platform; wherein, be equipped with the gas pocket that the axial runs through on the absorption cylinder, the suction nozzle with the gas pocket is linked together.

4. The rework fixture for LGA/BGA chip dispensing line of claim 2, wherein the number of the absorption components is one, the second supporting platform, the first supporting platform and the bottom board are provided with a set of through holes communicating with each other, and the absorption components are located at the center of the second supporting platform.

5. The rework fixture for LGA/BGA chip dispensing line of claim 2, wherein the upper surface of the second supporting platform is provided with an inward recessed clearance area, and when the LGA/BGA chip is supported on the second supporting platform, the clearance area covers at least the sensitive area of the LGA/BGA chip.

6. The rework fixture for an LGA/BGA chip dispensing line according to claim 5, wherein the number of the absorption components is plural, the second supporting platform, the first supporting platform and the bottom plate are provided with plural sets of through holes communicated with each other, the absorption components are in one-to-one correspondence with the plural sets of through holes, and wherein the absorption components are annularly arranged around the clearance area.

7. The rework fixture for LGA/BGA chip dispensing line according to any one of claims 2 to 6, wherein the second supporting platform is made of Teflon.

8. The rework fixture for LGA/BGA chip dispensing line of claim 3, wherein the end of the absorption column protruding from the through hole of the bottom plate is connected to a vacuum air source through a vacuum pipe, and a branch switch is disposed on the vacuum pipe.

9. The rework fixture for LGA/BGA chip dispensing line of claim 1, further comprising a transparent cover and first and second bosses for supporting said cover, said first and second bosses being disposed on said bottom plate, said support platform being located between said first and second bosses, wherein said cover is rotatably connected to said second boss.

10. The rework fixture for LGA/BGA chip dispensing line of claim 1, wherein said bottom plate has a plurality of independent supporting platforms for supporting a plurality of LGA/BGA chips at the same time.