CN116190284B - Full-automatic film pouring and laser integrated equipment for crystal grains and application method - Google Patents
Full-automatic film pouring and laser integrated equipment for crystal grains and application method Download PDFInfo
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- CN116190284B CN116190284B CN202310467865.8A CN202310467865A CN116190284B CN 116190284 B CN116190284 B CN 116190284B CN 202310467865 A CN202310467865 A CN 202310467865A CN 116190284 B CN116190284 B CN 116190284B
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- 239000013078 crystal Substances 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 23
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 123
- 238000000605 extraction Methods 0.000 claims abstract description 48
- 238000003825 pressing Methods 0.000 claims abstract description 27
- 238000004080 punching Methods 0.000 claims abstract description 13
- 230000007306 turnover Effects 0.000 claims description 18
- 238000012546 transfer Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 12
- 239000002390 adhesive tape Substances 0.000 claims description 9
- 230000000007 visual effect Effects 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000007689 inspection Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Laser Beam Processing (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The application relates to full-automatic film pouring laser integrated equipment for crystal grains and a use method thereof. The iron ring film pouring module comprises a drawing clamping jaw, an iron ring moving module and a punching module, wherein the drawing clamping jaw is used for clamping the iron ring, a UV film is arranged on the iron ring, the punching module is used for controlling the iron ring to punch towards the direction of a wafer so that crystal grains are adhered to the UV film, and the iron ring moving module is used for moving the iron ring out of the pressing position. The die clamping module is used for transferring the die from the iron ring film pouring module to the laser module and transferring the die from the laser module to the extraction tray. According to the method, the manufacturing process of the product is integrated onto one piece of equipment, the product is transferred through the transportation inside the equipment, manual operation of personnel is avoided as much as possible, time and cost are saved while convenience is realized, the production process is simplified, and the production efficiency is improved.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to full-automatic film pouring laser integrated equipment for crystal grains and a using method.
Background
At present, in the processing process of chip crystal grains, the crystal grains need to be transferred onto an iron ring from wafer (silicon wafer/wafer), then the surface of each crystal grain needs to be subjected to laser so as to track the batch number of products in the future, wherein the laser surface of the products is provided with a fixed surface, so that the positioning and the direction of the products need to be judged, and finally the products need to be packaged to a 2 inch extraction tray after being subjected to laser. At present, after the film is manually poured by staff, the film is manually picked to a picking tray, crystal grains are planted on the wafer through PNP equipment, and finally laser can be performed after manual feeding and discharging are required; the product after laser cannot be automatically packaged to a 2 inch extraction tray, and the manual operation is required by personnel, so that the labor cost is high; the process is too numerous and has low automation degree, so that the time consumption is too long, the error rate is high, and the reworking cost is high.
Disclosure of Invention
Aiming at the technical problems, the application provides full-automatic film pouring laser integrated equipment for crystal grains and a use method, and adopts the following technical scheme:
in a first aspect, the present application provides a full-automatic film pouring laser integrated device for a die, including:
the EFEM front end transmission module is provided with a feeding carrier for conveying the wafer or the iron ring to the press fit position;
the iron ring film pouring module comprises a drawing clamping jaw, an iron ring moving module and a punching module, wherein the drawing clamping jaw is used for clamping an iron ring, a UV film is arranged on the iron ring, the punching module is used for controlling the iron ring to punch towards the direction of a wafer so that crystal grains are adhered to the UV film, and the iron ring moving module is used for moving the iron ring out of a pressing position;
the laser module is used for coding and checking the code reading of the crystal grains;
the extraction tray conveying module is used for feeding and discharging extraction trays, and the extraction trays are used for placing the grains after coding and picking;
the die clamping module is used for transferring the die from the iron ring film pouring module to the laser module or transferring the die from the laser module to the extraction disc, and comprises an electric clamping jaw for clamping the die and a visual camera for positioning the die.
Preferably, the iron ring film pouring module further comprises a turnover assembly, the turnover assembly is in driving connection with the drawing die clamping jaw and used for controlling the drawing die clamping jaw to turn over, and the iron ring moving module is in driving connection with the turnover assembly and used for controlling the turnover assembly to move.
