CN113437003A - High-speed sheet arranging machine - Google Patents
High-speed sheet arranging machine Download PDFInfo
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- CN113437003A CN113437003A CN202110359904.3A CN202110359904A CN113437003A CN 113437003 A CN113437003 A CN 113437003A CN 202110359904 A CN202110359904 A CN 202110359904A CN 113437003 A CN113437003 A CN 113437003A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a high-speed sheet arranging machine, wherein: the WAFER stage mechanism is used for clamping a film loaded with a plurality of sheet-shaped semiconductor elements; the first vision module is arranged above the WAFER carrying platform mechanism and used for acquiring the position of the sheet-shaped semiconductor element on the WAFER carrying platform mechanism; the first pick-and-place module is used for picking up the sheet-shaped semiconductor element from the WAFER carrying platform mechanism and placing the sheet-shaped semiconductor element on the positioning module; the second vision module is arranged above the positioning module and used for acquiring the pose of the sheet-shaped semiconductor element on the WAFER carrying platform mechanism; the positioning module is used for correcting the pose of the sheet semiconductor element placed on the positioning module; the third vision module is arranged above the carrying platform module and used for acquiring the position of the film arrangement on the carrying platform module; the second pick-and-place module is used for picking up the sheet-shaped semiconductor element from the positioning module and placing the sheet-shaped semiconductor element at a sheet arranging position on the carrying platform module. The invention can synchronously take and discharge materials, greatly improves the chip discharge efficiency of the chip semiconductor element and better meets the process requirements.
Description
Technical Field
The invention relates to slice arranging equipment for slice semiconductor elements, in particular to a high-speed slice arranging machine.
Background
The conventional semiconductor element arranging process is generally completed by a high-speed arranging machine, and the arranging machine is automatic material taking and placing equipment which is used for sucking a sheet-shaped semiconductor element from a wafer disc, transplanting and arranging the sheet-shaped semiconductor element on a thin film according to a preset requirement and preparing for packaging or later processes. However, the conventional chip arranging machine for chip semiconductor elements can only sequentially execute the actions of material taking, position correction and material placing, the whole process flow has low efficiency, and the requirement of high-speed chip arrangement cannot be met.
Disclosure of Invention
The invention aims to solve the technical problem of providing a high-speed sheet arranging machine which can synchronously take and place materials and is beneficial to improving the sheet arranging efficiency aiming at the defects of the prior art.
In order to solve the technical problems, the invention adopts the following technical scheme.
The utility model provides a high-speed sheet arranging machine, its is including quick-witted case, quick-witted incasement is fixed with the board, be equipped with WAFER microscope carrier mechanism, first vision module, first get put module, second vision module, second get put module, third vision module, location module and microscope carrier module on the board, WAFER microscope carrier mechanism, location module and microscope carrier module set gradually along transversely, wherein: the WAFER stage mechanism is used for clamping a film loaded with a plurality of sheet-shaped semiconductor elements; the first vision module is arranged above the WAFER carrier mechanism and used for acquiring the position of a sheet-shaped semiconductor element on the WAFER carrier mechanism; the first pick-and-place module is used for picking up a sheet-shaped semiconductor element from the WAFER carrying platform mechanism and placing the sheet-shaped semiconductor element on the positioning module; the second vision module is arranged above the positioning module and used for acquiring the pose of the sheet-shaped semiconductor element on the WAFER loading platform mechanism; the positioning module is used for correcting the pose of the sheet semiconductor element placed on the positioning module; the third vision module is arranged above the carrying platform module and is used for acquiring the position of the film arrangement on the carrying platform module; the second pick-and-place module is used for picking up the sheet-shaped semiconductor element from the positioning module and placing the sheet-shaped semiconductor element at a sheet arranging position on the carrying platform module.
Preferably, the first pick-and-place module and the second pick-and-place module are both swing type pick-and-place modules.
