CN111785823B - Advanced LED crystal grain sorting and film-reversing device - Google Patents
Advanced LED crystal grain sorting and film-reversing device Download PDFInfo
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- CN111785823B CN111785823B CN202010783588.8A CN202010783588A CN111785823B CN 111785823 B CN111785823 B CN 111785823B CN 202010783588 A CN202010783588 A CN 202010783588A CN 111785823 B CN111785823 B CN 111785823B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
Abstract
The invention discloses an advanced LED crystal grain sorting and film pouring device, which belongs to the technical field of crystal grain sorting and comprises a base, wherein the base is connected with a carrier disc through a support column, a wafer blue film is arranged on the carrier disc and used for clamping the wafer blue film, a plurality of single crystal grains with the same electric property are adhered on the wafer blue film, a mounting plate parallel to the carrier disc is arranged on one side of the carrier disc, an encapsulation blue film opposite to the wafer blue film is arranged on the mounting plate, a bearing mechanism used for fixing the encapsulation blue film is arranged on the mounting plate, the encapsulation blue film comprises a transition blue film used for adhering the front of the single crystal grains and a separate storage blue film used for adhering the back of the single crystal grains, the carrier disc is horizontally arranged, a mounting table is arranged in the middle of the top end of the base, and a jacking mechanism is arranged in the middle of the top end of the mounting table. The invention integrates the arrangement of the automatic sorting and film-pouring integrated device, thereby greatly improving the service performance and the working efficiency of the device.
Description
Technical Field
The invention relates to the technical field of crystal grain sorting, in particular to an advanced LED crystal grain sorting and film pouring device.
Background
In the LED industry, various sub-processes, epitaxial growth, electrode plating, grinding, cutting, spot measurement, sorting, etc. are required to be performed on a finished product from a crystal grain, and when the crystal grain is sorted, the crystal grain needs to be sorted from wafers to a blue film (called a square sheet for short) in the same range according to different electrical grades.
Under the current situation: wafer and wafer blue film thereon are clamped by a special carrying disc, a thimble below jacks up crystal grains to be placed during operation (the thimble cover adopts vacuum to suck the wafer blue film, the thimble fixes the crystal grains from a middle thimble hole to separate from the wafer blue film), a swing arm provided with a suction nozzle adsorbs the jacked crystal grains by using vacuum, then air is blown to place the crystal grains on the blue film at the placing end (the blue film at the placing end is provided with a special bearing mechanism and is drawn and replaced back and forth), namely one crystal grain is jacked, and the placing device can drive the blue film to automatically move to the next placing position. Until the whole piece of blue film is swung to a specified amount. And finally, the product faces upwards.
When present crystalline grain is depositing separately, need earlier select separately the scattered crystalline grain that distributes on with wafer blue membrane through the sorter, then on the crystalline grain after will sorting is filmed to depositing separately through another device of falling the membrane, so, need purchase dedicated consumptive material and accessory (suction nozzle, swing arm) to the swing arm is picked, and each all needs fixed stroke (get, put), leads to work efficiency low.
Disclosure of Invention
1. Technical problem to be solved
The present invention is directed to an advanced LED die sorting and film-flipping apparatus to solve the above-mentioned problems.
