CN111312865A - Method and device for full-automatic intelligent positioning, transferring and arranging LED chips - Google Patents
Method and device for full-automatic intelligent positioning, transferring and arranging LED chips Download PDFInfo
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- CN111312865A CN111312865A CN201811515178.4A CN201811515178A CN111312865A CN 111312865 A CN111312865 A CN 111312865A CN 201811515178 A CN201811515178 A CN 201811515178A CN 111312865 A CN111312865 A CN 111312865A
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Abstract
The invention discloses a method and a device for full-automatic intelligent positioning, transferring and arranging LED chips, wherein the device comprises: the device comprises a material fixing mechanism, a blue film platform module, a thimble mechanism, a detection and supervision mechanism and an intelligent control mechanism. The device realizes the accurate operation of the material fixing mechanism, the blue film platform module and the thimble mechanism through the supervision of the detection and supervision mechanism and the control of the intelligent control mechanism, so that the method for accurately fixing the LED chips on the substrate is simple and easy to implement, and the device has a simple structure and is easy to realize the full-automatic intelligent transfer and arrangement of the LED chips.
Description
Technical Field
The invention relates to a method and a device for full-automatic intelligent positioning, transferring and arranging LED chips. More particularly, the present invention relates to a method and apparatus for transferring and arranging LED chips from a blue film to a substrate.
Background
The production technology of the LED is mature day by day, and the production technology of the LED is no longer a difficult problem of any LED enterprise at present regardless of a common LED chip or a micro LED chip. The micro LED chip is used as a self-luminous display technology, each pixel of the micro LED chip can be used as a single point to drive light to emit, the size of the micro LED chip is 10-100 times smaller than that of the current mainstream LED, the distance between pixel points can be reduced from the current millimeter level to the micron level by utilizing the micro LED in the display, the micro LED which is the newest LED in the LED, has higher technical difficulty ratio, higher brightness, better luminous efficiency and lower power consumption is taken as a research hotspot of batch industrialization in the current industry, the advantages of the micro LED in the display technology are required to be fully utilized, the batch transfer of the micro LED is required to be researched, the batch transfer of the micro LED chip always influences the industrial production of the micro LED chip, and the micro LED display can be practically used on the display only by a large number of repeated transfer processes. At present, a plurality of LED enterprises have made intensive research on a micro LED transfer technology, for example, LuxVue purchased by apple transfers micro LEDs in batches by electrostatic adsorption, although the technology is advanced in the batch transfer technology, the technology has a lot of defects, such as how to screen out unqualified chips in the batch transfer process, if an alternative method is used to screen out unqualified chips separately, a huge project is also required, and how to position the micro LEDs and a substrate more accurately, and the like, a series of problems still needs to be solved urgently in the technical field of batch transfer of micro LED chips, and more enterprises and more efforts are needed to make intensive research on the technology so as to enable the micro LEDs to really exert their advantageous values in industrial production.
Disclosure of Invention
The invention aims to provide a method for full-automatic intelligent positioning, transferring and arranging LED chips, which has simple steps and is easy to transfer and arrange LED chips on a large scale in an industrialized mode.
The invention also aims to provide a device for full-automatic intelligent positioning, transferring and arranging the LED chips, which has a simple mechanism and is applied to transferring and arranging the LED chips, so that the transferring and arranging operations of the LED chips in large batches are simpler and more accurate.
To achieve the objects and other advantages in accordance with the purpose of the invention, the present invention provides a method for full-automatic intelligent positioning, transferring and arranging LED chips, comprising the steps of:
A. fixing the blue film;
B. fixing the substrate to enable the substrate to be parallel to the blue film, and enabling the LED chip on the blue film to be close to the substrate and not attached to the substrate;
C. horizontally moving and adjusting the positions of the blue film and the substrate to enable one LED chip on the blue film to be corresponding to the position of the LED chip to be fixed on the substrate and the thimble on the other side of the blue film to be on the same vertical line;
D. the thimble ejects the LED chip from the blue film along the vertical line direction and is attached to the substrate;
E. resetting the ejector pins, and horizontally moving the blue film and the substrate respectively to enable the LED chip to be fixed on the upper side and the lower side of the blue film to be corresponding to the position of the next LED chip to be fixed on the substrate and the ejector pin on the other side of the blue film on the same vertical line;
F. the thimble ejects the LED chip from the blue film along the vertical line direction and is attached to the substrate;
G. e, F is repeated until the LED chip is fixed at the position on the substrate where the LED chip is required to be fixed.
