JP2018160687A5

JP2018160687A5 - Chip joining method and chip joining apparatus

Info

Publication number: JP2018160687A5
Application number: JP2018118273A
Authority: JP
Filing date: 2018-06-21
Publication date: 2018-12-27
Anticipated expiration: 2034-10-30

Description

実施形態は、チップの接合方法及びチップの接合装置に関する。 Embodiment relates to bonding apparatus for bonding method and the chip of the chip.

一つの実施形態は、チップの熱変形を抑制したりチップと基板との熱膨張率の差に起因した接合の位置ずれや接合後の残留応力を抑制・低減しながらチップを基板上に搭載できるチップの接合方法及びチップの接合装置を提供することを目的とする。 In one embodiment, the chip can be mounted on the substrate while suppressing thermal deformation of the chip or suppressing / reducing bonding misalignment or residual stress after bonding due to the difference in thermal expansion coefficient between the chip and the substrate. An object of the present invention is to provide a chip bonding method and a chip bonding apparatus.

一つの実施形態によれば、チップの接合方法が提供される。チップの接合方法では、チップの裏面がシートに貼り付けられた状態でチップの活性化された表面と基板の活性化された表面とを対向させて配置する。チップの接合方法では、保持機構によって第２の領域を保持する。保持機構は、基板の表面に垂直でない方向にシートに対して相対的に移動可能である。第２の領域は、シートにおける第１の領域の周囲の領域である。チップの接合方法では、シートにおける第２の領域が保持機構で保持された状態で第１の領域を介してチップの裏面を押圧してチップの活性化された表面を基板の活性化された表面に密着させる。チップの接合方法では、チップの活性化された表面が基板の活性化された表面に密着された状態を維持しながらシートにおける第１の領域を介したチップの裏面の押圧を解除してシートをチップの裏面から剥離する。 According to one embodiment, a method for joining chips is provided. In the chip bonding method, the activated surface of the chip and the activated surface of the substrate are arranged to face each other with the back surface of the chip attached to the sheet. The chip bonding method, the second region is retained by the holding mechanism. The holding mechanism is movable relative to the sheet in a direction that is not perpendicular to the surface of the substrate. The second area is an area around the first area in the sheet. In the chip bonding method, the activated surface of the chip is changed to the activated surface of the substrate by pressing the back surface of the chip through the first area while the second area of the sheet is held by the holding mechanism. Adhere to. In the chip bonding method, the pressing of the back surface of the chip through the first region in the sheet is released while maintaining the state where the activated surface of the chip is in close contact with the activated surface of the substrate. Peel from the back of the chip .

Claims

Placing the activated surface of the chip and the activated surface of the substrate facing each other with the back surface of the chip attached to the sheet;
And that the holding mechanism is movable relative to the sheet in a direction that is not perpendicular to the surface of the substrate, the second region surrounding the first region in the sheet to retain,
With the second region of the sheet held by the holding mechanism, the back surface of the chip is pressed through the first region to activate the activated surface of the chip on the substrate. Close contact with the surface,
The pressing of the back surface of the chip through the first region in the sheet is released while maintaining the activated surface of the chip in close contact with the activated surface of the substrate. Peeling from the back of the chip ;
A chip joining method comprising:

The placing includes retaining an outer peripheral area of the sheet;
2. The chip bonding method according to claim 1, wherein the second region is provided around the first region and spaced apart from the first region on the inner side of the outer peripheral region in the sheet.

The chip bonding method according to claim 1, further comprising heating the chip in a state where the back surface of the chip is pressed after the peeling.

The arrangement is
Including disposing the activated surface of the plurality of chips and the activated surface of the substrate facing each other in a state where the back surfaces of the plurality of chips are attached to a sheet,
The adhesion is
Pressing the back surface of the chip selected from the plurality of chips through the sheet to bring the activated surface of the selected chip into close contact with the activated surface of the substrate;
The peeling is
Chip bonding method according to any one of claims 1 to 3 which comprises peeling the sheet from the back surface of the selected chip.