2. Technical scheme
In order to solve the problems, the invention adopts the following technical scheme:
the utility model provides an advanced LED crystalline grain is selected separately and is fallen membrane device, includes the base, the base is connected with the carrier disc through the support column, be equipped with wafer blue membrane on the carrier disc, and the carrier disc is used for blocking wafer blue membrane, it has a plurality of single crystalline grain with the electrical property to glue on the wafer blue membrane, one side of carrier disc is equipped with the mounting panel rather than parallel, and is equipped with the encapsulation blue membrane that sets up with wafer blue membrane relatively on the mounting panel to be equipped with the bearing mechanism who is used for fixed encapsulation blue membrane on the mounting panel, encapsulation blue membrane is including being used for gluing the positive transition blue membrane of single crystalline grain and being used for gluing the branch of single crystalline grain back and depositing the blue membrane, carrier disc level sets up, the top middle part of base is equipped with the mount table, and the top middle part of mount table is equipped with a jack-up mechanism, jack-up mechanism includes the thimble lid and locates thimble lid below and is used for driving the unipolar movement component that the thimble lid reciprocated, the thimble cover is equipped with the vacuum adsorption mechanism who is used for sucking the wafer blue membrane or encapsulates the blue membrane, the bottom that the unipolar removed the component is connected with the top of mount table, carry and set up the thimble hole that corresponds and supply the vertical passing of thimble cover on the dish, the top of base is connected with the roof through the lift cylinder, the mounting panel is installed in the inside of roof, and the top of roof set up with the logical groove of mounting panel looks adaptation to lead to the bottom intercommunication of groove and roof, the inside that leads to the groove is equipped with the pivot that the level runs through mounting panel central point, and pivot and mounting panel fixed connection, the one end of pivot is connected with the driving motor who installs on the roof.
Preferably, the single-axis moving member is a micro cylinder.
Preferably, the upper end and the lower end of the mounting plate are both provided with a bearing mechanism, and the two bearing mechanisms are arranged in a back-to-back manner.
Preferably, the diameter of the pinhole is smaller than the diameter of a single crystal grain.
Preferably, the top plate forms a lifting structure through a lifting cylinder and the carrying disc, and the distance between the packaging blue film on the top plate and a single crystal grain on the carrying disc is 1mm when the lifting cylinder is in a non-working state.
3. Advantageous effects
1. The crystal grains sorted on the wafer blue film can be sequentially jacked up through the jacking mechanism and are sequentially adhered to the transition blue film, so that the crystal grains with the same electric property can be uniformly distributed on the transition blue film (the front surfaces of the crystal grains are adhered to the transition blue film at the moment), a powerful condition is provided for the film reversing of the crystal grains on the transition blue film, when the film is reversed, the transition blue film is placed on the carrying disc, the separate storage blue film is fixed on the mounting plate through the carrying mechanism, then the crystal grains on the transition blue film are jacked up and adhered to the separate storage blue film through the work of the jacking mechanism, the back surfaces of the crystal grains are adhered to the separate storage blue film, the arrangement of the crystal grain film reversing mode enables the device to realize the automatic integration of collection sorting and film reversing, the service performance and the working efficiency of the device are greatly improved, the situation that the existing device needs to use an additional sorting machine to firstly to sort the crystal grains distributed and scattered on the wafer blue film is avoided, and then the film pouring treatment is carried out on the crystal grains through another film pouring device, so that the crystal grains are complicated in separate storage step and time-consuming, and the problem that the equipment is high in manufacture and low in working efficiency due to the fact that the mechanical arm moves back and forth because the existing mechanical arm is required to carry out adsorption type separation is solved.
2. When the lifting cylinder is in a non-working state, the distance between the packaging blue film and the single crystal grain is set, so that the packaging blue film is favorably adhered to the jacked single crystal grain, and the working efficiency of the device is improved to a certain extent.
3. When the transition blue film is fully adhered with crystal grains with the same electric property, the transition blue film can be driven by the driving motor to work, so that the fully adhered blue film is turned over by 180 degrees upwards, and people can take down and replace the blue film conveniently.
4. The number and the reverse positions of the bearing mechanisms are arranged, so that when the separately stored blue film on one bearing mechanism is turned upwards, the separately stored blue film on the other bearing mechanism can be opposite to the transition blue film again, the separately stored blue film on the other bearing mechanism can continuously adhere crystal grains on the transition blue film, the device can continuously and continuously separately store single crystal grains with the same electric property, and the working efficiency of the device is improved.
Drawings
Fig. 1 is a front view of the internal structure of the present invention.
