TWM493142U - Die bonding apparatus generating negative pressure to adhere material sheet and die - Google Patents
Die bonding apparatus generating negative pressure to adhere material sheet and die Download PDFInfo
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- TWM493142U TWM493142U TW103215719U TW103215719U TWM493142U TW M493142 U TWM493142 U TW M493142U TW 103215719 U TW103215719 U TW 103215719U TW 103215719 U TW103215719 U TW 103215719U TW M493142 U TWM493142 U TW M493142U
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Description
本創作係為一種固晶裝置,特別是指一種可產生負壓吸附料片及晶粒之固晶裝置。The present invention is a solid crystal device, in particular, a solid crystal device capable of generating a negative pressure adsorbing web and a crystal grain.
發光二極體(LED)係藉由在支架中的晶粒發出光線,而晶粒固定在支架上的程序稱之為「固晶」,固晶技術的優劣將影響著發光二極體品質的好壞。晶粒是從晶圓切割而來,在製造過程中,晶圓會先切割成複數顆晶粒,再藉由固晶機逐一吸取晶粒並輸送到支架上矩陣排列的端子組(電極)中進行固定,最後再將支架上的每一顆晶粒及端子組進行打線、封裝、分割等製程。The light-emitting diode (LED) emits light through the crystal grains in the support, and the process of fixing the crystal grains on the support is called "solid crystal". The advantages and disadvantages of the solid crystal technology will affect the quality of the light-emitting diode. Good or bad. The die is cut from the wafer. During the manufacturing process, the wafer is first cut into a plurality of crystal grains, and then the crystal grains are sucked one by one by the die bonding machine and transported to the terminal array (electrode) arranged in the matrix on the support. Fixing, and finally, each die and terminal group on the bracket is wired, packaged, and divided.
傳統發光二極體(LED)固晶機固晶方式是利用吸嘴接觸晶粒表面在建立真空後,再將晶粒吸取帶離藍膜,而將晶粒固定在料片上,當晶粒要固在料片上之前會先在晶粒之固晶點點上導電膠,接著將晶粒放置在料片上,使晶粒脫離吸嘴主要係利用導電膠所產生的黏滯性,隨著科技迅速發展,晶粒體積日益縮小,致使晶粒無法脫離吸嘴的問題,例如以下列舉:一、晶粒表面具有沾黏性;二、因應製程需求只能使用微量導電膠;三、導電膠本身黏滯性不佳。以上列舉的幾種方式都會使傳統固晶方式不符合製程使用,衍生出機台生產參數上調整不易或無法固晶生產等問 題,間接使機台人機比下降、機台UPH(英文:Unit Per Hour的縮寫,中文:每小時產量、能力、產能)下降、固晶精度變差。The conventional solid-state diode (LED) die-bonding machine solid-crystal mode uses the nozzle to contact the surface of the die to establish a vacuum, and then the die is sucked away from the blue film, and the die is fixed on the chip. Before being fixed on the web, the conductive paste is first placed on the solid point of the die, and then the die is placed on the web, so that the die is separated from the nozzle mainly by the viscosity of the conductive adhesive. Development, the grain volume is shrinking, resulting in the problem that the crystal grains cannot be separated from the nozzle, for example, the following: First, the surface of the crystal grain is sticky; Second, only a small amount of conductive rubber can be used according to the process requirements; Poor hysteresis. The above-mentioned several methods will make the traditional solid crystal method not conform to the process, and it is difficult to adjust the production parameters of the machine or the production of solid crystal can not be produced. The problem is that the machine-to-machine ratio is reduced indirectly, the machine UPH (English: Unit Per Hour abbreviation, Chinese: hourly output, capacity, capacity) is reduced, and the precision of the solid crystal is deteriorated.
於是,本創作人潛心研究,並配合學理之應用,終提出一種巧妙之設計,能有效改善上述缺失之可產生負壓吸附料片及晶粒之固晶裝置。Therefore, the author devote himself to research, and with the application of the theory, finally put forward a clever design, which can effectively improve the above-mentioned missing solid crystal device which can produce negative pressure adsorption material and die.
