CN219696410U - Needling type sorting machine - Google Patents

Abstract

The utility model relates to a needling type separator, comprising: the needling device is provided with a thimble, and one side of the needling device is provided with a wafer bearing mechanism; the chip carrier bearing mechanism and the needling device are distributed on two opposite sides of the wafer bearing mechanism; and the driving device is electrically connected with the needling device and drives the ejector pin to lift the chip on the wafer in the wafer bearing mechanism to the chip carrier bearing mechanism. Because chip carrier bears mechanism and acupuncture device and distributes in the opposite both sides that the wafer born the weight of mechanism, and can drive the thimble through drive arrangement and bear the weight of the chip on the wafer carrier and bear the weight of the mechanism with the chip on the wafer carrier and directly jack up, the centre need not pass through any other mechanism and come the switching chip, can reduce the flow step, promote the beat, and the chip can directly bear the weight of the mechanism to chip carrier from the wafer carrier and bear the weight of the mechanism, the chip surface need not contact other mechanisms, and then be difficult for appearing bad problems such as fish tail.

Description

Needling type sorting machine

Technical Field

The utility model relates to the technical field of wafer sorting, in particular to a needling type sorting machine.

Background

Currently, light emitting diodes (light emitting diode, LEDs) are a type of light-emitting element that converts electrical energy into light energy. With the development of Light Emitting Diode (LED) technology, LED is widely used in the daily life fields such as illumination and signal display, and LED manufacturing technology is continuously developed.

LED chips are typically formed by a chip manufacturer by bonding together a blue film to form a wafer, and each chip is sorted by electrical and optical characteristics after passing through an electrical tester and a sorter.

In the related art, the current swing arm type separator includes: the chip transfer device comprises a needling device, a wafer bearing mechanism, a swing arm rotating mechanism and a chip carrier bearing mechanism, wherein the wafer bearing mechanism bears the wafer of the LED chips to be classified, the needling device can jack up the LED chips on the wafer, the chips are sucked through a swing arm A on one side of the swing arm rotating mechanism, then the swing arm rotating mechanism rotates the swing arm A to the position of the chip carrier bearing mechanism, meanwhile, a swing arm B on the swing arm rotating mechanism rotates to the wafer position of the LED chips to be classified, the chips are continuously sucked through the swing arm B, the swing arm rotating mechanism rotates again, and the chip transfer classification is finally completed through the action of circulation.

However, using the current equipment solution has the following drawbacks:

1. the chip is transferred from the wafer bearing mechanism to the chip carrier bearing mechanism, and a plurality of mechanisms such as a swing arm rotating mechanism are required to act, so that the process is complicated, the production beat is slow, and the speed cannot be further increased.

2. The chip surface is sucked through the swing arm suction nozzle, so that bad scratch is easy to occur, and the chip quality is influenced.

Therefore, there is a need to design a new needle punch separator to overcome the above-mentioned problems.

Disclosure of Invention

The embodiment of the utility model provides a needling type sorting machine, which aims to solve the problems that in the prior art, chips are transferred from a wafer bearing mechanism to a chip carrier bearing mechanism, a plurality of mechanisms such as a swing arm rotating mechanism are required to act, the flow is complex, the production beat is slow, the speed cannot be further increased, bad scratches are easy to occur, and the quality of the chips is influenced.

In a first aspect, there is provided a needle punch separator comprising: the needling device is provided with a thimble, and one side of the needling device is provided with a wafer bearing mechanism; the chip carrier bearing mechanism and the needling device are distributed on two opposite sides of the wafer bearing mechanism; and the driving device is electrically connected with the needling device and drives the ejector pin to lift the chip on the wafer in the wafer bearing mechanism to the chip carrier bearing mechanism.

In some embodiments, a spacing between the wafer carrier and the chip carrier is less than 1cm.

In some embodiments, the needling device is provided with a plurality of vacuum adsorption holes around the thimble, and the plurality of vacuum adsorption holes are arranged along the circumferential direction of the thimble.

In some embodiments, the needling type separator further comprises a fixed support, the needling device is mounted on the fixed support, and the driving device further drives the needling device to move on the fixed support in a vertical direction or a horizontal direction.

In some embodiments, the needle punch handler further includes a support bracket supported on a side of the chip carrier support mechanism remote from the wafer support mechanism.