Preferably, the punching module comprises a pressing plate and a film pressing cylinder, the pressing plate is arranged on one side, far away from the wafer, of the iron ring, the film pressing cylinder is in driving connection with the pressing plate, and the film pressing cylinder is provided with an electric proportional valve.
Preferably, the die clamping module comprises a first clamping module for transferring the die from the iron ring film pouring module to the laser module and a second clamping module for transferring the die from the laser module to the extraction tray, the first clamping module/second clamping module comprises a mounting seat and a mounting seat rotating assembly, the mounting seat is provided with two groups of electric clamping jaws, and the two groups of electric clamping jaws are arranged on two sides of the mounting seat in a central symmetry manner.
Preferably, the full-automatic film pouring and laser integrated device of the crystal grain is provided with an empty wafer checking module, a placement clamp and a NG clamp, wherein the empty wafer checking module is used for checking whether the film pulling of a wafer is complete, placing the empty wafer in the placement clamp if the film pulling is complete, and placing the empty wafer in the NG clamp if the film pulling is incomplete.
Preferably, the full-automatic film pouring laser integrated device is further provided with a yellow film inspection module, the yellow film inspection module comprises a bottom visual camera and an adhesive tape, the bottom visual camera is arranged on the die clamping module, and the adhesive tape is arranged on the picking tray conveying module.
In a second aspect, the application further provides a use method of the full-automatic film pouring laser integrated device for the crystal grains, which is characterized by comprising the following steps:
s1: placing the wafer and the iron ring on an EFEM front end transmission module;
s2: using EFEM wafer front end transmission to send the wafer and the iron ring to the press-fit position;
s3: transferring the crystal grains on the wafer to the iron ring by utilizing the iron ring film pouring module, and then transferring the iron ring to the picking carrier;
s4: transferring the crystal grains on the iron ring on the picking carrier to a laser module by utilizing the crystal grain clamping module for coding;
s5: the laser module transfers the crystal grains to the extraction tray by the crystal grain clamping module after the crystal grain code reading and checking, and then transfers the extraction tray to the next working procedure by the extraction tray conveying module.
Preferably, the step S3 specifically includes: the die drawing clamping jaw of the iron ring film pouring module is used for clamping the iron ring, then the turnover assembly of the iron ring film pouring module is used for overturning the iron ring, then the punching module of the iron ring film pouring module is used for controlling the iron ring to punch towards the direction of the wafer so that crystal grains are adhered to the UV film of the iron ring, and then the iron ring moving module is used for moving the iron ring to the picking carrier.
Preferably, the step S3 further includes: after the crystal grains on the wafer are transferred onto the iron ring, the empty wafer is returned to the checking position to check whether the drawing is complete, the empty wafer is placed on the wafer clamping if the drawing is complete, and the empty wafer is placed on the NG clamping if the drawing is incomplete.
Preferably, the step S5 further includes: before the grain clamping module transfers the grain to the extraction tray, positioning the grain and checking whether a yellow film exists or not, if the yellow film exists, sticking the yellow film, if sticking is successful, discharging the material in the extraction tray, if sticking is failed, alarming according to failure times, and if the yellow film does not exist, directly discharging the material in the extraction tray.
In summary, the present application includes at least one of the following beneficial technical effects:
by utilizing the principle that the adhesive force of the UV film is far stronger than that of the crystal grains on the wafer, the pressure is controlled to be pressed down by the cylinder and the proportional valve, so that the crystal grains are adhered on the UV film, and after pressure maintaining for a certain time, the crystal grains are separated by the Z axis of the drawing clamping jaw, so that the action of pouring the film is completed;
the product picking and clamping is realized by the electric clamping jaw, and the electric clamping jaw can accurately feed back whether the product is clamped or not and prevent the product from being clamped according to the corresponding thrust value set by the product;
according to the method, the manufacturing process of the product is integrated onto one piece of equipment, the product is transferred through the transportation inside the equipment, manual operation of personnel is avoided as much as possible, time and cost are saved while convenience is realized, the production process is simplified, and the production efficiency is improved.
Drawings
The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate embodiments and, together with the description, serve to explain the principles of the present application. Many of the intended advantages of other embodiments and embodiments will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.
Fig. 1 is an external structural schematic diagram of a full-automatic film pouring laser integrated device with crystal grains according to an embodiment of the application.