Preferably, the first pick-and-place module comprises a pick-and-place bracket, a vertical slide rail is fixed on the pick-and-place bracket, the vertical sliding rail is provided with a vertical sliding table which is connected with the vertical sliding rail in a sliding way, the taking and placing support is provided with a taking and placing lifting motor which is used for driving the vertical sliding table to slide up and down, a swing arm is arranged on the vertical sliding table, a vacuum suction nozzle for sucking the flaky semiconductor element is arranged at the first end of the swing arm, the second end of the swing arm is in rotating fit with the vertical sliding table, a taking and placing rotating motor for driving the swing arm to swing within a preset angle is arranged on the vertical sliding table, the swing arm is driven to move by the cooperation of the taking and placing rotating motor and the taking and placing lifting motor, and picking up the sheet-shaped semiconductor element from the WAFER carrying platform mechanism and placing the sheet-shaped semiconductor element on the positioning module, wherein the second taking and placing module has the same structure as the first taking and placing module.
Preferably, the taking and placing rotating motor is used for driving the swing arm to swing within an angle of 180 °.
Preferably, the WAFER stage mechanism comprises a screw rod linear module and a translation stage, the screw rod linear module is mounted on the stage, the translation stage is mounted at the driving end of the screw rod linear module and is driven by the screw rod linear module to translate, and the translation stage is provided with a WAFER jig for clamping a film and a rotation driving motor for driving the WAFER jig to rotate.
Preferably, a support frame is fixed on the machine table, and the first vision module, the first taking and placing module, the second vision module, the second taking and placing module and the third vision module are all arranged on the support frame.
Preferably, first vision module is including the regulation platform base, the regulation platform base is fixed in on the support frame, be equipped with on the regulation platform base and vertically adjust slip table and the two sliding fit, vertically be equipped with on the regulation slip table and transversely adjust slip table and the two sliding fit, be fixed with the riser on the transversely adjusting slip table, be equipped with CCD camera module on the riser, the camera lens of CCD camera module sets up down, the second vision module with the structure of third vision module all with first vision module is the same.
Preferably, be equipped with on the regulation platform base and be used for ordering about the vertical screw rod of revolving of vertical regulation slip table longitudinal motion, be equipped with on the vertical regulation slip table and be used for ordering about the horizontal screw rod of revolving of horizontal regulation slip table lateral motion.
Preferably, the positioning module comprises a positioning base, the positioning base is fixed on the machine table, a transverse positioning platform is arranged on the positioning base and is in sliding fit with the transverse positioning platform, a transverse positioning motor used for driving the transverse positioning platform to move transversely is arranged on the positioning base, a longitudinal positioning platform is arranged on the transverse positioning platform and is in sliding fit with the longitudinal positioning platform, a longitudinal positioning motor used for driving the longitudinal positioning platform to move longitudinally is arranged on the transverse positioning platform, a precise rotating motor is arranged on the longitudinal positioning platform, and a vacuum adsorption jig is arranged at the top drive end of the precise rotating motor.
Preferably, a thimble device is arranged below the WAFER carrier mechanism, the thimble device comprises a cross slide which can move transversely and longitudinally, and a lifting thimble and a thimble lifting driving mechanism for driving the lifting thimble to ascend or descend are arranged on the cross slide.
Preferably, the carrier module comprises a discharging carrier and a carrier translation mechanism for driving the discharging carrier to translate.
In the high-speed chip arranging machine disclosed by the invention, the first vision module, the second vision module and the third vision module are used for respectively collecting the WAFER carrier mechanism, the positioning module and the images of the sheet-shaped semiconductor elements on the carrier module so as to obtain the positions and postures of the sheet-shaped semiconductor elements, and the first taking and placing module and the second taking and placing module are used for moving and simultaneously executing the taking and placing actions.