In some embodiments, a lifting support is mounted on a side, away from the chip carrier bearing mechanism, of the support, the lifting support is connected with a first driving mechanism, and the first driving mechanism drives the lifting support to drive the support and the chip carrier bearing mechanism to move along an axis of the chip carrier bearing mechanism.

In some embodiments, the needle punch separator further comprises a loading mechanism comprising: the grabbing mechanism is used for feeding the chip carrier to the chip carrier bearing mechanism; and the pushing mechanism is arranged on one side of the chip carrier bearing mechanism and is used for pushing the chip carrier to a preset position of the chip carrier bearing mechanism.

In some embodiments, the needling device, the wafer carrying mechanism and the chip carrier carrying mechanism are further connected with a rotary switching device, and the rotary switching device drives the needling device, the wafer carrying mechanism and the chip carrier carrying mechanism to switch between a horizontal state and a vertical state.

In some embodiments, the needle punch sorter further comprises a second driving mechanism, the second driving mechanism is connected with the wafer bearing mechanism, and the second driving mechanism drives the wafer bearing mechanism to move relative to the ejector pin in a horizontal plane.

In some embodiments, the needling type sorting machine is provided with a wafer loading area and a chip carrier loading area, and further comprises a light auxiliary device connected with a third driving mechanism; when the second driving mechanism drives the wafer bearing mechanism to move from the wafer loading area to the chip carrier loading area, the third driving mechanism drives the light auxiliary device to synchronously move from the wafer loading area to the chip carrier loading area.

In some embodiments, the needle punch handler further includes a lift-up tray located below the wafer carrier, the lift-up tray configured to lift the wafer dome to a predetermined position of the wafer carrier.

The technical scheme provided by the utility model has the beneficial effects that:

the chip carrier bearing mechanism and the needling devices are distributed on the two opposite sides of the wafer bearing mechanism, and the ejector pins can be driven by the driving device to directly lift the chips on the wafer in the wafer bearing mechanism onto the chip carrier bearing mechanism, and the chips are not required to be transferred through any other mechanism in the middle, so that the flow steps can be reduced, the beats can be lifted, the chips can be directly from the wafer bearing mechanism to the chip carrier bearing mechanism, the surfaces of the chips do not need to be contacted with other mechanisms, and further the defects such as scratches and the like are not easy to occur.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural view of a horizontal arrangement of a needling type separator according to an embodiment of the present utility model;

fig. 2 is a schematic structural view of a vertical arrangement of a needling type separator according to an embodiment of the present utility model;

fig. 3 is a schematic view of a part of a needling apparatus according to an embodiment of the present utility model.

In the figure:

1. a needling device; 11. a thimble; 12. vacuum adsorption holes;

2. a wafer carrying mechanism; 3. a chip carrier bearing mechanism; 4. a fixed bracket; 5. a support bracket; 6. jacking the bracket;

7. a wafer; 8. a chip; 9. and a chip carrier.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The embodiment of the utility model provides a needling type sorting machine, which can solve the problems that in the prior art, chips are transferred from a wafer bearing mechanism to a chip carrier bearing mechanism, and a plurality of mechanisms such as a swing arm rotating mechanism are required to act, so that the process is complicated, the production beat is slow, the speed cannot be further increased, bad scratches are easy to occur, and the quality of the chips is influenced.

Referring to fig. 1 and 2, a needling type separator according to an embodiment of the present utility model may include: the needling device 1, the needling device 1 is provided with a thimble 11, one side of the needling device 1 is provided with a wafer bearing mechanism 2, wherein the wafer bearing mechanism 2 can bear a wafer 7, the wafer 7 can be fixed, the wafer 7 can comprise a blue film, and a plurality of chips 8 can be arranged on the blue film to form the wafer 7; the chip carrier carrying mechanism 3, the chip carrier carrying mechanism 3 and the needling device 1 are distributed on two opposite sides of the wafer carrying mechanism 2, the chip carrier carrying mechanism 3 can be used for fixing the chip carrier 9, wherein the needling device 1, the wafer carrying mechanism 2 and the chip carrier carrying mechanism 3 can be distributed up and down or horizontally, and can be specifically set according to the use requirement; and the driving device is electrically connected with the needling device 1, and can drive the ejector pins 11 to lift the chips 8 on the wafer 7 in the wafer bearing mechanism 2 to the chip carrier bearing mechanism 3. That is, the wafer carrying mechanism 2 and the chip carrier carrying mechanism 3 in the present embodiment are configured such that the ejector pins 11 can directly lift the chips 8 on the wafer 7 onto the chip carrier carrying mechanism 3, and the middle does not need to be switched through the swing arm rotating mechanism.

