JP2018160687A5 - Chip joining method and chip joining apparatus - Google Patents
Chip joining method and chip joining apparatus Download PDFInfo
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- JP2018160687A5 JP2018160687A5 JP2018118273A JP2018118273A JP2018160687A5 JP 2018160687 A5 JP2018160687 A5 JP 2018160687A5 JP 2018118273 A JP2018118273 A JP 2018118273A JP 2018118273 A JP2018118273 A JP 2018118273A JP 2018160687 A5 JP2018160687 A5 JP 2018160687A5
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- 239000000758 substrate Substances 0.000 claims description 30
- 239000004065 semiconductor Substances 0.000 claims 8
- 238000005286 illumination Methods 0.000 claims 4
- 230000002093 peripheral Effects 0.000 claims 4
- 230000000875 corresponding Effects 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000001629 suppression Effects 0.000 description 2
- 230000000717 retained Effects 0.000 description 1
Description
実施形態は、チップの接合方法及びチップの接合装置に関する。 Embodiment relates to bonding apparatus for bonding method and the chip of the chip.
一つの実施形態は、チップの熱変形を抑制したりチップと基板との熱膨張率の差に起因した接合の位置ずれや接合後の残留応力を抑制・低減しながらチップを基板上に搭載できるチップの接合方法及びチップの接合装置を提供することを目的とする。 In one embodiment, the chip can be mounted on the substrate while suppressing thermal deformation of the chip or suppressing / reducing bonding misalignment or residual stress after bonding due to the difference in thermal expansion coefficient between the chip and the substrate. An object of the present invention is to provide a chip bonding method and a chip bonding apparatus.
一つの実施形態によれば、チップの接合方法が提供される。チップの接合方法では、チップの裏面がシートに貼り付けられた状態でチップの活性化された表面と基板の活性化された表面とを対向させて配置する。チップの接合方法では、保持機構によって第2の領域を保持する。保持機構は、基板の表面に垂直でない方向にシートに対して相対的に移動可能である。第2の領域は、シートにおける第1の領域の周囲の領域である。チップの接合方法では、シートにおける第2の領域が保持機構で保持された状態で第1の領域を介してチップの裏面を押圧してチップの活性化された表面を基板の活性化された表面に密着させる。チップの接合方法では、チップの活性化された表面が基板の活性化された表面に密着された状態を維持しながらシートにおける第1の領域を介したチップの裏面の押圧を解除してシートをチップの裏面から剥離する。 According to one embodiment, a method for joining chips is provided. In the chip bonding method, the activated surface of the chip and the activated surface of the substrate are arranged to face each other with the back surface of the chip attached to the sheet. The chip bonding method, the second region is retained by the holding mechanism. The holding mechanism is movable relative to the sheet in a direction that is not perpendicular to the surface of the substrate. The second area is an area around the first area in the sheet. In the chip bonding method, the activated surface of the chip is changed to the activated surface of the substrate by pressing the back surface of the chip through the first area while the second area of the sheet is held by the holding mechanism. Adhere to. In the chip bonding method, the pressing of the back surface of the chip through the first region in the sheet is released while maintaining the state where the activated surface of the chip is in close contact with the activated surface of the substrate. Peel from the back of the chip .
Claims (27)
前記基板の表面に垂直でない方向に前記シートに対して相対的に移動可能である保持機構によって、前記シートにおける第1の領域の周囲の第2の領域を保持することと、
前記シートにおける前記第2の領域が前記保持機構で保持された状態で前記第1の領域を介して前記チップの裏面を押圧して前記チップの活性化された表面を前記基板の活性化された表面に密着させることと、
前記チップの活性化された表面が前記基板の活性化された表面に密着された状態を維持しながら前記シートにおける前記第1の領域を介した前記チップの裏面の押圧を解除して前記シートを前記チップの裏面から剥離することと、
を備えたことを特徴とするチップの接合方法。 Placing the activated surface of the chip and the activated surface of the substrate facing each other with the back surface of the chip attached to the sheet;
And that the holding mechanism is movable relative to the sheet in a direction that is not perpendicular to the surface of the substrate, the second region surrounding the first region in the sheet to retain,
With the second region of the sheet held by the holding mechanism, the back surface of the chip is pressed through the first region to activate the activated surface of the chip on the substrate. Close contact with the surface,
The pressing of the back surface of the chip through the first region in the sheet is released while maintaining the activated surface of the chip in close contact with the activated surface of the substrate. Peeling from the back of the chip ;
A chip joining method comprising:
前記第2の領域は、前記シート内の前記外周領域より内側において前記第1の領域から離間して前記第1の領域の周囲に設けられる
請求項1に記載のチップの接合方法。 The placing includes retaining an outer peripheral area of the sheet;
2. The chip bonding method according to claim 1, wherein the second region is provided around the first region and spaced apart from the first region on the inner side of the outer peripheral region in the sheet.
