TWI713131B - Crystal grain transfer equipment and method for transferring crystal grains using the equipment - Google Patents

Abstract

A crystal grain transfer device is suitable for transferring a plurality of crystal grains on a first carrier sheet to a second carrier sheet, and includes a movable carrier device and a top contact device. The mobile bearing device includes two bearing parts spaced opposite to each other and relatively translationally movable, and the bearing parts are respectively used for setting the first bearing sheet and the second bearing sheet, and allowing the dies on the first bearing sheet to be located Between the first supporting sheet and the second supporting sheet. The top contact device includes a top contact member located on the side of the first carrier sheet opposite to the die, and the top contact member can touch the first carrier sheet to transfer the corresponding die to the second carrier Chip. In addition, the present invention also provides a method for transferring crystal grains using the aforementioned crystal grain transfer device.

Description

Crystal grain transfer equipment and method for transferring crystal grains using the equipment

The present invention relates to a crystal grain transfer device and a method for transferring crystal grains, in particular to a crystal grain transfer device without a suction nozzle device and a method for transferring crystal grains without a suction nozzle device.

In the semiconductor manufacturing process, a die picking device is used to pick and classify the cut multiple die according to their appearance, quality or characteristics. The die picking equipment mainly includes a base, a carrying device arranged on the base and having two-spaced carrying parts, and a thimble device arranged on the base and located under the carrying device and having a thimble member A suction device arranged on the base and positioned on the carrying device, and an image capturing device arranged on the base and on the carrying portion.

When die picking is to be performed, a first carrier sheet with a plurality of die will be placed on one of the carrier parts, and a second carrier sheet for bonding the selected die Set on the other of the supporting parts, firstly use the image capturing device correspondingly on the die to determine the appearance quality of the die and confirm the position, and then press the ejector pin of the ejector device against the first carrier One of the dice on the first carrier is raised, and then the raised dice is sucked by a suction head of the sucking device. Finally, the sucking device will be moved by vertical movement, translation, or rotation. The crystal grains are sucked, transferred and glued onto the second carrier sheet.

It can be seen from the foregoing description that the existing die picking equipment needs to be additionally provided with the suction device to perform die picking and transfer, which not only increases the cost of the equipment, but also requires the transfer of the die through the suction device. Moving back and forth between the first carrier sheet and the second carrier sheet results in poor die transfer efficiency and reduces the overall process rate.

Therefore, the purpose of the present invention is to provide a crystal grain transfer device that does not require a suction device.

Therefore, the crystal grain transfer device of the present invention is suitable for transferring a plurality of crystal grains on a first carrier sheet to a second carrier sheet, and the crystal grain transfer device includes a moving carrier device and a top contact device.

The mobile bearing device includes two bearing parts spaced opposite to each other and relatively translationally movable, and the bearing parts are respectively used for setting the first bearing sheet and the second bearing sheet, and allowing the dies on the first bearing sheet to be located Between the first supporting sheet and the second supporting sheet.

The top contact device includes a top contact member located on the side of the first carrier sheet opposite to the die, and the top contact member can touch the first carrier sheet to transfer the corresponding die to the second carrier Chip.

In addition, the present invention also provides a method for transferring crystal grains.

The method for transferring crystal grains is suitable for transferring a plurality of crystal grains on a first carrier sheet to a second carrier sheet, and the method for transferring crystal grains includes a preparation step, a setting step, a moving step, and a pusher. Transfer steps.

The preparation step is to prepare the aforementioned crystal grain transfer equipment, the crystal grains, the first carrier sheet, and the second carrier sheet.

In the setting step, the first carrier sheet and the second carrier sheet carrying the dies are respectively arranged on the carrier portions, and the dies are positioned between the first carrier sheet and the second carrier sheet. between.

The moving step is to translate the supporting parts so that the crystal grains on the first supporting sheet move to the axis of the top contact.

The top contact transfer step is to make the top contact member touch the first carrier sheet and transfer the corresponding die to the second carrier sheet.