Fig. 2 is a schematic diagram of an internal structure of a full-automatic film pouring laser integrated device with a die according to an embodiment of the present application.
Fig. 3 is a schematic structural view of the embodiment of the present application for protruding the material loading platform and the iron ring film pouring module.
Fig. 4 is a schematic view of a structure of the iron ring film pouring module and the picking stage according to the embodiment of the present application.
Fig. 5 is a schematic structural view of an empty wafer inspection module according to an embodiment of the present application.
Fig. 6 is a schematic structural diagram of a laser module according to an embodiment of the present application.
Fig. 7 is a schematic diagram of a structure of a pick-up tray transfer module, a laser module, and a die pick-up tray transfer module according to an embodiment of the present application.
Fig. 8 is a schematic structural view of a camera for highlighting according to an embodiment of the present application.
Fig. 9 is a schematic view of a structure of an embodiment of the present application for highlighting the motorized clasps.
Fig. 10 is a schematic structural view of a bottom vision camera for highlighting an embodiment of the present application.
Fig. 11 is a schematic view of the structure of the embodiment of the present application for highlighting the adhesive tape.
FIG. 12 is a schematic diagram of one embodiment of a method of using a full-automatic film pouring laser integrated device that can be applied to the die of the present application.
Reference numerals illustrate: 101. an EFEM front end transmission module; 102. an iron ring film pouring module; 103. a laser module; 104. a extraction tray conveying module; 105. a die clamping module; 1. a feeding carrier; 2. an iron ring; 3. a wafer; 4. a stamping module; 5. drawing the die clamping jaw; 6. a pressing plate; 7. a film pressing cylinder; 8. a laser engraving machine; 9. a laser platform; 10. an eight-station carrying platform; 11. a laser post code reader; 13. extracting tray; 14. an electric clamping jaw; 15. a first clamping module; 16. a second clamping module; 17. a mounting base; 19. a bottom vision camera; 20. a feeding module of the extraction tray; 21. a extraction tray discharging module; 22. a coil moving module; 24. picking up a carrier; 25. a vision fine alignment camera; 26. a visual coarse alignment camera; 27. an adhesive tape; 28. wafer clamping; 29. clamping an iron ring; 30. NG card clips; 31. a manipulator; 32. a mapping camera; 33. a code reading camera; 34. an upper alignment camera; 35. and a side alignment camera.
Detailed Description
The present application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
At present, in the processing process of chip grains, the grains need to be transferred onto an iron ring from wafer (silicon wafer/wafer), and then the surface of each grain needs to be subjected to laser so as to track the batch number of products in the future, wherein the laser surface of the products is provided with a fixed surface, so that the positioning and direction of the products need to be judged; finally, the product needs to be packaged to a 2 inch extraction tray after laser. However, the laser and package of the die at present have the following disadvantages:
(1) Transferring from wafer to iron ring UV film, manually picking to a pick-up tray after manually pouring film by staff, seeding crystal grains to wafer by PNP equipment, and finally manually feeding and discharging to perform laser; the process is too numerous and has low automation degree, so that the time consumption is too long, the error rate is high, and the reworking cost is high;
(2) The product after laser cannot be automatically packaged to a 2 inch extraction tray, and the manual operation is required by personnel, so that the labor cost is high;
(3) NG products cannot be automatically removed, manual removal is required, removal errors are easy to cause, and products are consumed;
(4) The product of the existing equipment is conveyed to be adsorbed by the suction nozzle, and the suction nozzles with different sizes are required to be replaced according to different sizes of the product.
Aiming at the defects of the above points, the invention integrates the manufacturing flow of the product into one piece of equipment, realizes the transmission of the product through the transportation in the equipment, avoids the manual operation of personnel as much as possible, realizes convenience and saves time and cost.
In a first aspect, referring to fig. 1 and 2, a full-automatic film pouring laser integrated device for a die disclosed in an embodiment of the present application includes an EFEM front end transmission module 101, a coil pouring module 102, a laser module 103, a pick-up tray conveying module 104, and a die clamping module 105.
Referring to fig. 2 and 3, the efem front end transfer module 101 includes a wafer chuck 28, a coil chuck 29, and a NG chuck 30, and the efem front end transfer module 101 is provided with a robot 31 for clamping a wafer or a coil onto the loading stage 1 and a loading stage 1 for transferring the wafer 3 or the coil 2 to a press-fit position of the coil film pouring module 102.