The invention relates to a method for full-automatic intelligent positioning, transferring and arranging LED chips, wherein the positions of the LED chips to be fixed on a substrate or the LED chips to be fixed on the substrate on a blue film are not on the same vertical line with an ejector pin on the other side of the blue film, and the blue film or the substrate is subjected to position fine adjustment in the horizontal direction and is adjusted to be on the same vertical line with the ejector pin.
The invention relates to a method for full-automatic intelligent positioning, transferring and arranging LED chips, wherein the positions of the LED chips to be fixed on a substrate and the LED chips to be fixed on the substrate on a blue film are not on the same vertical line corresponding to an ejector pin on the other side of the blue film, and the blue film and the substrate are respectively subjected to position fine adjustment in the horizontal direction and are adjusted to be on the same vertical line with the ejector pin.
The invention relates to a method for full-automatic intelligent positioning, transferring and arranging LED chips, wherein when the next LED chip to be fixed on a blue film is an unqualified LED chip, the next qualified LED chip is corresponding to the position of the next LED chip to be fixed on a substrate and a thimble on the other side of the blue film on the same vertical line.
To achieve the objects and other advantages in accordance with the purpose of the invention, the present invention also provides a device for full-automatic intelligent positioning, transferring and arranging LED chips, comprising:
material fixing mechanism: fixing the substrate in the transferring and arranging process of the LED chips, and adjusting the position of the substrate according to the arrangement position of the LED chips required by the substrate and the directions of x and y axes;
blue membrane platform module: the blue film platform module is used for bearing the LED chip fixed in front of the substrate, and the LED chip on the blue film platform module is close to the substrate on the material fixing mechanism in parallel without being attached;
the thimble mechanism: the LED chip at the position corresponding to the thimble is ejected out of the blue film platform module and attached to the substrate by moving up and down on the z axis;
a detection supervision mechanism: the device comprises a support and a camera detection mechanism, wherein the camera detection mechanism is fixed on the support, and is used for detecting the positions of a material fixing mechanism, a blue film platform module and a thimble mechanism in the directions of x and y axes;
the intelligent control mechanism: the device comprises a material fixing control mechanism, a blue film platform module, a thimble mechanism and a detection and supervision mechanism.
The invention relates to a device for full-automatic intelligent positioning, transferring and arranging LED chips, wherein a material fixing mechanism conveys a substrate into the device and conveys the substrate out of the device after the substrate fixes the required LED chips.
The invention relates to a device for full-automatic intelligent positioning, transferring and arranging LED chips, wherein a material fixing mechanism drives a substrate to move after each LED chip is fixed on the substrate on the material fixing mechanism before all the LED chips required on the substrate are fixed, so that the position of the next LED chip required to be fixed and an ejector pin on an ejector pin mechanism are correspondingly arranged on a vertical line.
The invention discloses a device for full-automatic intelligent positioning, transferring and arranging LED chips, wherein a blue film platform module is a hollow platform module.
The invention relates to a device for full-automatic intelligent positioning, transferring and arranging LED chips, wherein a hollow blue membrane platform module is hollow at the corresponding position of the LED chips.
The invention relates to a device for full-automatic intelligent positioning, transferring and arranging LED chips, wherein before fixing all the LED chips on a substrate on a material fixing mechanism, and after each LED chip is fixed on the substrate on the material fixing mechanism, a blue film platform module drives the LED chips on the blue film platform module to move, so that the next LED chip to be fixed on the substrate and an ejector pin on an ejector pin mechanism are correspondingly arranged on a vertical line.
The device for full-automatic intelligent positioning, transferring and arranging the LED chips is characterized in that the intelligent control mechanism marks the positions of the unqualified LED chips on the blue film platform module, and when the LED chip needing to be fixed on the substrate on the upper side and the lower side of the blue film platform module is the unqualified LED chip, the intelligent control mechanism automatically jumps to the position where the next qualified LED chip and the thimble on the thimble mechanism are corresponding to each other on a vertical line.