請求項1又は2に記載のチップの接合方法。 The chip bonding method according to claim 1, further comprising heating the chip in a state where the back surface of the chip is pressed after the peeling.
複数の前記チップの裏面がシートに貼り付けられた状態で前記複数のチップの活性化された表面と前記基板の活性化された表面とを対向させて配置することを含み、
前記密着は、
前記シートを介して、前記複数のチップから選択されたチップの裏面を押圧して前記選択されたチップの活性化された表面を前記基板の活性化された表面に密着させることを含み、
前記剥離は、
前記シートを前記選択されたチップの裏面から剥離することを含む
請求項1から3のいずれか1項に記載のチップの接合方法。 The arrangement is
Including disposing the activated surface of the plurality of chips and the activated surface of the substrate facing each other in a state where the back surfaces of the plurality of chips are attached to a sheet,
The adhesion is
Pressing the back surface of the chip selected from the plurality of chips through the sheet to bring the activated surface of the selected chip into close contact with the activated surface of the substrate;
The peeling is
Chip bonding method according to any one of claims 1 to 3 which comprises peeling the sheet from the back surface of the selected chip.
前記半導体基板を分割して複数の前記チップに個片化することと、
をさらに備えた
請求項1から4のいずれか1項に記載のチップの接合方法。 Affixing the back surface of the semiconductor substrate to the sheet;
Dividing the semiconductor substrate into a plurality of chips ,
The chip joining method according to any one of claims 1 to 4, further comprising:
前記半導体基板を分割して複数の前記チップに個片化することと、
前記個片化された複数のチップの裏面を前記シートに貼り付けて、前記複数のチップを前記第2のシートから前記シートへ転写することと、
をさらに備えた
請求項1から4のいずれか1項に記載のチップの接合方法。 Affixing the surface of the semiconductor substrate to the second sheet;
Dividing the semiconductor substrate into a plurality of chips ,
And said singulated a plurality of the rear surface of the chip adhered to the sheet, transferring the plurality of chips from said second sheet to said sheet,
The chip joining method according to any one of claims 1 to 4, further comprising:
請求項5又は6に記載のチップの接合方法。 The chip bonding method according to claim 5, further comprising planarizing a surface of the semiconductor substrate before the singulation.
請求項7に記載のチップの接合方法。 The chip bonding method according to claim 7, wherein the planarization includes planarizing a surface of the semiconductor substrate to a flatness of 1 nm or less.
請求項8に記載のチップの接合方法。 The chip bonding method according to claim 8, wherein the planarization includes planarizing a surface of the semiconductor substrate to a flatness of 0.3 nm or less.
請求項5又は6に記載のチップの接合方法。 The chip bonding method according to claim 5, further comprising sequentially cleaning and drying the semiconductor substrate after the individualization.
請求項5又は6に記載のチップの接合方法。 The chip joining method according to claim 5, further comprising widening the interval between the plurality of chips after the singulation.
請求項11に記載のチップの接合方法。 It is, chip bonding method of claim 11, comprising extending the interval of a plurality of said chips greater than a thickness of the tip to spread the.