The iron ring pouring module 102 iron comprises a drawing clamping jaw 5, an iron ring moving module 22 and a punching module 4, a UV film is arranged on the iron ring 2, after the iron ring is sent to a pressing position, the drawing clamping jaw is used for clamping the iron ring to enable the iron ring 2 to be located above the wafer 3, and the punching module 4 is used for controlling the iron ring 2 to punch towards the direction of the wafer 3 so that crystal grains are adhered to the UV film.
The iron ring film pouring module 102 further comprises a turnover assembly, the turnover assembly is in driving connection with the drawing die clamping jaw 5 and used for controlling the drawing die clamping jaw 5 to turn over, the iron ring moving module is in driving connection with the turnover assembly and used for controlling the turnover assembly to move, and the iron ring moving module is used for moving the iron ring 2 out of the pressing position and moving to the picking carrier 24. In a specific embodiment, the overturning assembly is a rotating motor, and the driving module comprises a driving cylinder in the vertical direction and a driving cylinder in the horizontal direction.
The punching module 4 comprises a pressing plate 6 and a film pressing cylinder 7, the pressing plate 6 is arranged on one side, far away from the wafer 3, of the iron ring 2, the film pressing cylinder 7 is in driving connection with the pressing plate 6, and the film pressing cylinder 7 is provided with an electric proportional valve.
Referring to fig. 2 and 5, the full-automatic film pouring laser integrated device for the die is provided with an empty wafer inspection module, wherein the empty wafer inspection module is used for inspecting whether the film pulling of the wafer is complete, if the film pulling is complete, the empty wafer is placed on the wafer clamping 28, and if the film pulling is incomplete, the empty wafer is placed on the NG clamping 30. In a specific embodiment, the empty wafer inspection module includes a mapping camera 32 and a code reading camera 33 disposed above the loading stage 1.
In a specific embodiment, the full-automatic film pouring laser integrated device of the crystal grain is provided with a feeding module, the feeding module is provided with two groups of clamps, namely an iron ring attached to a UV film and a wafer with a product, and one surface of the UV film is sticky and the other surface of the UV film is non-sticky, so that the die drawing clamping jaw is required to be used for overturning the UV film to enable the adhesive surface of the UV film to face downwards to transfer the product on the wafer, wherein the working principle of the die drawing is as follows: the adhesive force of the iron ring UV film is far stronger than the adhesive force of the crystal grain on the wafer, the pressure is controlled to be downwards pressed by the air cylinder and the proportional valve, so that the crystal grain is adhered on the UV film, after a certain time of pressure maintaining (the pressure maintaining time can be adjusted according to the type and the quantity of products), the crystal grain is separated by a drawing clamping jaw (the drawing clamping jaw is composed of two groups of air cylinders, the air cylinder stretches out to synchronously clamp the iron ring), so that the products are transferred onto the UV film, an empty wafer is firstly moved to an inspection position on a carrier, then whether the drawing is complete is inspected by a camera, then the crystal grain is completely taken out by a tooth fork and put back into an original clamping, and if the crystal grain is left, the crystal grain is put into an NG clamping (NGbuffer) and taken out by personnel; thus, the action of pouring the film is completed, and the specific function is to transfer a material, and the NGbuffer also prevents the omission of products.
Referring to fig. 6, the laser module 103 is used for coding and checking the die, and in a specific embodiment, the laser module 103 includes a laser imprinter 8, a laser platform 9, an eight-station stage 10, a laser post-reading camera 11, and an alignment camera, and the alignment camera includes an upper alignment camera 34 and a side alignment camera 35.
Referring to fig. 2 and 7, a conveying table is disposed on the extraction tray conveying module 104 for conveying the extraction tray 13, and the extraction tray 13 is used for placing the coded and picked grains, wherein the extraction tray conveying module 104 comprises an extraction tray feeding module 20 and an extraction tray discharging module 21.
Referring to fig. 7-9, a die-clamping module 105 is used to transfer die from the iron-ring film-pouring module 102 to the laser module 103 and die from the laser module 103 to the pick-up pan 13, and includes motorized clamping jaws 14 for clamping die and a vision camera for positioning die.