Affixing the back surface of the semiconductor substrate to the sheet;
Dividing the semiconductor substrate into a plurality of chips ,
The chip joining method according to any one of claims 1 to 4, further comprising:

Affixing the surface of the semiconductor substrate to the second sheet;
Dividing the semiconductor substrate into a plurality of chips ,
And said singulated a plurality of the rear surface of the chip adhered to the sheet, transferring the plurality of chips from said second sheet to said sheet,
The chip joining method according to any one of claims 1 to 4, further comprising:

The chip bonding method according to claim 5, further comprising planarizing a surface of the semiconductor substrate before the singulation.

The chip bonding method according to claim 7, wherein the planarization includes planarizing a surface of the semiconductor substrate to a flatness of 1 nm or less.

The chip bonding method according to claim 8, wherein the planarization includes planarizing a surface of the semiconductor substrate to a flatness of 0.3 nm or less.

The chip bonding method according to claim 5, further comprising sequentially cleaning and drying the semiconductor substrate after the individualization.

The chip joining method according to claim 5, further comprising widening the interval between the plurality of chips after the singulation.

It is, chip bonding method of claim 11, comprising extending the interval of a plurality of said chips greater than a thickness of the tip to spread the.

  An arrangement mechanism having a sheet stage capable of fixing a sheet on which chips can be arranged and a substrate stage provided on the first side of the sheet and capable of providing a substrate;
  Provided on the second side opposite to the first side with respect to the sheet, and presses a first region corresponding to the chip in the sheet fixed to the sheet stage in the direction of the first side. A pressing mechanism that can
  A second region around the first region of the sheet is provided on the second side with respect to the sheet, provided around the pressing mechanism, and when the sheet is pressed by the pressing mechanism. A holding mechanism capable of holding;
With
  The relative positions of the pressing mechanism and the holding mechanism with respect to the sheet stage can be changed before or after the pressing mechanism presses the sheet.
A chip bonding apparatus.

The arrangement mechanism is arranged with the surface of the chip and the surface of the substrate facing each other with the back surface of the chip attached to a sheet ,
The holding mechanism is relatively movable in a direction not perpendicular to the surface of the substrate;
The pressing mechanism, Ru previous SL surface of the first region by pressing the back surface of the chip through the chip is adhered to the surface of the substrate
The chip bonding apparatus according to claim 13 .

The pressing mechanism releases the pressing of the back surface of the chip through the first region in the sheet and peels the sheet from the back surface of the chip.
The chip bonding apparatus according to claim 14.

The pressing mechanism is
A pressing head having a pressing surface corresponding to the back surface of the chip ;
A pin can be changed between a state of protruding and retracted state to the side of the pressing head from the pressing surface from the pressing surface,
Have
Bonding device chip according to 請 Motomeko 13.

The pressing head has a buffer member on the pressing surface.
The chip bonding apparatus according to claim 16.

The pressing mechanism further includes a drive unit that changes the pin between a state retracted from the pressing surface toward the pressing head and a state protruding from the pressing surface.
The chip bonding apparatus according to claim 16.

A recognition mechanism for recognizing each of the substrate and the chip ;
An alignment mechanism for aligning relative positions of the chip and the substrate based on a recognition result of the recognition mechanism;
Further comprising
The pressing mechanism, the chip bonding apparatus of claim 13, the relative positions of the chip and the substrate to press the back surface of the chip through the sheet in a state of being aligned.

The holding mechanism has an adsorption structure that adsorbs the second region of the sheet.
The chip bonding apparatus according to claim 13.

The substrate stage and the sheet stage are driven independently of each other.
The chip bonding apparatus according to claim 13.

The sheet stage can hold a flat ring that can fix the sheet to which the chip is attached.
The chip bonding apparatus according to claim 13.

The chip is arranged face down above the substrate by the arrangement mechanism.
The chip bonding apparatus according to claim 13.

The chip joining apparatus according to claim 19 , wherein the recognition mechanism includes illumination and a camera.

The pressing mechanism is arranged on the first side with respect to the arrangement mechanism,
25. The chip bonding apparatus according to claim 24 , wherein the illumination is arranged on a second side opposite to the first side with respect to the arrangement mechanism.

26. The chip bonding apparatus according to claim 25 , wherein the illumination is IR illumination.

The arrangement mechanism holds an outer peripheral area of the sheet during the arrangement,
The second region is provided around the first region and spaced apart from the first region on the inner side of the outer peripheral region in the sheet.
The chip bonding apparatus according to claim 13.