Drawings
FIG. 1 is a perspective view of a high speed sheet handling machine of the present invention;
FIG. 2 is a perspective view of the internal structure of a high-speed sheet arranging machine;
FIG. 3 is a front view of the internal structure of a high speed sheet arranging machine;
FIG. 4 is a first perspective view of a WAFER stage mechanism;
FIG. 5 is a second perspective view of the WAFER stage mechanism;
FIG. 6 is a first perspective view of the first vision module;
FIG. 7 is a second perspective view of the first vision module;
FIG. 8 is a first perspective view of the first pick-and-place module;
FIG. 9 is a second perspective view of the first pick-and-place module;
FIG. 10 is a perspective view of the positioning module;
fig. 11 is a perspective view of the stage module;
FIG. 12 is a first perspective view of the ejector pin device;
fig. 13 is a second perspective view of the ejector pin device.
Detailed Description
The invention is described in more detail below with reference to the figures and examples.
The invention discloses a high-speed WAFER arranging machine, which is shown in a combined figure 1-13 and comprises a machine case 102, wherein a machine table 1 is fixed in the machine case 102, a WAFER stage mechanism 2, a first vision module 3, a first taking and placing module 4, a second vision module 5, a second taking and placing module 6, a third vision module 7, a positioning module 8 and a stage module 9 are arranged on the machine table 1, the WAFER stage mechanism 2, the positioning module 8 and the stage module 9 are arranged in sequence along the transverse direction, and the WAFER arranging machine comprises:
the WAFER stage mechanism 2 is used for clamping a film loaded with a plurality of sheet-shaped semiconductor elements;
the first vision module 3 is arranged above the WAFER stage mechanism 2, and the first vision module 3 is used for acquiring the position of the sheet-shaped semiconductor element on the WAFER stage mechanism 2;
the first pick-and-place module 4 is used for picking up a sheet-shaped semiconductor element from the WAFER stage mechanism 2 and placing the sheet-shaped semiconductor element on the positioning module 8;
the second vision module 5 is arranged above the positioning module 8, and the second vision module 5 is used for acquiring the pose of the sheet-shaped semiconductor element on the WAFER stage mechanism 2;
the positioning module 8 is used for correcting the pose of the sheet-shaped semiconductor element placed on the positioning module;
the third vision module 7 is arranged above the carrier module 9, and the third vision module 7 is used for acquiring the position of the film arrangement on the carrier module 9;
the second pick-and-place module 6 is used for picking up the chip semiconductor element from the positioning module 8 and placing the chip semiconductor element at a chip arranging position on the carrying platform module 9.
In the structure, the first vision module 3, the second vision module 5 and the third vision module 7 are used for respectively collecting the images of the sheet-shaped semiconductor elements on the WAFER carrier mechanism 2, the positioning module 8 and the carrier module 9 so as to obtain the positions and postures of the sheet-shaped semiconductor elements, and the first taking and placing module 4 and the second taking and placing module 6 are used for moving and simultaneously executing taking and placing actions.
The chip semiconductor element includes, but is not limited to, a semiconductor chip, a ceramic chip, and the like.
In order to realize quick material taking and placing, in this embodiment, the first taking and placing module 4 and the second taking and placing module 6 are both swing type taking and placing modules.
Regarding the specific structure of the first pick-and-place module 4 and the second pick-and-place module 6, in this embodiment, the first pick-and-place module 4 includes a pick-and-place support 40, a vertical slide rail 41 is fixed on the pick-and-place support 40, a vertical slide rail 42 is arranged on the vertical slide rail 41 and slidably connected with the vertical slide rail, a pick-and-place lifting motor 43 for driving the vertical slide rail 42 to slide up and down is arranged on the pick-and-place support 40, a swing arm 44 is arranged on the vertical slide rail 42, a vacuum suction nozzle 45 for sucking a sheet semiconductor element is arranged at a first end of the swing arm 44, a second end of the swing arm 44 is rotatably matched with the vertical slide rail 42, a rotary motor 46 for driving the swing arm 44 to swing within an angle of 180 ° is arranged on the vertical slide rail 42, and the swing arm 44 is driven to move by the cooperation of the pick-and-place rotary motor 46 and the pick-and-place lifting motor 43, and picking up the chip semiconductor element from the WAFER stage mechanism 2 and placing the chip semiconductor element on the positioning module 8, wherein the second pick-and-place module 6 has the same structure as the first pick-and-place module 4.