The effect of the present invention is that the present invention omits the installation of the suction device in the existing die picking equipment, and mainly uses the first carrier sheet and the second carrier sheet to be arranged opposite to each other, so that the dies are located on the first carrier sheet And the second carrier sheet, and directly touch the first carrier sheet through the top contact member, so that the corresponding die is directly transferred to the setting surface of the second carrier sheet, without additional suction device, Not only can effectively reduce equipment costs but also improve the efficiency of crystal grain transfer.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

1 to 3, a first embodiment of the die transfer device 2 of the present invention includes a base 20, a mobile carrying device 21 connected to the base 20, and a mobile carrier device 21 connected to the base 20 and connected to the base 20. The top contact device 22 spaced apart from the mobile bearing device 21, a butt member 23 disposed on the base 20 and correspondingly located on the opposite side of the top contact device 22 and spaced apart from the mobile bearing device 21, and a contact member 23 disposed on the base The base 20 and the image capturing device 24 spaced apart from the mobile carrying device 21.

The die transfer device 2 is suitable for arranging a first carrier sheet 31 and a second carrier sheet 32 on the mobile carrier device 21, and through the top contact device 22, the abutting member 23, and the image capturing The device 24 transfers the plurality of dies 4 on the first carrier sheet 31 to the second carrier sheet 32.

Specifically, the mobile bearing device 21 includes two bearing portions 211 spaced apart from each other and relatively translationally movable. The bearing portions 211 are respectively used for the first bearing piece 31 and the second bearing piece 32 to be arranged. A supporting plate 31 has a supporting surface 311 for supporting the dies 4, and the second supporting plate 32 has a setting surface 321 for the dies 4 after transfer. When the first supporting sheet 31 and the second supporting sheet 32 are arranged on the supporting portions 211, the dies 4 on the first supporting sheet 31 are positioned on the first supporting sheet 31 and the second supporting sheet 31. Between a set surface 321 of the supporting sheet 32.

The top contact device 22 corresponding to the die 4 is located on the side of the first carrier plate 31 opposite to the die 4, and the top contact device 22 includes an outer ring sleeve 221 and an outer ring sleeve 221. The top contact 222, the top contact 222 can protrude from the outer ring sleeve 221 to touch the first carrier sheet 31, and directly transfer the corresponding die 4 to the setting surface of the second carrier sheet 32 321 on.

The abutting member 23 is located on the side of the second supporting sheet 32 opposite to the setting surface 321 corresponding to an axis of the top contact member 22 to abut against the second supporting sheet 32, that is, the first supporting sheet 32 The sheet 31 and the second supporting sheet 32 are located between the top contact device 22 and the abutting member 23. The abutting member 23 has a pipe wall 231 defining a through hole 232 along the axis, and a penetrating through The pipe wall 231 is connected to the groove 233 of the through hole 232.

The arrangement of the image capturing device 24 is not particularly limited, as long as it is arranged corresponding to the dies 4 and can irradiate the dies 4, in the first embodiment, it corresponds to an axis of the abutting member 23 It is disposed on the abutting member 23 so that the abutting member 23 is located between the second carrier sheet 32 and the image capturing device 24.

In detail, in the first embodiment, the first carrier sheet 31 and the second carrier sheet 32 are blue tapes, for example, and the dies 4 are light-emitting diode dies. Take an example for illustration, that is to say, the first carrier sheet 31 and the second carrier sheet 32, both of which are blue films and have the dies 4, are set on the die transfer device 2 of the first embodiment , That is, the die picking process that can sort the die 4 according to their appearance, quality or characteristics. Before the top contact 222 touches the first carrier sheet 31, the die 4 to be lifted is irradiated through the image capturing device 24 to detect the appearance or quality of the die 4. The top contact member 222 presses against the first supporting sheet 31 to allow the die 4 to be lifted up and directly transferred to the second supporting sheet 32, and at the same time, the supporting member 23 can abut the second supporting sheet 32 to control the force of transferring the die 4 to the second carrier sheet 32.