Reference numerals: 1-base, 2-support column, 3-carrying disc, 4-lifting cylinder, 5-top plate, 6-wafer blue film, 7-single crystal grain, 8-jacking mechanism, 81-single-shaft moving member, 82-thimble cover, 9-mounting table, 10-thimble hole, 11-mounting plate, 12-carrying mechanism, 13-packaging blue film, 14-through groove, 15-rotating shaft and 16-driving motor.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Examples
As shown in fig. 1, an advanced LED die sorting and film-pouring apparatus includes a base 1, the base 1 is connected to a carrier disc 3 through a supporting pillar 2, a wafer blue film 6 is disposed on the carrier disc 3, the carrier disc 3 is used to clamp the wafer blue film 6, a plurality of single dies 7 with the same electrical property are adhered on the wafer blue film 6, a mounting plate 11 parallel to the carrier disc 3 is disposed on one side of the carrier disc 3, an encapsulation blue film 13 disposed opposite to the wafer blue film 6 is disposed on the mounting plate 11, a carrying mechanism 12 for fixing the encapsulation blue film 13 is disposed on the mounting plate 11, a carrying mechanism 12 is disposed on both upper and lower ends of the mounting plate 11, the two carrying mechanisms 12 are disposed opposite to each other, the number and the positions of the carrying mechanisms 12 are set opposite to each other, when the dispensing blue film on one of the carrying mechanisms 12 is turned over upward, the dispensing blue film on the other carrying mechanism 12 can be opposite to the transition blue film again, so that the dispensing blue film on the other carrying mechanism 12 can continuously adhere the dies on the transition blue film, so that the device can continuously store single crystal grains with the same electric property in a separated mode, the working efficiency of the device is improved, the packaging blue film 13 comprises a transition blue film used for adhering the front side of the single crystal grain 7 and a storage blue film used for adhering the back side of the single crystal grain 7, the carrier disc 3 is horizontally arranged, the middle part of the top end of the base 1 is provided with the mounting table 9, and a jacking mechanism 8 is arranged in the middle of the top end of the mounting table 9, the jacking mechanism 8 comprises a thimble cover 82 and a single-shaft moving member 81 which is arranged below the thimble cover 82 and used for driving the thimble cover 82 to move up and down, the single-shaft moving member 81 is a micro cylinder or other devices capable of driving the thimble cover 82 to move up and down, and through the work of the single-shaft moving member 81, the top pin cover 82 of the top end of the wafer can be abutted against the bottom end surface of the wafer blue film 6 or the packaging blue film 13, so that the single crystal grain 7 is jacked up and separated from the wafer blue film 6 and the packaging blue film 13;
the thimble cover 82 is provided with a vacuum adsorption mechanism for sucking the wafer blue film 6 or the packaging blue film 13, the bottom end of the single-shaft moving component 81 is connected with the top end of the mounting table 9, the carrier disc 3 is provided with a thimble hole 10 which corresponds to the thimble cover 82 and allows the thimble cover 82 to vertically pass through, the diameter of the thimble hole 10 is smaller than that of the single crystal grain 7, the diameter of the thimble hole 10 and the diameter of the single crystal grain 7 are arranged, the periphery of the top end of the thimble hole 10 can support the periphery of the bottom end of the single crystal grain 7, so as to be beneficial to jacking and separating the single crystal grain 7, the top end of the base 1 is connected with the top plate 5 through the lifting cylinder 4, the top plate 5 forms a lifting structure through the lifting cylinder 4 and the carrier disc 3, the distance between the packaging blue film 13 on the top plate 5 and the single crystal grain 7 on the carrier disc 3 is about 1mm when the lifting cylinder 4 is in a non-working state, the distance between the packaging blue film 13 and the single crystal grain 7 is arranged, the packaging structure is favorable for the adhesion of the packaging blue film 13 to the single jacked crystal grain 7, the mounting plate 11 is mounted inside the top plate 5, the top end of the top plate 5 is provided with a through groove 14 matched with the mounting plate 11, the through groove 14 is communicated with the bottom end of the top plate 5, a rotating shaft 15 horizontally penetrating through the center of the mounting plate 11 is arranged inside the through groove 14, the rotating shaft 15 is fixedly connected with the mounting plate 11, and one end of the rotating shaft 15 is connected with a driving motor 16 mounted on the top plate 5.