Regarding the preferable structure of the wash stage mechanism 2, in this embodiment, the wash stage mechanism 2 includes a lead screw linear module 20 and a translation stage 21, the lead screw linear module 20 is mounted on the machine table 1, the translation stage 21 is mounted at a driving end of the lead screw linear module 20, the translation stage 21 is driven to translate by the lead screw linear module 20, and the translation stage 21 is provided with a wash tool 22 for clamping a film and a rotation driving motor 24 for driving the wash tool 22 to rotate.
In order to facilitate installation of the pick-and-place module and the vision module, in this embodiment, a support frame 10 is fixed on the machine table 1, and the first vision module 3, the first pick-and-place module 4, the second vision module 5, the second pick-and-place module 6 and the third vision module 7 are all arranged on the support frame 10.
About first vision module 3 second vision module 5 with the preferred structure of third vision module 7, in this embodiment, first vision module 3 is including regulation platform base 30, regulation platform base 30 is fixed in on the support frame 10, be equipped with on the regulation platform base 30 and vertically adjust slip table 31 and the two sliding fit, vertically adjust and be equipped with horizontal regulation slip table 32 and the two sliding fit on the slip table 31, be fixed with riser 33 on the horizontal regulation slip table 32, be equipped with CCD camera module 34 on the riser 33, CCD camera module 34's camera lens sets up down, second vision module 5 with the structure of third vision module 7 all with first vision module 3 is the same.
For convenience of manual adjustment, in this embodiment, a longitudinal screwing screw 35 for driving the longitudinal adjustment sliding table 31 to move longitudinally is disposed on the adjustment table base 30, and a transverse screwing screw 36 for driving the transverse adjustment sliding table 32 to move transversely is disposed on the longitudinal adjustment sliding table 31.
In this embodiment, a positioning station is further disposed between the material taking station and the material placing station, and the positioning module 8 is used for positioning a workpiece, specifically, the positioning module 8 includes a positioning base 80, the positioning base 80 is fixed on the machine table 1, a transverse positioning stage 81 and a sliding fit of the transverse positioning stage 81 and the transverse positioning stage are disposed on the positioning base 80, a transverse positioning motor 82 for driving the transverse positioning stage 81 to move transversely is disposed on the positioning base 80, a longitudinal positioning stage 83 and a sliding fit of the longitudinal positioning stage 83 and the transverse positioning stage 81 are disposed on the transverse positioning stage 81, a longitudinal positioning motor 84 for driving the longitudinal positioning stage 83 to move longitudinally is disposed on the transverse positioning stage 81, a precision rotating motor 85 is disposed on the longitudinal positioning stage 83, and a vacuum adsorption jig 86 is disposed at a top driving end of the precision rotating motor 85.
As a preferable mode, a thimble device 25 is arranged below the wash carrier mechanism 2, the thimble device 25 includes a cross slide 250 capable of moving horizontally and longitudinally, and the cross slide 250 is provided with a lifting thimble 251 and a thimble lifting drive mechanism 252 for driving the lifting thimble 251 to ascend or descend. The ejector pin device 25 with the above structure helps the first pick-and-place module 4 to accurately remove the sheet-like semiconductor device from the WAFER stage mechanism 2.
Further, the stage module 9 includes a material placing stage 90 and a stage translation mechanism 91 for driving the material placing stage 90 to translate.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents or improvements made within the technical scope of the present invention should be included in the scope of the present invention.