The die clamping module comprises a first clamping module 15 for transferring the die from the iron ring film pouring module 102 to the laser module 103 and a second clamping module 16 for transferring the die from the laser module 103 to the extraction tray 13, wherein the first clamping module 15/the second clamping module 16 comprises a mounting seat 17 and a mounting seat rotating assembly, the mounting seat 17 is provided with two groups of electric clamping jaws 14, the two groups of electric clamping jaws 14 are arranged on two sides of the mounting seat 17 in a central symmetry mode, and the mounting seat rotating assembly is a DD motor in the implementation. In a particular embodiment, the vision cameras include a vision fine alignment camera 25 and a vision coarse alignment camera 26.
Referring to fig. 10 and 11, the die clamping module of the full-automatic film pouring laser integrated device further comprises a yellow film inspection module, wherein the yellow film inspection module is arranged between the die clamping module 105 and the picking tray conveying module 104, in the implementation, the yellow film inspection module comprises a bottom vision camera 19 and an adhesive tape 27, the bottom vision camera 19 is arranged below a mounting frame of the die clamping module 105, the adhesive tape 27 is arranged on a conveying table on the picking tray conveying module 104, the bottom vision camera 19 is used for inspecting whether a yellow film exists or not, and when the yellow film exists, a product is clamped by clamping jaws to adhere the yellow film on the adhesive tape 27.
In a specific embodiment, the iron ring is placed on the material taking carrier and is aligned and mapped by the camera, then the picking of each product is started, the picking of the products is realized by the electric clamping jaw, and the electric clamping jaw can accurately feed back whether the products are clamped or not and prevent the products from being clamped according to the thrust corresponding to the setting of the products.
Whether the product is clamped to the laser platform or before the product is clamped to the picking plate, the precise alignment of the vision camera is carried out (the camera carries out correction and direction judgment on the product by identifying the characteristics on the product), so that the accuracy of the follow-up action is ensured. Specifically, when the product is clamped to a laser platform, a visual camera shoots, the relative offset of the crystal grain and the clamping jaw is calculated, the angle is compensated by the theta axis of the clamping jaw, the XY is compensated by the platform, and the clamping jaw descends again to clamp after the compensation is finished. When the product is placed on the laser platform, the upper alignment camera and the alignment measurement camera of the laser platform calculate the offset of the product, so that the laser position is accurate, and the offset is calculated and then corrected by the laser machine (the laser head is internally compensated in three directions of XYZ). When the product is clamped to the picking plate, the visual camera shoots, the relative offset of the crystal grain and the clamping jaw is calculated, the angle is adjusted by the theta axis of the clamping jaw, and the XY position is adjusted to the picking plate.
In specific embodiment, this application has designed two sets of clamping jaw, rotates 180 clamping jaw I through DD motor and can carry out the blowing in step in clamping jaw II when getting the material, and two sets of clamping jaw action base synchronization goes on making the action smoother also great saving the beat. The main function accomplished in this section is the handling of the product die.
In a specific embodiment, after the products are picked to the coding platform, the products are respectively positioned, laser is carried out, the code reading inspection after the laser is carried out, and the products are discharged (refer to fig. 8); the positioning before the laser ensures the relative position accuracy of the laser character on the product, the code reading check after the laser ensures whether the character is correct, the product is clamped by the clamping jaw to rotate 90 degrees, the vision camera at the bottom of the product photographs the bottom of the product, the precise alignment camera photographs the 2 inch extraction tray (refer to fig. 8) at the same time, and then the product can be corrected in real time so that the product can be accurately placed in the extraction tray. If the bottom camera recognizes errors or the laser post-reading code check judges NG, the product is placed in a special NG extract. Two groups of clamping jaws are also designed from the blanking part to the packaging part, so that the beats are greatly saved, and two groups of cameras at the bottom correspondingly exist. The main functions of the part are laser of the product and packaging of the product.
According to the method, the manufacturing process of the product is integrated onto one piece of equipment, the product is transferred through the transportation inside the equipment, manual operation of personnel is avoided as much as possible, time and cost are saved while convenience is realized, the production process is simplified, and the production efficiency is improved.