In this embodiment, since the chip carrier carrying mechanism 3 and the needling device 1 are distributed on two opposite sides of the wafer carrying mechanism 2, and the ejector pins 11 can be driven by the driving device to directly lift the chips 8 on the wafer 7 in the wafer carrying mechanism 2 onto the chip carrier carrying mechanism 3, the middle of the chip carrier carrying mechanism does not need to be connected with the chips 8 through any other mechanism, so that the mechanism of the swing arm is eliminated, the rotation of the chips 8 on the swing arm is reduced, the flow steps can be reduced, the beat is promoted, the ejector pins 11 lift the chips 8 on the blue film side, the chips 8 can be directly lifted from the wafer carrying mechanism 2 to the chip carrier carrying mechanism 3, the surfaces of the chips 8 do not need to contact with other mechanisms, and further, the bad problems such as scratches are not easy to occur, and the shipment quality of the chips 8 is improved.

It can be understood that the LED chips 8 on the wafer 7 may be LED chips 8, or other semiconductor chips 8, and the other semiconductor chips 8 may be sorted by the needling type sorting machine provided in the embodiment, which is not limited to sorting of the LED chips 8.

In the process of sorting, the wafer 7 can be firstly fed onto the wafer bearing mechanism 2, the chip carrier 9 is fed onto the chip carrier 9 bearing device, then the chip 8 in the wafer 7 is lifted up through the ejector pin 11 in the needling device 1, so that the corresponding chip 8 in the wafer 7 is directly separated from the blue film and adhered onto the chip carrier 9, then the ejector pin 11 returns to the initial position, then the needling device 1 or the wafer bearing mechanism 2 can be driven by a portal frame or other devices to move, the ejector pin 11 is aligned to the position of the next chip 8, and the steps are repeated to lift the chip 8 onto the chip carrier 9.

Preferably, the distance between the wafer carrying mechanism 2 and the chip carrier carrying mechanism 3 may be less than 1cm. The relatively small spacing can ensure that the chips 8 can immediately reach the chip carrier 9 of the chip carrier bearing mechanism 3 after being separated from the blue film of the wafer 7, and are not easy to fall off or shift. Of course, in other embodiments, the spacing between the wafer carrier 2 and the chip carrier 3 may be set according to practical requirements, and is not necessarily within 1cm, but is not limited thereto.

In some embodiments, referring to fig. 1 and 3, the needling apparatus 1 may be provided with a plurality of vacuum suction holes 12 around the thimble 11, and the plurality of vacuum suction holes 12 may be arranged along the circumferential direction of the thimble 11. Wherein, vacuum adsorption hole 12 can provide the vacuum to make acupuncture device 1 when jacking chip 8, vacuum adsorption hole 12 all around of thimble 11 can adsorb the blue membrane, so set up, the in-process of jacking chip 8 of thimble 11 can reduce the deformation of blue membrane, be favorable to promoting the precision behind the chip 8 jacking, simultaneously, because the deformation degree of blue membrane has reduced, this chip 8 around by the chip 8 of jacking is also difficult for being pulled and shifted by the blue membrane, has further promoted the position precision of other chips 8 around.

Referring to fig. 1, in some alternative embodiments, the needling apparatus 1 may further include a fixed support 4, the needling apparatus 1 is mounted to the fixed support 4, and the driving device may further drive the needling apparatus 1 to move in a vertical direction or a horizontal direction on the fixed support 4. In this embodiment, by setting the fixing support 4 in cooperation with the driving device, the movement of the needling device 1 in the vertical direction and the movement in the horizontal direction can be realized, so that the distance and the position of the needling device 1 relative to the wafer 7 carrying device can be adjusted, and the chip 8 can be lifted by adjusting a better distance. Of course, in other embodiments, the fixing bracket 4 may not be provided.