The advanced LED crystal grain sorting and film-pouring device has the specific application process that: during sorting, firstly, the top plate 5 is moved upwards by the lifting of the lifting cylinder 4 so as to facilitate people to place the wafer blue film 6, secondly, the wafer blue film 6 and the wafers thereon are clamped by the carrier disc 3, the single crystal grains 7 on the wafer blue film 6 are aligned with the pinhole 10, meanwhile, the transition blue film is fixed by the bearing mechanism 12 above the top plate 5, secondly, the fixed transition blue film is turned over by 180 degrees through the work of the driving motor 16 so as to be opposite to the single crystal grains 7, secondly, the lifting cylinder 4 is contracted and restored to a non-working state, at the moment, the transition blue film is separated from the wafer blue film 6 by about 1mm under the contraction of the lifting cylinder 4, secondly, the thimble cover 82 at the end part of the thimble cover passes through the pinhole 10 through the work of the jacking mechanism 8, and the thimble cover 82 adsorbs the bottom end of the wafer blue film 6 so as to ensure the stability of the wafer blue film 6, and then, the single crystal grains 7 are jacked by the thimble cover 82 and separated from the wafer blue film 6, simultaneously, sticking the jacked single crystal grain 7 by a transitional blue film, then displacing the transitional blue film and the wafer blue film 6 by a placing device, so that other blank areas on the transitional blue film and the crystal grains on the wafer blue film 6 move to be right above a top pinhole 10, jacking up and sticking another crystal grain to the transitional blue film by the work of a jacking mechanism 8, and continuously moving the transitional blue film and the wafer blue film 6 so that the crystal grains distributed and scattered on the wafer blue film 6 are sorted to the transitional blue film one by one and sequentially, and due to the arrangement of the crystal grain sorting mode on the wafer blue film 6, the existing situation that the crystal grains distributed and scattered on the wafer blue film 6 need to be sorted by an additional sorting machine, so that the crystal grains are subjected to film pouring treatment by another film pouring device after being sorted, and the crystal grain sorting step is complicated and time-consuming;
when the film is reversed, the lifting cylinder 4 is lifted, then the transition blue film adhered with the same electrical crystal grain is taken down from the top plate 5, the transition blue film adhered with the same electrical crystal grain is placed on the carrying disc 3 and fixed, the back of the crystal grain is exposed and faces upwards, then the separate storage blue film corresponding to the single crystal grain 7 is placed at the upper end and the lower end of the top plate 5 and fixed through the bearing mechanism 12, then the separate storage blue film on the top plate 5 is moved downwards until the distance between the separate storage blue film and the transition blue film on the top plate 5 is about 1mm through the complete contraction of the lifting cylinder 4, then the single crystal grain 7 on the transition blue film can be jacked up and separated from the transition blue film through the work of the jacking mechanism 8, when the back of the single crystal grain 7 is contacted with the adhering surface of the separate storage blue film, the single crystal grain 7 can be adhered on the separate storage blue film through repeating the steps, the film can be reversed and separated for the separated crystal grains in turn, this completes the use of the device.
It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that changes and modifications to the above embodiments are within the scope of the claims of the present invention as long as they are within the spirit and scope of the present invention.