In a second aspect, the embodiment of the application also discloses a method for using the full-automatic film pouring laser integrated device for the crystal grains, which comprises the following steps:
s1: placing the wafer and the iron ring on an EFEM front end transmission module;
s2: the front end transmission of the EFEM wafer sends the wafer and the iron ring to a pressing position;
s3: transferring the crystal grains on the wafer to the iron ring by utilizing the iron ring film pouring module, and then transferring the iron ring to the picking carrier;
the step S3 specifically comprises the following steps: the die drawing clamping jaw of the iron ring film pouring module is used for clamping the iron ring, then the turnover assembly of the iron ring film pouring module is used for overturning the iron ring, then the punching module of the iron ring film pouring module is used for controlling the iron ring to punch towards the direction of the wafer so that crystal grains are adhered to the UV film of the iron ring, and then the iron ring moving module is used for moving the iron ring to the picking carrier.
Wherein, the S3 further comprises: after the crystal grains on the wafer are transferred onto the iron ring, the empty wafer is returned to the checking position to check whether the drawing is complete, the empty wafer is placed on the wafer clamping if the drawing is complete, and the empty wafer is placed on the NG clamping if the drawing is incomplete.
S4: transferring the crystal grains on the iron ring on the picking carrier to a laser module by utilizing the crystal grain clamping module for coding;
wherein, the S4 further comprises: before the die clamping module transfers the die on the iron ring on the picking carrier to the laser module, the position of the die on the laser module is positioned by utilizing the vision fine alignment camera and the vision coarse alignment camera.
S5: the laser module reads the code of the crystal grain, and then the crystal grain clamping module transfers the crystal grain to the extraction tray, and the extraction tray conveying module transfers the extraction tray to the next process.
Wherein, the S5 further comprises: before the grain clamping module transfers the grain to the extraction tray, positioning the grain, checking whether a yellow film exists or not, if so, sticking the yellow film, if so, discharging the grain to the extraction tray, if so, alarming if so, and if not, directly discharging the grain to the extraction tray.
Fig. 9 shows a schematic diagram of a specific embodiment of a method of using a full-automatic film pouring laser integrated device that can be applied to the die of the present application, the method in this embodiment specifically includes the following steps:
the preparation steps are as follows: placing a wafer and an iron ring on a loadport (wafer loader/wafer loader) of an EFEM front end transmission module by personnel, taking the iron ring by a fork (manipulator), aligning the iron ring by a large-view CCD (charge coupled device), placing the iron ring on a feeding carrying platform, moving the feeding carrying platform to a press fit position, taking the iron ring by a die drawing clamping jaw, moving the die drawing clamping jaw to a turn-over position, turning the iron ring, and moving the iron ring to the press fit position; after placing the iron ring on the feeding carrier, carrying out back stroke on the wafer by the tooth fork, carrying out edge inspection positioning on the wafer, placing the wafer on the feeding carrier, reading codes, and moving the wafer to a press fit position; after the die drawing clamping jaw takes the iron ring, the carrier returns to place the wafer on the carrier.
And (3) film pouring: lowering the iron ring, lowering the pressing plate, maintaining pressure, drawing the die and leading the iron ring to a feeding position; and after the die is pulled out, the empty wafer is returned to the checking position to check whether the die is pulled out completely, if the die is pulled out completely, the empty wafer is placed on the placing clamp, and if the die is pulled out incompletely, the empty wafer is placed on the NG clamp.
And (3) laser steps: the material taking carrier receives materials, the coarse alignment camera is aligned, the fine alignment camera is aligned, products are clamped (a whole disc is clamped to complete the clamping of an empty iron ring, and a tooth fork is clamped), the material taking carrier rotates 180 degrees, and the materials are discharged on a code printing platform, positioned on the front side and the side, coded and checked.
The step of extraction: the blanking clamp clamps the product, rotates for 90 degrees, positions and checks whether the yellow film exists or not, rotates for 90 degrees (if the yellow film exists at this time, the yellow film is stuck, the material is discharged on the extraction tray if the sticking is successful, the alarm is selected according to the failure times if the sticking is failed, the material is directly discharged on the extraction tray if the yellow film does not exist), the material is discharged on the tray, and the cartridge clip is installed after the tray is full.