本創作的目的在於藉由承載座及其第一通氣孔、固定板及其第二通氣孔、真空產生單元之特殊設計,搭配應用料片之第三通氣孔,令自吸嘴脫附之晶粒固定於一料片上,以提高固晶作業效率,降低重工(rework)成本之功效。The purpose of this creation is to make the self-suction nozzle desorbed by the special design of the bearing seat and its first vent hole, the fixing plate and its second vent hole, and the vacuum generating unit, together with the third vent hole of the application piece. The granules are fixed on a web to improve the efficiency of the die bonding operation and reduce the cost of rework.
本創作為達到上述目的所採用之技術手段為可產生負壓吸附料片及晶粒之固晶裝置,係將一自吸嘴脫附之晶粒固定於一料片上,包括:一承載座,其上方係設有一容置槽,該容置槽係設有多數個第一通氣孔;一固定板,設置於該容置槽內,且該固定板係設有多數個第二通氣孔;一真空產生單元,包含一抽氣馬達、一控制閥及一抽氣管,該些抽氣管之一端係連接該抽氣馬達,其另一端係連接該些第一通氣孔;其中,所述料片係設置於該固定板上,且料片設有多數個第三通氣孔,所述第一通氣孔、第二通氣孔與第三通氣孔之間係互相連通,以供氣體流通。The technical means adopted for the above purpose is a solid crystal device capable of generating a negative pressure absorbing material and a die, and fixing a die detached from the suction nozzle to a material, comprising: a carrier. A plurality of first vent holes are disposed in the accommodating groove; a fixing plate is disposed in the accommodating groove, and the fixing plate is provided with a plurality of second vent holes; The vacuum generating unit comprises a pumping motor, a control valve and an exhausting pipe, one of the exhausting pipes is connected to the pumping motor, and the other end is connected to the first venting holes; wherein the material is The material is disposed on the fixing plate, and the material piece is provided with a plurality of third ventilation holes, and the first ventilation holes, the second ventilation holes and the third ventilation holes communicate with each other to allow gas to circulate.
在本創作的實施例中,該承載座之一側設有一可轉動之樞接件,該樞接件設有一第一接合部。In the embodiment of the present invention, one side of the carrier is provided with a pivotable pivoting member, and the pivoting member is provided with a first engaging portion.
在本創作的實施例中,更包含一壓板,該壓板之一側設有一第二接合部,該第二接合部與該第一接合部係互相對應接合。In an embodiment of the present invention, a pressure plate is further disposed, and a second joint portion is disposed on one side of the pressure plate, and the second joint portion and the first joint portion are coupled to each other.
為了能更清楚地描述本創作所提出之可產生負壓吸附料片及晶粒之固晶裝置,將藉由以下之實施例及附呈圖式作進一步之說明。In order to more clearly describe the solid crystal device of the present invention which can produce a negative pressure absorbing material and a die, the following embodiments and accompanying drawings will be further described.
10‧‧‧承載座10‧‧‧Hosting
11‧‧‧容置槽11‧‧‧ accommodating slots
12‧‧‧第一通氣孔12‧‧‧First vent
13‧‧‧樞接件13‧‧‧ pivotal parts
131‧‧‧第一接合部131‧‧‧First joint
20‧‧‧固定板20‧‧‧ fixed board
22‧‧‧第二通氣孔22‧‧‧second vent
30‧‧‧真空產生單元30‧‧‧vacuum generating unit
31‧‧‧抽氣馬達31‧‧‧Exhaust motor
32‧‧‧抽氣管32‧‧‧Exhaust pipe
33‧‧‧控制閥33‧‧‧Control valve
40‧‧‧料片40‧‧‧materials
42‧‧‧第三通氣孔42‧‧‧ third vent
50‧‧‧壓板50‧‧‧ pressure plate
51‧‧‧第二接合部51‧‧‧Second joint
A‧‧‧部分Part A‧‧‧
C‧‧‧晶粒C‧‧‧ grain
D‧‧‧對應點D‧‧‧ corresponding point
S‧‧‧吸嘴S‧‧‧ nozzle
P‧‧‧預定放置區P‧‧‧Predetermined placement area
第1圖為本創作實施例的立體圖。Fig. 1 is a perspective view of the present embodiment.