Further, in some embodiments, the needle-punched sorting machine may further include a support bracket 5, where the support bracket 5 is supported on a side of the chip carrier support mechanism 3 away from the wafer support mechanism 2. In this embodiment, by arranging the support bracket 5 on one side of the chip carrier carrying mechanism 3, the support bracket 5 can support the chip carrier 9 on the chip carrier carrying mechanism 3 to provide a supporting force, so that the needling type sorting machine can be suitable for the chip carrier 9 made of soft materials, such as blue film.

In other embodiments, if the chip carrier 9 is made of a hard material, such as PCB or glass, the chip carrier 9 may be directly placed on the chip carrier 9 carrying device to carry the chip 8, and the support bracket 5 may not be required to support the chip carrier 9.

Preferably, referring to fig. 1, a lifting support 6 may be installed on a side of the support 5 away from the chip carrier bearing mechanism 3, and the lifting support 6 is connected with a first driving mechanism, and the first driving mechanism may drive the lifting support 6 to drive the support 5 and the chip carrier bearing mechanism 3 to move along an axis of the chip carrier bearing mechanism 3. That is, the first driving mechanism cooperates with the jacking bracket 6 to drive the supporting bracket 5 and the chip carrier carrying mechanism 3 to lift and descend, so that the distance between the chip carrier carrying mechanism 3 and the wafer carrying mechanism 2 can be adjusted, and meanwhile, feeding on the chip carrier carrying mechanism 3 can be facilitated.

In some embodiments, the needle punch separator may further include a feeding mechanism, which may include: the grabbing mechanism is used for feeding the chip carrier 9 to the chip carrier bearing mechanism 3; and the pushing mechanism is arranged on one side of the chip carrier bearing mechanism 3 and is used for pushing the chip carrier 9 to a preset position of the chip carrier bearing mechanism 3. It can be understood that after the chip carriers 9 are grabbed onto the chip carrier bearing mechanism 3 by the grabbing mechanism, the position may not be an accurate position, and the chip carriers 9 can be pushed onto the preset position of the chip carrier bearing mechanism 3 by the pushing mechanism, so that each chip carrier 9 can accurately reach the set position of the chip carrier 9, and a basis is provided for accurate transfer of the subsequent chips 8.

Of course, in other embodiments, if the grabbing mechanism can directly accurately place the chip carrier 9 to the preset position, the pushing mechanism may not be required.

Further, in some alternative embodiments, the needling apparatus 1, the wafer carrier 2 and the chip carrier 3 may be further connected with a rotation switching device, where the rotation switching device may be entirely connected to the needling apparatus 1, the wafer carrier 2 and the chip carrier 3, or each of the needling apparatus 1, the wafer carrier 2 and the chip carrier 3 may be separately connected with a rotation switching device, and the rotation switching device may drive the needling apparatus 1, the wafer carrier 2 and the chip carrier 3 to switch between a horizontal state and a vertical state. Because when actual production needs, some production lines need to place wafer 7 horizontally, and some production lines need to place wafer 7 vertically, this embodiment can be according to the in-service use demand at will switch between horizontality and vertical state through setting up rotatory auto-change over device.

In some embodiments, the needle-punching sorter may further include a second driving mechanism, the second driving mechanism is connected to the wafer carrying mechanism 2, and the second driving mechanism drives the wafer carrying mechanism 2 to move relative to the ejector pins 11 in a horizontal plane. That is, the second driving mechanism can drive the wafer carrying mechanism 2 to move in a horizontal plane and can generate relative motion with the ejector pins 11, so that the ejector pins 11 can correspond to the chips 8 at different positions on the wafer 7, and then lift up different chips 8.

Preferably, the needling type sorting machine may be provided with a feeding area of the wafer 7 and a feeding area of the chip carrier 9, the wafer carrying mechanism 2 may be located in the feeding area of the wafer 7, the chip carrier carrying mechanism 3 may be located in the feeding area of the chip carrier 9, and the needling type sorting machine may further comprise a light auxiliary device, and the light auxiliary device is connected with a third driving mechanism; when the second driving mechanism drives the wafer carrying mechanism 2 to move from the feeding area of the wafer 7 to the feeding area of the chip carrier 9, the third driving mechanism drives the light assisting device to synchronously move from the feeding area of the wafer 7 to the feeding area of the chip carrier 9.