It should be noted that the state of the abutting member 23 is not particularly limited, as long as it can abut the second carrier plate 32 and is used to assist the detection and transfer of the dies 4, in the first embodiment The abutting member 23 is an example of a rigid straight tube with a groove 233 on the side. In detail, the image capturing device 24 is coaxially arranged with the abutting member 23. Therefore, the image capturing device 24 can irradiate the die 4 through the through hole 232 located on the axis of the abutting member 23 for detection. Preferably, the groove 233 communicating with the through hole 232 is further formed on the tube wall 231 of the abutting member 23, and side lighting can be used to assist in enhancing the clearer imaging of the image capturing device 24, Detect each die more accurately4.

Since the present invention omits the suction device in the existing die picking equipment, but directly touches the first carrier sheet 31 through the top contact 222 of the top contact device 22, so that the corresponding die 4 is directly lifted Is transferred to the second carrier sheet 32, therefore, in order to avoid the top contact 222 from being too large to be able to push the die 4 from the first carrier sheet 31 to the second carrier sheet 32, causing the top The contact 222 breaks the first supporting sheet 31. Preferably, the distance between the first supporting sheet 31 and the second supporting sheet 32 is between 0.5 mm and 4 mm. In addition, by making the viscosity of the setting surface 321 of the second supporting sheet 32 greater than the supporting surface 311 of the first supporting sheet 31, the die 4 can be easily lifted by the top contact 222 Detached from the first carrier sheet 31, and by the abutment member 23 against the second carrier sheet 32, the die 4 is adhered to the second carrier sheet 32 more firmly.

4 to 6, a second embodiment of the die transfer device 2 of the present invention is substantially the same as the first embodiment, except that the top contact device 22 and the first carrier of the second embodiment The setting positions of the sheet 31 and the second supporting sheet 32 are opposite to those of the first embodiment, and there is no abutting member 23. In detail, in the second embodiment, the die bonding process is mainly performed. Therefore, the first carrier sheet 31 is still a blue film with the dies 4, and the second carrier The sheet 32 is replaced with a package frame with die-bonding glue, and in order to prevent the die-bonding glue on the packaging frame from flowing, therefore, the second carrier sheet 32 is placed under the first carrier sheet 31 and the top contact The device 22 is arranged above the first carrier sheet 31, so that the top contact member 222 of the top contact device 22 can touch the first carrier sheet 31 from above to transfer the die 4 to the lower The die bonding process is completed on the die bonding glue of the second carrier sheet 32.

In order to more clearly explain the aforementioned crystal grain transfer device 2 of the present invention, the method of performing the aforementioned crystal grain transfer device 2 to transfer crystal grains is described as follows.

Referring to FIG. 7 and in conjunction with FIG. 3, a first embodiment of the method for transferring crystal grains of the present invention is illustrated. When the crystal grain transfer device 2 shown in FIG. 1 is used for the die picking process, the present invention transfers crystal grains An embodiment of the method includes a preparation step 51, a pre-processing step 52, a setting step 53, a moving step 54, and a push transfer step 55.

The preparation step 51 is to prepare the aforementioned die transfer device 2, the die 4, the first carrier sheet 31, and the second carrier sheet 32. In this embodiment, the die 4 is a light emitting diode Take bulk die as an example, and in the preparation step 51, the die 4 is placed on an initial carrier sheet (not shown), and the first carrier sheet 31 and the second carrier sheet 32 are crystallized with blue film. Take grain picking as an example.

The pre-processing step 52 is to adhere the exposed light-emitting surface 41 of each die 4 on the initial carrier sheet toward the carrier surface 311 of the first carrier sheet 31, and place the initial carrier sheet from the crystals The particles 4 are peeled off, so that the light-emitting surfaces 41 of the dies 4 are adhered to the supporting surface 311 of the first supporting sheet 31. Wherein, the way of peeling off the initial carrier sheet can heat the initial carrier sheet or stretch the initial carrier sheet to reduce its viscosity and facilitate peeling.