第2圖為本創作實施例的元件分解圖。Fig. 2 is an exploded view of the components of the present embodiment.
第3圖為第1圖之A部分放大的平面示意圖。Fig. 3 is an enlarged plan view showing a portion A of Fig. 1.
第4圖為本創作實施例之吸嘴吸取晶粒對準於料片之預定放置區P的側視圖。Figure 4 is a side elevational view of the predetermined placement zone P of the nozzle picking die aligned with the web in the present embodiment.
第5圖為本創作實施例之吸嘴吸取晶粒放置於料片之預定放置區P的側視圖。Figure 5 is a side elevational view of the nozzle in which the suction nozzle is placed in the predetermined placement area P of the web of the present embodiment.
第6圖為本創作之實施例自吸嘴脫附之晶粒固定於料片上的側視圖。Figure 6 is a side elevational view of the die of the present invention in which the die detached from the nozzle is fixed to the web.
請參閱第1~6圖,為本創作之可產生負壓吸附料片及晶粒之固晶裝置,係將一自吸嘴S脫附之晶粒C固定於一料片40上,包括:一承載座10、一固定板20、一真空產生單元30。Please refer to the figures 1~6, which is a solid crystal device capable of generating a negative pressure absorbing material and a die. The die C desorbed from the suction nozzle S is fixed on a material 40, including: A carrier 10, a fixing plate 20, and a vacuum generating unit 30.
所述承載座10,其上方設有一容置槽11,該容置槽11係設有多數個第一通氣孔12,本實施例中,該承載座10之一側設有一可轉動之樞接件13,該樞接件13設有一第一接合部131。The locating base 10 is provided with a accommodating slot 11 . The accommodating slot 11 is provided with a plurality of first venting holes 12 . In this embodiment, a pivoting pivot is provided on one side of the cradle 10 . The member 13 is provided with a first engaging portion 131.
所述固定板20,對應容置於該容置槽11,且該固定板20係設有多數個第二通氣孔22,該些第二通氣孔22與該些第一通氣孔12係互相連通,以供氣體流通,本實施例中,該固定板20之一側設有手提孔,以利於 移動而方便架設、保養或更換。The fixing plate 20 is correspondingly disposed in the accommodating groove 11 , and the fixing plate 20 is provided with a plurality of second vent holes 22 , and the second vent holes 22 and the first vent holes 12 are connected to each other. In the embodiment, a hole is provided on one side of the fixing plate 20 to facilitate the circulation of the gas. Move and easy to set up, maintain or replace.
所述真空產生單元30,包含一抽氣馬達31、一控制閥33及一抽氣管32,該抽氣管32之一端係連接該抽氣馬達31,且該抽氣管之另一端係連接該第一通氣孔12,而該控制閥33係配設於該抽氣管32上。The vacuum generating unit 30 includes a pumping motor 31, a control valve 33 and an exhausting pipe 32. One end of the exhausting pipe 32 is connected to the pumping motor 31, and the other end of the pumping pipe is connected to the first The vent hole 12 is disposed, and the control valve 33 is disposed on the air suction pipe 32.
所述料片40係設置於該固定板20上,且該料片40設有多數個第三通氣孔42,該些第三通氣孔42與該些第二通氣孔22係互相連通,以供氣體流通,本實施例中,該料片40設有各晶粒C之預定放置區P,所述預定放置區P為方形區域,各預定放置區P設有四個第三通氣孔42,但非以此為限,該些第三通氣孔42之設置必須考慮到晶粒C點膠處之對應點D。The material piece 40 is disposed on the fixing plate 20, and the material piece 40 is provided with a plurality of third ventilation holes 42. The third ventilation holes 42 and the second ventilation holes 22 are connected to each other for In the present embodiment, the web 40 is provided with a predetermined placement area P of each of the crystal grains C, the predetermined placement area P is a square area, and each of the predetermined placement areas P is provided with four third ventilation holes 42, but Without limitation, the arrangement of the third vent holes 42 must take into account the corresponding point D of the die C glue.