While the present invention has been described with reference to the specific embodiments thereof, the scope of the present invention is not limited thereto, and any changes or substitutions will be apparent to those skilled in the art within the scope of the present invention, and are intended to be covered by the present invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
In the description of the present application, it should be understood that the terms "upper," "lower," "inner," "outer," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application. The word 'comprising' does not exclude the presence of elements or steps not listed in a claim. The word 'a' or 'an' preceding an element does not exclude the presence of a plurality of such elements. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims shall not be construed as limiting the scope.
Claims (9)
1. Full-automatic film pouring laser integrated equipment of crystal grain, which is characterized by comprising:
the EFEM front end transmission module is provided with a feeding carrier for conveying the wafer or the iron ring to the press fit position;
the iron ring film pouring module comprises a drawing clamping jaw, an iron ring moving module and a punching module, wherein the drawing clamping jaw is used for clamping an iron ring, a UV film is arranged on the iron ring, the punching module is used for controlling the iron ring to punch towards the direction of a wafer so that crystal grains are adhered to the UV film, and the iron ring moving module is used for moving the iron ring out of a pressing position;
the laser module is used for coding and checking the code reading of the crystal grains;
the extraction tray conveying module is used for feeding and discharging extraction trays, and the extraction trays are used for placing the grains after coding and picking;
the die clamping module is used for transferring the die from the iron ring film pouring module to the laser module or transferring the die from the laser module to the extraction disc, and comprises an electric clamping jaw for clamping the die and a visual camera for positioning the die.
2. The full-automatic film pouring laser integrated device for the crystal grains according to claim 1, wherein the full-automatic film pouring laser integrated device is characterized in that: the iron ring film pouring module further comprises a turnover assembly, the turnover assembly is in driving connection with the drawing die clamping jaw and used for controlling the drawing die clamping jaw to turn over, and the iron ring moving module is in driving connection with the turnover assembly and used for controlling the turnover assembly to move.
3. The full-automatic film pouring laser integrated device for the crystal grains according to claim 2, wherein the full-automatic film pouring laser integrated device is characterized in that: the stamping module comprises a pressing plate and a film pressing cylinder, the pressing plate is arranged on one side, far away from the wafer, of the iron ring, the film pressing cylinder is in driving connection with the pressing plate, and the film pressing cylinder is provided with an electric proportional valve.
4. The full-automatic film pouring laser integrated device for the crystal grains according to claim 1, wherein the full-automatic film pouring laser integrated device is characterized in that: the die clamping module comprises a first clamping module used for transferring the die from the iron ring film pouring module to the laser module and a second clamping module used for transferring the die from the laser module to the extraction disc, the first clamping module/second clamping module comprises a mounting seat and a mounting seat rotating assembly, the mounting seat is provided with two groups of electric clamping jaws, and the two groups of electric clamping jaws are arranged on two sides of the mounting seat in a central symmetry mode.
5. The full-automatic film pouring laser integrated device for the crystal grains according to claim 1, wherein the full-automatic film pouring laser integrated device is characterized in that: the full-automatic film pouring and laser integrated equipment for the crystal grains is provided with an empty wafer checking module, a wafer clamping and a NG clamping, wherein the empty wafer checking module is arranged above the feeding carrying platform and used for checking whether the film pulling of the wafer is complete, the empty wafer is placed in the wafer clamping if the film pulling is complete, and the empty wafer is placed in the NG clamping if the film pulling is incomplete.
6. The full-automatic film pouring laser integrated device for the crystal grains according to claim 1, wherein the full-automatic film pouring laser integrated device is characterized in that: the full-automatic film pouring laser integrated equipment is characterized in that a yellow film checking module is further arranged, the yellow film checking module comprises a bottom visual camera and an adhesive tape, the bottom visual camera is arranged on the grain clamping module, and the adhesive tape is arranged on the picking disc conveying module.