According to the device for full-automatic intelligent positioning, transferring and arranging the LED chips, the ejector pin mechanism does not have displacement on the x axis and the y axis and can only move up and down on the z axis; the thimble mechanism motion path includes:
the thimble mechanism moves upwards along the z-axis;
ejecting the LED chip at the position corresponding to the ejector pin from the blue film platform module through the ejector pin;
attaching the ejected LED chip to a substrate on the material fixing mechanism;
the thimble mechanism moves downwards along the z-axis to restore the original position.
The invention relates to a device for full-automatic intelligent positioning, transferring and arranging LED chips, wherein a detection and supervision mechanism detects the positions of a material fixing mechanism, a blue film platform module and an ejector pin mechanism through a camera detection mechanism:
the upper part and the lower part of the material fixing mechanism are required to fix the position of an LED chip, the upper part and the lower part of the blue film platform module are required to fix the LED chip, and the thimble on the thimble mechanism are positioned on the same vertical line;
the upper part and the lower part of the material fixing mechanism need to fix the position of the LED chip or the upper part and the lower part of the blue film platform module need to fix the LED chip, is not on the same vertical line with the thimble on the thimble mechanism, after the detection monitoring mechanism sends a signal to the intelligent control mechanism, the intelligent control mechanism controls the material fixing mechanism or the blue film platform module to perform position fine adjustment in the horizontal direction, so that the material fixing mechanism which is not on the same vertical line with the thimble on the thimble mechanism is provided with an LED chip position to be fixed or the blue film platform module is provided with an LED chip to be fixed, after the LED chips are positioned on the same vertical line with the ejector pins on the ejector pin mechanism, the detection monitoring mechanism sends signals to the intelligent control mechanism, the intelligent control mechanism controls the ejector pin mechanism to start driving the ejector pins to move upwards along the z-axis direction, and the LED chips at the corresponding positions on the blue film platform module are ejected out and attached to the positions of the LED chips to be fixed on the substrate on the material fixing mechanism;
the upper part and the lower part of the material fixing mechanism are required to fix the position of the LED chip and the upper part and the lower part of the blue film platform module are required to fix the LED chip, is not on the same vertical line with the thimble on the thimble mechanism, after the detection monitoring mechanism sends a signal to the intelligent control mechanism, the intelligent control mechanism controls the material fixing mechanism and the blue film platform module to respectively carry out position fine adjustment in the horizontal direction, so that the material fixing mechanism which is not on the same vertical line with the thimble on the thimble mechanism is provided with an LED chip which needs to be fixed at the upper and lower positions and the blue film platform module is provided with an LED chip which needs to be fixed at the upper and lower positions, after the LED chip is positioned on the same vertical line with the ejector pin on the ejector pin mechanism, the detection monitoring mechanism sends a signal to the intelligent control mechanism, and the intelligent control mechanism controls the ejector pin mechanism to start driving the ejector pin to move upwards along the z-axis direction, so that the LED chip at the corresponding position on the blue film platform module is ejected out and is attached to the position of the LED chip required to be fixed on the substrate on the material fixing mechanism.
The invention at least comprises the following beneficial effects:
at present, the batch transfer technology of LED Micro chips, such as MiniLED, Micro LED chips and the like, is almost mastered by foreign companies, and the MiniLED, Micro LED chips and the like restrict the development of other enterprises in the technical field of Micro LED chip transfer by applying for patents, domestic companies, if people want to be used in the aspect of LED chip batch transfer, the existing technology has no way to select, and the unique technology of the people can be researched by independent research and development, the inventor of the invention finds a method for batch transfer of chips in the experimental process of batch transfer of the Micro LED chips, particularly the MiniLED, by positioning the chips on a blue film and a substrate needing to fix the chips and ejecting the chips from the blue film by an ejector pin to be attached on the substrate, the method for batch transfer and arrangement of the chips has simple steps and easy operation, and unqualified LED chips can be screened in the process, and the LED chips and the positions required to be fixed on the substrate are accurately positioned, so that the working efficiency of batch transfer and arrangement of the LED chips can be effectively improved, and the qualification rate of the LED chips on the substrate is ensured.
In the research process, the inventor of the invention develops a full-automatic intelligent positioning, transferring and arranging device for LED chips in order to enable the LED chips to be transferred and arranged in a large-scale industrialization way. .
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
The drawings are included to further explain the present invention and not to limit the scope of the invention.
FIG. 1 is a schematic front view showing a structure of a full-automatic intelligent positioning, transferring and arranging device for LED chips.