Claims (10)
1. The utility model provides a high-speed WAFER arranging machine, which is characterized in that, including quick-witted case (102), machine case (102) internal fixation has board (1), be equipped with WAFER microscope carrier mechanism (2), first vision module (3), first get put module (4), second vision module (5), second get put module (6), third vision module (7), location module (8) and microscope carrier module (9) on board (1), WAFER microscope carrier mechanism (2), location module (8) and microscope carrier module (9) set gradually along transversely, wherein:
the WAFER stage mechanism (2) is used for clamping a film loaded with a plurality of sheet-shaped semiconductor elements;
the first vision module (3) is arranged above the WAFER stage mechanism (2), and the first vision module (3) is used for acquiring the position of the sheet-shaped semiconductor element on the WAFER stage mechanism (2);
the first pick-and-place module (4) is used for picking up a sheet-shaped semiconductor element from the WAFER carrying platform mechanism (2) and placing the sheet-shaped semiconductor element on the positioning module (8);
the second vision module (5) is arranged above the positioning module (8), and the second vision module (5) is used for acquiring the pose of the sheet-shaped semiconductor element on the WAFER stage mechanism (2);
the positioning module (8) is used for correcting the pose of the sheet-shaped semiconductor element placed on the positioning module;
the third vision module (7) is arranged above the carrying platform module (9), and the third vision module (7) is used for acquiring the wafer arrangement position on the carrying platform module (9);
the second pick-and-place module (6) is used for picking up the sheet-shaped semiconductor elements from the positioning module (8) and placing the sheet-shaped semiconductor elements at a sheet arranging position on the carrying platform module (9).
2. A high-speed singulator according to claim 1, wherein the first pick-and-place module (4) and the second pick-and-place module (6) are each oscillating pick-and-place modules.
3. The high-speed wafer arranging machine of claim 2, wherein the first pick-and-place module (4) comprises a pick-and-place support (40), a vertical slide rail (41) is fixed on the pick-and-place support (40), a vertical slide table (42) and a sliding connection therebetween are arranged on the vertical slide rail (41), a pick-and-place lifting motor (43) for driving the vertical slide table (42) to slide up and down is arranged on the pick-and-place support (40), a swing arm (44) is arranged on the vertical slide table (42), a vacuum suction nozzle (45) for sucking the sheet semiconductor element is arranged at a first end of the swing arm (44), a second end of the swing arm (44) is in running fit with the vertical slide table (42), a pick-and-place rotating motor (46) for driving the swing arm (44) to swing within an angle of 180 degrees is arranged on the vertical slide table (42), and the swing arm (44) is driven by cooperation of the pick-and-place rotating motor (46) and the pick-and-place lifting motor (43) And moving, further picking up the sheet-shaped semiconductor element from the WAFER carrying platform mechanism (2) and placing the sheet-shaped semiconductor element on the positioning module (8), wherein the second pick-and-place module (6) has the same structure as the first pick-and-place module (4).
4. The high-speed WAFER arranging machine according to claim 3, wherein the WAFER stage mechanism (2) comprises a lead screw linear module (20) and a translation stage (21), the lead screw linear module (20) is installed on the machine table (1), the translation stage (21) is installed at a driving end of the lead screw linear module (20), the translation stage (21) is driven to translate by the lead screw linear module (20), and a WAFER fixture (22) for clamping a thin film and a rotation driving motor (24) for driving the WAFER fixture (22) to rotate are arranged on the translation stage (21).
5. The high-speed wafer arranging machine of claim 1, wherein a support frame (10) is fixed on the machine table (1), and the first vision module (3), the first pick-and-place module (4), the second vision module (5), the second pick-and-place module (6) and the third vision module (7) are all arranged on the support frame (10).
6. The high-speed sheet arranging machine according to claim 5, wherein the first vision module (3) comprises an adjusting table base (30), the adjusting table base (30) is fixed on the support frame (10), a longitudinal adjusting sliding table (31) and a sliding fit of the longitudinal adjusting sliding table and the adjusting table are arranged on the adjusting table base (30), a transverse adjusting sliding table (32) and a sliding fit of the longitudinal adjusting sliding table (31) are arranged on the longitudinal adjusting sliding table, a vertical plate (33) is fixed on the transverse adjusting sliding table (32), a CCD camera module (34) is arranged on the vertical plate (33), a lens of the CCD camera module (34) is arranged downwards, and the second vision module (5) and the third vision module (7) are identical in structure to the first vision module (3).