前記シートに対して前記第1の側の反対側の第2の側に設けられ、前記シートステージに固定されたシートにおける前記チップに対応する第1の領域を前記第1の側の方向に押圧することができる押圧機構と、 Provided on the second side opposite to the first side with respect to the sheet, and presses a first region corresponding to the chip in the sheet fixed to the sheet stage in the direction of the first side. A pressing mechanism that can
前記シートに対して前記第2の側に設けられ、前記押圧機構の周辺に設けられ、前記シートが前記押圧機構によって押圧されるとき、前記シートの第1の領域の周囲の第2の領域を保持することができる保持機構と、 A second region around the first region of the sheet is provided on the second side with respect to the sheet, provided around the pressing mechanism, and when the sheet is pressed by the pressing mechanism. A holding mechanism capable of holding;
を備え、With
前記シートステージに対する前記押圧機構及び前記保持機構の相対的な位置が、前記押圧機構が前記シートを押圧する前又は後で変更可能である The relative positions of the pressing mechanism and the holding mechanism with respect to the sheet stage can be changed before or after the pressing mechanism presses the sheet.
ことを特徴とするチップの接合装置。A chip bonding apparatus.
前記保持機構は、前記基板の表面に垂直でない方向に相対的に移動可能であり、
前記押圧機構は、前記第1の領域を介して前記チップの裏面を押圧して前記チップの表面を前記基板の表面に密着させる
請求項13に記載のチップの接合装置。 The arrangement mechanism is arranged with the surface of the chip and the surface of the substrate facing each other with the back surface of the chip attached to a sheet ,
The holding mechanism is relatively movable in a direction not perpendicular to the surface of the substrate;
The pressing mechanism, Ru previous SL surface of the first region by pressing the back surface of the chip through the chip is adhered to the surface of the substrate
The chip bonding apparatus according to claim 13 .
請求項14に記載のチップの接合装置。The chip bonding apparatus according to claim 14.
前記チップの裏面に対応した押圧面を有する押圧ヘッドと、
前記押圧面より前記押圧ヘッドの側へ引っ込んだ状態と前記押圧面から突出した状態との間で変更可能であるピンと、
を有する
請求項13に記載のチップの接合装置。 The pressing mechanism is
A pressing head having a pressing surface corresponding to the back surface of the chip ;
A pin can be changed between a state of protruding and retracted state to the side of the pressing head from the pressing surface from the pressing surface,
Have
Bonding device chip according to 請 Motomeko 13.
請求項16に記載のチップの接合装置。The chip bonding apparatus according to claim 16.
請求項16に記載のチップの接合装置。The chip bonding apparatus according to claim 16.
前記認識機構の認識結果に基づいて、前記チップ及び前記基板の相対的な位置をアライメントするアライメント機構と、
をさらに備え、
前記押圧機構は、前記チップ及び前記基板の相対的な位置がアライメントされた状態で前記シートを介して前記チップの裏面を押圧する
請求項13に記載のチップの接合装置。 A recognition mechanism for recognizing each of the substrate and the chip ;
An alignment mechanism for aligning relative positions of the chip and the substrate based on a recognition result of the recognition mechanism;
Further comprising
The pressing mechanism, the chip bonding apparatus of claim 13, the relative positions of the chip and the substrate to press the back surface of the chip through the sheet in a state of being aligned.
請求項13に記載のチップの接合装置。The chip bonding apparatus according to claim 13.
請求項13に記載のチップの接合装置。The chip bonding apparatus according to claim 13.
請求項13に記載のチップの接合装置。The chip bonding apparatus according to claim 13.
請求項13に記載のチップの接合装置。The chip bonding apparatus according to claim 13.
請求項19に記載のチップの接合装置。 The chip joining apparatus according to claim 19 , wherein the recognition mechanism includes illumination and a camera.
前記照明は、前記配置機構に対して前記第1の側の反対の第2の側に配されている
請求項24に記載のチップの接合装置。 The pressing mechanism is arranged on the first side with respect to the arrangement mechanism,
25. The chip bonding apparatus according to claim 24 , wherein the illumination is arranged on a second side opposite to the first side with respect to the arrangement mechanism.
請求項25に記載のチップの接合装置。 26. The chip bonding apparatus according to claim 25 , wherein the illumination is IR illumination.
前記第2の領域は、前記シート内の前記外周領域より内側において前記第1の領域から離間して前記第1の領域の周囲に設けられる The second region is provided around the first region and spaced apart from the first region on the inner side of the outer peripheral region in the sheet.
請求項13に記載のチップの接合装置。The chip bonding apparatus according to claim 13.
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