FIG. 2 is a schematic top view of the full-automatic intelligent positioning, transferring and arranging device for LED chips.
FIG. 3 is a schematic side view A of the full-automatic intelligent positioning, transferring and arranging device for LED chips.
FIG. 4 is a schematic side view B of the apparatus for automatically and intelligently positioning, transferring and arranging LED chips according to the present invention.
FIG. 5 is a schematic side view of another apparatus for automatically and intelligently positioning, transferring and arranging LED chips according to the present invention.
Description of the drawings: 1. the device comprises a thimble mechanism, 2 a thimble, 3 a blue film platform module, 4 a blue film, 5 an LED chip, 6 a material fixing mechanism, 7 a substrate, 8 a support and 9 a detection and supervision mechanism.
Detailed Description
Embodiments of the present disclosure are described in the specification. The disclosed embodiments are merely examples, and other embodiments may take various and alternative forms, the numbers not necessarily being to scale; certain features may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ embodiments.
The present invention is further described in detail below with reference to specific embodiments so that those skilled in the art can implement the invention without limiting the scope of the invention by referring to the description text.
The LED chips comprise common LED chips and Micro LED chips, and the Micro chips comprise Mini LED chips, Micro LED chips and the like, namely the technology is suitable for arrangement and transfer of LED chips with any different sizes, and is particularly suitable for the Mini LED chips. The blue film is used for expanding crystal in the prior art, or is a film with similar action to the blue film, if the blue film has elasticity, the blue film can be used for expanding distance after fixing chips on a wafer, has certain transparency, and can enable a detection mechanism to clearly shoot position information of an object on the other surface of the blue film through the blue film when being used for the device.
Embodiment 1 a device (suitable for transparent substrate) for full-automatic intelligent positioning, transferring and arranging LED chips.
As shown in fig. 1, the device for full-automatic intelligent positioning, transferring and arranging LED chips is composed of a material fixing mechanism, a blue film platform module, an ejector pin mechanism, a detection and supervision mechanism, an intelligent control mechanism and the like, wherein a transparent substrate on which Mini LED chips are to be arranged is conveyed into the device through the material fixing mechanism, is fixed on the material fixing mechanism, and moves in the direction of X, Y axis through the displacement of the material fixing mechanism; the LED chip to be fixed on the substrate is fixed on the blue film platform module through the blue film, is parallel to the substrate on the material fixing mechanism in the horizontal direction and is close to each other without being attached, the blue film platform module drives the LED chip on the blue film to move in the X, Y-axis direction, the position of the blue film platform module on which the LED chip is arranged is empty, a thimble fixed on the thimble mechanism can pass through, the thimble moves up and down through the thimble platform to move up and down on the Z axis, the LED chip above the thimble is ejected from the blue film platform module and is attached to the position of the LED chip required to be fixed on the substrate, wherein the thimble, the LED chip required to be fixed currently and the substrate are on the same vertical line, if the thimble, the detection monitoring mechanism arranged on the other side of the substrate detects the LED chip and transmits the offset information to the intelligent control mechanism, the intelligent control mechanism controls the position deviation mechanism through the acquired position deviation information: the blue film platform module or the material fixing mechanism finely adjusts the deviation position, so that the thimble, the LED chip which needs to be fixed at present and the LED chip which needs to be fixed by the substrate are positioned on the same vertical line. When the detection and supervision mechanism detects that the LED chips are on the same vertical line, the detection and supervision mechanism sends a signal to the intelligent control mechanism, the intelligent control mechanism controls the thimble mechanism to move in the Z-axis direction, and the thimble is used for ejecting the LED chips on the blue film platform module corresponding to the thimble to the position where the LED chips are required to be fixed on the substrate. After the process is finished, the ejector pins reset along with the ejector pin platforms, the blue film platform module and the material fixing mechanism respectively horizontally move, so that the LED chip to be fixed on the upper side and the lower side of the blue film platform module, the position of the next LED chip to be fixed on the substrate of the material fixing mechanism and the ejector pin on the other side of the blue film are correspondingly arranged on the same vertical line, the ejector pin platforms drive the ejector pins to eject the LED chips out of the blue film along the Z-axis direction again to be attached to the substrate, and the process is repeated until the LED chips are fixed on the substrate in the positions required to fix the LED chips. When unqualified LED chips exist on the blue film platform module, the detection and supervision mechanism sends signals to the intelligent control mechanism, or unqualified LED chip position information is marked in the intelligent control mechanism in advance, when the unqualified LED chips are moved, the intelligent control mechanism controls the blue film platform module to move on an X, Y axis, the blue film platform module moves until the qualified LED chips, the ejector pins and the LED chips needing to be fixed on the substrate are positioned on the same vertical line, and the ejector pins are used for ejecting the LED chips on the blue film platform module corresponding to the ejector pins according to normal steps to eject the LED chips to the positions needing to be fixed on the substrate.