本創作之可產生負壓吸附料片及晶粒之固晶裝置,更包含一壓板50,以供壓制所述料片40,避免固晶作業時料片40產生偏移,該壓板50之一側設有一第二接合部51,該第二接合部51與該第一接合部131係互相對應接合。The solid crystal device capable of producing a negative pressure absorbing material and a die further comprises a pressing plate 50 for pressing the material 40 to avoid offset of the material 40 during the die bonding operation, and one of the pressure plates 50 A second joint portion 51 is disposed on the side, and the second joint portion 51 and the first joint portion 131 are coupled to each other.
製程進行中,利用吸嘴S接觸晶粒C表面,在建立真空後吸取該晶粒C帶離藍膜,並將該晶粒C對準於料片40之預定放置區P,接著,吸嘴S吸取該晶粒C放置於所述料片40之預定放置區P,此時,真空產生單元30即呈啟動狀態,藉由抽氣馬達31及其一端連接之多數個抽氣管32提供一負壓,並由所述控制閥33(例如:電磁閥)所控制,所述抽氣管32之另一端連接該些第一通氣孔12,而該些第一通氣孔12與該些第二通氣孔22係互相連通,藉此,於該固定板20表面之該些第二通氣孔22處形成一負壓狀態,當所述料片40放置於該固定板20上將因此吸附其上;而所述料片40設有多數個第三通氣孔42,該些第三通氣孔42與該些第二通氣孔22係互相連通,所 以,所述料片40表面之該些第三通氣孔42處亦形成一負壓狀態,如此,當晶粒C接觸料片40時,該晶粒C將因此吸附並固定於所述料片40上,而順利脫離吸嘴S,藉此,精準且有效率地完成固晶作業。During the process, the surface of the die C is contacted by the nozzle S, and after the vacuum is established, the die C is taken away from the blue film, and the die C is aligned with the predetermined placement zone P of the web 40, and then the nozzle S sucks the die C to be placed in the predetermined placement area P of the web 40. At this time, the vacuum generating unit 30 is in an activated state, and a negative is provided by the pumping motor 31 and a plurality of exhaust pipes 32 connected at one end thereof. Pressing, and being controlled by the control valve 33 (for example, a solenoid valve), the other end of the exhaust pipe 32 is connected to the first vent holes 12, and the first vent holes 12 and the second vent holes are The 22 series are connected to each other, whereby a negative pressure state is formed at the second vent holes 22 on the surface of the fixing plate 20, and the material 40 is placed on the fixing plate 20 to be adsorbed thereon; The material sheet 40 is provided with a plurality of third vent holes 42, and the third vent holes 42 and the second vent holes 22 are in communication with each other. Therefore, the third vent holes 42 on the surface of the web 40 also form a negative pressure state, so that when the crystal grains C contact the web 40, the crystal grains C will thus be adsorbed and fixed to the web. 40, and smoothly separated from the nozzle S, thereby accurately and efficiently complete the die bonding operation.
本創作之特徵在於:藉由所述承載座10與固定板20互相結合,且該承載座10之多數個第一通氣孔12與該固定板20之多數個第二通氣孔22互相連通,而真空產生單元30之抽氣馬達31提供一負壓,透過抽氣管32與第一通氣孔12連接,令該固定板20表面形成負壓狀態,以達到吸附料片40及晶粒C,藉此,精準且有效率地完成固晶作業,降低成本之功效。The present invention is characterized in that the carrier 10 and the fixing plate 20 are coupled to each other, and the plurality of first ventilation holes 12 of the carrier 10 and the plurality of second ventilation holes 22 of the fixing plate 20 communicate with each other. The suction motor 31 of the vacuum generating unit 30 provides a negative pressure, and is connected to the first vent hole 12 through the exhaust pipe 32 to form a negative pressure state on the surface of the fixing plate 20 to reach the absorbing material sheet 40 and the crystal grain C. Accurate and efficient completion of the die-fixing operation, reducing the cost.