In the setting step 53, the first carrier sheet 31 and the second carrier sheet 32 provided with the dies 4 are respectively arranged on the carrier portions 21, and the dies 4 are positioned on the first carrier sheet 31 and Between the second supporting sheets 32, and when the first supporting sheet 31 is placed on one of the supporting portions 211, the peripheral edge of the first supporting sheet 31 is stretched by an expand ring, so that the The first carrier sheet 31 expands to reduce its viscosity, so as to facilitate the subsequent transfer of the dies 4.

The moving step 54 translates the supporting portions 211 so that the dies 4 on the first supporting sheet 31 move to the axis of the top contact 222 correspondingly, and detect the dies 4 through the image capturing device 24 .

The top contact transfer step 55 allows the top contact member 222 to contact the first supporting sheet 31 and lift up the corresponding die 4 to directly transfer and adhere to the setting surface 321 of the second supporting sheet 32 to complete Die picking process.

It should be noted here that when the light-emitting surface 41 of each die 4 is covered and arranged on the supporting surface 311 of the first supporting plate 31 with the aid of the initial carrier sheet in the preprocessing step 52, When the dies 4 are transferred from the first carrier sheet 31 to the second carrier sheet 32, the light emitting surfaces 41 of the dies 4 can be opposite to the setting surface 321 of the second carrier sheet 32 to be exposed . In addition, since the light-emitting surfaces 41 of the die 4 are first placed on the first supporting sheet 31, the positions of the die 4 on the first supporting sheet 31 are relatively The position on the initial carrier sheet is also correspondingly reversed. Therefore, before the transfer of the dies 4, the position of the dies 4 that has been inverted will be adjusted to perform position inversion processing corresponding to the control software.

6 and 7, a second embodiment of the method for transferring crystal grains of the present invention is described. When the crystal grains 4 are to be solidified, the crystal grain transfer device 2 shown in FIG. 4 is used. The die bonding process is performed. The steps of the method for transferring die of the second embodiment are substantially the same as the process steps of the die picking of the first embodiment, except that the preparation step 51 and the setting step 53. Specifically, when the die bonding process is to be performed, the second carrier sheet 32 prepared in the preparation step 51 is to prepare a package frame with die attach glue, and in the setting step 53, the first carrier sheet 31 The supporting portion 211 is provided on the upper side, and the supporting portion 211 is provided on the lower side of the second supporting sheet 32 to prevent the flow of the die-bonding glue, and the top contact 222 is provided on the first supporting sheet 31 to prevent the upper Touch each die 4 of the first carrier sheet 31 downward to directly bond the die on the second carrier sheet 32 (package frame).

Referring to FIG. 8, a third embodiment of the method for transferring crystal grains of the present invention is illustrated. The method for transferring crystal grains of the third embodiment is substantially the same as that of the first embodiment, except that the third embodiment does not The pre-processing step 52 further includes a flip step 56 implemented after the top touch transfer step 55. Specifically, when the pre-processing step 52 as in the first embodiment is not performed, the dies 4 are still disposed on the first carrier sheet 31 with their light-emitting surface 41 facing away from the carrier surface 311, and When the top contact transfer step 55 is performed, the top contact member 222 touches the back of the dies 4, so that the light-emitting surfaces 41 of the dies 4 are directly transferred to the second carrier sheet 32. On the setting surface 321, at this time, the turning step 56 is further performed to stick the back surface of each die 4 on the second carrier sheet 32 toward a third carrier sheet (not shown), so that each die 4 The light-emitting surface 41 is exposed away from the third carrier sheet.

To sum up, the die transfer equipment 2 of the present invention omits the installation of the suction device in the existing die picking equipment, and is not only suitable for the die picking process, but also for the die bond process (as long as one of the carrier sheets Just replace it with a package frame with die-bonding glue), so that the first carrier sheet 31 and the second carrier sheet 32 are arranged oppositely and spaced apart so that the dies 4 are located on the first carrier sheet 31 and the second carrier sheet 32, and directly touch the first supporting sheet 31 through the top contact 222 so that the corresponding die 4 is directly transferred to the setting surface 321 of the second supporting sheet 32, without additional suction device, not only It can effectively reduce the cost of equipment and increase the efficiency of crystal grain transfer, so it can indeed achieve the purpose of the invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to Within the scope of the patent for the present invention.