Further, the needling type sorting machine may further include a lifting disc, where the lifting disc may be disc-shaped and may be better for carrying the wafer 7, and the lifting disc is located below the wafer carrying mechanism 2, and is used for lifting the wafer 7 to a preset position of the wafer carrying mechanism 2. After the wafer 7 is grabbed by the grabbing mechanism or the manipulator, the wafer 7 can be placed on the lifting disc with lower height along the horizontal direction, then the wafer 7 is transported to the wafer bearing mechanism 2 above through the lifting disc, so that the horizontal movement and the vertical movement of the wafer 7 can be separated, the wafer 7 can be conveniently kept in linear movement all the time, namely, the wafer bearing mechanism comprises the horizontal linear movement and the vertical linear movement, and finally the wafer is accurately conveyed to the wafer bearing mechanism 2.

In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

It should be noted that in the present utility model, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The foregoing is only a specific embodiment of the utility model to enable those skilled in the art to understand or practice the utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A needle punch separator, comprising:

the needling device (1), the needling device (1) is provided with a thimble (11), and one side of the needling device (1) is provided with a wafer bearing mechanism (2);

the chip carrier bearing mechanism (3), the chip carrier bearing mechanism (3) and the needling device (1) are distributed on two opposite sides of the wafer bearing mechanism (2);

and the driving device is electrically connected with the needling device (1), and drives the ejector pins (11) to lift the chips (8) on the wafer (7) in the wafer bearing mechanism (2) to the chip carrier bearing mechanism (3).

2. The needle punch separator of claim 1, wherein:

the needling device (1) is provided with a plurality of vacuum adsorption holes (12) around the thimble (11), and the vacuum adsorption holes (12) are arranged along the circumferential direction of the thimble (11).

3. The needle punch separator of claim 1, wherein:

the needling type sorting machine further comprises a fixed support (4), the needling device (1) is mounted on the fixed support (4), and the driving device further drives the needling device (1) to move on the fixed support (4) along the vertical direction or the horizontal direction.

4. The needle punch separator of claim 1, wherein:

the needling type sorting machine further comprises a supporting bracket (5), wherein the supporting bracket (5) is supported on one side, far away from the wafer bearing mechanism (2), of the chip carrier bearing mechanism (3).

5. The needle punch separator of claim 4, wherein:

the chip carrier bearing mechanism is characterized in that a jacking bracket (6) is arranged on one side, far away from the chip carrier bearing mechanism (3), of the supporting bracket (5), the jacking bracket (6) is connected with a first driving mechanism, the first driving mechanism drives the jacking bracket (6) to drive the supporting bracket (5) and the chip carrier bearing mechanism (3) to move along the axis of the chip carrier bearing mechanism (3).

6. The needle separator of claim 1 or 4 or 5, further comprising a loading mechanism comprising:

the grabbing mechanism is used for feeding the chip carrier (9) to the chip carrier bearing mechanism (3);

and the pushing mechanism is arranged on one side of the chip carrier bearing mechanism (3) and is used for pushing the chip carrier (9) to a preset position of the chip carrier bearing mechanism (3).

7. The needle punch separator of claim 1, wherein:

the needling device (1), the wafer bearing mechanism (2) and the chip carrier bearing mechanism (3) are further connected with a rotary switching device, and the rotary switching device drives the needling device (1), the wafer bearing mechanism (2) and the chip carrier bearing mechanism (3) to switch between a horizontal state and a vertical state.

8. The needle punch separator of claim 1, wherein:

the needling type sorting machine further comprises a second driving mechanism, the second driving mechanism is connected with the wafer bearing mechanism (2), and the second driving mechanism drives the wafer bearing mechanism (2) to move relative to the ejector pins (11) in a horizontal plane.

9. The needle punch separator of claim 8, wherein:

the needling type sorting machine is provided with a wafer (7) feeding area and a chip carrier (9) feeding area, and further comprises a light auxiliary device which is connected with a third driving mechanism;

when the second driving mechanism drives the wafer bearing mechanism (2) to move from the wafer (7) feeding area to the chip carrier (9) feeding area, the third driving mechanism drives the light auxiliary device to synchronously move from the wafer (7) feeding area to the chip carrier (9) feeding area.

10. The needle punch separator of claim 1, wherein:

the needling type sorting machine further comprises a jacking disc, wherein the jacking disc is located below the wafer bearing mechanism (2) and is used for jacking the wafer (7) to a preset position of the wafer bearing mechanism (2).