Embodiment 2 a device for full-automatic intelligent positioning, transferring and arranging LED chips (which can be used for opaque substrates).
As shown in fig. 5, the device for full-automatic intelligent positioning, transferring and arranging LED chips is composed of a material fixing mechanism, a blue film platform module, an ejector pin mechanism, a detection and supervision mechanism, an intelligent control mechanism, etc., wherein a substrate on which Mini LED chips are to be arranged is conveyed into the device through the material fixing mechanism, is fixed on the material fixing mechanism, and moves in the direction of X, Y axis through the displacement of the material fixing mechanism; the LED chip to be fixed on the substrate is fixed on the blue film platform module through the blue film, is parallel to the substrate on the material fixing mechanism in the horizontal direction and is close to each other without being attached, the blue film platform module drives the LED chip on the blue film to move in the X, Y-axis direction, the position of the blue film platform module on which the LED chip is arranged is empty, a thimble fixed on the thimble mechanism can pass through, the thimble moves up and down through the thimble platform to move up and down on the Z axis, the LED chip above the thimble is ejected from the blue film platform module and is attached to the position of the substrate on which the LED chip is required to be fixed, wherein the thimble platform or the region for fixing the thimble is made of transparent material, the thimble, the LED chip required to be fixed at present and the substrate are required to fix the LED chip, on the same vertical line, if not on the same vertical line, the detection and supervision mechanism arranged on the other side of the thimble platform detects the LED chip, and transmit skew information for intelligent control mechanism, intelligent control mechanism is through the positional deviation information that acquires, the mechanism of control positional deviation: the blue film platform module or the material fixing mechanism finely adjusts the deviation position, so that the thimble, the LED chip which needs to be fixed at present and the LED chip which needs to be fixed by the substrate are positioned on the same vertical line. When the detection and supervision mechanism detects that the LED chips are on the same vertical line, the detection and supervision mechanism sends a signal to the intelligent control mechanism, the intelligent control mechanism controls the thimble mechanism to move in the Z-axis direction, and the thimble is used for ejecting the LED chips on the blue film platform module corresponding to the thimble to the position where the LED chips are required to be fixed on the substrate. After the process is finished, the ejector pins reset along with the ejector pin platforms, the blue film platform module and the material fixing mechanism respectively horizontally move, so that the LED chip to be fixed on the upper side and the lower side of the blue film platform module, the position of the next LED chip to be fixed on the substrate of the material fixing mechanism and the ejector pin on the other side of the blue film are correspondingly arranged on the same vertical line, the ejector pin platforms drive the ejector pins to eject the LED chips out of the blue film along the Z-axis direction again to be attached to the substrate, and the process is repeated until the LED chips are fixed on the substrate in the positions required to fix the LED chips. When unqualified LED chips exist on the blue film platform module, the detection and supervision mechanism sends signals to the intelligent control mechanism, or unqualified LED chip position information is marked in the intelligent control mechanism in advance, when the unqualified LED chips are moved, the intelligent control mechanism controls the blue film platform module to move on an X, Y axis, the blue film platform module moves until the qualified LED chips, the ejector pins and the LED chips needing to be fixed on the substrate are positioned on the same vertical line, and the ejector pins are used for ejecting the LED chips on the blue film platform module corresponding to the ejector pins according to normal steps to eject the LED chips to the positions needing to be fixed on the substrate.
It is apparent that those skilled in the art can obtain various effects, which have not been directly mentioned according to the respective embodiments, in various structures according to the embodiments of the present invention.
While embodiments of the invention have been disclosed above, it is not intended to be limited to the uses set forth in the specification and examples. It can be applied to all kinds of fields suitable for the present invention. Additional modifications will readily occur to those skilled in the art. It is therefore intended that the invention not be limited to the exact details and illustrations described and illustrated herein, but fall within the scope of the appended claims and equivalents thereof.