7. The high-speed wafer arranging machine as claimed in claim 6, wherein a longitudinal screwing screw (35) for driving the longitudinal adjusting sliding table (31) to move longitudinally is arranged on the adjusting sliding table base (30), and a transverse screwing screw (36) for driving the transverse adjusting sliding table (32) to move transversely is arranged on the longitudinal adjusting sliding table (31).
8. The high-speed sheet arranging machine according to claim 1, wherein the positioning module (8) comprises a positioning base (80), the positioning base (80) is fixed on the machine table (1), a transverse positioning carrying platform (81) is arranged on the positioning base (80) and is in sliding fit with the positioning carrying platform, a transverse positioning motor (82) for driving the transverse positioning carrying platform (81) to transversely move is arranged on the positioning base (80), the transverse positioning carrying platform (81) is provided with a longitudinal positioning carrying platform (83) which is in sliding fit with the longitudinal positioning carrying platform, a longitudinal positioning motor (84) for driving the longitudinal positioning carrying platform (83) to move longitudinally is arranged on the transverse positioning carrying platform (81), and a precise rotating motor (85) is arranged on the longitudinal positioning carrying platform (83), and a vacuum adsorption jig (86) is arranged at the top driving end of the precise rotating motor (85).
9. The high-speed WAFER arranging machine according to claim 1, wherein a pin device (25) is arranged below the WAFER carrier mechanism (2), the pin device (25) comprises a cross slide (250) capable of moving transversely and longitudinally, and a lifting pin (251) and a pin lifting driving mechanism (252) for driving the lifting pin (251) to ascend or descend are arranged on the cross slide (250).
10. The high-speed wafer arranging machine according to claim 1, wherein the stage module (9) comprises an emptying stage (90) and a stage translation mechanism (91) for driving the emptying stage (90) to translate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110359904.3A CN113437003B (en) | 2021-04-02 | 2021-04-02 | High-speed sheet arranging machine |
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|---|---|---|---|
| CN202110359904.3A CN113437003B (en) | 2021-04-02 | 2021-04-02 | High-speed sheet arranging machine |
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| CN113437003A true CN113437003A (en) | 2021-09-24 |
| CN113437003B CN113437003B (en) | 2022-04-01 |
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Cited By (1)
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|---|---|---|---|---|
| CN114211248A (en) * | 2021-12-31 | 2022-03-22 | 深圳新益昌科技股份有限公司 | Automatic chip mounting device |
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| CN208368539U (en) * | 2018-05-25 | 2019-01-11 | 中山市新益昌自动化设备有限公司 | A kind of width bracket LED crystal solidifying apparatus |
| CN109378285A (en) * | 2018-11-09 | 2019-02-22 | 苏州益耐特电子工业有限公司 | A kind of chip package arranging machine |
| CN209845641U (en) * | 2018-12-29 | 2019-12-24 | 东莞市宏鑫创达智能科技有限公司 | Automatic vision positioning device of FPC rigging machine |
| CN210092035U (en) * | 2019-04-16 | 2020-02-18 | 深圳市大成自动化设备有限公司 | Precise chip arrangement machine |
| CN110213906A (en) * | 2019-06-05 | 2019-09-06 | 深圳市诺泰自动化设备有限公司 | A kind of chip shooter machine |
| CN212449668U (en) * | 2020-05-12 | 2021-02-02 | 科尔迅智能科技(深圳)有限公司 | Sheet picking and placing device |
| CN111609009A (en) * | 2020-06-05 | 2020-09-01 | 南阳利达光电有限公司 | Chip mounter |
| CN111916375A (en) * | 2020-08-12 | 2020-11-10 | 深圳市诺泰芯装备有限公司 | Turret type chip glue-free die bonder |
| CN112259480A (en) * | 2020-10-23 | 2021-01-22 | 苏州艾科瑞思智能装备股份有限公司 | Turntable structure in chip bonding machine with correction function |
Cited By (1)
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| CN114211248A (en) * | 2021-12-31 | 2022-03-22 | 深圳新益昌科技股份有限公司 | Automatic chip mounting device |
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