Claims (5)
1. The advanced LED crystal grain sorting and film reversing device comprises a base (1), wherein the base (1) is connected with a carrying disc (3) through a supporting column (2), a wafer blue film (6) is arranged on the carrying disc (3), the carrying disc (3) is used for clamping the wafer blue film (6), a plurality of single crystal grains (7) with the same electric property are adhered on the wafer blue film (6), a mounting plate (11) parallel to the carrying disc (3) is arranged on one side of the carrying disc (3), a packaging blue film (13) opposite to the wafer blue film (6) is arranged on the mounting plate (11), and a bearing mechanism (12) used for fixing the packaging blue film (13) is arranged on the mounting plate (11), the advanced LED crystal grain sorting and film reversing device is characterized in that the packaging blue film (13) comprises a transition blue film used for adhering the front side of the single crystal grain (7) and a separate storage blue film used for adhering the back side of the single crystal grain (7), the carrier disc (3) is horizontally arranged, the mounting table (9) is arranged in the middle of the top end of the base (1), the jacking mechanism (8) is arranged in the middle of the top end of the mounting table (9) and comprises a thimble cover (82) and a single-shaft moving component (81) which is arranged below the thimble cover (82) and is used for driving the thimble cover (82) to move up and down, the thimble cover (82) is provided with a vacuum adsorption mechanism used for adsorbing a wafer blue film (6) or an encapsulation blue film (13), the bottom end of the single-shaft moving component (81) is connected with the top end of the mounting table (9), a thimble hole (10) which corresponds to the thimble cover (82) and is vertically passed by the thimble cover (82) is arranged on the carrier disc (3), the top end of the base (1) is connected with the top plate (5) through a lifting cylinder (4), and the mounting plate (11) is arranged in the top plate (5), and the top of roof (5) is seted up logical groove (14) with mounting panel (11) looks adaptation to the bottom intercommunication that leads to groove (14) and roof (5), the inside that leads to groove (14) is equipped with pivot (15) that the level runs through mounting panel (11) central part, and pivot (15) and mounting panel (11) fixed connection, the one end of pivot (15) is connected with driving motor (16) of installing on roof (5).
2. The advanced LED die sorting and flipping apparatus according to claim 1, wherein said single-axis moving member (81) is a micro cylinder.
3. The advanced LED die sorting and film-rewinding device as claimed in claim 1, wherein a carrying mechanism (12) is disposed at each of the upper and lower ends of the mounting plate (11), and the two carrying mechanisms (12) are disposed opposite to each other.
4. Advanced LED die sorting and flipping apparatus according to claim 1, wherein the diameter of said pinhole (10) is smaller than the diameter of a single die (7).
5. The advanced LED die sorting and film-rewinding device as claimed in claim 1, wherein the top plate (5) is configured to be lifted up and down from the carrier plate (3) by the lifting cylinder (4), and the distance between the package blue film (13) on the top plate (5) and the single die (7) on the carrier plate (3) is 1mm when the lifting cylinder (4) is in the non-operating state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010783588.8A CN111785823B (en) | 2020-08-06 | 2020-08-06 | Advanced LED crystal grain sorting and film-reversing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010783588.8A CN111785823B (en) | 2020-08-06 | 2020-08-06 | Advanced LED crystal grain sorting and film-reversing device |
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| CN111785823A CN111785823A (en) | 2020-10-16 |
| CN111785823B true CN111785823B (en) | 2021-11-23 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113828545A (en) * | 2021-09-29 | 2021-12-24 | 东莞市德镌精密设备有限公司 | Full-automatic acupuncture grain sorting equipment |
| CN115241107A (en) * | 2022-09-19 | 2022-10-25 | 深圳市优界科技有限公司 | Crystal grain transfer mechanism |
| CN116190284B (en) * | 2023-04-27 | 2023-08-04 | 柯尔微电子装备(厦门)有限公司 | Full-automatic film pouring and laser integrated equipment for crystal grains and application method |
| CN116721948A (en) * | 2023-06-20 | 2023-09-08 | 东莞普莱信智能技术有限公司 | Micro electronic component discharging, transferring and positioning device and method thereof |
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| CN111785823A (en) | 2020-10-16 |
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