Claims (13)
1. A method for full-automatic intelligent positioning, transferring and arranging LED chips is characterized by comprising the following steps:
A. fixing the blue film;
B. fixing the substrate to enable the substrate to be parallel to the blue film, and enabling the LED chip on the blue film to be close to the substrate and not attached to the substrate;
C. horizontally moving and adjusting the positions of the blue film and the substrate to enable one LED chip on the blue film to be corresponding to the position of the LED chip to be fixed on the substrate and the thimble on the other side of the blue film to be on the same vertical line;
D. the thimble ejects the LED chip from the blue film along the vertical line direction and is attached to the substrate;
E. resetting the ejector pins, and horizontally moving the blue film and the substrate respectively to enable the LED chip to be fixed on the upper side and the lower side of the blue film to be corresponding to the position of the next LED chip to be fixed on the substrate and the ejector pin on the other side of the blue film on the same vertical line;
F. the thimble ejects the LED chip from the blue film along the vertical line direction and is attached to the substrate;
G. e, F is repeated until the LED chip is fixed at the position on the substrate where the LED chip is required to be fixed.
2. The method according to claim 1, wherein the position of the LED chip to be fixed on the substrate or the LED chip to be fixed on the substrate on the blue film is not on the same vertical line with the thimble on the other side of the blue film, and the position of the blue film or the substrate is finely adjusted in the horizontal direction to be on the same vertical line with the thimble.
3. The method according to claim 1, wherein the positions of the LED chips to be fixed on the substrate and the LED chips to be fixed on the substrate on the blue film are different from the position of the thimble on the other side of the blue film on the same vertical line, and the positions of the blue film and the substrate are finely adjusted in the horizontal direction to be on the same vertical line as the thimble.
4. The method according to claim 1, wherein the next LED chip to be mounted on the blue film is an unqualified LED chip, and the position of the next qualified LED chip on the substrate and the position of the thimble on the other side of the blue film are aligned with each other.
5. The utility model provides a device that full-automatic intelligence location shifted, arranged LED chip which characterized in that, the device includes:
material fixing mechanism: fixing the substrate in the transferring and arranging process of the LED chips, and adjusting the position of the substrate according to the arrangement position of the LED chips required by the substrate and the directions of x and y axes;
blue membrane platform module: the blue film platform module is used for bearing the LED chip fixed in front of the substrate, and the LED chip on the blue film platform module is close to the substrate on the material fixing mechanism in parallel without being attached;
the thimble mechanism: the LED chip at the position corresponding to the thimble is ejected out of the blue film platform module and attached to the substrate by moving up and down on the z axis;
a detection supervision mechanism: the device comprises a support and a camera detection mechanism, wherein the camera detection mechanism is fixed on the support, and is used for detecting the positions of a material fixing mechanism, a blue film platform module and a thimble mechanism in the directions of x and y axes;
the intelligent control mechanism: the device comprises a material fixing control mechanism, a blue film platform module, a thimble mechanism and a detection and supervision mechanism.
6. The apparatus of claim 5, wherein the material fixing mechanism transports the substrate into the apparatus and transports the substrate out of the apparatus after the substrate fixes the desired LED chips.
7. The apparatus according to claim 5, wherein the material fixing mechanism drives the substrate to move after each LED chip is fixed on the substrate on the material fixing mechanism before all LED chips required on the substrate are fixed, so that the position of the next LED chip required to be fixed corresponds to the position of the thimble on the thimble mechanism on a vertical line.
8. The device for automatically and intelligently positioning, transferring and arranging LED chips as claimed in claim 5, wherein the blue film platform module is a hollow platform module.
9. The apparatus according to claim 8, wherein the hollow blue film platform module is hollow at the corresponding position of the LED chip.
10. The apparatus according to claim 5, wherein before the blue film platform module completes the fixing of all the LED chips on the substrate on the material fixing mechanism, and after each LED chip is fixed on the substrate on the material fixing mechanism, the blue film platform module drives the LED chip on the blue film platform module to move, so that the next LED chip to be fixed on the substrate corresponds to the thimble on the thimble mechanism in a vertical line.
11. The apparatus according to claim 10, wherein the intelligent control mechanism marks the position of the failed LED chip on the blue film platform module, and automatically jumps to the next failed LED chip corresponding to the pin on the pin mechanism when the LED chip on the blue film platform module to be fixed to the substrate is the failed LED chip.