2‧‧‧Die transfer equipment 31‧‧‧First carrier piece 20‧‧‧Base 311‧‧‧carrying surface 21‧‧‧mobile carrier device 32‧‧‧second carrier piece 211‧‧‧carrying part 321 ‧‧‧Setting surface 22‧‧‧Top contact device 4‧‧‧Die 221‧‧‧Outer ring sleeve 41‧‧‧Light emitting surface 222‧‧‧Top contact 51‧‧‧Preparation step 23‧‧‧Abut Piece 52‧‧‧Pre-processing step 231‧‧‧Pipe wall 53‧‧‧Setting step 232‧‧‧Through hole 54‧‧‧Movement step 233‧‧‧Groove 55‧‧‧Top contact transfer step 24‧‧ ‧Image capture device 56‧‧‧Flip step

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is a partial perspective view illustrating a first embodiment of the die transfer device of the present invention; Figure 2 is a view along the way A schematic partial cross-sectional view taken along the line II-II of 1 to assist in explaining the first embodiment of the die transfer device; Fig. 3 is a schematic partial cross-sectional schematic diagram illustrating a first carrier sheet and a second carrier sheet of the first embodiment 1. A top contact device and the relationship between a plurality of dies; Fig. 4 is a partial three-dimensional view illustrating a second embodiment of the die transfer device of the present invention; Fig. 5 is a schematic partial cross-sectional view taken along the line VV of Fig. 4 , To assist in explaining the second embodiment of the die transfer equipment; Fig. 6 is a partial cross-sectional schematic diagram illustrating the first carrier sheet, the second carrier sheet, the top contact device, and the dies of the second embodiment 7 is a schematic flow chart illustrating a first embodiment and a second embodiment of the method of transferring the crystal grains with the crystal grain transfer device of FIGS. 1 and 4; and FIG. 8 is a schematic flow chart A third embodiment of the method for transferring crystal grains by using the crystal grain transfer device of FIG. 1 is described.

22‧‧‧Top contact device

221‧‧‧Outer ring sleeve

222‧‧‧Top contact

23‧‧‧Abutment

231‧‧‧Tube Wall

232‧‧‧Through hole

233‧‧‧ groove

31‧‧‧First carrier sheet

311‧‧‧Loading surface

32‧‧‧Second Carrier Sheet

321‧‧‧setting surface

4‧‧‧grain

41‧‧‧Emitting surface

Claims (5)

A crystal grain transfer device is suitable for transferring a plurality of crystal grains on a first carrier sheet to a second carrier sheet. The crystal grain transfer device includes: a mobile carrying device, including two oppositely spaced and relatively translational carrying parts , The supporting parts are respectively used for setting the first supporting sheet and the second supporting sheet, and allowing the dies on the first supporting sheet to be located between the first supporting sheet and the second supporting sheet; The top contact device includes a top contact member located on the side of the first carrier sheet opposite to the die, the top contact member can touch the first carrier sheet to transfer the corresponding die to the second carrier On the chip; an abutting member, corresponding to an axis of the top contact member, is located on the side of the second carrier sheet opposite to the crystal grains; and an image capturing device is arranged corresponding to an axis of the abutting member, The abutting piece is located between the second carrier sheet and the image capturing device, and the abutting piece has a pipe wall defining a through hole along the axis, and a pipe wall that penetrates the pipe wall and is connected to the through hole Through the groove. The die transfer device according to claim 1, wherein the first carrier sheet and the second carrier sheet are both blue films. The die transfer device according to claim 2, wherein the first supporting sheet has a supporting surface for supporting the crystal grains, and the second supporting sheet has a setting surface on which the crystal grains are arranged, and the setting surface The viscosity is greater than the bearing surface. The crystal grain transfer device according to claim 3, wherein the crystal grains are light emitting diode crystal grains, and a light emitting surface of each of the crystal grains is disposed facing the carrying surface of the first carrier sheet. The die transfer device according to claim 1, wherein the first carrier sheet is a blue film, and the second carrier sheet is a package frame with die attach glue.

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