7. The application method of the full-automatic film pouring laser integrated equipment for the crystal grains is characterized by comprising the following steps of:
s1: placing the wafer and the iron ring on an EFEM front end transmission module;
s2: using EFEM wafer front end transmission to send the wafer and the iron ring to the press-fit position;
s3: transferring the crystal grains on the wafer to the iron ring by utilizing the iron ring film pouring module, and then transferring the iron ring to the picking carrier;
the step S3 specifically comprises the following steps: clamping an iron ring by using a drawing clamping jaw of an iron ring film pouring module, overturning the iron ring by using an overturning assembly of the iron ring film pouring module, controlling the iron ring to punch towards a wafer direction by using a punching module of the iron ring film pouring module so as to enable crystal grains to be adhered to a UV film of the iron ring, and transferring the iron ring to a picking carrier by using an iron ring moving module;
s4: transferring the crystal grains on the iron ring on the picking carrier to a laser module by utilizing the crystal grain clamping module for coding;
s5: the laser module transfers the crystal grains to the extraction tray by the crystal grain clamping module after the crystal grain code reading and checking, and then transfers the extraction tray to the next working procedure by the extraction tray conveying module.
8. The method for using the full-automatic film pouring laser integrated equipment for the crystal grains, which is disclosed in claim 7, is characterized in that: the step S3 further includes: after the crystal grains on the wafer are transferred onto the iron ring, the empty wafer is returned to the checking position to check whether the drawing is complete, the empty wafer is placed on the wafer clamping if the drawing is complete, and the empty wafer is placed on the NG clamping if the drawing is incomplete.
9. The method for using the full-automatic film pouring laser integrated equipment for the crystal grains, which is disclosed in claim 7, is characterized in that: the step S5 further includes: before the grain clamping module transfers the grain to the extraction tray, positioning the grain and checking whether a yellow film exists or not, if the yellow film exists, sticking the yellow film, if sticking is successful, discharging the material in the extraction tray, if sticking is failed, alarming according to failure times, and if the yellow film does not exist, directly discharging the material in the extraction tray.
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| CN202310467865.8A CN116190284B (en) | 2023-04-27 | 2023-04-27 | Full-automatic film pouring and laser integrated equipment for crystal grains and application method |
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| CN202310467865.8A CN116190284B (en) | 2023-04-27 | 2023-04-27 | Full-automatic film pouring and laser integrated equipment for crystal grains and application method |
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| CN116190284B true CN116190284B (en) | 2023-08-04 |
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| CN204946921U (en) * | 2015-09-18 | 2016-01-06 | 安徽三安光电有限公司 | A kind of all-in-one that there is pour mask, expand film function |
| CN205790042U (en) * | 2016-06-02 | 2016-12-07 | 天津三安光电有限公司 | A kind of have pour mask, the all-in-one of burst function |
| CN109065482A (en) * | 2018-08-09 | 2018-12-21 | 深圳市华腾半导体设备有限公司 | A kind of die grading mechanism and its die grading method |
| CN111785823B (en) * | 2020-08-06 | 2021-11-23 | 湘能华磊光电股份有限公司 | Advanced LED crystal grain sorting and film-reversing device |
| WO2022250490A1 (en) * | 2021-05-27 | 2022-12-01 | (주)한국바이오셀프 | Micro-particle separation device and micro-particle separation method using same |
| CN113257722B (en) * | 2021-06-29 | 2021-09-28 | 深圳中科四合科技有限公司 | Chip film-pouring method and chip film-pouring equipment |
| CN114435662B (en) * | 2022-01-29 | 2024-03-29 | 苏州镭明激光科技有限公司 | Film pouring equipment |
| CN218024148U (en) * | 2022-07-04 | 2022-12-13 | 福建兆元光电有限公司 | Automatic film pouring device for chip |
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Address after: Unit 1, 1st Floor, No. 670 Hong'an Road, Xiang'an Industrial Zone, Xiamen Torch High tech Zone, Xiamen, Fujian Province, 361000 Applicant after: Koer Microelectronics Equipment (Xiamen) Co.,Ltd. Address before: Unit 1, 1st Floor, No. 670 Hong Road, Xiang'an Industrial Zone, Torch High tech Zone, Xiamen City, Fujian Province, 361000 Applicant before: COER AUTOMATION EQUIPMENT CO.,LTD. |
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Denomination of invention: A fully automatic film pouring laser integrated equipment for grains and its usage method Granted publication date: 20230804 Pledgee: Agricultural Bank of China Limited by Share Ltd. Xiamen Xiangan branch Pledgor: Koer Microelectronics Equipment (Xiamen) Co.,Ltd. Registration number: Y2024980005972 |
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