綜合上述,本創作係解決傳統固晶依賴膠材特性使晶粒脫離吸嘴的情況,本創作係於所述承載座與固定板建立一套吸真空機構,在晶粒接觸料片時,其所產生的真空將輔助吸嘴將晶粒固定在料片上,藉此,具有以下優點:一、製程將不受導電膠材的種類、劑量等影響,以改善傳統固晶方式在生產時過於依賴膠材特性的問題;二、可簡化調整機台生產參數的步驟;三、提高機台UPH與人機比;四、增加固晶裝置對於料片的固定效果;五、克服晶粒表面黏性增加不易脫離吸嘴的現象。In summary, the present invention solves the problem that the conventional solid crystal-dependent rubber material is used to separate the crystal grains from the nozzle. The present invention establishes a vacuum suction mechanism on the bearing seat and the fixed plate, and when the crystal grain contacts the material piece, The generated vacuum will fix the die on the web by the auxiliary nozzle, thereby having the following advantages: First, the process will not be affected by the type and dosage of the conductive adhesive, so as to improve the traditional solid crystal mode and rely too much on production. The problem of the characteristics of the rubber material; Second, the steps of simplifying the adjustment of the production parameters of the machine; 3. Increasing the ratio of the UPH to the man-machine ratio; 4. Increasing the fixing effect of the solid crystal device on the material; 5. Overcoming the surface viscosity of the grain. Increase the phenomenon that it is not easy to get rid of the nozzle.
雖然本創作之實施例揭露如上,然而,並非用以限定本創作,任何熟習本創作所屬技術領域者,在不脫離本創作之精神和範圍內,舉凡依本創作之內容說明所述之形狀、構造、特徵及精神當可做些許之變更,因此本創作之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。The present invention is not limited to the scope of the present invention, and the shapes described in Structures, features, and spirits are subject to change. Therefore, the scope of patent protection of this creation is subject to the definition of the scope of the patent application attached to this specification.
10‧‧‧承載座10‧‧‧Hosting
30‧‧‧真空產生單元30‧‧‧vacuum generating unit
40‧‧‧料片40‧‧‧materials
50‧‧‧壓板50‧‧‧ pressure plate
A‧‧‧部分Part A‧‧‧
Claims (3)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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TW103215719U TWM493142U (en) | 2014-09-03 | 2014-09-03 | Die bonding apparatus generating negative pressure to adhere material sheet and die |
CN201420593232.8U CN204243022U (en) | 2014-09-03 | 2014-10-14 | Crystal fixing device capable of generating negative pressure to adsorb tablets and crystal grains |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW103215719U TWM493142U (en) | 2014-09-03 | 2014-09-03 | Die bonding apparatus generating negative pressure to adhere material sheet and die |
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TWM493142U true TWM493142U (en) | 2015-01-01 |
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TW103215719U TWM493142U (en) | 2014-09-03 | 2014-09-03 | Die bonding apparatus generating negative pressure to adhere material sheet and die |
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TW (1) | TWM493142U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI730763B (en) * | 2019-05-24 | 2021-06-11 | 日商Towa股份有限公司 | Suction plate, cutting apparatus, and cutting method |
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2014
- 2014-09-03 TW TW103215719U patent/TWM493142U/en not_active IP Right Cessation
- 2014-10-14 CN CN201420593232.8U patent/CN204243022U/en not_active Expired - Fee Related
Cited By (1)
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TWI730763B (en) * | 2019-05-24 | 2021-06-11 | 日商Towa股份有限公司 | Suction plate, cutting apparatus, and cutting method |
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