12. The device for automatically and intelligently positioning, transferring and arranging LED chips as claimed in claim 5, wherein the ejector pin mechanism has no displacement in x and y axes and can only move up and down in z axis; the thimble mechanism motion path includes:
the thimble mechanism moves upwards along the z-axis;
ejecting the LED chip at the position corresponding to the ejector pin from the blue film platform module through the ejector pin;
attaching the ejected LED chip to a substrate on the material fixing mechanism;
the thimble mechanism moves downwards along the z-axis to restore the original position.
13. The device for automatically and intelligently positioning, transferring and arranging LED chips according to claim 5, wherein the detection and supervision mechanism detects the positions of the material fixing mechanism, the blue film platform module and the thimble mechanism through the camera detection mechanism:
the upper part and the lower part of the material fixing mechanism are required to fix the position of an LED chip, the upper part and the lower part of the blue film platform module are required to fix the LED chip, and the thimble on the thimble mechanism are positioned on the same vertical line;
the upper part and the lower part of the material fixing mechanism need to fix the position of the LED chip or the upper part and the lower part of the blue film platform module need to fix the LED chip, is not on the same vertical line with the thimble on the thimble mechanism, after the detection monitoring mechanism sends a signal to the intelligent control mechanism, the intelligent control mechanism controls the material fixing mechanism or the blue film platform module to perform position fine adjustment in the horizontal direction, so that the material fixing mechanism which is not on the same vertical line with the thimble on the thimble mechanism is provided with an LED chip position to be fixed or the blue film platform module is provided with an LED chip to be fixed, after the LED chips are positioned on the same vertical line with the ejector pins on the ejector pin mechanism, the detection monitoring mechanism sends signals to the intelligent control mechanism, the intelligent control mechanism controls the ejector pin mechanism to start driving the ejector pins to move upwards along the z-axis direction, and the LED chips at the corresponding positions on the blue film platform module are ejected out and attached to the positions of the LED chips to be fixed on the substrate on the material fixing mechanism;
the upper part and the lower part of the material fixing mechanism are required to fix the position of the LED chip and the upper part and the lower part of the blue film platform module are required to fix the LED chip, is not on the same vertical line with the thimble on the thimble mechanism, after the detection monitoring mechanism sends a signal to the intelligent control mechanism, the intelligent control mechanism controls the material fixing mechanism and the blue film platform module to respectively carry out position fine adjustment in the horizontal direction, so that the material fixing mechanism which is not on the same vertical line with the thimble on the thimble mechanism is provided with an LED chip which needs to be fixed at the upper and lower positions and the blue film platform module is provided with an LED chip which needs to be fixed at the upper and lower positions, after the LED chip is positioned on the same vertical line with the ejector pin on the ejector pin mechanism, the detection monitoring mechanism sends a signal to the intelligent control mechanism, and the intelligent control mechanism controls the ejector pin mechanism to start driving the ejector pin to move upwards along the z-axis direction, so that the LED chip at the corresponding position on the blue film platform module is ejected out and is attached to the position of the LED chip required to be fixed on the substrate on the material fixing mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811515178.4A CN111312865A (en) | 2018-12-12 | 2018-12-12 | Method and device for full-automatic intelligent positioning, transferring and arranging LED chips |
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|---|---|---|---|
| CN201811515178.4A CN111312865A (en) | 2018-12-12 | 2018-12-12 | Method and device for full-automatic intelligent positioning, transferring and arranging LED chips |
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| CN111312865A true CN111312865A (en) | 2020-06-19 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112908899A (en) * | 2021-01-27 | 2021-06-04 | 深圳市卓兴半导体科技有限公司 | Chip transfer method, system and equipment |
| CN115241107A (en) * | 2022-09-19 | 2022-10-25 | 深圳市优界科技有限公司 | Crystal grain transfer mechanism |
-
2018
- 2018-12-12 CN CN201811515178.4A patent/CN111312865A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112908899A (en) * | 2021-01-27 | 2021-06-04 | 深圳市卓兴半导体科技有限公司 | Chip transfer method, system and equipment |
| CN115241107A (en) * | 2022-09-19 | 2022-10-25 | 深圳市优界科技有限公司 | Crystal grain transfer mechanism |
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